Radio frequency system and electronic equipment

Abstract

The invention discloses a radio frequency system and electronic equipment, and the radio frequency system comprises a substrate, a first metal layer and a second metal layer. The substrate is provided with an input port and an output port, the substrate comprises a first part and a second part, the first part is made of a microwave ferrite gyromagnetic material, at least partial area of the first part forms a first device through the microwave ferrite gyromagnetic material, and at least partial area of the second part forms a second device; or the second part is provided with a second device. The first device is used for transmitting a radio frequency signal input by the input port to the second device, and the second device outputs the radio frequency signal through the output port. The first metal layer and the second metal layer are arranged on the two faces of the substrate respectively in the thickness direction of the substrate. According to the application, the first device (such as a circulator) and the at least one second device with filtering, phase shifting and other functions are formed in the substrate, so that the second device does not need to be prepared independently, the forming process of the second device can be simplified, the cost is saved, meanwhile, the first device and the second device are both formed on the substrate, and the manufacturing cost is reduced. Therefore, the integration level of the first device and the second device is improved, and the miniaturization of the radio frequency system is realized.

Description

Technical Field

[0001] This application relates to the field of communication technology, and more specifically to a radio frequency system and electronic device. Background Technology

[0002] As wireless communication radio frequency systems continue to evolve towards higher speeds and lower latency, the number of radio frequency channels in future wireless base station products will gradually increase. This increase in the number of system radio frequency channels places higher demands on the integration of the radio frequency front-end links.

[0003] Existing technology integrates components such as circulators and filters by soldering them into a single PCB area. These components occupy a large area of ​​the board and have high losses. With the increasing trend of the number of RF channels, this is not conducive to the miniaturization design of the RF front end. Summary of the Invention

[0004] In view of this, this application provides a radio frequency system and electronic device to solve the problem of low integration of radio frequency systems in the prior art.

[0005] In a first aspect, this application provides a radio frequency (RF) system, comprising a substrate, a first metal layer, and a second metal layer. The substrate has an input port and an output port. The substrate includes a first portion and a second portion. The first portion is made of a microwave ferrite gyromagnetic material, and at least a portion of the first portion is formed as a first device using the microwave ferrite gyromagnetic material. At least a portion of the second portion is formed as a second device, or the second portion is provided with a second device. The first device is used to transmit an RF signal input from the input port to the second device, and the second device outputs an RF signal through the output port. Along the thickness direction of the substrate, the first metal layer is disposed on one side of the substrate. Along the thickness direction of the substrate, the second metal layer is disposed on the side of the substrate facing away from the first metal layer.

[0006] In this embodiment, by forming a first device (such as a circulator) and at least one second device with filtering, phase shifting and other functions in the substrate, the second device does not need to be fabricated separately, thereby simplifying the molding process of the second device and saving costs. At the same time, since both the first device and the second device are formed on the substrate, it is beneficial to improve the integration of the first device and the second device and realize the miniaturization of the radio frequency system.

[0007] In one possible implementation, a plurality of metallized vias are provided on the substrate, one end of each via being electrically connected to the first metal layer and the other end of each via being electrically connected to the second metal layer. At least a portion of the metallized vias form a channel for transmitting radio frequency (RF) signals. The cooperation of the metallized vias, the first metal layer, and the second metal layer allows for the formation of a circulator and a resonant cavity within the substrate, thereby simplifying the structure of the RF system while ensuring high-quality RF signal transmission.

[0008] In one possible implementation, at least some of the metallized vias form a cavity, the cavity having a first port and a second port. The first port communicates with a port of the first device, and the second port communicates with the output port. The multiple metallized vias can be arranged in a predetermined order, for example, in two rows, each row including multiple metallized vias. The two rows of metallized vias have a large spacing in the width direction of the RF system, forming a channel for transmitting RF signals. Along the length direction of the RF system, adjacent metallized vias in each row have a small spacing, thereby creating an electromagnetic shielding effect between the metallized vias distributed along the length direction, preventing RF signal leakage between adjacent metallized vias. The first and second metal layers also constrain the transmission direction of the RF signal. Thus, through the cooperation of the metallized vias, the first metal layer, and the second metal layer, it can be ensured that the RF signal can be transmitted in a predetermined direction in the substrate between the two rows of metallized vias.

[0009] In one possible implementation, the cavity includes one or more sub-cavities, and when there are two or more sub-cavities, the sub-cavities are sequentially connected. Furthermore, by adjusting the layout of the multiple sub-cavities, radio frequency signals can be transmitted in different directions. Simultaneously, by changing the transmission direction of the radio frequency signals, multiple sub-cavities can be designed on a relatively small substrate area, thereby obtaining multiple resonant points to meet different filtering requirements.

[0010] In one possible implementation, the radio frequency system further includes a permanent magnet disposed in the first portion for providing a bias magnetic field to cooperate with the microwave ferrite gyromagnetic material to form the first device. The permanent magnet can provide a bias magnetic field to confine the magnetic moment within the microwave ferrite gyromagnetic material, stimulating the gyromagnetic effect of the microwave ferrite gyromagnetic material to achieve a unidirectional magnetic excitation.

[0011] In one possible implementation, a supporting dielectric layer is disposed between the permanent magnet and the second metal layer. This supporting dielectric layer is insulating, preventing electrical connection between the permanent magnet and the second metal layer, and thus preventing the magnetic moment direction between the permanent magnet and the microwave ferrite gyromagnetic material from becoming disordered due to contact between the conductive permanent magnet and the second metal layer. By providing the supporting dielectric layer, the magnetic moment direction between the permanent magnet and the microwave ferrite gyromagnetic material can be made as parallel as possible to the thickness direction of the substrate, thereby ensuring that the radio frequency signal can be transmitted along a predetermined direction perpendicular to the thickness direction, guaranteeing the transmission quality of the radio frequency signal.

[0012] In one possible implementation, both the first and second parts are made of microwave ferrite gyromagnetic materials, meaning the entire substrate can be formed from microwave ferrite gyromagnetic materials, facilitating substrate fabrication. Alternatively, the first and second parts may be made of different materials; for example, the first part may be made of microwave ferrite gyromagnetic materials, while the second part may be made of ceramic, allowing the material of the second part to be flexibly configured according to the requirements of the second device.

[0013] In one possible implementation, the second metal layer includes a third portion and a fourth portion. At least a portion of the third portion's projection along the thickness direction of the substrate coincides with the projection of the first portion. The third portion is provided with multiple ports, which are spaced apart in a circumferential direction. The at least portion of the fourth portion's projection along the thickness direction of the substrate coincides with the projection of the second portion, thus limiting the transmission of radio frequency signals in the second portion. By aligning the at least portion of the projection of the third portion along the thickness direction of the substrate with the projection of the first portion, a circulator can be formed in the first portion. Similarly, by aligning the at least portion of the projection of the fourth portion along the thickness direction of the substrate with the projection of the second portion, filters, couplers, phase shifters, etc., can be formed in the second portion, resulting in a simple structure.

[0014] In one possible implementation, the substrate includes a first substrate and a second substrate. Along the thickness direction of the substrate, the second substrate is stacked on the first substrate. A first metal layer is disposed on the side of the first substrate facing away from the second substrate, and a second metal layer is disposed on the side of the second substrate facing away from the first substrate. A first port is disposed on either the first substrate or the second substrate, and a second port is disposed on the second substrate. A first resonant cavity is formed in the first substrate, and a second resonant cavity is formed in the second substrate. A radio frequency (RF) signal input from the input port passes sequentially through the first resonant cavity and the second resonant cavity before being output through the output port. The cooperation of the first and second metal layers allows the first and second substrates located between the first and second metal layers to respectively constitute the first and second resonant cavities, enabling the RF signal to be transmitted within both cavities, which is beneficial for obtaining higher quality RF signals.

[0015] In one possible implementation, the metallized vias include a first metallized via and a second metallized via. The first metallized via is disposed on the first substrate, and at least a portion of the first metallized vias form a first resonant cavity for transmitting radio frequency (RF) signals. The second metallized via is disposed on the second substrate, and at least a portion of the second metallized vias form a second resonant cavity for transmitting RF signals. The first metallized via can form a circulator and a filter in the first substrate, and the second metallized via can form a filter in the second substrate, thereby simplifying the structural design of the circulator and filter and improving the integration of the RF system. Of course, different types of second devices, such as couplers and phase shifters, can also be formed through the corresponding metallized vias.

[0016] In one possible implementation, the first resonant cavity and the second resonant cavity are connected through a feeding structure. By providing this feeding structure, radio frequency signal transmission between at least two stacked substrate layers can be achieved, which is beneficial for stacking multiple substrates in the thickness direction and improving the integration of the radio frequency system.

[0017] In one possible implementation, the electromagnetic loss of the second substrate is lower than that of the first substrate. This allows for improved resonant cavity performance while fully utilizing the advantages of low-loss dielectric materials to reduce radio frequency signal loss during transmission.

[0018] In one possible implementation, the first substrate is made of microwave ferrite gyromagnetic material to facilitate the formation of a circulator. The second substrate is made of ceramic, which has lower electromagnetic losses than microwave ferrite gyromagnetic material. This allows for improved resonant cavity performance while fully utilizing the advantages of low-loss dielectric materials to reduce RF signal loss during transmission.

[0019] In one possible implementation, the first device is a circulator, and the second device includes one or more of the following: a filter, a coupler, a power amplifier, a power divider, a phase shifter, and an RF chip.

[0020] In one possible implementation, the microwave ferrite gyromagnetic material is a self-biased microwave ferrite gyromagnetic material. This self-biased microwave ferrite gyromagnetic material can exhibit unidirectional magnetic moment without using a permanent magnet, enabling unidirectional transmission of radio frequency signals.

[0021] Secondly, embodiments of this application also provide an electronic device, comprising a circuit board and a radio frequency (RF) front-end link. The RF front-end link is disposed on the circuit board and includes the RF system provided in the first aspect of this application. The RF system is electrically connected to the circuit board. The electronic device provided in this embodiment has similar technical effects to the aforementioned RF system.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the radio frequency front-end link in related technologies;

[0025] Figure 2 A schematic diagram of an electronic device provided in an embodiment of this application;

[0026] Figure 3 An exploded view of a radio frequency system provided in one embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the substrate structure in the radio frequency system provided in the embodiments of this application;

[0028] Figure 5A schematic diagram of the first device in the radio frequency system provided in the embodiments of this application;

[0029] Figure 6 This is a schematic diagram of the structure of a radio frequency system provided in one embodiment of this application;

[0030] Figure 7 An exploded view of a radio frequency system provided in another embodiment of this application;

[0031] Figure 8 This is a schematic diagram of the structure of a radio frequency system provided in another embodiment of this application;

[0032] Figure 9 A cross-sectional view of a radio frequency system provided in one embodiment of this application;

[0033] Figure 10 A cross-sectional view of a radio frequency system provided in another embodiment of this application;

[0034] Figure 11 This is a schematic diagram of the signal transmission and reception principle in the radio frequency system implemented in the embodiments of this application;

[0035] Figure 12 A top view of a radio frequency system provided in one embodiment of this application;

[0036] Figure 13 A top view of a radio frequency system provided in another embodiment of this application;

[0037] Figure 14 A schematic diagram of the second metal layer on the substrate in the radio frequency system provided in this application;

[0038] Figure 15 This is a schematic diagram of the structure of a radio frequency system provided in one embodiment of this application;

[0039] Figure 16 This is a schematic diagram of the structure of a radio frequency system provided in another embodiment of this application;

[0040] Figure 17 A cross-sectional view of a radio frequency system provided in another embodiment of this application;

[0041] Figure 18 This is a schematic diagram of the structure of the first substrate in the radio frequency system provided in the embodiments of this application;

[0042] Figure 19 This is a schematic diagram of the structure of the second substrate in the radio frequency system provided in the embodiments of this application;

[0043] Figure 20 This is a schematic diagram of radio frequency signal transmission in a radio frequency system provided in an embodiment of this application.

[0044] Figure label:

[0045] 10'-PCB board;

[0046] 20'-microstrip line;

[0047] 30'- Device;

[0048] 100-Router;

[0049] 110 - Casing;

[0050] 120-antenna;

[0051] 130 - Circuit board;

[0052] 140 - RF front-end link;

[0053] 150-RF system;

[0054] 160 - Electronic components;

[0055] 200 - Signal Generator;

[0056] 300-signal receiver;

[0057] 400-circulator;

[0058] 500-filter;

[0059] 600-antenna;

[0060] 700-RF chip;

[0061] 1-Substrate;

[0062] 11-Part One;

[0063] 111 - First Device;

[0064] 12 - Part Two;

[0065] 121 - Second device;

[0066] 122-Base;

[0067] 123 - Metallized via;

[0068] 123a - First metallized via;

[0069] 123b - Second metallized via;

[0070] 13 - Input Port;

[0071] 14 - Output port;

[0072] 15-chamber;

[0073] 151-sub-chamber;

[0074] 15a - First Port;

[0075] 15b - Second Port;

[0076] 16-First substrate;

[0077] 161 - First resonant cavity;

[0078] 17-Second substrate;

[0079] 171 - Second resonant cavity;

[0080] 2-First metal layer;

[0081] 3-Second metal layer;

[0082] 31 - Part Three;

[0083] 32-Part Four;

[0084] 4-Permanent magnet;

[0085] 5-Supporting dielectric layer;

[0086] 6-Feeding structure;

[0087] 61-First power supply component;

[0088] 62-Second power supply component;

[0089] 63-Third power supply component;

[0090] 64 - Fourth power supply component. Detailed Implementation

[0091] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0092] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0093] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0094] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0095] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0096] As wireless communication radio frequency systems continue to evolve towards higher speeds and lower latency, the number of radio frequency channels in future wireless base station products will gradually increase from the currently common 32 channels to 128 channels, or even 512 channels. This increase in the number of system radio frequency channels places higher demands on the integration of the radio frequency front-end links.

[0097] Figure 1 This is a schematic diagram of the radio frequency front-end link in related technologies, such as... Figure 1 As shown, in related technologies, the RF front-end link may include devices 30' such as circulators and filters. These devices 30' need to be soldered onto a printed circuit board (PCB). To facilitate soldering and reduce interference between devices 30', a large distance needs to be maintained between each device 30'. This results in a large board area occupied by the devices 30', which is not conducive to miniaturization design. At the same time, due to the large board area occupied by the devices 30', the area on the PCB 10' used for arranging channels is small, which is not conducive to realizing the layout of more channels.

[0098] like Figure 1 As shown, the radio frequency signal between the two devices 30' on the PCB board 10' is generally transmitted through the microstrip line 20' in the PCB board. If the two devices 30' are far apart, the radio frequency signal needs to be transmitted through a longer microstrip line 20'. The microstrip line 20' itself will generate loss. Generally speaking, the loss is 0.5dB per inch of microstrip line 20'. If the microstrip line 20' is too long, it will lead to a large loss.

[0099] In addition, the material of the device 30' itself is generally different from that of the PCB board 10'. When the device 30' is soldered onto the PCB board through pads, solder, etc., the radio frequency signal is transmitted from the device 30' to the PCB board 10' or from the PCB board 10' to the device 30'. The transmission of the radio frequency signal needs to go through the switching of the dielectric material. During the process of the radio frequency signal being transmitted from one dielectric material to another, a large loss will be generated.

[0100] In view of this, embodiments of this application provide a radio frequency system to solve the above-mentioned technical problems.

[0101] The radio frequency system provided in this application embodiment can be applied to electronic devices, which may include mobile phones, computers, mobile internet devices (MIDs), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, robotic arms, cameras, robots, or smart home devices (such as televisions, air conditioners, robot vacuums, speakers, set-top boxes), relays, routers, customer premises equipment (CPE), wireless base stations, and other wireless communication products. This embodiment does not limit the specific type of electronic device.

[0102] Figure 2 This is a schematic diagram of an electronic device provided in an embodiment of this application. For ease of explanation, this embodiment uses an electronic device as an example. Figure 2 The following explanation uses router 200 as an example.

[0103] like Figure 2 As shown, the router 200 includes a housing 110 and an antenna 120. The housing 110 provides protection for the internal electronic components, and the antenna 120 is used to transmit and receive radio frequency signals. A circuit board 130 is disposed inside the housing 110. The circuit board 130 can be equipped with a radio frequency front-end link and numerous electronic components 160. The radio frequency front-end link 140 includes the radio frequency system 150 provided in this embodiment. The radio frequency system 150 is an integral structure that can be electrically connected to the circuit board 130 as a whole.

[0104] Figure 3 An exploded view of a radio frequency system provided in one embodiment of this application, such as Figure 3As shown, the radio frequency system includes a substrate 1, a first metal layer 2, and a second metal layer 3. Along the thickness direction of the substrate 1, the first metal layer 2 is disposed on one side of the substrate 1, and the second metal layer 3 is disposed on the side of the substrate 1 facing away from the first metal layer 2. The first metal layer 2 and the second metal layer 3 enable the transmission of radio frequency signals within the substrate 1. In one embodiment, the first metal layer 2 and the second metal layer 3 can be metal layers of a certain thickness formed on the surface of the substrate 1 by an electroplating process. In other embodiments, the first metal layer 2 and the second metal layer 3 can also be metal plates of a certain thickness.

[0105] Figure 4 This is a schematic diagram of the structure of substrate 1 in the radio frequency system provided in the embodiments of this application, as shown below. Figure 4 As shown, an input port 13 and an output port 14 are provided on the substrate 1. The input port 13 can be used to input radio frequency signals into the substrate 1, and the output port 14 can transmit the radio frequency signals transmitted in the substrate 1 to the outside. In one embodiment, the input port 13 and the output port 14 can be structures that can be electrically connected to external devices, such as microstrip lines, waveguides, wire transmission lines, coaxial transmission lines, or other conductive structures.

[0106] Among them, such as Figure 4 As shown, the substrate 1 includes a first portion 11 and a second portion 12. The substrate 1 can be a one-piece molded structure, capable of simultaneously molding the first portion 11 and the second portion 12. The material of the first portion 11 is a microwave ferrite gyromagnetic material, and at least a portion of the first portion 11 is formed into a first device 111 using the microwave ferrite gyromagnetic material.

[0107] Figure 5 This is a schematic diagram of the first device 111 in the radio frequency system provided in the embodiments of this application, as shown below. Figure 5 As shown, the first device 111 can be a circulator, which is a device that transmits high-frequency radio frequency signals in one direction. A circulator has multiple ports; for example, a circulator has three ports: port a, port b, and port c. Radio frequency signals injected from port a can only be transmitted to port b and not to port c, radio frequency signals injected from port b can only be transmitted to port c and not to port a, and radio frequency signals injected from port c can only be transmitted to port a and not to port b. In other words, radio frequency signals in this type of device can only be transmitted in a clockwise direction (e.g., ...). Figure 5 (As shown). In some other embodiments, the radio frequency signal may also be designed to be transmitted in a counterclockwise unidirectional direction.

[0108] The principle of unidirectional transmission achieved by the circulator is based on the tensor permeability characteristics generated by microwave ferrite gyromagnetic materials, which can cause the radio frequency signal propagating in the gyromagnetic material to undergo polarization rotation.

[0109] Figure 6 This is a schematic diagram of the structure of a radio frequency system provided in one embodiment of this application, as shown below. Figure 6 As shown, the microwave ferrite gyromagnetic material can be a non-magnetic material itself, requiring a permanent magnet 4 to form a circulator. The permanent magnet 4 provides a bias magnetic field to confine the magnetic moment within the microwave ferrite gyromagnetic material, exciting the gyromagnetic effect of the microwave ferrite gyromagnetic material to achieve unidirectional magnetic excitation. In other embodiments, the microwave ferrite gyromagnetic material can be a self-biased microwave ferrite gyromagnetic material, which can exhibit unidirectional magnetic moment without using the permanent magnet 4, enabling unidirectional transmission of radio frequency signals.

[0110] In one embodiment, such as Figure 6 As shown, the permanent magnet 4 can be disposed on the second metal layer 3 at a position corresponding to the first part 11.

[0111] In one embodiment, Figure 7 An exploded view of a radio frequency system provided in another embodiment of this application, such as Figure 7 As shown, a supporting dielectric layer 5 can be disposed between the permanent magnet 4 and the second metal layer 3. This supporting dielectric layer 5 is insulating and possesses a dielectric constant that facilitates the design of the first device. By disposing of this supporting dielectric layer 5 in the circulator region of the first part, electrical connections between the permanent magnet 4 and the second metal layer 3 that would interfere with radio frequency signals can be avoided. Simultaneously, the magnetic field provided by the permanent magnet 4 to the microwave ferrite gyromagnetic material can be made more uniform, resulting in superior performance of the first device (such as a circulator).

[0112] Figure 8 A schematic diagram of the structure of a radio frequency system provided in another embodiment of this application is shown below. Figure 8 As shown, at least a portion of the second part 12 is formed as the second device 121, or the second part 12 is provided with the second device 121. The second device 121 may include one or more of the following: a filter, a coupler, a power amplifier, a power divider, a phase shifter, and an RF chip. For example, the second device 121 may include only a filter, or it may include both a filter and a coupler, or it may include both a filter and an RF chip, with the RF chip used for power amplification. The specific type of the second device 121 can be determined according to actual design requirements.

[0113] In one embodiment, the second device can be formed in substrate 1, rather than a separately manufactured device, such as... Figure 8The second device 121b is shown. Exemplarily, as... Figure 8 As shown, taking the second device 121b as a filter as an example, a portion of the substrate 1 can serve as the filter substrate 122. Multiple metallized vias 123 are formed on the substrate 122, with both ends of the metallized vias 123 connected to the first metal layer 2 (see Figure 122). Figure 4 ) and the second metal layer 3 (see Figure 4 Electrical connections are established, and a resonant cavity can be formed in the substrate 122 through the cooperation of the metallized via 123, the first metal layer 2, and the second metal layer 3. This allows the RF system to be structured as a substrate integrated waveguide (SIW), enabling filtering of the RF signal as it passes through the resonant cavity. Forming the second device 121b in the substrate 1 simplifies its fabrication process, reduces costs, and improves the integration of the first device 111 and the second device 121b, thus miniaturizing the RF system. Furthermore, the portions of the first device 111 and the second device 121b used for transmitting RF signals can both be made of the same material, preventing changes in the medium during signal transmission and avoiding losses caused by changes in the dielectric material.

[0114] In one embodiment, the second device may be a separately manufactured device, such as... Figure 8 The second device 121a shown is a separately manufactured device that can be independently mounted on the substrate 1, allowing for more flexible mounting. For example, Figure 8 The second device 121a shown can be an RF chip used to amplify the RF signal input from the input port 13 and transmit the amplified RF signal to the circulator.

[0115] In one embodiment, Figure 9 A cross-sectional view of a radio frequency system provided in one embodiment of this application, as shown below. Figure 9 As shown, both the first part 11 and the second part 12 can be made of microwave ferrite gyromagnetic material, meaning the entire substrate 1 can be formed from microwave ferrite gyromagnetic material, thus facilitating the processing and manufacturing of the substrate 1. For example, as... Figure 9 As shown, a circulator can be formed using the microwave ferrite gyromagnetic material of the first part 11. A filter can be formed using the microwave ferrite gyromagnetic material of the second part 12. For example, a metallized via 123 can be provided in the second part 12, and a filter can be formed through the metallized via 123, the first metal layer 2, and the second metal layer 3.

[0116] In one embodiment, Figure 10A cross-sectional view of a radio frequency system provided in another embodiment of this application, such as Figure 10 As shown, the materials of the first part 11 and the second part 12 can be different. For example, the material of the first part 11 is microwave ferrite gyromagnetic material, and the material of the second part 12 is ceramic. That is, the material of the second part 12 can be flexibly configured according to the needs of the second device 121. For example, as... Figure 10 As shown, a circulator can be formed using the microwave ferrite gyromagnetic material of the first part 11. A filter can be formed using the ceramic material of the second part 12. For example, a metallized via 123 can be provided in the second part 12, and a filter can be formed through the metallized via 123, the first metal layer 2, and the second metal layer 3.

[0117] The first device 111 is used to transmit the radio frequency signal input from the input port 13 to the second device 121, and the second device 121 outputs the radio frequency signal through the output port 14.

[0118] Figure 11 This is a schematic diagram of the signal transmission and reception principle in the radio frequency system implemented in the embodiments of this application, such as... Figure 11 As shown, taking the first device 111 as a circulator 400 and the second device 121 as a filter as an example, the signal generator 200 can generate a radio frequency (RF) signal. The RF signal can be transmitted to port a of the circulator 400 through input port 13. The circulator 400 can transmit the RF signal from port a to port b according to its unidirectional transmission characteristics, and then transmit the RF signal to the filter through port b. The filter can effectively filter out frequencies at a specific frequency or frequencies other than that frequency to obtain an RF signal of a specific frequency. The RF signal processed by the filter can be output externally through output port 14, for example, to an antenna. In some embodiments, devices such as a power amplifier and a coupler can also be provided between the signal generator 200 and the circulator 400. In addition, the RF signal received by the antenna can be filtered by the filter and transmitted to the circulator 400 through port b. After unidirectional transmission by the circulator 400, it is output to the signal receiver 300 through port c of the circulator 400. Switches and low-noise amplifiers may also be installed between the circulator 400 and the signal receiver 300.

[0119] The radio frequency system provided in this application embodiment eliminates the need for separate fabrication of the first device 111 and the second device 121 as independent components. Both devices can be formed on the same substrate 1, making the substrate 1, the first device 111, and the second device 121 a unified module. This improves integration and reduces the distance between the first device 111 and the second device 121, thereby reducing radio frequency signal transmission loss. Furthermore, since the first device 111 and the second device 121 do not require separate soldering or pads onto the circuit board, frequent changes in the dielectric material occur during radio frequency signal transmission between them, reducing losses caused by these changes. In addition, this radio frequency system can be moved as a whole and installed on the circuit board in a single setup, facilitating installation and reducing the board area occupied.

[0120] Figure 12 A top view of a radio frequency system provided in one embodiment of this application, as shown below. Figure 12 As shown above, multiple metallized vias 123 can be formed on the substrate 1, such that at least a portion of the metallized vias 123 enclose a cavity 15. The cavity 15 has a first port 15a and a second port 15b. The first port 15a communicates with the port of the first device 111, and the second port 15b communicates with the output port 14. The multiple metallized vias 123 can be arranged in a predetermined order. Figure 12 The illustrated radio frequency (RF) system has a length direction X and a width direction Y. Some of the metallized vias 123 can be distributed along the length direction X, for example, in two rows. Each row includes multiple metallized vias 123, and the two rows of metallized vias 123 have a large spacing in the width direction Y, forming a channel for transmitting RF signals between them. Along the length direction X, adjacent metallized vias 123 in each row have a small spacing, thus creating an electromagnetic shielding effect between the metallized vias 123 distributed along the length direction X, preventing RF signals from leaking between adjacent metallized vias 123. The first metal layer 2 and the second metal layer 3 also constrain the transmission direction of the RF signal. Therefore, through the cooperation of the metallized vias 123, the first metal layer 2, and the second metal layer 3, it can be ensured that the RF signal can be transmitted in a predetermined direction in the substrate 1 between the two rows of metallized vias 123.

[0121] The aforementioned chamber 15 may include only one sub-chamber. Figure 12 The substrate 1 shown contains only one chamber 15, which can be understood as a sub-chamber.

[0122] Figure 13A top view of a radio frequency system provided in another embodiment of this application, as shown below. Figure 13 As shown, the first device can be a circulator 400, and the second device can include an RF chip 700 and a filter 500. The RF chip 700 can be mounted on a substrate for power amplification of the input RF signal. The filter 500 can be formed on the substrate by setting metallized vias 123 for filtering the RF signal. The RF signal can be input to the RF chip 700 through the input port. The RF chip 700 can amplify the RF signal and transmit the amplified RF signal to the circulator 400. The circulator 400 can realize unidirectional transmission of the RF signal, so that the RF signal is transmitted to the first port 15a of the filter 500. After being filtered by the filter 500, the RF signal is output to the outside through the second port 15b.

[0123] The chamber 15 in the filter 500 may include multiple sub-chambers 151, for example, such as Figure 13 As shown, four sub-cavities 151 can be formed by arranging metallized vias 123. The four sub-cavities 151 are connected in sequence. By adjusting the layout of the four sub-cavities 151, radio frequency signals can be transmitted in different directions. At the same time, by changing the transmission direction of radio frequency signals, multiple sub-cavities 151 can be designed on a substrate 11 with a smaller area, thereby obtaining multiple resonant points and meeting different filtering requirements.

[0124] Of course, in some other embodiments, there may be two, three, five or more sub-chambers 151, and the specific number of sub-chambers 151 can be determined according to the requirements of filtering characteristics.

[0125] In one embodiment, Figure 14 This is a schematic diagram of the second metal layer 3 on the substrate 1 in the radio frequency system provided in this application, as shown below. Figure 14 As shown, the second metal layer 3 includes a third portion 31 and a fourth portion 32, wherein at least a portion of the third portion 31 is projected along the thickness direction of the substrate 1 and intersects with the first portion 11 (see reference). Figure 4 The projections of the three parts coincide, and the third part 31 is provided with multiple ports, which are distributed at intervals in the circumferential direction. Figure 12 An exemplary illustration shows that the third portion 31 includes three ports, namely port a, port b, and port c, which constitute the three ports of the circulator. The fourth portion 32, at least partially projected along the thickness direction of the substrate 1, intersects with the second portion 12 (see reference 12). Figure 4 The projections of the ) coincide, which is used to limit the transmission of radio frequency signals in the second part 12 of the substrate 1.

[0126] The second metal layer 3 can be an integrally formed structure. For example, the third part 31 and the fourth part 32 can be directly formed on the surface of the substrate 1 by electroplating or other methods. Alternatively, it can be die-cast separately to form a metal plate including the third part 31 and the fourth part 32, which facilitates the processing and manufacturing of the second metal layer 3 and its connection with the substrate 1.

[0127] Figure 15 This is a schematic diagram of the structure of a radio frequency system provided in one embodiment of this application, as shown below. Figure 15 As shown, the substrate 1 in this RF system can be a single-layer structure, with a first metal layer 2 and a second metal layer 3 respectively disposed on opposite sides of the substrate 1. A circulator 400 and a filter 500 can be formed on the substrate 1, and an RF chip 700 for power amplification of the RF signal can be mounted on the substrate 1. The RF signal can be input to the RF chip 700 through the input port. The RF chip 700 can amplify the RF signal and transmit the amplified RF signal to the circulator 400. The circulator 400, based on its unidirectional transmission characteristics, allows the RF signal to be transmitted unidirectionally to the filter 500. After filtering by the filter 500, the RF signal is output externally through the output port 14.

[0128] Figure 16 A schematic diagram of the structure of a radio frequency system provided in another embodiment of this application is shown below. Figure 16 As shown, substrate 1 includes a first substrate 16 and a second substrate 17. The second substrate 17 is stacked on the first substrate 16 along the thickness direction of substrate 1. A first metal layer 2 is disposed on the side of the first substrate 16 facing away from the second substrate 17, and a second metal layer 3 is disposed on the side of the second substrate 17 facing away from the first substrate 16. A first port 15a is disposed on either the first substrate 16 or the second substrate 17, and a second port 15b is disposed on the second substrate 17. A first resonant cavity 161 is formed in the first substrate 16, and a second resonant cavity 171 is formed in the second substrate 17. The radio frequency signal input from the input port 13 passes sequentially through the first resonant cavity 161 and the second resonant cavity 171 and is then output through the output port 14. The first metal layer 2 and the second metal layer 3, in combination, allow the first substrate 16 and the second substrate 17 located between the first metal layer 2 and the second metal layer 3 to respectively constitute the first resonant cavity 161 and the second resonant cavity 171. Furthermore, the first resonant cavity 161 and the second resonant cavity 171 can be electrically connected through the feeding structure 6 (the feeding structure 6 will be described in detail later).

[0129] The radio frequency (RF) signal can be transmitted in the first resonant cavity 161 and the second resonant cavity 171. The portion of the first device 111 used for transmitting the RF signal can be formed from at least a portion of the first substrate 16 and the second substrate 17, and the second device 121 can also be formed from at least a portion of the first substrate 16 and the second substrate 17. Through the double-layer structure formed by the first substrate 16 and the second substrate 17, multiple resonant cavities can be formed in the first substrate 16 and the second substrate 17. When the RF signal is transmitted in the resonant cavities of the first substrate 16 and the second substrate 17, a higher quality RF signal can be obtained. When the second device 121 includes a filter, the integration of a filter with high suppression requirements and a circulator function can be achieved.

[0130] In other embodiments, the radio frequency system may also include three or more substrate layers, depending on the characteristics of the required radio frequency signal.

[0131] Figure 17 A cross-sectional view of a radio frequency system provided in another embodiment of this application, such as Figure 17 As shown, the first substrate 16 and the second substrate 17 can be made of different materials. For example, the electromagnetic loss of the second substrate 17 can be lower than that of the first substrate 16. Exemplarily, the first substrate 16 can be made of microwave ferrite gyromagnetic material to facilitate the formation of a circulator. The second substrate 17 can be made of ceramic, which has lower electromagnetic losses than microwave ferrite gyromagnetic material. This allows for improved resonant cavity performance while fully utilizing the advantages of low-loss dielectric materials to reduce RF signal loss during transmission.

[0132] In some other embodiments, the first substrate 16 and the second substrate 17 may also be made of the same material. For example, both the first substrate 16 and the second substrate 17 may be made of microwave ferrite gyromagnetic material. This embodiment does not limit this.

[0133] In both the first substrate 16 and the second substrate 17, metallized vias can be provided to confine the radio frequency signal within the respective substrate for transmission. The first substrate 16 and the second substrate 17 are described below.

[0134] Figure 18 This is a schematic diagram of the structure of the first substrate 16 in the radio frequency system provided in the embodiments of this application, as shown below. Figure 18 As shown, the metallized vias include a first metallized via 123a, which is disposed on the first substrate 16. At least a portion of the first metallized vias 123a form a first resonant cavity 161 for transmitting radio frequency signals. One or more of the first resonant cavities 161 may be formed. Figure 18Exemplarily shown are three first resonant cavities 161, which can realize filtering function. In addition, ports of a circulator, such as port a, port b and port c, can be formed between at least a portion of the first metallized vias 123a to realize circulator function.

[0135] The aforementioned power supply structure 6 may include a first power supply element 61 and a second power supply element 62. The first power supply element 61 is disposed on the first substrate 16 at port a, and the second power supply element 62 is disposed on the first substrate 16 at port c. The first power supply element 61 can receive radio frequency (RF) signals input from the input port, and the second power supply element 62 can output RF signals to the signal receiver. The power supply structure 6 may not be disposed at port b, but port b can be connected to the first resonant cavity 161, meaning that the RF signal output from port b can enter the first resonant cavity 161 and be further filtered by it. The power supply structure 6 also includes a third power supply element 63, which may be disposed on the first substrate 16 at a location corresponding to the second device 121 on the second substrate 17, for inputting RF signals from the second substrate 17 into the first substrate 16.

[0136] The first power supply component 61, the second power supply component 62, and the third power supply component 63 can all be formed on the first substrate 16 by processes such as electroplating, or they can be manufactured separately by conductive materials such as metal and installed on the first substrate 16.

[0137] Figure 19 This is a schematic diagram of the structure of the second substrate 17 in the radio frequency system provided in the embodiments of this application, as shown below. Figure 19 As shown, the metallized via includes a second metallized via 123b, which is disposed on the second substrate 17. At least a portion of the second metallized vias 123b form a second resonant cavity 171 for transmitting radio frequency signals. One or more of the second resonant cavities 171 may be formed. Figure 19 An example is shown where three second resonant cavities 171 are formed, and the three second resonant cavities 171 can realize the filtering function.

[0138] The second substrate 17 may have input ports and output ports. An RF chip 700 may also be disposed on the second substrate 17, and the RF chip 700 is electrically connected to the input ports for power amplification of the RF signal. In some other embodiments, the input ports may also be integrated onto the RF chip 700. The RF chip 700 may be connected to the third power supply element 63 on the first substrate (see reference 63). Figure 18Through metallized vias, the radio frequency signal, which has been amplified by the radio frequency chip 700, can be fed from the second substrate 17 into the first substrate, and can be processed by the circulator and filter in the first substrate before being transmitted back to the second substrate 17.

[0139] The aforementioned power supply structure 6 may further include a fourth power supply element 64 and a fifth power supply element. The fourth power supply element 64 and the first power supply element 61 are positioned opposite each other and can be electrically connected through metallized vias. The fifth power supply element and the second power supply element 62 are positioned opposite each other and can be electrically connected through metallized vias. Through the cooperation of the first power supply element 61 and the fourth power supply element 64, and the cooperation of the second power supply element 62 and the fifth power supply element, radio frequency signals can be transmitted between the first substrate 16 and the second substrate 17.

[0140] Figure 20 This is a schematic diagram of radio frequency signal transmission in a radio frequency system provided in an embodiment of this application, as shown below. Figure 20 As shown, the radio frequency (RF) signal input through input port 13 on the second substrate 17 is first amplified by the RF chip. The amplified RF signal then sequentially passes through the fourth feed element 64 and the first feed element 61 into the circulator 400 in the first substrate 16. After the circulator 400 adjusts the output direction, the RF signal is transmitted to the first resonant cavity 161 of the first substrate 16. After filtering in the first resonant cavity 161, the RF signal can be input to the RF chip 700 through the third feed element 63. The RF chip then inputs the RF signal to the second resonant cavity 171 of the second substrate 17. After filtering in the second resonant cavity 171, the signal can be output through output port 14. Thus, through the filtering processes of the first substrate 16 and the second substrate 17, the functions of a filter requiring high suppression and the circulator 400 can be integrated.

[0141] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A radio frequency system, characterized in that, include: A substrate having an input port and an output port, the substrate comprising a first portion and a second portion, the first portion being made of microwave ferrite gyromagnetic material, at least a portion of the first portion being formed as a first device using the microwave ferrite gyromagnetic material; at least a portion of the second portion being formed as a second device, or the second portion having a second device disposed thereon; the first device being used to transmit a radio frequency signal input from the input port to the second device, and the second device outputting a radio frequency signal through the output port; A first metal layer is disposed on one side of the substrate along the thickness direction of the substrate; A second metal layer is disposed on the substrate on the side opposite to the first metal layer, along the thickness direction of the substrate.

2. The radio frequency system according to claim 1, characterized in that, The substrate has a plurality of metallized vias, one end of which is electrically connected to the first metal layer and the other end of which is electrically connected to the second metal layer. At least some of the metallized vias form channels for transmitting radio frequency signals.

3. The radio frequency system according to claim 2, characterized in that, At least some of the metallized vias form a cavity, the cavity having a first port and a second port, the first port communicating with a port of the first device, and the second port communicating with the output port.

4. The radio frequency system according to claim 3, characterized in that, The chamber includes one or more sub-chambers. When there are two or more sub-chambers, the sub-chambers are connected in sequence.

5. The radio frequency system according to any one of claims 1-4, characterized in that, It also includes a permanent magnet disposed in the first part for providing a bias magnetic field to cooperate with the microwave ferrite gyromagnetic material to form the first device.

6. The radio frequency system according to claim 5, characterized in that, A supporting medium layer is provided between the permanent magnet and the second metal layer.

7. The radio frequency system according to any one of claims 1-6, characterized in that, Both the first and second parts are made of microwave ferrite gyromagnetic materials; Alternatively, the materials of the first part and the second part may be different.

8. The radio frequency system according to any one of claims 1-7, characterized in that, The second metal layer includes a third part and a fourth part, wherein at least a portion of the projection of the third part along the thickness direction of the substrate coincides with the projection of the first part, and the third part is provided with a plurality of ports, which are spaced apart in the circumferential direction. At least a portion of the fourth portion is projected along the thickness direction of the substrate and coincides with the projection of the second portion, thereby restricting the transmission of radio frequency signals in the second portion.

9. The radio frequency system according to claim 3, characterized in that, The substrate includes a first substrate and a second substrate. Along the thickness direction of the substrate, the second substrate is stacked on the first substrate. The first metal layer is disposed on the side of the first substrate facing away from the second substrate, and the second metal layer is disposed on the side of the second substrate facing away from the first substrate. The first port is disposed on the first substrate or the second substrate, and the second port is disposed on the second substrate; A first resonant cavity is formed in the first substrate, and a second resonant cavity is formed in the second substrate. The radio frequency signal input from the input port passes through the first resonant cavity and the second resonant cavity in sequence and is output through the output port.

10. The radio frequency system according to claim 9, characterized in that, The metallized via includes a first metallized via and a second metallized via. The first metallized via is disposed on the first substrate, and at least a portion of the first metallized vias form a first resonant cavity for transmitting radio frequency signals. The second metallized via is disposed on the second substrate, and at least a portion of the second metallized via forms a second resonant cavity for transmitting radio frequency signals.

11. The radio frequency system according to claim 9, characterized in that, The first resonant cavity and the second resonant cavity are connected by a feeding structure.

12. The radio frequency system according to claim 9, characterized in that, The electromagnetic loss of the second substrate is lower than that of the first substrate.

13. The radio frequency system according to claim 12, characterized in that, The first substrate is made of microwave ferrite gyromagnetic material, and the second substrate is made of ceramic.

14. The radio frequency system according to any one of claims 1-13, characterized in that, The first device is a circulator, and the second device includes one or more of the following: a filter, a coupler, a power amplifier, a power divider, a phase shifter, and an RF chip.

15. The radio frequency system according to claim 1, characterized in that, The microwave ferrite gyromagnetic material is a self-biased microwave ferrite gyromagnetic material.

16. An electronic device, characterized in that, The device includes a circuit board and a radio frequency (RF) front-end link, wherein the RF front-end link is disposed on the circuit board and the RF front-end link includes the RF system according to any one of claims 1-15, and the RF system is electrically connected to the circuit board.

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