Device for magneto-optical determination of current flowing through electrical conductor

Abstract

The invention relates to a device (4) for the magneto-optical determination of a current (I) through an electrical conductor (6), comprising: a light source (12) configured to generate a light signal; a receiving unit (16) configured for converting an optical signal into an electrical signal; a glass coil (8) configured to establish an optical connection between the light source (12) and the receiving unit (16); and an evaluation unit (18) configured for determining the current (I) on the basis of the polarization of the received optical signal. In order to be able to be implemented more easily and to be able to measure lower currents, it is proposed that the glass coil (8) is designed as a planar coil which is arranged in such a way that the electrical conductor (6) is arranged to extend in the region of the center (24) of the planar glass coil (8).

Description

Technical Field

[0001] This invention relates to an apparatus for magneto-optical measurement of current passing through an electrical conductor.

[0002] Furthermore, the present invention also relates to a semiconductor assembly having at least one semiconductor element for such a device.

[0003] Furthermore, the present invention also relates to a power converter having at least one such semiconductor component.

[0004] Furthermore, the present invention also relates to a method for manufacturing an apparatus for magneto-optical measurement of current passing through an electrical conductor.

[0005] Furthermore, the present invention relates to the use of a planar glass coil in magneto-optical measurement of current passing through an electrical conductor, wherein the electrical conductor is arranged to extend in the central region of the planar glass coil. Background Technology

[0006] These types of semiconductor components are used, for example, in power converters in electric drive technology. Here, a power converter can be understood as, for example, a rectifier, inverter, converter, or DC-DC voltage converter. These power converters are continuously being optimized, thereby employing improved semiconductor materials, modified assembly and interconnect technologies (AVT), and improved heat dissipation solutions. Furthermore, monitoring solutions are employed to monitor the semiconductor modules. These optimizations are particularly aimed at achieving higher power density, more compact structures, higher efficiency, and higher reliability.

[0007] The monitoring scheme includes sensors capable of measuring current, particularly load current. These sensors must not significantly affect the semiconductor device and its peripheral components, including, for example, assembly and interconnect (AVT) technology, especially leads. Furthermore, the sensors need to be able to respond rapidly to dynamic electrical processes of the semiconductor device, particularly transient switching processes, on the order of milliseconds or even picoseconds.

[0008] Publication EP 3 358 359 A1 describes a circuit board having a conductor circuit and a recess arranged in the direction of the conductor circuit such that the conductor circuit is interrupted. An insert is arranged in the recess, the insert having left, right, lower, and upper edges. A conductor is disposed in the insert, which closes the conductor circuit interrupted by the recess after the insert is inserted. The insert has a first optical layer and a second optical layer, with the conductor arranged between the two layers. The first and second optical layers each have at least one light guide structure having a first end and a second end. A light guide element is arranged in the right edge region of the insert, and each second end of the light guide structure is located in this region so that light input to the first end of the light guide fiber of the first optical layer is deflected to the second end of the light guide structure of the second optical layer, thereby causing the light path to surround the conductor. The circuit board also includes an optical transmitter and an optical receiver with evaluation devices, thereby forming a fiber optic current sensor for measuring the current flowing through the conductor.

[0009] Publication EP 4 050 347 A1 describes a method for monitoring at least one semiconductor element in a semiconductor module, wherein the semiconductor module has leads for contacting the semiconductor element. To acquire dynamic, especially transient, processes without significantly affecting at least one semiconductor element and its surrounding portion, the proposed approach is to arrange a magneto-optical sensor in the region of the semiconductor element or at least one lead, wherein a polarized light signal is reflected by the magneto-optical sensor, and the current is determined based on the polarization of the reflected light signal.

[0010] The scientific publication "Development of Optical Current Transformers and Application to Fault Location Systems for Substations" (Y. Yamagata et al., IEEE Transactions on Power Delivery, Vol. 8, No. 3, July 1993, pp. 1-7) describes a magneto-optical current transformer with a Faraday element formed from a bulk element of bismuth silicon oxide (BSO) single crystal. The contents of this research paper are incorporated herein by reference.

[0011] Existing solutions utilizing magneto-optical sensors are complex to implement and limited to measuring high currents and / or high electric fields, which at least partially hinders their widespread application in industry. Summary of the Invention

[0012] Against this background, the technical problem to be solved by the present invention is to provide an apparatus for magneto-optical measurement of current passing through an electrical conductor, which utilizes magneto-optical sensing technology, is easy to implement, and is suitable for measuring low currents.

[0013] This technical problem is solved by an apparatus for magneto-optical measurement of current passing through an electrical conductor, the apparatus comprising: a light source configured to generate an optical signal; a receiving unit configured to convert the optical signal into an electrical signal; a glass coil configured to establish an optical connection between the light source and the receiving unit; and an evaluation unit configured to measure the current based on the polarization of the received optical signal, wherein the glass coil is configured such that the planar coil is arranged such that the electrical conductor extends in the central region of the planar glass coil.

[0014] Furthermore, this technical problem is also solved by an apparatus for magneto-optical measurement of current passing through an electrical conductor, the apparatus comprising: a light source configured to generate an optical signal; a reflector configured to reflect the optical signal generated by the light source; a glass coil configured to establish an optical connection between the light source and the reflector; a receiving unit configured to convert the optical signal reflected by the reflector into an electrical signal; and an evaluation unit configured to determine the current based on the polarization of the received optical signal, wherein the glass coil is constructed as a planar coil, the planar coil being arranged such that the electrical conductor is arranged to extend in the central region of the planar glass coil.

[0015] Furthermore, this technical problem is also solved by a semiconductor component having at least one semiconductor element connected to an electrical conductor, and a device of the type described above.

[0016] Furthermore, this technical problem is also solved by a power converter having at least one of the aforementioned semiconductor components.

[0017] Furthermore, this technical problem is also solved by a method for manufacturing an apparatus for magneto-optical measurement of current passing through an electrical conductor, the apparatus comprising: a light source configured to generate an optical signal; a receiving unit configured to convert the optical signal into an electrical signal; an evaluation unit configured to determine the current based on the polarization of the received optical signal; and a glass coil connected to the light source and the receiving unit to establish an optical connection; wherein the glass coil is connected to form an optical connection with the light source and the receiving unit; wherein the glass coil is constructed as a planar coil, the planar coil being arranged such that the electrical conductor extends in the central region of the planar glass coil.

[0018] Furthermore, this technical problem is also solved by a method for manufacturing an apparatus for magneto-optical measurement of current passing through an electrical conductor, the apparatus comprising: a light source configured to generate an optical signal; a reflector; a receiving unit configured to convert the optical signal reflected by the reflector into an electrical signal; an evaluation unit configured to determine the current based on the polarization of the received optical signal; and a glass coil, wherein the glass coil is optically connected to the light source and the reflector, wherein the glass coil is constructed as a planar coil, the planar coil being arranged such that the electrical conductor extends in the central region of the planar glass coil.

[0019] Furthermore, this technical problem is also solved by a planar glass coil for magneto-optical measurement of current passing through an electrical conductor, wherein the electrical conductor is arranged to extend in the central region of the planar glass coil.

[0020] The advantages and preferred structure of the device described below can also be applied to semiconductor components, power converters, manufacturing methods, and this application.

[0021] This invention is based on the following idea: by employing and improving a sensor-based monitoring method, namely, using a magneto-optical sensor to measure current in an electrically isolated manner, especially in semiconductor modules, and this magneto-optical sensor having a glass coil, by making the distance between the glass coil and the current-carrying conductor very small and by having a sufficient number of turns in the glass coil, it is possible to measure lower currents, especially for low-voltage ranges. Based on the magneto-optical effect—called the Faraday effect in the case of transmission and the Kerr effect in the case of reflection—the magnetic field can be detected, especially quantitatively, by the polarization change induced in the glass coil that depends on the magnetic field strength. To obtain an arrangement optimized for sensing technology and easy to implement, the glass coil is constructed as a planar structure, and the electrical conductor is arranged extending in the central region of the planar glass coil. Such planar glass coils can be implemented simply and compactly, especially on electro-optical circuit boards (EOCBs). For example, the planar glass coil has at least 5 turns, especially at least 10 turns.

[0022] Current measurement can be performed as either reflection or transmission measurement. For reflection measurement, a reflector (e.g., constructed as a mirror) is connected to a planar glass coil. A light source for generating an optical signal and a receiving unit for converting the reflected or transmitted optical signal into an electrical signal are connected to the planar glass coil. The evaluation unit is configured to determine the current to be measured through the conductor based on the polarization of the received optical signal.

[0023] In a further embodiment, a planar glass coil is arranged in a plane that is substantially perpendicular to the direction of extension of the electrical conductor. This achieves optimized orientation of the planar glass coil relative to the magnetic field generated by the energized conductor, which has a positive impact on the sensitivity of the sensing technology.

[0024] In a further embodiment, the planar glass coil is integrated into the substrate, particularly completely integrated into the substrate. For example, the planar glass coil is completely arranged in the substrate and flush with the substrate surface, thus providing a flat surface. Integrating the glass coil into the substrate is easy to implement and allows for precise and space-saving structural designs.

[0025] In a further embodiment, the plane defined by the planar glass coil is arranged parallel to the surface of the substrate. This achieves optimized orientation of the planar glass coil relative to the magnetic field generated by the energized conductor, which has a positive impact on the sensitivity of the sensing technology. Furthermore, such an arrangement is easy to implement.

[0026] In a further embodiment, the planar glass coil is constructed of a waveguide with a width ranging from 1 μm to 100 μm, particularly from 3 μm to 50 μm. This structure allows for a high number of turns within a very small space, enabling the planar glass coil to be positioned very close to a current-carrying conductor, thereby improving sensing sensitivity.

[0027] In a further embodiment, a waveguide with a planar glass coil is introduced into a thin glass layer via a diffusion process, wherein the thin glass layer, together with the planar glass coil, is introduced flush with the substrate cavity. In particular, the optical waveguide can be fabricated in the thin glass layer using a controlled laser beam and subsequently an ion-exchange process. For example, the thin glass layer with the planar glass coil is completely introduced into the substrate cavity and flush with the substrate surface, thus creating a flat surface. Especially through the diffusion process, fine structures with high turn counts can be achieved in a very small space.

[0028] In a further embodiment, the electrical conductor includes a through-hole disposed in the substrate, the through-hole extending in the central region of the planar glass coil. For example, the through-hole extends perpendicular to the surface of the substrate on which the planar glass coil is disposed. Thus, the magnetic field formed in the through-hole region of the electrical conductor is optimally oriented relative to the planar glass coil surrounding the through-hole, thereby having a beneficial effect on the sensitivity of the sensor.

[0029] In a further embodiment, the planar glass coil comprises quartz glass, flint glass, bismuth silicon oxide, and / or bismuth germanium oxide. This gives the planar glass coil a sufficiently high Verdet constant, thereby enabling sufficiently sensitive current measurement accuracy, especially suitable for low-voltage ranges. Attached Figure Description

[0030] The present invention will be further described and illustrated below with reference to the embodiments shown in the accompanying drawings. The drawings show: Figure 1 A schematic diagram of a semiconductor assembly having a first design for a device for magneto-optical measurement of current passing through an electrical conductor. Figure 2 A schematic cross-sectional view of a first design for an apparatus for magneto-optical measurement of current passing through an electrical conductor. Figure 3 A schematic diagram of a semiconductor assembly having a second design for a device for magneto-optical measurement of current passing through an electrical conductor. Figure 4 A schematic diagram of a semiconductor assembly with a third design for a device for magneto-optical measurement of current passing through an electrical conductor. Figure 5 This is a schematic diagram of a power converter with a semiconductor module. Figure 6 A schematic diagram of a fourth design for manufacturing a device for magneto-optical measurement of current passing through an electrical conductor; and Figure 7 This is a schematic diagram of a semiconductor assembly with a fourth design for measuring the current passing through an electrical conductor using magneto-optical methods. Detailed Implementation

[0031] The embodiments described below relate to preferred embodiments of the invention.

[0032] In these embodiments, each described component constitutes a separate feature of the invention. Each feature is considered independently, and each feature can, individually or in a manner different from the illustrated combination, further improve the invention and is thus considered part of the invention individually or in a manner different from the illustrated combination. Furthermore, the described embodiments can be supplemented by other features of the invention described above.

[0033] The same reference numerals in each of the accompanying figures have the same meaning.

[0034] Figure 1A schematic diagram of a semiconductor component 2 with a first design of a device 4 for magneto-optical measurement of a current I passing through an electrical conductor 6 is shown. The device 4 includes, for example, a rectangular glass coil 8 constructed as a planar coil, and a transceiver unit 10 connected to the planar glass coil 8. The transceiver unit 10 includes a light source 12 for generating an optical signal. The planar glass coil 8 is connected to a reflector 14 configured to reflect the optical signal generated by the light source 12. For example, the reflector 14 has a mirror. An optical connection is established between the light source 12 and the reflector 14 via the planar glass coil 8. For example, the planar glass coil 8 is constructed of a waveguide 15 having a width b in the range of 1 μm to 100 μm, particularly in the range of 3 μm to 50 μm.

[0035] The planar glass coil 8 is made of, for example, thin glass comprising quartz glass, flint glass, bismuth silicon oxide, and / or bismuth germanium oxide, thereby achieving a sufficiently high Verdet constant to provide sufficiently sensitive current measurement accuracy, particularly suitable for low-voltage ranges. The transceiver unit 10 also includes a receiving unit 16 configured to convert the optical signal reflected by the reflector 14 into an electrical signal, and an evaluation unit 18 configured to determine the current I passing through the conductor 6 based on the polarization of the received optical signal.

[0036] A planar glass coil 8 is integrated into a substrate 20, particularly fully integrated into the substrate. The substrate can be configured, for example, as an electro-optical circuit board (EOCB). The waveguide 15 of the planar glass coil 8 is introduced into the cavity of the substrate 20 through a diffusion process. In particular, the optical waveguide 15 can be fabricated in thin glass using an ion exchange process with a controlled laser beam. Complex waveguide geometries can be formed using lasers, thus allowing a large number of turns to be accommodated in a very small space. For the sake of simplified illustration, Figure 1 The planar glass coil 8 shown exemplarily has 8.5 turns, but significantly more turns can be achieved, thereby improving sensitivity, especially by means of a diffusion process. For example, the planar glass coil 8 has at least 5 turns, and more particularly at least 10 turns.

[0037] An electrical conductor 6 is disposed on a substrate 20 and has a through-hole 22 formed as a via, which is arranged to extend at least partially through the substrate 20. The through-hole 22 is arranged in the region of the center 24 of the planar glass coil 8, such that the through-hole 22 of the electrical conductor 6 passes close to the optical waveguide 15 of the planar glass coil 8. Thus, the magnetic field is always oriented and modulated in the same way relative to the wave propagation of light in the optical waveguide 15, thereby causing the polarization to change in a single direction. The design of the planar glass coil 8 ensures that polarization fidelity is maintained along the entire length of the waveguide 15 of the coil (excluding the lead portion), except for the Faraday effect, i.e., the polarization does not change. In this respect, the reflector 14 has the advantage of achieving twice the modulation length with twice the optical path length, and the coupling of light in and out is also simplified.

[0038] The semiconductor component 2 also includes at least one semiconductor element 26 connected to the electrical conductor 6. The semiconductor element 26 can be configured, for example, as an insulated-gate bipolar transistor (IGBT), or as other power semiconductors, particularly wide-bandgap power semiconductors such as GaN or SiC power semiconductors. For example, the load current of the semiconductor element 26 flows through the electrical conductor 6 and is measured by the device 4.

[0039] Figure 2 A schematic cross-sectional view of a first design of a device 4 for magneto-optical measurement of the current I passing through an electrical conductor 6 is shown. A planar glass coil 8 is fully integrated into the substrate 20, i.e., the waveguide 15 of the planar glass coil 8 does not protrude above the surfaces 20a and 20b of the substrate 20. A through-hole 22 of the electrical conductor 6 extends from the first surface 20a of the substrate 20 to the second surface 20b opposite to the first surface 20a. Alternatively, the through-hole 22 can be configured as a blind via and connected to an inner layer of the substrate 20. A plane 28 defined by the planar glass coil 8 is arranged to extend parallel to the surfaces 20a and 20b of the substrate 20, wherein the plane 28 on which the planar glass coil 8 is arranged extends substantially perpendicular to the through-hole 22 of the electrical conductor 6. Figure 2 Other design schemes of device 4 in the middle correspond to Figure 1 The design scheme shown.

[0040] Figure 3 A schematic diagram of a semiconductor component 2 with a second design for a device 4 for magneto-optical measurement of the current I passing through the electrical conductor 6 is shown. The planar glass coil 8 is constructed in an octagonal shape. Alternatively, the planar glass coil 8 can also be constructed in a hexagonal or circular shape. Thus, the through-hole 22 of the electrical conductor 6 passes close to the optical waveguide 15 of the planar glass coil 8. For the sake of simplifying the illustration, Figure 3 The octagonal planar glass coil 8 shown exemplarily has 2.5 turns, but as mentioned above, significantly more turns can be achieved. Figure 3 Other design schemes for device 4 correspond to Figure 1 The design scheme shown.

[0041] Figure 4 A schematic diagram of a semiconductor component 2 with a third design of a device 4 for magneto-optical measurement of the current I in an electrical conductor 6 is shown. A receiving unit 16 is arranged on one end of a planar glass coil 8 opposite to the light source 12. Thus, the planar glass coil 8 establishes an optical connection between the light source 12 and the receiving unit 16. The receiving unit 16 is configured to convert the transmitted light signal into an electrical signal. An evaluation unit 18 is configured to measure the current based on the polarization of the received light signal. The receiving unit 16 can be directly arranged on the substrate 20 at the end of the planar glass coil 8. Alternatively, the planar glass coil 8 can be connected to the edge of the substrate 20 via an additional waveguide. In this way, the coupling-in and coupling-out surfaces can be connected to the light source 12 and the receiving unit 16 via precise structural edges, such as on the carrier layer of the EOCB. Figure 4 Other design schemes for device 4 correspond to Figure 3 The design scheme shown.

[0042] Figure 5 A schematic diagram of a power converter 30 having a semiconductor component 2 is shown. The semiconductor component 2 includes a device 4 for magneto-optical measurement of the current passing through an electrical conductor. The power converter 30 can include more than one semiconductor component 2.

[0043] Figure 6 A schematic diagram of a fourth design for manufacturing a device 4 for magneto-optical measurement of current passing through an electrical conductor is shown. A cavity 32 is formed in a substrate 20. A planar glass coil 8 is introduced into a thin glass 34 via a diffusion process. A recess 36 is provided at the center 24 of the planar glass coil 8 in the thin glass 34. The thin glass 34 with the planar glass coil 8 is flush-introduced into the cavity 32 of the substrate 20, the cavity being formed accordingly to the shape of the thin glass 34. An electrical conductor 6 is arranged perpendicular to the first surface 20a of the substrate 20 in a protrusion 38 corresponding to the recess 36, such that the conductor 6 extends through the center 24 of the planar glass coil 8. In a next step, another substrate 40 is arranged on the substrate 20 and the thin glass 34 with the planar glass coil 8 introduced into the cavity 32 of the substrate 20, wherein the conductor 6 of the other substrate 40 is electrically connected to the conductor 6 of the substrate 20 in the region of the center 24 of the planar glass coil 8, particularly by means of material fitting, such as by welding. The structure of the thin glass 34 with the planar glass coil 8 is configured to enable the transceiver unit 10 to be connected on the substrate 20. Figure 5 Other design schemes for device 4 correspond to Figure 2The design scheme in the middle.

[0044] Figure 7 A schematic diagram of a semiconductor component 2 with a fourth design of a device 4 for magneto-optical measurement of the current I in an electrical conductor 6 is shown. A thin glass 34 with a planar glass coil 8 is shown. Figure 6 The cavity 32 of the substrate 20 is flush with the first surface 20a of the substrate 20, wherein the thin glass 34 with the planar glass coil 8 is flush with the first surface 20a of the substrate 20. Another substrate 40 is flat, and particularly its entire surface, abutted against the substrate 20 and the thin glass 34 with the planar glass coil 8. The conductor 6 of the other substrate 40 is electrically connected to the conductor 6 of the substrate 20 in the central region 24 of the planar glass coil 8, particularly by means of material fitting, such as by soldering. The semiconductor assembly 2 also has at least one semiconductor element 26 connected to the electrical conductor 6. The load current flowing through the at least one semiconductor element 26 via the electrical conductor 6 is measured by the device 4 during operation of the semiconductor assembly 2. Figure 7 Other design schemes for device 4 correspond to Figure 5 The design scheme in the middle.

[0045] In summary, the present invention relates to an apparatus 4 for magneto-optical measurement of current I in an electrical conductor 6, the apparatus comprising: a light source 12 configured to generate an optical signal; a receiving unit 16 configured to convert the optical signal into an electrical signal; a glass coil 8 configured to establish an optical connection between the light source 12 and the receiving unit 16; and an evaluation unit 18 configured to measure the current I based on the polarization of the received optical signal. To facilitate simpler implementation and enable measurement of lower currents, it is proposed that the glass coil 8 be constructed as a planar coil, the planar coil being arranged such that the electrical conductor 6 extends in the region of the center 24 of the planar glass coil 8.

Claims

1. An apparatus (4) for magneto-optical measurement of a current (I) passing through an electrical conductor (6), the apparatus comprising: - Light source (12), the light source being configured to generate light signals; - Receiving unit (16), the receiving unit being configured to convert the optical signal into an electrical signal; - Glass coil (8), the glass coil being configured to establish an optical connection between the light source (12) and the receiving unit (16); - Evaluation unit (18), the evaluation unit is configured to determine the current (I) based on the polarization of the received optical signal; The glass coil (8) is constructed as a planar coil, and the planar coil is arranged such that the electrical conductor (6) is arranged to extend in the region of the center (24) of the planar glass coil (8).

2. An apparatus (4) for magneto-optical measurement of current (I) passing through an electrical conductor (6), the apparatus comprising: - Light source (12), the light source being configured to generate light signals; - Reflector (14), the reflector being configured to reflect the light signal generated by the light source (12); - Glass coil (8), the glass coil being configured to establish an optical connection between the light source (12) and the reflector (14); - Receiving unit (16), the receiving unit is configured to convert the light signal reflected by the reflector (14) into an electrical signal; - Evaluation unit (18), the evaluation unit is configured to determine the current (I) based on the polarization of the received optical signal; The glass coil (8) is constructed as a planar coil, and the planar coil is arranged such that the electrical conductor (6) is arranged to extend in the region of the center (24) of the planar glass coil (8).

3. The apparatus (4) according to any one of claims 1 or 2. in, The planar glass coil (8) is arranged in a plane (28) that extends substantially perpendicular to the electrical conductor (6).

4. The apparatus (4) according to any one of the preceding claims. in, The planar glass coil (8) is fully integrated into the substrate (20).

5. The apparatus (4) according to claim 4. in, The planar glass coil (8) is composed of a waveguide (15) having a width (b) in the range of 1 μm to 100 μm, particularly in the range of 3 μm to 50 μm.

6. The apparatus (4) according to any one of claims 4 or 5. in, The waveguide (15) of the planar glass coil (8) is introduced into the thin glass (34) by means of a diffusion process. The thin glass (34), together with the planar glass coil 8, is introduced flush into the cavity (32) of the substrate (20).

7. The apparatus (4) according to claim 6. in, The thin glass (34) has a recess (36) in the region of the center (24) of the planar glass coil (8). The cavity (32) of the substrate (20) has a protrusion (38) corresponding to the recess (36), in which the electrical conductor (6) is arranged perpendicular to the first surface (20a) of the substrate (20).

8. The apparatus (4) according to any one of claims 6 or 7. in, An additional substrate (40) is disposed on the substrate (20) and the thin glass (34) with the planar glass coil (8), wherein the conductor (6) of the additional substrate (40) is preferably electrically connected to the conductor (6) of the substrate (20) in a material-fitting manner in the region of the center (24) of the planar glass coil (8).

9. The apparatus (4) according to any one of claims 4 to 8. in, The electrical conductor (6) includes a through-hole (22) in the substrate (20), the through-hole being arranged to extend in the region of the center (24) of the planar glass coil (8).

10. The apparatus (4) according to any one of the preceding claims. in, The planar glass coil (8) comprises quartz glass, flint glass, bismuth silicon oxide and / or bismuth germanium oxide.

11. A semiconductor assembly (2) having at least one semiconductor element (26) connected to an electrical conductor (6) and a device (4) according to any one of the preceding claims.

12. A power converter (30) having at least one semiconductor component (2) according to claim 11.

13. A method for manufacturing an apparatus (4) for magneto-optical measurement of a current (I) passing through an electrical conductor (6), the apparatus comprising: - Light source (12), the light source being configured to generate light signals; - Receiving unit (16), the receiving unit being configured to convert the optical signal into an electrical signal; - Evaluation unit (18), the evaluation unit is configured to determine the current (I) based on the polarization of the received optical signal; - Glass coil (8) The glass coil (8) is connected to the light source (12) and the receiving unit (16) to establish an optical connection. The glass coil (8) is constructed as a planar coil, and the planar coil is arranged such that the electrical conductor (6) extends in the region of the center (24) of the planar glass coil (8).

14. A method for manufacturing an apparatus (4) for magneto-optical measurement of a current (I) passing through an electrical conductor (6), the apparatus comprising: - Light source (12), the light source being configured to generate light signals; -Reflector (14); - Receiving unit (16), the receiving unit is configured to convert the light signal reflected by the reflector (14) into an electrical signal; - Evaluation unit (18), the evaluation unit is configured to determine the current (I) based on the polarization of the received optical signal; - Glass coil (8) The glass coil (8) is connected to the light source (12) and the reflector (14) to establish an optical connection. The glass coil (8) is constructed as a planar coil, and the planar coil is arranged such that the electrical conductor (6) extends in the region of the center (24) of the planar glass coil (8).

15. The method according to any one of claims 13 or 14, in, The planar glass coil (8) is arranged in a plane (28) that extends substantially perpendicular to the electrical conductor (6).

16. The method according to any one of claims 13 to 15, in, The planar glass coil (8) is fully integrated into the substrate (20).

17. The method according to claim 16, in, The planar glass coil (8) is composed of a waveguide (15) having a width (b) in the range of 1 μm to 100 μm, particularly in the range of 3 μm to 50 μm.

18. The method according to claim 16 or 17, in, The waveguide (15) of the planar glass coil (8) is introduced into the thin glass (34) by means of a diffusion process, wherein the thin glass (34) together with the planar glass coil (8) is introduced flush into the cavity (32) of the substrate (20).

19. A planar glass coil (8) for the purpose of magneto-optical measurement of a current (I) passing through an electrical conductor (6), the electrical conductor being arranged to extend in the region of the center (24) of the planar glass coil (8).

20. The use according to claim 19, in, The planar glass coil (8) is arranged in a plane (28) that is arranged to extend substantially perpendicular to the electrical conductor (6).

21. The use according to any one of claims 19 or 20, in, The planar glass coil (8) is fully integrated into the substrate (20) such that the plane (28) defined by the planar glass coil (8) is arranged parallel to the surfaces (20a, 20b) of the substrate (20).

22. The use according to any one of claims 19 to 21, in, The planar glass coil (8) is introduced into the thin glass (34) by means of a diffusion process. The thin glass (34), together with the planar glass coil 8, is introduced flush into the cavity (32) of the substrate (20).

Images