Laser processing method, controller, laser processing equipment and circuit board

Abstract

The invention is suitable for the technical field of laser processing, and provides a laser processing method, a controller, laser processing equipment and a circuit board. The laser processing method comprises the steps that initial processing data of a modulation deflector in the laser processing equipment are obtained, and the initial processing data of the modulation deflector are used for controlling the modulation deflector to process a workpiece to be processed; distortion correction is conducted on the initial machining data of the modulation deflector to eliminate deviation generated in the process that a laser beam enters the modulation deflector and acts on a workpiece to be machined, corrected machining data are obtained, and distortion correction comprises at least one of machining coordinate correction and light spot form correction; accurate machining of irregular machining patterns in a single scanning range of the modulation deflector can be achieved, and compared with machining of irregular machining patterns through galvanometer deflection, the machining efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and particularly relates to a laser processing method, controller, laser processing equipment and circuit board. Background Technology

[0002] Traditional laser processing systems primarily rely on galvanometer scanning or stage movement for laser positioning. The galvanometer system uses the mechanical deflection of a mirror to move the laser processing point within the processing area. However, this mechanical deflection method is limited by its inherent physical inertia, resulting in low switching speeds and requiring additional stabilization time to eliminate positioning errors caused by vibrations. Some related technologies utilize modulated deflectors to achieve beam deflection, completely circumventing the limitations of mechanical inertia and improving switching speed and positioning accuracy. However, in actual processing, the shape and size of the processed patterns on the workpiece are random. Modulated deflectors are only suitable for processing small, regularly shaped patterns. Achieving precise processing of irregular patterns within a single scanning range of the modulated deflector is a key factor affecting processing efficiency. Summary of the Invention

[0003] This application provides a laser processing method, controller, laser processing equipment, and circuit board, which can achieve precise processing of irregular patterns within a single scanning range of a modulation deflector, thus improving processing efficiency compared to processing irregular patterns by galvanometer deflection.

[0004] The first aspect of this application provides a laser processing method, comprising: acquiring initial processing data of a modulation deflector within a laser processing device; performing distortion correction on the initial processing data of the modulation deflector to eliminate deviations generated during the process from the laser beam entering the modulation deflector to acting on the workpiece to be processed, thereby obtaining corrected processing data, wherein the distortion correction includes at least one of processing coordinate correction and spot shape correction, and the corrected processing data is used to process irregularly shaped processing patterns within a single scanning range of the modulation deflector.

[0005] In some embodiments of the first aspect, the number of modulation deflectors is two; the distortion correction includes, during machining coordinate correction, performing distortion correction on the initial machining data of the modulation deflectors, including: correcting the coordinate deviation between the actual machining coordinates and the target machining coordinates to correct the coordinate deviation caused by at least one of the following: the deviation between the actual distance and the theoretical distance between the two modulation deflectors, the deviation between the included angle between the two modulation deflectors and the theoretical included angle, and the installation angle deviation between the modulation deflectors and the machining platform carrying the workpiece to be processed in a preset reference direction.

[0006] In some embodiments of the first aspect, the distortion correction includes, during spot morphology correction, performing distortion correction on the initial processing data of the modulation deflector, including: performing distortion correction on the initial processing data of the modulation deflector based on the focusing optical component region through which the laser beam emitted from the modulation deflector passes, to obtain corrected processing data.

[0007] In some embodiments of the first aspect, distortion correction is performed on the initial processing data of the modulation deflector based on the focusing optical component region through which the laser beam emitted from the modulation deflector passes, to obtain corrected processing data. This includes: acquiring a focusing optical component calibration table, which records the calibration parameters corresponding to different processing points in the scene where the emitted beam from the modulation deflector is incident; determining the current calibration parameters based on the focusing optical component calibration table and the current processing point in the scene where the emitted beam from the modulation deflector is incident; and performing distortion correction on the initial processing data of the modulation deflector based on the current calibration parameters to obtain corrected processing data.

[0008] In some embodiments of the first aspect, controlling a modulation deflector to perform laser processing on a workpiece based on corrected processing data includes: determining the target frequency and initial amplitude of an initial radio frequency drive signal for the modulation deflector based on the corrected processing data; determining the diffraction efficiency corresponding to the target frequency, adjusting the amplitude according to the diffraction efficiency to obtain a target amplitude; generating a radio frequency drive signal based on the target frequency and target amplitude; and inputting the radio frequency drive signal into the modulation deflector to control the modulation deflector to perform laser processing on the workpiece.

[0009] In some embodiments of the first aspect, after generating the radio frequency drive signal, the method further includes: acquiring a laser synchronization signal; and adjusting the phase of the radio frequency drive signal based on the laser synchronization signal.

[0010] In some embodiments of the first aspect, the irregularly shaped processed pattern is an original processed pattern with a size less than or equal to a size threshold, or a sub-processed pattern obtained by disassembling an original processed pattern with a size greater than the size threshold.

[0011] In some embodiments of the first aspect, acquiring initial processing data of the modulation deflector within the laser processing equipment includes: acquiring initial processing data of the laser processing equipment; and decomposing the initial processing data of the laser processing equipment into galvanometer jump trajectory data and initial processing data of the modulation deflector.

[0012] In some embodiments of the first aspect, while controlling the modulation deflector to perform laser processing on the workpiece based on the corrected processing data, the method further includes: controlling the galvanometer adjustment based on the jump trajectory data so that the incident position of the laser beam on the workpiece jumps between areas of different processed patterns; and synchronously controlling the laser not to emit light during the period when the galvanometer controls the incident position of the laser beam to jump.

[0013] A second aspect of this application provides a controller, including a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, it implements the steps of the laser processing method described above.

[0014] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the laser processing method described above.

[0015] The fourth aspect of this application provides a computer program product that, when run, causes the above-described laser processing method to be executed.

[0016] The fifth aspect of this application provides a laser processing apparatus, comprising: a laser for emitting a laser beam; a beam control system including a galvanometer and a modulation deflector, the beam control system being used to transmit, control, and deflect the laser beam; a processing platform for carrying a workpiece to be processed; and a controller for controlling the laser, the beam control system, and the processing platform to work together to achieve the laser processing method as described in any of the first aspects.

[0017] The sixth aspect of this application provides a circuit board, which is processed according to the method of any one of the first aspects or the laser processing equipment based on any one of the fifth aspects.

[0018] In the embodiments of this application, the initial processing data of the modulation deflector is obtained, and distortion correction is performed on the initial processing data of the modulation deflector to eliminate the deviation generated by the laser beam from entering the modulation deflector to acting on the workpiece to be processed, thereby obtaining the corrected processing data. Based on the corrected processing data, the modulation deflector is controlled to perform laser processing on the workpiece to be processed, so as to process irregularly shaped processing patterns within a single scanning range of the modulation deflector. The distortion correction includes at least one of processing coordinate correction and spot shape correction, which can eliminate the processing coordinate offset and spot shape difference generated by the laser beam from entering the modulation deflector to acting on the workpiece to be processed, thereby achieving precise processing of irregular processing patterns by the modulation deflector within a single scanning range, which improves processing efficiency compared to processing irregular processing patterns by galvanometer deflection. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram illustrating the implementation process of a laser processing method provided in an embodiment of this application; Figure 2 This is a schematic diagram of the controller provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application; Figure 4 This is a schematic diagram of the specific structure of the laser processing equipment provided in the embodiments of this application. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are protected by this application.

[0022] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0023] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0025] Traditional laser processing systems primarily rely on galvanometer scanning or stage movement for laser positioning. The galvanometer system uses the mechanical deflection of a mirror to move points within the processing area. However, this mechanical deflection method is limited by its inherent physical inertia, resulting in low switching speeds and requiring additional stabilization time to eliminate positioning errors caused by vibration. Some related technologies utilize the diffraction effect of acoustic waves on laser light using acoustic deflectors (AODs). In these technologies, both galvanometers and AODs are configured in the laser processing equipment. By coordinating the control of beam deflection using the galvanometers and AODs, laser processing efficiency can be significantly improved. However, due to the relatively small scanning range of the AODs, the corresponding deflection size on the workpiece is also small. Therefore, this method is generally only applied to small-sized, regularly shaped graphics. "Small-sized" means the size of the graphic being processed falls within the scanning range of the AODs, and "regular shape" means the outer contour of the graphic is circular. However, in actual processing, it is often necessary to process large-sized, irregularly shaped graphics. Large size refers to the size of the processed graphic being outside the scanning range of the modulation deflector; irregular shape refers to the outer contour of the processed graphic being trapezoidal, parallelogram, or other non-circular shapes. In this case, the outer contour of the processed graphic that the modulation deflector needs to process within a single scanning range is often also irregular. How to control the modulation deflector to accurately process irregular processed graphics is one of the key factors affecting processing efficiency.

[0026] To illustrate the technical solution of this application, specific embodiments are described below.

[0027] Figure 1 A schematic diagram illustrating the implementation flow of a laser processing method provided in an embodiment of this application is shown. This method can be applied to a controller. The controller can be installed on a laser processing device.

[0028] Specifically, the above-mentioned laser processing method may include the following steps S101 to S103.

[0029] Step S101: Obtain the initial processing data of the modulation deflector in the laser processing equipment.

[0030] In the embodiments of this application, the workpiece to be processed is a workpiece that needs to be laser processed, including but not limited to circuit boards, sheet metal, mechanical parts, etc., wherein the circuit board refers to the packaging substrate used to carry and realize the interconnection of different chips and / or electronic components, including various PCB boards (Printed Circuit Boards) such as ordinary boards, multilayer boards, HDI, FPC, etc., and also includes IC carrier boards made of organic substrates, ceramic substrates, glass substrates, or other new substrates.

[0031] The initial processing data of the modulation deflector is based on the processing pattern obtained without the aforementioned distortion correction. The processing pattern includes irregularly shaped processing patterns within a single scan range of the modulation deflector.

[0032] Modulation deflectors are optical devices with beam manipulation capabilities. Common types include electro-optic deflectors, acousto-optic deflectors, and liquid crystal phased arrays. These devices can dynamically change the refractive index distribution of a transparent medium using physical effects such as electro-optic, acousto-optic, or liquid crystal birefringence, thereby deflecting the beam transmitted through the medium. They can also precisely control the phase of the beam using optical phased array technology, ultimately achieving beam deflection and scanning functions. For example, in one specific embodiment, the second beam deflection mechanism is specifically an acousto-optic deflector (AOD).

[0033] Step S102: The initial processing data of the modulation deflector is distorted to eliminate the deviation generated by the laser beam from entering the modulation deflector to acting on the workpiece to be processed, so as to obtain the distorted processing data.

[0034] In embodiments of this application, distortion correction may include at least one of machining coordinate correction and spot morphology correction. Specifically, distortion correction can correct errors introduced by the laser beam from its entry into the modulation deflector to its application to the workpiece. These errors can manifest as deviations between the geometric characteristics of the laser spot on the workpiece and the theoretical geometric characteristics of the laser spot. Geometric characteristics may include, but are not limited to, deviations in machining coordinates and spot morphology (such as spot size, shape, and energy density distribution). The aforementioned machining coordinate correction can correct offsets in the machining coordinates, while spot morphology correction can correct deviations in the spot morphology. By performing distortion correction on the initial machining data of the modulation deflector, corrected machining data can be obtained. The corrected machining data can be used to process irregularly shaped machining patterns within a single scanning range of the modulation deflector.

[0035] Step S103: Based on the corrected processing data, control the modulation deflector to perform laser processing on the workpiece to be processed.

[0036] Specifically, the corrected processing data is input into the controller, which can control the modulation deflector to perform laser processing on the workpiece, so that the laser spot acting on the workpiece after the modulation deflector can process irregular shapes.

[0037] It is understandable that when processing small, regularly shaped graphics (i.e., circles), a circumferential rotation method can be used. In this case, coordinate deviation has no significant impact on the actual processing effect. However, when processing irregularly shaped graphics, due to the asymmetry of the graphics, the laser processing path within the graphics is not completely symmetrical. A beam scanning path containing parallel line segments is typically used. Without distortion correction, the actual processing accuracy will decrease due to processing coordinate offset, and the quality will degrade due to spot shape deviation. This application, through distortion correction, can reduce processing coordinate offset and spot shape deviation, thereby obtaining a processed graphic with the required accuracy. Thus, a modulated deflector can be used for laser processing of the workpiece, eliminating the need for laser processing via galvanometer deflection.

[0038] In the embodiments of this application, the initial processing data of the modulation deflector used to control the laser processing equipment to process the workpiece is obtained. The initial processing data of the modulation deflector is then distorted to eliminate the deviation generated by the laser beam from entering the modulation deflector to acting on the workpiece, resulting in corrected processing data. Based on the corrected processing data, the modulation deflector is controlled to perform laser processing on the workpiece to process irregularly shaped processing patterns within a single scanning range of the modulation deflector. The distortion correction includes at least one of processing coordinate correction and spot shape correction, which can eliminate the processing coordinate offset and spot shape difference generated by the laser beam from entering the modulation deflector to acting on the workpiece. This enables the modulation deflector to accurately process irregular processing patterns within a single scanning range, improving processing efficiency compared to processing irregular processing patterns by galvanometer deflection.

[0039] In some embodiments of this application, obtaining the initial processing data of the modulation deflector in the laser processing equipment may include: obtaining the initial processing data of the laser processing equipment; and decomposing the initial processing data of the laser processing equipment into the galvanometer jump trajectory data and the initial processing data of the modulation deflector.

[0040] Specifically, the laser processing equipment can connect to a host computer, which can analyze the actual processing graphic data in real time. The initial processing data of the laser processing equipment is the processing data of the laser beam emitted by the laser, before the aforementioned distortion correction is performed, after passing through the optical path system consisting of a modulation deflector, galvanometer, and field lens, and exiting onto the workpiece. The actual processing graphic data can be decomposed into the jump trajectory data used to control the galvanometer and the initial processing data of the modulation deflector. Therefore, by separately controlling the galvanometer and modulation deflector, the actual processing path of the laser processing equipment can complete the processing of the graphic.

[0041] To ensure data reliability, before performing distortion correction on the initial processing data of the modulation deflector, the process may include verifying the data integrity of the initial processing data of the modulation deflector. This application does not impose restrictions on the method of data integrity verification; for example, it can be implemented using algorithms such as hash verification or data format verification.

[0042] Specifically, distortion correction includes correcting the distortion of the initial machining data of the modulation deflector during machining coordinate correction. This can include correcting the coordinate deviation between the actual machining coordinates and the target machining coordinates, where the coordinate deviation is caused by at least one of the following: the deviation between the actual distance and the theoretical distance between the two modulation deflectors, the deviation between the included angle and the theoretical included angle between the two modulation deflectors, and the installation angle deviation between the modulation deflector and the machining platform carrying the workpiece in the preset reference direction.

[0043] Specifically, laser processing equipment typically includes two modulation deflectors, responsible for deflecting the laser beam along the X and Y axes, respectively. These two deflectors must be installed according to a specified theoretical spacing and angle, and aligned with the processing platform supporting the workpiece in a preset reference direction to ensure processing accuracy. However, in actual laser processing equipment, the two deflectors often experience installation position deviations. This deviation causes the actual exit direction of the laser beam to deviate from the theoretical direction. Consequently, the actual processing coordinates of the laser focus on the working plane will deviate from the target processing coordinates throughout the processing range, directly compromising the absolute positioning accuracy of the entire laser processing equipment and affecting the geometric fidelity and feature position accuracy of the processed graphic.

[0044] The coordinate deviation caused by correcting the discrepancy between the actual and theoretical spacing of the two modulation deflectors can compensate for the linear distortion caused by the deviation between the actual and theoretical spacing of the two modulation deflectors. The coordinate deviation caused by correcting the discrepancy between the included angle and the theoretical angle between the two modulation deflectors can compensate for the nonlinear distortion caused by the discrepancy between the actual and theoretical angle (90°) between the two modulation deflectors. The coordinate deviation caused by correcting the installation angle deviation between the modulation deflectors and the machining platform in the preset reference direction can compensate for the nonlinear distortion caused by the installation angle deviation between the modulation deflector array and the machining platform in the preset reference direction. The preset reference direction can refer to the X-axis direction of the machining platform.

[0045] By correcting the coordinate deviation between the actual machining coordinates and the target machining coordinates, the actual machining coordinates can be made closer to the target machining coordinates, thereby making the machining coordinates of the modulated deflector more accurate.

[0046] Distortion correction includes the distortion correction of the initial processing data of the modulation deflector during spot shape correction. This can include: correcting the distortion of the initial processing data of the modulation deflector based on the focusing optical component area through which the laser beam emitted from the modulation deflector passes, to obtain the corrected processing data.

[0047] Specifically, after being deflected by the modulation deflector and galvanometer, the laser beam is guided by the focusing optics to form a laser spot on the workpiece. The focusing optics can be used to converge the incident parallel or divergent beam onto a focal plane, forming a clear, energy-concentrated spot. The focusing optics can include, but are not limited to, field lenses, telecentric lenses, and fiber-optic collimating focusing lenses. Different areas of the focusing optics will cause certain distortions in the beam transmission, resulting in distortions in the shape of the laser spot emitted onto the workpiece. The spot shape includes the shape of the spot and the energy density distribution of the spot. The larger the size of the pattern being processed, the wider the area covered by the laser beam is required, and the more significant the differences in the distortion of the laser spot shape at different positions become. Especially for large patterns covering the processing range of multiple modulation deflectors, within the scanning range of a single modulation deflector, the galvanometer remains stationary, and the laser spot is deflected between different processing points solely by the modulation deflector. This will cause the laser beam to pass through different areas of the focusing optics, thus inducing significant distortion.

[0048] Therefore, based on the distortion characteristics of the focusing optical component in different focusing optical component regions, the initial processing data of the modulation deflector can be distorted according to the focusing optical component region through which the laser beam emitted from the modulation deflector passes, so that the actual spot shape of the laser spot is close to the target spot shape, and the distorted processing data is obtained.

[0049] Specifically, based on the area of ​​the focusing optical component through which the laser beam emitted from the modulation deflector passes, the initial processing data of the modulation deflector is distorted to obtain the distorted processing data. This process may include: obtaining a focusing optical component calibration table; determining the current calibration parameters based on the focusing optical component calibration table and the current processing point corresponding to the initial processing data of the modulation deflector; and performing distortion correction on the initial processing data of the modulation deflector based on the current calibration parameters to obtain the distorted processing data.

[0050] Specifically, the correction parameters and deflection positions exhibit a non-linear mapping relationship. The focusing optics calibration table records the correction parameters corresponding to different processing points in the scene where the output beam from the modulated deflector is incident, which can be obtained through prior testing. Based on the focusing optics calibration table, the rotational and scaling distortions caused by the focusing optics at different deflection positions of the modulated deflector can be dynamically compensated, thereby ensuring precise processing spot shape and improving processing accuracy.

[0051] After obtaining the corrected processing data through distortion correction, the modulation deflector can be controlled to perform laser processing on the workpiece to be processed.

[0052] Specifically, controlling the modulation deflector to perform laser processing on the workpiece based on the corrected processing data can include: determining the target frequency and initial amplitude based on the corrected processing data; determining the diffraction efficiency corresponding to the target frequency, and adjusting the amplitude according to the diffraction efficiency to obtain the target amplitude; generating an radio frequency drive signal based on the target frequency and target amplitude; and inputting the radio frequency drive signal into the modulation deflector to control the modulation deflector to perform laser processing on the workpiece.

[0053] Specifically, based on the machining coordinates in the calibrated machining data, the controller can query the pre-calibrated coordinate-frequency lookup table to obtain the corresponding target frequency, and at the same time, obtain the basic drive amplitude as the initial amplitude.

[0054] Since the acousto-optic diffraction angles corresponding to different RF signal frequencies at the same RF signal amplitude exhibit varying diffraction efficiencies, dynamic amplitude modulation of the output RF drive signal based on a pre-stored diffraction efficiency-frequency characteristic curve can compensate for the diffraction efficiency differences caused by these angle variations. Specifically, the diffraction efficiency can be determined based on the target frequency, and the initial amplitude can be adjusted to obtain the target amplitude, thus stabilizing the laser energy across different scanning positions.

[0055] In some embodiments of this application, after generating the radio frequency drive signal, the method may further include: acquiring a laser synchronization signal; and adjusting the phase of the radio frequency drive signal based on the laser synchronization signal.

[0056] Among them, the laser synchronization signal is a synchronization signal provided by the laser, which is used to establish a synchronization link between the modulation deflector control and the laser output.

[0057] By inputting the radio frequency drive signal into the modulation deflector, the deflection angle of the modulation deflector can be proportional to the target frequency of the radio frequency drive signal, and the intensity of the diffracted beam after passing through the modulation deflector can be proportional to the signal intensity of the radio frequency drive signal, thereby enabling the laser beam to perform laser processing on the surface of the workpiece.

[0058] In some embodiments of this application, while controlling the modulation deflector to perform laser processing on the workpiece based on the corrected processing data, the method may also include: controlling the galvanometer adjustment based on the jump trajectory data, so that the incident position of the laser beam on the workpiece jumps between areas of different processed patterns. During the period when the galvanometer controls the incident position jump of the laser beam, the laser is simultaneously controlled to not emit light, so that the controller, galvanometer, and modulation deflector can work synchronously to work precisely on the workpiece.

[0059] It should be noted that the corrected machining data can be used to process irregularly shaped machining patterns within a single scan range of the modulation deflector.

[0060] In some implementations, the irregularly shaped processed pattern is the original processed pattern with a size less than or equal to a size threshold, i.e., a small-sized original processed pattern. In this case, based on the corrected processing data, the modulation deflector is controlled to perform laser processing on the workpiece to be processed, and a small-sized, irregularly shaped original processed pattern can be obtained within a single scanning range.

[0061] In other embodiments, the irregularly shaped processed pattern is a sub-processed pattern obtained by decomposing the original processed pattern whose size is larger than a size threshold. For example, a large-sized pattern can be divided into multiple sub-processed patterns smaller than the scanning range of the modulation deflector. In this case, based on the corrected processing data, the modulation deflector is controlled to perform laser processing on the workpiece to be processed. Small-sized, irregularly shaped sub-processed patterns can be processed within a single scanning range. The processing results of multiple scanning ranges can be superimposed to form a large-sized original processed pattern.

[0062] As mentioned earlier, when machining irregularly shaped graphics, the laser machining path within the graphics is not perfectly symmetrical due to the asymmetry of the graphics. Typically, a beam scanning path containing parallel line segments is used. Without distortion correction, the actual machining coordinate offset between the actual and theoretical values ​​leads to a decrease in actual machining accuracy, and the deviation in spot shape between the actual and theoretical values ​​results in a decrease in quality. This application reduces machining coordinate offset and spot shape deviation through distortion correction, thereby obtaining a machining graphic with the required accuracy.

[0063] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because based on this application, some steps can be performed in other orders.

[0064] like Figure 2 The diagram shown is a schematic of a controller provided in an embodiment of this application. Specifically, the controller 40 may include: a processor 400, a memory 401, and a computer program 402 stored in the memory 401 and executable on the processor 400, such as a laser processing program. When the processor 400 executes the computer program 402, it implements the steps in the various laser processing method embodiments described above, for example... Figure 1 Steps S101 to S103 are shown.

[0065] The computer program can be divided into one or more modules / units, which are stored in the memory 401 and executed by the processor 400 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0066] The controller may include, but is not limited to, a processor 400 and a memory 401. Those skilled in the art will understand that... Figure 2 This is merely an example of a controller and does not constitute a limitation on the controller. It may include more or fewer components than illustrated, or combine certain components, or different components. For example, the controller may also include input / output devices, network access devices, buses, etc.

[0067] The processor 400 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0068] The memory 401 can be an internal storage unit of the controller, such as the controller's hard drive or memory. The memory 401 can also be an external storage device of the controller, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or FlashCard. Furthermore, the memory 401 can include both internal and external storage units of the controller. The memory 401 is used to store the computer program and other programs and data required by the controller. The memory 401 can also be used to temporarily store data that has been output or will be output.

[0069] It should be noted that, for the sake of convenience and brevity, the structure of the controller described above can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.

[0070] Specifically, Figure 3 This application illustrates a laser processing apparatus, comprising: Laser 10 is used to emit a laser beam; A beam control system 20, comprising a galvanometer 201 and a modulation deflector 202, is used to transmit, control, and deflect a laser beam. The processing platform 30 is used to support the workpiece to be processed; Controller 40 is used to control the coordinated operation of the laser 10, beam control system 20, and processing platform 30 to achieve the following: Figures 1 to 2 The laser processing method described above.

[0071] In some embodiments of this application, the laser 10 may be a solid-state laser (e.g., nanosecond laser, picosecond laser, femtosecond laser, etc.), a gas laser (e.g., a CO2 laser), or other types of lasers, and this application does not impose any limitations on this. A laser 10 capable of providing suitable laser pulse wavelength and pulse frequency parameters can be selected according to processing requirements. The power, spot size, and number of pulses of the laser beam emitted by the laser 10 can all be set according to processing requirements.

[0072] In some embodiments of this application, the galvanometer 201 can precisely control the spatial direction of the laser beam by deflecting the high-speed reflective mirror, thereby achieving rapid positioning of the laser focus on the processing plane and scanning of complex trajectories.

[0073] In some embodiments of this application, the modulation deflector 202 is an optical device with beam control function. Common types include electro-optic deflectors, acousto-optic deflectors, and liquid crystal phased arrays. These devices can dynamically change the refractive index distribution of a transparent medium by utilizing physical effects such as electro-optic, acousto-optic, or liquid crystal birefringence, thereby deflecting the beam transmitted through the medium. They can also precisely control the phase of the beam using optical phased array technology, ultimately achieving beam deflection and scanning functions. For example, in one specific embodiment, the second beam deflection mechanism is specifically an acousto-optic deflector. The beam control system 20 described above can have two modulation deflectors 202, which can be set at a 90° angle to each other for offset in the X-axis and Y-axis directions, respectively.

[0074] In some embodiments of this application, the beam control system 20, in addition to the galvanometer 201 and the modulation deflector 202, may also include, but is not limited to, a beam shaper (e.g., an aperture, a beam expander or beam shrinker, a shaping component that converts the intensity distribution of the laser beam from a Gaussian distribution to the desired shape), and a focusing optical component. The beam shaper can be used to shape the laser beam to control the spot size and energy density distribution. The focusing optical component can be used to control the focal length, thereby affecting the energy density distribution of the laser spot formed at the processing position of the workpiece. The focusing optical component may include, but is not limited to, a field lens, a telecentric lens, and a fiber optic output collimating focusing lens. The various devices within the beam control system 20 cooperate with each other to transmit, control, and deflect the laser beam, forming a spot with specific laser parameters to process the signal transmission substrate. The modulation deflector 202 can be disposed between the laser 10 and the galvanometer 201, and the galvanometer 201 can be disposed between the modulation deflector 202 and the focusing optical component to achieve continuous deflection of the beam.

[0075] In some embodiments of this application, such as Figure 4 As shown, the controller 40 may include a first control card 4001 and a second control card 4002.

[0076] The first control card 4001 can be used to control the galvanometer 201. The second control card 4002 can be used to control the modulation deflector 202.

[0077] Specifically, the first control card 4001 can connect to the host computer, receive the galvanometer jump trajectory data transmitted by the host computer, and drive the galvanometer motor through real-time trajectory planning, dynamic delay compensation and closed-loop feedback control to achieve high-speed and precise positioning of the laser focus, and keep synchronized with the laser to ensure the stability and consistency of the processing process.

[0078] The second control card 4002 includes a first processor and a second processor. The first processor is connected to a host computer and is used to receive the initial processing data of the modulation deflector transmitted by the host computer, and to perform integrity verification and distortion correction on the initial processing data of the modulation deflector to obtain corrected processing data. The first processor and the second processor can be connected via a high-speed AXI interface. The second processor can receive the corrected processing data sent by the first processor, store it, and generate an RF drive signal, which is then sent to the modulation deflector 202 to control the modulation deflector 202 to deflect. This application does not limit the type of processor; for example, the first processor can be an ARM processor, and the second processor can be an FPGA processor. The second processor is also connected to the first control card 4001 and the laser 10 to perform synchronous control of the galvanometer 201, the modulation deflector 202, and the laser 10.

[0079] This application embodiment also provides a circuit board, which is based on... Figure 1 The described laser processing method or such Figure 3 The product obtained from the laser processing equipment.

[0080] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0081] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0082] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.

[0083] In the embodiments provided in this application, it should be understood that the disclosed devices / controllers / systems and methods can be implemented in other ways. For example, the device / controller / system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0084] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected based on actual needs to achieve the purpose of this embodiment.

[0085] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0086] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed based on the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0087] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser processing method characterized by, The method comprises: acquiring initial processing data of a modulation deflector in a laser processing device; performing distortion correction on the initial processing data of the modulation deflector to eliminate deviations generated in the process of a laser beam from entering the modulation deflector to acting on a workpiece to be processed, to obtain corrected processing data, wherein the distortion correction comprises at least one of processing coordinate correction and spot shape correction, and the corrected processing data is used to process an irregularly shaped processing pattern in a single scanning range of the modulation deflector; controlling the modulation deflector to perform laser processing on the workpiece to be processed based on the corrected processing data.

2. The laser processing method according to claim 1, wherein The number of modulation deflectors is two; when the distortion correction comprises processing coordinate correction, the distortion correction on the initial processing data of the modulation deflector comprises: correcting the coordinate deviation between the actual processing coordinates and the target processing coordinates to correct the coordinate deviation caused by at least one of the following: deviation of the actual distance between the two modulation deflectors from the theoretical distance, deviation of the included angle between the two modulation deflectors from the theoretical included angle, and deviation of the installation angle between the modulation deflector and the processing platform carrying the workpiece to be processed in the preset reference direction.

3. The laser processing method according to claim 1, wherein When the distortion correction comprises spot shape correction, the distortion correction on the initial processing data of the modulation deflector comprises: performing distortion correction on the initial processing data of the modulation deflector according to the region of the focusing optical assembly through which the laser beam emitted by the modulation deflector passes, to obtain the corrected processing data.

4. The laser processing method according to claim 3, wherein The distortion correction on the initial processing data of the modulation deflector according to the region of the focusing optical assembly through which the laser beam emitted by the modulation deflector passes, to obtain the corrected processing data, comprises: acquiring a focusing optical assembly correction table, which records correction parameters corresponding to different processing point positions in a scene where the laser beam emitted by the modulation deflector is incident; determining a current correction parameter based on the focusing optical assembly correction table and the current processing point position in the scene where the laser beam emitted by the modulation deflector is incident; performing distortion correction on the initial processing data of the modulation deflector based on the current correction parameter, to obtain the corrected processing data.

5. The laser processing method according to any one of claims 1 to 4, wherein The control of the modulation deflector to perform laser processing on the workpiece to be processed based on the corrected processing data comprises: determining a target frequency and an initial amplitude of an initial radio frequency driving signal of the modulation deflector based on the corrected processing data; determining a diffraction efficiency corresponding to the target frequency, to adjust the amplitude according to the diffraction efficiency to obtain a target amplitude; generating the radio frequency driving signal based on the target frequency and the target amplitude; inputting the radio frequency driving signal into the modulation deflector to control the modulation deflector to perform laser processing on the workpiece to be processed.

6. The laser processing method according to claim 5, wherein After the generation of the radio frequency driving signal, the method further comprises: acquiring a laser synchronizing signal; adjusting the phase of the radio frequency driving signal based on the laser synchronizing signal.

7. The laser processing method according to any one of claims 1 to 4, wherein The irregular-shaped machining graph is a primary machining graph with a size less than or equal to a size threshold value, or a sub-machining graph obtained by disassembling a primary machining graph with a size greater than the size threshold value.

8. The laser processing method according to any one of claims 1 to 4, wherein The initial machining data of the modulation deflector in the laser machining device is acquired, including: The initial machining data of the laser machining device is acquired; The initial machining data of the laser machining device is decomposed into the jump trajectory data of the galvanometer and the initial machining data of the modulation deflector.

9. The laser processing method according to claim 8, wherein Based on the corrected machining data, the modulation deflector is controlled to perform laser machining on the workpiece to be machined, and the method further includes: Based on the jump trajectory data, the galvanometer is controlled to adjust, so that the incident position of the laser beam on the workpiece to be machined jumps between the regions of different machining graphs; During the period that the galvanometer controls the incident position of the laser beam to jump, the laser is synchronously controlled to not emit light.

10. A controller comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor executes the computer program to realize the steps of the laser machining method according to any one of claims 1 to 9.

11. A laser processing apparatus characterized by comprising: It includes: A laser for emitting a laser beam; A beam control system, the beam control system including a galvanometer and a modulation deflector, the beam control system being used for transmitting, controlling and deflecting the laser beam; A machining platform for carrying a workpiece to be machined; A controller for controlling the above-mentioned laser, the beam control system and the machining platform to work cooperatively to realize the laser machining method according to any one of claims 1 to 9.

12. A wiring board, characterized by The circuit board is machined according to the laser machining method of any one of claims 1 to 9 or based on the laser machining device of claim 11. The circuit board is machined according to the laser machining method of any one of claims 1 to 9 or based on the laser machining device of claim 11.

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