High-temperature-resistant and high-modulus adhesive and preparation method thereof

By optimizing the monomer composition, crosslinking system, and preparation process of modified fillers, the problem of acrylate pressure-sensitive adhesives being unable to simultaneously achieve high temperature resistance and high modulus under high temperature conditions was solved, thus improving the mechanical stability and adhesive performance of the adhesives at high temperatures.

CN121673989APending Publication Date: 2026-03-17JIANGXI TA YI LAI POLYMER MATERIAL CO LTD
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Patent Information

Application Number
CN202511786320.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-01
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

Existing acrylic pressure-sensitive adhesives struggle to balance high temperature resistance, high modulus, and good adhesion performance in high-temperature environments. Furthermore, the poor compatibility between inorganic fillers and organic resin matrices leads to a decrease in bond strength and flexibility.

Method used

By rationally selecting monomer composition, crosslinking system, and modified filler, and optimizing preparation process parameters, a high-density and moderately tough crosslinked network is formed by using functional monomers composed of N-methoxymethylacrylamide, acrylic acid, and 2-acrylic acid-hexahydro-4,7-methylene-1H-indenyl ester, and a crosslinking agent composed of N,N'-methylenebisacrylamide and 1,1,3,3-tetramethyl-1,3-divinyldisilazane, combined with modified nano-silica filler and segmented initiation polymerization process.

Benefits of technology

This technology enables adhesives to maintain excellent mechanical stability and high modulus at high temperatures, improves the interfacial compatibility between inorganic fillers and organic monomers, enhances bonding strength and thermal conductivity, and ensures the stability and consistency of product performance.

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Abstract

The invention discloses a high-temperature-resistant and high-modulus adhesive and a preparation method thereof, and relates to the technical field of adhesives. The water-based adhesive comprises the following raw materials: 40-60 parts of a soft monomer, 20-30 parts of a hard monomer, 5-10 parts of a functional monomer, 1-3 parts of a cross-linking agent, 0.5-1.5 parts of an initiator, 2-5 parts of a modified nano filler and 30-50 parts of a solvent, the functional monomer is prepared by compounding N-methoxy methyl acrylamide, acrylic acid and 2-acrylic acid-hexahydro-4, 7-methylene-1H-indenyl ester according to a mass ratio of 2 to 1 to (1 to 1.5); the cross-linking agent is prepared by compounding N, N '-methylene bisacrylamide and 1, 1, 3, 3-tetramethyl-1, 3-divinyl disilazane according to a mass ratio of 1: (0.5 to 1). The adhesive has the advantages of favorable adhesive property, favorable high-temperature resistance and high modulus.
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