A radio frequency neutralizer and semiconductor processing apparatus

Abstract

The application discloses a radio frequency neutralizer and a semiconductor processing device, the radio frequency neutralizer is arranged outside a vacuum chamber, and the radio frequency neutralizer comprises a vacuum quartz cavity which is internally free of exposed metal structures; the vacuum quartz cavity comprises a gas inlet pipe and a transmission hole; a radio frequency coil is used for receiving radio frequency energy to ionize process gas in the vacuum quartz cavity; a graphite electrode structure is located in the vacuum quartz cavity, and the graphite electrode structure is used for pushing out electrons in the vacuum quartz cavity from the transmission hole; a metal flange is located on one side of the vacuum quartz cavity and detachably connected with the vacuum quartz cavity; and a graphite isolation structure is used for isolating the electrons emitted from the vacuum quartz cavity from the metal flange and also used for leading out the electrons in the vacuum quartz cavity. The radio frequency neutralizer can be arranged outside the vacuum chamber, liquid cooling medium can be conveniently supplied to the radio frequency coil, the heat dissipation efficiency of the radio frequency neutralizer is improved, metal ions carried by the electrons generated by the radio frequency neutralizer can be avoided, and the purity of the electrons is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a radio frequency neutralizer and semiconductor processing equipment. Background Technology

[0002] Radio frequency (RF) neutralizers ionize process gases using radio frequency (RF) and then separate electrons using an electric field. These separated electrons neutralize positively charged ions to produce uncharged ions, which are then used for etching or coating. During long-term operation, the RF neutralizer gradually generates heat, affecting its normal operation and lifespan.

[0003] Existing radio frequency (RF) neutralizers are typically housed inside a vacuum chamber. The confined space and numerous wiring within the vacuum chamber make it difficult to implement water-cooling circuitry. Currently, natural cooling is the primary method, where the RF neutralizer operates for a period, then is paused for a short time to allow it to cool down to a certain level before resuming operation. This cooling method significantly reduces the RF neutralizer's efficiency, impacting production efficiency.

[0004] In addition, current radio frequency neutralizers carry some unwanted metal ions while extracting electrons, which affects the purity of the electrons generated by the radio frequency neutralizer and reduces the yield of semiconductor products. Summary of the Invention

[0005] This invention provides a radio frequency neutralizer and a semiconductor processing device. The radio frequency neutralizer can be placed outside the vacuum chamber, which facilitates the introduction of liquid cooling medium into the radio frequency coil, improves the heat dissipation efficiency of the radio frequency neutralizer, and also avoids the electrons generated by the radio frequency neutralizer from carrying metal ions, thus ensuring the purity of the electrons.

[0006] According to one aspect of the present invention, a radio frequency neutralizer is provided, the radio frequency neutralizer being disposed outside a vacuum chamber, the radio frequency neutralizer comprising:

[0007] A vacuum quartz cavity with no exposed metal structure inside; the vacuum quartz cavity includes an inlet and an outlet; the inlet is used to receive process gases, and the outlet is used to emit electrons;

[0008] A radio frequency coil is wound around the outer wall of the vacuum quartz cavity. The radio frequency coil has a hollow structure and is used to receive the liquid cooling medium. The radio frequency coil is also used to receive radio frequency energy to ionize the process gas in the vacuum quartz cavity.

[0009] A graphite electrode structure is located inside the vacuum quartz cavity, and the graphite electrode structure is used to push electrons from the vacuum quartz cavity out of the emission hole;

[0010] A metal flange is located on one side of the vacuum quartz cavity and is detachably connected to the vacuum quartz cavity;

[0011] A graphite isolation structure is located on the side of the metal flange away from the vacuum quartz cavity and is detachably connected to the metal flange. The graphite isolation structure is used to isolate electrons emitted from the vacuum quartz cavity from the metal flange and to draw electrons out of the vacuum quartz cavity.

[0012] Optionally, the vacuum quartz cavity includes a quartz body, a quartz edge, a quartz gas delivery tube, and a quartz cover plate; wherein the emission hole is located on the quartz cover plate;

[0013] The edge of the quartz is detachably connected to the metal flange and is also integrally connected to the top edge of the quartz body;

[0014] The quartz gas supply pipe is integrally connected to the bottom of the quartz body, and the opening of the quartz gas supply pipe away from the bottom of the quartz body is the air inlet.

[0015] The quartz cover plate is seamlessly attached to the quartz body.

[0016] Optionally, the graphite isolation structure includes a graphite hollow frustum and a graphite edge;

[0017] The hollow graphite frustum is integrally connected to the graphite edge;

[0018] The graphite edge is located on the side of the metal flange away from the quartz edge and is detachably connected to the metal flange;

[0019] The diameter of the graphite hollow frustum gradually increases along the direction from the bottom to the top of the quartz body.

[0020] The graphite hollow frustum is in contact with the surface of the quartz cover plate away from the quartz body.

[0021] Optionally, the vacuum quartz cavity may further include a hollow quartz column integrally connected to the quartz cover plate;

[0022] The hollow quartz column is located on the side of the quartz cover plate away from the quartz body;

[0023] The vertical projection of the hollow quartz column on the quartz cover plate completely surrounds the emission hole;

[0024] The hollow graphite frustum is attached to the hollow quartz column.

[0025] Optionally, the graphite electrode structure includes a graphite cavity body and a graphite conductive electrode;

[0026] The graphite cavity body is located on the inner wall side of the vacuum quartz cavity;

[0027] The sidewall of the graphite cavity body includes multiple spaced longitudinal openings;

[0028] The graphite conductive electrode is electrically connected to the graphite cavity body and is also used to fix the graphite cavity body to the bottom of the quartz body.

[0029] Optionally, the radio frequency neutralizer provided in this embodiment also includes an ignition module;

[0030] The ignition module includes a metal ignition electrode and a graphite ignition electrode;

[0031] The metal ignition electrode extends from the outside of the quartz body to the inside of the quartz body, and the graphite ignition electrode is located inside the quartz body and completely encloses the metal ignition electrode located inside the quartz body.

[0032] Optionally, the radio frequency neutralizer provided in this embodiment further includes a power module; the power module includes a first power supply, a second power supply, a third power supply, and a fourth power supply;

[0033] The first power supply is electrically connected to the radio frequency coil and is used to provide radio frequency energy to the radio frequency coil so that the radio frequency coil ionizes the process gas in the vacuum quartz cavity to generate plasma;

[0034] The second power source is used to supply power to the graphite conductive electrode so that the graphite cavity body ejects electrons from the vacuum quartz cavity through the emission port;

[0035] The third power source is used to supply power to the ignition module;

[0036] The fourth power source is used to supply power to the graphite isolation structure.

[0037] Optionally, the radio frequency neutralizer provided in this embodiment further includes an impedance matching device; the impedance matching device is electrically connected between the first power supply and the radio frequency coil.

[0038] Optionally, the radio frequency neutralizer provided in this embodiment further includes a metal shield; the metal shield is located outside the radio frequency coil away from the vacuum quartz cavity;

[0039] The metal shielding cover is detachably connected to the metal flange;

[0040] The first end of the radio frequency coil passes through the metal shield to receive the cooling medium.

[0041] According to another aspect of the present invention, a semiconductor processing apparatus is provided, the semiconductor processing apparatus including the radio frequency neutralizer provided in any embodiment of the present invention.

[0042] This invention provides a radio frequency (RF) neutralizer. The vacuum quartz cavity of the RF neutralizer is a vacuum chamber. This design ensures that even when the RF neutralizer is placed outside the vacuum chamber, the process gas can still be ionized by the RF coil to generate plasma containing electrons and positive ions. This invention also includes a graphite electrode structure inside the vacuum quartz cavity to eject electrons from the emission port. A graphite isolation structure is placed outside the vacuum quartz cavity to guide the electrons out. The graphite isolation structure further isolates the electrons from contact with the metal flange in the RF neutralizer, ensuring electron purity and preventing metal ion doping. The RF coil is a hollow structure, allowing it to receive liquid cooling medium and improving the heat dissipation efficiency of the RF neutralizer. The metal flange allows for detachable connection between the vacuum quartz cavity and the graphite isolation structure, securing the RF neutralizer outside the vacuum chamber. In summary, the radio frequency neutralizer provided in this embodiment of the invention can be placed outside the vacuum chamber, which facilitates the introduction of liquid cooling medium into the radio frequency coil, improves the heat dissipation efficiency of the radio frequency neutralizer, and also prevents the electrons generated by the radio frequency neutralizer from carrying metal ions, thus ensuring the purity of the electrons.

[0043] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic cross-sectional view of a radio frequency neutralizer according to an embodiment of the present invention;

[0046] Figure 2 This is a schematic cross-sectional view of a vacuum quartz cavity and a graphite electrode structure connected according to an embodiment of the present invention.

[0047] Figure 3 This is a schematic diagram of a vacuum quartz cavity according to an embodiment of the present invention;

[0048] Figure 4 This is a top view schematic diagram of a vacuum quartz cavity according to an embodiment of the present invention;

[0049] Figure 5 This is a schematic diagram of a graphite isolation structure provided in an embodiment of the present invention;

[0050] Figure 6 This is a cross-sectional structural schematic diagram of another radio frequency neutralizer provided according to an embodiment of the present invention;

[0051] Figure 7 This is a schematic diagram of the structure of a graphite cavity body provided according to an embodiment of the present invention. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] Existing radio frequency (RF) neutralizers are generally housed inside a vacuum chamber and cannot be cooled by external liquid cooling media. Furthermore, because the vacuum chamber is a vacuum, the sealing of the plasma-generating chamber in existing RF neutralizers is not strictly required (poor sealing will result in the plasma-generating chamber remaining a vacuum). This embodiment provides an RF neutralizer that can be placed outside a vacuum chamber. The vacuum quartz cavity in the RF neutralizer that generates plasma has good sealing, the cavity interior is a vacuum, and the RF coils and other components outside the cavity can operate at standard atmospheric pressure.

[0055] Figure 1This is a schematic cross-sectional view of a radio frequency neutralizer according to an embodiment of the present invention. Figure 1 The graphite electrode structure is not shown. Figure 2 This is a schematic cross-sectional view of a vacuum quartz cavity and a graphite electrode structure connected according to an embodiment of the present invention. (Refer to...) Figure 1 and Figure 2 The radio frequency neutralizer provided in this embodiment includes: a vacuum quartz cavity 110, a radio frequency coil 120, a graphite electrode structure 130, a metal flange 140, and a graphite isolation structure 150; the vacuum quartz cavity 110 has no exposed metal structure inside; the vacuum quartz cavity 110 includes an inlet 101 and an emission port 102; the inlet 101 is used to receive process gas, and the emission port 102 is used to emit electrons; the radio frequency coil 120 is wound around the outer wall of the vacuum quartz cavity 110, and the radio frequency coil 120 has a hollow structure for receiving liquid cooling medium, and the radio frequency coil 120 is also used to receive radio frequency energy to ionize the vacuum quartz cavity 110. The process gas inside the vacuum quartz cavity 110; the graphite electrode structure 130 is located inside the vacuum quartz cavity 110, and the graphite electrode structure 130 is used to push electrons from the vacuum quartz cavity 110 out through the emission hole 102; the metal flange 140 is located on one side of the vacuum quartz cavity 110 and is detachably connected to the vacuum quartz cavity 110; the graphite isolation structure 150 is located on the side of the metal flange 140 away from the vacuum quartz cavity 110 and is detachably connected to the metal flange 140, and the graphite isolation structure 150 is used to isolate the electrons emitted from the vacuum quartz cavity 110 from the metal flange 140, and is also used to draw out electrons from the vacuum quartz cavity 110.

[0056] Specifically, the vacuum quartz cavity 110 is made of quartz, whose main component is silicon dioxide. Compared to ceramic cavities, the vacuum quartz cavity 110 does not produce metal ions. The graphite electrode structure 130 and the graphite isolation structure 150 are both made of graphite. Since there is no exposed metal inside the vacuum quartz cavity 110, and the graphite isolation structure 150 prevents electrons emitted from the emission port 102 from contacting the metal flange 140, the electrons generated by the radio frequency neutralizer provided in this embodiment do not carry metal ions. Furthermore, even if electrons emitted from the radio frequency neutralizer carry other ions, they are silicon and carbon-related ions, not metal ions. Therefore, the radio frequency neutralizer provided in this embodiment can be applied to the manufacture of silicon carbide products. The diameter of the inlet port 101 and the diameter of the emission port 102 can both be less than or equal to 2 mm. For example, the diameter of the emission port 102 is equal to 1 mm, and the diameter of the inlet port 101 is equal to 1 mm.

[0057] The vacuum quartz cavity 110 provided in this embodiment is a vacuum. Except for necessary through holes, no other through holes are provided in the vacuum quartz cavity 110, thus ensuring that the interior of the vacuum quartz cavity 110 is a vacuum. Because the vacuum quartz cavity 110 is a vacuum, the radio frequency energy generated by the radio frequency coil 120 coupled into the vacuum quartz cavity 110 can ionize the process gas to generate plasma. The working gas inside the vacuum quartz cavity 110 can be an inert gas; for example, the process gas can be argon or helium. The radio frequency neutralizer provided in this embodiment has a vacuum quartz cavity 110 inside, ensuring that plasma is generated inside the vacuum quartz cavity 110 even if the radio frequency neutralizer is placed outside the vacuum chamber.

[0058] Since this embodiment can be placed outside the vacuum chamber, there is no need to consider the complex wiring inside the vacuum chamber when setting up the cooling circuit. In this embodiment, the RF coil 120 is configured as a hollow structure, allowing liquid cooling medium to be introduced into the hollow structure of the RF coil 120, thereby reducing the temperature of the RF neutralizer. Cooling can be achieved without stopping the RF neutralizer; liquid cooling medium can be introduced into the RF coil 120 while the RF neutralizer is operating. The liquid cooling medium can be water.

[0059] Continue to refer to Figure 1 The vacuum quartz cavity 110 may include multiple first threaded through holes 103, and the metal flange 140 may include multiple second threaded through holes 141. Screws can pass through the first threaded through holes 103 and the second threaded through holes 141 to detachably connect the vacuum quartz cavity 110 and the metal flange 140. In this embodiment, the metal flange 140 is made of metal, which facilitates the connection of the metal flange 140 to external devices. The metal flange 140 can be fixed to the outside of the vacuum chamber, thereby fixing the entire radio frequency neutralizer to the outside of the vacuum chamber.

[0060] Graphite is conductive. When the graphite electrode structure 130 is connected to a negative voltage, electrons inside the vacuum quartz cavity 110 can be pushed out of the vacuum quartz cavity 110. When the graphite isolation structure 150 is connected to a positive voltage, electrons inside the vacuum quartz cavity 110 can be extracted more effectively.

[0061] In this embodiment, the graphite isolation structure 150 can cover the area that may come into contact with the metal flange 140 during the electron emission process. The graphite isolation structure 150 can prevent the electrons emitted from the emission hole 102 from contacting the metal flange 140, thereby further preventing the electrons from carrying metal ions and ensuring the purity of the electrons emitted by the radio frequency neutralizer.

[0062] Continue to refer to Figure 1The graphite isolation structure 150 provided in this embodiment includes a plurality of third threaded through holes 151, and the metal flange 140 includes a plurality of fourth threaded through holes 142. The third threaded through holes 151 and the fourth threaded through holes 142 are arranged opposite to each other, and screws can be passed through the third threaded through holes 151 and the fourth threaded through holes 142 to detachably connect the graphite isolation structure 150 and the metal flange 140.

[0063] In this embodiment, a first groove can be provided on the surface of the metal flange 140 that contacts the vacuum quartz cavity 110, and a first sealing ring 161 can be provided in the first groove. A second groove can also be provided on the surface of the metal flange 140 away from the vacuum quartz cavity 110, and a second sealing ring 162 can be provided in the second groove. The provision of the first sealing ring 161 and the second sealing ring 162 can further ensure the sealing performance of the vacuum quartz cavity 110, thereby ensuring that the cavity of the vacuum quartz cavity 110 is always in a vacuum state.

[0064] This embodiment provides a radio frequency (RF) neutralizer. The vacuum quartz cavity of the RF neutralizer is a vacuum, ensuring that even when the RF neutralizer is placed outside the vacuum chamber, the process gas is ionized by the RF coil to generate plasma containing electrons and positive ions. This embodiment also incorporates a graphite electrode structure inside the vacuum quartz cavity to eject electrons from the emission port. A graphite isolation structure is placed outside the vacuum quartz cavity to guide the electrons out. The graphite isolation structure further isolates the electrons from contact with the metal flange in the RF neutralizer, ensuring electron purity and preventing metal ion doping. The RF coil is a hollow structure, allowing it to receive liquid cooling medium and improving the heat dissipation efficiency of the RF neutralizer. The metal flange allows for detachable connection between the vacuum quartz cavity and the graphite isolation structure, securing the RF neutralizer outside the vacuum chamber. In summary, the radio frequency neutralizer provided in this embodiment can be placed outside the vacuum chamber, which facilitates the introduction of liquid cooling medium into the radio frequency coil, improves the heat dissipation efficiency of the radio frequency neutralizer, and also prevents the electrons generated by the radio frequency neutralizer from carrying metal ions, thus ensuring the purity of the electrons.

[0065] Optional, Figure 3 This is a schematic diagram of a vacuum quartz cavity according to an embodiment of the present invention. Figure 4 This is a top view schematic diagram of a vacuum quartz cavity according to an embodiment of the present invention. (Continuing to refer to...) Figures 1-4 The vacuum quartz cavity 110 includes a quartz body 111, a quartz edge 112, a quartz gas delivery tube 113, and a quartz cover plate 114; wherein, the emission port 102 is located on the quartz cover plate 114 (see reference). Figure 4The quartz edge 112 is detachably connected to the metal flange 140 and is also integrally connected to the top edge of the quartz body 111; the quartz gas pipe 113 is integrally connected to the bottom of the quartz body 111, and the port of the quartz gas pipe 113 away from the bottom of the quartz body 111 is the air inlet 101; the quartz cover plate 114 is seamlessly overlapped inside the quartz body 111.

[0066] Specifically, the quartz body 111, quartz edge 112, quartz gas delivery pipe 113, and quartz cover plate 114 are all made of quartz, and the quartz body 111, quartz edge 112, and quartz gas delivery pipe 113 are integrally connected. In this embodiment, the quartz gas delivery pipe may not extend into the interior of the quartz body 111.

[0067] Multiple first threaded through holes 103 are located on the quartz edge 112. The vacuum quartz cavity 110 is detachably connected to the metal flange 140 via the quartz edge 112. The vertical projection of the quartz edge 112 onto the quartz body 111 completely surrounds the quartz body 111. The quartz cover plate 114 overlaps inside the quartz body 111 without gaps, thus ensuring a vacuum state inside the vacuum quartz cavity 110. The surface of the quartz cover plate 114 away from the quartz body 111 can be on the same plane as the surface of the quartz edge 112 away from the quartz body 111. The quartz gas delivery pipe 113 has a certain length to avoid direct connection between the process gas delivery pipe and the bottom of the quartz body 111, which would result in poor sealing of the vacuum quartz cavity 110.

[0068] The vertical projections of the air inlet 101 and the emission port 102 onto the quartz body 111 can overlap.

[0069] The quartz body 111 can be a hollow cylinder, and the quartz cover plate 114 can be a cylinder including the emission hole 102.

[0070] Optional, Figure 5 This is a schematic diagram of a graphite isolation structure provided according to an embodiment of the present invention. (Continuing to refer to...) Figure 1 and Figure 5 The graphite isolation structure 150 includes a graphite hollow frustum 152 and a graphite edge 153; the graphite hollow frustum 152 and the graphite edge 153 are integrally connected; the graphite edge 153 is located on the side of the metal flange 140 away from the quartz edge 112 and is detachably connected to the metal flange 140; along the direction from the bottom of the quartz body 111 to the top of the quartz body 111, the diameter of the graphite hollow frustum 152 gradually increases, and the graphite hollow frustum 152 is in contact with the surface of the quartz cover plate 114 away from the quartz body 111.

[0071] Specifically, the metal flange 140 includes a first through hole that exposes a quartz cover plate 114, and a graphite hollow frustum 152 located within the first through hole. Multiple third threaded holes 151 are located on a graphite edge 153, and the graphite isolation structure 150 is detachably connected to the metal flange 140 via the graphite edge 153.

[0072] By setting the graphite hollow frustum 152 in contact with the quartz cover plate 114, the graphite hollow frustum 152 can apply a certain pressure to the quartz cover plate 114, further ensuring that the quartz cover plate 114 is fixedly connected to the quartz body 111, thus ensuring the airtightness of the quartz body 111.

[0073] The direction from the bottom to the top of the quartz body 111 can be denoted as the first direction Z. The diameter of the graphite hollow frustum 152 gradually increases, which facilitates the installation of the graphite isolation structure 150, ensures better electron emission, and ensures physical isolation between the electron and the metal flange 140.

[0074] Optional, Figure 6 This is a cross-sectional structural diagram of another radio frequency neutralizer provided according to an embodiment of the present invention. Figure 6 Graphite electrode structure not shown, see reference. Figure 6 The vacuum quartz cavity 110 also includes a hollow quartz column 117 integrally connected to the quartz cover plate 114; the hollow quartz column 117 is located on the side of the quartz cover plate 114 away from the quartz body 111; the vertical projection of the hollow quartz column 117 on the quartz cover plate 114 completely surrounds the emission hole 102; the graphite hollow frustum 152 overlaps in the hollow quartz column 117.

[0075] Specifically, the hollow quartz column 117 further prevents electrons emitted from the emission port 102 from contacting the metal flange 140. The graphite hollow frustum 152 overlaps within the hollow quartz column 117, applying a certain pressure to the hollow quartz column 117, thereby better securing the quartz cover plate 114 within the quartz body 111.

[0076] Optional, continue to refer to Figure 6 The radio frequency neutralizer provided in this embodiment also includes a metal shield 190; the metal shield 190 is located outside the radio frequency coil 120 away from the vacuum quartz cavity 110; the metal shield 190 is detachably connected to the metal flange 140; the first end of the radio frequency coil 120 passes through the metal shield 190 to receive the cooling medium.

[0077] Specifically, the metal shield 190 protects the vacuum quartz cavity 110 and the RF coil 120 for extended service life, while reducing RF energy leakage and improving the ionization efficiency of the process gas.

[0078] Optional, Figure 7 This is a schematic diagram of the structure of a graphite cavity body according to an embodiment of the present invention, with reference to... Figure 2 , Figure 3 and Figure 7 The graphite electrode structure 130 provided in this embodiment includes a graphite cavity body 131 and a graphite conductive electrode 132; the graphite cavity body 131 is located on the inner wall side of the vacuum quartz cavity 110; the sidewall of the graphite cavity body 131 includes a plurality of spaced longitudinal openings 1311 (see reference). Figure 7 The graphite conductive electrode 132 is electrically connected to the graphite cavity body 131 and is also used to fix the graphite cavity body 131 to the bottom of the quartz body 111.

[0079] Specifically, a graphite fixing plate 1312 is provided on the side of the graphite cavity body 131 away from the quartz cover plate 114. The graphite fixing plate 1312 includes a graphite through hole 1313. The graphite fixing plate 1312 is in contact with the bottom of the quartz body 111. A second through hole 115 is also provided at the bottom of the quartz body 111. The graphite conductive electrode 132 can pass through the graphite through hole 1313 and the second through hole 115 to be electrically connected to the external metal electrode 171, thereby receiving the negative voltage transmitted by the external metal electrode 171.

[0080] The graphite cavity body 131 also includes a longitudinal opening 1311 that penetrates the sidewall. The arrangement of multiple longitudinal openings 1311 can ensure that more radio frequency energy enters the vacuum quartz cavity 110 and improve the ionization efficiency of the process gas.

[0081] Optional, continue to refer to Figure 2 The radio frequency neutralizer provided in this embodiment also includes an ignition module 180; the ignition module 180 includes a metal ignition electrode 181 and a graphite ignition electrode 182; the metal ignition electrode 181 extends from the outside of the quartz body 111 to the inside of the quartz body 111, and the graphite ignition electrode 182 is located inside the quartz body 111 and completely encloses the metal ignition electrode 181 located inside the quartz body 111.

[0082] Specifically, the ignition module 180 is configured to ensure the ignition efficiency of the RF neutralizer. The inclusion of a portion of the metal ignition electrode 181 extending into the quartz body 111 ensures high voltage transmission from the ignition module 180 and improves its structural integrity.

[0083] By setting the graphite ignition electrode 182 to fully enclose the metal ignition electrode 181 located inside the quartz body 111, the metal ignition electrode 181 can be avoided from being exposed, further ensuring that there is no metal structure inside the vacuum quartz cavity 110.

[0084] Combination Figure 3The bottom of the quartz body 111 also includes a third through hole 116, through which the metal ignition electrode 181 can pass into the quartz body 111.

[0085] It should be noted that the graphite conductive electrode 132 completely fills the second through hole 115, and the metal ignition electrode 181 completely fills the third through hole 116. This arrangement ensures that the vacuum quartz cavity 110 is in a vacuum state.

[0086] Optionally, the radio frequency neutralizer provided in this embodiment further includes a power module; the power module includes a first power supply, a second power supply, a third power supply, and a fourth power supply; the first power supply is electrically connected to the radio frequency coil and is used to provide radio frequency energy to the radio frequency coil to ionize the process gas in the vacuum quartz cavity to generate plasma; the second power supply is used to supply power to the graphite conductive electrode so that the graphite cavity body pushes electrons in the vacuum quartz cavity out of the emission hole; the third power supply is used to supply power to the ignition module; and the fourth power supply is used to supply power to the graphite isolation structure.

[0087] Specifically, the power module is located outside the vacuum quartz cavity. The primary power source can be a radio frequency power source.

[0088] The second power supply provides a negative voltage to the graphite conductive electrodes, with a range of -70V to -100V. The third power supply provides a high voltage to the ignition module, reaching over 1000V. The fourth power supply provides a positive voltage to the graphite isolation structure, with a range of +40V to +60V. The fourth and second power supplies can share a common ground.

[0089] Optionally, the radio frequency neutralizer provided in this embodiment also includes an impedance matching device; the impedance matching device is electrically connected between the first power supply and the radio frequency coil.

[0090] Specifically, the impedance matching device provided in this embodiment is located outside the vacuum quartz cavity. The impedance matching device is set to ensure that the impedance of the vacuum quartz cavity matches the output impedance of the first power supply, thereby ensuring the utilization rate of radio frequency energy.

[0091] This embodiment also provides a semiconductor processing apparatus, which includes the radio frequency neutralizer provided in any embodiment of the present invention.

[0092] Specifically, the semiconductor processing equipment provided in this embodiment includes a plasma etching device or a plasma coating device. Since the semiconductor processing equipment provided in this embodiment includes the radio frequency neutralizer provided in any embodiment of the present invention, the semiconductor processing equipment provided in this embodiment also includes the technical features and corresponding beneficial effects of the radio frequency neutralizer.

[0093] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0094] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A radio frequency neutralizer characterized by, Located outside the vacuum chamber, the radio frequency neutralizer includes: A vacuum quartz cavity with no exposed metal structure inside; the vacuum quartz cavity includes an inlet and an outlet; the inlet is used to receive process gases, and the outlet is used to emit electrons; A radio frequency coil is wound around the outer wall of the vacuum quartz cavity. The radio frequency coil has a hollow structure and is used to receive the liquid cooling medium. The radio frequency coil is also used to receive radio frequency energy to ionize the process gas in the vacuum quartz cavity. A graphite electrode structure is located inside the vacuum quartz cavity, and the graphite electrode structure is used to push electrons from the vacuum quartz cavity out of the emission hole; A metal flange is located on one side of the vacuum quartz cavity and is detachably connected to the vacuum quartz cavity; A graphite isolation structure is located on the side of the metal flange away from the vacuum quartz cavity and is detachably connected to the metal flange. The graphite isolation structure is used to isolate electrons emitted from the vacuum quartz cavity from the metal flange and to draw electrons out of the vacuum quartz cavity. The vacuum quartz cavity includes a quartz body, a quartz edge, a quartz gas delivery pipe, and a quartz cover plate; wherein, the emission hole is located on the quartz cover plate; The edge of the quartz is detachably connected to the metal flange and is also integrally connected to the top edge of the quartz body; The quartz gas supply pipe is integrally connected to the bottom of the quartz body, and the opening of the quartz gas supply pipe away from the bottom of the quartz body is the air inlet. The quartz cover plate is seamlessly connected to the quartz body; The graphite isolation structure includes a graphite hollow frustum and a graphite edge; The hollow graphite frustum is integrally connected to the graphite edge; The graphite edge is located on the side of the metal flange away from the quartz edge and is detachably connected to the metal flange; The diameter of the graphite hollow frustum gradually increases along the direction from the bottom to the top of the quartz body. The vacuum quartz cavity also includes a hollow quartz column integrally connected to the quartz cover plate; The hollow quartz column is located on the side of the quartz cover plate away from the quartz body; The vertical projection of the hollow quartz column on the quartz cover plate completely surrounds the emission hole; The hollow graphite frustum is attached to the hollow quartz column.

2. The radio frequency neutralizer of claim 1, wherein, The graphite electrode structure includes a graphite cavity body and a graphite conductive electrode. The graphite cavity body is located on the inner wall side of the vacuum quartz cavity; The sidewall of the graphite cavity body includes multiple spaced longitudinal openings; The graphite conductive electrode is electrically connected to the graphite cavity body and is also used to fix the graphite cavity body to the bottom of the quartz body.

3. The radio frequency neutralizer of claim 2, wherein, It also includes an ignition module; The ignition module includes a metal ignition electrode and a graphite ignition electrode; The metal ignition electrode extends from the outside of the quartz body to the inside of the quartz body, and the graphite ignition electrode is located inside the quartz body and completely encloses the metal ignition electrode located inside the quartz body.

4. The radio frequency neutralizer according to claim 3, characterized in that, It also includes a power module; the power module includes a first power supply, a second power supply, a third power supply, and a fourth power supply; The first power supply is electrically connected to the radio frequency coil and is used to provide radio frequency energy to the radio frequency coil so that the radio frequency coil ionizes the process gas in the vacuum quartz cavity to generate plasma; The second power source is used to supply power to the graphite conductive electrode so that the graphite cavity body ejects electrons from the vacuum quartz cavity through the emission port; The third power source is used to supply power to the ignition module; The fourth power source is used to supply power to the graphite isolation structure.

5. The radio frequency neutralizer of claim 4, wherein, It also includes an impedance matching device; the impedance matching device is electrically connected between the first power supply and the radio frequency coil.

6. The radio frequency neutralizer according to any one of claims 1-5, characterized in that, It also includes a metal shielding cover; the metal shielding cover is located outside the radio frequency coil away from the vacuum quartz cavity; The metal shielding cover is detachably connected to the metal flange; The first end of the radio frequency coil passes through the metal shield to receive the cooling medium.

7. A semiconductor processing apparatus, characterized in that, Includes the radio frequency neutralizer as described in any one of claims 1-6.

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