A glass via substrate and a method of making the same

Abstract

The application discloses a glass through-hole substrate and a preparation method thereof. The preparation method comprises the following steps: S1, providing a glass substrate with a through-hole, the glass substrate having opposite first and second surfaces, and the through-hole penetrating through the first surface to the second surface; S2, providing a support plate, the support plate being provided with a first metal layer by means of a decomposable adhesive; S3, bonding the first surface of the glass substrate and the first metal layer on the support plate to each other, so that the first end of the through-hole is covered by the first metal layer; S4, depositing metal on the first metal layer exposed in the through-hole to form a second metal layer, and the through-hole is filled with the second metal layer; S5, decomposing the decomposable adhesive to separate the support plate from the first metal layer; and S6, depositing metal on the second surface of the glass substrate to form a third metal layer, and the third metal layer covers the second end of the through-hole. The application can realize the metallization of the high-aspect-ratio through-hole, reduce the probability of glass substrate breakage, simplify the process flow and reduce the production cost.

Description

Technical Field

[0001] This invention relates to a glass through-hole substrate and its preparation method. Background Technology

[0002] Through-glass via (TGV) substrates are a new type of printed circuit board substrate or IC carrier. Compared with common silicon and SOI substrates, TGV substrates offer superior electrical performance and lower parasitic capacitance, which is beneficial for the expansion of high-frequency signal transmission. Furthermore, the excellent optical properties of glass make them more suitable for optical applications such as micro-opto-electro-mechanical systems (MEMS). In summary, TGV substrates can have high-density, high-aspect-ratio glass vias, reducing device size while maintaining high-performance electrical interconnects, and have a very broad application prospect.

[0003] Currently, there are various methods for metallizing glass through-hole substrates. However, the following problems exist: thin glass (thickness less than 400um) is easily broken during the process; thermal shock tests after direct sputtering of metal onto the glass surface show peeling phenomena; high aspect ratio TGV holes (AR>10) face sputtering capacity bottlenecks or require higher equipment capabilities (higher-order sputtering / atomic layer deposition), leading to a sharp increase in production costs; general bridging electroplating processes are prone to problems such as core-encapsulated holes or difficulty in bridging due to excessively large hole diameters; electroplating processes are basically single-piece production, making it difficult to produce double-sided glass with different thicknesses and patterns; general chemical polishing processes after hole filling are prone to causing glass cracking and breakage, increasing production costs.

[0004] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a glass through-hole substrate and its preparation method, which can achieve metallization of through holes with high aspect ratios, reduce the probability of glass substrate breakage, simplify the process, and reduce production costs.

[0006] The first aspect of the present invention provides a method for preparing a glass through-hole substrate, comprising the following steps:

[0007] S1. A glass substrate with a through hole is provided, the glass substrate having opposite first and second surfaces, the through hole extending from the first surface to the second surface;

[0008] S2. A support plate is provided, wherein a first metal layer is coated on the support plate by means of a biodegradable adhesive;

[0009] S3. Bond the first surface of the glass substrate to the first metal layer on the support plate so that the first end of the through hole is covered by the first metal layer.

[0010] S4. Deposit metal onto the first metal layer exposed in the through hole to form a second metal layer, and fill the through hole with the second metal layer.

[0011] S5. Decompose the biodegradable adhesive to separate the support plate from the first metal layer;

[0012] S6. Deposit metal onto the second surface of the glass substrate to form a third metal layer, the third metal layer covering the second end of the via;

[0013] The second metal layer within the through-hole connects the first metal layer and the third metal layer.

[0014] In some preferred embodiments, in step S1, the aspect ratio of the via is 1 to 50, and the aperture is 2 to 200 μm; the first and / or second surfaces of the glass substrate include a patterned insulating layer, the insulating layer has a window, the via is exposed from the window, and the thickness of the insulating layer is 5 nm to 100 μm;

[0015] In step S3, the first metal layer is bonded to the insulating layer on the first surface, and the window on the insulating layer is filled by the second metal layer;

[0016] In step S6, metal is deposited onto the insulating layer on the second side of the glass substrate, and the window on the insulating layer is filled by the third metal layer.

[0017] In some preferred embodiments, the insulating layer comprises one or more of silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID (photo-induced dieletric) material, and polyimide.

[0018] In some preferred embodiments, in step S2, the decomposable adhesive includes a pyrolytic adhesive, and in step S5, the pyrolytic adhesive is heated to decompose.

[0019] In some preferred embodiments, in step S2, the biodegradable adhesive is applied to the support plate; or the biodegradable adhesive is located on tape, which is attached to the support plate.

[0020] In some preferred embodiments, in step S2, the thickness of the support plate is 100um to 2000um, and the support plate includes one or more of a metal plate and a glass fiber reinforced epoxy resin laminate; and / or, the first metal layer is deposited on the support plate or pressed onto a biodegradable adhesive layer on the support plate, and the thickness of the first metal layer is 2um to 100um.

[0021] In some preferred embodiments, in step S3, the glass substrate and the first metal layer are bonded by thermo-pressing.

[0022] In some preferred embodiments, in step S4, a first metal layer is electroplated into the through hole; in step S6, a third metal layer is electroplated onto the second metal layer in the through hole.

[0023] In some preferred embodiments, in step S5, the first metal layer is patterned to form a first circuit.

[0024] In step S6, the third metal layer covers the second surface, and the third metal layer is image-processed to form a second circuit to obtain a glass through-hole substrate; or, a bump is formed on the second metal layer inside the through hole by electroplating or metal ball implantation process, and the third metal layer includes the bump to obtain a glass through-hole substrate.

[0025] In some preferred embodiments, in step S2, a first metal layer is deposited on both opposite surfaces of the support plate; in step S3, a glass substrate is bonded to the first metal layer on each of the two surfaces of the support plate.

[0026] A second aspect of the present invention provides a glass through-hole substrate, which is obtained by the aforementioned preparation method.

[0027] In one embodiment, the glass through-hole substrate includes:

[0028] A glass substrate having a through-hole, the glass substrate having opposite first and second surfaces, the through-hole extending from the first surface to the second surface;

[0029] A first insulating layer is applied to a first surface of the glass substrate, and a first window is provided on the first insulating layer, with the through hole exposed from the first window;

[0030] A second insulating layer is applied to the second surface of the glass substrate, and a second window is provided on the second insulating layer, through which the through hole is exposed.

[0031] A first metal layer is patterned on the first insulating layer, and one end of the through hole is covered by the first metal layer;

[0032] A second metal layer is filled in the first window and the through hole and is in contact with the first metal layer;

[0033] A third metal layer fills the second window and contacts the second metal layer.

[0034] In one embodiment, the aspect ratio of the through-hole is 1-50, and the aperture is 2-200 μm. The thickness of the support plate is 100 μm-2000 μm, and the support plate includes one or more of a metal plate and a glass fiber reinforced epoxy resin laminate. The thickness of the insulating layer is 5 nm-100 μm; the insulating layer includes one or more of silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID material, and polyimide. The thickness of the first metal layer is 2 μm-100 μm, and the first metal layer is a copper plating or copper foil.

[0035] In one embodiment, the third metal layer includes bumps that protrude relative to the second insulating layer.

[0036] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0037] The method for fabricating a glass through-hole substrate of the present invention involves placing a first metal layer onto a glass substrate using a support plate, using the first metal layer exposed within the through-hole as a substrate, and depositing a second metal layer on it to achieve metallization within the through-hole. Subsequently, the support plate is removed from the glass substrate, and a third metal layer is deposited on the second metal layer exposed on the second surface to achieve electrical connection between the two sides of the substrate. This method enables the metallization of through-holes with high aspect ratios, reduces the probability of glass substrate breakage, and thus improves the yield rate. It eliminates the need for the step of sputtering metal atoms within the through-hole, reducing the process difficulty, simplifying the process flow, and lowering production costs. Attached Figure Description

[0038] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a structural diagram of a glass through-hole substrate according to Embodiment 1 of the present invention.

[0040] Figure 2 This is a preparation process flowchart according to Embodiment 1 of the present invention.

[0041] Figure 3 This is a schematic diagram illustrating the preparation of an A-plate according to Embodiment 1 of the present invention.

[0042] Figure 4 This is a schematic diagram illustrating the preparation of a B-plate according to Embodiment 1 of the present invention.

[0043] Figure 5 This is a schematic diagram of the bonding process between plate A and plate B according to Embodiment 1 of the present invention.

[0044] Figure 6 This is a schematic diagram illustrating the preparation of the second metal layer according to Embodiment 1 of the present invention.

[0045] Figure 7 This is a schematic diagram illustrating the preparation of the third metal layer according to Embodiment 1 of the present invention.

[0046] Figure 8 This is a structural diagram of another glass through-hole substrate according to Embodiment 1 of the present invention.

[0047] Figure 9 This is a preparation process flowchart according to Embodiment 2 of the present invention.

[0048] Figure 10 This is a schematic diagram illustrating the preparation of an A-plate according to Embodiment 2 of the present invention.

[0049] Figure 11 This is a schematic diagram illustrating the fabrication of two glass substrates having a first metal layer and a second metal layer according to Embodiment 2 of the present invention.

[0050] Figure 12 A microscope image of a glass through-hole substrate according to an embodiment of the present invention.

[0051] Figure label:

[0052] 1. Glass substrate; 10. Through-hole; 11. First side; 12. Second side;

[0053] 2. First insulating layer; 20. First window;

[0054] 3. Second insulating layer; 30. Second window;

[0055] 4. First metal layer; 40. Sputtered layer; 41. Support plate; 42. Biodegradable adhesive;

[0056] 5. Second metal layer;

[0057] 6. Third metal layer; 61. Bumps. Detailed Implementation

[0058] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more readily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof.

[0059] In this document, the terms “upper,” “lower,” “front,” “rear,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0060] Example 1

[0061] Example 1 provides a glass through-hole substrate and its preparation method. (Refer to...) Figure 1 As shown, the glass through-hole substrate includes a glass substrate 1, a first metal layer 4, a second metal layer 5, and a third metal layer 6; further, the glass through-hole substrate may also include a first insulating layer 2 and a second insulating layer 3. The first insulating layer 2 and the second insulating layer 3 isolate the surface of the glass substrate 1, which can avoid the peeling phenomenon shown in the thermal shock test after the direct sputtering of metal on the glass surface. Figures 2 to 7 The fabrication process of this glass through-hole substrate is shown.

[0062] Combination Figures 1 to 7 As shown, the glass substrate 1 can be a glass plate with opposite first surfaces 11 and second surfaces 12. One or more through-holes 10 are formed on the glass substrate 1, extending from the first surface 11 to the second surface 12. The shape of the glass substrate 1 can be a wafer or a polygonal (e.g., a wafer) piece, such as an 8-inch or 12-inch circle, or a square or rectangle with a side length greater than 100 mm. The thickness of the glass substrate 1 can be 100 μm to 1600 μm. The aspect ratio (AR) of the through-holes 10 is 1 to 50, and the aperture is 2 to 200 μm.

[0063] A first insulating layer 2 is applied to the first surface 11 of the glass substrate 1. A first window 20 is formed on the first insulating layer 2, and a through-hole 10 is exposed through the first window 20. The thickness of the first insulating layer 2 is 5 nm to 100 μm. The material of the first insulating layer 2 includes one or more of silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID material, and polyimide.

[0064] A second insulating layer 3 is applied to the second surface 12 of the glass substrate 1. A second window 30 is formed on the second insulating layer 3, and a through-hole 10 is exposed through the second window 30. The thickness of the second insulating layer 3 is 5 nm to 100 μm. The material of the second insulating layer 3 includes one or more of silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID material, and polyimide.

[0065] The first metal layer 4 is disposed on the first insulating layer 2, and the first metal layer 4 is patterned to form a circuit on the first surface 11 of the glass substrate 1. One end of the via 10 (the end closest to the first surface 11) is covered by the first metal layer 4. The thickness of the first metal layer 4 is 2um to 100um, and the first metal layer 4 is a copper plating or copper foil.

[0066] The second metal layer 5 fills the first window 20 and the through hole 10 and contacts the first metal layer 4.

[0067] The third metal layer 6 is disposed on the second insulating layer 3, and the third metal layer 6 is patterned to form a circuit covering the second surface 12 of the glass substrate 1. The other end of the via 10 (the end closer to the first surface 11) is covered by the third metal layer 6. In addition, the second window 30 on the second insulating layer 3 is also filled by the third metal layer 6. The second metal layer 5 conducts electricity between the first metal layer 4 and the third metal layer 6 on both sides of the glass substrate 1, forming an electrical connection in the thickness direction.

[0068] Figure 2 It shows Figure 1 The fabrication process of the glass through-hole substrate. (Refer to...) Figure 2 As shown, the fabrication method of this glass through-hole substrate includes the following steps:

[0069] S11. A glass substrate 1 with a through hole 10 is provided. The glass substrate 1 has a first surface 11 and a second surface 12 that are opposite to each other. The through hole 10 extends from the first surface 11 to the second surface 12.

[0070] S12. A support plate 41 is provided, and the support plate 41 is covered with a first metal layer 4 by a biodegradable adhesive 42.

[0071] S13. Bond the first surface 11 of the glass substrate 1 and the first metal layer 4 on the support plate 41 to each other, so that the first end of the through hole 10 is covered by the first metal layer 4.

[0072] S14. Deposit metal onto the first metal layer 4 exposed in the through hole 10 to form a second metal layer 5, and the through hole 10 is filled by the second metal layer 5.

[0073] S15. Decompose the decomposable adhesive 42 to separate the support plate 41 from the first metal layer 4.

[0074] S16. Deposit metal onto the second surface 12 of the glass substrate 1 to form a third metal layer 6, which covers the second end of the via 10. The second metal layer 5 within the via 10 connects the first metal layer 4 and the third metal layer 6.

[0075] In step S11, the glass substrate 1 can be a glass plate with opposite first surfaces 11 and second surfaces 12. One or more through-holes 10 are formed on the glass substrate 1, extending from the first surface 11 to the second surface 12. The shape of the glass substrate 1 can be a wafer or a polygonal (e.g., a wafer) wafer, such as an 8-inch or 12-inch circle, or a square or rectangle with a side length greater than 100 mm. The thickness of the glass substrate 1 can be 100 μm to 1600 μm. The aspect ratio (depth / width or diameter) of the through-hole 10 is 1 to 50, and the aperture is 2 to 200 μm.

[0076] Reference Figure 3 As shown, step S12 specifically includes:

[0077] Step S121: Clean the support plate 41; the thickness of the support plate 41 is 100um~2000um, and the support plate 41 includes one or more of metal plates and glass fiber reinforced epoxy resin laminates. In this embodiment, the support plate 41 is selected as a titanium plate.

[0078] Step S122: Apply or attach a biodegradable adhesive 42 to one surface of the support plate 41. In this embodiment, the biodegradable adhesive 42 includes a pyrolytic adhesive, such as a bio-oil-based adhesive, which loses its adhesive properties after being heated to a preset temperature. The biodegradable adhesive 42 can also be a photodegradable adhesive, etc. The biodegradable adhesive 42 is applied to the support plate 41; or the biodegradable adhesive 42 is located on an adhesive tape, which is then attached to the support plate 41.

[0079] Step S123: Apply a first metal layer 4 to the biodegradable adhesive 42.

[0080] The combination of boards obtained through steps S121 to S123 is called board A.

[0081] Specifically, in this embodiment, Ti / Cu is first sputtered onto the biodegradable adhesive 42 or a tape containing the biodegradable adhesive 42 to form a sputtered layer 40; then, a metal layer is deposited (e.g., electroplated) on the sputtered layer 40 to finally form a first metal layer 4 with a thickness of 2µm to 100µm. In other embodiments, copper foil can be directly laminated onto the biodegradable adhesive 42 without sputtering Ti / Cu.

[0082] Reference Figure 4As shown, before step S13, the glass substrate 1 is first processed as follows: the glass substrate 1 is laser-modified and etched to form multiple through holes 10; a first insulating layer 2 is coated on the first surface 11 of the glass substrate 1; the first insulating layer 2 is processed to form a first window 20 that is aligned and connected to the multiple through holes 10, and the obtained board assembly is called board B. The first insulating layer 2 is a photosensitive polyimide layer applied to the glass substrate 1 using a PSPI coating process; the first window 20 is formed by patterning using exposure / development technology, and the through holes 10 are exposed from the first window 20. In other embodiments, the first insulating layer 2 can also be silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID material, etc. The thickness of the first insulating layer 2 is 5 nm to 100 μm.

[0083] Reference Figure 5 As shown, after plates A and B are fabricated, step S13 is executed, in which plate A is flipped over (with the first metal layer 4 of plate A facing the first insulating layer 2 of plate B) and bonded to plate B. "The first surface 11 of the glass substrate 1 and the first metal layer 4 on the support plate 41 are bonded to each other" specifically refers to bonding the first metal layer 4 to the first insulating layer 2 of the first surface 11. Specifically, the first metal layer 4 is deposited on the first insulating layer 2 of the first surface 11 of the glass substrate 1, so that the first end of the through-hole 10 is covered by the first metal layer 4. The glass substrate 1 and the first metal layer 4 can be bonded together by thermo-pressing, allowing the first metal layer 4 and the first insulating layer 2 to be bonded together, either directly or through adhesive.

[0084] Reference Figure 6 As shown, in step S14, a first metal layer 4 is electroplated into the through hole 10. Specifically, the bonded A plate and B plate are placed in an electroplating device. The first metal layer 4 exposed in the through hole 10 serves as the cathode. After energizing, metal particles are deposited on the first metal layer 4 until the first window 20 and the through hole 10 are completely filled.

[0085] Continue to refer to Figure 6 In step S15, after the decomposable adhesive 42 decomposes, the support plate 41 separates from the B plate, while the first metal layer 4 remains on the B plate, forming a B plate covered with the first metal layer 4. The through-hole 10 and the first window 20 are filled with two metal layers, and the second metal layer 5 is in contact with the first metal layer 4. The second metal layer 5 can be a copper plating layer. In this embodiment, the decomposable adhesive 42 is a pyrolytic adhesive; therefore, heating decomposes the pyrolytic adhesive, causing the support plate 41 and the B plate to debond.

[0086] Continue to refer to Figure 6The first metal layer 4 is patterned to form the first circuit. Specifically, copper layer etching can be performed using photoresist technology (coating / exposure / development). Each via 10 is covered with the first circuit, and gaps are etched between the first circuits to isolate them from each other.

[0087] Reference Figure 7 As shown, in step S16, "depositing metal onto the second surface 12 of the glass substrate 1" specifically refers to depositing metal onto the second insulating layer 3 on the second surface 12. Specifically, the substrate (B-plate + patterned first metal layer 4 + second metal layer 5) processed in step S15 is flipped so that its second surface 12 faces upwards, and the second insulating layer 3 is coated onto the first surface 11 of the glass substrate 1. The second insulating layer 3 is then processed to form a second window 30 that is aligned and connected to the multiple vias 10. The second insulating layer 3 is a photosensitive polyimide layer applied to the glass substrate 1 using a PSPI coating process; patterning is performed using exposure / development technology to form the second window 30, with the vias 10 and the second metal layer 5 exposed through the second window 30. In other embodiments, the second insulating layer 3 can also be silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID materials, etc. The thickness of the second insulating layer 3 is 5 nm to 100 μm.

[0088] Continue to refer to Figure 7 Ti / Cu is sputtered onto the second insulating layer 3, followed by deposition (e.g., electroplating) of a metal layer to form a third metal layer 6. The third metal layer 6 fills the second window 30 and covers the second insulating layer 3. Subsequently, the third metal layer 6 is patterned to form second lines, ultimately obtaining a glass through-hole substrate product. Specifically, copper layer etching can be performed using photoresist technology (coating / exposure / development). Each through-hole 10 has a second line on its second metal layer 5, and gaps are etched between the second lines to isolate them from each other.

[0089] Figure 8 Another glass through-hole substrate is shown, which is related to Figure 1 The only difference between the glass through-hole substrates shown is the fabrication process and shape of the third metal layer 6; otherwise, they are basically the same. The third metal layer 6 includes bumps 61, which are formed on the second metal layer 5 within the through-hole 10 using a metal ball implantation process.

[0090] Example 2

[0091] The structure of the glass through-hole substrate in this embodiment is the same as that in Embodiment 1, the only difference being the preparation method.

[0092] See Figure 9 As shown, the method for preparing the glass through-hole substrate in this embodiment includes the following steps:

[0093] S21. Two glass substrates 1 with through holes 10 are provided. Each glass substrate 1 has an opposite first surface 11 and a second surface 12. The through hole 10 extends from the first surface 11 to the second surface 12.

[0094] S22. A support plate 41 is provided, and a first metal layer 4 is respectively coated on two opposite surfaces of the support plate 41 by a biodegradable adhesive 42.

[0095] S23. Two glass substrates 1 are bonded to the support plate 41, wherein one surface of the support plate 41 is bonded to the first surface 11 of one glass substrate 1, and the other surface of the support plate 41 is bonded to the first surface 11 of another glass substrate 1; the first end of the through hole 10 of each glass substrate is covered by a first metal layer 4.

[0096] S24. Deposit metal onto the first metal layer 4 exposed in the via 10 of each glass substrate 1 to form a second metal layer 5, and fill the via 10 with the second metal layer 5.

[0097] S25. Decompose the decomposable adhesive 42 to separate the support plate 41 from the first metal layer 4 on the two glass substrates 1, and at the same time form two glass substrates 1 covered with the first metal layer 4.

[0098] S26. Deposit metal onto the second surface 12 of each glass substrate 1 to form a third metal layer 6, which covers the second end of the through-hole 10. Two glass through-hole substrate products are obtained simultaneously.

[0099] The differences between the steps and those in Example 1 are as follows: the preparation of plate A and the simultaneous bonding of plate A to two plates B are the same. For example, the preparation of glass substrate 1 (plate A) in step S21 is the same as step S11 in Example 1; the preparation of the third metal layer 6 in step S26 is the same as step S16 in Example 1.

[0100] Specifically, refer to Figure 10 Step S22 specifically includes:

[0101] Step S221: Clean the support plate 41;

[0102] Step S222: Apply or attach biodegradable adhesive 42 to both surfaces of the support plate 41;

[0103] Step S223: Deposit a first metal layer 4 on each of the two decomposable adhesives 42.

[0104] Reference Figure 11In step S23, a B-plate is first bonded to one surface of an A-plate, and then a second B-plate is inverted and bonded to the other surface of the A-plate. The two bonded B-plates and one A-plate are placed in an electroplating apparatus, and simultaneously a second metal layer 5 is deposited in the first through-hole 10 and the first window 20 of the two B-plates, forming a layer in contact with the corresponding first metal layer 4. The bonding process can be the same as in Example 1.

[0105] Continue to refer to Figure 11 The two B plates and one A plate are debonded, and the specific process is the same as in Example 1. The decomposable adhesive 42 on both sides of the support plate 41 loses its adhesiveness, and the support plate 41 can be removed from the two A plates, and the two A plates covered with the first metal layer 4 are separated from each other; then the third metal layer 6 is applied according to the same process, specifically the same as step S16 in Example 1.

[0106] The preparation process in Example 2 further improves production efficiency.

[0107] Figure 12 A microscope image of the glass through-hole substrate prepared according to the embodiment is shown, with gray representing the metal layer. It can be seen that the through-hole 10 is completely filled with the metal layer, achieving circuit connectivity on both the top and bottom sides. Furthermore, additional layers can be stacked on both surfaces, with additional layers on both sides.

[0108] The above-described method for preparing a glass through-hole substrate involves placing a first metal layer 4 onto a glass substrate 1 using a support plate 41. The first metal layer 4 exposed within the through-hole 10 serves as the substrate, and a second metal layer 5 is deposited on it to achieve metallization within the through-hole 10. Subsequently, the support plate 41 is removed from the glass substrate 1, and a third metal layer 6 is deposited on the second metal layer 5 exposed on the second surface 12 to achieve electrical connection between the two sides of the substrate. This method enables metallization of the through-hole 10 with a high aspect ratio, reduces the probability of glass substrate 1 breakage, and thus improves the yield rate. It eliminates the need for the step of sputtering metal atoms within the through-hole 10, reducing the process difficulty, simplifying the process flow, and lowering production costs.

[0109] Furthermore, providing back support for the glass substrate 1 during fabrication increases yield and solves the problem of fragile thin glass (thickness less than 400µm) during the process. Adding an insulating layer to the glass substrate 1 prevents peeling during subsequent thermal shock testing after direct metal sputtering onto the glass surface. Employing a bottom copper plating process, especially for high aspect ratio TGV vias 10 (AR>10), saves sputtering steps and achieves higher aspect ratios without requiring increased equipment capabilities (higher-order sputtering / atomic layer deposition), thus avoiding a sharp increase in production costs. It also solves problems such as core-encapsulated holes or difficulties in bridging due to excessively large apertures in conventional bridging electroplating processes. The non-common cathode design addresses the challenge of achieving different thicknesses and patterns on both sides of the glass and facilitates subsequent stacking of glass of varying thicknesses, increasing product design flexibility. Conventional etching, reverse electroplating, or brushing processes are sufficient, eliminating the need for chemical polishing and preventing glass cracking and breakage. Simultaneous production of both substrates allows for the simultaneous fabrication of different thicknesses and patterns.

[0110] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0111] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.

[0112] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature.

[0113] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0114] The above embodiments are merely illustrative of the technical concept and features of the present invention, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they should not be construed as limiting the scope of protection of the present invention. All equivalent transformations or modifications made according to the principles of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method for preparing a glass through-hole substrate, characterized in that, Includes the following steps: S1. A glass substrate with a through hole is provided, the glass substrate having opposite first and second surfaces, the through hole extending from the first surface to the second surface; S2. A support plate is provided, wherein a first metal layer is coated on the support plate by means of a biodegradable adhesive; S3. Bond the first surface of the glass substrate to the first metal layer on the support plate so that the first end of the through hole is covered by the first metal layer. S4. Deposit metal onto the first metal layer exposed in the through hole to form a second metal layer, and fill the through hole with the second metal layer. S5. Decompose the decomposable adhesive, separate the support plate from the first metal layer, leave the first metal layer on the first surface of the glass substrate, and perform patterning on the first metal layer to form a first line. S6. Deposit metal onto the second surface of the glass substrate to form a third metal layer, the third metal layer covering the second end of the via; The second metal layer within the through-hole connects the first metal layer and the third metal layer.

2. The preparation method according to claim 1, characterized in that, In step S1, the aspect ratio of the via is 1~50, and the aperture is 2~200μm; the first and / or second surfaces of the glass substrate include a patterned insulating layer, the insulating layer has a window, the via is exposed from the window, and the thickness of the insulating layer is 5nm~100μm; In step S3, the first metal layer is bonded to the insulating layer on the first surface, and the window on the insulating layer is filled by the second metal layer; In step S6, metal is deposited onto the insulating layer on the second side of the glass substrate, and the window on the insulating layer is filled by the third metal layer.

3. The preparation method according to claim 2, characterized in that, The insulating layer comprises one or more of silicon dioxide, silicon oxynitride, poly(p-phenylenebenzodioxazole), PID material, and polyimide.

4. The preparation method according to claim 1, characterized in that, In step S2, the decomposable adhesive includes a pyrolytic adhesive, and in step S5, the pyrolytic adhesive is heated to decompose.

5. The preparation method according to claim 1, characterized in that, In step S2, the biodegradable adhesive is applied to the support plate; or the biodegradable adhesive is located on tape, and the tape is attached to the support plate.

6. The preparation method according to claim 1, characterized in that, In step S2, the thickness of the support plate is 100um~2000um, and the support plate includes one or more of a metal plate and a glass fiber reinforced epoxy resin laminate; and / or, the first metal layer is deposited on the support plate or pressed onto a biodegradable adhesive layer on the support plate, and the thickness of the first metal layer is 2um~100um.

7. The preparation method according to claim 1, characterized in that, In step S3, the glass substrate and the first metal layer are bonded by thermo-pressing.

8. The preparation method according to claim 1, characterized in that, In step S4, a first metal layer is electroplated into the through hole; in step S6, a third metal layer is electroplated onto the second metal layer in the through hole.

9. The preparation method according to claim 1, characterized in that, In step S6, the third metal layer covers the second surface, and the third metal layer is image-processed to form a second circuit to obtain a glass through-hole substrate; or, bumps are formed on the second metal layer inside the through hole by electroplating or metal ball implantation process to obtain a glass through-hole substrate.

10. The preparation method according to claim 1, characterized in that, In step S2, a first metal layer is deposited on both opposite surfaces of the support plate; in step S3, a glass substrate is bonded to the first metal layer on each of the two surfaces of the support plate.

11. A glass through-hole substrate, characterized in that, Obtained by the preparation method according to any one of claims 1 to 10.

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