Package substrate drilling method and package substrate

Abstract

The embodiment of the invention provides a packaging substrate drilling method and a packaging substrate, and the method comprises the steps: formulating the name of a laser drilling parameter on drilling equipment, the naming rule is endowed with corresponding codes based on an aperture type, a surface copper foil processing mode, a surface copper foil thickness, a target aperture, a dielectric layer thickness, a dielectric layer material manufacturer, a dielectric layer material model and a dielectric layer glass fiber series; according to different products, corresponding laser drilling process parameters are formulated on drilling equipment, and the laser drilling process parameters comprise laser energy and light spot size; setting a corresponding bar code on the work order according to the naming rule of the laser drilling parameters; the bar code on the product is scanned through the code scanning gun on the drilling equipment, and the drilling equipment automatically matches the corresponding laser drilling process parameters and processes the product. According to the method, the corresponding machining process parameters can be automatically called by scanning the two-dimensional code, the problem of product scrapping caused by wrong parameter selection is avoided, and the machining efficiency is further improved.

Description

Technical Field

[0001] This application relates to the field of packaging substrate technology, and in particular to a method for drilling a packaging substrate and a packaging substrate. Background Technology

[0002] CO2 laser drilling is an important processing technology in the manufacturing of packaging substrates, used to form micro-holes on the substrate to enable circuit interconnection.

[0003] In existing technologies, the method for evaluating parameters of new products often involves processing and debugging new processing parameters based on existing CO2 laser drilling parameters with similar hole diameter, copper thickness, and dielectric thickness to meet the processing needs of new products. When switching between different products or different facets of the same product during mass production, the corresponding CO2 laser drilling parameters need to be switched. At this time, the staff manually selects the processing parameters on the machine. However, this method is prone to causing the staff to select unreasonable parameters or select the wrong parameters during processing, which will lead to product scrap. Summary of the Invention

[0004] This application provides a method for drilling holes in a packaging substrate and a packaging substrate. By naming the laser drilling parameters and setting the corresponding barcode on the work order, the corresponding processing parameters can be automatically retrieved by scanning the QR code. This avoids the problem of product scrapping due to incorrect parameter selection, reduces the time for selecting processing parameters, and improves processing efficiency.

[0005] This application provides a method for drilling holes in a packaging substrate, including: A naming convention for laser drilling parameters has been established on the drilling equipment. The naming rules are based on the hole diameter type, surface copper foil treatment method, surface copper foil thickness, target hole diameter, dielectric layer thickness, dielectric layer material manufacturer, dielectric layer material model, and dielectric layer glass fiber series, and assign corresponding codes accordingly. For different products, corresponding laser drilling process parameters are formulated for the drilling equipment. The laser drilling process parameters include laser energy and spot size. According to the naming rules of laser drilling parameters, set the corresponding barcode on the work order; By scanning the barcode on the product with a barcode scanner on the drilling equipment, the drilling equipment automatically matches the corresponding laser drilling process parameters and processes the product.

[0006] In some embodiments, when setting corresponding laser drilling process parameters on the drilling equipment, the drilling equipment uses a pulsed laser beam to perform instantaneous high-temperature ablation on the substrate to remove copper foil, resin and glass fiber to form holes.

[0007] In some embodiments, defining corresponding laser drilling process parameters on the drilling equipment includes: Set the first laser energy to remove the copper foil on the surface of the packaging substrate and form the initial ablation hole; A second laser energy is set to ablate and remove most of the resin and glass fiber in the intermediate dielectric layer of the packaging substrate to further deepen the ablation hole. The second laser energy is less than the first laser energy. A third laser energy is set to ablate and remove the small amount of residual resin at the bottom of the ablation hole to form a complete through hole or blind hole. The third laser energy is less than the second laser energy.

[0008] In some embodiments, when removing the copper foil from the surface of the encapsulation substrate and forming the initial ablation hole, a negative pressure device is used to remove the molten copper foil formed by the ablation removal, as well as the vaporized resin and glass fiber.

[0009] In some embodiments, the aperture diameter of the drilling equipment satisfies the following relationship: d m =D / (k1*k2), where D is the target aperture, k1 is the effective spot diameter coefficient of the laser beam, and k2 is the comprehensive influence coefficient of the material on the absorption rate of CO2 laser light and the melting and gasification.

[0010] In some embodiments, k2 = k3 * k4 * k5, where: k3 is the influence coefficient of copper foil on CO2 laser light absorption rate and melting vaporization; k4 is the influence coefficient of glass fiber on CO2 laser light absorption rate and melting vaporization; and k5 is the influence coefficient of resin on CO2 laser light absorption rate and melting vaporization.

[0011] In some embodiments, k1=0.07; for conformal mask etching to create copper windows, k2=1; for copper foil with a thickness of 2μm and no browning treatment, k2=0.75; for copper foil with a thickness of 3μm and browning treatment, k2=0.87; for copper foil with a thickness of 5μm and browning treatment, k2=0.82; for glass fibers with thicknesses of 9μm, 11μm, and 14μm, k3=0.96; for glass fibers with thicknesses of 19μm, 20μm, 25μm, and 26μm, k3=0.92; for glass fibers with a thickness of 32μm, k3=0.88; for glass fibers with a thickness of 43μm, k3=0.85; for glass fibers with a thickness of 49μm, k3=0.81; K4=1. In some embodiments, the first laser energy satisfies the formula: M=E*Π*(k1*d m / 2) 2 / k6, where E is the energy density within the effective spot diameter of the laser beam, and k6 is the laser energy coefficient concentrated within the effective spot diameter.

[0012] In some embodiments, k6 = 86.5%; for the conformal mask etching process for creating copper windows, the optimal value range for E is 111.3~180.5 mj / mm. 2For copper foil with a thickness of 2μm and no browning treatment, the optimal value for E is 653.5 mj / mm. 2 The fluctuation range is ±5%; for copper foil with a thickness of 3μm and browning treatment, the optimal value for E is 545.6 mj / mm. 2 The allowable fluctuation range is ±5%; for 5μm thick copper foil with browning treatment, the optimal value for E is 698.3mj / mm. 2 The allowable fluctuation range is ±5%.

[0013] A second aspect of this application provides a packaging substrate, characterized in that the packaging substrate is processed by the packaging substrate drilling method described in any of the above embodiments.

[0014] The packaging substrate drilling method of this application naming laser drilling parameters and setting corresponding barcodes on the work order allows for automated retrieval of corresponding processing parameters by scanning the QR code. This avoids the problem of product scrapping due to incorrect parameter selection, reduces the time for selecting processing parameters, and improves processing efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a drilling method for a packaging substrate according to an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of the packaging substrate after the first step of ablation in an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the packaging substrate after the second step of ablation in an embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the packaging substrate after the third step of ablation in an embodiment of this application.

[0020] Figure label: Top copper foil 1; dielectric layer 2; bottom copper foil 3. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] refer to Figure 1 , Figure 1 This is a schematic diagram illustrating a method for drilling holes in a packaging substrate according to an embodiment of this application. The method for drilling holes in a packaging substrate includes: S1. A naming convention for laser drilling parameters has been established on the drilling equipment. The naming rules are based on the hole diameter type, surface copper foil treatment method, surface copper foil thickness, target hole diameter, dielectric layer thickness, dielectric layer material manufacturer, dielectric layer material model, and dielectric layer glass fiber series, and assign corresponding codes.

[0023] Specifically, Hole type: Code X indicates X-type through hole; code H indicates H-type through hole; code BVH indicates BVH blind hole; Surface copper foil treatment methods: C indicates CO2 laser drilling after conformal mask etching to open copper windows; D indicates CO2 laser drilling directly after DLD; B indicates CO2 laser drilling after browning of the copper surface. Surface copper foil thickness: 2, 3, and 5 represent 2um, 3um, and 5um, respectively; Target aperture: D60 indicates an aperture of 60µm; Dielectric layer thickness: T35 indicates that the thickness of the intermediate dielectric layer (resin glass fiber) is 35um; Dielectric layer glass fiber series: 1017 series with a thickness of 14um, 1027 series with a thickness of 19um, 1280 series with a thickness of 49um, etc.

[0024] For example, according to the above naming rules: BVH-B-3-D60-T40-1027 indicates that the CO2 laser drilling type of the processed packaging substrate is BVH blind hole, the surface copper foil treatment method is browning, the copper foil thickness is 3um, the target hole diameter is 60um, the thickness of the intermediate dielectric layer is 40um, and the dielectric layer glass fiber is 1027 series.

[0025] S2. For different products, formulate corresponding laser drilling process parameters on the drilling equipment. The laser drilling process parameters include laser energy and spot size.

[0026] S3. Set the corresponding barcode on the work order according to the naming rules of the laser drilling parameters.

[0027] S4. By scanning the barcode on the product with the barcode scanner on the drilling equipment, the drilling equipment automatically matches the corresponding laser drilling process parameters and processes the product.

[0028] The packaging substrate drilling method of this application naming laser drilling parameters and setting corresponding barcodes on the work order allows for automated retrieval of corresponding processing parameters by scanning the QR code. This avoids the problem of product scrapping due to incorrect parameter selection, reduces the time for selecting processing parameters, and improves processing efficiency.

[0029] In some embodiments, when setting corresponding laser drilling process parameters on the drilling equipment, the drilling equipment uses a pulsed laser beam to perform instantaneous high-temperature ablation on the substrate to remove copper foil, resin and glass fiber to form holes.

[0030] It should be noted that by using a pulsed laser beam to perform instantaneous high-temperature ablation on the substrate, the risk of a large heat-affected zone and deformation caused by continuous long-term ablation is avoided.

[0031] In some embodiments, reference Figures 2 to 4 The corresponding laser drilling process parameters for drilling equipment include: First step, refer to Figure 2 The first laser energy is set to remove the copper foil on the surface of the packaging substrate and form the initial ablation hole.

[0032] It should be noted that the first step requires setting a high energy parameter. After the copper foil on the surface of the packaging substrate absorbs the laser energy, it melts under instantaneous high temperature. At the same time, the resin and glass fiber under the copper foil absorb the laser energy and vaporize under instantaneous high temperature. The vaporization causes the resin and glass fiber to expand rapidly, which pushes the molten copper foil layer on the surface away to form the initial ablation hole.

[0033] Step 2, refer to Figure 3 A second laser energy is set to ablate and remove most of the resin and glass fiber in the intermediate dielectric layer of the packaging substrate to further deepen the ablation hole. The second laser energy is less than the first laser energy.

[0034] It should be noted that the second step requires setting medium energy parameters to ablate and remove most of the resin and glass fiber in the intermediate dielectric layer of the packaging substrate, in order to further deepen the ablation holes, while avoiding excessive ablation that would lead to product scrap.

[0035] Third step, refer to Figure 4 A third laser energy is set to ablate and remove the small amount of residual resin at the bottom of the ablation hole to form a complete through hole or blind hole. The third laser energy is less than the second laser energy.

[0036] It should be noted that the third step requires setting a lower energy parameter to ablate and remove the small amount of residual resin at the bottom of the hole, forming a complete through hole or blind hole, thus completing the drilling operation.

[0037] In some embodiments, when removing the copper foil from the surface of the encapsulation substrate and forming the initial ablation hole, a negative pressure device is used to remove the molten copper foil formed by the ablation removal, as well as the vaporized resin and glass fiber.

[0038] It should be noted that by removing the molten copper foil, vaporized resin, and glass fiber, these impurities are prevented from accumulating on the surface of the packaging substrate and affecting product quality. At the same time, these impurities are also prevented from accumulating on the drilling equipment and affecting normal laser drilling operations or even causing equipment damage.

[0039] In some embodiments, the aperture diameter of the drilling equipment satisfies the following relationship: d m =D / (k1*k2), where D is the target aperture, k1 is the effective spot diameter coefficient of the laser beam, and k2 is the comprehensive influence coefficient of the material on the absorption rate of CO2 laser light and the melting and gasification.

[0040] Furthermore, k2 = k3 * k4 * k5, where: k3 is the influence coefficient of copper foil on CO2 laser light absorption rate and melting vaporization; k4 is the influence coefficient of glass fiber on CO2 laser light absorption rate and melting vaporization; and k5 is the influence coefficient of resin on CO2 laser light absorption rate and melting vaporization.

[0041] It should be noted that the laser beam spot diameter is directly proportional to the set mask (aperture diameter in the CO2 laser drilling rig optical system), that is, the theoretical effective laser beam spot diameter d1 is proportional to the mask aperture diameter d. m The relationship is d1 = k1d m The different absorption rates of CO2 laser light by different materials such as copper foil, resin, and glass fiber, as well as the different thresholds for melting and vaporizing after absorbing laser energy, affect the actual hole size. Therefore, it is necessary to correct the actual drilling diameter D of the laser beam when processing different materials. Resin has the highest absorption rate of CO2 laser light, followed by glass fiber, and then copper foil. However, the threshold for melting and vaporizing is highest for copper foil, followed by glass fiber, and then lowest for resin. Therefore, k2 needs to be introduced to represent the comprehensive influence coefficient of the material's absorption rate of CO2 laser light and melting and vaporization, that is, D = k1d1, or D = k1k2d. m d m=D / (k1*k2). By selecting apertures of different diameters (1mm, 1.5mm, 2.0mm) and setting the same laser energy (2mJ), drilling tests were conducted on 2~3mm thick acrylic plates. After measuring the hole diameter on the processed acrylic plate corresponding to each aperture, the theoretical effective spot diameter d1 of the laser beam and the mask aperture diameter d were calculated. m The relationship is d1 = 0.07d m That is, k1=0.07.

[0042] For the conformal mask etching process for creating copper windows, since the copper layer of the target aperture is etched away using chemicals on the copper foil surface, laser drilling does not change the aperture size; therefore, k2 is set to 1. Through CO2 laser drilling aperture tests on copper foils with a thickness of 2μm without browning treatment, 3μm with browning treatment, and 5μm with browning treatment on the packaging substrate surface, it was found that: the untreated copper foil surface has extremely low laser light absorption, making it difficult for the copper foil to melt and vaporize. Therefore, for a 2μm thick copper foil without browning treatment, k2 is set to 0.75; for a 3μm thick copper foil with browning treatment, due to the high laser light absorption of the browning treatment and the low thickness of the copper foil, it is easy to melt and vaporize, so k2 is set to 0.87; for a 5μm thick copper foil with browning treatment, due to the high laser light absorption of the browning treatment but the high thickness of the copper foil, it is less likely to melt and vaporize, so k2 is set to 0.82.

[0043] By testing the hole diameter using CO2 laser drilling on different glass fiber types, the results showed that: for glass fibers with thicknesses of 9μm (glass fiber type #1006), 11μm (glass fiber type #1010), and 14μm (glass fiber type #1017), the k3 value was 0.96; for glass fibers with thicknesses of 19μm (glass fiber type #1027), 20μm (glass fiber type #1020), and 25μm (glass fiber type #1017), the k3 value was 0.96. For glass fibers with a thickness of #1037 and 26μm (glass fiber type #1030), the value of k3 is 0.92; for glass fibers with a thickness of 32μm (glass fiber type #1067), the value of k3 is 0.88; for glass fibers with a thickness of 43μm (glass fiber type #1078), the value of k3 is 0.85; and for glass fibers with a thickness of 49μm (glass fiber type #1080), the value of k3 is 0.81.

[0044] Because resin has the highest absorption rate of CO2 laser light and the lowest melting and vaporization threshold, the pore size and the effective spot size formed by the laser beam are basically the same when processing pure resin materials. In terms of the influence of different types of resin on the pore size, the pore size fluctuation tolerance was confirmed to be within ±5um during the test process of this invention. Therefore, the value of k3 is no longer subdivided according to different resin types, that is, the coefficient k3=1.0 is taken.

[0045] It should also be noted that for workpieces with copper windows created by conformal mask etching, the actual processing also needs to consider the alignment accuracy of the laser drilling machine (±0.005mm), the laser drilling accuracy (±0.01mm), and the exposure accuracy before creating the copper window by conformal mask etching (±0.01mm). The cumulative deviation affects the accuracy L=√(0.005²+0.01²+0.01²)=0.015mm. In order to ensure that the effective laser spot completely covers the target hole diameter of the copper window created by conformal mask etching during laser drilling, the effective laser spot diameter relative to the target hole diameter should be compensated by 0.015mm*2=0.03mm accuracy deviation.

[0046] In some embodiments, the first laser energy satisfies the formula: M=E*Π*(k1*d m / 2) 2 / k6, where E is the energy density within the effective spot diameter of the laser beam, and k6 is the laser energy coefficient concentrated within the effective spot diameter.

[0047] It should be noted that the laser energy set for laser drilling is partially concentrated within the effective spot diameter. Therefore, it is necessary to introduce a laser energy coefficient k6 concentrated within the effective spot diameter. According to the formula for energy density within the effective spot diameter, E = M*k6 / {Π*( k1d m From )² / 4}, we get M=E*Π*(k1*d m / 2) 2 / k6, because the CO2 laser drilling beam is a Gaussian beam, 86.5% of its energy is concentrated within the effective spot diameter; therefore, k6 is set to 86.5%. For the conformal mask etching process for creating copper windows, the laser only needs to process the resin and fiberglass layers in the intermediate substrate. The laser energy can be adjusted according to the fiberglass type (thickness). Experiments have shown that the optimal energy density range for CO2 laser drilling hole diameter is 111.3~180.5 mJ / mm. 2 By testing the CO2 laser drilling aperture of copper foil with a thickness of 2µm without browning treatment, 3µm with browning treatment, and 5µm with browning treatment on the surface of the packaging substrate, it was found that the untreated copper foil has an extremely low laser light absorption rate and is not easily melted and vaporized. For a 2µm thick copper foil without browning treatment, the optimal value of E is 653.5 mj / mm. 2 The fluctuation range is ±5%, meaning the optimal value range for E is 653.5 ± 5% mj / mm. 2 Because the surface browning treatment of copper foil results in high laser light absorption and the thin copper foil is prone to melting and vaporization, the optimal value for E is 545.6 mJ / mm for a 3μm thick, browned copper foil. 2 The fluctuation range is ±5%, meaning the optimal value range for E is 545.6 ± 5% mj / mm. 2The browning treatment on the copper foil surface results in high laser light absorption, and the thicker copper foil is less prone to melting and vaporization. For a 5μm thick copper foil with browning treatment, the optimal value for E is 698.3 mj / mm. 2 The fluctuation range is ±5%, meaning the optimal value range for E is 698.3 ± 5% mj / mm. 2 A second aspect of this application provides a packaging substrate, characterized in that the packaging substrate is processed by the packaging substrate drilling method of any of the above embodiments.

[0048] The packaging substrate of this application embodiment is processed by the packaging substrate drilling method of any of the above embodiments. The laser drilling parameters are named and the corresponding barcode is set on the work order. The corresponding processing parameters can be automatically retrieved by scanning the QR code, which avoids the problem of product scrapping due to incorrect parameter selection, reduces the time for selecting processing parameters, and improves processing efficiency.

[0049] In the description of this application, it should be understood that terms such as “first” and “second” are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0050] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0051] It should be understood that the terms "thickness," "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In the description of the present invention, unless otherwise stated, "a plurality of" means two or more.

[0052] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. At the same time, those skilled in the art will find that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for drilling holes in a packaging substrate, characterized in that, include: A naming convention for laser drilling parameters has been established on the drilling equipment. The naming rules are based on the hole diameter type, surface copper foil treatment method, surface copper foil thickness, target hole diameter, dielectric layer thickness, dielectric layer material manufacturer, dielectric layer material model, and dielectric layer glass fiber series, and assign corresponding codes accordingly. For different products, corresponding laser drilling process parameters are formulated for the drilling equipment. The laser drilling process parameters include laser energy and spot size. According to the naming rules of laser drilling parameters, set the corresponding barcode on the work order; By scanning the barcode on the product with a barcode scanner on the drilling equipment, the drilling equipment automatically matches the corresponding laser drilling process parameters and processes the product.

2. The method for drilling holes in a packaging substrate according to claim 1, characterized in that, When setting the corresponding laser drilling process parameters on the drilling equipment, the drilling equipment uses a pulsed laser beam to perform instantaneous high-temperature ablation on the substrate to remove copper foil, resin and glass fiber to form holes.

3. The method for drilling holes in a packaging substrate according to claim 1, characterized in that, The corresponding laser drilling process parameters for drilling equipment include: Set the first laser energy to remove the copper foil on the surface of the packaging substrate and form the initial ablation hole; A second laser energy is set to ablate and remove most of the resin and glass fiber in the intermediate dielectric layer of the packaging substrate to further deepen the ablation hole. The second laser energy is less than the first laser energy. A third laser energy is set to ablate and remove the small amount of residual resin at the bottom of the ablation hole to form a complete through hole or blind hole. The third laser energy is less than the second laser energy.

4. The method for drilling holes in a packaging substrate according to claim 3, characterized in that, When removing the copper foil from the surface of the packaging substrate and forming the initial ablation holes, a negative pressure device is used to remove the molten copper foil, vaporized resin, and glass fiber formed by the ablation process.

5. The method for drilling holes in a packaging substrate according to claim 3, characterized in that, The aperture diameter of the drilling equipment satisfies the following relationship: d m =D / (k1*k2), where D is the target aperture, k1 is the effective spot diameter coefficient of the laser beam, and k2 is the comprehensive influence coefficient of the material on the absorption rate of CO2 laser light and the melting and gasification.

6. The method for drilling holes in a packaging substrate according to claim 5, characterized in that, k2 = k3 * k4 * k5, where: k3 is the influence coefficient of copper foil on CO2 laser light absorption rate and melting vaporization; k4 is the influence coefficient of glass fiber on CO2 laser light absorption rate and melting vaporization; and k5 is the influence coefficient of resin on CO2 laser light absorption rate and melting vaporization.

7. The method for drilling holes in a packaging substrate according to claim 6, characterized in that, k1=0.07； For the process of creating copper windows using conformal mask etching, k2=1; for copper foil with a thickness of 2μm and no browning treatment, k2=0.75; for copper foil with a thickness of 3μm and browning treatment, k2=0.87; for copper foil with a thickness of 5μm and browning treatment, k2=0.

82. For glass fibers with thicknesses of 9μm, 11μm, and 14μm, k3 = 0.96; for glass fibers with thicknesses of 19μm, 20μm, 25μm, and 26μm, k3 = 0.92; for glass fibers with a thickness of 32μm, k3 = 0.88; for glass fibers with a thickness of 43μm, k3 = 0.85; and for glass fibers with a thickness of 49μm, k3 = 0.

81. K4=1。 8. The method for drilling holes in a packaging substrate according to claim 5, characterized in that, The first laser energy satisfies the formula: M=E*Π*(k1*d m / 2) 2 / k6, where E is the energy density within the effective spot diameter of the laser beam, and k6 is the laser energy coefficient concentrated within the effective spot diameter.

9. The method for drilling holes in a packaging substrate according to claim 8, characterized in that, k6=86.5%； For the process of creating copper windows using conformal mask etching, the optimal value range for E is 111.3~180.5 mj / mm. 2 For copper foil with a thickness of 2μm and no browning treatment, the optimal value for E is 653.5 mj / mm. 2 The fluctuation range is ±5%; for copper foil with a thickness of 3μm and browning treatment, the optimal value for E is 545.6 mj / mm. 2 The fluctuation range is ±5%; for copper foil with a thickness of 5μm and browning treatment, the optimal value for E is 698.3 mj / mm. 2 The fluctuation range is ±5%.

10. A packaging substrate, characterized in that, The packaging substrate is obtained by the packaging substrate drilling method according to any one of claims 1 to 9.

Images