OCA adhesive suitable for PC bonding, preparation method of OCA adhesive and adhesive film

Abstract

The invention discloses an OCA adhesive suitable for PC bonding, a preparation method of the OCA adhesive and an adhesive film. The OCA adhesive is prepared from the following components in parts by weight through a polymerization reaction: 40 to 55 parts of n-butyl acrylate, 5 to 30 parts of 2-ethylhexyl acrylate, 3 to 8 parts of isobornyl acrylate, 5 to 10 parts of hydroxyethyl acrylate, 10 to 20 parts of cyclohexyl methacrylate, 0.5 to 3 parts of acrylamide, 0.006 to 0.008 part of an initiator and 50 to 100 parts of a first solvent. According to the OCA adhesive suitable for PC bonding, the preparation method thereof and the adhesive film provided by the invention, the adhesive film can form firm bonding with a PC board, has high light transmittance and excellent weather resistance, and can effectively provide comprehensive and reliable protection for the PC board of an automobile. The cyclohexyl methacrylate used in the formula disclosed by the invention has excellent heat resistance, foaming resistance and rebound resistance, and can greatly relieve the problem that the existing PC board bonding OCA film is easy to blister at high temperature.

Description

Technical Field

[0001] This invention relates to the field of OCA adhesives, and particularly to an OCA adhesive suitable for bonding PC, its preparation method, and the adhesive film thereof. Background Technology

[0002] With the continuous development of electronic devices, the requirements for the assembly and bonding of components such as displays are becoming increasingly stringent. PC (polycarbonate) boards are widely used in electronic devices due to their excellent mechanical, optical, and thermal properties. When bonding PC boards to other components (such as displays and touchscreens), an adhesive with high light transmittance, good adhesion, weather resistance, and reliability is required. Optically transparent adhesives (OCAs) have important applications in the field of optical displays. However, traditional OCAs have some problems when used for bonding PC boards. For example, some OCAs have insufficient adhesion to PC boards and are prone to delamination after long-term use or environmental testing such as high and low temperature cycling; some OCAs have poor weather resistance, and their performance degrades in environments with ultraviolet radiation or high humidity, affecting the bonding effect and service life; moreover, existing OCAs, while meeting the high light transmittance requirements of PC boards, struggle to simultaneously achieve good mechanical and processing properties. Therefore, developing a high-performance OCA specifically for bonding PC boards is of significant practical importance. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a PC adhesive for bonding OCA, its preparation method and adhesive film, in order to address the shortcomings of the prior art.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: In the first aspect of the present invention, a PC-to-OCA adhesive is provided, which is prepared by polymerization reaction of the following components in parts by weight: 20-25 parts of n-butyl acrylate, 5-10 parts of isooctyl acrylate, 3-3.5 parts of isobornyl acrylate, 3.5-4.5 parts of hydroxyethyl acrylate, 5-10 parts of cyclohexyl methacrylate, 0.5-1 part of acrylamide, 0.006-0.008 parts of initiator, and 45-65 parts of ethyl acetate.

[0005] Preferably, the initiator is azobisisobutyronitrile.

[0006] Preferably, the first solvent is ethyl acetate.

[0007] A second aspect of the present invention provides a method for preparing a PC-to-OCA adhesive as described above, comprising the following steps: Isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent are mixed, nitrogen gas is introduced, and the mixture is heated and stirred. Then, a portion of the initiator is added, and the mixture is stirred while maintaining the temperature. The temperature is increased, the remaining initiator is added, the mixture is reacted, cooled, and the remaining first solvent is added. The mixture is stirred until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

[0008] Preferably, the preparation method of the adhesive suitable for bonding PC to OCA includes the following steps: Mix isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent. Purge with nitrogen and stir at 70-72°C for at least 30 minutes. Add a portion of the initiator and maintain the temperature while stirring for 1.5-6 hours. Raise the temperature to 75-76°C, add the remaining initiator, and react for 3-6 hours. Cool, add the remaining first solvent, and stir until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

[0009] In a third aspect, the present invention provides a PC bonding OCA adhesive film, which is obtained by coating and curing an adhesive, wherein the adhesive comprises the following raw material components by weight: 80-90 parts of the PC bonding OCA adhesive as described above, 0.02-0.08 parts of curing agent, and 10-20 parts of second solvent.

[0010] Preferably, the curing agent is an isocyanate curing agent, and the second solvent is toluene.

[0011] Preferably, the raw material components of the adhesive further include 0.015-0.06 parts by weight of antioxidant.

[0012] Preferably, the raw material components of the adhesive further include 0.15-0.6 parts by weight of silane coupling agent.

[0013] Preferably, the OCA adhesive film suitable for PC bonding is prepared by the following method: the raw material components for preparing the adhesive are mixed evenly, the resulting adhesive is evenly coated on the release film, dried at 110-130℃ for 2-10 min, another release film is attached to the adhesive surface, and cured at 60-80℃ for 24-96 h to obtain the OCA adhesive film suitable for PC bonding.

[0014] The beneficial effects of this invention are: This invention provides an OCA adhesive suitable for bonding PC, its preparation method, and the adhesive film. The adhesive film can form a strong bond with PC sheets, has high light transmittance and excellent weather resistance, and can effectively provide comprehensive and reliable protection for automotive PC sheets.

[0015] In the OCA adhesive formulation of this invention, by adding some heat-resistant (cyclohexyl methacrylate and acrylamide), high-viscosity (n-butyl acrylate and isooctyl acrylate), and anti-foaming (cyclohexyl methacrylate) monomers to the reaction system, the glass transition temperature of the acrylic adhesive is adjusted, resulting in an OCA film with excellent adhesion to automotive PC sheets. The cyclohexyl methacrylate used in the formulation of this invention has excellent heat resistance, anti-foaming, and anti-rebound properties, which can largely alleviate the problem of high-temperature bubbling of current OCA films for bonding PC sheets. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to embodiments, so that those skilled in the art can implement it based on the description.

[0017] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0018] Unless otherwise specified, the experimental methods used in the following examples are conventional methods. Unless otherwise specified, the materials and reagents used in the following examples are commercially available. For examples where specific conditions are not specified, conventional conditions or conditions recommended by the manufacturer are followed. For reagents or instruments whose manufacturers are not specified, they are all commercially available products.

[0019] This invention provides an adhesive suitable for bonding PC to OCA, which is prepared by polymerization reaction of the following components in parts by weight: 20-25 parts of n-butyl acrylate, 5-10 parts of isooctyl acrylate, 3-3.5 parts of isobornyl acrylate, 3.5-4.5 parts of hydroxyethyl acrylate, 5-10 parts of cyclohexyl methacrylate, 0.5-1 part of acrylamide, 0.006-0.008 parts of initiator, and 45-65 parts of ethyl acetate.

[0020] In a preferred embodiment, the initiator is azobisisobutyronitrile.

[0021] In a preferred embodiment, the first solvent is ethyl acetate.

[0022] A second aspect of the present invention provides a method for preparing the above-mentioned adhesive for bonding PC to OCA, comprising the following steps: Isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent are mixed, nitrogen gas is introduced, and the mixture is heated and stirred. Then, a portion of the initiator is added, and the mixture is stirred while maintaining the temperature. The temperature is increased, the remaining initiator is added, the mixture is reacted, cooled, and the remaining first solvent is added. The mixture is stirred until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

[0023] In a preferred embodiment, the preparation method of the adhesive suitable for bonding PC to OCA includes the following steps: Mix isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent. Purge with nitrogen and stir at 70-72°C for at least 30 minutes. Add a portion of the initiator and maintain the temperature while stirring for 1.5-6 hours. Raise the temperature to 75-76°C, add the remaining initiator, and react for 3-6 hours. Cool, add the remaining first solvent, and stir until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

[0024] In a third aspect, the present invention provides a PC bonding OCA adhesive film, which is obtained by coating and curing an adhesive, wherein the adhesive comprises the following raw material components by weight: 80-90 parts of the PC bonding OCA adhesive as described above, 0.02-0.08 parts of curing agent, and 10-20 parts of second solvent.

[0025] In a preferred embodiment, the curing agent is an isocyanate curing agent.

[0026] In a preferred embodiment, the second solvent is toluene.

[0027] In a preferred embodiment, the adhesive raw material components further include 0.015-0.06 parts by weight of antioxidant.

[0028] In a preferred embodiment, the raw material components of the adhesive further include 0.15-0.6 parts by weight of silane coupling agent.

[0029] In a preferred embodiment, the OCA adhesive film suitable for PC bonding is prepared by the following method: the raw material components for preparing the adhesive are mixed evenly, the resulting adhesive is uniformly coated on a release film, dried at 110-130°C for 2-10 min, another release film is attached to the adhesive surface, and cured at 60-80°C for 24-96 h to obtain the OCA adhesive film suitable for PC bonding.

[0030] The above is the general concept of the present invention. Based on this, detailed embodiments and comparative examples are provided below to further illustrate the present invention.

[0031] All component units below are parts by weight.

[0032] Example 1 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 15 parts of isooctyl acrylate, 50 parts of butyl acrylate, 7 parts of hydroxybutyl acrylate, 20 parts of cyclohexyl methacrylate, 8 parts of isobornyl acrylate, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Purge with nitrogen and stir at 70°C for 30 minutes. Then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0033] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive and mixed evenly. The resulting adhesive was coated on a release film with a thickness of 50μm and dried at 120℃ for 5min. Another release film was then attached to the adhesive surface and cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0034] Example 2 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 20 parts of isooctyl acrylate, 45 parts of butyl acrylate, 5 parts of hydroxybutyl acrylate, 20 parts of cyclohexyl methacrylate, 8 parts of isobornyl acrylate, 2 parts of acrylamide, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Purge with nitrogen and stir at 70°C for 30 minutes. Then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0035] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI and 20 parts of solvent were added to 90 parts of OCA adhesive and mixed evenly. The resulting adhesive was coated on a release film with a coating thickness of 50μm and dried at 120℃ for 5min. Another release film was then attached to the adhesive surface and cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0036] Example 3 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 20 parts of isooctyl acrylate, 45 parts of butyl acrylate, 5 parts of hydroxybutyl acrylate, 20 parts of cyclohexyl methacrylate, 8 parts of isobornyl acrylate, 2 parts of acrylamide, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0037] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of isocyanate curing agent HDI and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive and mixed evenly. The resulting adhesive was coated on a release film with a thickness of 50μm and dried at 120℃ for 5min. Another release film was then attached to the adhesive surface and cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0038] Example 4 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 20 parts of isooctyl acrylate, 45 parts of butyl acrylate, 7 parts of hydroxybutyl acrylate, 20 parts of cyclohexyl methacrylate, 8 parts of isobornyl acrylate, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0039] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI, 0.3 parts of silane coupling agent KH560 and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive. The mixture was stirred evenly, and the resulting adhesive was coated on a release film with a coating thickness of 50μm. It was dried at 120℃ for 5min, and another release film was attached to the adhesive surface. It was cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0040] Example 5 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 20 parts of isooctyl acrylate, 45 parts of butyl acrylate, 5 parts of hydroxybutyl acrylate, 20 parts of cyclohexyl methacrylate, 8 parts of isobornyl acrylate, 2 parts of acrylamide, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0041] A film suitable for bonding PC to OCA is prepared by the following method: Under conditions of 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI, 0.3 parts of silane coupling agent KH560, 0.5 parts of antioxidant 1010 and 20 parts of toluene were added to 90 parts of OCA adhesive. The mixture was stirred evenly, and the resulting adhesive was coated on a release film with a coating thickness of 50μm. It was dried at 120℃ for 5min, and another release film was attached to the adhesive surface. It was cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0042] Comparative Example 1 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 35 parts of isooctyl acrylate, 50 parts of butyl acrylate, 5 parts of hydroxybutyl acrylate, 8 parts of isobornyl acrylate, and 75 parts of ethyl acetate, and place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours to react. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0043] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive and mixed evenly. The resulting adhesive was coated on a release film with a thickness of 50μm and dried at 120℃ for 5min. Another release film was then attached to the adhesive surface and cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0044] Comparative Example 2 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 20 parts of isooctyl acrylate, 45 parts of butyl acrylate, 20 parts of cyclohexyl methacrylate, 5 parts of acrylic acid, 5 parts of isobornyl acrylate, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0045] A film suitable for bonding PC to OCA is prepared by the following method: Under conditions of 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI, 0.3 parts of silane coupling agent KH560, 0.5 parts of antioxidant 1010 and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive. The mixture was stirred evenly, and the resulting adhesive was coated on a release film with a coating thickness of 50μm. It was dried at 120℃ for 5min, and another release film was attached to the adhesive surface. It was cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0046] Comparative Example 3 An adhesive suitable for bonding PC to OCA is prepared by the following method: Accurately weigh 5 parts of isooctyl methacrylate, 28 parts of butyl acrylate, 10 parts of hydroxybutyl acrylate, 45 parts of isooctadecyl acrylate, 10 parts of isobornyl acrylate, 2 parts of acrylamide, and 75 parts of ethyl acetate. Place them in a four-necked flask equipped with a stirrer, condenser, and nitrogen tube. Stir at 70°C for 30 minutes, then add 0.002 parts of AIBN and maintain the temperature while stirring for 3 hours. Subsequently, raise the temperature to 75°C, add 0.001 parts of AIBN, and continue the reaction for 5 hours. After cooling, dilute with 55 parts of ethyl acetate to obtain OCA adhesive.

[0047] A film suitable for bonding PC to OCA is prepared by the following method: At 23~25℃ and 50±3% humidity, 0.03 parts of curing agent HDI and 20 parts of ethyl acetate were added to 90 parts of OCA adhesive and mixed evenly. The resulting adhesive was coated on a release film with a thickness of 50μm and dried at 120℃ for 5min. Another release film was then attached to the adhesive surface and cured at 70℃ for 48h to obtain an OCA adhesive film suitable for bonding PC.

[0048] Performance testing The following performance tests were performed on the OCA films prepared in the examples and comparative examples: Peel strength test at 20 min and 24 h: First, transfer PSA to 500 mm PET, then cut it into standard strips and attach them to the PC board. Roll it back and forth twice with a 2 kg roller (300 mm / min). Then place it at room temperature (23±2 ℃, relative humidity 50%) for 20 min and 24 h. Then use a universal tensile testing machine to peel it at 300 mm / min at 180°. Test 3 times and take the average value as the peel strength at 20 min and 24 h.

[0049] Residual testing method: The prepared protective film is adhered to the PC board and rolled back and forth twice with a 2 kg roller (300 mm / min). It is then placed in a 100 ℃ oven for 20 hours of aging. After aging, it is removed and left at room temperature for 2 hours. The film is then peeled off, and Nitto 31B tape is applied to the PC board and rolled back and forth twice with a 2 kg roller. After standing for 20 minutes, the peel strength is tested and recorded as A1. Standard Nitto 31B tape is adhered to the PC board and rolled back and forth twice with a 2 kg roller (300 mm / min). After standing for 20 minutes, the peel strength is tested and recorded as A2.

[0050] Residual SA% = (A1 / A2) × 100% The test results are shown in Table 1 below: Table 1 The test data in the table show that the prepared PC board bonding OCA film exhibits excellent performance, with stable peel force, high temperature resistance, no bubbling, and low residue.

[0051] A comparison of the examples and comparative examples illustrates that adding heat-resistant materials to the reaction system... The combination of highly viscous and anti-foaming monomers resulted in an OCA film with excellent adhesion to PC boards, meeting the requirements of low foaming residue at high temperatures while also maintaining good mechanical and processing properties.

[0052] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details.

Claims

1. An adhesive suitable for bonding PC to OCA, characterized in that, It is prepared by polymerization reaction of the following components in weight fractions: 20-25 parts of n-butyl acrylate, 5-10 parts of isooctyl acrylate, 3-3.5 parts of isobornyl acrylate, 3.5-4.5 parts of hydroxyethyl acrylate, 5-10 parts of cyclohexyl methacrylate, 0.5-1 part of acrylamide, 0.006-0.008 parts of initiator, and 45-65 parts of ethyl acetate.

2. The adhesive for bonding PC to OCA according to claim 1, characterized in that, The initiator is azobisisobutyronitrile.

3. The adhesive for bonding PC to OCA according to claim 1, characterized in that, The first solvent is ethyl acetate.

4. A method for preparing a PC-to-OCA adhesive as described in any one of claims 1-3, characterized in that, Includes the following steps: Isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent are mixed, nitrogen gas is introduced, and the mixture is heated and stirred. Then, a portion of the initiator is added, and the mixture is stirred while maintaining the temperature. The temperature is increased, the remaining initiator is added, the mixture is reacted, cooled, and the remaining first solvent is added. The mixture is stirred until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

5. The method for preparing the adhesive suitable for bonding PC to OCA according to claim 4, characterized in that, Includes the following steps: Mix isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, acrylamide, and a portion of the first solvent. Purge with nitrogen and stir at 70-72°C for at least 30 minutes. Add a portion of the initiator and maintain the temperature while stirring for 1.5-6 hours. Raise the temperature to 75-76°C, add the remaining initiator, and react for 3-6 hours. Cool, add the remaining first solvent, and stir until homogeneous to obtain an adhesive suitable for bonding PC to OCA.

6. A film suitable for bonding PC to OCA, characterized in that, It is obtained by coating and curing an adhesive, wherein the adhesive comprises the following raw material components by weight: 80-90 parts of the OCA adhesive for bonding PC as described in any one of claims 1-3, 0.02-0.08 parts of curing agent, and 10-20 parts of second solvent.

7. The adhesive film for bonding PC to OCA according to claim 6, characterized in that, The curing agent is an isocyanate curing agent, and the second solvent is toluene.

8. The adhesive film for bonding PC to OCA according to claim 6, characterized in that, The adhesive also includes 0.015-0.06 parts by weight of antioxidant.

9. The adhesive film for bonding PC to OCA according to claim 6, characterized in that, The adhesive also includes 0.15-0.6 parts by weight of silane coupling agent in its raw material components.

10. The adhesive film for bonding PC to OCA according to any one of claims 6-9, characterized in that, It is prepared by the following method: the raw material components for preparing the adhesive are mixed evenly, the resulting adhesive is evenly coated on the release film, dried at 110-130℃ for 2-10 min, another release film is attached to the adhesive surface, and cured at 60-80℃ for 24-96 h to obtain the adhesive film suitable for bonding PC to OCA.

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