Low-carbon two-component polyurethane pouring sealant for circuit board and preparation method of low-carbon two-component polyurethane pouring sealant

By designing a low-carbon two-component polyurethane potting compound, and utilizing a combination of PCE, bio-based polyols, and hydrophobic acrylate oligomers, the high carbon emissions and insufficient hydrophobicity of traditional potting compounds are solved, achieving high aging resistance and stable protection of circuit boards.

CN121699569AActive Publication Date: 2026-03-20SHANGHAI FUMING SEALING MATERIAL
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Patent Information

Application Number
CN202610212313.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-13
Publication Date
2026-03-20
Estimated Expiration
2046-02-13

AI Technical Summary

Technical Problem

Traditional polyurethane circuit board potting compounds have high carbon emissions during production and insufficient hydrophobic properties, making the circuit boards prone to moisture absorption and short circuits, and exhibiting poor aging resistance, thus failing to meet the long-term protection requirements of high-end electronic devices.

Method used

The low-carbon two-component polyurethane potting compound uses PCE and bio-based polyols as raw materials, combined with hydrophobic acrylate oligomers to form a dual hydrophobic barrier of physical and chemical properties, improving aging resistance, and controlling the crosslinking density to balance rigidity and elasticity.

Benefits of technology

It significantly reduces water absorption, improves tensile strength and hardness, extends the service life of circuit boards in high temperature and humid environments, and meets the circuit board protection needs of complex environments.

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Abstract

The invention relates to the field of electric appliance potting materials, in particular to a low-carbon two-component polyurethane potting adhesive for a circuit board and a preparation method of the low-carbon two-component polyurethane potting adhesive. The preparation raw materials of the low-carbon double-component polyurethane pouring sealant for the circuit board comprise a component A and a component B, wherein the component A is prepared from the following raw materials: isocyanate, a flame retardant and a plasticizer; and the component B is prepared from the following raw materials: PCE, castor oil, a hydrophobic acrylate oligomer, a catalyst and a defoaming agent. The PCE and the castor oil are used as core raw materials, and the low-carbon and environment-friendly characteristics are achieved; by introducing the hydrophobic acrylate oligomer and combining the structural advantages of PCE, the water absorption rate of the product is remarkably reduced, meanwhile, the product has balanced mechanical properties and excellent aging resistance, the pouring sealant can effectively protect a circuit board from being affected by environments such as moisture and high temperature, and the actual use effect is excellent.
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