Hard coating composition, method for manufacturing window, and electronic device

Abstract

The hard coating composition includes a solvent and a hard coating solid matter. The hard coating solid substance comprises a silsesquioxane compound, a free radical polymerization initiator and a cationic polymerization initiator, the silsesquioxane compound comprises a free radical polymerizable functional group and a cationic polymerizable functional group, the free radical polymerizable functional group comprises a (meth) acrylate group, and the cationic polymerizable functional group comprises a (meth) acrylate group. The cationically polymerizable functional group includes an oxetane group. A method of manufacturing a window includes applying a hard coating composition on a base layer to form a preliminary hard coating; drying the preliminary hard coating to remove the solvent; and curing the dried preliminary hard coating layer to form the hard coating layer. The electronic device comprises a window manufactured by the method and a power module for supplying power.

Description

Technical Field

[0001] The embodiments relate to hard coating compositions. More specifically, the embodiments relate to hard coating compositions for manufacturing hard coatings, methods for manufacturing windows including hard coatings, and electronic devices including windows. Background Technology

[0002] Various types of display devices are used to provide image information. A display device may include a display panel that displays the image and a window that protects the display panel. Users view the image displayed on the display panel through the window.

[0003] Windows can include various layers to improve durability and prevent fingerprints, etc. For example, a window can include a base layer and a hard coating disposed on the base layer. The hard coating can be used to improve durability, such as the hardness of the base layer. Summary of the Invention

[0004] The embodiments provide a hard coating composition for forming a hard coating.

[0005] The implementation provides a method for manufacturing a window, the window comprising a hard coating formed using a hard coating composition, and having improved flexibility and durability.

[0006] However, the implementation methods are not limited to those described herein. The above and other implementation methods will become more apparent to those skilled in the art upon which this disclosure pertains by referring to the following detailed description of this disclosure.

[0007] The hard coating composition according to the embodiment includes a solvent and a hard coating solids. The hard coating solids include a silsesquioxane compound, a radical polymerization initiator, and a cationic polymerization initiator, wherein the silsesquioxane compound contains radical polymerizable functional groups and cationic polymerizable functional groups, the radical polymerizable functional groups including (meth)acrylate groups, and the cationic polymerizable functional groups including oxetane groups.

[0008] In the implementation scheme, the free radical polymerizable functional group can be an EO (ethylene oxide) modified isocyanuric acid diacrylate group, and the cationic polymerizable functional group can be a 2-ethylhexyloxetane group.

[0009] In the embodiments, the silsesquioxane compound may contain radical polymerizable functional groups and cationic polymerizable functional groups in a ratio of about 5:5 to about 6:4.

[0010] In the implementation scheme, the free radical polymerization initiator may be diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide.

[0011] In the implementation scheme, the cationic polymerization initiator may be triarylsulfonium hexafluoroantimonate.

[0012] In an embodiment, relative to 100% of the hard coating solids, the hard coating composition may comprise about 80 wt% to about 91 wt% of a silsesquioxane compound, about 1 wt% to about 2 wt% of a free radical polymerization initiator, and about 0.5 wt% to about 1 wt% of a cationic polymerization initiator.

[0013] In the implementation scheme, the hard coating solid material may further include silica nanoparticles.

[0014] In the implementation scheme, the average diameter of the silica nanoparticles can be from about 20 nm to about 60 nm.

[0015] In an embodiment, the hard coating composition may contain about 3 wt% to about 14 wt% of silica nanoparticles relative to 100 wt% of hard coating solids.

[0016] In the implementation scheme, the sesquioxane compound may have a random structure.

[0017] The method for manufacturing a window according to the embodiment includes applying a hard coating composition comprising a solvent and a hard coating solids material onto a substrate layer to form a preliminary hard coating, drying the preliminary hard coating to remove the solvent, and curing the dried preliminary hard coating to form a hard coating. The hard coating solids material includes a silsesquioxane compound, a free radical polymerization initiator, and a cationic polymerization initiator. The silsesquioxane compound contains free radical polymerizable functional groups and cationic polymerizable functional groups. The free radical polymerizable functional groups include (meth)acrylate groups, and the cationic polymerizable functional groups include oxetane groups.

[0018] In the implementation scheme, the free radical polymerizable functional group can be an EO (ethylene oxide) modified isocyanuric acid diacrylate group, and the cationic polymerizable functional group can be a 2-ethylhexyloxetane group.

[0019] In the embodiments, the silsesquioxane compound may contain radical polymerizable functional groups and cationic polymerizable functional groups in a ratio of about 5:5 to about 6:4.

[0020] In the embodiments, the free radical polymerization initiator may be diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and the cationic polymerization initiator may be triarylsulfonium hexafluoroantimonate.

[0021] In an embodiment, relative to 100 wt% of the hard coating solids, the hard coating composition may comprise about 80 wt% to about 91 wt% of a silsesquioxane compound, about 1 wt% to about 2 wt% of a free radical polymerization initiator, and about 0.5 wt% to about 1 wt% of a cationic polymerization initiator.

[0022] In the implementation scheme, the hard coating solid material may further include silica nanoparticles.

[0023] In an embodiment, curing of the dried preliminary hard coating that forms the hard coating may include photocuring the dried preliminary hard coating.

[0024] In the implementation, the curing of the dried preliminary hard coating that forms the hard coating may further include heat curing the dried preliminary hard coating.

[0025] In the implementation scheme, the sesquioxane compound may have a random structure.

[0026] The electronic device according to the implementation scheme includes a window manufactured by the method of manufacturing a window according to the implementation scheme and a power module for power supply.

[0027] In a hard coating formed from a hard coating composition according to an embodiment, the hard coating can have improved flexibility and hardness. Therefore, windows including a hard coating can be suitably used in foldable electronic devices. Attached Figure Description

[0028] Figure 1 , Figure 2 and Figure 3 This is a schematic perspective view illustrating an electronic device according to an embodiment.

[0029] Figure 4 It is along Figure 1 A schematic cross-sectional view taken by line I-I'.

[0030] Figure 5 Examples are shown including Figure 4 A schematic cross-sectional view of a display panel in an electronic device.

[0031] Figure 6 Examples are shown including Figure 4 A schematic cross-sectional view of a window in an electronic device.

[0032] Figure 7 This is a schematic block diagram illustrating an electronic device according to an implementation scheme.

[0033] Figure 8 This is a schematic view illustrating an electronic device according to an embodiment. Detailed Implementation

[0034] In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of various embodiments or implementations of the invention. As used herein, “implementation” and “implementation” are interchangeable terms and are non-limiting examples of the apparatus or methods disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details, or may be practiced with one or more equivalent arrangements. These embodiments are not necessarily exclusive or limiting of this disclosure. For example, a particular shape, configuration, and characteristic of an embodiment may be used or implemented in another embodiment.

[0035] Unless otherwise specified, the illustrated embodiments should be understood as providing features of the invention. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, areas and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the scope of the invention.

[0036] The use of crosshairs and / or shading in the accompanying drawings generally serves to clarify the boundaries between adjacent elements. Thus, the presence or absence of crosshairs or shading does not express or indicate any preference or need for particular materials, material properties, dimensions, scales, commonalities between illustrated elements, and / or any other characteristics, properties, etc., of the elements, unless otherwise specified. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be enlarged for clarity and / or descriptive purposes. When embodiments can be implemented differently, the specific sequence of processes may differ from the order in which they are described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Moreover, the same reference numerals denote the same elements.

[0037] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, it can be directly on, directly connected to, or directly bonded to another component or layer, or there can be an intermediate component or layer. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to," there is no intermediate component or layer. Therefore, the term "connection" can refer to a physical connection, an electrical connection, and / or a fluid connection, with or without an intermediate component. Furthermore, the first direction axis DR1, the second direction axis DR2, and the third direction axis D3 are not limited to the three axes of a Cartesian coordinate system, such as the X-axis, Y-axis, and Z-axis, and can be interpreted in a broader sense. For example, the first direction axis DR1, the second direction axis DR2, and the third direction axis D3 can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of A and B" can be understood to mean only A, only B, or any combination of A and B. Furthermore, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0038] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0039] Spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “above,” “higher than,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thereby describe the relationship between one element and another, as illustrated in the accompanying drawings. Spatial relative terms are also intended to cover different orientations of the equipment in use, operation, and / or manufacture, other than those described in the drawings. For example, if the equipment in the drawings is flipped, an element described as “below” or “under” other elements or features would be oriented “above” those elements or features. Thus, the term “below” can cover both above and below orientations. Furthermore, the equipment may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and in such cases, the spatial relative descriptors used herein should be interpreted accordingly.

[0040] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Furthermore, the terms “comprises,” “comprising,” “includes,” and / or “including”, when used in this specification, specify the presence of a given feature, integer, step, operation, element, component, and / or group thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations rather than terms of degree, and thus to explain the inherent deviations in measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±20%, ±10%, or ±5% of the specified value.

[0041] Various embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of embodiments and / or intermediate structures. Therefore, variations in the shapes of the illustrations should be expected due to, for example, manufacturing techniques and / or tolerances. Consequently, the embodiments disclosed herein should not necessarily be interpreted as limited to the specific illustrative shapes of the areas, but should include deviations in shape resulting from, for example, manufacturing processes. In this way, the areas illustrated in the figures can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and thus are not necessarily intended to be limiting.

[0042] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings as functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented via electronic (or optical) circuitry (e.g., logic circuitry), discrete components, microprocessors, hardwired circuitry, memory elements, wiring connections, etc., which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented via microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can optionally be driven by firmware and / or software. It is also conceivable that each block, unit, and / or module can be implemented via dedicated hardware, or as a combination of dedicated hardware performing some functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, without departing from the scope of the invention, each block, unit, and / or module in some embodiments may be physically divided into two or more interactive and discrete blocks, units, and / or modules. Furthermore, without departing from the scope of the present invention, some implementation blocks, units and / or modules can be physically combined into more complex blocks, units and / or modules.

[0043] Figure 1 , Figure 2 and Figure 3 This is a schematic perspective view illustrating an electronic device according to an embodiment.

[0044] refer to Figure 1 , Figure 2 and Figure 3 The electronic device (ED) can be a device activated by an electrical signal. For example, the electronic device (ED) can be a small electronic device, such as a smartphone, mobile phone, smartwatch, game console, camera, etc., but the implementation is not limited to this. Figure 1 , Figure 2 and Figure 3 An example of a small electronic device is a foldable smartphone.

[0045] like Figure 1 As illustrated, an electronic device ED may include a display surface for displaying an image IM. For example, the display surface may be substantially parallel to a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. The electronic device ED may display the image IM on a third direction DR3 that is substantially parallel to the normal direction of the display surface. For example, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2. Hereinafter, the third direction DR3 may be referred to as the thickness direction.

[0046] An electronic device ED may include a display area DA and a non-display area NDA. The display area DA may be an area that generates light. The non-display area NDA may be located around the display area DA. For example, in a plan view, the non-display area NDA may surround at least a portion of the display area DA. In one embodiment, the non-display area NDA may be an area where no image is displayed. However, the embodiment is not limited to this, and an image may be displayed in at least a portion of the non-display area NDA.

[0047] The electronic device ED can be a foldable electronic device that can be folded or unfolded. The electronic device ED can include a folded region FA and non-folded regions NFA1 and NFA2. The folded region FA and the non-folded regions NFA1 and NFA2 can be defined depending on whether the electronic device ED is folded. The folded region FA can be the area where the electronic device ED is folded, and the non-folded regions NFA1 and NFA2 can be the areas where the electronic device ED is not folded.

[0048] In the implementation plan, such as Figure 1 As illustrated, the electronic device ED may include a first non-folding region NFA1 and a second non-folding region NFA2 spaced apart from each other. A folding region FA may be located between the first non-folding region NFA1 and the second non-folding region NFA2. Although Figure 1 An example of an electronic device ED includes one folded region and two non-folded regions. The implementation is not limited thereto, and the electronic device ED may include two or more folded regions and three or more non-folded regions.

[0049] In the implementation scheme, the folded region FA may extend in the second direction DR2. The second non-folded region NFA2 may be spaced apart from the first non-folded region NFA1 in the first direction DR1. Figure 2 and Figure 3 As illustrated, the electronic device ED can be folded relative to a folding axis FX extending in the second direction DR2. The electronic device ED can be folded such that the first non-folding region NFA1 and the second non-folding region NFA2 face each other relative to the folding region FA. The folding region FA can be folded to have curvature.

[0050] although Figure 2 and Figure 3 The example shows that the folding region FA and the folding axis FX extend in the direction of the long side of the electronic device ED, but the implementation is not limited to this, and the folding region FA and the folding axis FX may extend in the direction of the short side of the electronic device ED.

[0051] In the implementation plan, such as Figure 2As illustrated, the inwardly foldable electronic device ED prevents the display surface of the image IM from being exposed to the outside. In an embodiment, such as... Figure 3 As illustrated, the outwardly foldable electronic device ED allows the display surface of the image IM to be exposed to the outside.

[0052] Figure 4 It is along Figure 1 A schematic cross-sectional view taken by line I-I'. Figure 5 Examples are shown including Figure 4 A schematic cross-sectional view of a display panel in an electronic device.

[0053] refer to Figure 1 , Figure 4 and Figure 5 Electronic devices (EDs) may include a display panel (DP), a protective layer (PF), a support member (SM), and a window (WD).

[0054] As described above, the electronic device ED may include a first non-folding region NFA1, a second non-folding region NFA2, and a folding region FA. Each of the display panel DP, the protective layer PF, the support member SM, and the window WD may include the first non-folding region NFA1, the second non-folding region NFA2, and the folding region FA.

[0055] The protective layer PF and the support member SM may be arranged below the display panel DP (e.g., in the direction opposite to the third direction DR3), and the window WD may be arranged on the display panel DP (e.g., in the third direction DR3).

[0056] The display panel DP may include pixels that generate an image. Pixels may be arranged in the display area DA. Light emitted from each of the pixels may be combined to generate an image. Each of the pixels may include pixel circuitry and a light-emitting element LED, the pixel circuitry including at least one transistor TR. The pixel circuitry may further include at least one capacitor.

[0057] The display panel DP may include a substrate SUB, a buffer layer BFL, pixels, insulating layers IL1, IL2 and IL3, a pixel limiting layer PDL and an encapsulation layer ENC.

[0058] A substrate SUB can form the base of a display panel (DP). The substrate SUB can be an insulating substrate formed of transparent or opaque materials. The substrate SUB can include plastic and be flexible. The substrate SUB can have a single-layer or multi-layer structure.

[0059] A buffer layer (BFL) can be disposed on the substrate (SUB). The buffer layer (BFL) prevents impurities such as oxygen and moisture from diffusing through the substrate (SUB) to the upper part of the substrate (SUB). For example, the buffer layer (BFL) can contain inorganic insulating materials, such as silicon compounds or metal oxides. For instance, the buffer layer (BFL) can contain silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon nitride oxide (SiO) x N y ), silicon carbide (SiO) x C y ), silicon carbide (SiC) x N y ), aluminum oxide (AlO) x ), aluminum nitride (AlN) x ), tantalum oxide (TaO) x ), hafnium oxide (HfO) x ), zirconium oxide (ZrO x ), titanium oxide (TiO) x These can be used individually or in combination with each other.

[0060] The transistor TR can be disposed on the buffer layer BFL. The transistor TR may include an active layer ACT, a gate electrode GE, a first contact electrode SE, and a second contact electrode DE.

[0061] The active layer ACT can be disposed on the buffer layer BFL. The active layer ACT can comprise oxide semiconductors, silicon semiconductors, etc. For example, the oxide semiconductor can include at least one oxide selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor can include amorphous silicon, polycrystalline silicon, etc. The active layer ACT can include a first contact region S, a second contact region D, and a channel region CH between the first contact region S and the second contact region D. The first contact region S and the second contact region D can have higher conductivity than the channel region CH.

[0062] The first insulating layer IL1 can be disposed on the active layer ACT. The first insulating layer IL1 can cover the active layer ACT on the buffer layer BFL. For example, the first insulating layer IL1 can contain an inorganic insulating material.

[0063] The gate electrode GE can be disposed on the first insulating layer IL1. The gate electrode GE can overlap the channel region CH of the active layer ACT in a plan view. The gate electrode GE can contain materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, and transparent conductive materials. For example, the gate electrode GE can contain gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), aluminum-containing alloys, silver-containing alloys, copper-containing alloys, molybdenum-containing alloys, and aluminum nitrides (AlN). x ), tungsten nitride (WN) x ), titanium nitride (TiN) x ), chromium nitride (CrN) x ), tantalum nitride (TaN) x ), SrRuO x ), zinc oxide (ZnO) x Indium tin oxide (ITO), tin oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x Indium zinc oxide (IZO), etc. These can be used alone or in combination with each other.

[0064] The second insulating layer IL2 can be disposed on the gate electrode GE. The second insulating layer IL2 can cover the gate electrode GE on the first insulating layer IL1. The second insulating layer IL2 can contain inorganic insulating material.

[0065] The first contact electrode SE and the second contact electrode DE can be disposed on the second insulating layer IL2. The first contact electrode SE and the second contact electrode DE can be connected to the first contact region S and the second contact region D of the active layer ACT, respectively. Each of the first contact electrode SE and the second contact electrode DE can contain a conductive material.

[0066] The third insulating layer IL3 can be disposed on the first contact electrode SE1 and the second contact electrode DE. For example, the third insulating layer IL3 can comprise an organic insulating material. For example, the third insulating layer IL3 can comprise photoresist, polyacryl-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acrylic-based resin, epoxy-based resin, etc. These can be used individually or in combination with each other.

[0067] The light-emitting element (LED) can be disposed on the third insulating layer IL3. The LED may include a first electrode E1, an intermediate layer ML, and a second electrode E2.

[0068] The first electrode E1 can be disposed on the third insulating layer IL3. The first electrode E1 can contain a conductive material. The first electrode E1 can be electrically connected to the transistor TR. For example, the first electrode E1 can be connected to the second contact electrode DE (or the first contact electrode SE) through a contact hole formed in the third insulating layer IL3. For example, the first electrode E1 can be used as the anode of the light-emitting element LED (or function as the anode of the light-emitting element LED).

[0069] A pixel defining layer (PDL) may be disposed on the first electrode E1. The PDL may cover the peripheral portion of the first electrode E1 and may define a pixel opening that exposes the central portion of the first electrode E1. The light-emitting area may be defined by the pixel opening. For example, the PDL may comprise an organic insulating material. In an embodiment, the PDL may further comprise an inorganic or organic material, wherein the inorganic or organic material comprises a light-blocking material having a black color.

[0070] An intermediate layer ML can be disposed on the first electrode E1 and the pixel defining layer PDL. A portion of the intermediate layer ML can be disposed in a pixel opening of the pixel defining layer PDL. In an embodiment, the intermediate layer ML may include a first functional layer comprising an organic material, a light-emitting layer disposed on the first functional layer and comprising a light-emitting material, and a second functional layer disposed on the light-emitting layer and comprising an organic material. For example, the first functional layer may include a hole injection layer, a hole transport layer, etc., and the second functional layer may include an electron transport layer, an electron injection layer, etc. For example, the light-emitting layer may comprise at least one of an organic light-emitting material and quantum dots.

[0071] The second electrode E2 can be disposed on the intermediate layer ML. For example, the second electrode E2 can contain a conductive material. For example, the second electrode E2 can be used as the cathode of a light-emitting element LED (or function as the cathode of a light-emitting element LED).

[0072] An encapsulation layer ENC can be disposed on the second electrode E2. The encapsulation layer ENC may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the encapsulation layer ENC may include a first inorganic encapsulation layer IEL1 disposed on the second electrode E2, an organic encapsulation layer OEL disposed on the first inorganic encapsulation layer IEL1, and a second inorganic encapsulation layer IEL2 disposed on the organic encapsulation layer OEL. For example, various functional layers (e.g., touch sensing layer, color filter layer, light collecting layer, etc.) may be additionally disposed on the encapsulation layer ENC.

[0073] A protective layer PF can be disposed below the display panel DP. The protective layer PF protects the lower surface of the display panel DP. In embodiments, the protective layer PF can comprise plastic and can be flexible. For example, the protective layer PF can comprise (or may be) a polyethylene terephthalate (PET) film or a polyimide (PI) film, but embodiments are not limited thereto.

[0074] The support member SM can be arranged below the protective layer PF. The support member SM can support the display panel DP and prevent deformation of the display panel DP due to external impacts. In the implementation, the support member SM can include various functional layers, such as a buffer layer, a shielding layer, a heat dissipation layer, a support plate, etc.

[0075] A window WD can be mounted on the display panel (DP). The window WD can cover the entire upper surface of the display panel (DP) (e.g., the display surface). The window WD protects the display panel from external impacts. The window WD can be flexible, thus folding according to the folding of the electronic device (ED). The window WD will be described in detail below.

[0076] like Figure 4 As illustrated, adhesive layers AD1, AD2, and AD3 can be disposed between various components of the electronic device ED. For example, a first adhesive layer AD1 can be disposed between the display panel DP and the window WD to bond the display panel DP and the window WD; a second adhesive layer AD2 can be disposed between the display panel DP and the protective layer PF to bond the display panel DP and the protective layer PF; and a third adhesive layer AD3 can be disposed between the protective layer PF and the support member SM to bond the protective layer PF and the support member SM. For example, each of adhesive layers AD1, AD2, and AD3 may include (or may be) a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, an optically clear resin (OCR), etc.

[0077] For example, the electronic device ED may further include a housing integrated with a window WD. The housing can be integrated with the window WD to provide internal space. The display panel DP, protective layer PF, and support members SM can be accommodated within the internal space provided between the housing and the window WD. The housing can stably protect the components housed within the internal space from external impacts.

[0078] Figure 6 Examples are shown including Figure 4 A schematic cross-sectional view of a window in an electronic device.

[0079] refer to Figure 6 The window WD may include a substrate layer BL, a hard coating HC, an anti-reflective layer ARL, and an anti-fingerprint layer AF.

[0080] In this embodiment, the substrate layer BL may comprise a plastic film and may be flexible. For example, the substrate layer BL may be a polyethylene terephthalate (PET) film or a polyimide (PI) film, but the embodiment is not limited thereto.

[0081] A rigid coating HC can be disposed on the substrate layer BL. In an embodiment, the rigid coating HC can be disposed (e.g., directly disposed) on the upper surface of the substrate layer BL. The rigid coating HC can have relatively high hardness. For example, the hardness of the rigid coating HC can be greater than the hardness of the substrate layer BL. The rigid coating HC can increase the durability of the window WD, thereby effectively protecting the display panel DP from external impacts. For example, the rigid coating HC can have relatively high flexibility. The rigid coating HC can be flexible and thus foldable.

[0082] In some embodiments, the hard coating HC can be formed from a hard coating composition, which may include a solvent and a hard coating solid, which may include a polymer compound and a polymerization initiator. In some embodiments, the hard coating HC can be formed from a polymer compound, a polymerization initiator, and silica nanoparticles. In some embodiments, the thickness of the hard coating HC can be from about 3 micrometers (μm) to about 5 μm, but the embodiments are not limited thereto. The hard coating HC will be described later along with methods for manufacturing windows (WD).

[0083] An anti-reflective layer (ARL) can be disposed on a rigid coating (HC). The ARL reduces the reflectivity of external light through the window (WD). In an embodiment, the ARL may include high-refractive-index layers and low-refractive-index layers. The refractive index of each of the high-refractive-index layers may be greater than the refractive index of each of the low-refractive-index layers.

[0084] High-refractive-index layers and low-refractive-index layers can be in the thickness direction (e.g., along the thickness direction). Figure 1 The third-party DR3) layers are stacked alternately. In an embodiment, the anti-reflective layer ARL may include a total of three or more high-refractive-index layers and low-refractive-index layers stacked alternately in the thickness direction. For example, the anti-reflective layer ARL may include a total of five high-refractive-index layers and low-refractive-index layers stacked alternately in the thickness direction, but the embodiment is not limited thereto.

[0085] In the implementation scheme, each of the high refractive index layers may contain titanium niobium oxide (Ti). x Nb y O z For example, each of the high refractive index layers may contain Ti. 14 Nb3O 35 However, the implementation plan is not limited to this.

[0086] In the implementation scheme, each of the low-refractive-index layers may contain silicon oxide (Si). x O y For example, each of the low-refractive-index layers may contain SiO2, but the implementation is not limited to this.

[0087] An anti-fingerprint layer AF can be disposed on an anti-reflective layer ARL. The anti-fingerprint layer AF prevents fingerprints from forming on the upper surface of the electronic device ED. For example, the anti-fingerprint layer AF can include metal oxides, silicon-based compounds, fluorine-based compounds, etc. In another example, at least one of the anti-reflective layer ARL and the anti-fingerprint layer AF can be omitted.

[0088] The method for manufacturing the window WD according to the implementation plan will be described in detail below.

[0089] First, a hard coating composition can be prepared. In one embodiment, the hard coating composition may comprise a solvent and a hard coating solid, the hard coating solid comprising a polymer compound and a polymerization initiator. In another embodiment, the hard coating composition may comprise a solvent, a polymer compound, a polymerization initiator, and silica nanoparticles. In this document, the phrase "hard coating solid" can refer to all components in the hard coating composition other than the solvent, such as the polymer compound, the polymerization initiator, and the silica nanoparticles.

[0090] In embodiments, the solvent may include ketone-based solvents or alcohol-based solvents. For example, the solvent may include at least one of 2-butanone (MEK) and 1-methoxy-2-methyl-2-propanol (PGM). For example, a mixture of MEK and PGM may be used as a solvent, or MEK or PGM may be used alone as a solvent. The weight ratio of the solvent relative to 100 wt% of the hard coating composition may be from about 70 wt% to about 90 wt%. However, this is an example, and embodiments are not limited thereto.

[0091] The polymer compound can be a polymerizable compound containing polymerizable functional groups. In an embodiment, the polymer compound can be a silsesquioxane compound containing polymerizable functional groups. For example, the polymer compound can be a silsesquioxane compound represented by Formula 1.

[0092] [Formula 1]

[0093] In Formula 1, each of R1 and R2 can be a polymerizable functional group. R1 and R2 can be different polymerizable functional groups. In an embodiment, R1 can be a radical polymerizable functional group, and R2 can be a cationic polymerizable functional group. In an embodiment, R1 can include a (meth)acrylate group, and R2 can include an oxetyl group.

[0094] In the embodiments, the free radical polymerizable functional group (i.e., R1) can be an EO (ethylene oxide) modified isocyanuric acid diacrylate group, and the cationic polymerizable functional group (i.e., R2) can be a 2-ethylhexyloxetane group.

[0095] The radical-polymerizable functional group and the cationic-polymerizable functional group can be functional groups with different properties for the hard coating HC. In an embodiment, the radical-polymerizable functional group can be a functional group that improves the hardness of the hard coating HC, and the cationic-polymerizable functional group can be a functional group that improves the flexibility of the hard coating HC. In an embodiment, the silsesquioxane compound can contain radical-polymerizable and cationic-polymerizable functional groups in a ratio of about 5:5 to about 6:4.

[0096] However, the embodiments are not limited to polymer compounds containing two functional groups (i.e., R1 and R2), and for example, the polymer compound may further contain functional groups that do not react with each of the two functional groups. In an embodiment, the functional group may be a functional group containing an oxetyl group in the main chain and a (meth)acrylate group in the side chain. The oxetyl group may further improve the flexibility of the hard coating HC, and the acrylate group may further improve the hardness of the hard coating HC. For example, the functional group may be a functional group represented by Formula 2, but this is an example, and the embodiments are not limited thereto.

[0097] [Equation 2]

[0098] In the implementation scheme, as shown in Formula 1, the silsesquioxane compound can have a random structure. When the silsesquioxane compound has a random structure, the hardness and flexibility of the hard coating HC can be relatively improved compared to when the silsesquioxane compound has a different structure.

[0099] However, the implementation is not limited to this, and the silsesquioxane compound can have various structures, such as ladder structures, complete or incomplete cage structures, etc. When the silsesquioxane compound has a structure other than a random structure, the silsesquioxane compound can contain radical polymerizable functional groups and cationic polymerizable functional groups in a ratio of about 5:5 to about 6:4.

[0100] Polymer initiators can initiate the polymerization reaction of polymer compounds. In embodiments, polymerization initiators may include free radical polymerization initiators and cationic polymerization initiators. Free radical polymerization initiators can generate free radicals by light, and therefore, can photocurable hard coating compositions. Cationic polymerization initiators can generate cations by light and / or heat, and therefore, can photocurable and / or thermally cured hard coating compositions.

[0101] In an embodiment, the hard coating composition may comprise a solvent and a hard coating solid substance, the hard coating solid substance may comprise a silsesquioxane compound, a free radical polymerization initiator and a cationic polymerization initiator, the silsesquioxane compound may comprise a free radical polymerizable functional group and a cationic polymerizable functional group, the free radical polymerizable functional group may comprise a (meth)acrylate group, and the cationic polymerizable functional group may comprise an oxetane group.

[0102] In this embodiment, the polymerization reaction of the free radical polymerizable functional groups of the silsesquioxane compound can be initiated by a free radical polymerization initiator, and thus, a hard coating HC with improved heat resistance and hardness can be formed. In this embodiment, the free radical polymerization initiator can be diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, but the embodiment is not limited to this.

[0103] In this embodiment, the polymerization reaction of the cationicly polymerizable functional groups of the silsesquioxane compound can be initiated by a cationic polymerization initiator, and thus, a hard coating HC with improved flexibility can be formed. In this embodiment, the cationic polymerization initiator can be a triarylsulfonium hexafluoroantimonate, but the embodiment is not limited to this.

[0104] In this embodiment, the silica nanoparticles can be dispersed in a solvent. The silica nanoparticles can partially bind to a silsesquioxane compound to enhance the bonding strength and improve the wear resistance of the hard coating HC. In this embodiment, the average diameter of the silica nanoparticles can be from about 20 nanometers (nm) to about 60 nm. However, the embodiment is not limited to this, and for example, the average diameter of the silica nanoparticles can be less than about 20 nm or greater than about 60 nm. For example, various changes can be made to the average diameter and / or content of the silica nanoparticles to enhance the wear resistance of the hard coating HC.

[0105] In embodiments, relative to 100 wt% of the hard coating solids, the hard coating composition may comprise about 91 wt% or less of a silsesquioxane compound, about 2 wt% or less of a free radical polymerization initiator, about 1 wt% or less of a cationic polymerization initiator, and about 3 wt% or more of silica nanoparticles. For example, relative to 100 wt% of the hard coating solids, the hard coating composition may comprise about 80 wt% to about 91 wt% of a silsesquioxane compound, about 1 wt% to about 2 wt% of a free radical polymerization initiator, about 0.5 wt% to about 1 wt% of a cationic polymerization initiator, and about 3 wt% to about 14 wt% of silica nanoparticles. In embodiments, the hard coating composition may further comprise additives that control the hardness and / or flexibility of the hard coating HC. For example, additives may include coupling agents, leveling agents, defoamers, etc. For example, coupling agents may include methacryloxysilanes, etc. For example, leveling agents may include polydimethylsiloxane (“PDMS”), polyether-modified siloxanes, fluorinated acrylate copolymers, etc. For example, defoamers may include PDMS, octamethylcyclotetrasiloxane, etc.

[0106] The prepared hard coating composition can be applied to a substrate layer BL to form a preliminary hard coating. The hard coating composition can be applied to one surface of the substrate layer BL. In one embodiment, the hard coating composition can be applied by a wet coating method, but the embodiment is not limited thereto.

[0107] A preliminary hard coating formed on the substrate layer BL can be dried. During the drying step of the preliminary hard coating, the solvent contained in the hard coating composition can be removed.

[0108] In this embodiment, the dried preliminary hard coating can be photocured. The preliminary hard coating may comprise a hard coating solid material containing silsesquioxane compounds, free radical polymerization initiators, cationic polymerization initiators, and silica nanoparticles. Under light irradiation, the polymerization reaction of the silsesquioxane compound can be initiated by both free radical and cationic polymerization initiators. For example, under light irradiation, the photopolymerization of the free radical polymerizable functional groups of the silsesquioxane compound can be initiated by a free radical polymerization initiator, and the photopolymerization of the cationic polymerizable functional groups of the silsesquioxane compound can be initiated by a cationic polymerization initiator. For example, the free radical and cationic photopolymerization reactions of the silsesquioxane compound can occur simultaneously.

[0109] Therefore, a preliminary hard coating can be cured to form a hard coating HC. The hard coating HC may contain a cross-linked structure formed by curing (i.e., photocuring) a silsesquioxane compound. Because free radical polymerization and cationic polymerization occur simultaneously, a hard coating HC with relatively low shrinkage, relatively high adhesion, and relatively low oxygen interference can be formed during the formation process. In an embodiment, the hard coating HC can be formed to a thickness of about 3 μm to about 5 μm.

[0110] In one embodiment, the dried preliminary hard coating may be photocured and then thermally cured. The preliminary hard coating may comprise a hard coating solid material, which may include silsesquioxane compounds, free radical polymerization initiators, cationic polymerization initiators, and silica nanoparticles.

[0111] First, under light irradiation, the polymerization of silsesquioxane compounds can be initiated by both free radical polymerization initiators and cationic polymerization initiators. Under light irradiation, the photopolymerization of the free radical polymerizable functional groups of silsesquioxane compounds can be initiated by free radical polymerization initiators, and the photopolymerization of the cationic polymerizable functional groups of silsesquioxane compounds can be initiated by cationic polymerization initiators. For example, the free radical photopolymerization and cationic photopolymerization of silsesquioxane compounds can occur simultaneously.

[0112] Subsequently, under the condition of provided heat, the polymerization reaction of the silsesquioxane compound can be further initiated by a cationic polymerization initiator. Under the condition of provided heat, the thermal polymerization reaction of the cationically polymerizable functional groups of the silsesquioxane compound can be further initiated by a cationic polymerization initiator. For example, the cationic thermal polymerization reaction of the silsesquioxane compound can be further carried out. Because the free radical polymerizable functional groups of the silsesquioxane compound (e.g., photopolymerizable free radical polymerizable functional groups) are heat-resistant, the hardness properties are not changed by the provided heat.

[0113] Therefore, a preliminary hard coating can be cured to form a hard coating HC. The hard coating HC can comprise a cross-linked structure formed by curing (i.e., photocuring and thermal curing) a silsesquioxane compound. Because the free radical polymerization and cationic polymerization reactions occur simultaneously, a hard coating HC with relatively low shrinkage, relatively high adhesion, and relatively low oxygen interference can be formed during the formation process. For example, because photocuring and thermal curing are performed sequentially, a hard coating HC with relatively improved hardness and flexibility can be formed. In embodiments, the hard coating HC can be formed to a thickness of about 3 μm to about 5 μm.

[0114] An anti-reflective layer ARL can be formed on a hard coating HC. In an embodiment, a high-refractive-index layer and a low-refractive-index layer can be alternately stacked on the hard coating HC. For example, the high-refractive-index layer and the low-refractive-index layer can be formed by vacuum deposition. An anti-fingerprint layer AF can be coated on the anti-reflective layer ARL, and thus, a window WD can be formed.

[0115] In the embodiments, the hardness of the window WD can be about 0.5 GPa or greater than 0.5 GPa, for example, about 0.65 GPa or greater than 0.65 GPa. For example, the elastic modulus of the window WD can be about 6.5 GPa or greater than 6.5 GPa, for example, about 7.29 GPa or greater than 7.29 GPa. In the embodiments, the reflectivity of the window WD can be about 0.5% to about 1.5%, for example, about 1.0% or less than 1.0%. In the embodiments, the crack strain of the window WD can be about 10% or greater than 10%. In the embodiments, in abrasion and chemical resistance tests under a load of about 1.0 kg, the window WD exhibits good surface properties even after about 5000 and about 3000 reciprocating friction cycles, respectively. For example, before the abrasion and chemical resistance tests, the water contact angle of the window WD can be about 100° or greater, and after the abrasion and chemical resistance tests, the water contact angle of the window WD can be about 95° or greater.

[0116] According to the implementation plan, the hard coating HC of the window WD can not only have improved hardness and abrasion resistance, but also improved flexibility. Therefore, the hardness and flexibility of the window WD can be improved, making the window WD suitable for use in electronic devices (e.g., foldable electronic devices).

[0117] The effects of the implementation plan will be described below through specific experimental examples.

[0118] [Window Assessment]

[0119] A window according to Comparative Example 1, a window according to Comparative Example 2, and a window according to Embodiment 1 were manufactured respectively, and the crack strain, reflectivity, surface hardness, abrasion resistance, and chemical resistance of each window were evaluated.

[0120] [Window Manufacturing]

[0121] A hard coating with a thickness of 5 μm is formed on a polyethylene terephthalate (PET) film with a thickness of 65 μm, and an anti-reflective layer is formed on the hard coating (e.g., by alternately vacuum-depositing a total of 5 layers of Ti on the hard coating). 14 Nb3O 35 membrane and Si9Al2O 10(A film is used to form an anti-reflective layer) to manufacture the window according to Comparative Example 1 and the window according to Comparative Example 2, respectively.

[0122] A hard coating with a thickness of about 5 μm is formed on a polyethylene terephthalate (PET) film with a thickness of about 65 μm, and an anti-reflective layer is formed on the hard coating (e.g., by alternately vacuum-depositing a total of 5 layers of Ti on the hard coating). 14 Nb3O 35 The window according to Embodiment 1 is manufactured by forming an anti-reflective layer using a film and a SiO2 film. The windows of Comparative Example 1, Comparative Example 2 and Embodiment 1 are manufactured under the same conditions, except for the hard coating composition used to manufacture the hard coating and some compositions used for the anti-reflective layer.

[0123] The hard coating of Comparative Example 1 was formed from a hard coating composition comprising, relative to 100 wt% of hard coating solids, 95 wt% of a cage-structured silsesquioxane compound as a polymerizable compound, 3 wt% of 2-(1,3-benzodioxacyclopenten-5-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine as a cationic photopolymerization initiator, and 2 wt% of an additive comprising methacryloyloxysilane and PDMS, wherein the cage structure has a 2-ethylhexyloxetane group as a cationic photopolymerizable monofunctional group.

[0124] The hard coating of Comparative Example 2 was formed from a hard coating composition comprising, relative to 100 wt% of hard coating solids, 93 wt% of a cage-structured silsesquioxane compound as a polymerizable compound, 2 wt% of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide as a free radical photopolymerization initiator, 3 wt% of silica nanoparticles with an average diameter of 45 nm, and 2 wt% of an additive comprising methacryloyloxysilane and PDMS, wherein the cage structure has pentaerythritol triacrylate (PETA) and trimethylolpropane trimethacrylate (TMPTMA) as free radical photopolymerizable functional groups.

[0125] The hard coating of embodiment 1 is formed from a hard coating composition, which, relative to 100 wt% of hard coating solids, comprises 91 wt% of a random silsesquioxane compound as a polymerizable compound, 2 wt% of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide as a free radical photopolymerization initiator, 1 wt% of triarylsulfonium hexafluoroantimonate (mixed) as a cationic photo / thermal polymerization initiator, 3 wt% of silica nanoparticles with an average diameter of 45 nm, and about 3 wt% of an additive comprising methacryloyloxysilane and PDMS, wherein the random structure has EO-modified isocyanurate diacrylate groups as free radical photopolymerizable functional groups and 2-ethylhexyloxetane groups as cationic photo / thermal polymerizable functional groups.

[0126] The evaluation methods for crack strain, reflectivity, surface hardness, wear resistance and chemical resistance are as follows.

[0127] [Crack strain]

[0128] Crack strain represents the increase in the size of a sample relative to its initial size after being stretched. Samples for measuring crack strain were prepared by cutting windows of 10 mm × 60 mm according to Comparative Example 1, Comparative Example 2, and Embodiment 1. Each of the prepared samples was stretched at a tensile speed of 50 mm / min using a tensile testing machine (e.g., a general-purpose testing machine) from Instron. After stretching, the occurrence of cracks was examined, and the increase in sample size was measured for evaluation.

[0129] [Reflectivity]

[0130] The reflectance of each of the windows according to Comparative Example 1, Comparative Example 2 and Embodiment 1 was measured at 550 nm using a Konica Minolta CM3700A reflectance mode.

[0131] [Surface Hardness]

[0132] The surface hardness was measured using a nanoindenter (TI-950 Berkovich diamond indenter from Bruker Corporation), and the indentation depth of the surface of each of the windows in Comparative Example 1, Comparative Example 2, and Scheme 1 was 200 nm.

[0133] [Abrasion Resistance]

[0134] Abrasion resistance was evaluated by measuring the water contact angle after an abrasion test with an eraser. Samples for abrasion resistance measurement were prepared by cutting windows of 70 mm × 80 mm according to Comparative Example 1, Comparative Example 2, and Embodiment 1. Each prepared sample was fixed to the fixture of an abrasion resistance measuring device (scratch tester from Daesung Precision Corporation), and an eraser with a diameter of 5 mm (rubber rod from Munbang Sau Corporation) was applied and fixed to its tip. The eraser was repeatedly rubbed against each surface of the window by setting the travel distance to 15 mm, the speed to 50 rpm, and the load to 1.0 kg. Each surface was then observed visually or the water contact angle of each abraded surface was measured using a contact angle measuring device (droplet shape analysis system from Kruss Corporation).

[0135] [Chemical resistance]

[0136] Chemical resistance was assessed by applying alcohol to the surface of each of the windows according to Comparative Example 1, Comparative Example 2, and Embodiment 1, and by repeatedly rubbing the surface of each window with an eraser under the same conditions as those used to assess abrasion resistance. Each surface was then observed visually or the water contact angle of each abraded surface was measured.

[0137] Table 1 shows the evaluation results of crack strain, reflectivity, surface hardness, abrasion resistance and chemical resistance of the windows according to Comparative Example 1, Comparative Example 2 and Scheme 1.

[0138] Table 1

[0139] Referring to Table 1, it can be noted that the window of Comparative Example 1 exhibits excellent flexibility because the silsesquioxane compound has a cationicly polymerizable monofunctional group, resulting in high measured crack strain, but low measured abrasion resistance and chemical resistance. The window of Comparative Example 2 exhibits excellent hardness because the silsesquioxane compound only has free radical polymerizable functional groups, resulting in high measured surface hardness, but low measured crack strain.

[0140] It can be confirmed that, compared with the window of Comparative Example 1 or the window of Comparative Example 2, the window of Embodiment 1 has superior crack strain, surface hardness, abrasion resistance and chemical resistance.

[0141] For example, the window of Embodiment 1 was measured to have a crack strain of 10.5% (exceeding the target value of 10%), a reflectivity of 0.62% to 0.71% (meeting the target value of 1.0%), and an excellent surface hardness of 0.5 GPa. For example, the measured elastic modulus of the window of Embodiment 1 was 6.5 GPa. For example, in abrasion resistance and chemical resistance tests, even after 10,000 and 3,000 reciprocating friction cycles, the window of Embodiment 1 still exhibited good surface properties, exceeding the target values ​​for 5,000 and 3,000 reciprocating friction cycles, and even after abrasion resistance and chemical resistance tests, the water contact angle of the window of Embodiment 1 remained at or greater than the target value of 95°, indicating that the window of Embodiment 1 has excellent abrasion resistance and chemical resistance.

[0142] The window WD according to the embodiment can be applied to various electronic devices. The electronic device according to the embodiment may include the aforementioned window WD, and may further include modules or devices with additional functions besides the window WD, such as a power supply module.

[0143] Figure 7 This is a schematic block diagram illustrating an electronic device according to an implementation scheme.

[0144] refer to Figure 7 The electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0145] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0146] The memory 13 can store data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application program stored in the memory 13, image data signals and / or input control signals can be sent to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0147] The power module 14 may include a power supply module such as a power adapter and a battery device, and a power conversion module, wherein the power conversion module converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 10.

[0148] Figure 8 This is a schematic view illustrating an electronic device according to an embodiment.

[0149] refer to Figure 8According to the implementation scheme, the various electronic devices used in the window can include not only image display electronic devices, but also wearable electronic devices containing display modules, vehicle electronic devices 10_3 containing display modules, etc. Image display electronic devices can be smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, desktop monitors 10_1e, etc. Wearable electronic devices can be smart glasses 10_2a, head-mounted displays 10_2b, smartwatches 10_2c, etc. Vehicle electronic devices 10_3 can be central information displays (CIDs) arranged on the vehicle's dashboard and central instrument panel, in-vehicle mirror displays, etc.

[0150] This disclosure can be applied to various display devices and electronic devices. For example, the embodiments can be applied to various display devices, such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, medical display devices, etc.

[0151] At the conclusion of this detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments without substantially departing from the principles, spirit, and scope of this disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and are not intended to be limiting.

Claims

1. A hard coating composition comprising: Solvent; and Hard-coated solid substances, including: A silsesquioxane compound comprising a radical polymerizable functional group and a cationic polymerizable functional group, wherein the radical polymerizable functional group comprises a (meth)acrylate group and the cationic polymerizable functional group comprises an oxetane group; Free radical polymerization initiators; and Cationic polymerization initiator.

2. The hard coating composition of claim 1, wherein... The free radical polymerizable functional group is an ethylene oxide-modified isocyanuric acid diacrylate group, and The cationic polymerizable functional group is a 2-ethylhexyloxetane group.

3. The hard coating composition of claim 1, wherein the silsesquioxane compound comprises the free radical polymerizable functional group and the cationic polymerizable functional group in a ratio of 5:5 to 6:

4.

4. The hard coating composition of claim 1, wherein... The free radical polymerization initiator is diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and The cationic polymerization initiator is triarylsulfonium hexafluoroantimonate.

5. The hard coating composition of claim 1, wherein the silsesquioxane compound has a random structure.

6. A method for manufacturing a window, the method comprising: A hard coating composition comprising a solvent and a hard coating solid is applied to a substrate layer to form a preliminary hard coating; Dry the initial hard coating to remove the solvent; as well as The dried preliminary hard coating is cured to form a hard coating. The hard coating solid material includes: A silsesquioxane compound comprising a radical polymerizable functional group and a cationic polymerizable functional group, wherein the radical polymerizable functional group comprises a (meth)acrylate group and the cationic polymerizable functional group comprises an oxetane group; Free radical polymerization initiators; and Cationic polymerization initiators, and The curing of the dried preliminary hard coating that forms the hard coating includes: The initial hard coating is light-cured and dried.

7. The method of claim 6, wherein The free radical polymerizable functional group is an ethylene oxide-modified isocyanuric acid diacrylate group, and The cationic polymerizable functional group is a 2-ethylhexyloxetane group.

8. The method of claim 6, wherein The free radical polymerization initiator is diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and The cationic polymerization initiator is triarylsulfonium hexafluoroantimonate.

9. The method of claim 6, wherein the curing of the dried preliminary hard coating forming the hard coating further comprises: The initial hard coating is heat-cured and dried.

10. Electronic devices, including: A window manufactured according to any one of claims 6 to 9; as well as Power supply module.

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