Terminal connection health degree detection method and device, power equipment and power system

Abstract

The invention discloses a terminal connection health degree detection method and device, power equipment and a power system, and belongs to the field of equipment safety, and the method comprises the steps: obtaining a first temperature of a to-be-detected terminal; the heat variable of the to-be-tested terminal is changed, after the heat variable of the to-be-tested terminal is changed, the second temperature of the to-be-tested terminal is obtained, and the heat variable is used for representing the variable influencing the temperature of the to-be-tested terminal; and determining the connection health degree of the to-be-detected terminal based on a temperature difference value between the first temperature and the second temperature and a preset detection condition. According to the invention, the accuracy of health degree detection of the to-be-detected terminal can be improved, and misjudgment or missing report can be avoided.

Description

Technical Field

[0001] This application relates to the field of equipment safety technology, specifically to a terminal connection health detection method, device, power equipment, and power system. Background Technology

[0002] In power or signal transmission systems, poor contact at the terminal wire ends can generate a lot of heat and even cause a fire. Therefore, real-time health monitoring of the terminal connections can ensure the safety of power or signal transmission systems. Summary of the Invention

[0003] Embodiments of this application provide a terminal connection health detection method, apparatus, power device, and power system to detect the health of terminal connections in real time and improve the security of the power or signal transmission system where the terminals are located.

[0004] To address the aforementioned technical problems, embodiments of this application disclose the following technical solutions:

[0005] Firstly, a method for detecting the health of terminal connections is provided, including:

[0006] Obtain the first temperature of the terminal under test;

[0007] The heat variable of the terminal under test is changed, and after the heat variable of the terminal under test is changed, the second temperature of the terminal under test is obtained. The heat variable is used to characterize the variable that affects the temperature of the terminal under test.

[0008] The connection health of the terminal under test is determined based on the temperature difference between the first temperature and the second temperature and the preset detection conditions.

[0009] In some embodiments, the preset detection condition is that the temperature difference is less than a temperature difference threshold; determining the connection health of the terminal under test based on the temperature difference between the first temperature and the second temperature and the preset detection condition includes:

[0010] The connection health of the terminal under test is determined based on the comparison between the temperature difference value and the temperature difference threshold.

[0011] In some embodiments, the step of determining the temperature difference threshold includes:

[0012] Obtain the mapping information between the sample temperature difference and the change in the sample heat variable;

[0013] The temperature difference corresponding to the change in the current heat variable is determined based on the mapping information and used as the temperature difference threshold.

[0014] In some embodiments, the preset detection condition is that the impedance is less than an impedance threshold; determining the connection health of the terminal under test based on the temperature difference between the first temperature and the second temperature and the preset detection condition includes:

[0015] The impedance of the terminal under test is calculated based on the temperature difference and heat variation.

[0016] The connection health of the terminal under test is determined by comparing the impedance with the impedance threshold.

[0017] In some embodiments, thermal variables include one or more of electrical parameters and thermal resistance.

[0018] In some embodiments, the electrical parameters include current; changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes, includes:

[0019] Change the current, and after changing the current, obtain the second temperature of the terminal under test;

[0020] The impedance of the terminal under test is calculated based on the temperature difference and heat variation, including:

[0021] The impedance is calculated based on the temperature difference, the first current corresponding to the first temperature, the second current corresponding to the second temperature, and the thermal resistance.

[0022] In some embodiments, changing the heat variable of the terminal under test and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes includes:

[0023] Change the thermal resistance, and then obtain the second temperature of the terminal under test after changing the thermal resistance;

[0024] The impedance of the terminal under test is calculated based on the temperature difference and heat variation, including:

[0025] The impedance is calculated based on the temperature difference, the first thermal resistance corresponding to the first temperature, the second thermal resistance corresponding to the second temperature, and the current.

[0026] In some embodiments, electrical parameters include power; changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes, includes:

[0027] Change the power, and after changing the power, obtain the second temperature of the terminal under test;

[0028] The impedance of the terminal under test is calculated based on the temperature difference and heat variation, including:

[0029] The impedance is calculated based on the temperature difference, the first power corresponding to the first temperature, the second power corresponding to the second temperature, the thermal resistance, and the voltage.

[0030] In some embodiments, electrical parameters include voltage; changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes, includes:

[0031] Change the voltage, and after changing the voltage, obtain the second temperature of the terminal under test;

[0032] The impedance of the terminal under test is calculated based on the temperature difference and heat variation, including:

[0033] The impedance is calculated based on the temperature difference, the first voltage corresponding to the first temperature, the second voltage corresponding to the second temperature, the thermal resistance, and the power.

[0034] In some embodiments, the electrical parameters include current; changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes, includes:

[0035] Change the thermal resistance and current, and then obtain the second temperature of the terminal under test after changing the thermal resistance and current;

[0036] The impedance of the terminal under test is calculated based on the temperature difference and heat variation, including:

[0037] The impedance is calculated based on the temperature difference, the first current and the first thermal resistance corresponding to the first temperature, and the second current and the second thermal resistance corresponding to the second temperature.

[0038] Secondly, a terminal connection health detection device is provided, comprising:

[0039] The first acquisition module is used to acquire the first temperature of the terminal to be tested;

[0040] The second acquisition module is used to change the heat variable of the terminal under test, and after the heat variable of the terminal under test is changed, acquire the second temperature of the terminal under test. The heat variable is used to characterize the variable that affects the temperature of the terminal under test.

[0041] The detection module is used to determine the connection health of the terminal under test based on the temperature difference between the first temperature and the second temperature and preset detection conditions.

[0042] Thirdly, a power device is provided, the power device comprising:

[0043] At least one processor; and a memory communicatively connected to the at least one processor;

[0044] The memory stores a computer program that can be executed by at least one processor, and the computer program is executed by at least one processor so that at least one processor can perform the above-described terminal connection health detection method.

[0045] Fourthly, a power system is provided, which includes the power equipment as described above.

[0046] One of the above technical solutions has the following advantages or beneficial effects:

[0047] This application discloses a terminal connection health detection method. It obtains a temperature difference by acquiring a first temperature and a second temperature of the same terminal under test, and determines whether the connection of the terminal under test is normal based on the temperature difference and preset detection conditions. This method can detect terminal connection health even when there is only one terminal under test. Furthermore, the preset detection conditions are determined based on thermal variables, eliminating the need to consider ambient temperature or the operating environment of the power or signal transmission system where the terminal under test is located. This improves the accuracy of the terminal health detection and avoids false positives or false negatives. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the overall process of the terminal connection health detection method according to an embodiment of this application;

[0050] Figure 2 This is one of the flowcharts illustrating the terminal connection health detection method according to an embodiment of this application;

[0051] Figure 3 This is a second schematic flowchart of the terminal connection health detection method according to an embodiment of this application;

[0052] Figure 4 This is a schematic diagram of the terminal connection health detection device according to an embodiment of this application;

[0053] Figure 5 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0054] Figure label:

[0055] 401-First acquisition module, 402-Second acquisition module, 403-Detection module; 40-Electronic device; 41-Processor; 42-Read-only memory; 43-Random access memory; 44-Bus; 45-Input / output interface; 46-Input unit; 47-Output unit; 48-Storage unit; 49-Communication unit. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0057] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified.

[0058] Currently, the connection health of terminals is determined by comparing the monitored terminal temperature with a safe temperature. If the monitored terminal temperature exceeds the safe temperature, the terminal connection health is considered abnormal. The safe temperature is usually a set threshold or the average of temperature data from multiple terminals. If the safe temperature is a set threshold, this threshold is determined by considering the ambient temperature and the operating environment of the power or signal transmission system where the terminal is located. In this case, judging the health status based on this threshold is prone to misjudgment or missed detection of abnormal terminals, thus reducing the accuracy of terminal connection health detection. If the safe temperature is determined by the average of temperature data from multiple terminals, the actual current flowing through each terminal during operation may vary, leading to inconsistent terminal temperatures. Therefore, the calculated safe temperature will have a large error due to temperature deviations, resulting in misjudgment or missed detection. Furthermore, it requires collecting temperature data from multiple terminals of the same device, which has limitations in application. In summary, existing terminal connection health detection methods suffer from misjudgment or missed detection, and their accuracy needs improvement.

[0059] In view of this, embodiments of this application provide a terminal connection health detection method, apparatus, power device, and power system. This method obtains a temperature difference by acquiring a first temperature and a second temperature of the same terminal under test, and determines whether the connection health of the terminal under test is normal based on the temperature difference and preset detection conditions. Terminal connection health detection can be achieved even when there is only one terminal under test. Furthermore, the preset detection conditions are determined based on thermal variables, eliminating the need to consider ambient temperature or the operating environment of the power or signal transmission system where the terminal under test is located. This improves the accuracy of the connection health detection and avoids false positives or false negatives, thus solving at least some of the aforementioned technical problems.

[0060] Please see Figure 1 , Figure 1 This is a schematic diagram of the overall process of the terminal connection health detection method according to an embodiment of this application, as follows: Figure 1 As shown, the terminal connection health detection method includes the following steps:

[0061] S101, obtain the first temperature of the terminal to be tested.

[0062] Among them, the terminal under test is the contact point or connecting component of electrical connection in the power or signal transmission system, such as the terminal of inverter, converter, battery, etc. Specifically, it can be a wiring terminal, connector terminal, battery terminal, etc., without limitation.

[0063] In this step, the first temperature of the terminal under test can be obtained through a temperature sensor.

[0064] S102, change the heat variable of the terminal under test, and after the heat variable of the terminal under test changes, obtain the second temperature of the terminal under test.

[0065] Among them, the heat variable is used to characterize the variables that affect the temperature of the terminal under test. Specifically, it includes electrical parameters and thermal resistance that affect the temperature of the terminal under test. Electrical parameters can be current, power, voltage, etc. flowing through the terminal, and factors affecting thermal resistance can include ambient temperature, ventilation conditions, contact pressure, etc.

[0066] In this step, changing the heat variable can specifically mean adjusting the value of a heat variable at different times. Taking adjusting only the current as an example, before adjustment, the current flowing through the terminal under test is measured as the first current value, and at the same time, the temperature of the terminal under test at this time is measured by the temperature sensor as the first temperature. After adjustment, the current flowing through the terminal under test is measured as the second current value, and at the same time, the temperature of the terminal under test at this time is measured as the second temperature.

[0067] In addition, changing heat variables can also involve adjusting the values ​​of multiple heat variables simultaneously, such as adjusting current, ambient temperature, and ventilation conditions at the same time, thereby obtaining two different temperatures before and after the adjustment. Furthermore, the second temperature is also obtained through measurement using a temperature sensor.

[0068] S103, based on the temperature difference between the first temperature and the second temperature and the preset detection conditions, determine the connection health of the terminal under test.

[0069] In some embodiments of this application, the preset detection conditions can be set based on a temperature difference threshold. For example, the preset detection condition can be that the temperature difference is less than the temperature difference threshold. If the temperature difference is less than the temperature difference threshold, it is determined that the temperature difference meets the preset detection condition, and thus the connection health of the terminal under test is determined to be normal. If the temperature difference is greater than or equal to the temperature difference threshold, it is determined that the temperature difference does not meet the preset detection condition, and thus the connection health of the terminal under test is abnormal.

[0070] In other embodiments of this application, the preset detection conditions may also be set based on other thresholds. For example, the preset detection condition may be that the impedance is less than the impedance threshold, and the impedance threshold is obtained based on the temperature difference threshold conversion.

[0071] The actual value of the aforementioned temperature difference threshold or other thresholds converted from temperature difference thresholds can be a preset fixed value or determined according to the change of heat variable. For example, when the current changes by aA, the corresponding temperature difference threshold is b℃; when the current changes by cA, the corresponding temperature difference threshold is d℃.

[0072] The terminal connection health detection method provided in this application obtains a temperature difference by acquiring a first temperature and a second temperature of the same terminal under test, and determines whether the connection health of the terminal under test is normal based on the temperature difference and preset detection conditions. This method can detect terminal connection health even when there is only one terminal under test. Furthermore, the preset detection conditions are determined based on thermal variables. The determination of the preset detection conditions does not require consideration of factors such as ambient temperature or the operating environment of the power or signal transmission system where the terminal under test is located, thus avoiding excessive influence from additional factors and improving the accuracy of the connection health detection of the terminal under test, preventing false positives or false negatives.

[0073] In some embodiments of this application, when the preset detection condition is that the temperature difference is less than a temperature difference threshold, the temperature difference threshold can specifically be the maximum temperature change value corresponding to the change in the heat variable. This maximum temperature change value is the critical value for the connection health of the terminal under test to change from a normal state to an abnormal state. For example, when the ambient temperature is adjusted from room temperature to a high temperature state, the maximum temperature change value of the terminal under test from room temperature to high temperature is the temperature difference threshold. The temperature difference threshold can be obtained through testing.

[0074] In this embodiment, the connection health of the terminal under test is determined based on the temperature difference between the first temperature and the second temperature and preset detection conditions, including:

[0075] The connection health of the terminal under test is determined by comparing the temperature difference between the first and second temperatures with a temperature difference threshold. Specifically, the temperature difference is compared to the temperature difference threshold. If the temperature difference is greater than or equal to the temperature difference threshold, it indicates that the connection health of the terminal under test is in an abnormal state after the change in heat variable; if the temperature difference is less than the temperature difference threshold, it indicates that the connection health of the terminal under test is in a normal state after the change in heat variable.

[0076] In other embodiments of this application, there may be multiple temperature thresholds, corresponding to multiple connection health levels, with each temperature threshold corresponding to a connection health level. By comparing the temperature difference with multiple temperature thresholds, it is possible to determine which connection health level the terminal under test belongs to.

[0077] The terminal connection health detection method provided in this application determines the connection health of the terminal under test by using a temperature difference threshold and a temperature difference value. The temperature difference threshold is determined based on the change of heat variables, rather than being set according to factors such as ambient temperature and operating conditions, thereby making the detection results more accurate.

[0078] In some embodiments of this application, the step of determining the temperature difference threshold includes:

[0079] Obtain the mapping information between the sample temperature difference and the change in the sample heat variable.

[0080] The temperature difference corresponding to the change in the current heat variable is determined based on the mapping information and used as the temperature difference threshold.

[0081] Specifically, the temperature changes of the terminals under different heat variable input conditions are measured and recorded through experiments or simulations. The collected sample data are then summarized and analyzed to obtain mapping information. The mapping information can be a data table of sample temperature differences and changes in sample heat variables. After obtaining the current change in heat variable, an interpolation algorithm can be used to determine the corresponding temperature difference in the data table for the current change in heat variable, and the determined temperature difference is used as the temperature difference threshold.

[0082] Alternatively, data fitting can be performed on the sample temperature difference and the change in the sample heat variable. The obtained fitted curve can be used as mapping information. After obtaining the current change in the heat variable, the temperature difference corresponding to the current change in the heat variable can be obtained from the fitted curve as the temperature difference threshold.

[0083] In addition, the sample temperature difference and the change in sample heat variable can be used as training data, and machine learning algorithms can be used to train the model to obtain a model for temperature difference threshold prediction. The parameters in this model can reflect the mapping information between the sample temperature difference and the change in sample heat variable. The current change in heat variable is input into the model for temperature difference threshold prediction, and the temperature difference threshold is predicted by this model.

[0084] The terminal connection health detection method provided in this application determines the temperature difference threshold by mapping information between the sample temperature difference and the change in sample heat variable, thereby further improving the accuracy of terminal connection health detection.

[0085] In some embodiments of this application, when the preset detection condition is that the impedance is less than the impedance threshold, the impedance threshold can be obtained by measuring when the terminal is in a healthy state (e.g., at the time of manufacture), or it can be obtained by converting based on the temperature difference threshold.

[0086] In this embodiment, the connection health of the terminal under test is determined based on the temperature difference between the first temperature and the second temperature and preset detection conditions, including:

[0087] The impedance of the terminal under test is calculated based on the temperature difference and heat variation.

[0088] The connection health of the terminal under test is determined by comparing the impedance with the impedance threshold.

[0089] In some embodiments, the relationship between temperature and impedance can be expressed as: T - Ta = Rth * R * I 2 Where T is temperature, Ta is ambient temperature, Rth is the thermal resistance of the terminal under test, R is the impedance of the terminal under test, and I is the current flowing through the terminal under test. Based on T-Ta = Rth * R * I 2 The temperature difference between the first temperature T1 and the second temperature T2 can be calculated as T1-T2 = R*(Rth1*I1*I1-Rth2*I2*I2), where the first current I1 and the second current I2, as well as the first thermal resistance Rth1 and the second thermal resistance Rth2, can all be heat variables. By changing these heat variables, the first current I1 and the second current I2 can be obtained, and the impedance R can be calculated.

[0090] In other embodiments, the relationship between temperature and impedance can also be: Where P is the power across the terminals under test, and U is the output voltage. Based on The temperature difference between the first temperature T1 and the second temperature T2 can be calculated. Among them, the first power P1 and the second power P2, the first voltage U1 and the second voltage U2, and the first thermal resistance Rth1 and the second thermal resistance Rth2 can all be heat variables. By changing these heat variables, the first current I1 and the second current I2 are obtained, and the impedance R is calculated.

[0091] Based on either of the two methods described above, the impedance of the terminal under test is calculated and then compared with an impedance threshold. If the impedance is greater than or equal to the impedance threshold, the connection health of the terminal under test is determined to be abnormal; if the impedance is less than the impedance threshold, the connection health of the terminal under test is determined to be normal.

[0092] In other embodiments of this application, there may be multiple impedance thresholds, each impedance threshold corresponding to a connection health level. By comparing the impedance with multiple impedance thresholds, it can be determined which connection health level the terminal under test belongs to, and the user can take corresponding measures for different connection health levels.

[0093] The terminal connection health detection method provided in this application determines the connection health of the terminal under test by means of impedance and impedance threshold. The impedance threshold setting does not need to consider factors such as ambient temperature and operating conditions, thereby improving the detection accuracy.

[0094] In some embodiments of this application, such as Figure 2 As shown, the electrical parameters include current, and step S102 includes the following sub-steps:

[0095] S1021, change the current, and after changing the current, obtain the second temperature of the terminal to be measured.

[0096] Step S103 includes the following sub-steps:

[0097] S1031, the impedance is calculated based on the temperature difference, the first current corresponding to the first temperature, the second current corresponding to the second temperature, and the thermal resistance.

[0098] That is, before changing the current, the first temperature T1 of the terminal under test is obtained by measuring the temperature sensor, and the first current I1 of the terminal under test is obtained by measuring the ammeter. After changing the current, the second temperature T2 and the second current I2 of the terminal under test are measured. The impedance R is calculated according to the formula T1-T2=Rth*R*(I1*I1-I2*I2), where Rth is the thermal resistance, which can be directly measured.

[0099] In some embodiments of this application, such as Figure 3 As shown, step S102 includes the following sub-steps:

[0100] S1022, change the thermal resistance, and after changing the thermal resistance, obtain the second temperature of the terminal to be measured.

[0101] Step S103 includes the following sub-steps:

[0102] S1032, the impedance is calculated based on the temperature difference, the first thermal resistance corresponding to the first temperature, the second thermal resistance corresponding to the second temperature, and the current.

[0103] Changing thermal resistance can be achieved by altering the contact area of ​​the terminals to change the heat flux per unit area, thus changing the thermal resistance; by changing the contact pressure of the terminals (such as using bolts for fastening, adding thermal pads, etc.) to change the thermal conductivity of the terminals; or by changing the heat dissipation conditions of the terminals (such as adding heat sinks around the terminals, changing the airflow around the terminals, adjusting the ambient temperature of the terminals, etc.) to change the thermal resistance.

[0104] Schematic illustration: Adjusting the fan speed around the terminal under test changes the ambient temperature of the terminal, thereby altering its thermal resistance. A higher fan speed results in better heat dissipation and lower thermal resistance; conversely, a lower fan speed results in higher thermal resistance. The thermal resistance of the terminal under test is changed by altering the fan speed, based on the first thermal resistance Rth1 at a first temperature, the second thermal resistance Rth2 at a second temperature, the current I, and the temperature difference T1-T2, using the formula T1-T2 = R*I. 2 The impedance R is obtained by calculating *(Rth1-Rth2).

[0105] In some embodiments of this application, the electrical parameters include power, and step S102 includes the following sub-steps:

[0106] S1023, change the power, and after changing the power, obtain the second temperature of the terminal under test. Specifically, the power can be changed by changing the current, or the power loss can be adjusted by changing the contact resistance to further change the power, or the operating frequency can be adjusted for AC terminals, etc.

[0107] Step S103 includes the following sub-steps:

[0108] S1033, the impedance is calculated based on the temperature difference, the first power corresponding to the first temperature, the second power corresponding to the second temperature, the thermal resistance, and the voltage.

[0109] That is, before the power is changed, the first temperature T1 corresponds to the first power P1, and after the power is changed, the second temperature T2 corresponds to the second power P2, according to the formula. The impedance R is calculated, where the thermal resistance Rth and the voltage U can be directly measured.

[0110] In some embodiments of this application, the electrical parameters include voltage, and step S102 includes the following sub-steps:

[0111] S1024, change the voltage, and after changing the voltage, obtain the second temperature of the terminal under test.

[0112] Step S103 includes the following sub-steps:

[0113] S1034, the impedance is calculated based on the temperature difference, the first voltage corresponding to the first temperature, the second voltage corresponding to the second temperature, the thermal resistance, and the power.

[0114] That is, before the voltage is changed, the first temperature T1 corresponds to the first voltage U1, and after the voltage is changed, the second temperature T2 corresponds to the second voltage U2, according to the formula... The impedance R is calculated, where the thermal resistance Rth and the power P can be measured.

[0115] In some embodiments of this application, the electrical parameters include current, and step S102 includes the following sub-steps:

[0116] S1025, change the thermal resistance and current, and obtain the second temperature of the terminal under test after changing the thermal resistance and current.

[0117] Step S103 includes the following sub-steps:

[0118] S1035, the impedance is calculated based on the temperature difference, the first current and the first thermal resistance corresponding to the first temperature, and the second current and the second thermal resistance corresponding to the second temperature.

[0119] That is, before changing the thermal resistance and current, the first temperature T1 corresponds to the first current I1 and the first thermal resistance Rth1. After changing the thermal resistance and current, the second temperature T2 corresponds to the second current I2 and the second thermal resistance Rth2. Then, the impedance R is calculated according to the formula T1-T2=R*(Rth1*I1*I1-Rth2*I2*I2).

[0120] In some embodiments of this application, the electrical parameters include power and voltage, and step S102 includes the following sub-steps:

[0121] S1026, change the power and voltage, and after changing the power and voltage, obtain the second temperature of the terminal under test.

[0122] Step S103 includes the following sub-steps:

[0123] S1036, the impedance is calculated based on the temperature difference, the first power and first voltage corresponding to the first temperature, the second power and second voltage corresponding to the second temperature, and the thermal resistance Rth.

[0124] That is, before changing the power and voltage, the first temperature T1 corresponds to the first power P1 and the first voltage U1; after changing the power and voltage, the second temperature T2 corresponds to the second power P2 and the second voltage U2, and then according to the formula... The impedance R is calculated.

[0125] In some embodiments of this application, the electrical parameters include power and voltage, and step S102 includes the following sub-steps:

[0126] S1027, change the power, voltage and thermal resistance, and obtain the second temperature of the terminal under test after changing the power, voltage and thermal resistance.

[0127] Step S103 includes the following sub-steps:

[0128] S1037, the impedance is calculated based on the temperature difference, the first power corresponding to the first temperature, the first voltage and the first thermal resistance, the second power corresponding to the second temperature, the second voltage and the second thermal resistance.

[0129] That is, before changing the power, voltage, and thermal resistance, the first temperature T1 corresponds to the first power P1, the first voltage U1, and the first thermal resistance Rth1. After changing the power, voltage, and thermal resistance, the second temperature T2 corresponds to the second power P2, the second voltage U2, and the second thermal resistance Rth2. Then, according to the formula... The impedance R is calculated.

[0130] The terminal connection health detection method provided in this application obtains a first temperature and a second temperature by changing one or more of the electrical parameters and thermal resistance. It calculates the impedance based on the heat variables before and after the change, as well as the first temperature and the second temperature. Then, it compares the impedance with an impedance threshold and determines the connection health of the terminal under test based on the comparison result, thereby improving the detection accuracy.

[0131] Please see Figure 4 , Figure 4 This is a schematic diagram of the terminal connection health detection device according to an embodiment of this application. The terminal connection health detection device includes a first acquisition module 401, a second acquisition module 402, and a detection module 403.

[0132] The first acquisition module 401 is used to acquire the first temperature of the terminal to be tested.

[0133] The second acquisition module 402 is used to change the heat variable of the terminal under test, and after the heat variable of the terminal under test changes, acquire the second temperature of the terminal under test. The heat variable is used to characterize the variable that affects the temperature of the terminal under test.

[0134] The detection module 403 is used to determine the connection health of the terminal under test based on the temperature difference between the first temperature and the second temperature and preset detection conditions.

[0135] The terminal connection health detection device provided in this application corresponds to the terminal connection health detection method described above, and will not be repeated here.

[0136] Accordingly, this application also provides a power device. Please refer to [link / reference]. Figure 5 , Figure 5 This is a schematic diagram of the structure of a power device according to an embodiment of this application. The power device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The power device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or claimed herein.

[0137] The power device 40 includes at least one processor 41 and a memory, such as a read-only memory (ROM) 42 or a random access memory (RAM) 43, communicatively connected to the at least one processor 41. The memory stores computer programs executable by the at least one processor 41. The processor 41 can perform various appropriate actions and processes based on the computer programs stored in the ROM 42 or loaded from storage unit 48 into the RAM 43. The RAM 43 may also store various programs and data required for the operation of the power device 40. The processor 41, ROM 42, and RAM 43 are interconnected via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44. Multiple components in the power device 40 are connected to the I / O interface 45, including: an input unit 46, such as a keyboard or mouse; an output unit 47, such as various types of displays or speakers; a storage unit 48, such as a disk or optical disk; and a communication unit 49, such as a network card, modem, or wireless transceiver. The communication unit 49 allows the power device 40 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0138] Processor 41 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 41 performs the various methods described in the foregoing embodiments, such as the terminal connection health detection method, or processor 41 can be configured in the control subsystem of the energy and carbon management system described in the foregoing embodiments.

[0139] In some embodiments, this application also provides a power system including a power device 40.

[0140] It should be understood that the various forms of processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the embodiments of this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this document does not impose any restrictions.

[0141] The present application provides a detailed description of a terminal connection health detection method, apparatus, power device, and power system. Specific examples have been used to illustrate the principles and implementation methods of the present application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of the present application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for detecting the health of terminal connections, characterized in that, include: Obtain the first temperature of the terminal under test; The heat variable of the terminal under test is changed, and after the heat variable of the terminal under test is changed, the second temperature of the terminal under test is obtained. The heat variable is used to characterize the variable that affects the temperature of the terminal under test. The connection health of the terminal under test is determined based on the temperature difference between the first temperature and the second temperature and the preset detection conditions.

2. The terminal connection health detection method according to claim 1, characterized in that, The preset detection condition is that the temperature difference is less than the temperature difference threshold. Based on the temperature difference between the first temperature and the second temperature and preset detection conditions, the connection health of the terminal under test is determined, including: Based on the comparison between the temperature difference value and the temperature difference threshold, the connection health of the terminal under test is determined.

3. The terminal connection health detection method according to claim 2, characterized in that, The steps for determining the temperature difference threshold include: Obtain the mapping information between the sample temperature difference and the change in the sample heat variable; The temperature difference corresponding to the change in the current heat variable is determined based on the mapping information and used as the temperature difference threshold.

4. The terminal connection health detection method according to claim 1, characterized in that, The preset detection condition is that the impedance is less than the impedance threshold. Based on the temperature difference between the first temperature and the second temperature and preset detection conditions, the connection health of the terminal under test is determined, including: The impedance of the terminal under test is calculated based on the temperature difference and the heat variable. The connection health of the terminal under test is determined based on the comparison between the impedance and the impedance threshold.

5. The terminal connection health detection method according to any one of claims 1 to 4, characterized in that, The heat variables include one or more of electrical parameters and thermal resistance.

6. The terminal connection health detection method according to claim 5, characterized in that, The electrical parameters include current; changing the heat variable of the terminal under test, and obtaining the second temperature of the terminal under test after the heat variable of the terminal under test changes, includes: Change the current, and after changing the current, obtain the second temperature of the terminal under test; The impedance of the terminal under test is calculated based on the temperature difference and the heat variable, including: The impedance is calculated based on the temperature difference, the first current corresponding to the first temperature, the second current corresponding to the second temperature, and the thermal resistance.

7. The terminal connection health detection method according to claim 5, characterized in that, Changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test has changed, includes: Change the thermal resistance, and then obtain the second temperature of the terminal under test after changing the thermal resistance; The impedance of the terminal under test is calculated based on the temperature difference and the heat variable, including: The impedance is calculated based on the temperature difference, the first thermal resistance corresponding to the first temperature, the second thermal resistance corresponding to the second temperature, and the current.

8. The terminal connection health detection method according to claim 5, characterized in that, The electrical parameters include power; changing the heat variable of the terminal under test, and obtaining the second temperature of the terminal under test after the heat variable of the terminal under test changes, includes: The power is changed, and after the power is changed, the second temperature of the terminal under test is obtained; The impedance of the terminal under test is calculated based on the temperature difference and the heat variable, including: The impedance is calculated based on the temperature difference, the first power corresponding to the first temperature, the second power corresponding to the second temperature, the thermal resistance, and the voltage.

9. The terminal connection health detection method according to claim 5, characterized in that, The electrical parameters include voltage; changing the heat variable of the terminal under test, and obtaining a second temperature of the terminal under test after the heat variable of the terminal under test changes, includes: The voltage is changed, and after the voltage is changed, the second temperature of the terminal under test is obtained; The impedance of the terminal under test is calculated based on the temperature difference and the heat variable, including: The impedance is calculated based on the temperature difference, the first voltage corresponding to the first temperature, the second voltage corresponding to the second temperature, the thermal resistance, and the power.

10. The terminal connection health detection method according to claim 5, characterized in that, The electrical parameters include current; changing the heat variable of the terminal under test, and obtaining the second temperature of the terminal under test after the heat variable of the terminal under test changes, includes: The thermal resistance and current are changed, and after changing the thermal resistance and current, the second temperature of the terminal under test is obtained. The impedance of the terminal under test is calculated based on the temperature difference and the heat variable, including: The impedance is calculated based on the temperature difference, the first current and the first thermal resistance corresponding to the first temperature, and the second current and the second thermal resistance corresponding to the second temperature.

11. A terminal connection health detection device, characterized in that, include: The first acquisition module is used to acquire the first temperature of the terminal to be tested; The second acquisition module is used to change the heat variable of the terminal under test, and after the heat variable of the terminal under test is changed, acquire the second temperature of the terminal under test, wherein the heat variable is used to characterize the variable affecting the temperature of the terminal under test; The detection module is used to determine the connection health of the terminal under test based on the temperature difference between the first temperature and the second temperature and preset detection conditions.

12. A power device, characterized in that, The power device includes: At least one processor; and a memory communicatively connected to said at least one processor; The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the terminal connection health detection method according to any one of claims 1 to 10.

13. An electric power system, characterized in that, The power system includes: the power device as described in claim 12.

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