Surface structure recombination treatment method and laser processing equipment
By combining gigahertz laser scanning with a preheating step, the problems of object deformation and uneven heating in heat treatment methods are solved, achieving uniform reorganization of the object's surface structure and performance improvement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2026-03-27
AI Technical Summary
Existing heat treatment methods are prone to deformation or breakage when processing thin sheet objects inside furnace tubes, and the processing range is limited, making it difficult to achieve uniform heating and structural remodeling.
The surface of the object is scanned using a gigahertz laser, and the structure is reorganized through multiple pulse nodes and fundamental frequency pulses. Combined with a preheating step to improve the uniform heating effect, the surface structure is reorganized using laser processing equipment.
This technology enables the structural reorganization of object surfaces by uniform heating in a short time, expands the application range of processed objects, and improves physical properties such as the electrical properties of silicon carbide substrates.
Smart Images
Figure CN121732980A_ABST
Abstract
Description
Technical Field
[0001] This application relates to a surface treatment technology, and more particularly to a method for restructuring an object using a gigahertz (GHz) laser. Background Technology
[0002] Traditional methods for altering the microstructure and surface properties of materials involve heat treatment within furnace tubes. However, such heat treatment is often limited by the size of the furnace tube space, and as the workpieces become increasingly thinner, they are prone to deformation or breakage during heat treatment within the furnace tube.
[0003] Therefore, how to restructure the surface of processed objects through process design and expand their application areas to overcome the aforementioned defects has become one of the important issues that this industry seeks to address. Summary of the Invention
[0004] The technical problem to be solved by this application is to provide a surface structure remodeling processing method that addresses the shortcomings of the prior art, so that the surface of the object is uniformly heated in a short time to remodel the structure, thereby improving the physical properties of the processed object and expanding the application range of the processed object.
[0005] This application provides a surface structure reconstruction processing method, which includes: providing an object and performing a structure reconstruction step, scanning at least a portion of the surface of the object with a gigahertz (GHz) laser to reconstruct the structure of at least a portion of the surface.
[0006] According to a feasible implementation scheme, gigahertz laser scanning includes multiple pulse segments, each pulse segment being periodic and each pulse segment including at least one fundamental frequency pulse.
[0007] According to a feasible implementation plan, the number of fundamental frequency pulses in each pulse segment is 1-2000.
[0008] According to a feasible implementation scheme, the frequency of each pulse node is 1Hz-10GHz; the frequency of each baseband pulse is 0.1GHz-2GHz.
[0009] According to a feasible implementation scheme, the wavelength of each fundamental frequency pulse is from 300 nm to 2000 nm, and the pulse energy of each fundamental frequency pulse is from 10 nJ to 1000 μJ.
[0010] According to a feasible implementation scheme, a preheating step is performed before the structural remodeling step, by scanning at least a portion of the object's surface using another laser scanning method.
[0011] This application also provides a laser processing apparatus suitable for structural reconstruction of the surface of an object. The laser processing apparatus includes a stage, a control device, and a laser device. The stage is used to support the object. The laser device is electrically connected to the control device and includes a laser source module and a galvanometer module. The laser device scans at least a portion of the surface of the object with a gigahertz laser, thereby reconstructing the structure of at least a portion of the surface.
[0012] According to a feasible implementation scheme, gigahertz laser scanning includes multiple pulse segments, each pulse segment being periodic and each pulse segment including at least one fundamental frequency pulse.
[0013] According to a feasible implementation plan, the number of fundamental frequency pulses in each pulse segment is 1-2000.
[0014] According to a feasible implementation scheme, the frequency of each pulse node is 1Hz-10GHz; the frequency of each baseband pulse is 0.1GHz-2GHz.
[0015] According to a feasible implementation scheme, the wavelength of each fundamental frequency pulse is from 300 nm to 2000 nm, and the pulse energy of each fundamental frequency pulse is from 10 nJ to 1000 μJ.
[0016] According to a feasible implementation scheme, a preheating step is performed before the structural remodeling step, by scanning at least a portion of the object's surface using another laser scanning method.
[0017] According to a feasible implementation scheme, the laser processing equipment also includes a spectral imager, which includes a photosensitive element. The spectral imager is electrically connected to a control device, receives reflected light from the object, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image.
[0018] One of the beneficial effects of this application is that the surface structure remodeling method provided by this application can remodel the surface of an object in a short time and with uniform heating by using a gigahertz laser to scan at least a portion of the surface of the object, thereby remodeling at least a portion of the surface. In some technical fields, the object is a silicon carbide substrate. By scanning with a gigahertz laser, the resistance of the silicon carbide substrate can be changed without destroying its shape, thus improving its electrical properties.
[0019] Furthermore, in one embodiment, a preheating step is performed before structural reconstruction, by scanning at least a portion of the object's surface using a second laser scan. This secondary scanning, combined with preheating, results in better structural reconstruction of the object's surface.
[0020] Furthermore, according to one embodiment, the laser processing equipment also includes a spectral imager, including a photosensitive element. The spectral imager is electrically connected to a control device, receives reflected light from the object, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image. In this way, the reorganization of the object's surface structure can be monitored in real time to determine whether the desired effect (such as the outline of the object's surface microstructure) has been achieved, and the conditions of the femtosecond laser can be adjusted accordingly.
[0021] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic flowchart of a surface structure reconstruction method according to an embodiment of this application;
[0024] Figure 2 This is a schematic diagram of the pulse node and fundamental frequency pulse of laser scanning according to an embodiment of this application;
[0025] Figure 3 This is a schematic flowchart of a surface structure reconstruction method according to an embodiment of this application;
[0026] Figure 4 This is a schematic diagram of the architecture of a laser processing device according to an embodiment of this application. Detailed Implementation
[0027] The following specific embodiments illustrate the implementation of the "Surface Structure Reconstruction Processing Method and Laser Processing Equipment" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.
[0028] Please see Figure 1This is a schematic flowchart illustrating a surface structure remodeling processing method according to an embodiment of this application. The surface structure remodeling processing method 100 includes steps S1 to S2. Step S1: Providing an object. According to some embodiments, the object may be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate. Step S2: Performing a structure remodeling step by scanning at least a portion of the surface of the object with a gigahertz laser, causing at least a portion of the surface to undergo structural remodeling. In other words, the surface structure remodeling processing method of this application can cause partial or complete structural remodeling of the object surface, generating multiple microstructures.
[0029] Please see Figure 2 This diagram illustrates a pulse segment PS and a fundamental frequency pulse P in a laser scanning process according to an embodiment of this application. The aforementioned gigahertz laser scanning includes multiple pulse segments PS (or pulse trains), each pulse segment PS being generated periodically, and each pulse segment PS including at least one fundamental frequency pulse P. In some embodiments, the number of fundamental frequency pulses P within each pulse segment PS is 1-2000 (inclusive of any natural number from 1 to 2000). According to some embodiments, the frequency of each pulse segment PS is 1Hz-10GHz (inclusive of any positive integer from 1 to 10); the frequency of each fundamental frequency pulse P is 0.1GHz-2GHz (inclusive of any positive integer from 1 to 2). According to other embodiments, the wavelength of each fundamental frequency pulse P is 300nm-2000nm (inclusive of any positive integer from 300 to 2000), and the pulse energy of each fundamental frequency pulse P is 10nJ-1000μJ (inclusive of any positive integer from 10 to 1000).
[0030] Please see Figure 3 This is a schematic flowchart of a surface structure reconstruction processing method 200 according to an embodiment of this application. According to this embodiment, before performing step S2, a preheating step S11 is also performed, in which at least a portion of the object's surface is scanned using another laser scanning method. Through this secondary scanning and preheating, the surface structure reconstruction effect of the object is improved.
[0031] According to some embodiments, the preheating step involves scanning at least a portion of the object's surface using a laser spot area scanning method. The structural reconstruction step involves scanning at least a portion of the object's surface using a laser spot line scanning method. According to other embodiments, the preheating step involves scanning at least a portion of the object's surface using a laser spot line scanning method. The structural reconstruction step involves scanning at least a portion of the object's surface using a laser spot area scanning method.
[0032] The aforementioned "at least a portion" refers to the area processed by laser. This can be partial processing or processing of the entire surface.
[0033] Please see Figure 3This is a schematic diagram of the architecture of a laser processing device Z according to an embodiment of this application. The laser processing device Z is suitable for structural reconstruction of the surface of an object. The laser processing device Z includes: a stage 1, a control device 2, and a laser device 3. The stage 1 is used to support the object. The laser device 3 is electrically connected to the control device 2. The laser device 3 includes a laser source module 31 and a galvanometer module 32. The laser device 3 scans at least a portion of the surface of the object with a gigahertz laser, thereby reconstructing the structure of at least a portion of the surface.
[0034] The control device 2 is, for example, a computer. According to some embodiments, the object processed by the laser processing equipment Z can be a semiconductor wafer, a silicon carbide substrate, a glass substrate, a metal substrate, or a ceramic substrate.
[0035] In some embodiments, the gigahertz laser scanning of the laser device 3 includes a plurality of pulse segments PS, each pulse segment PS being periodically generated, and each pulse segment PS including at least one fundamental frequency pulse P. In some embodiments, the number of fundamental frequency pulses P in each pulse segment PS is 1-2000 (inclusive of any natural number from 1 to 2000). According to some embodiments, the frequency of each pulse segment PS is 1Hz-10GHz (inclusive of any positive integer from 1 to 10); the frequency of each fundamental frequency pulse P is 0.1GHz-2GHz (inclusive of any positive integer from 1 to 2). According to other embodiments, the wavelength of each fundamental frequency pulse P is 300nm-2000nm (inclusive of any positive integer from 300 to 2000), and the pulse energy of each fundamental frequency pulse P is 10nJ-1000μJ (inclusive of any positive integer from 10 to 1000).
[0036] According to some embodiments, before performing the structural reconstruction step, the laser device 3 also performs a preheating step, scanning at least a portion of the object's surface using another laser scanning method. Through this secondary scanning and preheating, the structural reconstruction effect on the object's surface is improved.
[0037] According to some embodiments, the preheating step involves scanning at least a portion of the object's surface using a laser spot area scanning method. The structural reconstruction step involves scanning at least a portion of the object's surface using a laser spot line scanning method. However, this application is not limited to this; according to other embodiments, the preheating step involves scanning at least a portion of the object's surface using a laser spot line scanning method. The structural reconstruction step involves scanning at least a portion of the object's surface using a laser spot area scanning method.
[0038] Please refer to the following: Figure 4According to this embodiment, the laser processing equipment Z further includes a spectral imager 4, including a photosensitive element 41. The spectral imager 4 is electrically connected to the control device 2, receives reflected light from an object, and correspondingly transmits a photosensitive signal to the control device 2. The control device 2 then generates a spectral image. The photosensitive element 41 is, for example, a charge-coupled device (CCD). According to some embodiments, the light source of the reflected light from the object is a laser beam. According to other embodiments, the spectral imager 4 includes another light source module, such as a light-emitting diode, which illuminates the object with white light, and the photosensitive element 41 receives the reflected light from the object. In other words, according to some embodiments, the optical axis of the laser device 3 can be coaxial with the optical axis of the spectral imager 4. According to other embodiments, the optical axis of the laser device 3 can be non-coaxial with the optical axis of the spectral imager 4; this application is not limiting.
[0039] According to some embodiments, the spectral imager 4 is a hyperspectral imager (HSI). By observing the hyperspectral image, the status of surface structure reorganization of an object can be monitored in real time. For example, structural reorganization is the formation of microstructures on the surface. The hyperspectral image can be used to determine whether the shape of the microstructures is the preset shape, and the processing conditions of laser scanning can be further adjusted.
[0040] "Beneficial effects of the embodiments"
[0041] One of the beneficial effects of this application is that the surface structure remodeling method provided by this application can achieve structural remodeling of the surface of the object by scanning at least a portion of the surface with a gigahertz laser in a short time. In some technical fields, the object is a silicon carbide substrate. By scanning with a femtosecond laser, the resistance of the silicon carbide substrate can be changed without destroying its shape, thereby improving its electrical properties.
[0042] Furthermore, in one embodiment, a preheating step is performed before structural reconstruction, by scanning at least a portion of the object's surface using a second laser scan. This secondary scanning, combined with preheating, results in better structural reconstruction of the object's surface.
[0043] Furthermore, according to one embodiment, the laser processing equipment also includes an optical sensor electrically connected to a control device. The sensor receives reflected light from the object and transmits a photosensitive signal to the control device, which then generates a spectral image. This allows for real-time monitoring of the object's surface structure remodeling and corresponding adjustments to the laser scanning conditions.
[0044] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.
Claims
1. A method for surface structure reconstruction, characterized in that, The surface structure reconstruction process includes: Provide an object; and A structural remodeling step is performed by scanning at least a portion of the surface of the object with a 1 GHz laser, thereby remodeling the at least a portion of the surface.
2. The surface structure reconstruction method according to claim 1, characterized in that, The gigahertz laser scan includes multiple pulse segments, each pulse segment being periodic and each pulse segment including at least one fundamental frequency pulse.
3. The surface structure reconstruction method according to claim 1, characterized in that, The number of fundamental frequency pulses in each pulse segment is 1-2000.
4. The surface structure reconstruction method according to claim 1, characterized in that, The frequency of each pulse node is 1Hz-10GHz; the frequency of each baseband pulse is 0.1GHz-2GHz.
5. The surface structure reconstruction method according to claim 1, characterized in that, The wavelength of each fundamental frequency pulse is from 300 nm to 2000 nm, and the pulse energy of each fundamental frequency pulse is from 10 nJ to 1000 μJ.
6. The surface structure reconstruction method according to claim 1, characterized in that, Before performing the structural remodeling step, a preheating step is also performed, in which at least a portion of the surface of the object is scanned by another laser scan.
7. A laser processing device suitable for structural remodeling of the surface of an object, characterized in that, The laser processing equipment includes: A platform for supporting the object; A control device; and A laser device electrically connected to the control device, the laser device including a laser source module and a galvanometer module, the laser device performing a structural reconstruction step by scanning at least a portion of the surface of the object with a 1 MHz laser, thereby reconstructing the structure of the at least a portion of the surface.
8. The laser processing equipment according to claim 7, characterized in that, The gigahertz laser scan includes multiple pulse segments, each pulse segment being periodic and each pulse segment including at least one fundamental frequency pulse.
9. The laser processing equipment according to claim 8, characterized in that, The number of fundamental frequency pulses in each pulse segment is 1-2000.
10. The laser processing equipment according to claim 8, characterized in that, The frequency of each pulse node is 1Hz-10GHz; the frequency of each baseband pulse is 0.1GHz-2GHz.
11. The laser processing equipment according to claim 8, characterized in that, The wavelength of each fundamental frequency pulse is from 300 nm to 2000 nm, and the pulse energy of each fundamental frequency pulse is from 10 nJ to 1000 μJ.
12. The laser processing equipment according to claim 7, characterized in that, Before performing the structural remodeling step, a preheating step is also performed, in which at least a portion of the surface of the object is scanned by another laser scan.
13. The laser processing equipment according to claim 7, characterized in that, The laser processing equipment also includes a spectral imager, which includes a photosensitive element. The spectral imager is electrically connected to the control device, receives reflected light reflected by the object, and transmits a photosensitive signal to the control device accordingly. The control device then generates a spectral image.