Coaxial visual feedback laser scribing dynamic control method, device, equipment and system

Abstract

The invention provides a coaxial visual feedback laser scribing dynamic control method, device, equipment and system, and relates to a photovoltaic device manufacturing technology. The method comprises the following steps: generating a planned path of an (n + 1) th type of lineation based on an actual path of the nth type of lineation acquired by coaxial vision equipment; the coaxial vision equipment is coaxial with the laser processing light path; executing the (n + 1) th type of lineation according to the planned path, and in the execution process, monitoring the relative position between the (n + 1) th type of lineation which is being formed and the adjacent nth type of lineation in real time through coaxial vision equipment; and dynamically adjusting the planning path according to the deviation between the relative position and a preset relative position. According to the invention, the dead zone can be effectively compressed to ensure the power generation efficiency.

Description

Technical Field

[0001] This application relates to photovoltaic device manufacturing technology, and in particular to a method, apparatus, equipment and system for dynamic control of laser scribing with coaxial visual feedback. Background Technology

[0002] As the industry moves towards large-size, high-efficiency, and low-cost mass production, laser scribing technology must ensure extremely high positioning accuracy to reduce dead zones and increase effective power generation area, while also having the ability to compensate for dynamic deformation caused by thermal effects and material properties during processing in real time, in order to achieve stable and high-yield production.

[0003] Currently, the mainstream technologies for achieving precision laser scribing mainly rely on two methods. The first is to use an ultra-high precision mechanical motion platform to drive the laser processing strictly according to a preset digital path. The second is to introduce vision-assisted positioning, typically by installing a camera (ranged-axis vision) next to the laser processing head. Before scribing begins, the camera photographs and positions the markings or existing scribing lines on the substrate, and then performs a one-time static coordinate correction to the preset laser path.

[0004] However, neither of the above two solutions can effectively cope with dynamic deformation and parallax error in actual processing, resulting in a defect of excessively large dead zone. Summary of the Invention

[0005] This application provides a method, apparatus, equipment, and system for dynamic control of laser scribing with coaxial visual feedback, which can be used to cope with dynamic deformation and parallax error in actual processing, effectively reduce dead zone, and ensure power generation efficiency.

[0006] In a first aspect, this application provides a method for dynamic control of laser line drawing with coaxial visual feedback, the method comprising:

[0007] Based on the actual path of the nth type of line obtained through a coaxial vision device, a planned path for the (n+1)th type of line is generated; the coaxial vision device is coaxial with the laser processing optical path.

[0008] The line drawing of type n+1 is executed according to the planned path, and during the execution, the relative position between the line drawing of type n+1 being formed and the adjacent line drawing of type n is monitored in real time by the coaxial vision device.

[0009] The planned path is dynamically adjusted based on the deviation between the relative position and the preset relative position.

[0010] Secondly, this application provides a coaxial visual feedback laser marking dynamic control device, the device comprising:

[0011] The generation module is used to generate a planned path for the (n+1)th type of line based on the actual path of the nth type of line obtained through a coaxial vision device; the coaxial vision device is coaxial with the laser processing optical path.

[0012] The execution module is used to execute the (n+1)th type of line drawing according to the planned path, and during the execution process, the coaxial vision device monitors in real time the relative position between the (n+1)th type of line drawing being formed and the adjacent nth type of line drawing;

[0013] The adjustment module is used to dynamically adjust the planned path based on the deviation between the relative position and the preset relative position.

[0014] Thirdly, this application provides an electronic device, including at least one processor and a memory communicatively connected to the processor;

[0015] The memory stores computer-executed instructions;

[0016] The processor executes computer execution instructions stored in the memory to implement the method as described in the first aspect.

[0017] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method described in the first aspect.

[0018] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the method described in the first aspect.

[0019] Sixthly, this application provides a coaxial visual feedback laser marking dynamic control system, the system comprising:

[0020] A laser processing device, wherein the processing optical path of the laser processing device is used to generate scribing lines;

[0021] A coaxial vision device, wherein the imaging optical path of the coaxial vision device is coaxial with the processing optical path;

[0022] The electronic device described in the third aspect is communicatively connected to both the laser processing equipment and the coaxial vision device.

[0023] This application provides a method, apparatus, device, and system for dynamic control of laser marking with coaxial visual feedback. The method of this application proposes to obtain the actual path of the nth type of marking based on a coaxial vision device coaxial with the laser processing optical path, generate a planned path for the (n+1)th type of marking, and, during the process of marking the (n+1)th type of marking according to the planned path, monitor the relative position of the (n+1)th type of marking being formed with adjacent nth type markings in real time through the coaxial vision device, and dynamically adjust the planned path according to the deviation between the relative position and the preset relative position. In this process, firstly, through the coaxial integration design of laser and vision, the optical axis of the coaxial vision device is strictly aligned with the optical axis of laser processing, completely eliminating the parallax error inherent in the paraxial vision solution from a physical perspective, achieving precise positioning and providing a foundation for dead zone compression. Secondly, based on the actual path of the nth type of scribing in the previous process, the planned path of the subsequent n+1th type of scribing is generated, rather than relying on a preset fixed program, which can actively avoid the deformation deviation of the nth type of scribing caused by thermal effects and material properties. At the same time, during the execution of the n+1th type of scribing, the coaxial vision device tracks the relative position in real time, and combined with the dynamic feedback adjustment mechanism, it can provide microsecond-level response and compensation for dynamic deformation that occurs in real time during processing, avoiding the risk of short circuits due to line crossing. The synergistic effect of the above technical means eliminates the need to reserve too much safety margin to cope with deformation and positioning errors, thereby stably compressing the dead zone width to an ultra-narrow range, maximizing the effective power generation area of ​​the battery, and ultimately ensuring the photoelectric conversion efficiency of the photovoltaic device. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0025] Figure 1 A schematic diagram illustrating an application scenario of a coaxial visual feedback-based dynamic control method for laser line drawing, as provided in an embodiment of this application.

[0026] Figure 2 A flowchart illustrating a coaxial visual feedback-based dynamic control method for laser marking provided in an embodiment of this application;

[0027] Figure 3 A schematic diagram of the principle of a coaxial visual feedback-based laser marking dynamic control method provided in this application embodiment. Figure 1 ;

[0028] Figure 4 A schematic diagram of the principle of a coaxial visual feedback-based laser marking dynamic control method provided in this application embodiment. Figure 2 ;

[0029] Figure 5 A schematic diagram of a coaxial visual feedback laser scribing dynamic control device provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0031] Figure 7 A schematic diagram of the structure of a coaxial visual feedback laser marking dynamic control system provided in this application embodiment. Figure 1 ;

[0032] Figure 8 A schematic diagram of the structure of a coaxial visual feedback laser marking dynamic control system provided in this application embodiment. Figure 2 .

[0033] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0034] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0035] Perovskite solar cells are considered an important direction for the next generation of photovoltaic technology due to their excellent photoelectric performance. In their manufacturing process, laser scribing is the core process used to form precise insulating trenches (dead zones) on the thin film layer, thereby connecting sub-cells in series. The scribing accuracy directly determines the efficiency and yield of the cell.

[0036] As the industry moves towards large-size, high-efficiency, and low-cost mass production, unprecedented requirements are placed on laser scribing technology: it must ensure extremely high positioning accuracy to reduce dead zones and increase effective power generation area, while having the ability to compensate for dynamic deformation caused by thermal effects and material properties during processing in real time, so as to achieve stable and high-yield production.

[0037] Currently, the mainstream technical solutions for achieving precision laser scribing mainly rely on two types of methods: one is to use an ultra-high precision mechanical motion platform (such as a linear motor or air bearing platform) with a fixed laser optical path. The core logic is to assume that the substrate is perfectly flat and without deformation. The scribing path is generated entirely based on a preset program. The precise displacement of the platform drives the substrate or laser head to complete the scribing operation. Essentially, it relies on the high rigidity and motion precision of the mechanical structure to ensure the accuracy of the scribing position. However, it is easily affected by cumulative errors in large-size processing and is only suitable for small-size, low-deformation scenarios.

[0038] Another type is an upgrade solution that introduces vision-assisted positioning. Typically, one or more cameras are installed next to the laser processing head (i.e., a rangefinder vision layout). Before the scribing process starts, the camera takes pictures of the preset marks on the substrate surface or the completed previous scribing. The system calculates the positioning deviation based on the image recognition results, and then performs a one-time static coordinate compensation on the preset laser path before performing the scribing operation. This attempt to correct the inherent error of mechanical positioning through visual positioning, but it does not change the core logic of positioning before processing, and there is a parallax problem that is difficult to eradicate.

[0039] It is evident that neither of the above two solutions can effectively address the dynamic deformation and parallax error in actual processing, resulting in a large dead zone width, severely sacrificing the effective power generation area, and restricting the improvement of battery efficiency.

[0040] Therefore, embodiments of this application provide a method, apparatus, device, and system for dynamic control of laser marking with coaxial visual feedback to solve the above-mentioned problems. Specifically, the method of this application proposes to first obtain the actual path of the completed nth type of marking using a coaxial vision device arranged coaxially with the laser processing optical path, and then plan the execution path of the (n+1)th type of marking accordingly; during the processing of the (n+1)th type of marking, the coaxial vision device continuously monitors its relative positional relationship with adjacent nth type markings; and then, based on the deviation between the monitored relative position and the preset standard position, the planned path of the (n+1)th type of marking is dynamically adjusted in real time.

[0041] It is understood that the coaxial visual feedback laser scribing dynamic control method of this application is applicable to any scenario that requires scribing or grooving using lasers. For example, Figure 1 This is a schematic diagram illustrating an application scenario of a coaxial visual feedback-based laser marking dynamic control method provided in an embodiment of this application. Figure 1 As shown, this method can be used in the manufacturing of perovskite solar cells for three-line scribing of P1 / P2 / P3 and grooving of functional areas.

[0042] Currently, during the mass production of large-size perovskite solar cells, the substrate is prone to dynamic deformation due to thermal effects. Traditional parietal vision solutions suffer from parallax errors, and static compensation cannot cope with real-time deformation. This not only results in the scribing dead zone width typically exceeding 180μm, sacrificing effective power generation area, but also easily leads to problems such as slot offset and inconsistent slot spacing during grooving, affecting the integrity of the cell structure and series performance, thus restricting the improvement of cell efficiency and yield.

[0043] When applying the method of this application to the above-mentioned scenarios, such as Figure 1 As shown, the completed P1 scribing (or preceding grooving) image is first acquired using a coaxial vision device, and its centerline (or groove center) coordinates are extracted as the actual path. Based on this, the planned path for P2 scribing (or subsequent grooving) is generated. During the processing of P2 scribing (or subsequent grooving), the coaxial vision device acquires images in real time containing both the preceding scribing (or grooving) and the P2 scribing (or current grooving) that is being formed, and monitors their relative positions. If the monitored spacing deviates from the preset standard, the current scribing path (or grooving path) is immediately and dynamically adjusted. Similarly, the planned path for P3 scribing (or subsequent grooving) is generated based on the actual path of P2 scribing (or intermediate grooving). The relative position with P2 scribing (or intermediate grooving) is monitored in real time during processing and dynamically corrected, ultimately completing the precise processing of scribing and grooving throughout the entire process.

[0044] In the above process, the coaxial design of the coaxial vision equipment and the laser processing optical path eliminates the parallax error of the off-axis vision at the physical level, realizing what you see is what you process. This provides core precision assurance for the compression of the scribing dead zone and the precise control of the slotting position. Real-time position monitoring and dynamic path adjustment during processing can actively compensate for scribing / slotting offset caused by substrate thermal deformation, avoiding the risk of line crossing or slot misalignment. Without reserving too much safety margin, the dead zone width can be stably compressed to an ultra-narrow range, while ensuring the consistency of the slotting spacing, maximizing the effective power generation area of ​​the battery and ensuring structural reliability. The real-time dynamic control mode is adapted to the high-speed processing requirements of large-size mass production scenarios, effectively improving product yield and consistency.

[0045] It should be understood that, in the above process, the executing entity can be any electronic device in the scenario, which can be set up independently or integrated into the control system of the existing processing equipment in the scenario. This embodiment does not limit this. In addition, the application scenario of the method of this application can also be other photovoltaic device laser precision scribing and grooving scenarios, such as crystalline silicon solar cell slab scribing and electrode groove processing, thin film photovoltaic device isolation scribing and functional area grooving, etc. This embodiment does not limit this.

[0046] The following detailed description, with reference to the accompanying drawings and using an electronic device as the execution subject, outlines some embodiments of the coaxial visual feedback laser line drawing dynamic control method of this application. Where the embodiments do not conflict, the following embodiments and features thereof can be combined with each other.

[0047] This application provides a method for dynamic control of laser marking with coaxial visual feedback. Figure 2 A flowchart illustrating a coaxial visual feedback-based dynamic control method for laser line drawing, as provided in this application embodiment, is shown below. Figure 2 As shown, the method in this application embodiment includes:

[0048] S201. Based on the actual path of the nth type of line obtained through the coaxial vision device, generate the planned path of the (n+1)th type of line.

[0049] In this embodiment, the coaxial vision device is coaxial with the laser processing optical path. Specifically, the core components of the coaxial vision device are integrated into the optical path structure of the laser processing system, including a laser system, a coaxial illumination unit, a beam splitter assembly, a coaxial camera, and a narrowband filter. Each component is arranged according to a specific optical path logic to achieve optical axis coincidence.

[0050] In this embodiment, the collimated laser beam emitted by the laser system is reflected by the beam splitter assembly and then focused onto the workpiece surface (photovoltaic thin-film device substrate) by the field lens; the coaxial illumination unit uses a ring LED light source to provide uniform, shadow-free observation illumination to the processing area; the beam splitter assembly (which can be a dichroic beam splitter or a polarizing beam splitter prism, and if it is a polarizing beam splitter prism, it needs to be paired with a quarter-wave plate) simultaneously allows the illumination light reflected from the processing surface to be transmitted to the imaging path; a narrowband filter is set in the imaging optical path in front of the coaxial camera, and its passband center wavelength is matched with the wavelength of the coaxial illumination unit to filter out the processing laser reflected light, plasma arc light and stray light; the optical axis of the coaxial camera is strictly coincident with the laser processing optical axis through the beam splitter assembly to ensure that the observation position is completely consistent with the processing position, realizing what is seen is what is processed.

[0051] It should be noted that the method in this embodiment is used for the manufacture of photovoltaic thin-film devices. The nth type of scribing and the (n+1)th type of scribing are any two different types of P1 scribing, P2 scribing, and P3 scribing that constitute an internal series circuit.

[0052] It should be understood that the P1, P2, and P3 scribing lines are all designed according to the series circuit requirements of photovoltaic thin-film devices, and a preset number of parallel scribing lines are set. The specific number is determined according to the device size, power requirements, and process standards. For example, the number of each type of scribing line in a square meter-level module can reach hundreds.

[0053] The positional relationship of the three types of scribing is as follows: the P1 scribing is used to divide the transparent conductive film layer to form an independent front electrode unit; the P2 scribing is located between adjacent P1 scribings and is used to divide the perovskite power generation layer, while realizing the connection between the front electrode and the back electrode; the P3 scribing is used to divide the back electrode layer and complete the series connection of the micro power generation unit. Finally, through the orderly arrangement of the three scribings, the entire photovoltaic thin film device is divided into multiple series micro power generation units. The three types of scribings are parallel to each other and have uniform spacing. The spacing is the dead zone width, which directly affects the effective power generation area of ​​the device.

[0054] In this embodiment, the electronic device is connected to a coaxial vision device, which acquires a clear image of the scribing area to obtain the actual path. This actual path refers to the true trajectory of the nth type of scribing after it is actually formed on the substrate, presented in the form of centerline coordinates. It is the core data reflecting the actual position, shape, and deformation state of the scribing, which is different from the preset theoretical path and can truly reflect the deformation effects caused by thermal effects and material properties during the processing.

[0055] Specifically, the electronic device acquires an image of the completed nth type of line through a coaxial vision device to obtain an nth type of line image; based on the nth type of line image, the centerline coordinates of the nth type of line are extracted as the actual path.

[0056] More specifically, in this embodiment, during the image acquisition process, the electronic device controls the coaxial illumination unit to provide uniform and stable illumination, ensuring that the scribbled area and the background form a clear contrast. The coaxial camera performs precise imaging on the completed nth type of scribbled line to obtain image data containing the complete outline of the scribbled line.

[0057] After image acquisition, the electronic device transmits the image data to the FPGA high-speed processing unit for a series of processing steps: First, the image is processed in grayscale to enhance the contrast between the doodle edge and the background by adjusting the pixel grayscale values, thereby reducing the impact of stray light on the imaging effect; then, a customized Blob analysis algorithm is used to process the grayscale-processed image to accurately identify the edge contour of the nth type of doodle and determine the pixel coordinates of the two sides of the doodle; based on the identified coordinates of the two sides of the doodle, the center line of the doodle is obtained through geometric calculation, and then the complete coordinate information of the center line is extracted to form actual path data that can accurately represent the actual trajectory of the nth type of doodle. The entire image processing process relies on the hardware parallel computing capability of the FPGA to achieve efficient and fast response.

[0058] It should be understood that in practical applications, during image acquisition, the brightness and wavelength parameters of the coaxial illumination unit can be adaptively adjusted based on the reflectivity of different film layers of the photovoltaic thin-film device (such as transparent conductive film, perovskite power generation film, and back electrode film), or different types of beam splitter components can be replaced to optimize optical path adaptability. During image processing, edge detection algorithms (such as the Canny algorithm) and threshold segmentation algorithms can be used to replace the Blob analysis algorithm, or algorithm fusion can be used to achieve simultaneous grayscale processing and contour recognition, thereby improving processing efficiency. When determining the actual path, the center axis can be fitted based on the pixel distribution density of the lined area, or the center line can be determined by fitting a straight line / curve to discrete edge points using the least squares method. At the same time, the coordinates of the detected edge points can also be used as the actual path during image processing, but this embodiment does not limit this.

[0059] In addition, in practical applications, the image processing process can also be completed by other dedicated processing units with high-speed parallel computing capabilities, such as GPU image processing modules, ASIC custom chips, DSP digital signal processors, etc., or by the electronic device itself. This embodiment does not limit this.

[0060] In the above process, the coaxial illumination unit and narrowband filter effectively filter out the interference of processing residual light and ambient stray light, ensuring the clarity and purity of the acquired image and providing a high-quality data foundation for subsequent processing. The high-speed image processing flow based on FPGA realizes accurate recognition of the outline of the scribbled line and efficient extraction of the center line coordinates, ensuring that the actual path can truly restore the actual state of the nth type of scribbled line.

[0061] Furthermore, in this embodiment, after obtaining the actual path of the nth type of line, the electronic device must strictly follow the manufacturing process requirements of the photovoltaic thin film device (including but not limited to the conduction performance requirements of the series circuit, the dead zone width design standard, and the requirements for avoiding damage to the film structure, etc.) and generate the planned path of the (n+1)th type of line based on the actual path.

[0062] It should be understood that this step is executed before the processing of each (n+1)th type of line. That is, for each line drawn in P2, it is executed before its processing begins; for each line drawn in P3, it is also executed before its processing begins. This ensures that each subsequent line can generate a planned path based on the actual trajectory of the previous line, avoiding the accumulation of batch deformation.

[0063] As an example, when n=1, the first type of scribing is the P1 scribing. After all P1 scribings have been processed, before starting the processing of each P2 scribing, the electronic device will re-acquire the actual paths of the two adjacent P1 scribings corresponding to the P2 scribing through the coaxial vision device (to avoid deviation of the trajectory of a single P1 scribing due to local deformation of the substrate). Then, according to the preset spacing required by the process, the dedicated planning path of the current P2 scribing is generated to ensure that each P2 scribing can accurately adapt to the actual position of the P1 scribings on both sides.

[0064] When n=2, the second type of scribing is P2 scribing. After each P2 scribing is processed, before starting the processing of each P3 scribing, the electronic device will collect the actual path of the two adjacent P2 scribings corresponding to the P3 scribing through the coaxial vision device (capturing the dynamic deformation generated during the processing of P2 scribing in real time), and then generate the planned path of the current P3 scribing based on the preset spacing standard, so as to ensure that each P3 scribing can maintain a precise spacing with the P2 scribings on both sides.

[0065] In one instance, the electronic device calculates the systematic deviation between the actual path of the nth type of marking and the preset theoretical path corresponding to the nth type of marking; based on the systematic deviation, it performs feedforward compensation on the planned path to obtain the final planned path used in the processing.

[0066] In this embodiment, the feedforward compensation process is also synchronized before processing each (n+1)th type of scribing. That is, when generating the planned path for each P2 / P3 scribing, the systematic deviation between the actual path and the preset theoretical path of its two adjacent P1 / P2 scribings is first calculated, and then the planned path of the current P2 / P3 scribing is compensated in a targeted manner to ensure that the deviation of a single scribing is offset in a timely manner and does not affect the accuracy of subsequent batch scribing.

[0067] Specifically, the preset theoretical path refers to the pre-set scribing trajectory based on the design drawings of photovoltaic thin film devices under ideal processing conditions (i.e., no thermal deformation or microscopic warping of the substrate, no positioning error or process interference of the processing equipment). It includes core parameters such as the starting point coordinates, ending point coordinates, extension direction, and spacing between adjacent scribing lines. It is stored in the memory of electronic equipment in the form of a set of digital coordinates as a reference for processing.

[0068] Based on this, when calculating systematic deviations, the electronic equipment compares the centerline coordinates of the actual path of the nth type of line drawing with the corresponding preset theoretical path coordinates point by point, and counts the positional deviation values ​​of each corresponding point in the X-axis direction and Y-axis direction respectively. Then, the distribution law of the deviation (such as linear offset deviation, nonlinear deformation deviation, etc.) is analyzed by algorithm, and the regular deviations caused by factors such as cumulative equipment error and overall deformation of the substrate are screened out, that is, systematic deviations.

[0069] Furthermore, the electronic equipment determines the compensation direction and amount based on the pattern of systematic deviation, and corrects the planned path of the (n+1)th type of scribing point by point. For example, if the actual path of the P1 scribing is shifted by 4μm in the positive X-axis direction (systematic deviation), then when generating the planned path of the P2 scribing, the coordinates of each P2 scribing are shifted by 4μm in the positive X-axis direction to offset the influence of systematic deviation and ensure that the relative position of the (n+1)th type of scribing and the nth type of scribing strictly meets the process requirements.

[0070] It should be understood that for such regular systematic deviations, in addition to compensation when generating subsequent scribing paths, pre-compensation can also be performed directly on the preset theoretical path of the nth type of scribing that causes the deviation during the early equipment debugging or process preparation stage. For example, if it is found that the P1 scribing generally has a systematic deviation of 4μm offset in the positive X-axis direction, then in the preset theoretical path of the P1 scribing, the coordinates of all P1 scribings can be offset by 4μm in the negative X-axis direction as a whole, thereby canceling the systematic deviation at its source and simplifying the compensation logic of subsequent scribing.

[0071] It should be understood that in other instances, the calculation of systematic deviation can also be achieved through the following process: selecting key feature points of the line drawing (such as the starting point, midpoint, and ending point) for deviation comparison, eliminating the need for point-by-point calculation, thus simplifying the calculation process and improving processing efficiency; or by fitting the curve equations of the actual path and the theoretical path, calculating the offset between the curves as the systematic deviation; feedforward compensation can also be achieved through the following process: adopting a segmented compensation strategy according to the severity of the deviation, performing precise compensation for areas with large deviations and simplified compensation for areas with small deviations, or establishing a deviation prediction model based on historical processing data to perform predictive compensation for the planned path in advance. This embodiment does not limit this approach.

[0072] Through the above examples, it is possible to proactively offset regular deviations generated during processing (such as cumulative equipment positioning errors, overall thermal deformation of the substrate, etc.), preventing deviations from continuously accumulating in the scribing process of P1→P2→P3, and ensuring the relative positional accuracy of each scribing line; at the same time, it can make the planning path of the n+1th type of scribing line more closely match the actual processing scenario, without the need to reserve additional safety margins to avoid systematic deviations, providing a key guarantee for the extreme compression of dead zone width; in addition, it can also effectively improve the consistency of scribing position of devices in different batches and different regions, reduce product performance differences, help improve the overall yield and reliability of photovoltaic thin film devices, and reduce quality costs in the production process.

[0073] S202. Perform the (n+1)th type of line marking according to the planned path, and monitor the relative position between the (n+1)th type of line marking being formed and the adjacent (n)th type of line marking in real time through a coaxial vision device.

[0074] In this embodiment, after each P2 / P3 scribing is initiated, the electronic device controls the laser processing equipment to execute the (n+1)th type of scribing according to the planned path determined in the aforementioned process. During execution, the electronic device controls the coaxial vision device to monitor the relative position between the (n+1)th type of scribing and the adjacent nth type of scribing in real time.

[0075] It should be understood that, since all three types of lines are parallel and evenly distributed multi-line structures (each type of line has a preset number of hundreds), any (n+1)th type line is located between two parallel (n)th type lines. That is, each (n+1)th type line corresponds to two directly adjacent (n)th type lines (for example, each line of P2 line is located between two parallel (P1) lines; each line of P3 line is located between two parallel (P2) lines). These two (n)th type lines constitute the two side boundary references of the (n+1)th type line.

[0076] In this embodiment, relative position refers to the spatial relationship between the real-time trajectory of the (n+1)th type of line being formed and the actual paths of the adjacent (n)th type of lines on both sides. The core includes two key parameters: First, the distance between the (n+1)th type of line and the adjacent (n)th type of line on the left and the distance between the (n)th type of line and the adjacent (n)th type of line on the right (i.e., the dead zone width on both sides), which must strictly match the uniform spacing standard preset by the process; Second, the parallelism between the (n+1)th type of line and the adjacent (n)th type of lines on both sides, to ensure that the extension direction of the three is consistent and to avoid local spacing being too small or short-circuiting due to tilting.

[0077] For example, during the execution of the P2 line drawing, the relative position is specifically reflected in the real-time distance between the P2 real-time trajectory and the left and right P1 lines, as well as the parallelism deviation between the P2 trajectory and the two P1 trajectories. These parameters directly determine the uniformity of the dead zone width and the reliability of the circuit series connection.

[0078] Specifically, in this embodiment, during execution, the electronic device acquires the (n+1)th type of line image through a coaxial vision device; processes the (n+1)th type of line image to identify and locate the instantaneous position of the (n+1)th type of line that is being formed; and calculates the relative position based on the instantaneous position and the actual path of the acquired (n)th type of line.

[0079] More specifically, in this embodiment, the electronic device controls the coaxial vision device to continuously acquire real-time images containing the (n+1)th type of scribbling line that is being formed and the nth type of scribbling line on both sides. During the acquisition process, the coaxial illumination unit provides uniform illumination with adaptive brightness, and the narrow-band filter accurately filters out the processing laser reflected light, plasma arc light and ambient stray light to ensure that the outline of the scribbling line in the image is clear and free of interference.

[0080] Similarly, in this embodiment, the acquired image data is transmitted to the FPGA high-speed processing unit in real time. The unit first performs grayscale enhancement processing on the image, and strengthens the contrast between the edge of the scribbled line and the background of the substrate by adjusting the pixel grayscale distribution. Then, a customized Blob analysis algorithm is used to perform parallel operations on the image to accurately outline the instantaneous edge contour of the n+1th type of scribbled line that is forming, and then calculates its instantaneous center line coordinates (i.e., instantaneous position).

[0081] Subsequently, the FPGA high-speed processing unit retrieves the previously stored actual path data (centerline coordinates) of the nth type of line. After coordinate system normalization, it compares the instantaneous position of the (n+1)th type of line with the spatial relationship of the actual paths of the adjacent nth type of lines on both sides, calculates the instantaneous time distance value (i.e., the real-time dead zone width on both sides), and solves the angle between the instantaneous trajectory and the trajectory of the nth type of line by fitting the straight line equation to obtain the parallelism deviation, and finally forms complete relative position data.

[0082] In practical applications, image acquisition and processing can also be achieved through the other methods mentioned above, which will not be elaborated here. In practical applications, when calculating relative positions, key feature points of the line (such as the starting point, midpoint, and ending point) can be selected to calculate the spacing and parallelism without comparing point by point, so as to balance accuracy and calculation speed. This embodiment does not limit this.

[0083] In addition, in practical applications, the real-time distance between the (n+1)th type of scribe line and the adjacent nth type of scribe line can be detected in real time by a laser displacement sensor, and the parallelism between the two can be monitored by an angle sensor, or the relative position can be obtained by integrating multi-dimensional data such as vision, displacement, and angle through multi-sensor data fusion technology. This application does not limit this to either.

[0084] In the above process, by identifying the position of the forming scribing line in real time and dynamically comparing and calculating it with the actual path of the previously accurately obtained scribing line, a dynamic reference system based entirely on the actual physical state is constructed. Based on this, the traditional logic relying on preset static coordinates can be fundamentally abandoned, ensuring that the generation of each new scribing line is strictly anchored to the actual result of the previous scribing line, thereby effectively preventing the transmission and accumulation of processing errors between processes. Simultaneously, this mechanism enables the system to possess in-situ response and compensation capabilities, automatically offsetting dynamic interference introduced during processing by factors such as material deformation and thermal drift, effectively improving the consistency of scribing line spacing and the overall stability and accuracy of the process.

[0085] S203. Dynamically adjust the planned path based on the deviation between the relative position and the preset relative position.

[0086] The preset relative position is a benchmark parameter pre-set based on the manufacturing process requirements of photovoltaic thin film devices, circuit series reliability standards, and dead zone width optimization targets. The core parameters include the preset distance between the (n+1)th type of scribing and the adjacent nth type of scribing on the left (i.e., the target dead zone width, such as the ultra-narrow dead zone standard value of the process design), the preset distance between the nth type of scribing and the adjacent nth type of scribing on the right, and the preset parallelism tolerance of the three (such as the maximum allowable tilt angle ≤ ±0.1°). This parameter is stored in the electronic device in the form of digital coordinate relationship or threshold range, and serves as the core basis for deviation judgment and path adjustment.

[0087] In this embodiment, the electronic device compares the relative position data (including real-time spacing between the two sides and actual parallelism) obtained by real-time monitoring with the corresponding parameters of the preset relative position one by one, calculates the difference between the real-time spacing and the preset spacing (e.g., left spacing deviation = real-time left spacing - preset left spacing), and the deviation value between the actual parallelism and the preset parallelism tolerance, forming a complete deviation dataset, and accurately quantifying the degree of deviation between the current line drawing path and the ideal state.

[0088] Furthermore, in this embodiment, when the deviation exceeds a preset information interval, the electronic device generates a path adjustment command; and updates the planned path according to the path adjustment command.

[0089] Specifically, the preset confidence interval is the allowable range of deviation determined based on process accuracy requirements, equipment response capability, and material properties. It is a key threshold for balancing processing accuracy and adjustment efficiency (for example, the confidence interval for spacing deviation is set to ±2μm, and the confidence interval for parallelism deviation is set to ±0.05°). Its value can be flexibly adapted according to different film processing scenarios and high-speed / low-speed processing modes.

[0090] In this embodiment, the electronic device first verifies the validity of the deviation data to eliminate abnormal deviations caused by instantaneous imaging interference. Then, based on the verified deviation value, and in conjunction with the compensation algorithm pre-stored in the FPGA high-speed processing unit, it calculates the path correction amount in the same direction (e.g., when the left spacing deviation is -3μm, the correction amount is to shift to the left by 3μm to increase the left spacing; when the parallelism deviation exceeds the tolerance, the trajectory angle correction value is calculated). Finally, the correction amount is converted into a path adjustment command that the laser processing equipment can recognize. The command contains key parameters such as adjustment direction, adjustment amplitude, and adjustment rate to ensure a smooth and accurate adjustment process.

[0091] In this embodiment, the electronic device sends adjustment instructions to the control module of the laser processing equipment in real time, and synchronously updates the currently executed n+1 type of line drawing path, so as to realize the dynamic matching between the planned path and the actual processing requirements.

[0092] It should be understood that in practical applications, a dynamic confidence interval strategy can also be adopted, which adaptively adjusts the interval range according to the processing area (such as the edge and center area of ​​the device) and the scribing type (P2 / P3). The edge area can be appropriately widened to adapt to the edge deformation of the substrate. When generating path adjustment instructions, the correction amount can also be calculated based on the deviation gradient using a proportional-integral-derivative (PID) control algorithm, or a deviation prediction model can be established by combining historical adjustment data to generate predictive adjustment instructions in advance. When updating the path, a segmented update strategy can also be adopted, which prioritizes updating the path in areas with larger deviations and keeps the original path in areas with smaller deviations, so as to balance the adjustment accuracy and processing efficiency. This embodiment does not limit this.

[0093] In this embodiment, by generating an adjustment command and updating the path when the deviation exceeds the confidence interval, it is possible to proactively avoid the accumulation of deviations by adjusting the path in a timely manner to address the real-time deformation caused by substrate thermal effects and material properties during processing. This solves the problem that static solutions cannot cope with dynamic deformations and avoids the risk of short circuits caused by line crossings. The setting of the confidence interval avoids frequent adjustments caused by small deviations, reducing path fluctuations, and can also correct deviations that exceed the allowable range in a timely manner, ensuring that the dead zone width is stably controlled within the ultra-narrow range of the process design, maximizing the effective power generation area of ​​the device. At the same time, through a standardized deviation judgment and adjustment process, the positional differences of the scribing lines in different batches and different areas are reduced, effectively improving product yield and reliability.

[0094] In addition, in practical applications, the judgment may not be based on the confidence interval. For example, a strategy of adjusting as soon as there is a difference can be adopted. As long as a deviation between the relative position and the preset relative position is detected, an adjustment instruction correction path is generated in real time regardless of the size of the deviation. Alternatively, a hierarchical adjustment strategy can be adopted (different adjustment priorities and adjustment ranges are set according to the size of the deviation). This application does not limit this.

[0095] The method provided in this embodiment relies on the innovative design of laser-vision coaxial integration to ensure that the optical axis of the coaxial vision device and the optical axis of laser processing are strictly coincident. This completely eliminates the parallax error inherent in traditional off-axis vision solutions from the physical architecture level, achieving precise positioning and laying a solid core physical foundation for the extreme compression of dead zone width. It abandons the traditional mode that relies on preset fixed programs and dynamically generates the planned path of the subsequent n+1th type of line drawing based on the actual path of the previous nth type of line drawing. It can actively adapt to and avoid the deformation deviation of the nth type of line drawing caused by thermal effects and the material's own characteristics, ensuring the adaptability and accuracy of path planning.

[0096] Furthermore, during the processing of the (n+1)th type of scribing, the relative position of the scribing to the adjacent nth type of scribing is continuously tracked in real time by a coaxial vision device. Combined with a dynamic feedback adjustment mechanism based on FPGA hardware acceleration, millisecond-level response and precise compensation can be achieved for dynamic deformations that occur in real time during processing, thus eliminating the risk of short circuits due to line crossings at the source.

[0097] The three core technologies mentioned above form a deep synergistic effect, eliminating the need to reserve extra safety margins to cope with deformation and positioning errors. This allows the dead zone width to be stably compressed to an ultra-narrow range, maximizing the effective power generation area of ​​the battery. Ultimately, this constructs an intelligent closed loop of processing, testing, and calibration, providing a dual reliable guarantee for the photoelectric conversion efficiency and mass production yield of photovoltaic devices.

[0098] As a preferred example, after all three types of scribing (P1, P2, P3) are completed, the electronic equipment performs dead zone width statistical analysis and process quality assessment based on the scribing position data and dynamic adjustment records collected and stored in real time during the scribing process, and obtains analysis and assessment results; based on the analysis and assessment results, a processing quality report is generated; the processing quality report includes quality judgment, anomaly location and process trend.

[0099] In this embodiment, the electronic device initiates an offline quality analysis and process optimization feedback process, performs multi-dimensional statistical distribution analysis on the dead zone width data collected throughout the process, and generates a complete report covering the processing quality of a single substrate and the process trend of a batch, providing data support for subsequent production optimization.

[0100] Specifically, the electronic device first retrieves the full dead zone width data stored in the FPGA high-speed processing unit, including the real-time spacing between each P2 scribing and the two P1 scribings on both sides, the real-time spacing between each P3 scribing and the two P2 scribings on both sides, and the deviation correction records dynamically adjusted during the processing, ensuring that the data covers the complete processing cycle of each scribing. Subsequently, the electronic device performs layered processing on the data: according to the scribing type (P1-P2 dead zone, P2-P3 dead zone), it calculates key statistical quantities such as average, standard deviation, maximum, and minimum values ​​to clarify the uniformity of the dead zone width within a single substrate; by drawing histograms, box plots, and other statistical charts, it visually presents the distribution characteristics of the dead zone width and determines whether there is any abnormal discrete data (such as out-of-tolerance dead zones caused by severe local deformation of the substrate or laser energy fluctuations).

[0101] Based on this, the electronic equipment compares the statistical results with the dead zone width threshold required by the process design (such as the ultra-narrow dead zone standard value ±3μm) to complete the quality judgment: if all dead zone width data are within the threshold range and the standard deviation is less than the preset control limit (such as ≤1μm), the dead zone accuracy of the substrate is judged to meet the requirements and marked as a qualified product; if there is abnormal data exceeding the threshold, the electronic equipment will locate the scribing position corresponding to the abnormal dead zone (such as the local dead zone width of a certain P2 scribing line and the left P1 scribing line exceeding the standard), and trace back the processing log of that position (including the dynamic adjustment record at that time, image acquisition data, substrate positioning parameters, etc.) to analyze the cause of the abnormality (such as local warping of the substrate, improper adaptation of lighting parameters, etc.), providing a basis for subsequent targeted optimization.

[0102] Furthermore, the electronic equipment performs correlation analysis between the quality data of a single substrate and historical batch data to extract process trend characteristics. For example, it statistically analyzes the average change trend of dead zone width across multiple consecutive batches to determine if there are any electronic equipment issues such as equipment positioning accuracy attenuation or laser energy drift. It also compares the dead zone width distribution differences corresponding to different film types and substrate specifications to optimize preset values ​​of process parameters under different scenarios (such as adjusting the illumination brightness and confidence interval range of specific film layers). The resulting processing quality report includes core content such as single substrate quality judgment results, anomaly location and cause analysis, batch process trend charts, and parameter optimization suggestions. This report can be stored in the electronic equipment database in real time or transmitted to the factory's MES system via an interface to achieve data sharing.

[0103] This preferred example extends the closed-loop control of single-processing to batch optimization, enabling continuous process iteration through data-driven approaches. On one hand, it prevents defective products from flowing into subsequent processes, reducing quality costs; on the other hand, it eliminates reliance on human experience, allowing for process optimization through objective data mining, improving equipment adaptability to different production scenarios, and contributing to the long-term stable operation of the production line. This further strengthens the advantages of a fully intelligent closed-loop process encompassing processing, inspection, calibration, and optimization.

[0104] This application also provides a dynamic control method for laser scribing with coaxial vision feedback, which is used to describe in detail the control process of laser processing equipment and coaxial vision equipment.

[0105] Specifically, Figure 3 A schematic diagram of the principle of a coaxial visual feedback-based laser marking dynamic control method provided in this application embodiment. Figure 1 .like Figure 3 As shown, in this embodiment, the electronic device controls the laser to operate in pulse mode; and controls the coaxial vision device to perform exposure during the interval of the laser pulse to acquire the nth type of scribing image and / or the (n+1)th type of scribing image.

[0106] More specifically, such as Figure 3 As shown, the time axis clearly divides the laser pulse duration t1 and the pulse interval t2. The electronic device achieves the collaborative work of the laser and the coaxial vision device through time-synchronous control: the laser emits laser pulses at a preset frequency, and the laser beam is focused on the substrate surface to complete local scribing during the t1 period; when the laser pulse ends and enters the t2 period (i.e., the pulse interval), the electronic device synchronously triggers the coaxial illumination unit to turn on and controls the coaxial camera to perform ultra-short exposure. At this time, there is no laser interference in the processing area, and the camera can acquire a clear image containing the complete outline of the nth type scribing, or the instantaneous trajectory of the (n+1)th type scribing that is forming and the adjacent nth type scribing; after the exposure is completed, the image data is transmitted to the FPGA high-speed processing unit in real time, and the laser prepares for the next round of pulse emission, forming a cyclical collaborative mode of laser processing-intermittent exposure-image processing, ensuring that processing and imaging do not interfere with each other.

[0107] It should be understood that in practical applications, the exposure time of the coaxial camera can be adaptively adjusted according to the laser pulse frequency, and multiple short exposures can be completed within the t2 time period and the images can be superimposed to improve image quality. For different film layer reflection characteristics, the timing of the coaxial illumination unit can be adjusted, and the illumination can be started 1-2ms in advance before the exposure to stabilize the light field. If the laser pulse interval t2 is short, inter-frame compression technology can be used to acquire images in different regions within two adjacent t2 time periods and stitch them together to form a complete line drawing image. This embodiment does not limit this.

[0108] In this embodiment, controlling the laser to operate in pulse mode and expose during the intermittent period effectively avoids interference from processing light. During the laser pulse intermittent period, no processing laser or plasma arc light is generated. Combined with the effect of the narrow-band filter, the coaxial camera can acquire images without overexposure or stray light interference, effectively improving the clarity and contrast of the scribing outline, providing a high-quality data foundation for subsequent feature extraction and coordinate calculation. Furthermore, it enables parallel processing and imaging, allowing image acquisition without pausing the processing flow, effectively avoiding the impact of additional inspection time on production efficiency. Simultaneously, it ensures the accuracy of instantaneous trajectory capture. During the n+1 type of scribing process, high-frequency exposure during the pulse intermittent period accurately captures the instantaneous trajectory during the scribing process, providing timely and continuous data support for dynamic feedback adjustments. In addition, it effectively protects the coaxial camera sensor from direct laser irradiation, preventing damage.

[0109] In practical applications, the laser can also be controlled to operate in continuous wave mode, while a narrowband filter with higher bandwidth and a fast shutter can be configured for the coaxial camera to avoid laser interference through the coordinated use of filtering and high-speed shading; or a laser pulse and camera exposure misalignment triggering technology can be used to complete the exposure within the period when the laser pulse intensity decays to a safe threshold. This application does not limit this to either.

[0110] It should be understood that the electronic device in this application, as the logical entity executing the various method steps, can have its core processing capabilities implemented by one or more dedicated hardware processors. In a preferred embodiment, the electronic device includes the aforementioned Field Programmable Gate Array (FPGA). FPGAs, with their hardware parallel architecture and programmable characteristics, are particularly suitable for high-speed, real-time processing of images acquired by the coaxial vision module (such as the identification and localization of instantaneous positions in the (n+1)th type of line drawing image), and for implementing millisecond-level dynamic adjustment calculations of planned paths.

[0111] Therefore, the core control functions such as high-speed image processing, real-time deviation calculation, and dynamic path adjustment performed by electronic devices as described in the context of this application can all be efficiently carried out and completed by FPGA in specific implementations, so as to ensure the response speed and determinism of the entire control closed loop and meet the stringent real-time requirements of laser precision machining.

[0112] As a further detailed explanation of the method in this application, Figure 4 A schematic diagram of the principle of a coaxial visual feedback-based laser marking dynamic control method provided in this application embodiment. Figure 2 .like Figure 4As shown, this method demonstrates a complete dynamic control loop for line drawing (P1, P2, P3). Its core lies in using each completed line drawing as the dynamic benchmark for the next line drawing, and performing real-time closed-loop corrections during execution. The specific process is as follows:

[0113] Substrate positioning initialization stage: First, the photovoltaic thin film device substrate is loaded onto the dynamic control platform. The array camera in the multi-sensor positioning module scans and collects the edge contour of the substrate or preset mark points (reference points). The collected data is transmitted to the FPGA high-speed processing unit in real time. The FPGA unit performs grayscale processing on the image to accurately identify the actual position of the substrate edge contour or mark points. Based on this position, a dedicated geometric coordinate system is established to finally locate the starting point of P1 line drawing, providing a unified and accurate coordinate reference for subsequent line drawing and avoiding initial positioning errors caused by substrate placement deviations.

[0114] P1 Marking and Trajectory Recording Stage: The dynamic control platform initiates motion based on the initial positioning results, driving the laser processing equipment to perform P1 marking. During processing, the coaxial camera synchronously performs parallax-free imaging, acquiring images of the P1 marking process in real time and outputting them to the display screen and FPGA high-speed processing unit. The FPGA unit performs grayscale enhancement and edge contour recognition on the acquired P1 marking images, accurately extracting the centerline coordinates of the P1 marking to form the actual path data of the P1 marking. At the same time, the actual path is compared with the preset theoretical trajectory, and the motion parameters of the dynamic correction platform are adjusted through negative feedback to ensure the straightness and positional accuracy of the P1 marking, providing a reliable reference trajectory for subsequent P2 marking.

[0115] In the P2 scribing path generation and dynamic correction stage: Based on the stored actual P1 scribing path and the pre-set P1-P2 dead zone width standard, the FPGA high-speed processing unit generates the initial planned path for each P2 scribing. After starting P2 scribing processing, the coaxial camera continuously acquires real-time images containing the instantaneous trajectory of the current P2 scribing and the two adjacent P1 scribings, and transmits them to the FPGA unit in real time. The FPGA unit quickly analyzes the difference between the current P2 scribing coordinates and the actual paths of the adjacent P1 scribings. If the difference is within the preset confidence interval, the current planned path is maintained and processing continues. If the difference exceeds the confidence interval, the path correction amount is immediately calculated, and the P2 scribing path is adjusted in real time. During processing, the FPGA unit also continuously identifies the edge contours of P2 and adjacent P1 scribings, extracts the center position of the adjacent P1 scribings to perform secondary correction on the P2 path, and extracts the actual path of the P2 scribing to provide data support for P3 scribing planning. The processing parameters of the P2 scribing are also adjusted and optimized through negative feedback.

[0116] P3 Marking Path Generation and Closed-Loop Control Stage: Based on the actual path of the P2 marking, the FPGA unit generates the planned path for each P3 marking according to the preset spacing between P2 and P3 specified in the process. After starting the P3 marking process, the coaxial camera synchronously acquires real-time images containing the instantaneous trajectory of the P3 marking, adjacent P2 markings, and the corresponding P1 markings, and feeds them back to the FPGA unit in real time. The FPGA unit analyzes the difference between the current P3 marking coordinates and the actual path of the P2 marking, and determines whether the path needs to be adjusted through the confidence interval to ensure that the P3 marking is accurately located between adjacent P2 markings. During the processing, the FPGA unit continuously identifies the edge contours of P3 and adjacent P2 markings, extracts the center position of adjacent P2 markings, and corrects the P3 path in real time to avoid deviations caused by dynamic deformation. At the same time, it extracts the center positions of P1 and P3 markings, calculates the dead zone width data in real time, and after completing the P3 marking, compares the actual P3 path with the preset trajectory and performs negative feedback adjustment to ensure that each P3 marking can accurately segment the back electrode layer and complete the series closed loop of the micro power generation unit.

[0117] Quality Inspection and Judgment Stage: After all three types of scribing are completed, the system performs statistical distribution analysis on the collected dead zone width data to determine whether the dead zone accuracy of the substrate meets the process design requirements, and generates a complete processing quality report to provide data reference for optimizing process parameters in subsequent batch processing.

[0118] In the above process, each scribing is not performed in isolation; its position is determined by the actual result of the previous scribing and the real-time formation process of the current scribing. Through a closed loop of coaxial sensing, real-time calculation, and dynamic adjustment, the system compensates in situ for static and dynamic deviations introduced by equipment errors, material deformation, and thermal effects in traditional processes. This theoretically allows for a smaller design spacing (D1, D2), ultimately minimizing and stabilizing the dead zone width W, thereby improving the effective power generation area and production yield of perovskite solar cells.

[0119] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0120] It should be further noted that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0121] The above embodiments introduce a coaxial visual feedback laser line drawing dynamic control method from the perspective of process flow. The following embodiments introduce a coaxial visual feedback laser line drawing dynamic control device from the perspective of virtual module or virtual unit. For details, please refer to the following embodiments.

[0122] This application also provides a coaxial visual feedback laser marking dynamic control device for implementing the method described in the above method embodiments. Figure 5 A schematic diagram of a coaxial visual feedback laser marking dynamic control device provided in this application embodiment is shown below. Figure 5 As shown, in this embodiment, the coaxial visual feedback laser marking dynamic control device may include:

[0123] The generation module 51 is used to generate the planned path of the (n+1)th type of line based on the actual path of the nth type of line obtained through the coaxial vision device; the coaxial vision device is coaxial with the laser processing optical path;

[0124] The execution module 52 is used to execute the (n+1)th type of line drawing according to the planned path, and during the execution process, it monitors the relative position between the (n+1)th type of line drawing being formed and the adjacent nth type of line drawing in real time through a coaxial vision device.

[0125] The adjustment module 53 is used to dynamically adjust the planned path based on the deviation between the relative position and the preset relative position.

[0126] In one possible implementation of this application embodiment, the generation module 51 is specifically used for:

[0127] Calculate the systematic deviation between the actual path of the nth type of line and the preset theoretical path corresponding to the nth type of line;

[0128] Feedforward compensation is applied to the planned path based on systematic bias.

[0129] In one possible implementation of this application embodiment, the adjustment module 53 is specifically used for:

[0130] When the deviation exceeds the preset confidence interval, a path adjustment command is generated;

[0131] Update the planned route based on the route adjustment instructions.

[0132] In one possible implementation of this application embodiment, the generation module 51 is specifically used for:

[0133] The image of the nth type of line is obtained by acquiring the image of the completed nth type of line using a coaxial vision device;

[0134] Based on the nth type of line image, the centerline coordinates of the nth type of line are extracted as the actual path.

[0135] In one possible implementation of this application embodiment, the execution module 52 is specifically used for:

[0136] During execution, the (n+1)th type of line drawing image is acquired using a coaxial vision device;

[0137] Process the (n+1)th type of line image, identify and locate the instantaneous position of the (n+1)th type of line that is forming;

[0138] Calculate the relative position based on the instantaneous position and the actual path of the nth type of line already obtained.

[0139] In one possible implementation of this application embodiment, the execution module 52 is further configured to:

[0140] Control the laser to operate in pulse mode;

[0141] The coaxial vision device is controlled to expose during the intervals between laser pulses to acquire the nth type of scribing image and / or the (n+1)th type of scribing image.

[0142] In one possible implementation of this application embodiment, the generation module 51 is further configured to:

[0143] Based on the scribing position data and dynamic adjustment records collected and stored in real time during the scribing process, dead zone width statistical analysis and process quality assessment are performed to obtain analysis and assessment results.

[0144] Based on the analysis and evaluation results, a processing quality report is generated; the processing quality report includes quality judgment, anomaly location, and process trend.

[0145] It should be understood that the above-described device embodiments are merely illustrative, and the device of this application can also be implemented in other ways. For example, the division of units / modules in the above embodiments is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units, modules, or components may be combined, or integrated into another system, or some features may be ignored or not executed.

[0146] This application provides an electronic device. Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, such as... Figure 6 As shown, Figure 6 The illustrated electronic device includes at least one processor 61 and a memory 62. The processor 61 and the memory 62 are connected, for example, via a bus 63. Optionally, the electronic device may also include a transceiver 64. It should be noted that in practical applications, the transceiver 64 is not limited to one, and the structure of this electronic device does not constitute a limitation on the embodiments of this application.

[0147] Processor 61 may be a central processing unit (CPU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It may implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. Processor 61 may also be a combination that implements computational functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0148] Bus 63 may include a pathway for transmitting information between the aforementioned components. Bus 63 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Bus 63 may be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 6 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0149] The memory 62 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto.

[0150] The memory 62 stores computer execution instructions for implementing the scheme of this application, and the processor 61 controls the execution. The processor 61 executes the computer execution instructions stored in the memory 62 to implement the content shown in the foregoing method embodiments.

[0151] This application also provides a computer-readable storage medium, which may include various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk. Specifically, the computer-readable storage medium stores computer-executable instructions, which are used to implement the methods in the above embodiments.

[0152] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the technical solution of the above method embodiments. Its implementation principle and technical effects are similar, and will not be repeated here.

[0153] This application also provides a coaxial vision feedback laser scribing dynamic control system, the system comprising: a laser processing device, the processing optical path of the laser processing device being used to generate scribing; a coaxial vision device, the imaging optical path of the coaxial vision device being coaxial with the processing optical path; and the electronic device in the foregoing embodiments, which is communicatively connected to the laser processing device and the coaxial vision device respectively.

[0154] Specifically, Figure 7 A schematic diagram of the structure of a coaxial visual feedback laser marking dynamic control system provided in this application embodiment. Figure 1 , Figure 8A schematic diagram of the structure of a coaxial visual feedback laser marking dynamic control system provided in this application embodiment. Figure 2 .like Figure 7 and Figure 8 As shown, this system uses laser-vision coaxial integration as its core architecture. It is composed of laser processing equipment (laser system), coaxial vision equipment (coaxial camera system), electronic equipment (control system), dynamic execution module (dynamic motion platform), and auxiliary function modules. The modules work closely together to achieve precise line drawing and dynamic control.

[0155] More specifically, the laser processing equipment, as the core of the scribing execution, includes a laser system and an optical path transmission component. The laser system emits a high-energy collimated laser beam, which is reflected by a mirror and transmitted to a beam splitter component. During optical path transmission, the laser beam is precisely focused onto the workpiece surface (i.e., the surface of the photovoltaic thin-film device substrate) by a field lens, forming a scribing trajectory that meets the process requirements. This provides energy support for the formation of P1, P2, and P3 scribing lines. Its output power, pulse frequency, and other parameters can be adjusted in real time through the core control module to adapt to the processing needs of different film layers.

[0156] The coaxial vision sensing device is strictly coaxial with the laser processing optical path. Its core components include a coaxial illumination unit, a beam splitter assembly, a narrowband filter, and a coaxial camera. The coaxial illumination unit uses a ring-shaped LED light source, coupled to the main optical path via an optical fiber bundle, to provide uniform, shadow-free observation illumination to the processing area. It can also adaptively adjust brightness and wavelength parameters based on the reflection characteristics of different films such as transparent conductive films, perovskite power-generating films, and back electrode films. The beam splitter assembly can be a dichroic beam splitter or a polarizing beam splitter prism (if a polarizing beam splitter prism is used, it is paired with a quarter-wave plate). Its core function is to achieve optical path splitting and combining: allowing the laser processing beam to reflect onto the substrate surface while simultaneously allowing the illumination light reflected from the substrate to be transmitted to the imaging path, ensuring that the processing and observation optical paths share the same optical axis. A narrowband filter is positioned in front of the coaxial camera, with its passband center wavelength precisely matched to the wavelength of the coaxial illumination unit, efficiently filtering out processing laser reflected light, plasma arc light, and ambient stray light, avoiding imaging interference. The optical axis of the coaxial camera is completely aligned with the laser processing optical axis through the beam splitter assembly, achieving "what you see is what you process," and accurately acquiring image data including scribing contours, providing high-quality raw material for subsequent processing.

[0157] The electronic device integrates a high-speed FPGA processing unit. It sends start / stop and parameter adjustment commands to the laser processing equipment, controls the imaging timing of the coaxial vision device, stores preset process parameters (such as preset relative position, confidence interval, and dead zone width standard), and enables data interaction with external systems. The FPGA high-speed processing unit, as the core computing power carrier, is responsible for undertaking real-time computing tasks assigned by the electronic device, including image grayscale processing, line edge contour recognition (using Blob analysis algorithms or other edge detection algorithms), centerline coordinate extraction, deviation calculation, and compensation amount solution. Leveraging its hardware parallel computing capabilities, it compresses the entire process latency to the millisecond level, ensuring the real-time performance of dynamic control. Furthermore, the electronic device also integrates an array camera data interface for a multi-sensor positioning module, which can receive substrate edge contour or mark point data to establish a dedicated geometric coordinate system, achieving precise positioning of the P1 line scribing starting point.

[0158] The dynamic execution module includes a dynamic control platform and a precision motion system, used to fix the photovoltaic thin-film device substrate and drive it to move along a planned path. The dynamic control platform receives path commands and adjustment signals from the core control module, and uses precision motion mechanisms such as linear motors and air bearings to drive the substrate to achieve high-precision translation, ensuring that the laser beam can form a line at the designated position. At the same time, the platform can dynamically correct based on real-time feedback deviation data to compensate for the effects of substrate deformation or motion errors, ensuring the straightness and positional accuracy of the line.

[0159] The auxiliary function module includes a display screen and a data storage unit. The display screen can receive image data acquired by the coaxial camera and the calculation results output by the core control module in real time, intuitively presenting information such as the line formation process, relative position parameters, and deviation data, supporting full-process visual monitoring by operators. The data storage unit is used to store the entire process data, including acquired images, extracted actual path coordinates, deviation records, adjustment instructions, and the final dead zone width statistics, providing data support for subsequent quality traceability and process optimization.

[0160] It should be understood that there are multiple alternatives for each module of the system: different types of lasers (such as fiber lasers and solid-state lasers) can be selected for laser processing equipment to adapt to different power requirements; in the coaxial vision sensing equipment, the beam splitter assembly can be flexibly changed according to the optical path adaptation requirements, the coaxial camera can be selected with a higher resolution model to improve imaging accuracy, and the illumination unit can also use a surface light source instead of a ring LED light source; in the electronic equipment, the FPGA high-speed processing unit can be replaced by a GPU image processing module, an ASIC custom chip, or a DSP digital signal processor to undertake real-time computing tasks; the motion mechanism of the dynamic execution module can be selected with different levels of precision transmission components according to the processing accuracy requirements; the auxiliary function module can add a data transmission interface to achieve seamless integration with the factory MES system, which is not limited in this application.

[0161] The system provided in this application fundamentally eliminates parallax errors through its laser-vision coaxial integrated design, ensuring strict consistency between observation and processing positions and improving absolute positioning accuracy to the micrometer level, thus laying the physical foundation for extreme compression of dead zone width. Simultaneously, the system utilizes a high-speed processing unit to construct a millisecond-level control closed loop, enabling real-time sensing and dynamic compensation for trajectory deviations caused by thermal effects and material deformation during processing, effectively avoiding the risk of short circuits due to line crossings. Furthermore, the system integrates processing, inspection, and calibration functions, achieving online full inspection. While improving production yield, its rapid response capability fully meets the demands of high-speed mass production. Finally, the system possesses excellent process adaptability and self-optimization capabilities, adapting to different film layers through parameter adjustments and autonomously optimizing processes based on real-time data, reducing reliance on operational experience and providing key equipment support for the large-scale, low-cost manufacturing of perovskite solar cells.

[0162] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0163] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0164] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A method for dynamic control of laser line drawing with coaxial visual feedback, characterized in that, The method includes: Based on the actual path of the nth type of line obtained through a coaxial vision device, a planned path for the (n+1)th type of line is generated; the coaxial vision device is coaxial with the laser processing optical path. The line drawing of type n+1 is executed according to the planned path, and during the execution, the relative position between the line drawing of type n+1 being formed and the adjacent line drawing of type n is monitored in real time by the coaxial vision device. The planned path is dynamically adjusted based on the deviation between the relative position and the preset relative position.

2. The method according to claim 1, characterized in that, The process of generating a planned path for the (n+1)th type of line based on the actual path of the nth type of line obtained through a coaxial vision device includes: Calculate the systematic deviation between the actual path of the nth type of line and the preset theoretical path corresponding to the nth type of line; Feedforward compensation is performed on the planned path based on the systematic deviation.

3. The method according to claim 1 or 2, characterized in that, The step of dynamically adjusting the planned path based on the deviation between the relative position and the preset relative position includes: When the deviation exceeds the preset confidence interval, a path adjustment command is generated; The planned path is updated according to the path adjustment instruction.

4. The method according to claim 1 or 2, characterized in that, The actual path of the nth type of line obtained through a coaxial vision device includes: The coaxial vision device is used to acquire images of the completed nth type of line drawing to obtain the nth type of line drawing image. Based on the nth type of line image, the centerline coordinates of the nth type of line are extracted as the actual path.

5. The method according to claim 1 or 2, characterized in that, The real-time monitoring of the relative position between the (n+1)th type of scribe line and the adjacent nth type scribe line via the coaxial vision device includes: During the execution process, the (n+1)th type of line drawing image is acquired through the coaxial vision device; Process the (n+1)th type of line image, identify and locate the instantaneous position of the (n+1)th type of line that is being formed; The relative position is calculated based on the instantaneous position and the actual path of the nth type of line that has been obtained.

6. The method according to claim 1 or 2, characterized in that, The method further includes: Control the laser to operate in pulse mode; The coaxial vision device is controlled to expose during the intervals between laser pulses to acquire the nth type of scribing image and / or the (n+1)th type of scribing image.

7. The method according to claim 1 or 2, characterized in that, The method further includes: Based on the scribing position data and dynamic adjustment records collected and stored in real time during the scribing process, dead zone width statistical analysis and process quality assessment are performed to obtain analysis and assessment results. Based on the analysis and evaluation results, a processing quality report is generated; the processing quality report includes quality judgment, anomaly location, and process trend.

8. A coaxial visual feedback laser marking dynamic control device, characterized in that, The device includes: The generation module is used to generate a planned path for the (n+1)th type of line based on the actual path of the nth type of line obtained through a coaxial vision device; the coaxial vision device is coaxial with the laser processing optical path. The execution module is used to execute the (n+1)th type of line drawing according to the planned path, and during the execution process, the coaxial vision device monitors in real time the relative position between the (n+1)th type of line drawing being formed and the adjacent nth type of line drawing; The adjustment module is used to dynamically adjust the planned path based on the deviation between the relative position and the preset relative position.

9. An electronic device, characterized in that, It includes at least one processor and a memory communicatively connected to the processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory to implement the method as described in any one of claims 1-7.

10. A coaxial visual feedback dynamic control system for laser line marking, characterized in that, The system includes: A laser processing device, wherein the processing optical path of the laser processing device is used to generate scribing lines; A coaxial vision device, wherein the imaging optical path of the coaxial vision device is coaxial with the processing optical path; The electronic device as described in claim 9 is communicatively connected to both the laser processing equipment and the coaxial vision equipment.

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