Epoxy molding compound and preparation method and application thereof
By combining specific fillers and their synergistic effects, epoxy molding compounds with high dielectric constant, low loss, good processability and reliability are prepared, solving the balance problem between dielectric and mechanical properties of traditional epoxy molding compounds, and making them suitable for semiconductor packaging materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-22
- Publication Date
- 2026-03-27
AI Technical Summary
Traditional epoxy molding compounds struggle to achieve high dielectric constants while maintaining low losses, good processability, and reliable thermomechanical properties.
An epoxy molding compound is prepared by using a specific second filler and the synergistic effect of other components. The dielectric constant is improved by combining the specific second filler with the first filler, and uniform dispersion and strong interfacial bonding are achieved in the epoxy matrix.
It achieves high dielectric constant while maintaining low loss, good processability and reliable thermomechanical properties, making it suitable for semiconductor packaging materials.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic packaging materials technology, specifically to an epoxy molding compound, its preparation method, and its application. Background Technology
[0002] Epoxy molding compounds are widely used in the semiconductor packaging industry due to their advantages such as low shrinkage, excellent electrical insulation properties, chemical resistance, easy processing, low cost, and convenient mass production, occupying 97% of the entire microelectronic packaging material market.
[0003] With the rapid development of technologies such as 5G communication, the Internet of Things, and automotive electronics, electronic components are evolving towards higher frequencies, greater integration, and miniaturization. This presents new functional requirements for packaging materials. For example, in RF antenna modules, materials with high dielectric constants are needed to reduce antenna size; in high-end processor packaging, embedded capacitor materials are required to achieve excellent power integrity and decoupling effects.
[0004] Traditional epoxy molding compounds primarily focus on insulation, protection, and low stress, but their dielectric constant is typically low (Dk < 4.0 @ 10 GHz), making it difficult to meet these requirements. Existing technologies often face the following challenges: 1. Uneven filler dispersion: High proportions of inorganic fillers tend to agglomerate in the epoxy resin matrix, leading to uneven local properties, increased dielectric loss (Df), and decreased reliability. 2. Deteriorated processability: High filler content severely reduces the flowability and moldability of the composite material, easily causing encapsulation defects. 3. High dielectric loss: Simply increasing the filler content is usually accompanied by a significant increase in dielectric loss, making it unsuitable for high-frequency applications. 4. Imbalanced overall performance: It is difficult to achieve a high dielectric constant (Dk > 10 @ 10 GHz) while maintaining low loss (Df < 0.01 @ 10 GHz), good processability, and reliable thermomechanical properties. Summary of the Invention
[0005] The purpose of this invention is to overcome the problem that traditional epoxy molding compounds in the prior art are difficult to obtain while maintaining low loss, good processability, and reliable thermomechanical properties. This invention provides an epoxy molding compound, its preparation method, and its application. This technical solution, through the synergistic effect of a specific second filler and other components, achieves an increase in the dielectric constant of the epoxy molding compound and highly uniform dispersion and strong interfacial bonding within the epoxy matrix, thereby preparing an epoxy molding compound with high dielectric constant, low dielectric loss, excellent processability, and reliability.
[0006] To achieve the above objectives, a first aspect of the present invention provides an epoxy molding compound comprising epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent, and colorant; wherein the filler is a combination of a first filler and a second filler; the first filler is selected from silicon dioxide and / or alumina; the second filler is selected from at least one of anatase titanium dioxide, rutile titanium dioxide, barium titanate, and silicon nitride; based on the total weight of the fillers, the content of the first filler is 97.5-99.9% by weight, and the content of the second filler is 0.1-2.5% by weight.
[0007] Preferably, based on the total weight of the epoxy molding compound, the epoxy resin content is 8-11% by weight, the phenolic resin content is 5-7% by weight, the curing accelerator content is 4-6% by weight, the filler content is 70-80% by weight, the release agent content is 0.1-1.2% by weight, the ion trapping agent content is 0.1-1.5% by weight, the toughening agent content is 0.2-1.4% by weight, the coupling agent content is 0.3-1.5% by weight, and the colorant content is 0.1-1% by weight.
[0008] Preferably, the curing accelerator contains a first curing accelerator and an optional second curing accelerator, wherein the first curing accelerator is a compound with the structure shown in formula (1), and the first curing accelerator is different from the second curing accelerator; Equation (1).
[0009] Preferably, the content of the first curing accelerator is 75-100% by weight, based on the total weight of the curing accelerator.
[0010] Preferably, the second curing accelerator is selected from at least one of tertiary amine compounds, organophosphorus compounds, and imidazole compounds.
[0011] Preferably, the tertiary amine compound is selected from at least one of 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene, and triethylamine benzyldimethylamine.
[0012] Preferably, the organophosphorus compound is selected from at least one of triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine, and tris(p-tolyl)phosphine.
[0013] Preferably, the imidazole compound is selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole and 3-amino-1,2,4-triazole.
[0014] Preferably, the coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyl ethertrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysiloxane.
[0015] Preferably, the toughening agent is selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene, and ethylene-vinyl acetate copolymer.
[0016] Preferably, the ion trapping agent is selected from at least one of anion trapping agents, cation trapping agents, and zwitterionic trapping agents.
[0017] Preferably, the epoxy resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin, and heterocyclic epoxy resin.
[0018] Preferably, the release agent is selected from carnauba wax, synthetic wax, and mineral wax.
[0019] Preferably, the phenolic resin is selected from at least one of linear phenolic resins and their derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, linear phenolic resins and their derivatives, monohydroxynaphthol phenolic resins and their derivatives, and dihydroxynaphthol phenolic resins and their derivatives.
[0020] Preferably, the colorant is selected from zinc oxide and / or carbon black.
[0021] A second aspect of the present invention provides a method for preparing the above-mentioned epoxy molding compound, the method comprising the following steps: (1) Pulverize and mix epoxy resin, phenolic resin, curing accelerator, filler, mold release agent, ion capture agent, toughening agent, coupling agent and colorant, and then melt-mix the mixed material at a temperature of 80-100℃ for 5-20 minutes. (2) Cool and crush the molten compound obtained in step (1) and preform it to obtain epoxy molding compound.
[0022] The third aspect of this invention provides the application of the above-mentioned epoxy molding compound in semiconductor packaging materials.
[0023] Through the above technical solution, the epoxy molding compound of the present invention, by containing a specific second filler and its synergistic effect with other components, has a high dielectric constant and higher signal integrity in semiconductor applications. Detailed Implementation
[0024] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.
[0025] The endpoints and any values of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of the various ranges, the endpoint values of the various ranges and individual point values, and individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.
[0026] The epoxy molding compound of this invention comprises epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent, and colorant; wherein the filler is a combination of a first filler and a second filler; the first filler is selected from silicon dioxide and / or alumina; the second filler is selected from at least one of anatase titanium dioxide, rutile titanium dioxide, barium titanate, and silicon nitride; based on the total weight of the fillers, the content of the first filler is 97.5-99.9% by weight, and the content of the second filler is 0.1-2.5% by weight. According to the epoxy molding compound of this invention, through the specific second filler and its specific content, and the synergistic effect with the first filler, epoxy resin, phenolic resin, curing accelerator, release agent, ion trapping agent, toughening agent, coupling agent, and colorant, the epoxy molding compound possesses high dielectric constant, low loss, good processability, and reliability, resulting in higher signal integrity in semiconductor applications.
[0027] In the epoxy molding compound of the present invention, the epoxy resin, the phenolic resin, the curing accelerator, the filler, the release agent, the ion trapping agent, the toughening agent, the coupling agent and the colorant do not contain sulfur.
[0028] In the epoxy molding compound of the present invention, in order to improve the dielectric constant of the epoxy molding compound, in a preferred embodiment, the filler is a combination of a first filler and a second filler; the first filler is selected from silicon dioxide and alumina, and the weight ratio of silicon dioxide to alumina is 1:(3.9-4.4); the second filler is barium titanate, and based on the total weight of the filler, the content of the first filler is 97.5-99.9% by weight, and the content of the second filler is 0.1-2.5% by weight. The second filler helps to improve the dielectric constant, and through the specific composition and specific content of the first and second fillers, the epoxy molding compound has a high dielectric constant, resulting in higher signal integrity in semiconductor applications. In a preferred embodiment, the silicon dioxide is crystalline silicon dioxide and / or fused silicon dioxide.
[0029] In the epoxy molding compound of the present invention, in order to improve the processability and reliability of the epoxy molding compound, based on the total weight of the epoxy molding compound, the content of the epoxy resin is preferably 8-11% by weight, more preferably 9-11% by weight; the content of the phenolic resin is preferably 5-7% by weight, more preferably 6-7% by weight; the content of the curing accelerator is preferably 4-6% by weight, more preferably 4.5-5% by weight; the content of the filler is preferably 70-80% by weight, more preferably 75-80% by weight; and the content of the release agent is... The preferred content of the first filler is 0.1-1.2 wt%, more preferably 0.2-0.4 wt%; the preferred content of the ion scavenger is 0.1-1.5 wt%, more preferably 0.3-0.5 wt%; the preferred content of the toughening agent is 0.2-1.4 wt%, more preferably 0.4-0.5 wt%; the preferred content of the coupling agent is 0.3-1.5 wt%, more preferably 0.5-0.7 wt%; and the preferred content of the colorant is 0.1-1 wt%, more preferably 0.2-0.4 wt%. By using specific types of second fillers and the dosage relationships between the raw material components, the epoxy molding compound achieves a high dielectric constant while maintaining low loss, good processability, and reliable thermomechanical properties.
[0030] In the epoxy molding compound of the present invention, the curing accelerator may contain a first curing accelerator and an optional second curing accelerator, wherein the first curing accelerator may be a compound with the structure shown in formula (1), and the first curing accelerator is different from the second curing accelerator; Equation (1).
[0031] In the epoxy molding compound of the present invention, the second curing accelerator may be selected from at least one of tertiary amine compounds, organophosphorus compounds, and imidazole compounds, preferably organophosphorus compounds, and more preferably triphenylphosphine. The tertiary amine compound may be selected from at least one of 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene, and triethylamine benzyldimethylamine, preferably 2,4,6-tris(dimethylaminomethyl)phenol. The organophosphorus compound may be selected from at least one of triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine, and tris(p-tolyl)phosphine, preferably triphenylphosphine. The imidazole compound may be selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole, and 3-amino-1,2,4-triazole, preferably 3-amino-1,2,4-triazole.
[0032] In the epoxy molding compound of the present invention, based on the total weight of the curing accelerators, the content of the first curing accelerator is preferably 75-100% by weight, more preferably 85-90% by weight. To improve the reliability of the epoxy molding compound, in a preferred embodiment, the curing accelerator contains a first curing accelerator and a second curing accelerator, wherein the first curing accelerator is a compound with the structure shown in formula (1), and the second curing accelerator is triphenylphosphine, and based on the total weight of the curing accelerators, the content of the first curing accelerator is 85-90% by weight.
[0033] In the epoxy molding compound of the present invention, the coupling agent may be selected from at least one of γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyl ether trimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysiloxane, preferably γ-glycidoxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane. To improve the reliability of the epoxy molding compound, in a preferred embodiment, the coupling agent is γ-glycidoxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane, and the weight ratio of γ-glycidoxypropyltrimethoxysilane to N-phenyl-3-aminopropyltrimethoxysiloxane is (1.5-2.5):1.
[0034] In the epoxy molding compound of the present invention, the toughening agent may be selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene and ethylene-vinyl acetate copolymer, preferably methyl methacrylate-butadiene-styrene terpolymer.
[0035] In the epoxy molding compound of the present invention, the ion trapping agent may be selected from at least one of anion trapping agents, cationic trapping agents, and zwitterionic trapping agents, preferably a cationic trapping agent, more preferably IXE100. The anion trapping agent may be hydrotalcite. The cationic trapping agent may be IXE100. The zwitterionic trapping agent may be IXE6107.
[0036] In the epoxy molding compound of the present invention, the epoxy resin may be selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin and heterocyclic epoxy resin, preferably biphenyl type epoxy resin.
[0037] In the epoxy molding compound of the present invention, the release agent can be selected from carnauba wax, synthetic wax, and mineral wax, preferably carnauba wax. The synthetic wax can be polyethylene wax.
[0038] In the epoxy molding compound of the present invention, the phenolic resin may be selected from at least one of linear phenolic resin and its derivatives, condensate of p-xylene and phenol, condensate of p-xylene and naphthol, linear phenolic resin and its derivatives, monohydroxynaphthol phenolic resin and its derivatives, and dihydroxynaphthol phenolic resin and its derivatives, preferably linear phenolic resin.
[0039] In the epoxy molding compound of the present invention, the colorant may be selected from zinc oxide and / or carbon black, preferably carbon black.
[0040] In some embodiments, the epoxy molding compound of the present invention comprises epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent, and colorant; wherein the filler is a combination of a first filler and a second filler; the first filler is selected from silicon dioxide and / or alumina; the second filler is selected from at least one of anatase titanium dioxide, rutile titanium dioxide, barium titanate, and silicon nitride; based on the total weight of the fillers, the content of the first filler is 97.5-99.9% by weight, and the content of the second filler is 0.1-2%.5% by weight; the curing accelerator contains a first curing accelerator and an optional second curing accelerator, wherein the first curing accelerator is a compound with the structure shown in formula (1), and the first curing accelerator is different from the second curing accelerator; based on the total weight of the curing accelerator, the content of the first curing accelerator is 75-100% by weight; the second curing accelerator is selected from at least one of tertiary amine compounds, organophosphorus compounds, and imidazole compounds; the tertiary amine compound is selected from at least one of 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene, and triethylaminebenzyldimethylamine; the organophosphorus compound is selected from triphenylphosphine, The compound is selected from at least one of triethylphosphine, trimethylphosphine, tributylphosphine, and tri(p-tolyl)phosphine; the imidazole compound is selected from at least one of 2-methylimidazolium, 2,4-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-heptadecylimidazolium, and 3-amino-1,2,4-triazole; the coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysiloxane; the toughening agent is selected from methyl methacrylate. At least one of butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene, and ethylene-vinyl acetate copolymer; the ion scavenger is selected from at least one of anion scavengers, cationic scavengers, and zwitterionic scavengers; the epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin, and heterocyclic epoxy resin; the release agent is selected from carnauba wax, synthetic wax, and mineral wax; the phenolic resin is selected from linear phenolic resin and its derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, linear phenolic resin and its derivatives. The epoxy molding compound contains at least one of the following: biological, monohydroxynaphthol phenolic resin and its derivatives, and dihydroxynaphthol phenolic resin and its derivatives; the colorant is selected from zinc oxide and / or carbon black; based on the total weight of the epoxy molding compound, the epoxy resin content is 8-11% by weight, the phenolic resin content is 5-7% by weight, the curing accelerator content is 4-6% by weight, the filler content is 70-80% by weight, the release agent content is 0.1-1.2% by weight, the ion trapping agent content is 0.1-1.5% by weight, the toughening agent content is 0.2-1.4% by weight, the coupling agent content is 0.3-1.5% by weight, and the colorant content is 0.1-1% by weight.
[0041] In other embodiments, the epoxy molding compound of the present invention comprises epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trap, toughening agent, coupling agent, and colorant; wherein the filler is a combination of a first filler and a second filler; the first filler is selected from silica and alumina, and the weight ratio of silica to alumina is 1:(3.9-4.4); the second filler is barium titanate; based on the total weight of the filler, the content of the first filler is 97.5-99.9% by weight, and the content of the second filler is 0.1-2.5% by weight; the curing accelerator comprises a first curing accelerator and a second curing accelerator, wherein the first curing accelerator is a compound with the structure shown in formula (1), and the second curing accelerator is triphenylphosphine; based on the total weight of the curing accelerator, the content of the first curing accelerator is 85-90% by weight; the coupling agent is γ-glycidoxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane. The weight ratio of γ-glycidyl etheroxypropyltrimethoxysilane to N-phenyl-3-aminopropyltrimethoxysiloxane is (1.5-2.5):1; the toughening agent is selected from methyl methacrylate-butadiene-styrene terpolymer; the ion trapping agent is selected from IXE100; the epoxy resin is selected from biphenyl-type epoxy resin; the release agent is selected from carnauba wax; the phenolic resin is selected from linear phenolic resin; the colorant is selected from carbon black; based on the total weight of the epoxy molding compound, the... The epoxy resin content is 9-11% by weight, the phenolic resin content is 6-7% by weight, the curing accelerator content is 4.5-5% by weight, the filler content is 75-80% by weight, the release agent content is 0.2-0.5% by weight, the ion scavenger content is 0.3-0.5% by weight, the toughening agent content is 0.4-0.5% by weight, the coupling agent content is 0.5-0.7% by weight, and the colorant content is 0.2-0.4% by weight.
[0042] The present invention also provides a method for preparing the above-mentioned epoxy molding compound, the method comprising the following steps: (1) Pulverize and mix epoxy resin, phenolic resin, curing accelerator, filler, mold release agent, ion capture agent, toughening agent, coupling agent and colorant, and then melt-mix the mixed material at a temperature of 80-100℃ for 5-20 minutes. (2) Cool and crush the molten compound obtained in step (1) and preform it to obtain epoxy molding compound.
[0043] According to the method described in this invention, a specific second filler and its specific content are mixed and kneaded, and an epoxy molding compound is prepared by means of a first filler, epoxy resin, phenolic resin, curing accelerator, release agent, ion trapping agent, toughening agent, coupling agent and colorant. The prepared epoxy molding compound has a high dielectric constant and higher signal integrity in semiconductor applications.
[0044] In this invention, the equipment used for melt mixing can be a conventional choice in the art, such as a two-roll open mill, a single-screw extruder, a twin-screw extruder, a kneader, or a mixer.
[0045] This invention also provides the application of the aforementioned epoxy molding compound in semiconductor packaging materials. According to the application described in this invention, through the specific second filler and its specific content, and the synergistic effect with the first filler, epoxy resin, phenolic resin, curing accelerator, release agent, ion trapping agent, toughening agent, coupling agent, and colorant, the epoxy molding compound possesses high dielectric constant, low loss, good processability, and reliability, resulting in higher signal integrity in semiconductor applications.
[0046] The following examples further illustrate the epoxy molding compound, its preparation method, and its application according to the present invention. These examples are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following examples.
[0047] Unless otherwise specified, the experimental methods used in the following embodiments are conventional methods in the art. Unless otherwise specified, the experimental materials used in the following embodiments are commercially available.
[0048] Unless otherwise specified, all reagents used in the embodiments and comparative examples of this invention are commercially available products.
[0049] A. Epoxy resin: Biphenyl type epoxy resin was purchased from Jinan Shengquan, brand name SQE-101, epoxy equivalent (g / eq): 176-196; B. Phenolic resin: Linear phenolic resin was purchased from Shanghai Hengfeng, brand name Resicare3010; C1 First curing accelerator: The compound with the structure shown in formula (1) was purchased from BlueBio, brand name TPTP-BQ; Equation (1); C2 Second Curing Accelerator: Triphenylphosphine was purchased from Suzhou Jinyuan Fine Chemical Co., Ltd., brand name TPP; D1 First Filler: Silica was purchased from Jiangsu Lianrui, grade NQ1035H, with a d90 of 20μm; D2 First Packing Material: Alumina was purchased from Jiangsu Lianrui, grade BE033; D3 Second Packing Material: Barium titanate was purchased from Jiangsu Lianrui, with a d90 of 20μm; E-release agent: Carnauba wax was purchased from Shanghai Yiba Chemical Raw Materials Co., Ltd., grade: t3; Toughening agent F: Methyl methacrylate-butadiene-styrene terpolymer was purchased from Shenzhen Yingshun Plastic Raw Materials Co., Ltd., brand name: MBS; G1 coupling agent: γ-glycidoxypropyltrimethoxysilane was purchased from Dow Corning, brand name Z-6040; G2 coupling agent: N-phenyl-3-aminopropyltrimethoxysiloxane was purchased from Momentive, brand name Y-9669; H colorant: Carbon black was purchased from Hengdeli Chemical Co., Ltd.; I-ion scavenger: IXE-100 was purchased from Toa Synthetic Co., Ltd., Japan.
[0050] In the following examples, please refer to Table 1 for the specific selection of the raw materials used in the preparation of the epoxy molding compound and their specific amounts. In the following comparative examples, please refer to Table 2 for the specific selection of the raw materials used in the preparation of the epoxy molding compound and their specific amounts.
[0051] Example 1 (1) Epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent and colorant are crushed and mixed, and then the mixed material is melt-mixed for 10 minutes on an open mixer with a main roller at 80°C and a secondary roller at 100°C. (2) Cool and crush the molten compound obtained in step (1) and preform it into cake to obtain epoxy molding compound.
[0052] Example 2 (1) Epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent and colorant are crushed and mixed, and then the mixed material is melt-mixed for 20 minutes on an open mixer with a main roller at 80°C and a secondary roller at 100°C. (2) Cool and crush the molten compound obtained in step (1) and preform it into cake to obtain epoxy molding compound.
[0053] Example 3 (1) Epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent and colorant are crushed and mixed, and then the mixed material is melt-mixed for 5 minutes on an open mixer with a main roller at 80°C and a secondary roller at 100°C. (2) Cool and crush the molten compound obtained in step (1) and preform it into cake to obtain epoxy molding compound.
[0054] Example 4 The method of Example 1 was implemented, except that the specific components and dosages of each raw material used in the preparation of the epoxy molding compound are shown in Table 1.
[0055] Example 5 The method of Example 1 was implemented, except that the specific components and dosages of each raw material used in the preparation of the epoxy molding compound are shown in Table 1.
[0056] Example 6 The method of Example 1 was implemented, except that the specific components and dosages of each raw material used in the preparation of the epoxy molding compound are shown in Table 1.
[0057] Example 7 The method of Example 1 was implemented, except that the specific components and dosages of each raw material used in the preparation of the epoxy molding compound are shown in Table 1.
[0058] Example 8 The method of Example 1 was implemented, except that the specific components and dosages of each raw material used in the preparation of the epoxy molding compound are shown in Table 1.
[0059] Example 9 The method of Example 1 was implemented, except that barium titanate was replaced with anatase titanium dioxide (purchased from Ningbo Xinfu, grade HA100).
[0060] Example 10 The method of Example 1 was implemented, except that barium titanate was replaced with rutile titanium dioxide (purchased from Longbai Group, grade LR-996).
[0061] Example 11 The method of Example 1 was implemented, except that barium titanate was replaced with silicon nitride (purchased from Lianrui).
[0062] Table 1
[0063] Comparative Example 1 The method of Example 1 was implemented, except that no second filler was added. The specific components and dosages of each raw material used in the preparation of epoxy molding compound are shown in Table 2.
[0064] Comparative Example 2 The method of Example 1 was implemented, except that, based on the total weight of the fillers, the content of the first filler was 90% by weight and the content of the second filler was 10% by weight; the specific composition and dosage of each raw material used in the preparation of epoxy molding compound are shown in Table 2.
[0065] Comparative Example 3 The method of Example 1 was implemented, except that only alumina was added. The specific components and amounts of each raw material used in the preparation of epoxy molding compound are shown in Table 2.
[0066] Comparative Example 4 The method of Example 1 was implemented, except that only silica was added. The specific components and amounts of each raw material used in the preparation of epoxy molding compound are shown in Table 2.
[0067] Comparative Example 5 The method of Example 1 was implemented, except that silicon dioxide was replaced with calcium carbonate.
[0068] Comparative Example 6 The method of Example 1 was implemented, except that aluminum oxide was replaced with aluminum hydroxide.
[0069] Table 2
[0070] Test case The epoxy molding compounds prepared in Examples 1-11 and Comparative Examples 1-6 were tested for dielectric constant, dielectric loss, copper adhesion, and flexural strength, respectively, and carried out according to the following methods: (1) Test of dielectric constant and dielectric loss: 80g of powdered epoxy molding compound was put into the injection molding machine. Under the conditions of injection pressure of 60bar and injection time of 15s, the material was injected into a special dielectric constant test mold at 175℃. After mold closing for 120s, a round piece with a thickness of 3mm and a diameter of 80mm was formed. Then it was placed in an oven and cured at 175℃ for 4h. After that, it was placed in an impedance analyzer to test the dielectric constant and dielectric loss. The results are recorded in Table 3. (2) Copper adhesion test: Using a low-pressure transfer molding machine, under the conditions of mold temperature of 175℃, injection pressure of 60 bar, and curing time of 110 s, the obtained epoxy molding compound was molded on the copper sheet to form a contact area of 176 mm². 2 The cylindrical material was partially cured with epoxy molding compound. The copper adhesion force (N) of the uncured and post-cured materials was tested using a microcomputer-controlled electronic universal testing machine and recorded in Table 3. In this paper, the pressure is gauge pressure. (3) Bending strength test: 110g of powdered epoxy molding compound was put into the injection molding machine. Under the conditions of injection pressure of 60 bar and injection time of 15s, the material was injected into a special bending strength test mold at 175℃. After mold closing for 120s, a sample block with specifications of 15.41*10.78*120mm was made. Then, it was placed in an oven and cured at 175℃ for 4 hours. After curing, it was placed in a universal testing machine for bending strength test. The mold opening bending strength and mold opening bending modulus were obtained and recorded in Table 3. Table 3
[0071] As can be seen from the results in Table 3, the embodiments using the epoxy molding compound described in this invention exhibit high dielectric constant, low dielectric loss, high copper adhesion, and excellent thermomechanical properties. While achieving a high dielectric constant, it maintains low loss, good processability, and reliable thermomechanical properties. In contrast, Comparative Example 2, although possessing a high dielectric constant, has poor thermomechanical properties and cannot achieve both a high dielectric constant and reliable thermomechanical properties.
[0072] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.
Claims
1. An epoxy molding compound, characterized in that, This epoxy molding compound contains epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent and colorant; Wherein, the packing material is a combination of the first packing material and the second packing material; The first filler is selected from silica and / or alumina; The second filler is selected from at least one of anatase titanium dioxide, rutile titanium dioxide, barium titanate, and silicon nitride; Based on the total weight of the packing material, the content of the first packing material is 97.5-99.9% by weight, and the content of the second packing material is 0.1-2.5% by weight.
2. The epoxy molding compound according to claim 1, characterized in that, Based on the total weight of the epoxy molding compound, the epoxy resin content is 8-11% by weight, the phenolic resin content is 5-7% by weight, the curing accelerator content is 4-6% by weight, the filler content is 70-80% by weight, the release agent content is 0.1-1.2% by weight, the ion trapping agent content is 0.1-1.5% by weight, the toughening agent content is 0.2-1.4% by weight, the coupling agent content is 0.3-1.5% by weight, and the colorant content is 0.1-1% by weight.
3. The epoxy molding compound according to claim 1 or 2, characterized in that, The curing accelerator contains a first curing accelerator and an optional second curing accelerator, wherein the first curing accelerator is a compound with the structure shown in formula (1), and the first curing accelerator is different from the second curing accelerator; Equation (1); Preferably, the content of the first curing accelerator is 75-100% by weight, based on the total weight of the curing accelerator.
4. The epoxy molding compound according to claim 3, characterized in that, The second curing accelerator is selected from at least one of tertiary amine compounds, organophosphorus compounds, and imidazole compounds; Preferably, the tertiary amine compound is selected from at least one of 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene, and triethylamine benzyldimethylamine; Preferably, the organophosphorus compound is selected from at least one of triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine, and tris(p-tolyl)phosphine; Preferably, the imidazole compound is selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole and 3-amino-1,2,4-triazole.
5. The epoxy molding compound according to any one of claims 1-4, characterized in that, The coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyl ethertrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysiloxane.
6. The epoxy molding compound according to any one of claims 1-5, characterized in that, The toughening agent is selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene, and ethylene-vinyl acetate copolymer.
7. The epoxy molding compound according to any one of claims 1-5, characterized in that, The ion trapping agent is selected from at least one of anion trapping agents, cation trapping agents, and zwitterionic trapping agents.
8. The epoxy molding compound according to any one of claims 1-7, characterized in that, The epoxy resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin, and heterocyclic epoxy resin; and / or The release agent is selected from carnauba wax, synthetic waxes, and mineral waxes; and / or The phenolic resin is selected from at least one of linear phenolic resins and their derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, linear phenolic resins and their derivatives, monohydroxynaphthol phenolic resins and their derivatives, and dihydroxynaphthol phenolic resins and their derivatives; and / or The colorant is selected from zinc oxide and / or carbon black.
9. A method for preparing the epoxy molding compound according to any one of claims 1-8, characterized in that, The method includes the following steps: (1) Pulverize and mix epoxy resin, phenolic resin, curing accelerator, filler, mold release agent, ion capture agent, toughening agent, coupling agent and colorant, and then melt-mix the mixed material at a temperature of 80-100℃ for 5-20 minutes. (2) Cool and crush the molten compound obtained in step (1) and preform it to obtain epoxy molding compound.
10. The application of the epoxy molding compound according to any one of claims 1-8 in semiconductor packaging materials.