Production process of high-viscosity damping and silencing BOPP (biaxially-oriented polypropylene) packaging adhesive tape

Abstract

The invention relates to a production process of a high-viscosity shock-absorption noise-reduction BOPP (Biaxially-oriented Polypropylene) packaging adhesive tape, and belongs to the technical field of packaging materials. Mixing an acrylate copolymer emulsion, epoxy modified polyurethane, nano calcium carbonate, tackifying resin, a dispersing agent, a defoaming agent and deionized water to obtain a composite adhesive; uniformly coating the composite adhesive on the surface of the modified BOPP film, and then attaching a release film to form a composite base material; and feeding the composite base material into a curing oven, curing, forming, slitting and rolling to obtain the high-viscosity damping and silencing BOPP packaging adhesive tape. The modified BOPP thin film is prepared from a BOPP film, methylbenzene, 5-isopropenyl-pyridine-2-amine, hydrogen-based silsesquioxane and tetrabutylammonium bromide, and the modified BOPP thin film is prepared from the BOPP film, methylbenzene, 5-isopropenyl-pyridine-2-amine, the adhesive tape prepared by the invention has high viscosity and excellent damping performance and silencing effect.

Description

Technical Field

[0001] This invention relates to the field of packaging materials technology, and in particular to a production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape. Background Technology

[0002] BOPP encapsulation tape is widely used in logistics, transportation, and product packaging due to its advantages such as low cost, good weather resistance, and ease of use. With the continuous development of the packaging industry, the market's performance requirements for BOPP encapsulation tape are increasing. It not only needs to have good adhesion to ensure the sealing and stability of the packaging, but also needs to provide shock absorption and noise reduction during transportation to protect the contents, especially fragile products such as precision instruments and electronic equipment.

[0003] Chinese Patent CN219032057U discloses a high-performance encapsulation tape, relating to the field of encapsulation tapes. It includes a tape body with a notch in the middle of its surface. A tearing mechanism is connected to the lower surface of the tape body at the middle position. The tearing mechanism includes a metal wire, a tear strip, a third adhesive layer, a movable crossbar, and a connecting through hole. The tear strip is connected to the middle of the lower surface of the tape body. The upper surface of the tear strip has the third adhesive layer. A metal wire is embedded within the tear strip, and movable crossbars are spaced apart on the metal wire. A connecting through hole is located in the middle of the movable crossbar. A first adhesive layer is located on one side of the lower surface of the tape body near the tearing mechanism, and a second adhesive layer is located on the other side of the lower surface of the tape body near the tearing mechanism.

[0004] Chinese Patent CN118755395A discloses a noise-absorbing BOPP encapsulation tape, which uses BOPP biaxially oriented polypropylene film as the substrate, uniformly coats the surface of the film with pressure-sensitive adhesive emulsion, and dries it to obtain a semi-finished tape; the semi-finished tape is subjected to electro-electro-electrode treatment by a corona machine to form multiple micro-pits on the surface of the semi-finished tape; the corona-treated semi-finished tape is then slit into noise-absorbing BOPP encapsulation tapes by a slitting machine.

[0005] In the existing technology, BOPP encapsulation tape is usually achieved by increasing the amount of adhesive coating or using a single type of tackifying resin. However, this method often leads to an increase in the cost of the tape, and it cannot effectively absorb the noise generated during transportation, resulting in poor shock absorption and noise reduction performance. Summary of the Invention

[0006] To address the aforementioned problems, this invention provides a production process for high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape. The operation steps are as follows, in parts by weight: S1: Mix 40-60 parts of acrylate copolymer emulsion with a solid content of 45-55%, 20-30 parts of epoxy-modified polyurethane with a molecular weight of 8000-12000, 5-10 parts of nano-calcium carbonate, 1-5 parts of tackifying resin, 1-4 parts of dispersant, 0.5-2 parts of defoamer, and 10-20 parts of deionized water, and stir at a speed of 800-1200 r / min for 30-45 min to obtain a composite adhesive; S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 15-25μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0007] Furthermore, the tackifying resin is one of rosin glycerol ester RG-80, petroleum resin C5-101, and terpene phenolic resin TPR-203.

[0008] Furthermore, the dispersant is one of sodium polyacrylate (PAA-Na), phosphate ester dispersant DP-950, and polycarboxylate dispersant SN-5040.

[0009] Furthermore, the defoamer is one of the following: polyether defoamer PE-6800, mineral oil defoamer MO-20, and silicone defoamer DF-10.

[0010] Furthermore, the release film is one of the following: fluorinated release film FEP-30, polyethylene release film PE-40, and silicone oil release film PET-50-S.

[0011] Furthermore, the S3 curing and molding steps are as follows: first, pre-curing at 60-70℃ for 20-30 minutes, and then fully curing at 80-90℃ for 40-60 minutes.

[0012] Furthermore, the method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 148-296 parts of toluene, 12-18 parts of 5-isopropenyl-pyridine-2-amine, and 6-10 parts of hydrogen-based silsesquioxane into the reactor, and turn on the bottom reflux device. T2: Introduce helium gas to remove oxygen for 25-40 minutes, turn on the plasma equipment, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; spray the mixed liquid onto both sides of the membrane through the horizontal spray pipe, add 0.4-0.9 parts of tetrabutylammonium bromide, and heat up to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0013] Furthermore, the power of the T2 plasma device is 100-130W.

[0014] Furthermore, the reaction temperature of T2 is 70-80℃, and the reaction time is 3-5 hours.

[0015] Furthermore, the T3 vacuum drying oven has a vacuum degree of 0.07 MPa, a temperature of 60-70℃, and a drying time of 5-15 minutes.

[0016] Reaction mechanism: Plasma treatment can activate the surface of BOPP membrane, generating active free radicals (•C-) and carbon-carbon double bonds (C=C), providing reaction sites for subsequent interface modification. The quaternary ammonium cation of tetrabutylammonium bromide ((C4H9)4N⁺) can weaken the bond energy of the silicon-hydrogen bond (Si-H) in hydrogen-based silsesquioxanes, and its bromide ion (Br⁻) can further assist in the dissociation of silicon-hydrogen bonds, promoting the generation of silicon-based species. These silicon-based species undergo addition reactions with the carbon-carbon double bonds on the BOPP membrane surface to form elastic silicon-carbon chains. On the other hand, they synergistically interact with the amino groups and double bonds in 5-isopropenyl-pyridine-2-amine to optimize the molecular arrangement and structural stability of the elastic chains. At the same time, the active free radicals on the BOPP membrane surface can covalently bond with the modified chains, strengthening the bonding strength between the membrane body and the modified layer, providing support for the adhesion, shock absorption, and noise reduction performance of the tape at the molecular structure level.

[0017] The present invention discloses a production process for a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape. Compared with the prior art, the present invention has the following significant advantages: 1. Enhanced Adhesion Strength: The covalently bonded modified layer formed on the surface of the modified BOPP film creates a stronger interfacial force with the composite adhesive, improving the overall adhesion performance of the tape. This ensures a tight fit with the packaging material when sealing goods, preventing packaging loosening during transportation due to weak adhesion.

[0018] 2. Improved shock absorption performance: The silicon-carbon bond elastic chains formed during the modification process have excellent deformation recovery capabilities, which can efficiently absorb external impact energy and reduce collision damage to goods caused by vibration during transportation. It is especially suitable for packaging and protection of fragile items.

[0019] 3. Optimized noise reduction effect: The elastic structure in the modified layer can effectively reduce the transmission of noise caused by friction or collision during packaging handling and transportation, reduce noise interference in logistics scenarios, and meet the packaging requirements for noise control. Detailed Implementation

[0020] The present invention will now be described in detail with reference to embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

[0021] The following detailed description is exemplary and intended to provide further detailed explanation of the invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention.

[0022] 1. 180° peel strength test: Referring to GB / T2792-2014 "Determination of peel strength of adhesive tape", an electronic universal testing machine was used to paste the tape sample onto a standard stainless steel plate and roll it back and forth 3 times with a 2kg rolling wheel. After 24 hours, a 180° peel test was carried out at a speed of 300mm / min.

[0023] 2. Impact Absorption Rate Test: Referring to Appendix A of GB / T1865-2009 "Artificial Climate Aging and Artificial Radiation Exposure of Paints and Varnishes", a drop hammer impact tester was used. The tape sample was pasted on a 5mm thick cardboard to make a 100mm×100mm sample. The drop hammer mass was 1kg and the impact height was 500mm. The energy change before and after the impact was measured. Impact absorption rate = (energy before impact - energy after impact) / energy before impact × 100%.

[0024] 3. Sound absorption coefficient test: Referring to GB / T18696.2-2002 "Measurement of sound absorption coefficient and acoustic impedance in acoustic impedance tubes - Part 2: Transfer function method", the sound absorption coefficient of the tape sample was measured at a frequency of 2000Hz using an impedance tube sound absorption coefficient measurement system.

[0025] Example 1

[0026] A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 40g of acrylate copolymer emulsion with a solid content of 45%, 20g of epoxy-modified polyurethane with a molecular weight of 8000, 5g of nano-calcium carbonate, 1g of tackifying resin, 1g of dispersant, 0.5g of defoamer, and 10g of deionized water, and stir for 30min at a speed of 800r / min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 15μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0027] The tackifying resin is rosin glycerol ester RG-80.

[0028] The dispersant is sodium polyacrylate (PAA-Na).

[0029] The defoamer mentioned is polyether defoamer PE-6800.

[0030] The release film is a fluorinated release film, FEP-30.

[0031] The steps for S3 curing are as follows: first, pre-curing at 60°C for 20 minutes, and then fully curing at 80°C for 40 minutes.

[0032] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 148g of toluene, 12g of 5-isopropenyl-pyridine-2-amine and 6g of hydrogen-based silsesquioxane into the reactor, and turn on the bottom reflux device. T2: Helium gas is introduced for deoxygenation for 250 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through a horizontal spray pipe, 0.4g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0033] The power of the T2 plasma device is 100W.

[0034] The reaction temperature of T2 is 70°C, and the reaction time is 3 hours.

[0035] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 60°C, and a drying time of 5 minutes.

[0036] Example 2

[0037] A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 45g of acrylate copolymer emulsion with a solid content of 50%, 23g of epoxy-modified polyurethane with a molecular weight of 9000, 6g of nano-calcium carbonate, 2g of tackifying resin, 2g of dispersant, 1g of defoamer, and 13g of deionized water, and stir for 35 minutes at a speed of 900r / min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 20μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0038] The tackifying resin is petroleum resin C5-101.

[0039] The dispersant is a phosphate ester dispersant, DP-950.

[0040] The defoamer mentioned is mineral oil defoamer MO-20.

[0041] The release film is a polyethylene release film, PE-40.

[0042] The steps for S3 curing are as follows: first, pre-curing at 65°C for 25 minutes, and then fully curing at 85°C for 45 minutes.

[0043] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 186g of toluene, 14g of 5-isopropenyl-pyridine-2-amine and 7g of hydrogen-based silsesquioxane into the reactor, and turn on the bottom reflux device. T2: Helium gas is introduced for deoxygenation for 30 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through a horizontal spray pipe, 0.5g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0044] The power of the T2 plasma device is 110W.

[0045] The reaction temperature of T2 is 75°C, and the reaction time is 4 hours.

[0046] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 65°C, and a drying time of 10 minutes.

[0047] Example 3

[0048] A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 55g of acrylate copolymer emulsion with a solid content of 50%, 28g of epoxy-modified polyurethane with a molecular weight of 11000, 8g of nano-calcium carbonate, 4g of tackifying resin, 3g of dispersant, 1.5g of defoamer, and 18g of deionized water, and stir at a speed of 1100r / min for 40min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 20μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0049] The tackifying resin is petroleum resin C5-101.

[0050] The dispersant is a phosphate ester dispersant, DP-950.

[0051] The defoamer mentioned is mineral oil defoamer MO-20.

[0052] The release film is a polyethylene release film, PE-40.

[0053] The steps for S3 curing are as follows: first, pre-curing at 65°C for 25 minutes, and then fully curing at 85°C for 55 minutes.

[0054] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 255g toluene, 16g 5-isopropenyl-pyridine-2-amine, and 9g hydrosilsesquioxane into the reactor, and turn on the bottom reflux device. T2: Helium gas is introduced for deoxygenation for 35 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through the horizontal spray pipe, 0.8g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0055] The power of the T2 plasma device is 120W.

[0056] The reaction temperature of T2 is 75°C, and the reaction time is 4 hours.

[0057] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 65°C, and a drying time of 10 minutes.

[0058] Example 4

[0059] A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 60g of 55% acrylate copolymer emulsion, 30g of epoxy-modified polyurethane with a molecular weight of 12000, 10g of nano-calcium carbonate, 5g of tackifying resin, 4g of dispersant, 2g of defoamer, and 20g of deionized water, and stir at 1200r / min for 45min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 25μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0060] The tackifying resin is terpene phenolic resin TPR-203.

[0061] The dispersant is polycarboxylate dispersant SN-5040.

[0062] The defoamer mentioned is silicone defoamer DF-10.

[0063] The release film mentioned is a silicone oil release film PET-50-S.

[0064] The steps for S3 curing are as follows: first, pre-curing at 70°C for 30 minutes, and then fully curing at 90°C for 60 minutes.

[0065] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 296g toluene, 18g 5-isopropenyl-pyridine-2-amine, and 10g hydrosilsesquioxane into the reactor, and turn on the bottom reflux device. T2: Helium gas is introduced for deoxygenation for 40 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through a horizontal spray pipe, 0.9g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0066] The power of the T2 plasma device is 130W.

[0067] The reaction temperature of T2 is 80℃, and the reaction time is 5 hours.

[0068] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 70°C, and a drying time of 15 minutes.

[0069] Comparative Example 1 A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 40g of acrylate copolymer emulsion with a solid content of 45%, 20g of epoxy-modified polyurethane with a molecular weight of 8000, 5g of nano-calcium carbonate, 1g of tackifying resin, 1g of dispersant, 0.5g of defoamer, and 10g of deionized water, and stir for 30min at a speed of 800r / min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the BOPP film with a coating thickness of 15μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0070] The tackifying resin is rosin glycerol ester RG-80.

[0071] The dispersant is sodium polyacrylate (PAA-Na).

[0072] The defoamer mentioned is polyether defoamer PE-6800.

[0073] The release film is a fluorinated release film, FEP-30.

[0074] The steps for S3 curing are as follows: first, pre-curing at 60°C for 20 minutes, and then fully curing at 80°C for 40 minutes.

[0075] Comparative Example 2 A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 40g of acrylate copolymer emulsion with a solid content of 45%, 20g of epoxy-modified polyurethane with a molecular weight of 8000, 5g of nano-calcium carbonate, 1g of tackifying resin, 1g of dispersant, 0.5g of defoamer, and 10g of deionized water, and stir for 30min at a speed of 800r / min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 15μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0076] The tackifying resin is rosin glycerol ester RG-80.

[0077] The dispersant is sodium polyacrylate (PAA-Na).

[0078] The defoamer mentioned is polyether defoamer PE-6800.

[0079] The release film is a fluorinated release film, FEP-30.

[0080] The steps for S3 curing are as follows: first, pre-curing at 60°C for 20 minutes, and then fully curing at 80°C for 40 minutes.

[0081] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 148g of toluene and 6g of hydrogen-based silsesquioxane into the reactor, and turn on the bottom reflux device; T2: Helium gas is introduced for deoxygenation for 250 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through a horizontal spray pipe, 0.4g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0082] The power of the T2 plasma device is 100W.

[0083] The reaction temperature of T2 is 70°C, and the reaction time is 3 hours.

[0084] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 60°C, and a drying time of 5 minutes.

[0085] Comparative Example 3 A production process for a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape, comprising the following steps: S1: Mix 40g of acrylate copolymer emulsion with a solid content of 45%, 20g of epoxy-modified polyurethane with a molecular weight of 8000, 5g of nano-calcium carbonate, 1g of tackifying resin, 1g of dispersant, 0.5g of defoamer, and 10g of deionized water, and stir for 30min at a speed of 800r / min to obtain a composite adhesive. S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 15μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound up to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape.

[0086] The tackifying resin is rosin glycerol ester RG-80.

[0087] The dispersant is sodium polyacrylate (PAA-Na).

[0088] The defoamer mentioned is polyether defoamer PE-6800.

[0089] The release film is a fluorinated release film, FEP-30.

[0090] The steps for S3 curing are as follows: first, pre-curing at 60°C for 20 minutes, and then fully curing at 80°C for 40 minutes.

[0091] The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 148g of toluene and 12g of 5-isopropenyl-pyridine-2-amine into the reactor, and turn on the bottom reflux device; T2: Helium gas is introduced for deoxygenation for 250 minutes, the plasma equipment is turned on, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; the mixed liquid is sprayed onto both sides of the membrane through a horizontal spray pipe, 0.4g of tetrabutylammonium bromide is added, and the temperature is raised to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

[0092] The power of the T2 plasma device is 100W.

[0093] The reaction temperature of T2 is 70°C, and the reaction time is 3 hours.

[0094] The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 60°C, and a drying time of 5 minutes.

[0095] Table 1 shows the test results of the 180° peel strength, impact absorption rate, and sound absorption coefficient of the tapes in the examples and comparative examples. 180° peel strength (N / 25mm) Impact absorption rate (%) Sound absorption coefficient Example 1 5.6 72 0.52 Example 2 5.7 73 0.53 Example 3 6.0 79 0.56 Example 4 6.1 81 0.58 Comparative Example 1 3.2 45 0.29 Comparative Example 2 4.8 64 0.46 Comparative Example 3 5.1 67 0.48 The performance differences between the examples and comparative examples in the data table clearly demonstrate that the synergistic effect of the click chemical reaction products and key auxiliary compounds (5-isopropenyl-pyridine-2-amine, hydroxysilsesquioxane, tetrabutylammonium bromide) in the leaching agent is the core factor determining the overall performance of the tape in terms of high adhesion, shock absorption, and noise reduction. Examples 1-4 utilize a complete modification system, where the three compounds achieve a synergistic effect through click reaction: tetrabutylammonium bromide assists hydrogen-based silsesquioxane in generating silicon-based species, which then react with the BOPP film and 5-isopropenyl-pyridine-2-amine to form structurally stable silicon-carbon bonded elastic chains, thereby strengthening the interfacial bonding between the film and the adhesive. Ultimately, this results in a simultaneous improvement in 180° peel strength, impact absorption rate, and sound absorption coefficient.

[0096] Comparative Example 1 used an unmodified BOPP membrane, lacking the modified structure formed by the aforementioned click reaction products. The membrane had weak adhesion to the adhesive and lacked an elastic buffer layer, resulting in all three performance characteristics being significantly lower than those of the Examples. Comparative Example 2 did not add 5-isopropenyl-pyridine-2-amine, leading to insufficient optimization of the elastic chain molecular structure, weakened interfacial adhesion and elastic deformation capacity, and a significant decrease in performance compared to the Examples. Comparative Example 3 did not add hydrogen-based silsesquioxane, failing to form sufficient silicon-carbon bonded elastic chains. The elastic support structure required for vibration damping and noise reduction was missing, and its performance was also inferior to the Examples.

[0097] In summary, the product formed by the click reaction of 5-isopropenyl-pyridine-2-amine, hydrogen silsesquioxane, and tetrabutylammonium bromide is the key to giving the tape its comprehensive properties of high adhesion, shock absorption, and noise reduction. Without any one of the three, optimal performance cannot be achieved.

[0098] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A production process for a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulating tape, the operation steps of which are as follows, by weight parts: S1: Mix 40-60 parts of acrylate copolymer emulsion with a solid content of 45-55%, 20-30 parts of epoxy-modified polyurethane with a molecular weight of 8000-12000, 5-10 parts of nano-calcium carbonate, 1-5 parts of tackifying resin, 1-4 parts of dispersant, 0.5-2 parts of defoamer, and 10-20 parts of deionized water, and stir at a speed of 800-1200 r / min for 30-45 min to obtain a composite adhesive; S2: The composite adhesive is uniformly coated on the surface of the modified BOPP film with a coating thickness of 15-25μm, and then the release film is laminated to form a composite substrate; S3: The composite substrate is fed into a curing oven, cured and shaped, slit, and wound to obtain a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape. The modified BOPP film is prepared by treating a BOPP film in a plasma device containing toluene, 5-isopropenyl-pyridine-2-amine, hydroxysilsesquioxane, and tetrabutylammonium bromide.

2. The production process of a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape according to claim 1, characterized in that: The tackifying resin is one of rosin glycerol ester RG-80, petroleum resin C5-101, or terpene phenolic resin TPR-203.

3. The production process of a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape according to claim 1, characterized in that: The dispersant is one of sodium polyacrylate (PAA-Na), phosphate ester dispersant DP-950, and polycarboxylate dispersant SN-5040.

4. The production process of a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape according to claim 1, characterized in that: The defoamer is one of the following: polyether defoamer PE-6800, mineral oil defoamer MO-20, and silicone defoamer DF-10.

5. The production process of a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape according to claim 1, characterized in that: The release film is one of the following: fluorinated release film FEP-30, polyethylene release film PE-40, and silicone oil release film PET-50-S.

6. The production process of a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape according to claim 1, characterized in that: The steps for S3 curing are as follows: first, pre-curing at 60-70℃ for 20-30 minutes, and then fully curing at 80-90℃ for 40-60 minutes.

7. The production process of a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape according to claim 1, characterized in that: The method for preparing the modified BOPP film is as follows: T1: Place the BOPP membrane vertically between the two plates of the plasma reactor, add 148-296 parts of toluene, 12-18 parts of 5-isopropenyl-pyridine-2-amine, and 6-10 parts of hydrogen-based silsesquioxane into the reactor, and turn on the bottom reflux device. T2: Introduce helium gas to remove oxygen for 25-40 minutes, turn on the plasma equipment, and helium gas is ejected from the gas holes on the inner side of the electrode to form a parallel gas flow; spray the mixed liquid onto both sides of the membrane through the horizontal spray pipe, add 0.4-0.9 parts of tetrabutylammonium bromide, and heat up to react; T3: After the reaction is complete, turn off the plasma equipment, filter out impurities, and put the membrane into a vacuum drying oven to dry, thus obtaining the modified BOPP film.

8. The production process of a high-viscosity, shock-absorbing, and noise-reducing BOPP encapsulation tape according to claim 7, characterized in that: The power of the T2 plasma device is 100-130W.

9. The production process of a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape according to claim 7, characterized in that: The reaction temperature of T2 is 70-80℃, and the reaction time is 3-5 hours.

10. The production process of a high-viscosity, shock-absorbing, and noise-absorbing BOPP encapsulation tape according to claim 7, characterized in that: The T3 vacuum drying oven operates at a vacuum level of 0.07 MPa, a temperature of 60-70°C, and a drying time of 5-15 minutes.