Display module and display device

Abstract

The invention discloses a display module and a display device, belongs to the technical field of display, and aims to at least solve the problem of low assembly efficiency of the display module due to the fact that a printed circuit board and an electromagnetic film are connected through a flexible circuit board in related technologies. The display module comprises a display panel, an electromagnetic film and a printed circuit board, and the electromagnetic film is located on the side, away from a light emitting face, of the display panel and comprises a first binding bonding pad; the printed circuit board is located on the side, away from the display panel, of the electromagnetic film and comprises a second binding bonding pad, and the second binding bonding pad is connected with the first binding bonding pad in a binding mode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] The display module comprises a display panel, a super clean foam (SCF) and an electromagnetic film which are sequentially stacked on the backlight side of the display panel, and a printed circuit board (PCB) which is disposed on the side of the electromagnetic film away from the super clean foam and is electrically connected to the electromagnetic film through a flexible printed circuit (FPC).

[0003] However, the flexible printed circuit and the printed circuit board rely on manual connection of the connector of the flexible printed circuit to the connection end of the printed circuit board in the connection process, resulting in low assembly efficiency and high assembly cost of the display module. SUMMARY

[0004] Embodiments of the present application provide a display module and a display device to at least improve the problem of low assembly efficiency of the display module caused by connecting the printed circuit board and the electromagnetic film through the flexible printed circuit in the related art.

[0005] To achieve the above-mentioned purpose, according to a first aspect of the present application, a display module is provided, comprising: a display panel; an electromagnetic film located on the side of the display panel away from the light-out surface, the electromagnetic film comprising a first binding pad; and a printed circuit board located on the side of the electromagnetic film away from the display panel, the printed circuit board comprising a second binding pad, the second binding pad being connected to the first binding pad.

[0006] In some embodiments, the second binding pad is disposed on the surface of the printed circuit board close to the display panel and is disposed opposite to the first binding pad.

[0007] In some embodiments, the electromagnetic film has a first windowing area exposing the first binding pad, the printed circuit board has a second windowing area exposing the second binding pad, and the orthographic projection of the first windowing area on the display panel is located within the orthographic projection of the second windowing area on the display panel.

[0008] In some embodiments, the first bonding pad comprises a plurality of first inter-spaced fingers, a width of each first finger and a spacing between two adjacent first fingers sum up to a first pitch; the second bonding pad comprises a plurality of second inter-spaced fingers, a width of each second finger and a spacing between two adjacent second fingers sum up to a second pitch; wherein the first pitch is smaller than the second pitch.

[0009] In some embodiments, the second bonding pad is connected to the first bonding pad by a room temperature curing anisotropic conductive adhesive.

[0010] In some embodiments, the display module further comprises an interlayer dielectric layer and a shielding layer arranged between the electromagnetic film and the printed circuit board, the interlayer dielectric layer is located between the shielding layer and the electromagnetic film, and a first opening is formed on the interlayer dielectric layer, a second opening is formed on the shielding layer, and the first opening and the second opening are in communication with each other and expose the first bonding pad.

[0011] In some embodiments, the interlayer dielectric layer comprises a pressure sensitive adhesive.

[0012] In some embodiments, the shielding layer comprises a ferrite magnetic material.

[0013] In some embodiments, the display module further comprises a metal heat dissipation layer arranged between the shielding layer and the printed circuit board, the metal heat dissipation layer is provided with a third opening, and the third opening, the first opening and the second opening are in communication with each other and expose the first bonding pad.

[0014] In some embodiments, the display panel comprises a display main body portion, a bending portion and a bonding portion connected in sequence, and the bonding portion is arranged opposite to the display main body portion; the display module further comprises a back plate, an adhesive layer and a buffer layer arranged in sequence on a side of the display main body portion close to the bonding portion, and the electromagnetic film is arranged on the buffer layer.

[0015] According to a second aspect of the present application, a display device is provided, comprising the display module of any one of the embodiments of the first aspect.

[0016] In the display module provided by the embodiments of the present application, the first binding pad of the electromagnetic film is connected with the second binding pad of the printed circuit board, so that a flexible circuit board is not needed to be arranged between the electromagnetic film and the printed circuit board to connect the two, thereby effectively avoiding the problem of low assembly efficiency of the display module caused by the connector of the flexible circuit board relying on manual buckling on the connection end of the printed circuit board in the related art. In addition, since the flexible circuit board is omitted, the stress of the ultra-clean foam or the similar structure under the action of the attaching jig is relatively uniform in the process of arranging the ultra-clean foam or the similar structure between the display panel and the electromagnetic film, thereby on the one hand, the problem of indentation can be effectively improved, so as to ensure that the display module has a high appearance yield, and on the other hand, the problem of virtual attachment of the ultra-clean foam or the similar structure can be effectively improved, thereby improving the use stability of the display module.

[0017] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0019] Figure 1 is a cross-sectional structure schematic diagram of a display module according to the related art; Figure 2 is a cross-sectional structure schematic diagram of a display module provided by some embodiments of the present application; Figure 3 is another cross-sectional structure schematic diagram of a display module provided by some embodiments of the present application; Figure 4 is a relative position relationship schematic diagram of a display panel and a printed circuit board according to some embodiments of the present application; Figure 5 is a relative position relationship schematic diagram of an electromagnetic film and a printed circuit board according to some embodiments of the present application; Figure 6 is a back surface structure schematic diagram of a printed circuit board according to some embodiments of the present application; Figure 7 is a cross-sectional structure diagram of a display device provided by some embodiments of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described technical solutions are only used to explain and describe the ideas of the present application, and should not be regarded as limiting the protection scope of the present application.

[0021] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and similar words do not represent any order, number, or importance, but are only used to distinguish different technical features. The term "multiple" and similar words represent two or more, unless otherwise explicitly limited.

[0022] In the present application, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments. The embodiments, implementation manners, examples and related technical features of the present application can be combined, replaced with each other without conflict.

[0023] In the related art, as shown in Figure 1 The display module 100' includes a display panel 101', an ultra-clean foam 102', an electromagnetic film 103', a printed circuit board 104', and a flexible circuit board 105', wherein the ultra-clean foam 102' and the electromagnetic film 103' are located on the backlight side of the display panel 101' and are sequentially stacked, one end of the flexible circuit board 105' is connected with the binding pad of the electromagnetic film 103', the other end of the flexible circuit board 105' extends to the surface of the side of the printed circuit board 104' facing away from the display panel 101', and is buckled on the connection end of the printed circuit board 104' through the connector, thereby realizing the electrical connection between the printed circuit board 104' and the electromagnetic film 103'.

[0024] However, the connector of the flexible circuit board 105' depends on manual buckling on the connection end of the printed circuit board 104', which leads to low assembly efficiency and high assembly cost of the display module 100'.

[0025] In addition, the connector has a large thickness, and the flexible circuit board 105' has a thickness difference at a position where the connector is arranged and other positions. During the process of attaching the ultra-clean foam 102' on the display panel 101', the attachment jig needs to be hollowed out to avoid the flexible circuit board 105', which is prone to cause the ultra-clean foam 102' to have marks due to uneven stress, affecting the appearance yield of the display module 100', and is also prone to cause the ultra-clean foam 102' to be attached loosely, affecting the use stability of the display module 100'.

[0026] Based on this, some embodiments of the present application provide a display module and a display device comprising the display module to at least improve the problem of low assembly efficiency of the display module caused by connecting the printed circuit board and the electromagnetic film through the flexible circuit board in the related art.

[0027] As shown in Figures 2 to 6 , the display module 100 comprises a display panel 10, an electromagnetic film 20, and a printed circuit board 30.

[0028] The electromagnetic film 20 is located on the side of the display panel 10 away from the light-emitting surface, and the electromagnetic film 20 comprises a first binding pad 21. The printed circuit board 30 is located on the side of the electromagnetic film 20 away from the display panel 10, and the printed circuit board 30 comprises a second binding pad 31, and the second binding pad 31 is connected in binding with the first binding pad 21.

[0029] For the display module 100 provided by the embodiments of the present application, since the first binding pad 21 of the electromagnetic film 20 is connected in binding with the second binding pad 31 of the printed circuit board 30, it is not necessary to arrange a flexible circuit board between the electromagnetic film 20 and the printed circuit board 30 to connect the two, thereby effectively avoiding the problem of low assembly efficiency of the display module caused by the connector of the flexible circuit board relying on manual buckling on the connection end of the printed circuit board in the related art. In addition, since the flexible circuit board is omitted, during the process of arranging the ultra-clean foam or similar structure between the display panel 10 and the electromagnetic film 20, the ultra-clean foam or similar structure is stressed relatively uniformly under the action of the attachment jig, thereby on the one hand, the problem of marks can be effectively improved, ensuring that the display module 100 has a high appearance yield, and on the other hand, the problem of loose attachment of the ultra-clean foam or similar structure can be effectively improved, thereby improving the use stability of the display module 100.

[0030] The display module and the display device provided by the embodiments of the present application will be described below in combination with specific embodiments, which are specifically described as follows.

[0031] Some embodiments of the present application provide a display module, as shown in Figure 2 and Figure 3 , the display module 100 comprises a display panel 10, an electromagnetic film 20, and a printed circuit board 30.

[0032] Referring to Figure 2 The light-emitting surface of the display panel 10 is used for displaying a picture, and the back surface of the display panel 10 is arranged opposite to the light-emitting surface. The display panel 10 can be a flexible display panel, which comprises a display main body part 11, a bending part 12 and a binding part 13 connected in sequence. The binding part 13 is transferred to the back side of the display main body part 11 by bending the bending part 12, and the binding part 13 is arranged opposite to the display main body part 11.

[0033] The display main body part 11 comprises a driving substrate and a light-emitting device layer on the driving substrate. The driving substrate can drive the light-emitting device in the light-emitting device layer to emit light, so as to realize picture display of the display panel 10. The binding part 13 can be connected with a printed circuit board 30, so as to receive a control signal from the printed circuit board 30 and transmit the control signal to the driving substrate, thereby driving the light-emitting device to emit light. For example, the binding part 13 is connected with the printed circuit board 30 through a flexible circuit board CC.

[0034] In some examples, the display module 100 further comprises a polarizer POL, an optical adhesive layer OCA and a cover plate CG arranged in sequence on the side of the display main body part 11 away from the binding part 13. The light emitted by the display main body part 11 can pass through the polarizer POL, the optical adhesive layer OCA and the cover plate CG in sequence and exit, so that a user can watch the picture displayed by the display module 100.

[0035] In some examples, the display module 100 further comprises a back plate BP, an adhesive layer 41 and a buffer layer 42 arranged in sequence on the side of the display main body part 11 close to the binding part 13, and the electromagnetic film 20 is arranged on the buffer layer 42. The back plate BP can provide stable support for the display main body part 11. The adhesive layer 41 can stably bond the buffer layer 42 to the back plate BP. For example, the adhesive layer 41 can comprise a textured adhesive, in which case the adhesive layer 41 has a certain flexibility and can play a role in exhausting air, thereby facilitating the flexible design of the display module 100. In addition, the buffer layer 42 can comprise foam, which can play a role in buffering and shading, thereby improving the display effect of the display module 100.

[0036] In some examples, a support part and a spacer can be arranged in sequence on the side of the binding part 13 close to the display main body part 11. The support part can be made of the same material as the back plate BP. The spacer can be fixed on the electromagnetic film 20.

[0037] Referring to Figure 3 The electromagnetic film 20 is located on the side of the back surface of the display panel 10, and the electromagnetic film 20 comprises a first binding pad 21.

[0038] It is worth mentioning that in the description of the present application, the electromagnetic film 20 is an electromagnetic induction structure using electromagnetic resonance technology. The electromagnetic film 20 includes an electromagnetic induction layer, and a plurality of coils are arranged on the electromagnetic induction layer. By introducing alternating current to one of the coils through the controller, an electromagnetic field will be generated around the coil. In the electromagnetic field, the movement of the stylus will cause the stylus resonance circuit to accumulate electric energy. After the stylus accumulates electric energy, the controller will stop providing alternating current to the coil and connect the coil to the receiving circuit. At this time, the energy accumulated by the stylus will be transmitted to the coil near the stylus tip through the free vibration of the resonance circuit. In addition, the controller can first scan the plurality of coils on the electromagnetic induction layer to preliminarily detect the approximate position of the stylus, and then scan the plurality of coils around the stylus and process the detected signals, so as to calculate the accurate coordinates of the stylus.

[0039] Please continue to refer to Figure 3 , the printed circuit board 30 is located on the side of the electromagnetic film 20 away from the display panel 10, and the printed circuit board 30 includes a second binding pad 31, which is bound and connected with the first binding pad 21, so as to realize signal transmission between the printed circuit board 30 and the electromagnetic film 20.

[0040] In the embodiment, since the first binding pad 21 of the electromagnetic film 20 is bound and connected with the second binding pad 31 of the printed circuit board 30, it is not necessary to set a flexible circuit board between the electromagnetic film 20 and the printed circuit board 30 to connect them, so as to effectively avoid the problem of low assembly efficiency of the display module caused by the connector of the flexible circuit board relying on manual buckling on the connection end of the printed circuit board in the related art. In addition, since the flexible circuit board is omitted, the super-clean foam is relatively uniformly stressed under the action of the attaching jig in the process of setting the super-clean foam composed of the adhesive layer 41 and the buffer layer 42 between the display panel 10 and the electromagnetic film 20, so as to effectively improve the problem of indentation on one hand, ensure that the display module 100 has a high appearance yield, and on the other hand, effectively improve the problem of virtual attachment of the super-clean foam, thereby improving the use stability of the display module 100.

[0041] In some embodiments, please continue to refer to Figure 3 , the display module 100 further includes an interlayer dielectric layer 51 and a shielding layer 52 arranged between the electromagnetic film 20 and the printed circuit board 30. The interlayer dielectric layer 51 is located between the shielding layer 52 and the electromagnetic film 20, and a first opening K1 is formed on the interlayer dielectric layer 51. The shielding layer 52 is provided with a second opening K2, and the first opening K1 and the second opening K2 are in communication with each other and expose the first binding pad 21.

[0042] In the embodiment, by arranging the shielding layer 52, the influence of external electromagnetic interference on the signal transmitted in the electromagnetic film 20 can be effectively inhibited, so that the electromagnetic film 20 can keep a stable working state. In addition, by arranging the first opening K1 on the interlayer medium layer 51, the second opening K2 on the shielding layer 52, and exposing the first binding pad 21 through the first opening K1 and the second opening K2, the binding connection between the first binding pad 21 and the second binding pad 31 can be ensured.

[0043] In some examples, the interlayer medium layer 51 includes a pressure sensitive adhesive (PSA). On one hand, the adhesion of the pressure sensitive adhesive can be used to fix the electromagnetic film 20 and the shielding layer 52. On the other hand, the elasticity of the pressure sensitive adhesive can be used to absorb part of the mechanical stress and thermal stress, so as to protect the electromagnetic film 20.

[0044] In some examples, the shielding layer 52 includes a ferrite magnetic material. By using the ferrite magnetic material to make the shielding layer 52, the high-frequency noise can be well absorbed, so as to effectively inhibit the influence of external electromagnetic interference on the signal transmitted in the electromagnetic film 20.

[0045] In some examples, please refer to Figure 3 , the display module 100 further includes a metal heat dissipation layer 53 arranged between the shielding layer 52 and the printed circuit board 30. The metal heat dissipation layer 53 is provided with a third opening K3, and the third opening K3 is in communication with the first opening K1 and the second opening K2 and exposes the first binding pad 21.

[0046] In the embodiment, by arranging the metal heat dissipation layer 53, the heat generated during the working of the display panel 10 and the printed circuit board 30 can be quickly dissipated, so as to improve the working performance of the display module 100. In addition, the metal heat dissipation layer 53 also has a certain rigidity, so as to improve the structural strength of the display module 100. In addition, by arranging the third opening K3 on the metal heat dissipation layer 53, the third opening K3 cooperates with the first opening K1 and the second opening K2 to expose the first binding pad 21, so as to ensure that the metal heat dissipation layer 53 does not hinder the binding connection between the first binding pad 21 and the second binding pad 31.

[0047] In some examples, the metal heat dissipation layer 53 can include copper or aluminum. In this way, the metal heat dissipation layer 53 can have a certain electromagnetic shielding capability, so as to form a composite shielding assembly with the shielding layer 52, thereby further improving the anti-interference capability of the electromagnetic film 20.

[0048] In some examples, the printed circuit board 30 is adhered to the metal heat dissipation layer 53 by a tape.

[0049] In some embodiments, please refer to Figure 3 The second bonding pad 31 is disposed on the surface of the printed circuit board 30 close to the display panel 10, and is disposed opposite to the first bonding pad 21.

[0050] In the embodiment, since the second bonding pad 31 is disposed on the surface of the printed circuit board 30 close to the display panel 10, the second bonding pad 31 and the first bonding pad 21 can be oriented towards each other, which can simplify the electrical connection path between the second bonding pad 31 and the first bonding pad 21, on the one hand, it is beneficial to reduce signal transmission loss and improve signal transmission stability, on the other hand, it is helpful to improve the connection stability between the second bonding pad 31 and the first bonding pad 21.

[0051] In some examples, the second bonding pad 31 and the first bonding pad 21 are connected by conductive adhesive. For example, the second bonding pad 31 and the first bonding pad 21 are connected by room temperature curing anisotropic conductive adhesive M.

[0052] By using room temperature curing anisotropic conductive adhesive M to bind the second bonding pad 31 and the first bonding pad 21, it can avoid the problem that the use of traditional high-temperature anisotropic conductive adhesive (ACF) causes heat damage to the display panel 10 and other devices in the high-temperature environment required by the ACF. Moreover, since the room temperature curing anisotropic conductive adhesive M does not require heating equipment, it is beneficial to solve the energy consumption and shorten the process time.

[0053] It is worth noting that in the embodiments of the present application, the room temperature curing anisotropic conductive adhesive M refers to the ACF that can be cured at room temperature, which can realize the binding connection between the second bonding pad 31 and the first bonding pad 21 in the temperature range of 20-30℃.

[0054] In some embodiments, as shown in Figure 4 and Figure 5 The electromagnetic film 20 has a first windowing area 201 exposing the first bonding pad 21, and the printed circuit board 30 has a second windowing area 301 exposing the second bonding pad 31, and the orthographic projection of the first windowing area 201 on the display panel 10 is located in the range of the orthographic projection of the second windowing area 301 on the display panel 10.

[0055] In this case, the area of the second opening area 301 is larger than that of the first opening area 201, and the second opening area 301 surrounds the first opening area 201. Thus, in the process of connecting the second bonding pad 31 and the first bonding pad 21 by the conductive adhesive, the gap between the second opening area 301 and the first opening area 201 provides a buffer space for the flow, exhaust and curing of the conductive adhesive (for example, room temperature curing anisotropic conductive adhesive M), thereby ensuring that the conductive adhesive can be uniformly distributed under pressure to form a conductive path with good consistency and improve the connection reliability between the second bonding pad 31 and the first bonding pad 21.

[0056] In some examples, the length direction of the first opening area 201 is the first direction X, and the width direction of the first opening area 201 is the second direction Y, and the first direction X and the second direction Y are perpendicular. In the first direction X, the second opening area 301 and the first opening area 201 have a first spacing D1 between the edges on the same side, and the first spacing D1 can be greater than or equal to 0.1 mm and less than or equal to 0.5 mm. In the second direction Y, the second opening area 301 and the first opening area 201 have a second spacing D2 between the edges on the same side, and the second spacing D2 can be greater than or equal to 0.1 mm and less than or equal to 0.5 mm.

[0057] In the present example, by setting the first spacing D1 and the second spacing D2 in the range of 0.1 mm to 0.5 mm, on the one hand, it is beneficial to the alignment between the second bonding pad 31 and the first bonding pad 21, and on the other hand, it avoids that the opening area of the second opening area 301 is too large to affect its own wiring space and structural strength.

[0058] In some examples, as shown in Figure 6 , the second opening area 301 is arranged on the back surface of the printed circuit board 30 (i.e., the surface of the printed circuit board 30 close to the display panel 10). The back surface of the printed circuit board 30 is also provided with a plurality of copper leakage areas spaced from the second opening area 301, and the copper leakage areas are used to realize the grounding of the printed circuit board 30, thereby avoiding the problem of static accumulation on the printed circuit board 30.

[0059] In some embodiments, referring to Figure 5 , the first bonding pad 21 includes a plurality of first gold fingers 211 spaced from each other, and the sum of the width of the first gold finger 211 and the spacing between the adjacent two first gold fingers 211 is the first pitch P1; the second bonding pad 31 includes a plurality of second gold fingers 311 spaced from each other, and the sum of the width of the second gold finger 311 and the spacing between the adjacent two second gold fingers 311 is the second pitch P2; wherein the first pitch P1 is less than the second pitch P2.

[0060] In this way, during the bonding connection of the first bonding pad 21 and the second bonding pad 31, by arranging the relatively large pitch on the first bonding pad 21, the first gold finger 211 and the second gold finger 311 can be provided with a lateral fine adjustment space for alignment, so as to absorb a certain alignment error, and improve the bonding yield of the first bonding pad 21 and the second bonding pad 31.

[0061] In some examples, the first pitch P1 can be greater than or equal to 0.23 mm and less than or equal to 0.27 mm. The second pitch P2 can be greater than or equal to 0.33 mm and less than or equal to 0.37 mm.

[0062] In some examples, the width of the first gold finger 211 can be greater than or equal to 0.13 mm and less than or equal to 0.17 mm. In some examples, the width of the second gold finger 311 can be greater than or equal to 0.08 mm and less than or equal to 0.12 mm.

[0063] Some embodiments of the present application also provide a display device, such as Figure 7 As shown in the figure, the display device 200 comprises the display module 100 according to any of the above embodiments.

[0064] Since the display device 200 comprises the display module 100, the display device 200 has the technical effects of the display module 100, which will not be repeated here.

[0065] In some examples, the display device 200 can be an electronic book, an electronic newspaper, a flat panel display, a television, a personal portable computer, etc. The embodiments of the present application do not limit this.

[0066] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification made according to the technical essence of the present application without departing from the technical solution content of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that, include: Display panel; An electromagnetic film is located on the side of the display panel opposite to the light-emitting surface, and the electromagnetic film includes a first bonding pad. as well as A printed circuit board is located on the side of the electromagnetic film opposite to the display panel. The printed circuit board includes a second bonding pad, which is bonded to the first bonding pad.

2. The display module according to claim 1, characterized in that, The second bonding pad is disposed on the surface of the printed circuit board near the display panel and is disposed opposite to the first bonding pad.

3. The display module according to claim 2, characterized in that, The electromagnetic film has a first window area exposing the first bonding pad, and the printed circuit board has a second window area exposing the second bonding pad. The orthographic projection of the first window area on the display panel is within the range of the orthographic projection of the second window area on the display panel.

4. The display module according to any one of claims 1-3, characterized in that, The first bonding pad includes a plurality of first gold fingers spaced apart from each other, and the sum of the width of the first gold fingers and the spacing between two adjacent first gold fingers is the first pitch; The second bonding pad includes a plurality of second gold fingers spaced apart from each other, and the sum of the width of the second gold fingers and the spacing between two adjacent second gold fingers is the second pitch; Wherein, the first pitch is smaller than the second pitch.

5. The display module according to any one of claims 1-3, characterized in that, The second bonding pad is connected to the first bonding pad by a room temperature curing anisotropic conductive adhesive.

6. The display module according to any one of claims 1-3, characterized in that, It also includes an interlayer dielectric layer and a shielding layer disposed between the electromagnetic film and the printed circuit board. The interlayer dielectric layer is located between the shielding layer and the electromagnetic film, and a first opening is formed on the interlayer dielectric layer, and a second opening is formed on the shielding layer. The first opening and the second opening are interconnected and expose the first bonding pad.

7. The display module according to claim 6, characterized in that, The interlayer dielectric layer includes a pressure-sensitive adhesive; and / or The shielding layer comprises a ferrite magnetic material.

8. The display module according to claim 6, characterized in that, It also includes a metal heat dissipation layer disposed between the shielding layer and the printed circuit board, the metal heat dissipation layer having a third opening, the third opening communicating with the first opening and the second opening and exposing the first bonding pad.

9. The display module according to any one of claims 1-3, characterized in that, The display panel includes a display main body, a bending part, and a binding part connected in sequence, with the binding part disposed opposite to the display main body. The display module also includes a back plate, an adhesive layer, and a buffer layer, which are stacked sequentially on the side of the display body near the bonding part, and the electromagnetic film is disposed on the buffer layer.

10. A display device, characterized in that, Includes the display module described in any one of claims 1-9.

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