SMT surface mounting control method, SMT surface mounting equipment and SMT surface mounting device

Abstract

The invention discloses an SMT mounting control method, SMT mounting control equipment and an SMT mounting control device, and belongs to the technical field of mounting control. The method is applied to SMT mounting equipment, and comprises the following steps: obtaining validity information of a to-be-mounted material, and determining an effective material; based on the material position of the effective material in the feeder and the physical layout of each suction nozzle, constructing a distribution relation between the effective material and the suction nozzles; performing stroke limit verification on each material-suction nozzle pair in the distribution relation; under the condition that the stroke limit verification is not passed, determining an over-limit suction nozzle, and according to the distribution direction of the over-limit suction nozzle on the mounting head, pairing the effective material which is not mounted and the available suction nozzle so as to update the distribution relation; and repeatedly executing verification on the updated distribution relation until all the material-suction nozzle pairs pass stroke limit verification, and controlling the suction nozzles to execute a mounting action on the sucked effective materials. The method can meet the requirements of high-efficiency mounting of a large-size PCB, an edge element or a full Wafer.

Description

Technical Field

[0001] This application belongs to the field of surface mount control technology, and in particular relates to an SMT surface mount control method, equipment and apparatus. Background Technology

[0002] In automated production of surface mount technology (SMT), high-efficiency placement equipment commonly employs placement heads with multiple horizontally arranged nozzles, in conjunction with feeders distributed on the left and right sides of the equipment, to achieve parallel material handling and high-speed placement. Especially in advanced packaging and wafer-level placement scenarios, tray-type or wafer feeders are widely used, where materials must be identified visually or verified using a map before being picked up.

[0003] However, because the nozzles are fixed in a horizontal layout on the placement head, and the left and right feeder feeders usually exceed the mechanical travel limit of the opposite nozzles, the left nozzle cannot pick up the right feeder material, and the right nozzle cannot pick up the left feeder material. The edge of the PCB placement area may also exceed the placement travel range of some nozzles. If the picking task is assigned by a fixed mapping or simple polling method, it is very easy for the nozzles to "pick up but not place" or "place but not pick up" to exceed the limit. Once a defective or unplaceable material is picked up, it will cause waste of expensive materials and may cause equipment downtime or material rejection.

[0004] Currently, the main methods to avoid exceeding the limit are to reduce the number of nozzles, centralize feeders in the center of the equipment, or restrict the placement area. However, these methods are insufficient to meet the needs of high-efficiency placement of large-size PCBs, edge components, or full-wafer components. Summary of the Invention

[0005] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an SMT placement control method, equipment, and apparatus that can meet the needs of efficient placement of large-size PCBs, edge components, or full-wafer components.

[0006] In a first aspect, this application provides an SMT placement control method applied to an SMT placement equipment, the SMT placement equipment including left and right distributed feeders and a placement head with horizontally arranged multiple nozzles, the method comprising: Obtain the validity information of the materials to be mounted and determine the valid materials; Based on the material position of the effective material in the feeder and the physical layout of each of the nozzles, a distribution relationship is established between the effective material and the nozzles; For each material-nose pairing in the allocation relationship, a stroke limit check is performed, which includes material pick-up stroke limit and placement stroke limit; If the travel limit verification fails, an over-limit nozzle is identified. Based on the distribution direction of the over-limit nozzle on the placement head, the unplaced valid material and the available nozzle are matched to update the allocation relationship. The over-limit nozzle cannot complete the material picking or placement. The updated allocation relationship is repeatedly validated until all material-nose pairs pass the stroke limit validation, and the nozzles are controlled to perform the mounting action by picking up the valid material.

[0007] According to one embodiment of this application, obtaining the validity information of the material to be mounted includes: The visual recognition module of the SMT placement equipment detects the materials in the feeder or reads the pre-stored MAP data to determine whether the materials to be placed are good products. The material to be mounted that is determined to be good is taken as the effective material, and the material X coordinate position of the effective material in the feeder and the target mounting X coordinate position of the effective material on the PCB are obtained. The material position is determined based on the material's X-coordinate position and the target mounting X-coordinate position.

[0008] According to one embodiment of this application, the step of establishing a distribution relationship between the effective material and the suction nozzles based on the material position of the effective material in the feeder and the physical layout of each of the suction nozzles includes: Based on the X-coordinate position of the effective material in the feeder, the unattached effective materials are sorted from smallest to largest. Arrange all the nozzles on the mounting head from left to right according to their installation position; The sorted effective materials are matched one-to-one with the sorted suction nozzles in sequence to construct the material-suction nozzle pairing and obtain the allocation relationship.

[0009] According to one embodiment of this application, the stroke limit verification for each material-nose pair in the allocation relationship includes: In the material-nozzle pairing, the nozzle X-coordinate position in the equipment coordinate system and the effective material X-coordinate position in the feeder are determined. If the X-coordinate position of the material is within the allowable X-range of the feeder, and the deviation between the X-coordinate position of the material and the corresponding X-coordinate position of the nozzle does not exceed the material handling tolerance, the material handling stroke limit verification is deemed to have passed. If the target placement X coordinate of the effective material on the PCB is within the placement allowable X range of the feeder, the placement stroke limit verification is deemed to have passed. If both the material pick-up stroke limit and the mounting stroke limit are verified, the material-nose pairing is confirmed to have passed the stroke limit verification.

[0010] According to one embodiment of this application, the step of matching the unmounted effective material with the available nozzles based on the distribution direction of the over-limit nozzles on the placement head includes: Obtain the out-of-limit suction nozzles that failed the travel limit verification, and construct an out-of-limit suction nozzle set; The coordinate difference between the X-coordinate of each nozzle in the set of oversized nozzles and the X-coordinate of the center of the mounting head is used to calculate the algebraic sum of the coordinate differences; When the algebraic sum is less than zero, the over-limit nozzle is left over-limit. The unmounted effective materials are sorted from smallest to largest according to the X coordinate and paired with the available nozzles located on the right side of the mounting head in turn. If the algebraic sum is greater than zero, the over-limit nozzle is right over-limit. The unmounted effective materials are sorted from largest to smallest according to the X coordinate and paired with the available nozzles located on the left side of the mounting head in turn. Wherein, the X-coordinate of the placement head center is the midpoint of the X-coordinates of all nozzles, and the available nozzles are those that have not been marked as exceeding the limit and have not yet been placed in the current round.

[0011] According to one embodiment of this application, the step of repeatedly performing verification on the updated allocation relationship includes: If the material-nozzle pairing in the updated allocation relationship passes the stroke limit verification, control the corresponding nozzle to perform material picking and complete the mounting. If the material-nose pairing fails the stroke limit verification, the valid material is retained in the set of unattached valid materials to participate in the construction of the allocation relationship in the next round. If the number of material-nozzle pairs that pass the verification does not increase in two consecutive rounds, the verification process is terminated and the set of valid unattached materials is output.

[0012] According to one embodiment of this application, controlling the suction nozzle to perform a mounting action by picking up the effective material includes: If the material-nozzle pairing passes both the material pick-up stroke limit and the placement stroke limit verification, a pick-up command is sent to the nozzle. Once the nozzle has finished picking up the material, it moves to the target position on the PCB to perform placement.

[0013] In a second aspect, this application provides an SMT placement device, including a controller and left and right distributed feeders respectively connected to the controller, and a placement head having a horizontally arranged multi-nozzle, the controller being used to execute the SMT placement control method as described in the first aspect.

[0014] According to one embodiment of this application, the feeder is a tray feeder or a wafer feeder, which are respectively disposed on the left and right sides of the SMT placement equipment. When the feeding area of ​​the feeder on either side exceeds the mechanical stroke limit of the nozzle on the opposite side, the left nozzle cannot pick up the effective material of the right feeder, and the right nozzle cannot pick up the effective material of the left feeder.

[0015] Thirdly, this application provides an SMT placement control device, the device comprising: The acquisition module is used to obtain the validity information of the materials to be mounted and to determine the valid materials. The first processing module is used to establish an allocation relationship between the effective material and the suction nozzle based on the material position of the effective material in the feeder and the physical layout of each suction nozzle; The second processing module is used to perform stroke limit verification on each material-nozzle pair in the allocation relationship, the stroke limit including material picking stroke limit and mounting stroke limit; The third processing module is used to determine the over-limit nozzle when the stroke limit verification fails, and to match the unplaced valid material with the available nozzles according to the distribution direction of the over-limit nozzles on the placement head, so as to update the allocation relationship. The over-limit nozzle cannot complete the material picking or placement. The fourth processing module is used to repeatedly perform verification on the updated allocation relationship until all the material-nozzle pairs pass the stroke limit verification, and control the nozzles to perform the mounting action to pick up the effective material.

[0016] Fourthly, this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the SMT placement control method as described in the first aspect above.

[0017] Fifthly, this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the SMT placement control method as described in the first aspect above.

[0018] In a sixth aspect, this application provides a chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the SMT placement control method as described in the first aspect.

[0019] In a seventh aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements the SMT placement control method as described in the first aspect above.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application.

[0021] The SMT placement control method, equipment, and apparatus provided in this application have the following advantages over the prior art: (1) By assigning tasks based on the effective material location and the physical layout of the nozzles before picking up materials, and simultaneously verifying the dual feasibility of the picking stroke and the placement stroke for each assigned task, it is ensured that the picking action is triggered only when the nozzle can completely execute the picking-placement process. When there is an over-limit situation due to the stroke limitation, the matching strategy of the remaining materials and available nozzles is dynamically adjusted according to the distribution direction of the over-limit nozzles, and the task relay is achieved through multiple rounds of iterative allocation. Thus, without changing the hardware structure of the equipment, the invalid picking, material waste and equipment downtime caused by the inability of the feeder material on one side to be picked up by the nozzle on the other side or the placement position exceeding the limit are avoided. This improves the placement success rate, material utilization rate and production continuity of the horizontal multi-nozzle SMT placement equipment in tray or wafer feeding scenarios, and can meet the needs of large-size PCB, edge components or full wafer high-efficiency placement, taking into account the production goals of high efficiency, zero waste and high yield.

[0022] (2) By integrating real-time visual inspection and pre-stored MAP data, dual verification of material status is achieved, avoiding misjudgment due to the failure of a single inspection method, improving system operating efficiency, and ensuring that only good products that can be mounted enter the subsequent scheduling process, preventing nozzle contamination, equipment downtime or waste of high-value materials caused by invalid material picking, and improving overall mounting reliability and automation continuity. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flowchart illustrating the SMT placement control method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the SMT placement control device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0025] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] The SMT placement control method, SMT placement equipment, SMT placement control device, electronic equipment, and readable storage medium provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0027] The SMT placement control method is applied to SMT placement equipment (hereinafter referred to as "equipment"). The SMT placement equipment includes left and right feeders and a placement head with multiple nozzles arranged laterally. It is an automated manufacturing equipment used to automatically pick up and place electronic components onto a printed circuit board (PCB). The feeder is a feeding device set on the left and right sides of the SMT placement equipment. It is used to store and position materials and is divided into a left feeder area and a right feeder area. It has a carrier track or tray slot inside to fix the material position. The placement head is an actuator on the SMT placement equipment that is equipped with multiple nozzles. It can move as a whole in the XY plane. The nozzle is an end effector used for vacuum suction and release of materials and is fixedly installed on the placement head.

[0028] A PCB is a printed circuit board, which serves as a mounting substrate for electronic components. Its surface has pads for receiving materials.

[0029] Because the nozzles are rigidly arranged in a straight line on the placement head and have no independent X-axis movement capability, the left nozzle usually cannot pick up materials from the right feeder, and vice versa; at the same time, the edge area of ​​the PCB may exceed the placement stroke of some nozzles. Traditional scheduling methods often result in waste of materials that cannot be picked up and placed because they only check the feasibility of picking up the materials.

[0030] like Figure 1 As shown, the SMT placement control method includes: Step 110: Obtain the validity information of the material to be mounted and determine the valid material.

[0031] Understandably, the materials to be mounted are electronic components, such as chips, capacitors, and wafer dies, that the feeder needs to pick up and mount onto the PCB in the current task.

[0032] Validity information is data used to determine whether a material is a suitable material for mounting, including visual inspection results or yield markers in a pre-stored MAP.

[0033] Effective materials are those that have been identified as good products after being judged as suitable for placement and can participate in placement scheduling.

[0034] In step 110, after the SMT placement equipment is started, its built-in vision recognition module acquires images of the materials in the feeders on the left and right sides; through template matching or defect detection algorithms, it identifies whether each material is damaged, flipped, missing, or misaligned; or it directly reads the pre-stored MAP map data, which records the good / bad status of each material position; the materials determined to be good are marked as valid materials, and their positions in the feeders and corresponding PCB placement target positions are recorded as the basic input for subsequent scheduling.

[0035] Step 120: Based on the material position of the effective material in the feeder and the physical layout of each of the nozzles, establish a distribution relationship between the effective material and the nozzles.

[0036] It is understandable that the material position is the X-coordinate position of the effective material in the feeder, reflecting its lateral feeding position.

[0037] The physical layout of the nozzles is a fixed structure in which multiple nozzles on the placement head are rigidly arranged in a straight line along the horizontal direction. Each nozzle has a unique and immutable X coordinate in the equipment coordinate system.

[0038] The allocation relationship consists of a set of scheduling instructions composed of multiple material-nozzle pairs, which are used to guide the material handling task.

[0039] In step 120, all valid materials are sorted from smallest to largest according to their X coordinate in the feeder. At the same time, the nozzles on the placement head are sorted according to their physical installation order from left to right. Then, the sorted materials and nozzles are matched one by one in sequence to form an initial material-nozzle pairing list, which serves as the allocation relationship for the first round of scheduling. Through orderly matching with aligned positions, materials and nozzles are paired as close as possible in space, reducing the need for cross-area material retrieval, reducing the probability of mechanical stroke conflicts in the initial allocation, and improving the efficiency of the first round of placement.

[0040] Step 130: Perform stroke limit verification on each material-nozzle pair in the allocation relationship. The stroke limit includes material pick-up stroke limit and mounting stroke limit.

[0041] Understandably, travel limit verification is a joint verification mechanism that includes both material picking and placement feasibility.

[0042] Material-nose pairing is the mapping relationship between a valid material to be verified and a nozzle.

[0043] The material handling travel limit refers to whether the nozzle can physically reach the material's picking position in the feeder, which is limited by the feeder area boundary and the nozzle's fixed X-coordinate.

[0044] The placement travel limit is the limitation on whether the nozzle can physically reach the target placement position of the material on the PCB, which is limited by the overall movement range of the placement head.

[0045] In step 130, for each material-nozzle pairing, two conditions are verified: first, whether the X coordinate of the material in the feeder is within the allowable pick-up X range of the equipment, and whether the deviation from the X coordinate of the nozzle does not exceed the minimum pick-up tolerance (because the nozzle cannot move laterally); second, whether the target placement X coordinate of the material on the PCB is within the placement X range that the nozzle can reach. Only when both conditions are met is the verification considered successful. The dual feasibility verification mechanism of pick-up and placement is introduced in the scheduling phase to fundamentally prevent the invalid picking of materials that can be picked up but cannot be placed, thereby reducing material waste and improving placement yield and process safety.

[0046] Step 140: If the travel limit verification fails, identify the over-limit nozzles. Based on the distribution direction of the over-limit nozzles on the placement head, pair the unplaced valid materials with the available nozzles to update the allocation relationship. The over-limit nozzles will be unable to complete material picking or placement.

[0047] Understandably, an over-limit nozzle is a nozzle that fails the stroke limit test and is therefore unable to complete material picking or placement.

[0048] The distribution direction is the overall offset trend of the over-limit nozzle on the placement head, which is divided into left over-limit or right over-limit.

[0049] Available nozzles are those that have not been marked as out of limit and have not yet completed their placement task in the current round.

[0050] Updating the allocation relationship involves re-establishing a new material-nose mapping for the remaining materials while retaining the successfully paired materials.

[0051] In step 140, all nozzles that failed verification are collected as an over-limit nozzle set. The algebraic sum of their X coordinates relative to the center of the placement head is calculated. If the sum is negative, it is determined to be a left over-limit, and if it is positive, it is determined to be a right over-limit. Based on this, the unplaced valid materials are reordered and preferentially allocated to the available nozzles on the opposite side (right or left side) to form an updated allocation relationship. Through the intelligent redistribution strategy based on the center of gravity offset of the over-limit nozzles, the task relay between the left and right feeders and multiple nozzles is realized. Without increasing hardware costs, the placement coverage and equipment utilization are improved, which is especially suitable for asymmetric feeding or edge placement scenarios.

[0052] Step 150: Repeat the verification of the updated allocation relationship until all the material-nozzle pairs pass the stroke limit verification, and control the nozzle to perform the mounting action to pick up the effective material.

[0053] It is understandable that repeated execution of the verification is to send the updated allocation relationship back into the travel limit verification process, forming an iterative closed loop.

[0054] Controlling the nozzle to perform the placement action involves sending a pick-up command to the nozzle after double verification is passed, and then moving it to the target position on the PCB to complete the placement after it has picked up the material.

[0055] In step 150, the process of allocation → verification → reallocation is executed cyclically. In each round, only the pairing that passes the double verification is triggered to take the material. The material-nozzle pairing that fails the verification is kept in the waiting queue. When all valid materials pass the verification, the corresponding nozzles are controlled to complete the material taking and mounting in sequence. If there is no progress for several consecutive rounds, the circuit breaker mechanism is triggered to terminate the process.

[0056] According to the SMT placement control method provided in this application embodiment, task allocation is performed based on the effective material position and the physical layout of the nozzles before material picking. The feasibility of both the picking stroke and the placement stroke is simultaneously verified for each assigned task to ensure that the picking action is triggered only when the nozzle can completely execute the picking-placement process. When an over-limit situation occurs due to stroke limitation, the matching strategy between the remaining material and the available nozzles is dynamically adjusted according to the distribution direction of the over-limit nozzles. Task relay is achieved through multiple rounds of iterative allocation. Thus, without changing the equipment hardware structure, the problem of invalid picking, material waste, and equipment downtime caused by the inability of material on one side feeder to be picked up by the nozzle on the other side or the placement position exceeding the limit is avoided. This improves the placement success rate, material utilization rate, and production continuity of horizontal multi-nozzle SMT placement equipment in tray-type or wafer feeding scenarios. It can meet the needs of high-efficiency placement of large-size PCBs, edge components, or full-wafer components, and takes into account the production goals of high efficiency, zero waste, and high yield.

[0057] In some embodiments, obtaining the validity information of the material to be mounted includes: The visual recognition module of the SMT placement equipment detects the materials in the feeder or reads the pre-stored MAP data to determine whether the materials to be placed are good products. The material to be mounted that is determined to be good is taken as the effective material, and the material X coordinate position of the effective material in the feeder and the target mounting X coordinate position of the effective material on the PCB are obtained. The material position is determined based on the material's X-coordinate position and the target mounting X-coordinate position.

[0058] Understandably, the vision recognition module is an image acquisition and processing unit integrated in SMT placement equipment, including an industrial camera, ring light source, lens, and image analysis software, used for imaging and status recognition of materials.

[0059] MAP data is a material location yield mapping file pre-stored in the equipment's memory. It records whether each feeding position is a good product, a bad product, or an empty position, and is generated by the previous process or manual inspection.

[0060] The determination of a material as a suitable mounting material is a logical process of judging whether a material is complete, undamaged, unoffset, unflipped, and meets the conditions for normal picking and mounting.

[0061] The material X-coordinate position is the lateral physical position of the material in the feeder, based on the equipment's global coordinate system, and is measured in millimeters. It is used to characterize the lateral target position when picking up the material.

[0062] The target placement X-coordinate position is the horizontal coordinate of the material corresponding to the pad in the PCB design file. It is based on the device's global coordinate system and is used to characterize the horizontal target position during placement.

[0063] The material location is represented by a composite data structure, which includes the material's X-coordinate for picking up in the feeder and its X-coordinate for mounting on the PCB, to fully describe the spatial context of the material throughout the entire mounting process.

[0064] In actual operation, after the SMT placement equipment starts the placement task, it controls the vision recognition module to acquire high-resolution images of the left and right feeder areas. By comparing the current image with the standard material template, it identifies whether there are any abnormalities such as defects, offsets exceeding the threshold, flips, or missing parts. Alternatively, it directly reads the pre-stored MAP data from the equipment memory. The MAP data records the material status of each feeder position in tabular form. It then performs a placeable good product determination on the material to be placed and outputs a good product mark for each material.

[0065] All materials that are deemed good and ready for mounting are marked as valid materials. The actual material X-coordinate position of the material in the feeder is extracted from the positioning result returned by the vision recognition module, or its theoretical material supply X-coordinate is read from the metadata field of the MAP diagram. The pad position corresponding to the material is queried from the current PCB mounting program (Job File) to obtain its target mounting X-coordinate position. Both coordinates are unified based on the global coordinate system of the equipment.

[0066] The acquired material X-coordinate position and the target mounting X-coordinate position are packaged together to form a material position object containing "picking position" and "mounting position". This object is associated with the corresponding valid material ID and stored in the scheduling queue for retrieval.

[0067] In this embodiment, by integrating real-time visual inspection and pre-stored MAP data, dual verification of material status is achieved, avoiding misjudgment due to the failure of a single detection method, improving system operating efficiency, and ensuring that only good products that can be mounted enter the subsequent scheduling process, preventing nozzle contamination, equipment downtime or waste of high-value materials caused by invalid material picking, and improving overall mounting reliability and automation continuity.

[0068] In some embodiments, establishing a distribution relationship between the effective material and the suction nozzles based on the material position of the effective material in the feeder and the physical layout of each of the nozzles includes: Based on the X-coordinate position of the effective material in the feeder, the unattached effective materials are sorted from smallest to largest. Arrange all the nozzles on the mounting head from left to right according to their installation position; The sorted effective materials are matched one-to-one with the sorted suction nozzles in sequence to construct the material-suction nozzle pairing and obtain the allocation relationship.

[0069] It is understandable that unmounted valid materials are the collection of valid materials that have not yet been mounted and are still in a pending state.

[0070] The installation position is the physical fixed point of the nozzle on the crossbeam of the mounting head, which has a unique and immutable X coordinate.

[0071] In actual execution, it iterates through all currently unmounted valid materials, reads the X-coordinate position of each material in the feeder, and then calls a sorting algorithm (such as quicksort) to arrange these materials in ascending order according to their X-coordinate values, generating an ordered material queue.

[0072] Read the X coordinates of all nozzles on the placement head in the device coordinate system; since the nozzles are arranged in a rigid straight line, their X coordinates naturally reflect the physical order from left to right; based on this, sort the nozzles according to their X coordinates from smallest to largest to generate a nozzle sequence.

[0073] The first valid material after sorting is assigned to the first nozzle after sorting, the second material is assigned to the second nozzle, and so on. If the number of materials exceeds the number of nozzles, the excess materials are kept in the queue to wait for the next round. All successful pairings are encapsulated as allocation relationship objects for use by the verification module.

[0074] In this embodiment, by placing the materials supplied from the left at the front of the queue, it is easier to pair them with the left nozzles first, reducing the need for cross-zone material retrieval and improving the spatial rationality and scheduling efficiency of the initial allocation; establishing a nozzle sequence consistent with the material sorting direction provides a structural basis for subsequent one-to-one pairing, ensuring spatial alignment, avoiding misaligned allocation, maximizing the use of the spatial correspondence between the nozzles and feeders, reducing the probability of first-round stroke conflicts, and improving placement efficiency and success rate.

[0075] In some embodiments, the stroke limit verification for each material-nose pair in the allocation relationship includes: In the material-nozzle pairing, the nozzle X-coordinate position in the equipment coordinate system and the effective material X-coordinate position in the feeder are determined. If the X-coordinate position of the material is within the allowable X-range of the feeder, and the deviation between the X-coordinate position of the material and the corresponding X-coordinate position of the nozzle does not exceed the material handling tolerance, the material handling stroke limit verification is deemed to have passed. If the target placement X coordinate of the effective material on the PCB is within the placement allowable X range of the feeder, the placement stroke limit verification is deemed to have passed. If both the material pick-up stroke limit and the mounting stroke limit are verified, the material-nose pairing is confirmed to have passed the stroke limit verification.

[0076] It is understandable that the equipment coordinate system is a globally unified Cartesian coordinate system for SMT placement equipment, with the origin located at the mechanical zero point of the equipment.

[0077] The X-coordinate position of the nozzle is the fixed lateral coordinate of the nozzle in the device coordinate system, which is determined by its installation position.

[0078] The allowable X range for material handling is the X coordinate interval within the feeder area set by the equipment that allows the nozzle to perform material handling operations. It is defined by the maximum and minimum X coordinates of the material handling operation.

[0079] The material handling tolerance is the maximum allowable offset in the X direction when the nozzle handles material. It is used to characterize the fact that the nozzle has no independent X-direction movement capability. For example, it is set to 0.1 mm.

[0080] The material handling travel limit verification is a feasibility check to determine whether the nozzle can physically reach the feeder's material handling position.

[0081] The X-range allowed for placement is the X-boundary of the PCB placement area that the placement head can move to as a whole, defined by the maximum and minimum X coordinates of the PCB placement.

[0082] Mounting travel limit verification is a feasibility check to determine whether the nozzle can reach the target position on the PCB.

[0083] In actual execution, for the current material-nozzle pairing, the nozzle X-coordinate position of the nozzle is queried from the device hardware configuration table, and the material X-coordinate position in the feeder is extracted from the position attribute of the material.

[0084] Determine if the material X-coordinate satisfies the condition that the minimum X-coordinate of the material operation is less than or equal to the material X-coordinate and the maximum X-coordinate of the material operation. At the same time, calculate that the difference between the material X-coordinate and the nozzle X-coordinate is less than or equal to the material handling tolerance. If both conditions are met, then the material handling stroke limit verification is considered successful.

[0085] Read the target placement X coordinate of the valid material on the PCB; determine whether it meets the requirement that the minimum X coordinate of PCB placement ≤ the target placement X coordinate ≤ the maximum X coordinate of PCB placement; if it meets the requirement, the placement stroke limit verification is confirmed to be passed.

[0086] The execution logic uses an AND condition: the material-nozzle pair is marked as "stroke limit verification passed" only if both the material pick-up stroke limit verification and the mounting stroke limit verification pass; otherwise, it is marked as "exceeding the limit".

[0087] For example, in the material handling stroke limit verification, the material handling feasibility function is: in, For the sucker For materials The result of the material extraction feasibility assessment is given, with a value of 1 indicating that the material can be extracted and 0 indicating that the material cannot be extracted. For the j-th nozzle on the mounting head; This refers to the k-th material to be processed. For materials The X-coordinate position in the feeder; The minimum X-coordinate (left boundary) of the feeder area that the equipment is allowed to pick up material from. The maximum X-coordinate (right boundary) of the feeder area that the equipment is allowed to pick up materials from. For the sucker The fixed X-coordinate in the device coordinate system; This represents the distance between the material and the nozzle in the X direction. This is the maximum allowable offset for the suction nozzle to pick up material. Because the nozzle position is fixed, it cannot move laterally. ; This is an indicator function that outputs 1 if the condition is true, and 0 otherwise.

[0088] In the placement stroke limit verification, the placement feasibility function is: in, For the sucker For materials The result of the mounting feasibility assessment is as follows: 1 indicates that it can be mounted, and 0 indicates that it exceeds the limit and cannot be mounted. For materials The target mounting X coordinate on the PCB; The minimum X-coordinate (left boundary) of the placement area that the device's placement head can reach; The maximum X-coordinate (right boundary) of the placement area that the device's placement head can reach.

[0089] In this embodiment, by verifying based on real physical coordinates, misjudgments caused by coordinate errors are avoided. By forcibly implementing dual feasibility pre-verification, it is ensured that the nozzle can physically reach the feeder pick-up position, preventing pick-up failure, nozzle collision, or material drop due to exceeding the boundary or excessive offset. This ensures equipment safety and placement reliability, and ensures that the nozzle can move to the target position on the PCB after picking up the material to complete the placement. This avoids the waste of high-value materials that cannot be placed after picking up the material, fundamentally eliminating invalid pick-up, and especially protecting non-renewable materials such as high-cost wafer chips, thereby improving material utilization and process safety.

[0090] In some embodiments, matching the unmounted usable material with the available nozzles according to the distribution direction of the over-limit nozzles on the placement head includes: Obtain the out-of-limit suction nozzles that failed the travel limit verification, and construct an out-of-limit suction nozzle set; The coordinate difference between the X-coordinate of each nozzle in the set of oversized nozzles and the X-coordinate of the center of the mounting head is used to calculate the algebraic sum of the coordinate differences; When the algebraic sum is less than zero, the over-limit nozzle is left over-limit. The unmounted effective materials are sorted from smallest to largest according to the X coordinate and paired with the available nozzles located on the right side of the mounting head in turn. If the algebraic sum is greater than zero, the over-limit nozzle is right over-limit. The unmounted effective materials are sorted from largest to smallest according to the X coordinate and paired with the available nozzles located on the left side of the mounting head in turn. Wherein, the X-coordinate of the placement head center is the midpoint of the X-coordinates of all nozzles, and the available nozzles are those that have not been marked as exceeding the limit and have not yet been placed in the current round.

[0091] Understandably, the over-limit nozzle set is a data structure that is a collection of all over-limit nozzle IDs or indices.

[0092] The X-coordinate of the placement head center is the midpoint of the X-coordinates of all nozzles, used to characterize the geometric center of the placement head.

[0093] The coordinate difference is the algebraic deviation between the X coordinate of a single nozzle and the X coordinate of the center, and the algebraic sum is the signed sum of all coordinate differences.

[0094] Left over-limit refers to a situation where most of the over-limit nozzles are concentrated on the left side of the placement head.

[0095] Right over-limit refers to a situation where most of the over-limit nozzles are concentrated on the right side of the placement head.

[0096] In actual execution, all material-nose pairs in the current allocation relationship are traversed, and nozzles with a verification status of "failed" are selected and their numbers are added to the over-limit nozzle set. First, the X coordinate of the center of the mounting head is calculated, and then for each over-limit nozzle, the coordinate difference is calculated. All coordinate differences are added together to obtain the algebraic sum S.

[0097] If the algebraic sum S < 0, it is determined to be left out of bounds; the unattached valid materials are arranged in ascending order according to their X coordinates in the feeder.

[0098] If the algebraic sum S>0, it is determined to be a right overlimit; the unmounted valid materials are arranged in descending order of X coordinate; and then assigned to the available nozzles located on the left side of the mounting head in sequence to form a new pair.

[0099] For example, the criterion for exceeding the limit direction is: in, The criterion value for the dominant direction of the overlimit; This refers to the collection of nozzles that have exceeded the current material handling or mounting limits. Let J be the X-coordinate of the over-limit suction nozzle j; The X-coordinate of the entire placement head (the midpoint of the X-coordinates of all nozzles); This is the sum of the offsets of all over-limit nozzles relative to the center position; It is a sign function, and the result is positive, negative, or zero; in the decision rule, if This indicates that most of the oversized nozzles are located on the left side of the center, and is judged as left oversized; if This indicates that most of the oversized nozzles are located on the right side of the center, and is judged as right oversized.

[0100] In this embodiment, the overall offset trend of the over-limit suction nozzles is reflected more accurately than simply counting the left and right quantities by algebraically and quantitatively. This aligns the material sorting direction with the available suction nozzle area on the right, making it easier to transfer materials that are difficult to pick up on the left to the suction nozzles on the right for processing, thus improving the success rate of redistribution. It also realizes intelligent load migration based on the center of gravity offset, using redundant suction nozzles on the opposite side to complete the task, thereby improving the mounting coverage and equipment utilization rate.

[0101] In some embodiments, the step of repeatedly performing verification on the updated allocation relationship includes: If the material-nozzle pairing in the updated allocation relationship passes the stroke limit verification, control the corresponding nozzle to perform material picking and complete the mounting. If the material-nose pairing fails the stroke limit verification, the valid material is retained in the set of unattached valid materials to participate in the construction of the allocation relationship in the next round. If the number of material-nozzle pairs that pass the verification does not increase in two consecutive rounds, the verification process is terminated and the set of valid unattached materials is output.

[0102] It is understandable that the process of picking up materials involves the sequence of actions: the nozzle descends, the vacuum is activated, and the material is picked up.

[0103] The complete placement process involves a sequence of actions: moving the device to the target position on the PCB, lowering it, shutting off the vacuum, and releasing the material.

[0104] The set of valid unmounted materials is a dynamically maintained queue of materials to be processed.

[0105] In actual execution, for the pairs that pass the verification in the updated allocation relationship, a pick-up instruction is sent to the corresponding nozzle; after the nozzle completes the pick-up, the placement head moves to the target position on the PCB, performs the placement action, and marks the material as "placed".

[0106] For pairs that fail verification, the material is not discarded, but is retained in the set of valid unmounted materials for rescheduling during the next round of allocation relationship construction.

[0107] Record the number of pairs that pass the verification in each round; if the number of successful pairs in the nth round is less than or equal to the number of successful pairs in the (n-1)th round in two adjacent iterations, it is determined that the scheduling has converged or fallen into an infinite loop. The operation of automatically jumping out of the loop is terminated, the verification process is terminated, and the remaining set of valid unmounted materials is output to the operation interface for manual intervention.

[0108] In this embodiment, by performing physical operations only on feasible tasks, the effectiveness of actions is ensured, ineffective actions are avoided from consuming production capacity or damaging materials, all materials are guaranteed to have the opportunity to be redistributed, omissions due to single failures are avoided, the overall placement completion rate is improved, the production line is prevented from stopping due to infinite algorithm iterations, the production cycle is guaranteed to be controllable, and abnormal material traceability is provided to improve equipment robustness and operation and maintenance efficiency.

[0109] In some embodiments, controlling the suction nozzle to perform a mounting action by picking up the effective material includes: If the material-nozzle pairing passes both the material pick-up stroke limit and the placement stroke limit verification, a pick-up command is sent to the nozzle. Once the nozzle has finished picking up the material, it moves to the target position on the PCB to perform placement.

[0110] Understandably, the material handling command is a combination of control signals that control the opening of the suction nozzle vacuum valve and the downward movement of the Z-axis, used to initiate the suction action.

[0111] The target location is the design placement coordinate of the material on the PCB, including X, Y, Z and angle information.

[0112] Material handling completion is the state where the suction nozzle successfully picks up the material and this is confirmed by the vacuum sensor.

[0113] In actual execution, only after confirming that the material-nozzle pairing has passed the dual verification of material picking and placement strokes, is a material picking command sent to the solenoid valve of the nozzle through the I / O interface to start the vacuum suction process.

[0114] After the nozzle picks up the material, the placement head moves to the target X / Y position of the material on the PCB, the Z-axis descends to the placement height, the vacuum is turned off, and the material is released to complete the placement.

[0115] In this embodiment, the material picking action is guaranteed by the placement process, which eliminates the waste of materials that cannot be placed after picking, and achieves a seamless connection from material picking to placement, ensuring process integrity and placement accuracy, and improving overall production efficiency and yield.

[0116] This application also provides an SMT placement device, including a controller and left and right distributed feeders respectively connected to the controller, and a placement head having multiple nozzles arranged laterally. The controller is used to execute the SMT placement control method as described in the above embodiments.

[0117] In some embodiments, the feeder is a tray feeder or a wafer feeder, respectively located on the left and right sides of the SMT placement equipment. When the feeding area of ​​the feeder on either side exceeds the mechanical travel limit of the nozzle on the opposite side, the left nozzle cannot pick up the effective material from the right feeder, and the right nozzle cannot pick up the effective material from the left feeder.

[0118] The SMT placement control method provided in this application can be executed by an SMT placement control device. This application uses an SMT placement control device executing the SMT placement control method as an example to illustrate the SMT placement control device provided in this application.

[0119] This application also provides an SMT placement control device.

[0120] like Figure 2 As shown, the SMT placement control device includes: The acquisition module 210 is used to acquire the validity information of the material to be mounted and to determine the valid material; The first processing module 220 is used to construct an allocation relationship between the effective material and the suction nozzle based on the material position of the effective material in the feeder and the physical layout of each suction nozzle; The second processing module 230 is used to perform stroke limit verification on each material-nozzle pair in the allocation relationship, the stroke limit including material picking stroke limit and mounting stroke limit; The third processing module 240 is used to determine the over-limit nozzle when the stroke limit verification fails, and to match the unplaced valid material with the available nozzles according to the distribution direction of the over-limit nozzles on the placement head, so as to update the allocation relationship, and the over-limit nozzle cannot complete the material picking or placement. The fourth processing module 250 is used to repeatedly perform verification on the updated allocation relationship until all the material-nozzle pairs pass the stroke limit verification, and control the nozzles to perform the mounting action to pick up the effective material.

[0121] According to the SMT placement control device provided in this application embodiment, task allocation is performed based on the effective material position and the physical layout of the nozzles before material picking. The feasibility of both the picking stroke and the placement stroke is simultaneously verified for each allocated task. This ensures that the picking action is triggered only when the nozzle can completely execute the picking-placement process. When an over-limit situation occurs due to stroke limitations, the matching strategy between the remaining material and the available nozzles is dynamically adjusted according to the distribution direction of the over-limit nozzles. Task relay is achieved through multiple rounds of iterative allocation. Thus, without changing the equipment hardware structure, the problem of invalid picking, material waste, and equipment downtime caused by the inability of material on one side feeder to be picked up by the nozzle on the other side or the placement position exceeding the limit is avoided. This improves the placement success rate, material utilization rate, and production continuity of horizontal multi-nozzle SMT placement equipment in tray-type or wafer-feeding scenarios. It can meet the needs of high-efficiency placement of large-size PCBs, edge components, or full-wafer components, while taking into account the production goals of high efficiency, zero waste, and high yield.

[0122] The SMT placement control device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a laptop computer, a mobile internet device (MID), an ultra-mobile personal computer (UMPC), a server, network attached storage (NAS), a personal computer (PC), etc., and this application embodiment does not specifically limit the scope.

[0123] The SMT placement control device in this application embodiment can be a device with an operating system. This operating system can be Android, iOS, or other possible operating systems; this application embodiment does not specifically limit it.

[0124] The SMT placement control device provided in this application embodiment can realize the various processes implemented as described in the SMT placement control method embodiment above. To avoid repetition, it will not be described again here.

[0125] In some embodiments, such as Figure 3 As shown, this application embodiment also provides an electronic device 300, including a processor 301, a memory 302, and a computer program stored in the memory 302 and executable on the processor 301. When the program is executed by the processor 301, it implements the various processes of the above-described SMT placement control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0126] It should be noted that the electronic devices in the embodiments of this application include the mobile electronic devices and non-mobile electronic devices described above.

[0127] This application also provides a non-transitory computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described SMT placement control method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0128] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0129] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described SMT placement control method.

[0130] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0131] This application embodiment also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described SMT placement control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0132] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0133] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0134] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the SMT placement control method of the various embodiments of this application.

[0135] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0136] In the description of this application, "multiple" means two or more.

[0137] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0138] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0139] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for controlling SMT placement, characterized in that, The method is applied to SMT placement equipment, which includes left and right distributed feeders and a placement head with horizontally arranged multiple nozzles. Obtain the validity information of the materials to be mounted and determine the valid materials; Based on the material position of the effective material in the feeder and the physical layout of each of the nozzles, a distribution relationship is established between the effective material and the nozzles; For each material-nose pairing in the allocation relationship, a stroke limit check is performed, which includes material pick-up stroke limit and placement stroke limit; If the travel limit verification fails, an over-limit nozzle is identified. Based on the distribution direction of the over-limit nozzle on the placement head, the unplaced valid material and the available nozzle are matched to update the allocation relationship. The over-limit nozzle cannot complete the material picking or placement. The updated allocation relationship is repeatedly validated until all material-nose pairs pass the stroke limit validation, and the nozzles are controlled to perform the mounting action by picking up the valid material.

2. The SMT placement control method according to claim 1, characterized in that, The acquisition of validity information for the material to be mounted includes: The visual recognition module of the SMT placement equipment detects the materials in the feeder or reads the pre-stored MAP data to determine whether the materials to be placed are good products. The material to be mounted that is determined to be good is taken as the effective material, and the material X coordinate position of the effective material in the feeder and the target mounting X coordinate position of the effective material on the PCB are obtained. The material position is determined based on the material's X-coordinate position and the target mounting X-coordinate position.

3. The SMT placement control method according to claim 1, characterized in that, The process of establishing a distribution relationship between the effective material and the suction nozzles based on the material position of the effective material in the feeder and the physical layout of each nozzle includes: Based on the X-coordinate position of the effective material in the feeder, the unattached effective materials are sorted from smallest to largest. Arrange all the nozzles on the mounting head from left to right according to their installation position; The sorted effective materials are matched one-to-one with the sorted suction nozzles in sequence to construct the material-suction nozzle pairing and obtain the allocation relationship.

4. The SMT placement control method according to claim 1, characterized in that, The stroke limit verification for each material-nose pairing in the allocation relationship includes: In the material-nozzle pairing, the nozzle X-coordinate position in the equipment coordinate system and the effective material X-coordinate position in the feeder are determined. If the X-coordinate position of the material is within the allowable X-range of the feeder, and the deviation between the X-coordinate position of the material and the corresponding X-coordinate position of the nozzle does not exceed the material handling tolerance, the material handling stroke limit verification is deemed to have passed. If the target placement X coordinate of the effective material on the PCB is within the placement allowable X range of the feeder, the placement stroke limit verification is deemed to have passed. If both the material pick-up stroke limit and the mounting stroke limit are verified, the material-nose pairing is confirmed to have passed the stroke limit verification.

5. The SMT placement control method according to claim 1, characterized in that, The step of matching unmounted effective materials with available nozzles based on the distribution direction of the over-limit nozzles on the placement head includes: Obtain the out-of-limit suction nozzles that failed the travel limit verification, and construct an out-of-limit suction nozzle set; The coordinate difference between the X-coordinate of each nozzle in the set of oversized nozzles and the X-coordinate of the center of the mounting head is used to calculate the algebraic sum of the coordinate differences; When the algebraic sum is less than zero, the over-limit nozzle is left over-limit. The unmounted effective materials are sorted from smallest to largest according to the X coordinate and paired with the available nozzles located on the right side of the mounting head in turn. If the algebraic sum is greater than zero, the over-limit nozzle is right over-limit. The unmounted effective materials are sorted from largest to smallest according to the X coordinate and paired with the available nozzles located on the left side of the mounting head in turn. Wherein, the X-coordinate of the placement head center is the midpoint of the X-coordinates of all nozzles, and the available nozzles are those that have not been marked as exceeding the limit and have not yet been placed in the current round.

6. The SMT placement control method according to claim 1, characterized in that, The step of repeatedly performing verification on the updated allocation relationship includes: If the material-nozzle pairing in the updated allocation relationship passes the stroke limit verification, control the corresponding nozzle to perform material picking and complete the mounting. If the material-nozzle pairing fails the stroke limit verification, the valid material is retained in the set of unattached valid materials to participate in the construction of the allocation relationship in the next round. If the number of material-nozzle pairs that pass the verification does not increase in two consecutive rounds, the verification process is terminated and the set of valid unattached materials is output.

7. The SMT placement control method according to claim 1, characterized in that, The control of the suction nozzle to perform the mounting action by picking up the effective material includes: If the material-nozzle pairing passes both the material pick-up stroke limit and the placement stroke limit verification, a pick-up command is sent to the nozzle. Once the nozzle has finished picking up the material, it moves to the target position on the PCB to perform placement.

8. An SMT placement device, characterized in that, The device includes a controller and left and right distributed feeders respectively connected to the controller, and a placement head having a horizontally arranged multi-nozzle assembly. The controller is used to perform the SMT placement control method as described in any one of claims 1-7.

9. The SMT placement equipment according to claim 8, characterized in that, The feeder is a tray feeder or a wafer feeder, which is respectively located on the left and right sides of the SMT placement equipment. When the feeding area of ​​the feeder on either side exceeds the mechanical travel limit of the nozzle on the opposite side, the left nozzle cannot pick up the effective material from the right feeder, and the right nozzle cannot pick up the effective material from the left feeder.

10. An SMT placement control device, characterized in that, include: The acquisition module is used to obtain the validity information of the materials to be mounted and to determine the valid materials. The first processing module is used to establish an allocation relationship between the effective material and the suction nozzle based on the material position of the effective material in the feeder and the physical layout of each suction nozzle; The second processing module is used to perform stroke limit verification on each material-nozzle pair in the allocation relationship, the stroke limit including material picking stroke limit and mounting stroke limit; The third processing module is used to determine the over-limit nozzle when the stroke limit verification fails, and to match the unplaced valid material with the available nozzles according to the distribution direction of the over-limit nozzles on the placement head, so as to update the allocation relationship. The over-limit nozzle cannot complete the material picking or placement. The fourth processing module is used to repeatedly perform verification on the updated allocation relationship until all the material-nozzle pairs pass the stroke limit verification, and control the nozzles to perform the mounting action to pick up the effective material.

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