Manufacturing method of solar photovoltaic photoelectric glass

Abstract

The invention discloses a manufacturing method of solar photovoltaic photoelectric glass, which comprises the following steps of: clamping a gluing sheet and assembling a wiring end, and firmly adhering a photoelectric glass LED (Light Emitting Diode) circuit and a light-transmitting laminated layer by the clamping gluing sheet; and the assembly wiring terminal is used for connecting an external photoelectric electric control display system and photovoltaic inversion energy storage equipment. Different from single photovoltaic glass or photoelectric display glass, the photoelectric glass LED circuit is combined with the light-transmitting laminated layer, light rays transmit the light-transmitting photoelectric glass LED circuit and irradiate the light-transmitting laminated layer, the light-transmitting laminated layer utilizes light energy to generate electricity, and the electric energy is timely transmitted and stored through the second plug cord. And the photoelectric glass LED circuit provides electric energy through the first plug cord to emit light, so that various images are presented, the user requirements are met, and the application scene of the solar photovoltaic photoelectric glass is expanded.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic display technology, and more particularly to a method for manufacturing solar photovoltaic glass. Background Technology

[0002] With the deep integration of building energy conservation and intelligent display technologies, traditional architectural glass, which only possesses basic functions such as lighting and heat insulation, can no longer meet the complex needs of modern buildings for "green energy utilization + intelligent information display." Meanwhile, single-function photovoltaic glass or optoelectronic display glass, due to their functional limitations, is difficult to adapt to diverse scenarios. The market needs an integrated glass product that combines high transparency, efficient power generation, and stable display functions. Summary of the Invention

[0003] In view of the above problems, this application provides a method for manufacturing solar photovoltaic glass.

[0004] To achieve the above objectives, the applicant provides a method for manufacturing solar photovoltaic glass, comprising the following steps: Laminated laminate: A light-transmitting laminate is bonded to the anti-reflective glass. The light-transmitting laminate includes multiple light-transmitting cadmium telluride glass lattice circuits. The multiple light-transmitting cadmium telluride glass lattice circuits are stacked one on top of the other, and adjacent light-transmitting cadmium telluride glass lattice circuits are bonded together. The light transmittance of the light-transmitting cadmium telluride glass in each light-transmitting cadmium telluride glass lattice circuit decreases from top to bottom. Photoelectric glass LED circuits are bonded to the light-transmitting laminate, and ultra-clear tempered glass is bonded to the photoelectric glass LED circuits. Assemble the wiring terminals: Connect the first PCB circuit board to the exposed FPC flexible circuit board of the photoelectric glass LED circuit, solder the first plug wire to the first PCB circuit board, solder the exposed FPC flexible circuit boards of each light-transmitting cadmium telluride glass lattice circuit to their respective second PCB circuit boards, and solder the second PCB circuit board that is soldered to the exposed FPC flexible circuit board of the light-transmitting cadmium telluride glass lattice circuit located closest to the anti-reflective glass in the light-transmitting stack to the second plug wire.

[0005] Furthermore, in the laminated sheet, the light-transmitting layer is bonded to the anti-reflective glass through the following steps: A layer of film is laid on the upper surface of the anti-reflective glass; A light-transmitting cadmium telluride glass lattice circuit, the bottom layer of the light-transmitting stack, is laid on the upper surface of the film on the anti-reflective glass. Then, a layer of film is laid on its upper surface, and another layer of light-transmitting cadmium telluride glass lattice circuit is laid on the film on the bottom layer of the light-transmitting cadmium telluride glass lattice circuit. The above operation is repeated until all the light-transmitting cadmium telluride glass lattice circuits are stacked.

[0006] Furthermore, the light-transmitting stack includes three light-transmitting cadmium telluride glass lattice circuits. From top to bottom, the light transmittance of the light-transmitting cadmium telluride glass in the first light-transmitting cadmium telluride glass lattice circuit is 70%, the light transmittance of the light-transmitting cadmium telluride glass in the second light-transmitting cadmium telluride glass lattice circuit is 50%, and the light transmittance of the light-transmitting cadmium telluride glass in the third light-transmitting cadmium telluride glass lattice circuit is 30%.

[0007] Furthermore, in the laminated sheet, a light-transmitting layer is bonded to the anti-reflective glass through the following steps: a photoelectric glass LED circuit is bonded to the light-transmitting layer; and ultra-clear tempered glass is bonded to the photoelectric glass LED circuit. A layer of film is laid on the upper surface of the anti-reflective glass; A light-transmitting layer is laid on the upper surface of the film located on the anti-reflective glass; A film is laid on the upper surface of the light-transmitting laminate; Photoelectric glass LED circuitry is laid on the upper surface of the film located on the light-transmitting laminate; A film is laid on the LED circuit of the optoelectronic glass; Ultra-white tempered glass is laid on the upper surface of the film located on the LED circuit of the optoelectronic glass; The anti-reflective glass, light-transmitting laminate, photoelectric glass LED circuit, and ultra-clear tempered glass are subjected to vacuuming, high temperature, and high pressure treatment, which causes the anti-reflective glass, light-transmitting laminate, photoelectric glass LED circuit, and ultra-clear tempered glass to adhere to each other.

[0008] Furthermore, the film is PVB film; High-temperature and high-pressure treatment is achieved through a pressure cooker, with the temperature controlled at 120-130℃, the heating rate controlled at 5℃ / min, the pressure controlled at 1.0-1.5MPa, and the holding time controlled at 5-7h.

[0009] Furthermore, after assembling the terminals, the following steps are also included: The display glass is composed of anti-reflective glass, light-transmitting laminate, photoelectric glass, LED circuit, and ultra-white tempered glass. Multiple display glass pieces are installed into the slots of the profile frame and fixed with structural adhesive. Install the photoelectric control display system into the profile frame and connect the photoelectric control display system to the first plug wire of each display glass.

[0010] Furthermore, the assembly of the terminals also includes the following steps: Protect the solder joints after welding with insulating pads; The insulating pad, the first PCB circuit board, and the second PCB circuit board are secured to the base of the waterproof terminal block with screws. Attach the top cover and side cover to the base and secure them with screws; Apply potting compound to the base, top cover, and side cover.

[0011] Furthermore, the base of the waterproof terminal is located on the side of the anti-reflective glass away from the light-transmitting layer.

[0012] Furthermore, the anti-reflective glass is an anti-reflective LOW-E glass, with a visible light reflectivity of less than 5%.

[0013] Furthermore, the substrate for the optoelectronic glass LED circuit is ultra-white glass.

[0014] Unlike existing technologies, the above technical solution has the following advantages: Unlike a single photovoltaic glass or optoelectronic display glass, this invention combines the optoelectronic glass LED circuit with a light-transmitting layer. Light passes through the optoelectronic glass LED circuit and illuminates the light-transmitting layer, which then uses the light energy to generate electricity and transmits and stores the electrical energy in a timely manner through a second connector. The optoelectronic glass LED circuit emits light by being powered by the first connector to display various images, meet user needs, and improve the application scenarios of this solar photovoltaic optoelectronic glass.

[0015] The above description of the invention is merely an overview of the technical solution of the present invention. In order to enable those skilled in the art to better understand the technical solution of the present invention and to implement it based on the description and drawings, and to make the above-mentioned objectives and other objectives, features and advantages of the present invention easier to understand, the following description is provided in conjunction with the specific embodiments and drawings of the present invention. Attached Figure Description

[0016] The accompanying drawings are only used to illustrate the principles, implementation methods, applications, features, and effects of specific embodiments of the present invention and other related contents, and should not be considered as limitations on the present invention.

[0017] In the accompanying drawings of the instruction manual: Figure 1 This is a flowchart of the present invention; Figure 2 This is a front view of the solar photovoltaic glass in this invention; Figure 3 This is a back view of the solar photovoltaic glass in this invention; Figure 4 This is an elevation view of the solar photovoltaic glass in this invention; Figure 5 This is a side view of the solar photovoltaic glass in this invention; Figure 6 This is a schematic diagram of the solar photovoltaic glass in this invention; Figure 7 This is a schematic diagram of the internal structure of the waterproof connector described in this embodiment; Figure 8 This is a schematic diagram showing the first plug wire and the second plug wire being installed at the waterproof terminal in this embodiment; Figure 9 This is a schematic diagram of the insulating pad in this embodiment; Figure 10 This is a front view of the first PCB circuit board in this embodiment; Figure 11 This is a back view of the first PCB circuit board in this embodiment; Figure 12 This is a front view of the second PCB circuit board in this embodiment; Figure 13 This is a back view of the second PCB circuit board in this embodiment; Figure 14 A schematic diagram of the lattice circuit scheme for the third transparent cadmium telluride glass. Figure 15 A schematic diagram of the second transparent cadmium telluride glass lattice circuit scheme; Figure 16 This is a schematic diagram of the first transparent cadmium telluride glass lattice circuit scheme; Figure 17 A schematic diagram showing the arrangement of LED beads on an LED circuit in optoelectronic glass; Figure 18 This is a schematic diagram of the optoelectronic glass LED circuit scheme in this invention; Figure 19 This is a schematic diagram of the circuit assembly scheme for solar photovoltaic glass in this invention; Figure 20 This is a topological diagram of the solar photovoltaic glass in this invention; Figure 21 This is a flowchart of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Ultra-clear tempered glass; 2. Optoelectronic glass LED circuit; 3. Transparent laminate; 31. First transparent cadmium telluride glass lattice circuit; 32. Second transparent cadmium telluride glass lattice circuit; 33. Third transparent cadmium telluride glass lattice circuit; 4. Anti-reflective glass; 5. Film; 6. Waterproof terminal; 61. First plug wire; 62. Second plug wire; 63. First PCB circuit board; 64. Second PCB circuit board; 65. Insulating pad. Detailed Implementation

[0019] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this invention in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this invention and are therefore intended only as examples, not as limiting the scope of protection of this invention.

[0020] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this invention, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0021] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0022] In the description of this invention, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0023] In this invention, terms such as “first” and “second” are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0024] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0025] In this invention, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this invention, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0026] In the description of the embodiments of the present invention, the spatial related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of the present invention or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0027] Unless otherwise explicitly stated or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this invention, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral arrangement; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this invention according to the specific circumstances.

[0028] Please see Figures 1 to 21 This embodiment provides a method for manufacturing solar photovoltaic glass, including the following steps: Laminated laminate S106: A light-transmitting laminate 3 is bonded to the anti-reflective glass 4. The light-transmitting laminate 3 includes multiple light-transmitting cadmium telluride glass lattice circuits. The multiple light-transmitting cadmium telluride glass lattice circuits are stacked one on top of the other, and adjacent light-transmitting cadmium telluride glass lattice circuits are bonded together. The light transmittance of the light-transmitting cadmium telluride glass in each light-transmitting cadmium telluride glass lattice circuit decreases from top to bottom. A photoelectric glass LED circuit 2 is bonded to the light-transmitting laminate 3, and an ultra-white tempered glass 1 is bonded to the photoelectric glass LED circuit 2. Assemble the wiring terminals S107: Connect the first PCB circuit board 63 to the exposed FPC flexible circuit board a of the photoelectric glass LED circuit 2, solder the first plug wire 61 to the first PCB circuit board 63, solder the exposed FPC flexible circuit boards b of each light-transmitting cadmium telluride glass lattice circuit to their respective second PCB circuit boards 64, and solder the second PCB circuit board 64 that is soldered to the exposed FPC flexible circuit board b of the light-transmitting cadmium telluride glass lattice circuit located closest to the anti-reflective glass 4 in the light-transmitting stack 3 to the second plug wire 62.

[0029] Anti-reflective glass 4 is positioned on the side away from the user and features low reflectivity and high light transmittance. When light shines from the anti-reflective glass 4, the light can pass through it effectively and onto the light-transmitting stack 3, thereby reducing light loss during propagation. The light-transmitting stack 3 receives external light and converts light energy into electrical energy. The multiple light-transmitting cadmium telluride glass lattice circuits included in the light-transmitting stack 3 are all light-transmitting, and these circuits are formed by processing circuits and power generation elements on the light-transmitting cadmium telluride glass substrate. The multiple light-transmitting cadmium telluride glass lattice circuits are stacked sequentially, with the topmost one bonded to the photoelectric glass LED circuit 2. The photoelectric glass LED circuit 2 is light-transmitting and has high light transmittance, allowing light to pass freely and reducing light loss. The photoelectric glass LED circuit 2 provides light emission. The light source utilizes a light source to emit light and present an image. The light-emitting element on the photoelectric glass LED circuit 2 is located on the side away from the light-transmitting cadmium telluride glass lattice circuit, and the ultra-white tempered glass 1 is bonded to the side of the photoelectric glass LED circuit 2 away from the light-transmitting cadmium telluride glass lattice circuit. This allows the light emitted by the photoelectric glass LED circuit 2 to directly illuminate the ultra-white tempered glass 1, reducing light loss during propagation and improving image brightness. The ultra-white tempered glass 1 is located on the side facing the user, and the iron content inside the ultra-white tempered glass 1 is extremely low, which can reduce the absorption of light during propagation. The ultra-white tempered glass 1 has high light transmittance, and the transmittance of visible light is above 91.5%, ensuring that external light can pass through the ultra-white tempered glass 1 and the photoelectric glass LED circuit 2 to illuminate the light-transmitting stack 3, so that multiple light-transmitting cadmium telluride glass lattice circuits can use light energy to generate electricity.

[0030] In step S107 of assembling the connectors, the front side of the first PCB circuit board 63 is soldered and fixed to the corresponding pads on the exposed FPC flexible circuit board a of the optoelectronic glass LED circuit 2. The exposed FPC flexible circuit board a of the optoelectronic glass LED circuit 2 serves to connect the positive and negative terminals of the internal power supply and signal transmission of the optoelectronic glass LED circuit 2. Then, the first plug wire 61 is soldered to the pads on the back side of the first PCB circuit board 63. Preferably, the first plug wire 61 is a GX16-6 aviation plug wire. The first plug wire 61 is connected to an external control system and is used to supply power and control signals to the optoelectronic glass LED circuit 2. The front sides of multiple second PCB circuit boards 64 are soldered and fixed to the corresponding pads on the exposed FPC flexible circuit board b of the transparent cadmium telluride glass lattice circuit. The circuit board is fixed by welding, and then the second plug wire 62 is welded to the second PCB circuit board 64, which is located on the FPC flexible circuit board b of the light-transmitting cadmium telluride glass lattice circuit closest to the anti-reflective glass 4 in the light-transmitting stack 3. Preferably, the second plug wire 62 is a standard interface 2-core plug wire, which is used to transmit the electrical energy generated by the light-transmitting stack 3. Furthermore, the circuits on multiple circuit boards are connected in parallel through the positive and negative through holes c of each second PCB circuit board 64, and GJMD70A high-stability photovoltaic special anti-reverse connection diodes are used to connect them at the parallel nodes of each second PCB circuit board 64, so that the electrical energy generated by each light-transmitting cadmium telluride glass lattice circuit is collected and transmitted out through the second plug wire 62.

[0031] Specifically, light shines from one side of the ultra-white tempered glass 1. Due to the high light transmittance of the ultra-white tempered glass 1 and the photoelectric glass LED circuit 2, the light can pass through the ultra-white tempered glass 1 and the photoelectric glass LED circuit 2 to illuminate the light-transmitting superimposed layer. Since the light-transmitting cadmium telluride glass lattice circuit itself is light-transmitting, and there are two or more light-transmitting cadmium telluride glass lattice circuits, and the light transmittance of the light-transmitting cadmium telluride glass in each light-transmitting cadmium telluride glass lattice circuit decreases from top to bottom, when multiple light-transmitting cadmium telluride glass lattice circuits are stacked, each light-transmitting cadmium telluride glass lattice circuit can also generate electricity using light, thereby increasing the total power generation. Furthermore, the first plug wire 61 is used to transmit electrical energy and control signals, causing the light source on the photoelectric glass LED circuit 2 to emit light and display various images, thereby combining photovoltaic power generation and photoelectric display to achieve the effect of generating electricity during the day using the light-transmitting superimposed layer 3 and displaying images at night using the photoelectric glass LED circuit 2.

[0032] Compared with existing technologies, unlike single photovoltaic glass or optoelectronic display glass, this embodiment combines optoelectronic glass LED circuit 2 with light-transmitting stack 3. Light passes through optoelectronic glass LED circuit 2 and irradiates light-transmitting stack 3. Light-transmitting stack 3 then uses light energy to generate electricity and transmits and stores the electrical energy in a timely manner through the second plug line 62. Optoelectronic glass LED circuit 2 emits light by being powered by the first plug line 61 to present various images and meet user needs, thus improving the application scenarios of this solar photovoltaic optoelectronic glass.

[0033] In this embodiment, in the laminated sheet S106, the light-transmitting layer 3 is bonded to the anti-reflective glass 4 through the following steps: A layer of film 5 is laid on the upper surface of the anti-reflective glass 4; A layer of transparent cadmium telluride glass lattice circuit is laid on the upper surface of the film 5 on the anti-reflective glass 4. Then, a layer of film 5 is laid on its upper surface, and another layer of transparent cadmium telluride glass lattice circuit is laid on the film 5 on the bottom layer of transparent cadmium telluride glass lattice circuit. The above operation is repeated until all transparent cadmium telluride glass lattice circuits are stacked.

[0034] Specifically, after bonding the anti-reflective glass 4 to the light-transmitting laminate 3 according to the above steps, the exposed FPC flexible circuit board b of each light-transmitting cadmium telluride glass lattice circuit is fixed to the side of the anti-reflective glass 4 away from the light-transmitting laminate 3 using traceless adhesive to prevent damage to the FPC flexible circuit board b in subsequent steps. Furthermore, the power generation components on each light-transmitting cadmium telluride glass lattice circuit are all located on the side away from the anti-reflective glass 4 to maximize the reception of external light and thus increase power generation. After the anti-reflective glass 4 is initially bonded to the light-transmitting laminate 3 using the film 5, it can be subjected to vacuum, high temperature, and high pressure treatment to improve the adhesion strength between the anti-reflective glass 4 and the light-transmitting laminate 3.

[0035] The anti-reflective glass 4 is bonded to the light-transmitting cadmium telluride glass lattice circuit and the light-transmitting cadmium telluride glass lattice circuit to each other using film 5. The materials for film 5 are widely available, the process is mature, and the price is low, which helps to reduce production costs.

[0036] In this embodiment, the light-transmitting stack 3 includes three light-transmitting cadmium telluride glass lattice circuits. From top to bottom, the light transmittance of the light-transmitting cadmium telluride glass in the first light-transmitting cadmium telluride glass lattice circuit 31 is 70%, the light transmittance of the light-transmitting cadmium telluride glass in the second light-transmitting cadmium telluride glass lattice circuit 32 is 50%, and the light transmittance of the light-transmitting cadmium telluride glass in the third light-transmitting cadmium telluride glass lattice circuit 33 is 30%.

[0037] Preferably, the first transparent cadmium telluride glass lattice circuit 31 uses cadmium telluride glass with 70% transmittance as the base material. This 70% transmittance is achieved by adjusting the thickness (2-3 μm) and doping (e.g., As / Cl) of the CdTe layer. It employs ultra-white float glass, with a surface chemically strengthened (e.g., ion exchange method), achieving a surface hardness ≥650 HV and a transmittance ≥91% (uncoated). It is passivated with an ITO or FTO thin film of 50-100 nm thickness, sheet resistance ≤15 Ω / □, deposited by magnetron sputtering at a temperature ≤200℃; using the closed-space sublimation (CSS) method. Alternatively, solution methods (such as spray pyrolysis) can be used to control grain size and film uniformity; film thickness 2-3 μm, grain size ≥1 μm, sheet resistance ≤500Ω / □; chemical bath deposition (CBD) or RF sputtering, thickness 50-100 nm, bandgap 2.4 eV, carrier mobility ≥30 cm² / (V·s); silver-aluminum alloy screen printing to form ohmic contacts, linewidth ≤50 μm, resistivity ≤10 μΩ·cm; encapsulation with EVA / PVB film, tested according to IEC61215 standard, insulation resistance ≥100 MΩ, damp heat test (85℃ / 85%RH) ≥1000 h. The second transparent cadmium telluride glass lattice circuit 32 uses 50% transparent cadmium telluride glass as the base material, replacing traditional ITO with silver nanowires, increasing the transmittance to 55%. Sputtering-assisted CSS method achieves a battery efficiency of 22.1%; ultra-white float glass (thickness 3-6mm) with a surface roughness <0.5nm is used; indium tin oxide (ITO) is deposited by magnetron sputtering with a film thickness of 80-120nm and a sheet resistance of 10-20Ω / □; closed-space sublimation (CSS) is the main method, with a temperature of 500-600℃ and a deposition rate of 0.5-1Å / s; chemical bath deposition of CdS layer concentration 0.1MCdSO4, pH 10-11; mesh-shaped Ag electrode (linewidth <50μm) with transmittance loss <10%, encapsulated with EVA / PVB film with an insulation resistance >100MΩ. The third transparent cadmium telluride glass lattice circuit 33 uses cadmium telluride glass with 30% transmittance as the base material. This 30% transmittance is achieved by adjusting the film thickness and introducing a transparent conductive layer (such as ITO or FTO). Low-iron tempered glass (transmittance >91%) is used, with surface pretreatment (cleaning, chemical polishing). Fluorine-doped tin oxide (FTO) is deposited by sputtering, with a thickness of 50-100 nm and a sheet resistance <10 Ω / □. Closed-space sublimation (CSS) or solution method is used, with a thickness of 2-3 μm. Doping elements (such as Cl) optimize carrier mobility. A perovskite / Ag back contact, with a thickness of 50-100 nm, is required to form an ohmic contact with the TCO. EVA and PO films are used for encapsulation. Transmittance testing (ASTM G173 standard) and weather resistance testing (IEC 61215) are performed.

[0038] Specifically, three transparent cadmium telluride glass lattice circuits are laser-spot welded together. The three transparent cadmium telluride glass lattice circuits have the same voltage matching (60V-150V), and the current should decrease as transparency increases. The nominal currents are as follows: 30% voltage 60-150V, power 180W / ㎡, current 1.2A, short-circuit current 1.5A; 50% voltage 60-150V, power 130W / ㎡, current 1.07A, short-circuit current 1.2A; 70% voltage 60-150V, power 25W / ㎡, current 0.167A, short-circuit current 0.7A. The three transparent cadmium telluride glass lattice circuits are connected in parallel through 64 positive and negative vias on the second PCB board to achieve the sum of the current output. The ideal parallel output formula is: [I_{total} = I_{70%} + I_{50%} At the parallel node of each transparent cadmium telluride glass lattice circuit (second PCB board 64), GJMD70A high-stability photovoltaic-specific reverse-connection protection diodes are used to balance engineering installation capacity splicing performance redundancy (performance parameters: GJMD70A high redundancy is suitable for long-term high load or multiple parallel expansion scenarios, average on-state current 70A, which can meet the subsequent expansion needs of the circuit, off-state repetitive peak voltage 600-1800V, with wider adaptability, on-state non-repetitive surge current 2.6KA, surge current average time product 34.4×10³A²S, with stronger impact resistance; thermal resistance (junction to case) 0.35℃ / W, high heat dissipation efficiency; on-state peak voltage 0.80-0.85V, insulation voltage 2500VAC, storage temperature -40-125℃).

[0039] The three transparent cadmium telluride glass lattice circuits are arranged from top to bottom. The first transparent cadmium telluride glass lattice circuit 31 with a light transmittance of 70% is placed on the side of the photoelectric glass LED circuit 2 away from the ultra-white tempered glass 1. The third transparent cadmium telluride glass lattice circuit 33 with a light transmittance of 30% is placed on the side of the anti-reflective glass 4 close to the photoelectric glass LED circuit 2. The second transparent cadmium telluride glass lattice circuit 32 with a light transmittance of 50% is placed between the first transparent cadmium telluride glass lattice circuit 31 and the second transparent cadmium telluride glass lattice circuit 32. This allows light to sequentially shine onto the first transparent cadmium telluride glass lattice circuit 31, the second transparent cadmium telluride glass lattice circuit 32, and the third transparent cadmium telluride glass lattice circuit 33, ensuring that each transparent cadmium telluride glass lattice receives enough light to generate electricity.

[0040] The higher the light transmittance of cadmium telluride (CDT) glass, the higher its production cost. If multiple CDT glass lattice circuits all use high-transmittance CDT glass as the base material, the production cost will increase significantly. If low-transmittance CDT glass is used as the base material, the lower CDT glass lattice circuit will not receive enough light, thus reducing power generation. When the light transmittance of the CDT glass in each CDT glass lattice circuit decreases from top to bottom, the production cost can be reduced while making full use of light to obtain sufficient electrical energy.

[0041] In other embodiments, the light-transmitting stack 3 includes four light-transmitting cadmium telluride glass lattice circuits. The light transmittance of the light-transmitting cadmium telluride glass in the four light-transmitting cadmium telluride glass lattice circuits decreases sequentially from top to bottom, such as 80%, 60%, 40%, and 20%. That is, the light transmittance of the light-transmitting cadmium telluride glass in the topmost light-transmitting cadmium telluride glass lattice circuit is 80%, and the light transmittance of the light-transmitting cadmium telluride glass in the bottommost light-transmitting cadmium telluride glass lattice circuit is 20%.

[0042] In some embodiments, the light-transmitting stack 3 includes five light-transmitting cadmium telluride glass lattice circuits. The light transmittance of the light-transmitting cadmium telluride glass in the five light-transmitting cadmium telluride glass lattice circuits decreases sequentially from top to bottom, such as 80%, 70%, 60%, 50%, and 40%. That is, the light transmittance of the light-transmitting cadmium telluride glass in the topmost light-transmitting cadmium telluride glass lattice circuit is 80%, and the light transmittance of the light-transmitting cadmium telluride glass in the bottommost light-transmitting cadmium telluride glass lattice circuit is 40%.

[0043] In a multi-layer transparent cadmium telluride glass lattice circuit, the transmittance of the transparent cadmium telluride glass decreases sequentially from top to bottom. The transmittance can decrease in a regular manner, such as when the transparent stack 3 includes three transparent cadmium telluride glass lattice circuits, the transmittance from top to bottom is 70%, 50%, and 30% respectively; or, the transmittance can decrease irregularly, such as when the transparent stack 3 includes three transparent cadmium telluride glass lattice circuits, the transmittance from top to bottom is 70%, 65%, and 33% respectively.

[0044] In this embodiment, in the laminated sheet S106, the following steps are performed: bonding the light-transmitting layer 3 to the anti-reflective glass 4, bonding the photoelectric glass LED circuit 2 to the light-transmitting layer 3, and bonding the ultra-clear tempered glass 1 to the photoelectric glass LED circuit 2: A layer of film 5 is laid on the upper surface of the anti-reflective glass 4; A light-transmitting layer 3 is laid on the upper surface of the film 5 located on the anti-reflective glass 4; A film 5 is laid on the upper surface of the light-transmitting laminate 3; Photoelectric glass LED circuit 2 is laid on the upper surface of the film 5 located on the light-transmitting laminate 3; A layer of film 5 is laid on the LED circuit 2 of the optoelectronic glass; Ultra-white tempered glass 1 is laid on the upper surface of the film 5 located on the photoelectric glass LED circuit 2; The anti-reflective glass 4, the light-transmitting laminate 3, the photoelectric glass LED circuit 2, and the ultra-white tempered glass 1 are subjected to vacuuming, high temperature, and high pressure treatment, which causes the anti-reflective glass 4, the light-transmitting laminate 3, the photoelectric glass LED circuit 2, and the ultra-white tempered glass 1 to adhere to each other.

[0045] Preferably, film 5 is a PVB film with a thickness between 2.28 mm and 3.42 mm. PVB film is solid at room temperature and has good flexibility and light transmittance. Under high temperature and high pressure conditions, it will melt into a viscous fluid.

[0046] When the photoelectric glass LED circuit 2 is attached to the upper surface of the film 5 located on the light-transmitting stack 3, the light-emitting element of the photoelectric glass LED circuit 2 is located on the side away from the light-transmitting stack 3, that is, the light-emitting surface of the photoelectric glass LED circuit 2 is set opposite to the ultra-white tempered glass 1, so that the user can easily view the image displayed by the photoelectric glass LED circuit 2. Before the anti-reflective glass 4, the light-transmitting stack 3, the photoelectric glass LED circuit 2 and the ultra-white tempered glass 1 are subjected to vacuuming, high temperature and high pressure treatment, the exposed FPC flexible circuit board a of the photoelectric glass LED circuit 2 and the exposed FPC flexible circuit board b of each light-transmitting cadmium telluride glass lattice circuit in the light-transmitting stack 3 are fixed to the side of the anti-reflective glass 4 away from the light-transmitting stack 3 with traceless adhesive to avoid damage to the FPC flexible circuit board in subsequent steps. Specifically, the anti-reflective glass 4, the light-transmitting laminate 3, the photoelectric glass LED circuit 2, and the ultra-clear tempered glass 1 are packaged in vacuum bags and then vacuum-sealed. They are then placed in an autoclave, where the high-temperature, high-pressure environment melts the film 5. The melted film 5 becomes a viscous fluid and fills the tiny gaps between the anti-reflective glass 4 and the light-transmitting laminate 3, between the light-transmitting laminate 3 and the photoelectric glass LED circuit 2, and between the photoelectric glass LED circuit 2 and the ultra-clear tempered glass 1. After the film 5 cools, the anti-reflective glass 4, the light-transmitting laminate 3, the photoelectric glass LED circuit 2, and the ultra-clear tempered glass 1 are firmly bonded together, enhancing the overall structural strength. The temperature inside the autoclave is controlled between 120 and 130°C, the heating rate is controlled at 5°C / min, the pressure is controlled at 1.0-1.5 MPa, and the heat and pressure are maintained for 5-7 hours.

[0047] The heating rate is controlled at 5℃ / min to avoid uneven melting of the film 5 due to sudden temperature rise, or stress cracks in the anti-reflective glass 4, light-transmitting laminate 3, photoelectric glass LED circuit 2, and ultra-clear tempered glass 1 due to differences in thermal expansion and contraction; the pressure is controlled at 1.0~2.5MPa to ensure that the molten film 5 fully wets each bonding surface and fills the tiny gaps; the heat preservation and pressure holding time is controlled at 5~7h to avoid delamination later due to insufficient bonding.

[0048] In this embodiment, after assembling the terminal block S107, the process further includes installation and debugging S109, which includes the following steps: The display glass formed by anti-reflective glass 4, light-transmitting laminate 3, photoelectric glass LED circuit 2 and ultra-white tempered glass 1 is installed into the slots of the profile frame and fixed with structural adhesive. Install the photoelectric control display system into the profile frame, and connect the photoelectric control display system to the first plug line 61 of each display glass.

[0049] In this embodiment, the assembly of the terminal block S107 further includes the following steps: Protect the solder joints after welding with insulating pad 65; The insulating pad 65, the first PCB circuit board 63, and the second PCB circuit board 64 are secured to the base of the waterproof terminal 6 with screws. Attach the top cover and side cover to the base and secure them with screws; Apply potting compound to the base, top cover, and side cover.

[0050] Specifically, after welding, multiple insulating pads 65, the first PCB circuit board 63, and the second PCB circuit board 64 are screwed onto the base of the waterproof terminal 6. The top cover and side cover of the waterproof terminal 6 are then fastened and secured with locking screws. After completing the above steps, a dial indicator is used to test the welding continuity pass rate. After confirming that the welding is fine, a circuit connection and lighting test is performed. The circuit can be lit normally by touch. Then, a switching test of the three primary colors R, B, and G and mixed white light is performed for more than 10 seconds. If there are no quality problems such as failure to light up, partial non-lighting, or flickering, the waterproof terminal 6 is potted with potting compound. After standing for about 24 hours until the potting compound solidifies, it is inspected, labeled, and transferred to the finished product testing workshop.

[0051] In this embodiment, the base of the waterproof terminal 6 is located on the side of the anti-reflective glass 4 away from the light-transmitting layer 3. Installing the base of the waterproof terminal 6 on the outer side of the anti-reflective glass 4 will not obstruct the ultra-clear tempered glass 1, preventing it from affecting the user's viewing of the image displayed by the photoelectric glass LED circuit 2. At the same time, it will not block external light from shining from the ultra-clear tempered glass 1 onto the light-transmitting layer 3, thus avoiding affecting the power generation. In addition, it facilitates wiring, debugging, and maintenance by construction personnel without the need to disassemble the glass.

[0052] In this embodiment, the anti-reflective glass 4 is an anti-reflective LOW-E glass with a visible light reflectance of less than 5%. The anti-reflective glass 4 has a periodic microstructure formed on its surface using nanoimprinting technology, which results in a reflectance of less than 5%, effectively preventing reflections on the surface of the anti-reflective glass 4.

[0053] In this embodiment, the substrate of the photoelectric glass LED circuit 2 is ultra-clear glass. Ultra-clear glass has high light transmittance. Using ultra-clear glass as the substrate of the photoelectric glass LED circuit 2 allows external light to pass through the photoelectric glass LED circuit 2 and illuminate the light-transmitting stack 3, thereby increasing the power generation of the light-transmitting stack 3.

[0054] In this embodiment, before the lamination and bonding process S106, the manufacturing method further includes the following steps: Material Preparation S101: Ultra-white glass is selected as the substrate for the LED circuit 2. Low iron content (typically ≤0.015%) and high light transmittance (visible light transmittance ≥91.5%) are achieved through high-purity raw material ratios, strict melting processes, and precision machining technology. High-purity imported quartz sand is used, with quartz sand (SiO2 ≥99.5%), soda ash (Na2CO3), and limestone (CaCO3) as the main components, and Fe2O3 content is strictly controlled. The process involves electric melting or an oxy-fuel combustion furnace at a temperature of 1550-1600℃, primarily using float glass molding, with some high-end products employing an overflow pull-down method. Gradual cooling is used to eliminate… Internal stress; and the ultra-white glass is used as an LED circuit solution: to realize a simple circuit architecture that can be mass-produced on a large scale, a single-sided glass-based nano-silver single-sided circuit board with the same circuit structure, the main materials used in this solution include ultra-white glass (length and height can be customized) 6mm thick transparent white glass-based single-sided nano-silver circuit board, internal control IC type LED beads packaged with 2026 single-line return-to-zero code control protocol, 200 ohm chip resistor packaged with 1206, 10A high current jumper packaged with 1312, an FPC flexible circuit board with only conduction connection function and a terminal block dedicated to optoelectronic glass; Select PVB film as film 5; Transparent cadmium telluride glass was selected as the substrate for the transparent cadmium telluride glass lattice circuit. Anti-reflective LOW-E glass was selected as Anti-reflective Glass 4. Periodic microstructures were formed on the glass surface using nanoimprinting technology to achieve ultra-low reflectivity (<5%). Low-emissivity (Low-E) coating and anti-reflective (AR) coating technologies were combined to optimize optical performance, achieving energy saving and visual comfort. Multiple layers of metal oxides (such as silver (Ag) and indium tin oxide (ITO)) were deposited on the glass surface using magnetron sputtering (MS) or chemical vapor deposition (CVD). Multilayer dielectric films (such as alternating SiO2 / TiO2 layers) or nanostructure surface treatments were used to reduce visible light reflectivity (typically ≤5%). Ultra-white float glass (transmittance ≥91.5%) with a thickness of 3-12mm was used. Magnetron sputtering (mainstream): Multilayer metal oxides (such as SnO2:In2O3, Ag layer) + anti-reflective dielectric layer. Passivation treatment (to prevent silver layer oxidation) + physical tempering; Ultra-clear glass was chosen as the substrate for ultra-clear tempered glass 1.

[0055] In this embodiment, after material preparation S101, the manufacturing method further includes the following steps: Cutting and edge grinding S102: The substrate of the optoelectronic glass LED circuit 2, the ultra-white tempered glass 1, and the anti-reflective glass 4 are cut into a rectangular shape according to the pre-designed size using a high-precision CNC cutting machine. The cutting accuracy is controlled within ±0.25mm. Then, edge grinding is performed. The roughness Ra of the material edge after grinding does not exceed 0.8μm to ensure smooth edges and avoid stress concentration during subsequent installation and use, which could lead to material breakage.

[0056] In this embodiment, after the cutting and grinding step S102, the manufacturing method further includes the following steps: Cleaning S103: Place the cut and ground substrate of the optoelectronic glass LED circuit 2, the ultra-clear tempered glass 1, and the anti-reflective glass 4 into a professional cleaning equipment. Use deionized water and a neutral cleaning agent to clean for at least 5 minutes to ensure that impurities, dust, oil, etc. on the surface are thoroughly removed. After cleaning, the number of particulate contaminants on the material surface should not exceed 10 per square centimeter. Then, perform the original tempering process on the cleaned ultra-clear tempered glass 1 and the LED circuit processing step S104 on the substrate of the optoelectronic glass LED circuit 2. The specific parameters can refer to the normal glass tempering coefficient to prepare for the subsequent lamination process.

[0057] In this embodiment, after cleaning S103, the manufacturing method further includes the following steps: LED Circuit Processing S104: Using traditional screen printing technology, a circuit screen is used for pattern transfer; the designed large LED matrix circuit scheme RX-274 format Gerber file is placed on the printing equipment work platform through the pattern transfer method to create a large screen, and professionally prepared nano silver paste is spread on it. The nano silver paste circuit is printed according to the principle that the squeegee pressure does not exceed 1 / 4 of the actual stress limit of the screen.

[0058] The LED circuit fabrication process S104 also includes the following steps: Glass-based circuit board tempering: After printing, the circuit is inspected using SPI (Optical Inspection and Comparison Equipment) to ensure there are no open circuits, short circuits, missing prints, misalignment, or other quality issues. Then, it is baked in a drying tunnel oven at 240°C for about 5 minutes. Finally, the dried optoelectronic glass LED circuit 2 substrate is sent to a large glass tempering furnace for tempering. During tempering, the high temperature of 695°C in the furnace should not exceed 15 seconds, followed by hot air heat preservation for 30 seconds. Other specific parameters can be referenced from the normal glass tempering coefficient. During the tempering process, the nano-silver material, as well as the indium tin alloy and glass powder in the material, can fully combine with the glass silicon oxide material to achieve the performance required for the PCB circuit board.

[0059] In LED circuit fabrication S104, after the glass-based circuit board is tempered, the following steps are also included: STM mounting: Using conventional SMT processes, LEDs and external circuitry are mounted on the circuit according to the designed LED positions. 1206 chip 200-ohm resistors and 1312 package 10A high-current jumpers are also mounted. Finally, an FPC flexible circuit board a with only conductive connection function is mounted. After being soldered in a reflow tunnel oven and cooled, the glass circuit board PCBA assembly is completed.

[0060] In this embodiment, after processing the LED circuit in step S104, the manufacturing method further includes the following steps: Semi-test Aging S105: The photoelectric glass LED circuit 2, after completing the LED circuit processing step S104, is placed in the aging workshop. It is connected to a dedicated LED bead aging and lighting equipment through the external connector of the soldered FPC flexible circuit board a. The aging scheme mainly adopts a high and low current impact method, sequentially lighting up red, green, blue (RGB three primary colors), and white (mixed color) for 3 seconds each in transient mode, then lighting up red, green, blue (RGB three primary colors), and white (mixed color) for 5 seconds each in a gradual brightening mode, and finally lighting up red, green, blue (RGB three primary colors), and white (mixed color) for 3 seconds each in a strobe mode. The aging process is automatically cycled through this process. After each lighting period exceeding 8 hours, the power is cut off for half an hour to check for any faulty LED beads that need to be replaced. Once no problems are confirmed, the product is powered on again for aging. The total aging time is 168 hours to complete the aging process of the entire semi-finished product. The semi-finished product that has completed the total aging time is labeled and enters the next process. The light-transmitting cadmium telluride glass lattice circuit undergoes environmental simulation testing (such as damp heat cycling (85℃ / 85%RH), ultraviolet accelerated aging test, temperature cycling (-40℃-85℃)). Electrical performance tests are conducted using equipment such as a solar simulator (AM1.5G), LCR meter, and electrical parameter analyzer. After passing the test, the product is labeled and enters the next process.

[0061] In this embodiment, after assembling the terminal block S107 and before installing and debugging S109, the manufacturing method further includes the following steps: Finished Product Testing S108: The inspection personnel check the solar photovoltaic glass products that have been labeled and allowed to circulate in the previous process. After confirming that there are no errors, the test personnel connect the exposed FPC flexible circuit board a of the LED circuit 2 of the photovoltaic glass to a professional LED power control integrated lighting equipment through the first plug wire 61. The testing process is similar to the product semi-testing scheme, but the total aging time of the finished product test does not exceed 72 hours. During the total time, the power is cut off for half an hour every 8 hours to check for any defective LED beads, and then the power is turned on again to continue the test. The finished product test aging scheme also adopts the high and low current impact method to sequentially light up red, green, blue (RGB three primary colors), and white (mixed color) for 3 seconds each in transient mode, then in a gradual light-to-dark mode to light up red, green, blue (RGB three primary colors), and white (mixed color) for 5 seconds each, and finally in a strobe mode to light up red, green, blue (RGB three primary colors), and white (mixed color) for 3 seconds each. The power is automatically cycled and continuously lit until the total aging time reaches 72 hours to complete the entire finished product test aging process. Aging tests aim to evaluate the performance degradation and reliability of solar photovoltaic glass in long-term outdoor environments. The tests need to be combined with environmental stress (humid heat, ultraviolet radiation, temperature cycling, etc.) and electrical performance (efficiency degradation, electroluminescence, etc.) for comprehensive evaluation. Finished products that have completed the total aging test can be labeled and put into storage, thus completing the production of the entire solar photovoltaic glass product.

[0062] In this embodiment, the installation and debugging S109 further includes the following steps: The power supply of the main control display system is connected to the photoelectric glass LED circuit 2 via the first plug cable 61, together forming a photoelectric electronic control display system. Each power supply of the main control display system is connected to the corresponding position of the photoelectric glass LED circuit 2. Multiple power supplies of the main control display system are connected and communicated with each other via a network cable. The video playback function can be realized by connecting the network cable to the photoelectric electronic control display system. The photoelectric electronic control display system mainly includes a power supply and a control card. The system on the control card includes a main control chip (e.g., a high-performance chip using the ARM architecture, with a main frequency of up to 1GHz and multiple channels). Based on processing capabilities, it can process display data); the control method of single-line zeroing code for LED beads in the glass-based circuit scheme (it can realize independent and precise adjustment of the brightness, color, etc. of LED dot matrix in different areas, with an adjustment accuracy of 256 levels of grayscale control); photoelectric glass (the spacing between LED beads can be customized according to customer needs to 10mm / 15mm / 20mm / 30mm / 40mm / 50mm, etc., using LED beads with high color rendering index and high brightness, color rendering index Ra≥90, the brightness of a single LED bead can reach 10-15 lumens, and the light output uniformity reaches more than 97.5%). The photovoltaic inverter energy storage device is installed in a designated location. The photovoltaic inverter energy storage device is electrically connected to the light-transmitting cadmium telluride glass lattice circuit through the second plug line 62. The photovoltaic inverter energy storage device is connected to the photoelectric control display system through the mains power output port to realize the transmission of power. It is also connected to the mains power grid to realize the conversion of excess power into external power and increase economic benefits. The assembled display glass underwent comprehensive debugging and testing. First, the display effect was checked by playing video and image files of different formats and resolutions, observing the LED circuit of the photoelectric glass from different angles and distances to ensure clear images, vibrant colors, and no flickering or ghosting. Next, the stability of the photoelectric control display system was tested, running continuously for over 24 hours to monitor for malfunctions such as crashes, data loss, and display errors. Finally, the photovoltaic inverter energy storage equipment was inspected, using a grounding resistance tester (accuracy ±1%) to test the grounding system (grounding resistance ≤4Ω) according to GB50057-2010. DC was applied... Insulation resistance was tested by applying 500V voltage for 1 minute (insulation resistance ≥200MΩ (IEC61730-2)); cable connections were checked to confirm compliance with GB / T5013.1-2022 standard (no signs of overheating (infrared thermometry ≤45℃)); IV curve scanning was performed using a Class A sunlight simulator (fill factor ≥0.78); MPPT response test was performed simulating a 10% irradiance change (tracking error ≤1%); temperature coefficient verification was conducted at an ambient temperature of 25℃±2℃ (electrical performance degradation ≤0.25% / ℃). Simulated display tests were conducted on the photovoltaic and electronically controlled display system. Different image and video signals were input to check whether the brightness, color, and resolution of the displayed image met the design requirements. Brightness error was controlled within ±10%, color deviation ΔE did not exceed 5 (measured using the internationally recognized CIE1976 color space standard), and resolution reached high-definition standards (e.g., 1920×1080 and above). Simultaneously, the response time for display mode switching was checked, requiring a switching time of no more than 1 second to ensure proper display functionality. Then, simulated tests were conducted on the photovoltaic energy storage system. An IV meter (such as Fluke43B or SolarEye) was used to measure open-circuit voltage (Voc), short-circuit current (Isc), and maximum power (Pmax) under standard test conditions (STC: 1000W / m², 25℃, AM1.5G), with an irradiance >800 ppm. Test at W / m², with a test error ≤±1%; compare the factory nominal power before installation with the actual measured power after installation, and calculate the annual average attenuation rate (≤2% in the first year, ≤0.5% / year thereafter); apply DC 1000V voltage and measure the insulation resistance between the component frame and the grounding terminal (≥100MΩ), and repeat the test after a humid environment (RH≥90%); use an infrared thermal imager to simulate partial shading (such as shadows) and monitor whether the component temperature exceeds 85℃ (IEC61215:2021 requirement); a damp heat cycle test is required at 85℃ / 85%RH (24 hours dry + 24 hours damp heat, total 1000 hours), and defects such as encapsulation layer delamination and electrode corrosion are checked; use Q-SunXenon lamps to simulate UV radiation (IEC60068-2-3:2021), with a test cycle ≥2000 hours, to conduct an ultraviolet aging test.

[0063] Process complete: The above manufacturing method can efficiently produce solar photovoltaic glass that meets the needs of specific scenarios, providing the market with an innovative and practical high-tech green energy-saving new product.

[0064] Please see Figure 21 The diagram shows a flowchart of a preferred embodiment of the present invention. First, material preparation is performed. The first part of the material is used as a light-transmitting laminate. Three pieces of light-transmitting cadmium telluride glass lattice circuits are laser-spot-welded and then subjected to semi-test aging. The remaining materials are cut and edge-ground, then cleaned. After cleaning, the second part of the material is processed into LED circuits using an LED circuit design, followed by glass-based circuit board tempering, STM mounting, and semi-test aging. The third part of the material is then tempered. Finally, the processed first, second, and third parts of the material are laminated and glued together. After lamination and glue bonding, the wiring terminals are assembled, the finished product is tested, and installation and debugging are performed. The process is then complete.

[0065] This invention proposes a solar photovoltaic glass that, through optimized transparency gradient design of the transparent cadmium telluride glass lattice circuit (70% / 50% / 30% three-layer superposition), efficient bonding using PVB film, and integration of high-transparency (90%) photovoltaic glass LED circuit and ultra-clear tempered glass, solves the pain points of existing technologies such as poor compatibility between photovoltaic and display functions, insufficient transparency, and low structural stability. It achieves the dual functions of "efficient power generation during the day and high-definition display at night," adapting to the combined needs of modern buildings for energy conservation and intelligent interaction, demonstrating significant technological innovation and market application value. Furthermore, by optimizing material selection and using multi-level, multi-layer transparent / semi-transparent cadmium telluride glass lattice circuits to receive different solar radiation, it strives to improve power generation efficiency while maintaining the same illumination area, achieving the effect of daytime energy generation and storage, and high-definition photovoltaic display at night. This provides the market with a high-value-added, green, energy-saving, high-tech product, filling the gap in the market for building materials glass products related to "green energy utilization + intelligent information display."

[0066] Finally, it should be noted that although the above embodiments have been described in the description and drawings of this invention, this should not limit the scope of patent protection of this invention. Any technical solutions that are based on the essential concept of this invention, utilize the content described in the description and drawings of this invention to make equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this invention.

Claims

1. A method for manufacturing solar photovoltaic glass, characterized in that, Includes the following steps: Laminated laminate: A light-transmitting laminate is bonded to the anti-reflective glass. The light-transmitting laminate includes multiple light-transmitting cadmium telluride glass lattice circuits. The multiple light-transmitting cadmium telluride glass lattice circuits are stacked one on top of the other, and adjacent light-transmitting cadmium telluride glass lattice circuits are bonded together. The light transmittance of the light-transmitting cadmium telluride glass in each light-transmitting cadmium telluride glass lattice circuit decreases from top to bottom. Photoelectric glass LED circuits are bonded to the light-transmitting laminate, and ultra-clear tempered glass is bonded to the photoelectric glass LED circuits. Assemble the wiring terminals: Connect the first PCB circuit board to the exposed FPC flexible circuit board of the photoelectric glass LED circuit, solder the first plug wire to the first PCB circuit board, solder the exposed FPC flexible circuit boards of each light-transmitting cadmium telluride glass lattice circuit to their respective second PCB circuit boards, and solder the second PCB circuit board that is soldered to the exposed FPC flexible circuit board of the light-transmitting cadmium telluride glass lattice circuit located closest to the anti-reflective glass in the light-transmitting stack to the second plug wire.

2. The manufacturing method according to claim 1, characterized in that, In laminated sheets, light-transmitting layers are bonded to the anti-reflective glass using the following steps: A layer of film is laid on the upper surface of the anti-reflective glass; A light-transmitting cadmium telluride glass lattice circuit, the bottom layer of the light-transmitting stack, is laid on the upper surface of the film on the anti-reflective glass. Then, a layer of film is laid on its upper surface, and another layer of light-transmitting cadmium telluride glass lattice circuit is laid on the film on the bottom layer of the light-transmitting cadmium telluride glass lattice circuit. The above operation is repeated until all the light-transmitting cadmium telluride glass lattice circuits are stacked.

3. The manufacturing method according to claim 1 or 2, characterized in that, The light-transmitting stack comprises three light-transmitting cadmium telluride glass lattice circuits. From top to bottom, the light transmittance of the light-transmitting cadmium telluride glass in the first light-transmitting cadmium telluride glass lattice circuit is 70%, the light transmittance of the light-transmitting cadmium telluride glass in the second light-transmitting cadmium telluride glass lattice circuit is 50%, and the light transmittance of the light-transmitting cadmium telluride glass in the third light-transmitting cadmium telluride glass lattice circuit is 30%.

4. The manufacturing method according to claim 1, characterized in that, In the laminated sheet, a light-transmitting layer is bonded to the anti-reflective glass through the following steps: a photoelectric glass LED circuit is bonded to the light-transmitting layer; and ultra-clear tempered glass is bonded to the photoelectric glass LED circuit. A layer of film is laid on the upper surface of the anti-reflective glass; A light-transmitting layer is laid on the upper surface of the film on the anti-reflective glass; A film is laid on the upper surface of the light-transmitting laminate; Photoelectric glass LED circuitry is laid on the upper surface of the film located on the light-transmitting laminate; A film is laid on the LED circuit of the optoelectronic glass; Ultra-white tempered glass is laid on the upper surface of the film located on the LED circuit of the optoelectronic glass; The anti-reflective glass, light-transmitting laminate, photoelectric glass LED circuit, and ultra-clear tempered glass are subjected to vacuuming, high temperature, and high pressure treatment, which causes the anti-reflective glass, light-transmitting laminate, photoelectric glass LED circuit, and ultra-clear tempered glass to adhere to each other.

5. The manufacturing method according to claim 4, characterized in that, The film is PVB film; High-temperature and high-pressure treatment is achieved through a pressure cooker, with the temperature controlled at 120-130℃, the heating rate controlled at 5℃ / min, the pressure controlled at 1.0-1.5MPa, and the holding time controlled at 5-7h.

6. The manufacturing method according to claim 1, characterized in that, After assembling the terminals, the following steps are also included: The display glass is composed of anti-reflective glass, light-transmitting laminate, photoelectric glass, LED circuit, and ultra-white tempered glass. Multiple display glass pieces are installed into the slots of the profile frame and fixed with structural adhesive. Install the photoelectric control display system into the profile frame and connect the photoelectric control display system to the first plug wire of each display glass.

7. The manufacturing method according to claim 1, characterized in that, The assembly of the terminals also includes the following steps: Protect the solder joints after welding with insulating pads; The insulating pad, the first PCB circuit board, and the second PCB circuit board are secured to the base of the waterproof terminal block with screws. Attach the top cover and side cover to the base and secure them with screws; Apply potting compound to the base, top cover, and side cover.

8. The manufacturing method according to claim 7, characterized in that, The base of the waterproof terminal is located on the side of the anti-reflective glass away from the light-transmitting layer.

9. The manufacturing method according to claim 1, characterized in that, The anti-reflective glass is a low-E anti-reflective glass with a visible light reflectivity of less than 5%.

10. The manufacturing method according to claim 1, characterized in that, The substrate for the optoelectronic glass LED circuit is ultra-white glass.

Images