Multi-wire cutting multi-fluid cooling device and machining method

Abstract

The invention relates to a multi-wire cutting multi-fluid cooling device and a machining method.The multi-wire cutting multi-fluid cooling device comprises a cutting fluid box, a cutting fluid pump, a conveying pipe, a filter, a heat exchanger, a cooling water pipe, a condenser, a diamond wire cooling device, a silicon rod cooling device and a silicon wafer cooling device, one end of the conveying pipe is arranged in the cutting fluid box, and the conveying pipe is sequentially provided with the cutting fluid pump, the filter, the heat exchanger and the cooling water pipe; the diamond wire is arranged on the guide wheel, the silicon rod is arranged above the diamond wire, and two groups of diamond wire cooling devices, two groups of silicon rod cooling devices and two groups of silicon wafer cooling devices are respectively arranged on two sides of the silicon rod. According to the multi-wire cutting multi-fluid cooling device and the machining method, the cutting liquid atomization effect is achieved through the arrangement of the double-fluid nozzles, the rejection rate of silicon wafers is reduced, targeted cooling of diamond wires is achieved through the diamond wire cooling device, and cooling of uncut silicon rods is achieved through the silicon rod cooling device.

Description

Technical Field

[0001] This invention relates to a multi-wire cutting multi-fluid cooling device and processing method. Background Technology

[0002] As a renewable energy source, solar photovoltaic (PV) technology is playing an increasingly important role in future energy supply. Currently, crystalline silicon cells account for 95.9% of the overall PV cell market. Diamond wire cutting, a silicon wafer processing technology that has matured in recent years, is seeing its cost increase as silicon material becomes the most significant component of wafer processing costs. Therefore, fine-wire thin-wafer cutting is becoming the future direction for PV development.

[0003] The thickness of P-type silicon wafers has rapidly decreased from 180µm to 150µm. Cutting these thinner wafers requires more stable cutting conditions, resulting in better control of the total transflective volume (TTV) of the wafer. The steel wire used for diamond wire cutting has also rapidly transitioned from 70µm to 20µm. Even finer diamond wire cutting will be used in the future.

[0004] In existing diamond wire multi-wire cutting technology, multi-wire cutting uses a slurry pump to supply cutting fluid to the nozzle. The nozzle then overflows the cutting fluid onto a dense network of diamond wires. As the diamond wires reciprocate, they carry the cutting fluid into the cutting area. The main functions of the cutting fluid are cooling, lubrication, dispersion, and penetration.

[0005] With the advancement of thin-film and fine-wire cutting, diamond wire cutting requires higher linear speeds. Because the cross-section of the fine wire is smaller, the amount of cutting fluid carried is reduced. Even finer diamond wires have lower breaking tensile strength, making them more prone to breakage at high speeds. As the silicon ingot is gradually fed into the cutting process, the silicon wafers, due to the presence of the kerf, will stick together under the influence of the cutting fluid. This makes it more difficult for the diamond wire to carry fluid into the cutting area. Simultaneously, the increased friction under the pressure of the silicon wafers generates more heat, thus accelerating wire wear and making the diamond wire more susceptible to breakage. The increased heat can cause cracks in the silicon ingot, resulting in quality defects. Summary of the Invention

[0006] To overcome the shortcomings of the prior art, the present invention provides a multi-wire cutting multi-fluid cooling device.

[0007] To solve the above problems, the technical solution adopted by the present invention is: a multi-wire cutting multi-fluid cooling device and processing method, comprising a cutting fluid tank, a cutting fluid pump, a delivery pipe, a filter, a heat exchanger, a cooling water pipe, a condenser, a diamond wire cooling device, a silicon rod cooling device, a silicon wafer cooling device, a guide wheel, diamond wire, and a silicon rod. One end of the delivery pipe is inside the cutting fluid tank. The delivery pipe is sequentially equipped with the cutting fluid pump, the filter, and the heat exchanger. The diamond wire is mounted on the guide wheel. The silicon rod is above the diamond wire. Two sets of diamond wire cooling devices, silicon rod cooling devices, and silicon wafer cooling devices are respectively provided on both sides of the silicon rod. The device includes a silicon wafer cooling unit connected to a delivery pipe. The diamond wire cooling unit includes a first delivery branch pipe and a first nozzle. The first delivery branch pipe is connected to the delivery pipe, and the first nozzle is connected to the first delivery branch pipe. The first nozzle is located above the diamond wire. The silicon rod cooling unit includes a second delivery branch pipe and a second nozzle. The second delivery branch pipe is connected to the delivery pipe, and the second nozzle is connected to the second delivery branch pipe. The second nozzle is located on one side of the silicon rod. The silicon wafer cooling unit includes a third delivery branch pipe, a gas source delivery pipe, and a dual-fluid nozzle. The third delivery branch pipe is connected to the delivery pipe, and the third delivery branch pipe is connected to the dual-fluid nozzle. The gas source delivery pipe is connected to the dual-fluid nozzle.

[0008] As a preferred embodiment, the dual-fluid nozzle includes a liquid inlet connector, an air inlet connector, and a nozzle pipe. The liquid inlet connector is connected to a delivery branch pipe, and the air inlet connector is connected to a gas source delivery pipe. One end of the nozzle pipe is provided with a plug. The nozzle pipe is provided with a liquid pipeline and a gas pipeline. The liquid pipeline has multiple through holes arranged in an array, and the gas pipeline has multiple air holes arranged in an array. The air holes communicate with the through holes.

[0009] As a preferred embodiment, the cutting fluid tank is equipped with a level gauge.

[0010] As a preferred embodiment, the delivery pipe is equipped with a pressure sensor one and a pressure sensor two, with the pressure sensor one installed between the cutting fluid pump and the filter.

[0011] As a preferred embodiment, the heat exchanger is provided with cooling water pipes, which are connected to the condenser.

[0012] As a preferred embodiment, the gas supply pipe is equipped with a ball valve and a pressure reducing valve.

[0013] As a preferred embodiment, the cutting fluid, after being pumped through the cutting fluid tank and passing through a pressure sensor, is filtered by a filter. Cooling water is then delivered to a heat exchanger via a condenser to cool the cutting fluid. Subsequently, the pressure is monitored in real time again by a pressure sensor. The cutting fluid then enters the nozzles of the diamond wire cooling device to cool the diamond wire. The cutting fluid then enters the nozzles of the silicon rod cooling device to cool the top of the uncut silicon rod. After entering the dual-fluid nozzles of the silicon wafer cooling device, the cutting fluid is delivered to the dual-fluid nozzles via a gas supply pipe. The cutting fluid is then delivered into the nozzle and blown out by the gas, atomizing the cutting fluid and spraying it onto the cut silicon wafer.

[0014] By adopting the above technical solution, compared with the prior art, the present invention achieves simultaneous cooling of silicon rods, cut silicon wafers and diamond wires through the setting of multi-wire cutting multi-fluid cooling device and processing method. At the same time, the setting of dual-fluid nozzles achieves the effect of cutting fluid atomization, reducing the scrap rate of silicon wafers. The diamond wire cooling device achieves targeted cooling of diamond wires, and the silicon rod cooling device achieves cooling of uncut silicon rods.

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a structural view of the multi-wire cutting multi-fluid cooling device and processing method of the present invention.

[0017] Figure 2 This is a partial structural view of the multi-wire cutting multi-fluid cooling device and processing method of the present invention.

[0018] Figure 3 A partial view of the dual-fluid nozzle of the multi-wire cutting multi-fluid cooling device of the present invention. Figure 1 .

[0019] Figure 4 A partial view of the dual-fluid nozzle of the multi-wire cutting multi-fluid cooling device of the present invention. Figure 2 .

[0020] Figure 5 A cross-sectional view of the dual-fluid nozzle of the multi-wire cutting multi-fluid cooling device of the present invention. Figure 1 .

[0021] Figure 6 This is an axial view of the dual-fluid nozzle of the multi-wire cutting multi-fluid cooling device of the present invention.

[0022] In the diagram: 1. Cutting fluid tank, 2. Cutting fluid pump, 3. Delivery pipe, 4. Filter, 5. Heat exchanger, 6. Cooling water pipe, 7. Condenser, 8. Diamond wire cooling device, 8a. Delivery branch pipe one, 8b. Nozzle one, 9. Silicon rod cooling device, 9a. Delivery branch pipe two, 9b. Nozzle two, 10. Silicon wafer cooling device, 10a. Delivery branch pipe three, 10b. Gas source delivery pipe, 10c. Dual fluid nozzle, 10c1. Liquid inlet connector, 10c2. Air inlet connector, 10c3. Nozzle, 10c31. Liquid pipeline, 10c311. Through hole, 10c32. Gas pipeline, 10c321. Air hole, 10c4. Plug, 11. Guide wheel, 12. Diamond wire, 13. Silicon rod, 14. Liquid level gauge, 15. Pressure sensor one, 16. Pressure sensor two, 17. Ball valve, 18. Pressure reducing valve. Detailed Implementation

[0023] Example: Figure 1-6 As shown, a multi-wire cutting multi-fluid cooling device and processing method includes a cutting fluid tank 1, a cutting fluid pump 2, a delivery pipe 3, a filter 4, a heat exchanger 5, a cooling water pipe 6, a condenser 7, a diamond wire cooling device 8, a silicon rod cooling device 9, a silicon wafer cooling device 10, a guide wheel 11, a diamond wire 12, and a silicon rod 13. One end of the delivery pipe 3 is inside the cutting fluid tank 1. The cutting fluid pump 2, the filter 4, and the heat exchanger 5 are sequentially installed on the delivery pipe 3. The diamond wire 12 is installed on the guide wheel 11. The silicon rod 13 is above the diamond wire 12. Two sets of diamond wire cooling devices 8, silicon rod cooling devices 9, and silicon wafer cooling devices 10 are respectively provided on both sides of the silicon rod 13. The diamond wire cooling devices 8, silicon rod cooling devices 9, and silicon wafer cooling devices 10 are connected to the delivery pipe 3. The diamond wire cooling device 8 includes a first conveying branch pipe 8a and a first nozzle 8b. The first conveying branch pipe 8a is connected to the conveying pipe 3, and the first nozzle 8b is connected to the first conveying branch pipe 8a. The first nozzle 8b is located above the diamond wire 12. The silicon rod cooling device 9 includes a second conveying branch pipe 9a and a second nozzle 9b. The second conveying branch pipe 9a is connected to the conveying pipe 3, and the second nozzle 9b is connected to the second conveying branch pipe 9a. The second nozzle 9b is located on one side of the silicon rod 13. The silicon wafer cooling device 10 includes a third conveying branch pipe 10a, a gas source conveying pipe 10b, and a dual-fluid nozzle 10c. The third conveying branch pipe 10a is connected to the conveying pipe 3, and the third conveying branch pipe 10a is connected to the dual-fluid nozzle 10c. The gas source conveying pipe 10b is connected to the dual-fluid nozzle 10c.

[0024] Furthermore, the dual-fluid nozzle 10c includes a liquid inlet connector 10c1, an air inlet connector 10c2, and a nozzle 10c3. The liquid inlet connector 10c1 is connected to the delivery branch pipe 10a, and the air inlet connector 10c2 is connected to the air source delivery pipe 10b. One end of the nozzle 10c3 is provided with a plug 10c4. The nozzle 10c3 is provided with a liquid pipeline 10c31 and a gas pipeline 10c32. The liquid pipeline 10c31 has multiple through holes 10c311 arrayed on it, and the gas pipeline 10c32 has multiple air holes 10c321 arrayed on it. The air holes 10c311 communicate with the through holes 10c32. With the dual-fluid nozzle 10c, the cutting fluid entering the liquid pipeline 10c31 is atomized by the gas blown out through the air holes 10c321, which reduces the pressure of the cutting fluid impacting the silicon wafer and can reduce the scrap rate of the cut silicon wafer.

[0025] Furthermore, the cutting fluid tank 1 is equipped with a level gauge 14, which enables real-time monitoring of the liquid level in the cutting fluid tank 1.

[0026] Furthermore, the delivery pipe 3 is equipped with a pressure sensor 15 and a pressure sensor 16. The pressure sensor 15 is installed between the cutting fluid pump and the filter, and the pressure sensor 16 is located on one side of the heat exchanger 5. Through the installation of the pressure sensor 15 and the pressure sensor 16, real-time pressure detection of the cutting fluid in the delivery pipe 3 is achieved.

[0027] Furthermore, the heat exchanger 5 is equipped with a cooling water pipe 6, which is connected to the condenser 7. Through the cooperation of the cooling water pipe 6 and the condenser 7, the cutting fluid inside the heat exchanger 5 is cooled down, providing cooled cutting fluid for the diamond wire 12 and silicon rod 13 during the cutting operation.

[0028] Furthermore, the gas supply pipe 10b is equipped with a ball valve 17 and a pressure reducing valve 18. The ball valve 17 enables the opening and closing of the gas supply pipe 10b, and the pressure reducing valve 18 reduces the pressure of the gas in the gas pipeline 10c32, thereby reducing the damage of high-pressure gas to the silicon wafer.

[0029] In this invention, the cutting fluid passes through the cutting fluid pump 2 in the cutting fluid tank 1, then through the pressure sensor 15 and the filter 4. Cooling water is then delivered to the heat exchanger via the condenser to cool the cutting fluid. The pressure is then monitored in real time by the pressure sensor 16. The cutting fluid then enters the nozzle 8b of the diamond wire cooling device 8 to cool the diamond wire. The cutting fluid enters the nozzle 9b of the silicon rod cooling device 9 to cool the top of the uncut silicon rod 13. The cutting fluid enters the dual-fluid nozzle 10c of the silicon wafer cooling device 10 and is then delivered to the dual-fluid nozzle 10c via the gas supply pipe 10b. The cutting fluid is then delivered to the spray pipe 10c3 and blown out by the gas, atomizing the cutting fluid and spraying it onto the cut silicon wafer.

[0030] By adopting the above technical solution, compared with the prior art, the present invention achieves simultaneous cooling of silicon rods, cut silicon wafers and diamond wires through the setting of multi-wire cutting multi-fluid cooling device and processing method. At the same time, the setting of dual-fluid nozzles achieves the effect of cutting fluid atomization, reducing the scrap rate of silicon wafers. The diamond wire cooling device achieves targeted cooling of diamond wires, and the silicon rod cooling device achieves cooling of uncut silicon rods.

[0031] This invention is not limited to the preferred embodiments described above. Anyone should know that any structural changes made under the guidance of this invention, and any technical solutions that are the same as or similar to this invention, are within the scope of protection of this invention.

Claims

1. A multi-wire cutting multi-fluid cooling device and processing method, comprising a cutting fluid tank, a cutting fluid pump, a delivery pipe, a filter, a heat exchanger, a cooling water pipe, a condenser, a diamond wire cooling device, a silicon rod cooling device, a silicon wafer cooling device, a guide wheel, diamond wire, and a silicon rod. One end of the delivery pipe is inside the cutting fluid tank. The delivery pipe is sequentially equipped with the cutting fluid pump, the filter, and the heat exchanger. The diamond wire is mounted on the guide wheel. The silicon rod is positioned above the diamond wire. Two sets of diamond wire cooling devices, silicon rod cooling devices, and silicon wafer cooling devices are respectively provided on both sides of the silicon rod. The diamond wire cooling device, silicon rod cooling device, and silicon wafer cooling device are integrated with... The diamond wire cooling device includes a first delivery branch pipe and a first nozzle. The first delivery branch pipe is connected to the first delivery pipe, and the first nozzle is connected to the first delivery branch pipe. The first nozzle is located above the diamond wire. The silicon rod cooling device includes a second delivery branch pipe and a second nozzle. The second delivery branch pipe is connected to the second delivery pipe, and the second nozzle is connected to the second delivery branch pipe. The second nozzle is located on one side of the silicon rod. The silicon wafer cooling device includes a third delivery branch pipe, a gas source delivery pipe, and a dual-fluid nozzle. The third delivery branch pipe is connected to the second delivery pipe, and the third delivery branch pipe is connected to the dual-fluid nozzle. The gas source delivery pipe is connected to the dual-fluid nozzle.

2. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The dual-fluid nozzle includes a liquid inlet connector, an air inlet connector, and a nozzle. The liquid inlet connector is connected to a delivery branch pipe, and the air inlet connector is connected to a gas source delivery pipe. One end of the nozzle is provided with a plug. The nozzle has a liquid pipeline and a gas pipeline. The liquid pipeline has multiple through holes arrayed on it, and the gas pipeline has multiple air holes arrayed on it. The air holes communicate with the through holes.

3. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The cutting fluid tank is equipped with a level gauge.

4. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The delivery pipe is equipped with a pressure sensor 1 and a pressure sensor 2. The pressure sensor 1 is installed between the cutting fluid pump and the filter, and the pressure sensor 2 is located on one side of the heat exchanger.

5. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The heat exchanger is equipped with a cooling water pipe, which is connected to the condenser.

6. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The gas supply pipe is equipped with a ball valve and a pressure reducing valve.

7. The multi-wire cutting multi-fluid cooling device and processing method as described in claim 1, characterized in that: The cutting fluid, after being pumped through the cutting fluid tank and passing through pressure sensor one, is filtered by a filter. Cooling water is then delivered to the heat exchanger via a condenser to cool the cutting fluid. Subsequently, the pressure is monitored in real time again by pressure sensor two. The cutting fluid then enters nozzle one of the diamond wire cooling device to cool the diamond wire. The cutting fluid then enters nozzle two of the silicon rod cooling device to cool the top of the uncut silicon rod. After entering the dual-fluid nozzle of the silicon wafer cooling device, the cutting fluid is delivered to the dual-fluid nozzle through the gas supply pipe. The cutting fluid is then delivered into the nozzle and blown out by the gas, atomizing the cutting fluid and spraying it onto the cut silicon wafer.

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