Turnover portable microneedle module

Abstract

The invention provides a turnover portable microneedle module, and relates to the technical field of electronic product testing. Comprising an upper assembly and a lower assembly, the upper assembly comprises an upper fixing plate, a first microneedle module and a second microneedle module are fixed to the bottom of the upper fixing plate through at least two mounting blocks respectively, the lower assembly comprises a lower fixing plate, and a third microneedle module is fixed to the center of the top of the lower fixing plate; a guide assembly is arranged between the upper assembly and the lower assembly. The first microneedle module, the second microneedle module and the third microneedle module respectively correspond to the left connector, the right connector and the middle connector of the product to be tested, full connector butt joint can be achieved without forcibly bending a short Flex, the problems that due to the fact that the Flex is too short, module placement is crowded, and bending stress is too large are solved, and the integrity and the service life of Flex signal transmission are guaranteed.

Description

Technical Field

[0001] This invention relates to the technical field of electronic product testing, specifically to a flip-up portable microneedle module. Background Technology

[0002] The testing of modern electronic products, especially small-sized board-level and chip-level testing, requires a stable and efficient interface to connect the power supply, signal source, and measurement units of automated test equipment to the tiny and densely packed test points on the device under test (DUT). Based on this, the architecture of micro-needle modules and ribbon cables has emerged. The micro-needle module acts as the "tentacle," responsible for performing precise physical contact and electrical connections at the forefront. The Flex, acting as the "nerve bundle," offers advantages over cable bundles in terms of flexibility and small size, and is responsible for transmitting signals and power from the ATE (Automatic Test Equipment) to the micro-needle module without loss. It is worth noting that a complex chip or circuit board may have hundreds or even thousands of test points. The micro-needle module can integrate a high-density probe array, while the ribbon cable provides a corresponding number of parallel lines, leading out all test signals at once, enabling comprehensive parallel testing of product functions and effectively improving product testing efficiency.

[0003] Therefore, the length of the ribbon cable is crucial to the design of the microneedle module, mainly affecting signal integrity, power loss, and mechanical coupling effects. For example, a longer ribbon cable can amplify transmission line effects, leading to signal delay, impedance mismatch, and signal reflection. Simultaneously, an excessively long ribbon cable can cause a drop in the power supply voltage reaching the microneedle module and the device under test, affecting the testing accuracy of power devices and even causing functional failure. Considering these impacts, designers prioritize short ribbon cables in product design, minimizing the length of the cables used for testing. First, shorter ribbon cables reduce signal propagation delay; second, shorter ribbon cables reduce loop resistance, mitigating the impact of voltage drop on testing; finally, shorter ribbon cables experience less deformation and stress transmitted to the microneedle module under vibration, insertion, and removal scenarios, reducing the risk of solder joint fatigue and breakage, and extending service life.

[0004] However, short cables also bring a series of challenges to the design of microneedle modules, such as limited placement of the microneedle module, the close proximity between the microneedle module and the product causing scratches, and difficulty in picking up and putting down the product.

[0005] Therefore, the present invention provides a flip-up portable microneedle module. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a flip-up portable microneedle module.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a flip-up portable microneedle module, comprising an upper component and a lower component; The upper component includes an upper fixing plate, on the bottom of which a first microneedle module and a second microneedle module are respectively fixed by at least two mounting blocks; a DUT contour block is mounted on the bottom of the upper fixing plate and on the side of the mounting blocks, and a DUT stop block is rotatably connected to the outer side of the DUT contour block; a contour support block is also fixed on the bottom of the upper fixing plate, and a flip-top pressure head is provided at the end of the contour support block to press and fix the product to be tested. The lower component includes a lower fixing plate, and a third microneedle module is fixed at the top center of the lower fixing plate; A guide component is provided between the upper component and the lower component. The upper component is flipped and precisely positioned with the lower component through the guide component, so that the corresponding connector of the product under test is connected to the third micro-needle module.

[0008] The first, second, and third microneedle modules are respectively assigned to the left, right, and center connectors of the product under test (DUT). This allows for full connector mating without the need for forced bending of the short Flex connector, avoiding issues such as crowded module placement and excessive bending stress caused by excessively short Flex connectors, thus ensuring the integrity and lifespan of Flex signal transmission. Through the coordination of the upper component's DUT contour block, DUT stop block, contour support block, and flip-top pressure head with the upper and lower components' guiding positioning, the product's positional accuracy before and after flipping is ensured, meeting the electrical connection requirements for precision testing. The third microneedle module, with the upper component independently securing the product and the lower component independently installing, provides ample space for product handling, preventing scratch damage caused by excessively close proximity between the microneedle module and the product. Simultaneously, the flip-type mating process simplifies operation, lowers the skill threshold for operators, and improves testing efficiency.

[0009] In a preferred embodiment, the guide assembly includes a guide post fixed to the bottom of the upper fixed plate and a guide block fixed to the top of the lower fixed plate; the guide block has a positioning hole adapted to the guide post, and the guide post is inserted into the positioning hole to achieve positioning of the upper and lower assemblies.

[0010] The technical advantages of adopting the above-mentioned further solution are as follows: The cooperation between the guide post and the positioning hole of the guide block effectively offsets the minor deviations that may occur during the flipping of the upper component, ensuring precise alignment of the product's middle connector and the third micro-needle module after the upper component is flipped 180°, avoiding test signal interruption or product damage caused by alignment deviation. After the guide post is inserted into the positioning hole of the guide block, it forms a support structure, limiting the relative displacement between the upper and lower components, thus increasing the overall structural rigidity after docking. This prevents poor contact between the micro-needle and the connector due to vibration during testing, ensuring the stability and reliability of the test signal. The guiding effect of the guide structure allows operators to complete the docking of the upper and lower components without repeated calibration, reducing operational difficulty, shortening the preparation time for a single test, and further improving testing efficiency.

[0011] In a preferred embodiment, the mounting block is symmetrically mounted to the bottom of the upper fixing plate by bolts, and the first microneedle module and the second microneedle module are assembled on the mounting block in a one-to-one correspondence.

[0012] The technical advantages of adopting the above-mentioned further solution are as follows: The mounting block is fixed to the upper fixing plate with bolts, and the microneedle module is double-fixed by the positioning groove and screws, preventing the microneedle module from loosening or shifting during flipping and testing, ensuring the positional accuracy of the probe array, and guaranteeing the consistency of electrical connections. This allows the fixing position of the mounting block to be adjusted or a suitable mounting block to be replaced according to the connector spacing of different products under test, without the need for a complete replacement. It is compatible with testing various product specifications, reducing the investment cost of testing equipment.

[0013] In a preferred embodiment, the contour support block is disposed in the middle region of the bottom of the upper fixed plate to support the main structure of the product under test.

[0014] The technical effect of adopting the above-mentioned further solution is that the contour support block is located at the bottom center of the upper fixed plate, and the contour curved surfaces of the top and sides of the support block fully fit the product. This not only provides uniform support for the product, but also disperses the clamping force and inertial force during the flipping process, avoiding product deformation or damage caused by local stress concentration.

[0015] In a preferred embodiment, the flip-top pressure head is rotatably connected to the end of the contour support block, and the middle part of the flip-top pressure head is a planar structure, thereby pressing the product to be tested onto the upper fixed plate.

[0016] The technical effect of adopting the above-mentioned further solution is that the planar structure in the middle of the flip-top pressure head is adapted to the top contour of the product, and the two form a surface contact, providing uniform clamping force, effectively preventing the product from shaking or shifting during the flipping of the upper component, ensuring stable contact between the first micro-needle module, the second micro-needle module and the product connector, and preventing signal interruption.

[0017] In a preferred embodiment, the inner side of the DUT contour block is formed with a contour groove that matches the side of the product under test, for lateral positioning of the product under test. When the DUT block is rotated to a horizontal position, the end of the DUT block abuts against the edge of the product under test to limit the lateral displacement of the product under test.

[0018] The technical effect of adopting the above-mentioned further solution is that the contouring groove on the inner side of the DUT contouring block is perfectly matched with the side contour of the product, so that the product can be automatically positioned laterally when placed, ensuring that the left and right connectors of the product are precisely aligned with the probe arrays of the first microneedle module and the second microneedle module, without the need for manual calibration, thus improving the efficiency of operation.

[0019] In a preferred embodiment, flip handles are fixed on both sides of the lower fixing plate to assist in the flipping operation.

[0020] The technical effect of adopting the above-mentioned further solution is that the flip handle provides a stable grip point for the operator, making the 180° flip operation of the upper component more effortless and stable, avoiding the flip imbalance caused by uneven weight distribution of the upper component, and reducing the operation risk.

[0021] In a preferred embodiment, support frames are fixed on both sides of the upper fixing plate to facilitate the operator to flip the upper component to complete the assembly with the lower component.

[0022] The technical effect of adopting the above-mentioned further solution is that by fixing the support frame to both sides of the upper fixed plate with screws, a gripping point is provided for the operator, making the flipping of the upper component easier and avoiding imbalance caused by uneven force during the flipping process.

[0023] In a preferred embodiment, the first microneedle module, the second microneedle module, and the third microneedle module each include: A flip cover, which is equipped with a buckle, a pressure head spring cover plate, and a flip pre-pressure block; A floating plate, on which a connector is fixed, and a spring pin is provided below the connector; A mold core fixing base plate is provided, and the floating plate is assembled inside the mold core fixing base plate and can float relative to it. A Flex cable is connected to the mold core fixing base plate, and the Flex cable is electrically connected to the connector.

[0024] The technical advantages of adopting the above-mentioned further solutions are as follows: The three micro-needle modules use the same structure, simplifying the design, processing, and assembly process. This also facilitates subsequent maintenance or module replacement, reducing equipment production and maintenance costs. The connector, spring pins, and Flex cable are integrated into the mold core fixing base plate, shortening the signal transmission path, reducing signal loss, and ensuring the integrity of high-density test signals. The cooperation between the floating plate and the mold core fixing base plate provides tolerance compensation space for the docking of the spring pins and the product under test, avoiding poor contact problems caused by processing or assembly errors.

[0025] In a preferred embodiment, the flip cover is locked to the mold core fixing base plate by a buckle. When the flip cover is closed, the flip pre-compression block presses down on the product to be tested, and the floating plate drives the connector and spring pin to float, so that the spring pin is in contact with the test point of the product to be tested. The test signal is transmitted to the Flex cable through the spring pin and the connector.

[0026] The technical effects of adopting the above-mentioned further solution are as follows: when the flip cover is closed, the flip pre-compression block first positions the product to be tested, so that the product test point is aligned with the spring pin, avoiding the error of manual alignment and improving the testing efficiency; the floating plate drives the connector and spring pin to float adaptively, so that the spring pin and the product test point form a tight and uniform contact, which avoids damage caused by hard contact.

[0027] This invention provides a flip-up portable microneedle module. It has the following advantages: The first, second, and third micro-needle modules correspond to the left, right, and center connectors of the product under test (DUT), respectively. This allows for full connector mating without the need for forced bending of the short Flex connector, avoiding issues such as crowded module placement and excessive bending stress caused by excessively short Flex connectors. This ensures the integrity and lifespan of Flex signal transmission. Through the coordination of the upper component's DUT contour block, DUT stop block, contour support block, and flip-top pressure head with the upper and lower components' guiding positioning, the product's positional accuracy before and after flipping is ensured, meeting the electrical connection requirements for precision testing. This resolves the conflict between short ribbon cables and precise testing, balancing testing efficiency, product protection, and ease of operation, making it suitable for small-size board-level and chip-level precision testing. Attached Figure Description

[0028] Figure 1 A schematic diagram of the structure of a flip-up portable microneedle module provided by the present invention; Figure 2 A schematic diagram of the lower fixing plate structure of a flip-up portable microneedle module provided by the present invention; Figure 3 A schematic diagram of the upper fixing plate structure of a flip-up portable microneedle module provided by the present invention; Figure 4 A schematic diagram of the bottom structure of the upper fixing plate of a flip-up portable microneedle module provided by the present invention; Figure 5 This is a schematic diagram of the microneedle module structure of a flip-up portable microneedle module provided by the present invention.

[0029] Legend: 1. Upper fixing plate; 2. Lower fixing plate; 3. Mounting block; 4. First microneedle module; 5. Second microneedle module; 6. Third microneedle module; 7. Guide block; 8. Guide post; 9. DUT contour block; 10. DUT stop block; 11. Contouring support block; 12. Flip-top pressure head; 13. Support frame; 14. Flip handle; 15. Mold core fixing base plate; 16. Floating plate; 17. Connector; 18. Flip-top; 19. Buckle; 20. Pressure head spring cover plate; 21. Flip pre-compression block; 22. Flex cable. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] like Figures 1-5 As shown, this embodiment provides a technical solution: a flip-up portable microneedle module, including an upper component and a lower component that cooperate with each other to complete the fixation, microneedle alignment, and flip positioning of the product under test. The upper component includes an upper fixing plate 1, which is made of aluminum alloy. Two mounting blocks 3 are fixed to the bottom of the upper fixing plate 1 by screws. A first microneedle module 4 and a second microneedle module 5 are respectively mounted on the two mounting blocks 3, and the probe arrays of the first microneedle module 4 and the second microneedle module 5 are matched with the left and right connector contact positions of the product under test, respectively. At the bottom of the upper fixed plate 1 and on the outer side of each mounting block 3, a DUT contour block 9 is fixed with bolts. A DUT stop block 10 is rotatably connected to the outer side of the DUT contour block 9 via a pivot shaft to limit the lateral displacement of the product under test. A contour support block 11 is also fixed to the middle area of ​​the bottom of the upper fixed plate 1 with screws. The top contour of the contour support block 11 is adapted to the main structure of the product under test, providing support. A flip-top pressure head 12 is provided at the end of the contour support block 11 away from the center of the upper fixed plate 1. The product under test is fixed below the upper fixed plate 1 by the pressing action of the flip-top pressure head 12. The lower assembly includes a lower fixed plate 2, which is made of the same material as the upper fixed plate 1. A third microneedle module 6 is doubly fixed at the top center of the lower fixed plate 2 by a positioning pin and screws. The probe array of the third microneedle module 6 corresponds to the contact position of the intermediate connector of the product under test. A guide component is provided between the upper and lower components. During assembly, the upper component is rotated 180° and then accurately positioned with the lower component through the guide component. At this time, the connector in the middle of the product under test is in contact with the probe array of the third microneedle module 6, completing the full docking of the three microneedle modules with different connectors of the product. This effectively avoids problems such as limited module placement and product scratches caused by the excessively short Flex.

[0032] In this embodiment, as Figures 1-3As shown: The guide assembly includes a guide block 7 and a guide post 8. The guide post 8 is a cylindrical structure made of stainless steel, and its top is fixed to the bottom of the upper fixing plate 1 via a threaded connection. The guide block 7 is fixed to the top two sides of the lower fixing plate 2 by bolts, and the position of the guide block 7 corresponds to that of the guide post 8. The guide block 7 has a positioning hole that matches the guide post 8, and a copper sleeve matching the guide post 8 is placed inside the positioning hole. When it is necessary to connect the upper and lower components, the upper component is rotated 180° so that the guide post 8 is aligned with the positioning hole of the corresponding guide block 7. The upper component is then slowly lowered, and the guide post 8 is inserted into the positioning hole. The guiding action of the positioning hole achieves precise positioning of the upper and lower components, ensuring precise contact between the third micro-needle module 6 and the intermediate connector of the product under test. Figure 3 As shown, there are three guide posts 8, which serve as a foolproof measure and help operators place components.

[0033] In this embodiment, as Figure 1-4 As shown: The top of the mounting block 3 has a through hole that matches the threaded hole at the bottom of the upper fixing plate 1 (e.g., Figure 2 As shown, mounting blocks 3 are bolted to the left and right sides of the bottom of the upper fixing plate 1. The distance between the two mounting blocks 3 is determined according to the distance between the left and right connectors of the product under test. In this embodiment, the distance is set to 70mm. Each mounting block 3 has a positioning groove and threaded hole corresponding to the first micro-needle module 4 and the second micro-needle module 5 at its bottom. The first micro-needle module 4 and the second micro-needle module 5 are respectively embedded in the corresponding positioning groove and fixed by screws to realize assembly and replacement, which improves the stability of installation. The fixing position of the mounting block 3 can also be adjusted or a suitable mounting block 3 can be replaced according to the connector position of different products under test, which enhances the versatility of the device.

[0034] In this embodiment, as Figure 1 , Figure 3 and Figure 4 As shown: The contoured support block 11 is fixed to the middle area of ​​the bottom of the upper fixing plate 1 with screws. The length of the contoured support block 11 is adapted to the main body length of the product under test; in this embodiment, the length is 30mm and the width is 20mm. The top of the contoured support block 11 is contoured to form a support surface that completely fits the bottom contour of the product under test. When the product under test is placed on the upper component, the support surface of the contoured support block 11 is in full contact with the bottom of the product under test, which not only provides stable support for the product under test, but also disperses the pressure on the product under test, avoiding local stress concentration that could lead to product damage. At the same time, the height of the contoured support block 11 is set to 60mm to ensure that sufficient installation space is reserved between the product under test and the bottom of the upper fixing plate 1, avoiding interference with other components.

[0035] In this embodiment, as Figure 3 and Figure 4As shown: One end of the flip-top pressure head 12 is rotatably connected to the end of the contour support block 11 via a rotating shaft. The middle part of the flip-top pressure head 12 has a planar structure, which is adapted to the top contour of the product under test. After the product under test is placed on the contour support block 11 and the left and right connectors are connected to the first and second micro-needle modules, the flip-top pressure head 12 is flipped downwards, so that the middle part of the flip-top pressure head 12 presses against the top of the product under test, fixing the product under test between the upper fixing plate 1 and the flip-top pressure head 12. The rotating connection method is convenient to operate, and the clamping force is uniform, which can effectively prevent the product under test from shaking or shifting during the flipping process, ensuring stable contact between the micro-needle module and the product connector.

[0036] In this embodiment, as Figure 1-4 As shown: The inner side of the DUT contour block 9 is CNC machined with contour grooves (not shown in the figure) that perfectly match the side contour of the product under test. The depth and width of the contour grooves match the size of the product under test. When the product under test is placed on the upper component, both sides of the product under test are embedded in the corresponding contour grooves, achieving lateral positioning of the product under test and preventing the product from shifting in the width direction. The DUT stop block 10 has an L-shaped structure. The DUT stop block 10 is rotatably connected to the outside of the DUT contour block 9 via a pivot. After the product under test is placed in place, the DUT stop block 10 is rotated to a horizontal position, and the end of the DUT stop block 10 abuts against the edge of the product under test. Through the synergistic action of the two DUT stop blocks 10, the lateral displacement of the product under test is restricted, preventing the product from detaching when flipped.

[0037] In this embodiment, as Figure 2 As shown, the flip handle 14 has a cylindrical structure and is fixed to the left and right sides of the lower fixed plate 2 by bolts. The central axis of the flip handle 14 is parallel to the side of the lower fixed plate 2. When it is necessary to flip the lower component, the operator can hold the flip handles 14 on both sides with both hands to stably flip the lower component 180°. This not only reduces the difficulty of operation but also avoids direct contact between the operator and the lower component, thus preventing product contamination or structural damage, and improves the safety and convenience of operation.

[0038] In the embodiments, such as Figure 3 and Figure 4 As shown: The support frame 13 is a frame structure made of aluminum alloy. The support frame 13 is fixed to the left and right sides of the upper fixed plate 1 by screws, providing a stable gripping point for the operator, making it convenient for the operator to flip the upper component, and avoiding imbalance caused by uneven force during the flipping process.

[0039] In this embodiment, as Figure 5As shown: The first microneedle module 4, the second microneedle module 5, and the third microneedle module 6 adopt the same structural design, all including a flip cover 18, a floating plate 16, and a core fixing base plate 15. The flip cover 18 is provided with a buckle 19, a pressure head spring cover plate 20, and a flip pre-pressure block 21. A connector 17 is fixed to the surface of the floating plate 16 by bolts. Spring pins are arranged below the connector 17. The floating plate 16 is assembled inside the core fixing base plate 15 and can float within a small range. The bottom of the core fixing base plate 15 is connected to a Flex cable 22, which is electrically connected to the connector 17. When the product under test is docked with the microneedle module, the flip cover 18 is locked to the core fixing base plate 15 by the buckle 19. The flip pre-pressure block 21 closes and presses down on the product under test as the flip cover 18 closes. The floating plate 16 drives the connector 17 and the spring pins to float, so that the spring pins fit tightly with the product test points. When the flip cover 18 is closed, the flip pre-compression block 21 first positions the product to be tested to ensure that the product test point is aligned with the spring pin; at the same time, the floating characteristic of the floating plate 16 can compensate for the installation tolerance of the product or module, so that the spring pin adaptively fits the product test point; finally, the test signal is transmitted to the external test equipment through the path of the spring pin, connector 17 and Flex cable 22.

[0040] Working principle: like Figure 1-5 As shown: The operator first places the product to be tested on the contour support block 11 of the upper component, ensuring that the bottom of the product is fully in contact with the support surface of the contour support block 11. Simultaneously, the two sides of the product are embedded into the contour grooves of the DUT contour block 9. This contour structure achieves initial lateral positioning of the product, ensuring that the left and right connectors are aligned with the probe arrays of the first microneedle module 4 and the second microneedle module 5, respectively. Then, the DUT stop block 10 on the outside of the DUT contour block 9 is rotated to a horizontal position, with the end of the DUT stop block 10 abutting against the edge of the product, restricting lateral displacement. Next, the flip-top pressure head 12 is flipped downwards. Utilizing the characteristic that its central planar structure adapts to the top contour of the product, the product is pressed firmly between the upper fixing plate 1 and the flip-top pressure head 12, completing the overall fixation of the product on the upper component. At this point, the left and right connectors of the product are in stable contact with the probe arrays of the first microneedle module 4 and the second microneedle module 5, establishing a preliminary signal path. Because the middle connector of the product under test is positioned vertically relative to the left and right connectors, and its Flex length is limited, it cannot directly align with the lower module. Therefore, alignment is achieved through flipping. The operator holds the support brackets 13 on both sides of the upper fixing plate 1 and flips the upper component of the fixed product 180° so that the product faces downwards. After flipping, the three guide posts 8 fixed on the upper component are aligned with the guide blocks 7 on both sides of the lower fixing plate 2. The upper component is then slowly lowered. Using the guiding action of the guide posts 8 and the positioning holes of the guide blocks 7, the upper and lower components are aligned, ensuring precise alignment between the middle connector of the product and the probe array of the third microneedle module 6.

[0041] After the upper and lower components are positioned, the left and right connectors of the product under test (DUT) are in stable contact with the first microneedle module 4 and the second microneedle module 5, having been previously fixed. The middle connector, after being flipped and positioned, is in close contact with the probe array of the third microneedle module 6, achieving full docking of the three microneedle modules with connectors at different positions on the product. At this point, the power and signal sources of the external test equipment (ATE) are transmitted to the three microneedle modules via Flex cables. The probe arrays of the microneedle modules establish electrical paths through physical contact, transmitting test signals to various test points on the DUT, while simultaneously sending feedback signals from the product back to the test equipment, completing operations such as parameter verification or functional testing. After the test, the operator holds the support frame 13 and lifts the upper component upwards, causing the guide post 8 to disengage from the positioning hole of the guide block 7. Then, the upper component is rotated 180° to return to its initial state. Subsequently, the flip-top pressure head 12 is flipped upwards, and the DUT stop block 10 is rotated to a vertical position to release the fixing constraint on the product. The product under test can then be directly removed, completing a single test procedure.

[0042] If it is necessary to replace the microneedle module or adapt it to different products, the corresponding microneedle module can be replaced or the position of the mounting block 3 can be adjusted by removing the fixing bolts of the mounting block 3 to enhance the versatility of the device.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A reversible portable microneedle module, characterized in that, The upper assembly and the lower assembly are included. The upper assembly includes an upper fixed plate (1), the bottom of which is fixed with a first microneedle module (4) and a second microneedle module (5) respectively through at least two mounting blocks (3); a DUT profiling block (9) is mounted on the bottom of the upper fixed plate (1) and beside the mounting blocks (3), and a DUT stop block (10) is rotatably connected to the outside of the DUT profiling block (9); a profiling support block (11) is also fixed to the bottom of the upper fixed plate (1), and a flip press head (12) is arranged at the end of the profiling support block (11) to press and fix the product to be tested; The lower assembly includes a lower fixed plate (2), the top center of which is fixed with a third microneedle module (6); a guide assembly is arranged between the upper assembly and the lower assembly, the upper assembly is precisely positioned with the lower assembly after being turned over through the guide assembly, and the corresponding connector of the product to be tested is connected with the third microneedle module (6).

2. The reversible portable microneedle module of claim 1, wherein: The guide assembly includes a guide column (8) fixed to the bottom of the upper fixed plate (1) and a guide block (7) fixed to the top of the lower fixed plate (2); a positioning hole adapted to the guide column (8) is formed in the guide block (7), and the guide column (8) is inserted into the positioning hole to realize the positioning of the upper assembly and the lower assembly.

3. The reversible portable microneedle module of claim 1, wherein: The mounting blocks (3) are mounted on the bottom of the upper fixed plate (1) through bolts, and the first microneedle module (4) and the second microneedle module (5) are correspondingly assembled on the mounting blocks (3).

4. The reversible portable microneedle module of claim 1, wherein: The profiling support block (11) is arranged in the middle region of the bottom of the upper fixed plate (1) to support the main structure of the product to be tested.

5. The reversible portable microneedle module of claim 4, wherein: The flip press head (12) is rotatably connected to the end of the profiling support block (11), and the middle part of the flip press head (12) is a flat structure, so as to press the product to be tested on the upper fixed plate (1).

6. The reversible portable microneedle module of claim 1, wherein: The inner side of the DUT profiling block (9) is formed with a profiling groove adapted to the side of the product to be tested, for lateral positioning of the product to be tested; when the DUT stop block (10) is rotated to a horizontal state, the end of the DUT stop block (10) abuts against the edge of the product to be tested, so as to limit the transverse displacement of the product to be tested.

7. The reversible portable microneedle module of claim 1, wherein: The lower fixed plate (2) is fixed with a turnover handle (14) on both sides, which is used to assist the turnover operation.

8. The reversible portable microneedle module of claim 1, wherein: The upper fixed plate (1) is fixed with a support frame (13) on both sides, which is used to assist the turnover operation of the upper assembly.

9. The reversible portable microneedle module of claim 1, wherein: The first microneedle module (4), the second microneedle module (5) and the third microneedle module (6) all include: A flip cover (18) is arranged on the flip cover (18), and a buckle (19), a press head spring cover plate (20) and a turnover pre-pressing block (21) are arranged on the flip cover (18); A floating plate (16) is fixed with a connector (17), and a spring sheet needle is arranged below the connector (17); The floating plate (16) is assembled in the inside of the mold core fixing base plate (15) and can be relatively floated, the Flex ribbon (22) is connected on the mold core fixing base plate (15), and the Flex ribbon (22) is electrically connected with the connector (17).

10. The reversible portable microneedle module of claim 9, wherein: The flip cover (18) is locked with the mold core fixing base plate (15) through the buckle (19), when the flip cover (18) is closed, the flip pre-pressing block (21) presses the product to be tested, the floating plate (16) drives the connector (17) and the spring needle to adapt to the floating, so that the spring needle is attached to the test point of the product to be tested, and the test signal is transmitted to the Flex ribbon (22) through the spring needle and the connector (17).

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