A packaging structure of a diode photovoltaic module and a preparation method thereof

Abstract

The application relates to the technical field of diode photovoltaic module processing, in particular to a packaging structure and a preparation method of a diode photovoltaic module. The packaging structure comprises a support frame, stress supports are fixedly connected to the four corners of the bottom of the support frame, and a first electric push rod is fixedly connected to the bottom of the support frame; a limiting disc is fixedly connected to the top of the support frame, an arc-shaped sliding groove is embedded in the top of the limiting disc, and the telescopic end of the first electric push rod is fixedly connected with the side wall of a sliding frame; a connecting rod is slidably connected in the sliding frame, and the lower end of the connecting rod is slidably inserted into the arc-shaped sliding groove; and a connecting plate is fixedly connected to the top of the connecting rod. The negative pressure system composed of a suction pump and a suction disc can safely and non-destructively adsorb and fix a cover plate; a driving motor can drive the whole placing assembly to rotate, so that the adsorbed cover plate is turned over to a packaging position; and a second electric push rod finally accurately presses the cover plate onto the glue-filled shell.

Description

Technical Field

[0001] This invention relates to the field of diode photovoltaic module processing technology, and in particular to a packaging structure and preparation method for a diode photovoltaic module. Background Technology

[0002] Patent CN120072759A discloses a diode packaging structure and photovoltaic junction box that facilitates chip packaging. The structure includes a copper-clad laminate, one or more chip bodies are fixedly connected to the top of the copper-clad laminate, solder is fixedly connected to the right side of the top of the copper-clad laminate, a connection port is provided on the left side of the top of the copper-clad laminate, four positioning holes are opened on the surface of the copper-clad laminate, two rectangular grooves are opened on the surface of the copper-clad laminate, and a cable is fixedly connected to the left side of the copper-clad laminate.

[0003] In the aforementioned prior art, when encapsulating a module, the outer shell and internal components need to be encapsulated together by a cover, which fails to connect the outer shell, cover, and components in the same operation step, thus reducing the encapsulation time. Summary of the Invention

[0004] Therefore, the present invention provides a packaging structure and manufacturing method for a diode photovoltaic module to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a packaging structure and preparation method for a diode photovoltaic module, comprising a support frame, wherein force-bearing brackets are fixedly connected to the four corners of the bottom of the support frame, and a first electric push rod is fixedly connected to the bottom of the support frame; a limiting disk is fixedly connected to the top of the support frame, and an arc-shaped sliding groove is embedded in the top of the limiting disk; the telescopic end of the first electric push rod is fixedly connected to the side wall of the sliding frame.

[0006] A connecting rod is slidably connected inside the sliding frame, and the lower end of the connecting rod is slidably inserted into the arc-shaped groove.

[0007] A connecting plate is fixedly connected to the top of the connecting rod, and a second electric push rod is fixedly connected to the top of the connecting plate;

[0008] The telescopic end of the second electric push rod is fixedly connected to the connecting plate, and a drive motor is bolted to the side wall of the connecting plate;

[0009] The output shaft of the drive motor is fixedly connected to the side wall of the placement component and drives the placement component to rotate and connect with the side wall of the connecting plate.

[0010] Preferably, a first transmission rack is fixedly connected to the side wall of the sliding frame, the first transmission rack meshes with a drive gear, and the drive gear is rotatably connected to the top of the support frame through a torsion spring.

[0011] Preferably, the drive gear meshes with the second transmission rack, the side wall of the second transmission rack is fixedly connected to the placement disk, and a guide rod is fixedly connected to the side wall of the placement disk, the guide rod being slidably inserted into the interior of the limiting disk.

[0012] Preferably, the placement component includes a receiving frame, the side wall of which is fixedly connected to the output shaft of the drive motor, and suction cups are fixedly connected to the four corners of the top of the receiving frame. The internal space of the receiving frame is divided into an upper space and a lower space by a partition. The upper space is connected to the suction cup. A suction pump is bolted to the side wall of the receiving frame and is connected to the upper space.

[0013] Preferably, connecting components are fixedly connected to the four bottom corners of the receiving frame;

[0014] The connecting component includes a sliding frame, the top of which is fixedly connected to the bottom of the receiving frame. A drive groove is embedded in the side wall of the sliding frame, and a slide rod is slidably connected in the drive groove. One end of the slide rod is fixedly connected to the outer frame.

[0015] Preferably, a return spring is fixedly connected inside the outer frame, and the other end of the return spring is fixedly connected to the lower frame. The lower frame is slidably connected inside the outer frame. The side wall of the slide rod is rotatably connected to the first connecting rod. The other end of the first connecting rod is rotatably connected to the second connecting rod. The top of the second connecting rod is fixedly connected to the bottom of the force plate through a steel wire rope. The top of the force plate is fixedly connected to the return spring.

[0016] Preferably, the top of the reset spring is fixedly connected to the top of the sliding frame, and a contact rod is fixedly connected to the middle area of ​​the force plate, with the contact rod having a hollowed-out guide cavity.

[0017] Preferably, a one-way valve is provided at the bottom of the guide cavity, the upper end of the guide cavity is connected to the lower space, and a conveying pipe is fixedly connected to the side wall of the receiving frame, which is connected to the lower frame.

[0018] Preferably, the drive groove, slide bar, outer frame, lower frame, first connecting rod, and second connecting rod are provided in four sets, respectively arranged on the four outer peripheral walls of the sliding frame.

[0019] A method for fabricating a diode photovoltaic module includes the following steps:

[0020] S1. The fixture on the placement tray holds the outer casing, and then the placement assembly is controlled to connect the copper-clad laminate to the inside of the outer casing;

[0021] S2. Control the first electric push rod to drive the sliding frame to move left and right. The sliding frame drives the receiving frame to move through the connecting rod. While the connecting rod moves left and right, it slides in the arc-shaped slide groove. The connecting rod also slides back and forth with the assistance of the arc-shaped slide groove.

[0022] S3. While sliding, the sliding frame drives the first transmission rack to move. The first transmission rack meshes with the drive gear to rotate. The drive gear meshes with the second transmission rack to move. The second transmission rack drives the placement plate to move. When the first transmission rack and the drive gear disengage, the drive gear automatically resets and meshes with the torsion spring to drive the second transmission rack and the placement plate to reset and move. This process is repeated, so that while the guide cavity moves left and right and slides up and down, the outer shell on the placement plate shakes left and right.

[0023] S4. After the silicone potting compound is filled into the shell, the control drive motor drives the receiving frame to rotate. The receiving frame drives the suction cup and the cover plate to rotate downward. The second electric push rod drives the receiving frame to move downward. The receiving frame drives the cover plate to move downward and fix it to the shell, thus completing the encapsulation.

[0024] The beneficial effects of this invention are:

[0025] This invention utilizes a first and second connecting rod triggered by a contact rod to enable the lower frame to automatically "sense" and insert into the positioning hole of the copper-clad laminate. During lifting, the first and second connecting rods automatically open, using the lower and outer frames to expand from the inside and clamp the positioning hole, facilitating subsequent automatic alignment and connection of the positioning hole and positioning post. This avoids surface scratches that may be caused by traditional mechanical grippers, ensuring a firm and damage-free clamping experience.

[0026] The potting adhesive of the present invention is injected through a delivery pipe system, flows through the lower space and guide cavity, and finally flows out from the one-way valve at the bottom of the contact rod. The guide cavity moves left and right and shakes up and down, allowing the adhesive to flow naturally within the potting area and fully fill every gap, effectively expelling air and greatly improving the insulation, thermal conductivity and long-term reliability of the encapsulated body.

[0027] This invention utilizes a sliding frame that drives a second transmission rack via a first transmission rack and a drive gear, thereby moving the placement tray and its outer casing left and right. Simultaneously, the sliding frame, through the movement of a connecting rod in an arc-shaped groove, causes the receiving frame and the dispensing contact rod to perform compound movements of left and right and up and down, resulting in a wavy dispensing point that increases the dispensing area. This ensures that while the dispensing point is moving to dispense the adhesive, the object being dispensed is also moving in the opposite direction, creating a highly efficient relative motion that greatly optimizes the potting effect.

[0028] This invention utilizes a negative pressure system consisting of a suction pump and suction cups to safely and non-destructively adsorb and fix the cover plate. The drive motor rotates the entire placement assembly, thereby flipping the adsorbed cover plate to the sealing position. Finally, the second electric push rod precisely presses the cover plate onto the glued outer shell, completing the sealing process. The entire process is smooth and efficient, reducing the risks and errors caused by manual handling.

[0029] This invention automates the entire process from grasping, positioning, dispensing, shaking to final cover sealing, significantly reducing reliance on skilled workers and lowering labor costs and operational differences. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the prior art structure of the present invention.

[0031] Figure 2 This is a three-dimensional structural diagram of the present invention.

[0032] Figure 3 This is a top view of the present invention.

[0033] Figure 4 This is the invention Figure 3 A magnified structural diagram at point A in the diagram.

[0034] Figure 5 This is a schematic diagram of the upper and lower space structures of the present invention.

[0035] Figure 6 This is a schematic diagram of the placement tray structure of the present invention.

[0036] Figure 7 This is a schematic diagram of the connecting component structure of the present invention. Figure 1 .

[0037] Figure 8 This is a schematic diagram of the connecting component structure of the present invention. Figure 2 .

[0038] The components include: support frame-1, force-bearing bracket-2, first electric push rod-3, limiting disc-4, arc-shaped slide groove-5, sliding frame-6, connecting rod-7, connecting plate-8, second electric push rod-9, connecting plate-10, drive motor-11, placement assembly-12, first transmission rack-61, drive gear-62, second transmission rack-63, placement disc-64, receiving frame-121, suction cup-122, suction pump-123, upper space-124, lower space-125, connecting assembly-126, sliding frame-1261, drive groove-1262, slide rod-1263, outer frame-1264, lower frame-1265, first connecting rod-1266, second connecting rod-1267, force-bearing plate-1268, return spring-1269, contact rod-12610, guide cavity-12611, and delivery pipe-12612. Detailed Implementation

[0039] To further explain the technical solution of the present invention, a detailed description is provided below through specific embodiments.

[0040] like Figure 2As shown, the present invention provides a packaging structure and manufacturing method for a diode photovoltaic module, including a support frame 1, a controller fixedly connected to the support frame 1, the controller being used to make electrical connections with electrical components, and force-bearing brackets 2 fixedly connected to the four corners of the bottom of the support frame 1.

[0041] like Figure 2-8 As shown in this embodiment, the bottom of the support frame 1 is fixedly connected to a first electric push rod 3, the top of the support frame 1 is fixedly connected to a limiting disk 4, the top of the limiting disk 4 is embedded with an arc-shaped sliding groove 5, and the telescopic end of the first electric push rod 3 is fixedly connected to the side wall of the sliding frame 6.

[0042] like Figure 2-8 As shown in this embodiment, a first transmission rack 61 is fixedly connected to the side wall of the sliding frame 6. The first transmission rack 61 meshes with the drive gear 62. The drive gear 62 is rotatably connected to the top of the support frame 1 through a torsion spring. The drive gear 62 meshes with a second transmission rack 63. The side wall of the second transmission rack 63 is fixedly connected to the placement disk 64. A guide rod is fixedly connected to the side wall of the placement disk 64. The guide rod provides a limiting effect for the sliding of the placement disk 64. The guide rod slides into the interior of the limiting disk 4. The teeth on the first transmission rack 61 are intermittent, which facilitates intermittent meshing between the first transmission rack 61 and the drive gear 62.

[0043] The top of the placement plate 64 is bolted to a clamp, which facilitates the subsequent clamping of the workpiece.

[0044] like Figure 2-8 As shown in this embodiment, a connecting rod 7 is slidably connected inside the sliding frame 6. The lower end of the connecting rod 7 is slidably inserted into the arc-shaped groove 5. The sliding frame 6 is used to apply a pushing force to the connecting rod 7 and provide sliding space. A connecting plate 8 is fixedly connected to the top of the connecting rod 7. A second electric push rod 9 is fixedly connected to the top of the connecting plate 8. The telescopic end of the second electric push rod 9 is fixedly connected to the connecting plate 10 and is used to provide adjustment power to the connecting plate 10. A drive motor 11 is bolted to the side wall of the connecting plate 10. The output shaft of the drive motor 11 is fixedly connected to the side wall of the placement assembly 12 and drives the placement assembly 12 to rotate and connect with the side wall of the connecting plate 10.

[0045] like Figure 2-8As shown in this embodiment, the placement component 12 includes a receiving frame 121. The side wall of the receiving frame 121 is fixedly connected to the output shaft of the drive motor 11. The drive motor 11 drives the receiving frame 121 to rotate and adjust its position. Suction cups 122 are fixedly connected to the four corners of the top of the receiving frame 121. The suction cups 122 use negative pressure to adsorb and fix the workpiece. The internal space of the receiving frame 121 is divided into an upper space 124 and a lower space 125 by a partition. The upper space 124 is connected to the inside of the suction cups 122. A suction pump 123 is bolted to the side wall of the receiving frame 121. The suction pump 123 is connected to the inside of the upper space 124. The suction pump 123 uses negative pressure to adsorb and fix the suction cups 122.

[0046] Among them, the four bottom corners of the receiving frame 121 are fixedly connected with connecting components 126;

[0047] like Figure 2-8 As shown, in this embodiment, the connecting component 126 includes a sliding frame 1261. The top of the sliding frame 1261 is fixedly connected to the bottom of the receiving frame 121. A driving groove 1262 is embedded in the side wall of the sliding frame 1261. A sliding rod 1263 is slidably connected in the driving groove 1262. One end of the sliding rod 1263 is fixedly connected to the outer frame 1264. A return spring 1269 is fixedly connected in the outer frame 1264.

[0048] like Figure 2-8 As shown in this embodiment; the other end of the reset spring 1269 is fixedly connected to the lower frame 1265, the lower frame 1265 is slidably connected inside the outer frame 1264, the side wall of the slide rod 1263 is rotatably connected to the first connecting rod 1266, and the other end of the first connecting rod 1266 is rotatably connected to the second connecting rod 1267.

[0049] The top of the second connecting rod 1267 is fixedly connected to the bottom of the force plate 1268 by a steel wire rope. The top of the force plate 1268 is fixedly connected to the return spring 1269. The top of the return spring 1269 is fixedly connected to the top of the inner side of the sliding frame 1261. A contact rod 12610 is fixedly connected to the middle area of ​​the force plate 1268. A guide cavity 12611 is formed by hollowing out the contact rod 12610. A one-way valve is provided at the bottom of the guide cavity 12611. The upper end of the guide cavity 12611 is connected to the lower space 125. A conveying pipe 12612 is fixedly connected to the side wall of the receiving frame 121. The conveying pipe 12612 is connected to the lower frame 1265.

[0050] The drive groove 1262, slide bar 1263, outer frame 1264, lower frame 1265, first connecting rod 1266, and second connecting rod 1267 are provided in four sets, which are respectively set on the four outer peripheral walls of the sliding frame 1261.

[0051] Place the cover plate on top of the receiving frame 121 and make contact with the suction cup 122. Then control the suction pump 123 to draw out the air in the upper space 124 so that the suction cup 122 can adsorb and fix the cover plate.

[0052] like Figure 2-8 As shown, the working principle in this embodiment is as follows: A copper-clad laminate with positioning holes around its perimeter is placed on a placement tray 64. The copper-clad laminate is connected to the chip body and solder and a rectangular slot (e.g., Figure 1 (As shown), then control the second electric push rod 9 to drive the receiving frame 121 to move downward, the receiving frame 121 drives the connecting component 126 below to move downward, the bottom of the contact rod 12610 is pre-inserted into the positioning hole, and then contacts and squeezes the bottom, while the bottom of the lower frame 1265 is forced to move upward.

[0053] The contact rod 12610 moves upward, causing the force plate 1268 to move upward. The force plate 1268 then causes multiple sets of first connecting rods 1266 to move upward. These first connecting rods 1266, through the second connecting rod 1267, cause the slide rod 1263 to move inward. The slide rod 1263 causes the outer frame 1264 to move inward. The lower frame 1265 at the bottom of the outer frame 1264 contacts and slides against the surface of the copper-clad laminate. When the lower frame 1265 moves inward, its bottom contacts the positioning hole on the copper-clad laminate, and the pressure on the lower frame 1265 disappears. The lower frame 1265 then moves downward and inserts into the positioning hole. Then, the second electric push rod 9 is controlled to push the placement component 12 to move upward. The placement component 12 drives the connecting component 126 to move upward as a whole. The contact rod 12610 at the bottom of the connecting component 126 disappears from contact with the placement plate 64. The reset spring 1269 drives the force plate 1268 and the contact rod 12610 to move upward. The force plate 1268 drives multiple sets of sliding rods 1263 to move outward through the first connecting rod 1266 and the second connecting rod 1267. The sliding rods 1263 drive the outer frame 1264 and the lower frame 1265 to move outward. The outer frame 1264 and the lower frame 1265 can also clamp and fix the positioning hole of the copper-clad laminate.

[0054] When the connecting component 126 moves upward, it continues to move the copper-clad laminate upward, placing the positioning post, connecting block and terminal base station housing on the placement plate 64, and fixing them by the clamp.

[0055] The control frame 121 moves downward, which in turn moves the connecting assembly 126 downward. The connecting assembly 126 then moves the contact rod 12610 downward to contact the positioning post. (Simultaneously, external silicone potting compound is delivered into the lower space 125, then enters the guide cavity 12611 within the contact rod 12610 through the lower space 125, and is then delivered downward through the contact rod 12610. For example, in the area where the copper-clad laminate enters the housing but is not connected to the positioning post inside the housing, there is a filling portion between the copper-clad laminate and the housing positioning post.) The silicone potting compound can be applied in segments. The positioning post applies a pushing force to the contact rod 12610. The contact rod 12610 indirectly drives the outer frame 1264 and the lower frame 1265 to move inward. The outer frame 1264 and the lower frame 1265 lose the pressure on the positioning hole of the copper-clad laminate. The copper-clad laminate automatically slides downward and disengages from the contact with the outer frame 1264 and the lower frame 1265. The positioning hole on the copper-clad laminate slides into the positioning post and completes the connection between the copper-clad laminate and the positioning post on the terminal base station inside the shell. This controls the receiving frame 121 to move upward.

[0056] At the same time, the external silicone potting compound is delivered into the lower space 125, and then enters the guide cavity 12611 in the contact rod 12610 through the lower space 125, and is delivered downward to the lower housing through the contact rod 12610. It is convenient to fill part of the silicone potting compound between the copper clad laminate and the housing positioning post in the area where the copper clad laminate enters the housing but is not connected to the positioning post in the housing.

[0057] The first electric push rod 3 is controlled to drive the sliding frame 6 to move left and right. The sliding frame 6 drives the receiving frame 121 to move through the connecting rod 7. While moving left and right, the connecting rod 7 slides in the arc-shaped slide groove 5. The connecting rod 7 slides back and forth with the assistance of the arc-shaped slide groove 5.

[0058] While sliding, the sliding frame 6 drives the first transmission rack 61 to move. The first transmission rack 61 meshes with the drive gear 62 to rotate. The drive gear 62 meshes with the second transmission rack 63 to move. The second transmission rack 63 drives the placement disk 64 to move. When the first transmission rack 61 and the drive gear 62 disengage, the drive gear 62 automatically resets and meshes with the torsion spring, driving the second transmission rack 63 and the placement disk 64 to reset and move. This process repeats, causing the guide cavity 12611 to move left and right while sliding up and down, and the outer shell on the placement disk 64 to sway left and right.

[0059] After the silicone potting compound is filled into the shell, the drive motor 11 drives the receiving frame 121 to rotate. The receiving frame 121 drives the suction cup 122 and the cover plate to rotate downward. The second electric push rod 9 drives the receiving frame 121 to move downward. The receiving frame 121 drives the cover plate to move downward and fix it to the shell, thus completing the encapsulation.

[0060] This invention utilizes a first connecting rod 1266 and a second connecting rod 1267 triggered by a contact rod 12610 to enable the lower frame 1265 to automatically "sense" and insert into the positioning hole of the copper-clad laminate. During lifting, the first connecting rod 1266 and the second connecting rod 1267 automatically open, and the lower frame 1265 and the outer frame 1264 expand from the inside to clamp the positioning hole, facilitating the subsequent automatic alignment and connection of the positioning hole and the positioning post. This avoids surface scratches that may be caused by traditional mechanical grippers, and the clamping is firm and damage-free.

[0061] The potting adhesive of the present invention is injected into the system through the delivery pipe 12612, flows through the lower space 125 and the guide cavity 12611, and finally flows out from the one-way valve at the bottom of the contact rod 1210. The guide cavity 12611 moves left and right and shakes up and down, allowing the adhesive to flow naturally in the potting area and fully fill every gap, effectively expelling air and greatly improving the insulation, thermal conductivity and long-term reliability of the encapsulated body.

[0062] In this invention, the sliding frame 6 drives the second transmission rack 63 to move via the first transmission rack 61 and the drive gear 62, thereby driving the placement tray 64 and its outer shell to move left and right. At the same time, the sliding frame 6 moves in the arc-shaped groove 5 via the connecting rod 7, causing the receiving frame 121 and the glue dispensing contact rod 12610 to perform compound movements of left and right and up and down. This makes the glue dispensing point wavy, increasing the glue dispensing area and ensuring that the glued object moves in the opposite direction while the glue dispensing point moves to dispense glue, forming a highly efficient relative motion and greatly optimizing the potting effect.

[0063] The present invention uses a negative pressure system composed of a suction pump 123 and a suction cup 122 to safely and non-destructively adsorb and fix the cover plate; the drive motor 11 can drive the entire placement assembly 12 to rotate, thereby flipping the adsorbed cover plate to the sealing position; the second electric push rod 9 finally presses the cover plate precisely onto the glued shell to complete the sealing. The whole process is smooth and efficient, reducing the risks and errors caused by manual handling.

[0064] This invention automates the entire process from grasping, positioning, dispensing, shaking to final cover sealing, significantly reducing reliance on skilled workers and lowering labor costs and operational differences.

[0065] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging structure for a diode photovoltaic module, comprising a support frame (1), wherein force-bearing brackets (2) are fixedly connected to the four corners of the bottom of the support frame (1), and a first electric push rod (3) is fixedly connected to the bottom of the support frame (1). Its features are: The support frame (1) is fixedly connected to the top of the limiting plate (4), and the top of the limiting plate (4) is embedded with an arc-shaped sliding groove (5). The telescopic end of the first electric push rod (3) is fixedly connected to the side wall of the sliding frame (6). A connecting rod (7) is slidably connected inside the sliding frame (6), and the lower end of the connecting rod (7) is slidably inserted into the arc-shaped groove (5); The top of the connecting rod (7) is fixedly connected to a connecting plate (8), and the top of the connecting plate (8) is fixedly connected to a second electric push rod (9). The telescopic end of the second electric push rod (9) is fixedly connected to the connecting plate (10), and the side wall of the connecting plate (10) is bolted with a drive motor (11). The output shaft of the drive motor (11) is fixedly connected to the side wall of the placement component (12) and drives the placement component (12) to rotate and connect with the side wall of the connecting plate (10).

2. The packaging structure of a diode photovoltaic module according to claim 1, characterized in that: The sliding frame (6) has a first transmission rack (61) fixedly connected to its side wall. The first transmission rack (61) meshes with a drive gear (62). The drive gear (62) is rotatably connected to the top of the support frame (1) via a torsion spring.

3. The packaging structure of a diode photovoltaic module according to claim 2, characterized in that: The drive gear (62) meshes with the second transmission rack (63), the side wall of the second transmission rack (63) is fixedly connected to the placement disk (64), and a guide rod is fixedly connected to the side wall of the placement disk (64), the guide rod being slidably inserted into the interior of the limiting disk (4).

4. The packaging structure of a diode photovoltaic module according to claim 3, characterized in that: The placement component (12) includes a receiving frame (121), the side wall of the receiving frame (121) is fixedly connected to the output shaft of the drive motor (11), and suction cups (122) are fixedly connected to the four corners of the top of the receiving frame (121). The internal space of the receiving frame (121) is divided into an upper space (124) and a lower space (125) by a partition. The upper space (124) is connected to the suction cup (122). A suction pump (123) is bolted to the side wall of the receiving frame (121), and the suction pump (123) is connected to the upper space (124).

5. The packaging structure of a diode photovoltaic module according to claim 4, characterized in that: Connecting components (126) are fixedly connected to the four bottom corners of the receiving frame (121). The connecting component (126) includes a sliding frame (1261), the top of which is fixedly connected to the bottom of the receiving frame (121), and a driving groove (1262) is embedded in the side wall of the sliding frame (1261). A sliding rod (1263) is slidably connected in the driving groove (1262), and one end of the sliding rod (1263) is fixedly connected to the outer frame (1264).

6. The packaging structure of a diode photovoltaic module according to claim 5, characterized in that: A reset spring (1269) is fixedly connected inside the outer frame (1264). The other end of the reset spring (1269) is fixedly connected to the lower frame (1265). The lower frame (1265) is slidably connected inside the outer frame (1264). The side wall of the slide rod (1263) is rotatably connected to the first connecting rod (1266). The other end of the first connecting rod (1266) is rotatably connected to the second connecting rod (1267). The top of the second connecting rod (1267) is fixedly connected to the bottom of the force plate (1268) through a steel wire rope. The top of the force plate (1268) is fixedly connected to the reset spring (1269).

7. The packaging structure of a diode photovoltaic module according to claim 6, characterized in that: The top of the reset spring (1269) is fixedly connected to the top of the sliding frame (1261), and a contact rod (12610) is fixedly connected to the middle area of ​​the force plate (1268). The contact rod (12610) is hollowed out to form a guide cavity (12611).

8. The packaging structure of a diode photovoltaic module according to claim 7, characterized in that: A one-way valve is provided at the bottom of the guide cavity (12611). The upper end of the guide cavity (12611) is connected to the lower space (125). A conveying pipe (12612) is fixedly connected to the side wall of the receiving frame (121). The conveying pipe (12612) is connected to the lower frame (1265).

9. The packaging structure of a diode photovoltaic module according to claim 6, characterized in that: The drive groove (1262), slide bar (1263), outer frame (1264), lower frame (1265), first connecting rod (1266), and second connecting rod (1267) are provided in four sets, respectively set on the four outer peripheral walls of the sliding frame (1261).

10. A method for fabricating a diode photovoltaic module, employing the packaging structure of a diode photovoltaic module as described in claim 8, characterized in that: Includes the following steps: S1. The fixture on the placement tray (64) holds the outer casing, and then the placement assembly (12) connects the copper-clad laminate to the inside of the outer casing. S2. Control the first electric push rod (3) to drive the sliding frame (6) to move left and right. The sliding frame (6) drives the receiving frame (121) to move through the connecting rod (7). The connecting rod (7) slides in the arc-shaped slide groove (5) while moving left and right. The connecting rod (7) slides back and forth with the assistance of the arc-shaped slide groove (5). S3. While sliding, the sliding frame (6) drives the first transmission rack (61) to move. The first transmission rack (61) meshes and drives the drive gear (62) to rotate. The drive gear (62) meshes and drives the second transmission rack (63) to move. The second transmission rack (63) drives the placement plate (64) to move. When the first transmission rack (61) and the drive gear (62) disengage, the drive gear (62) automatically resets and meshes through the torsion spring, driving the second transmission rack (63) and the placement plate (64) to reset and move. This process is repeated, causing the guide cavity (12611) to move left and right while sliding up and down, and the outer shell on the placement plate (64) to sway left and right. S4. After the silicone potting compound is filled into the shell, the control drive motor (11) drives the receiving frame (121) to rotate. The receiving frame (121) drives the suction cup (122) and the cover plate to rotate downward. The second electric push rod (9) drives the receiving frame (121) to move downward. The receiving frame (121) drives the cover plate to move downward and fix it to the shell, thus completing the encapsulation.

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