Glass etching liquid, cover plate glass and preparation method of cover plate glass

Abstract

The invention relates to glass etching liquid, cover plate glass and a preparation method of the cover plate glass. The glass etching liquid comprises the following components in percentage by mass: 1%-10% of hydrofluoric acid, 45%-60% of inorganic acid and 30%-54% of water, the inorganic acid comprises one or more of sulfuric acid, hydrochloric acid and nitric acid. When the glass etching liquid is used for treating the concave-convex surface of the glass, the roughness of the surface of the glass can be effectively reduced.

Description

Technical Field

[0001] This application relates to the field of glass processing technology, and in particular to glass etching solutions, cover glass, and methods for their preparation. Background Technology

[0002] To meet the usage requirements of mobile phones and other electronic products, the edge area of ​​the glass cover usually needs to have a certain curvature, which means that the edge needs to be CNC machined to form a side wall with chamfers and straight sides.

[0003] However, the high surface roughness of the CNC-machined glass sidewalls not only results in a matte appearance in some areas but also reduces the overall four-point bending strength (4PB) of the cover glass. To address this issue, the industry typically adds an extra edge polishing process to reduce the roughness of the straight sections. This involves stacking the glass cover products, fitting them into a specific fixture with all edges uniformly exposed, and then placing the fixture into an edge polishing machine. The chamfered edges and straight sections are then polished using a corresponding polishing jig with a buffing wheel until the edges are shiny. This edge polishing process is time-consuming, and the stacking / splitting requires manual operation, leading to reduced production efficiency and increased production costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a glass etching solution, cover glass, and preparation method thereof that can effectively reduce sidewall roughness and improve four-point bending strength, and are applicable to simple processes.

[0005] In a first aspect, this application provides a glass etching solution.

[0006] A glass etching solution, by weight percentage, comprises the following components:

[0007] Hydrofluoric acid 1%~10%,

[0008] Inorganic acids 45%~60%, and

[0009] Water content 30%~54%;

[0010] The inorganic acid includes one or more of sulfuric acid, hydrochloric acid, and nitric acid.

[0011] In some embodiments, the glass etching solution further includes 0.5% to 5% organic additives by mass percentage; the organic additives include one or more of ethylene glycol, glycerin, polyethylene glycol, and ethyl acetate.

[0012] In a second aspect, this application provides a method for preparing a cover glass.

[0013] A method for preparing a cover glass includes the following steps:

[0014] A semi-finished cover plate is obtained, the semi-finished cover plate including an upper surface and a lower surface disposed opposite to each other, and a side wall connecting the upper surface and the lower surface;

[0015] The sidewalls of the semi-finished cover plate are polished using the glass etching solution described above to prepare the cover glass.

[0016] In some embodiments, the polishing process takes 20s to 300s; and / or

[0017] The polishing temperature is 15℃~50℃.

[0018] In some embodiments, the method for preparing the cover glass further includes:

[0019] The polished semi-finished cover plate is then cleaned and tempered.

[0020] In some embodiments, the vertical distance between the upper surface and the lower surface is 0.3 mm to 1 mm.

[0021] In some embodiments, the sidewalls are obtained by CNC machining.

[0022] In some embodiments, the upper and lower surfaces of the semi-finished cover plate have acid-resistant layers.

[0023] In some embodiments, the thickness, composition, and preparation method of the acid-resistant layer are specified.

[0024] In some embodiments, the method for preparing the cover glass further includes, prior to the polishing process:

[0025] Remove the acid-resistant layer near the sidewall, with a removal width greater than or equal to 0.5 mm.

[0026] In a third aspect, this application provides a cover glass.

[0027] A cover glass is prepared using the cover glass preparation method described above.

[0028] When treating the uneven surface of glass with the above-mentioned glass etching solution, the bumps have a larger specific surface area and a larger contact area with the glass etching solution, thus the glass etching solution has a higher etching efficiency for the bumps. Furthermore, the above-mentioned glass etching solution provides a large amount of H₂ by adding a high concentration of inorganic acid. +It can effectively promote the dissolution of etching products, thereby significantly reducing the problem of etching products re-attaching to uneven surfaces, thus providing a stable etching environment. Under the action of a specific amount of hydrofluoric acid, the height of uneven sites on the glass surface tends to be consistent as etching progresses, effectively reducing the roughness of the glass surface. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the cross-sectional structure of a semi-finished cover plate according to one embodiment of this application.

[0031] Figure 2 This is a roughness test diagram of the straight section of the sidewall of the cover glass of Comparative Example 7 of this application.

[0032] Figure 3 This is a roughness test diagram of the straight section of the sidewall of the cover glass of Embodiment 1 of this application.

[0033] Figure 4 This is a roughness test diagram of the straight section of the sidewall of the cover glass in Embodiment 14 of this application.

[0034] Figure 5 This is a topographic view of the sidewall of the semi-finished cover plate of Comparative Example 1.

[0035] Figure 6 This is an image showing the surface morphology of the sidewall of the cover glass in the control group.

[0036] Figure 7 This is a topographic view of the sidewall of the cover glass in Example 14.

[0037] Figure 8 The images show actual photos of the cover glass for Comparative Example 1, the control group, and Example 14. Detailed Implementation

[0038] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. In this application, "at least one" means one or more, such as one, two, or more than two. "Multiple" or "several" means at least two, such as two, three, etc.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0042] Unless otherwise specified, all steps in this application may be performed sequentially or randomly. For example, the method includes steps (a) and (b), indicating that the method may include steps (a) and (b) performed sequentially, or it may include steps (b) and (a) performed sequentially. For example, the method may also include step (c), indicating that step (c) may be added to the method in any order. For example, the method may include steps (a), (b), and (c), or it may include steps (a), (c), and (b), or it may include steps (c), (a), and (b), etc.

[0043] In this application, "above" or "below" includes the number itself. For example, "below 1" includes 1.

[0044] Unless otherwise specified, the temperature parameters in this application are permitted to be either constant-temperature treatment or variations within a certain temperature range. It should be understood that the constant-temperature treatment allows temperature fluctuations within the precision range of the instrument control, such as ±5℃, ±4℃, ±3℃, ±2℃, or ±1℃.

[0045] In a first aspect, this application provides a glass etching solution that can effectively reduce sidewall roughness and improve four-point bending strength, and is applicable to simple processes.

[0046] For example, by weight percentage, the glass etching solution comprises the following components:

[0047] Hydrofluoric acid 1%~10%,

[0048] Inorganic acids 45%~60%, and

[0049] Water content 30%~54%;

[0050] Inorganic acids include one or more of sulfuric acid, hydrochloric acid, and nitric acid.

[0051] When treating the uneven surface of glass with the above-mentioned glass etching solution, the bumps have a larger specific surface area and a larger contact area with the glass etching solution, thus the glass etching solution has a higher etching efficiency for the bumps. Furthermore, the above-mentioned glass etching solution provides a large amount of H₂ by adding a high concentration of inorganic acid. + It can effectively promote the dissolution of etching products, thereby significantly reducing the problem of etching products re-attaching to uneven surfaces, and thus providing a stable etching environment. Under the action of a specific amount of hydrofluoric acid, the height of uneven sites on the glass surface tends to be consistent as etching progresses, effectively reducing the roughness of the glass surface.

[0052] It should be noted that hydrofluoric acid is a common etching solution that can be used to repair microcracks on glass surfaces and improve mechanical strength. However, repairing microcracks and the resulting increase in mechanical strength does not necessarily mean that the roughness of the glass surface has been effectively reduced. The most direct evidence of this is that traditional hydrofluoric acid etching solutions cannot produce a surface polishing effect, and in roughness tests, the salinity (Sa) of the etched surface does not show significant improvement. The inventors discovered that hydrofluoric acid etching produces insoluble precipitates, which have an uncontrollable impact on the etching process, making it impossible to reduce roughness. Further research revealed that controlling the H+ in the etching system... + Once a certain concentration is reached, the amount of precipitate is greatly reduced, and the uncontrollable influencing factors are significantly reduced. Only on this basis can the effect of reducing surface roughness become possible.

[0053] In this embodiment, the hydrofluoric acid content in the glass etching solution can be, but is not limited to, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, or other values ​​within the range of 1% to 10%. If the concentration of hydrofluoric acid is too high, the etching rate will be too fast and unstable, making it difficult to reduce surface roughness. Maintaining the hydrofluoric acid content within the above-mentioned range can achieve a more stable etching effect. Optionally, the hydrofluoric acid content in the glass etching solution can be 3% to 8%.

[0054] In this embodiment, the inorganic acid content in the glass etching solution can be, but is not limited to, 45%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, or other values ​​within the range of 45% to 60%. If the concentration of inorganic acid is too low, there will not be a sufficient concentration of H+ in the glass etching solution, making it difficult to reduce roughness. If the concentration of inorganic acid is too high, it will crowd out the water content, which will also lead to the re-adhesion of deposits, making it difficult to reduce roughness. Optionally, the inorganic acid content in the glass etching solution can be 52% to 58%.

[0055] In this embodiment, the water content in the glass etching solution can be, but is not limited to, 30%, 35%, 40%, 45%, 50%, 54%, or other values ​​within the range of 30% to 54%.

[0056] In some embodiments, the inorganic acid is sulfuric acid. To reduce the surface roughness of the glass, the glass etching solution needs to possess stable performance. At high temperatures, sulfuric acid has low volatility and is not easily decomposed, thus achieving relatively good results.

[0057] In some embodiments, the glass etching solution further includes 0.5% to 5% organic additives by weight percentage. Optionally, the content of organic additives in the glass etching solution can be, but is not limited to, 0.5%, 1%, 2%, 3%, 4%, 5%, or other values ​​within the range of 1% to 5%. Optionally, the glass etching solution further includes 0.5% to 3% organic additives.

[0058] In some embodiments, the organic additives include one or more of ethylene glycol, glycerin, polyethylene glycol, and ethyl acetate. The use of organic additives can buffer the chemical reaction and suppress etching defects such as over-etching. However, if the concentration is too high, it can cause a significant decrease in etching rate and render the roughness reduction effect ineffective, or even cause the roughness to increase.

[0059] In a second aspect, this application provides a method for preparing a cover glass.

[0060] For example, a method for preparing cover glass includes the following steps:

[0061] A semi-finished cover plate is obtained, which includes an upper surface and a lower surface that are arranged opposite to each other, and a sidewall connecting the upper surface and the lower surface.

[0062] The sidewalls of the semi-finished cover plate are polished using the glass etching solution described above to prepare the cover glass.

[0063] In some embodiments, the sidewalls are obtained by CNC machining.

[0064] In this application, the semi-finished cover plate refers to the product obtained after the substrate has been uncoiled, slited, and CNC machined. At this time, the CNC machined area has a high roughness, which not only gives it a matte appearance but also results in poor durability due to structural stress, making it unusable as a finished product. Therefore, the CNC machined area needs to be polished to improve its appearance.

[0065] In some embodiments, the average roughness of the sidewalls is 300 nm to 600 nm.

[0066] In some embodiments, the vertical distance between the upper surface and the lower surface of the cover glass is 0.3 mm to 1 mm. Optionally, the vertical distance between the upper surface and the lower surface can be, but is not limited to, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, or other values ​​within the range of 0.3 mm to 1 mm. It is understood that in some embodiments, the vertical distance between the upper surface and the lower surface of the cover glass is the thickness of the substrate.

[0067] Please see Figure 1 , Figure 1 This is a cross-sectional structural diagram of a semi-finished cover plate according to one embodiment of this application. In some embodiments, the sidewall of the semi-finished cover plate includes a straight section perpendicular to the upper and lower surfaces, and a chamfer connecting the upper and lower surfaces. The straight section connects the upper and lower surfaces through the chamfer.

[0068] In some embodiments, the width of the straight section is 30% to 95% of the maximum thickness of the cover glass.

[0069] In some embodiments, the width of the chamfer is 0.05mm to 0.3mm.

[0070] The above-mentioned method for preparing cover glass can effectively reduce the side wall roughness of the semi-finished cover glass after CNC processing, and obtain cover glass with a glossy side wall and a high 4PB value. Compared with the traditional edge polishing process, it has the advantages of simple process and high efficiency.

[0071] In some embodiments, the polishing time is 20s to 1200s. Optionally, the polishing time can be, but is not limited to, 20s, 50s, 100s, 200s, 300s, 400s, 500s, 600s, 700s, 800s, 900s, 1000s, 1100s, 1200s, or other values ​​within the range of 20s to 1200s. The polishing time is positively correlated with the etching amount; therefore, the polishing time can be adjusted according to specific needs and desired results. Studies have shown that as polishing continues, roughness will continuously improve within a certain range, but as time increases, the improvement becomes less significant or even worsens, and it can also affect the upper and lower surfaces. Optionally, for semi-finished cover plates with a thickness of 0.1mm to 1mm, the polishing time is 20s to 300s.

[0072] In some embodiments, the polishing temperature is 15°C to 50°C. Optionally, the polishing temperature can be, but is not limited to, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, or other values ​​within the range of 15°C to 50°C. If the polishing temperature is too low, the etching progress is slow and inefficient, and the solubility of sulfates will also decrease significantly, resulting in a reduced roughness improvement effect. If the polishing temperature is too high, the etching rate will be too fast and unstable, making it difficult to reduce roughness. Furthermore, HF is volatile, and excessively high temperatures pose a safety risk.

[0073] In some embodiments, the method for preparing the semi-finished cover plate includes:

[0074] Obtain the substrate, unwind the substrate, and perform CNC processing on the edge area of ​​the unwound substrate to form sidewalls, thus obtaining a semi-finished cover plate.

[0075] In some embodiments, the substrate includes one or more of Asahi Glass DTPRO Corning GG3 and Corning GG8.

[0076] In some embodiments, the method for preparing the cover glass further includes:

[0077] The polished semi-finished cover plate undergoes cleaning and tempering. The cleaning process removes impurities and surface coatings, such as the acid-resistant layer.

[0078] In some embodiments, the upper and lower surfaces of the semi-finished cover plate have an acid-resistant layer. The acid-resistant ink protects the upper and lower surfaces of the semi-finished cover plate from the etching effects of the glass etching solution.

[0079] In some embodiments, the method for preparing the semi-finished cover plate includes:

[0080] The substrate is obtained, and acid-resistant ink is roll-printed onto its surface to form an acid-resistant layer. Then, it is unwound, and the edge areas are processed using CNC machining to form sidewalls, resulting in a semi-finished cover plate. It is understood that after unwinding and CNC machining, the edge areas, under the action of cutting, do not have an acid-resistant layer on their surface.

[0081] In some embodiments, the acid-resistant layer is made of modified phenolic resin.

[0082] In some embodiments, the thickness of the acid-resistant layer is 0.05 mm to 0.4 mm. Optionally, the thickness of the acid-resistant layer can be, but is not limited to, 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or other values ​​within the range of 0.05 mm to 0.4 mm.

[0083] In some embodiments, before polishing, the acid-resistant layer near the sidewall is removed, with a removal width greater than or equal to 0.5 mm. Studies have shown that in the early stages of polishing, the surface of the sidewall connected to the upper and lower surfaces does not have an acid-resistant layer, resulting in minimal impact. However, as the polishing process continues and a certain etching amount is reached, the ink layer at the boundary gradually becomes prominent and partially detaches onto the sidewall, affecting the etching progress at the sidewall chamfer. This not only increases roughness but can even lead to a decrease in 4PB. In this embodiment, by pre-removing a portion of the acid-resistant layer at the boundary, the aforementioned problems can be effectively avoided. It is understood that the removal width refers to the distance extending in a direction perpendicular to the tangent at the edge of the acid-resistant layer.

[0084] In some embodiments, the removal of the acid-resistant layer includes cleaning. Alternatively, areas where the acid-resistant layer needs to be retained are locally masked, and the boundary acid-resistant layer is quickly removed by overall cleaning.

[0085] In some implementations, the acid-resistant layer is removed before polishing. It is understood that removing the entire acid-resistant layer helps improve product yield.

[0086] In a third aspect, this application provides a cover glass.

[0087] A cover glass is prepared using the cover glass preparation method described above.

[0088] The present application will be further described in detail below with reference to specific embodiments.

[0089] Unless otherwise specified, the raw materials used in the following specific embodiments and comparative examples are all commercially available products; the instruments used are all commercially available products; and the processes used are all conventionally selected by those skilled in the art unless otherwise specified.

[0090] Example 1

[0091] This embodiment provides a cover glass. The method for preparing the cover glass is as follows:

[0092] Using 0.5mm thick Asahi Glass DTPRO as the substrate, a modified phenolic resin acid-resistant layer is screen-printed. After unwinding, a standard processing size of 161*74mm is obtained. CNC machining is then performed to obtain a product with the following characteristics: Figure 1 The semi-finished cover plate with side wall structure shown has a chamfer width of 0.1 mm and a straight body width of 0.3 mm.

[0093] The semi-finished cover plate is immersed in glass etching solution and polished at 30°C for 30 seconds to obtain the cover glass.

[0094] The glass etching solution, by mass percentage, consists of 5% hydrofluoric acid, 55% sulfuric acid, 2% ethylene glycol, and the remainder water.

[0095] Examples 2-11

[0096] Examples 2-11 provide a cover glass. Compared with Example 1, the difference in the preparation method of the cover glass lies in the polishing conditions and the specific composition of the glass etching solution. For details, please refer to Table 1.

[0097] Examples 12-14

[0098] Examples 12-14 provide a cover glass. The preparation method of the cover glass is as follows:

[0099] Clean the surface of the semi-finished cover plate to remove the acid-resistant layer;

[0100] The semi-finished cover plate is immersed in a glass etching solution for polishing to obtain the cover glass. Please refer to Table 1 for details on the polishing process and the composition of the glass etching solution.

[0101] Example 15

[0102] This embodiment provides a cover glass. This embodiment is basically the same as embodiment 14, except that: the surface of the semi-finished cover glass is covered with a masking film with a size of 157*68mm, and a 2mm non-masked area is reserved on the four sides of the semi-finished cover glass for local surface cleaning.

[0103] Comparative Examples 1-7

[0104] Comparative Example 1 is a semi-finished cover plate of Example 1.

[0105] Comparative Examples 2-7 provide a cover glass. Compared with Example 1, the difference in the preparation method of the cover glass lies in the polishing conditions and the specific composition of the glass etching solution, as shown in Table 1.

[0106] control group

[0107] The control group was provided with a cover glass.

[0108] The control group was basically the same as Example 1, except that the sidewalls of the semi-finished cover plate were mechanically polished using a side polishing machine to obtain the cover glass.

[0109] Test case

[0110] Roughness testing method: Surface morphology testing is performed using a white light interferometer to confirm the roughness status of the straight sections of the product's sidewalls. Each verification test consists of 5 products, with 5 points randomly selected for testing on each product. The final result is the average of 25 data points. Please refer to [link to relevant documentation]. Figures 2-8 ,in, Figures 2-4 The figures show the surface roughness Sa test results for Comparative Examples 7, 1, and 14, respectively. Figures 5-7 The images show the appearance morphology of the sidewalls of Comparative Example 1, Control Group, and Example 14, respectively. Figure 8 The images show actual photos of the cover glass for Comparative Example 1, the control group, and Example 14.

[0111] Etching amount: Represents the average reduction in length and width dimensions of the cover glass before and after acid etching.

[0112] 4PB (Four-Point Bending) Test Method: Use a dedicated four-point bending tester. Each group of 30 products is tested for verification. The specific result is based on the B10 result calculated from the strength data of the 30 products.

[0113] Table 1. Preparation conditions and test data of the examples, comparative examples, and control groups.

[0114]

[0115] Based on the experimental data in Table 1, as shown in Examples 1-11, the roughness gradually decreases with increasing polishing time. However, when the etching amount is high, the acid-resistant layer at the boundary peels off, affecting the etching uniformity at the chamfer position and causing a decrease in the 4PB value. Furthermore, low temperatures result in insignificant improvements in roughness and 4PB, while excessively high temperatures reduce the stability of the acid-resistant layer, potentially worsening 4PB. Within a certain concentration range, HF concentration has a relatively small effect on roughness reduction, but higher concentrations of HF lead to increased roughness and decreased 4PB. Finally, low concentrations of organic additives have a relatively small effect on roughness, but high concentrations result in poorer roughness improvement and a worse 4PB.

[0116] As can be seen from Examples 12-15, the acid etching process does not have an acid-resistant layer, which is more conducive to the reduction of roughness and can further improve 4PB.

[0117] As can be seen from Examples 2-5, hydrofluoric acid and sulfuric acid can only reduce the surface roughness and improve the product 4PB when they are combined in a certain proportion. HF alone, sulfuric acid alone, or improper ratio of the two can not effectively reduce the surface roughness and improve the product 4PB.

[0118] From Table 1 and Figure 8 It is evident that the polishing process of this application can effectively improve the smoothness and 4PB value of the sidewall of the CNC-processed cover glass, transforming the sidewall from a frosted surface to a reflective surface, with a processing effect comparable to that of traditional edge polishing processes.

[0119] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0120] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this invention patent should be determined by the appended claims, and the specification can be used to interpret the content of the claims.

Claims

1. A glass etching solution, characterized in that, The glass etching solution comprises the following components by weight percentage: Hydrofluoric acid 1%~10%, Inorganic acids 45%~60%, and Water content 30%~54%; The inorganic acid includes one or more of sulfuric acid, hydrochloric acid, and nitric acid.

2. The glass etching solution according to claim 1, characterized in that, The glass etching solution further includes 0.5% to 5% organic additives by mass percentage; the organic additives include one or more of ethylene glycol, glycerin, polyethylene glycol and ethyl acetate.

3. A method for preparing a cover glass, characterized in that, Includes the following steps: A semi-finished cover plate is obtained, the semi-finished cover plate including an upper surface and a lower surface disposed opposite to each other, and a side wall connecting the upper surface and the lower surface; The sidewall of the semi-finished cover plate is polished using the glass etching solution described in any one of claims 1 to 2 to prepare the cover glass.

4. The method for preparing cover glass according to claim 3, characterized in that, The polishing process takes 20s to 300s; and / or The polishing temperature is 15℃~50℃.

5. The method for preparing cover glass according to claim 3, characterized in that, The method for preparing the cover glass further includes: The polished semi-finished cover plate is then cleaned and tempered.

6. The method for preparing cover glass according to any one of claims 3 to 5, characterized in that, The vertical distance between the upper surface and the lower surface is 0.3mm to 1mm.

7. The method for preparing cover glass according to any one of claims 3 to 5, characterized in that, The sidewalls are obtained through CNC machining.

8. The method for preparing cover glass according to any one of claims 3 to 5, characterized in that, The upper and lower surfaces of the semi-finished cover plate have acid-resistant layers.

9. The method for preparing cover glass according to claim 8, characterized in that, Before performing the polishing process, the method for preparing the cover glass further includes: Remove the acid-resistant layer near the sidewall, with a removal width greater than or equal to 0.5 mm.

10. A glass article, characterized in that, The cover glass is prepared using the method described in any one of claims 3 to 9.

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