Epoxy group-containing titanate-silicate ester oligomer, boiling-resistant epoxy heat-conducting thermosetting adhesive film, preparation method of boiling-resistant epoxy heat-conducting thermosetting adhesive film and electronic instrument

Abstract

The invention provides an epoxy group-containing titanate-silicate ester oligomer, a boiling-resistant epoxy heat-conducting thermosetting adhesive film, a preparation method of the boiling-resistant epoxy heat-conducting thermosetting adhesive film and an electronic instrument, and relates to the field of thermosetting adhesive films. The titanate-silicate ester oligomer containing the epoxy group is prepared from the following raw materials in parts by mass: 5 to 15 parts of gamma-glycidyl ether oxypropyl trimethoxy silane and 5 to 15 parts of an ethyl acetoacetate titanium compound. By adding the titanate-silicate ester oligomer containing the epoxy group, the boiling resistance of the system is greatly improved, the epoxy group can be better compatible with matrix resin epoxy, and the epoxy group can also react with the curing agent.

Description

Technical Field

[0001] This application relates to the field of thermosetting films, and more particularly to an epoxy-containing titanate-silicate oligomer, a water-resistant epoxy thermally conductive thermosetting film, its preparation method, and electronic instruments. Background Technology

[0002] In today's rapidly developing technological landscape, smart homes are gradually becoming a part of people's lives. Smart home designs are trending towards thinner and more compact designs. The application of 5G is continuously improving product performance, but also increasing power consumption, all of which place higher demands on heat dissipation technology. Against this backdrop, thermally conductive materials have emerged. The commercialization of 5G has brought new opportunities to the thermally conductive materials industry. As smart homes become increasingly thinner and labor costs rise, there is a need for screwless designs, requiring thermosetting adhesive films to replace screws for fixing. Furthermore, the environments in which smart homes are used generally require waterproofing, especially the humid and hot environment of kitchens. Therefore, the demand for waterproof thermally conductive materials, especially water-resistant thermosetting adhesive films, is increasing significantly.

[0003] Traditional water-resistant additives show a sharp decline in performance after adding a large amount of thermally conductive powder. Therefore, it is necessary to find a silicon-based water-resistant material that can withstand boiling water and is compatible with thermally conductive fillers.

[0004] Traditional titanate silicate oligomers have good water resistance and compatibility with thermally conductive fillers, but poor compatibility with epoxy films. Therefore, it is necessary to introduce titanate silicate oligomers containing epoxy groups.

[0005] In summary, it is necessary to achieve high adhesion and high thermal conductivity while maintaining excellent water resistance even with a large amount of thermally conductive filler. Therefore, epoxy-containing titanate and silicate oligomers are required. Summary of the Invention

[0006] The purpose of this application is to provide an epoxy-containing titanate-silicate oligomer, a water-resistant epoxy thermally conductive thermosetting film, a method for preparing the same, and an electronic instrument, in order to solve the above-mentioned problems.

[0007] To achieve the above objectives, the first aspect of this application provides an epoxy-containing titanate-silicate oligomer, the raw materials of which, by mass parts, comprise: 5-15 parts of γ-glycidyl etheroxypropyltrimethoxysilane and 5-15 parts of ethyl acetoacetate titanium complex.

[0008] The second aspect of this application provides the aforementioned epoxy-containing titanate-silicate oligomers, comprising: Water, ethanol, and sulfuric acid are first mixed to obtain a mixed solution; The mixed solution, γ-glycidyl etheroxypropyltrimethoxysilane, and ethyl acetoacetate titanium complex were subjected to a second mixing, heating, and vacuum distillation to obtain the epoxy-containing titanate-silica oligomer.

[0009] Optionally, the mass ratio of the water to the ethanol is 5-15:80-100; And / or, the mass ratio of the water to the γ-glycidoxypropyltrimethoxysilane is 5-15:5-15.

[0010] Optionally, the pH of the mixed solution is 1.5-2.5; And / or, the heating temperature is 70℃-90℃, and the time is 0.5-2h.

[0011] A third aspect of this application provides a water-resistant, boil-proof, thermally conductive thermosetting adhesive film, the raw material of which includes the aforementioned epoxy-containing titanate-silica ester oligomer.

[0012] Optionally, the raw materials may also include thermoplastic polyurethane elastomers, epoxy resins, epoxy latent curing agents, and thermally conductive fillers.

[0013] Optionally, the raw materials of the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, by weight, include: The composition includes 4.5-5 parts of the epoxy-containing titanate-silicate oligomer, 20-40 parts of the thermoplastic polyurethane elastomer, 50-55 parts of the epoxy resin, 5-6 parts of the epoxy latent curing agent, and 550-650 parts of the thermally conductive filler.

[0014] Optionally, the thermoplastic polyurethane elastomer includes a hydroxyl-terminated thermoplastic polyurethane elastomer; And / or, the epoxy resin includes one or more of bisphenol A type epoxy resin, sulfur-containing epoxy resin, and biphenyl-containing epoxy resin, wherein the kinematic viscosity of the bisphenol A type epoxy resin at 25°C is 15000 mPa·s-30000 mPa·s. And / or, the epoxy latent curing agent includes one or more of dicyandiamide compounds, organic hydrazide compounds, boron trifluoride-amine complexes, and photosensitive latent salt compounds; Preferably, the epoxy latent curing agent includes dicyandiamine; And / or, the thermally conductive filler includes one or more of alumina, magnesium oxide, diamond, boron nitride, and aluminum nitride.

[0015] Preferably, the thermally conductive filler includes alumina.

[0016] The fourth aspect of this application provides a method for preparing the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, comprising: The raw materials and organic solvent are mixed to obtain a mixture; The mixture is coated onto the surface of release PET and cured to obtain a water-resistant, heat-conducting, thermosetting epoxy film.

[0017] The fifth aspect of this application provides an electronic instrument including the aforementioned water-resistant, boil-resistant, thermally conductive thermosetting epoxy film.

[0018] Compared with the prior art, the beneficial effects of this application include: The epoxy-containing titanate-silicate oligomers provided in this application significantly improve the system's water resistance. The epoxy groups are more compatible with the main epoxy resin and can also react with the curing agent. The addition of epoxy groups improves compatibility, and the epoxy subsequently reacts with the hydroxyl groups of the thermoplastic polyurethane elastomer and the epoxy latent curing agent, forming a unified whole, unlike the simple filler without epoxy groups.

[0019] The method for preparing epoxy-containing titanate-silicate oligomers provided in this application is simple to operate and the raw materials are readily available.

[0020] The water-resistant, heat-conducting, thermosetting epoxy film provided in this application is a film-like material with good operability. It can be cut into the required material, applied to the place where it is needed, and further cured at high temperature to bond the substrate together. It has a high bonding height and can completely replace screws.

[0021] The method for preparing the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film provided in this application is simple, has a short production cycle, and high production efficiency, and can be used for large-scale production.

[0022] The electronic instrument provided in this application has good hot water performance and a long service life. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope of this application.

[0024] Figure 1 Infrared spectrum of γ-glycidoxypropyltrimethoxysilane provided in Example 1; Figure 2 Infrared spectral image of the ethyl acetoacetate titanium complex provided in Example 1; Figure 3 Infrared spectral image of the epoxy-containing titanate-silicate oligomer provided in Example 1. Detailed Implementation

[0025] First, the solution provided in this application will be explained in more detail as follows: The first aspect of this application provides an epoxy-containing titanate-silica ester oligomer, wherein the raw materials, by weight, comprise: 5-15 parts of γ-glycidyl etheroxypropyltrimethoxysilane and 5-15 parts of ethyl acetoacetate titanium complex.

[0026] Optionally, the raw materials for the epoxy-containing titanate-silicate oligomers may, by weight, be 5 parts, 10 parts, 15 parts or any value between 5 and 15 parts of γ-glycidyl etheroxypropyltrimethoxysilane, and 5 parts, 10 parts, 15 parts or any value between 5 and 15 parts of ethyl acetoacetate titanium complex.

[0027] It should be noted that γ-glycidyl etheroxypropyltrimethoxysilane is an epoxy-containing silane. The ethyl acetoacetate titanium complex itself has good waterproof properties. They underwent a hydrolysis-condensation reaction, and after the reaction, epoxy-containing titanate-silicate oligomers were obtained. This substance has good waterproof properties. The core of its reaction mechanism lies in the chemical reaction between the organic functional groups (such as alkoxy groups) in its molecular structure and the hydroxyl groups on the surface of the inorganic substrate, as well as the low surface energy hydrophobic film formed by itself. The second aspect of this application provides the aforementioned epoxy-containing titanate-silicate oligomers, comprising: Water, ethanol, and sulfuric acid are first mixed to obtain a mixed solution; The mixed solution, γ-glycidyl etheroxypropyltrimethoxysilane, and ethyl acetoacetate titanium complex were subjected to a second mixing, heating, and vacuum distillation to obtain the epoxy-containing titanate-silica oligomer.

[0028] In some embodiments, the mass ratio of water to ethanol is 5-15:80-100; Optionally, the mass ratio of water to ethanol can be any value between 5:80, 10:80, 15:80, 110:90, 10:100, or 5-15:80-100. And / or, the mass ratio of the water to the γ-glycidoxypropyltrimethoxysilane is 5-15:5-15.

[0029] Optionally, the mass ratio of water to γ-glycidoxypropyltrimethoxysilane can be any value between 5:5, 5:10, 5:15, 10:5, 15:5, or 5-15:5-15.

[0030] In some embodiments, the pH of the mixed solution is 1.5-2.5; Optionally, the pH of the mixed solution can be any value between 1.5, 2, 2.5, 1.5-2.5, or 1.5-2.5; It is important to note that pH has a significant impact on the reaction rate and product structure.

[0031] In an alkaline environment, the reaction rate will slow down or even stop because alkaline conditions will cause silanol to be converted into silicate ions, thereby inhibiting the condensation reaction; while in an environment with pH 3-6, the reaction is relatively slow and the product is prone to gelation.

[0032] And / or, the heating temperature is 70℃-90℃, and the time is 0.5-2h.

[0033] Optionally, the heating temperature can be any value between 70℃, 80℃, 90℃ or 70-90℃, and the time can be any value between 0.5h, 1h, 1.5h, 2h or 0.5-2h.

[0034] A third aspect of this application provides a water-resistant, boil-proof, thermally conductive thermosetting adhesive film, the raw material of which includes the aforementioned epoxy-containing titanate-silica ester oligomer.

[0035] In some embodiments, the raw materials also include thermoplastic polyurethane elastomer, epoxy resin, epoxy latent curing agent, and thermally conductive filler.

[0036] It should be noted that the main function of thermoplastic polyurethane elastomer is to be in film form before curing, which gives the thermosetting film good workability. It contains hydroxyl groups that can further react with epoxy resin at high temperatures. It should also be noted that thermoplastic polyurethane elastomers, as film-forming substances before curing, are easy to handle and contain hydroxyl groups for subsequent reactions; epoxy-containing titanate-silicate oligomers, as water-resistant additives, contain epoxy groups that allow for better compatibility with the main epoxy resin, and their epoxy groups can also react with the curing agent and thermoplastic polyurethane elastomers; bisphenol A type epoxy resin is the main resin, and has good epoxy adhesion properties; dicyandiamine, as a latent epoxy curing agent, requires high temperatures to react; and alumina, as a functional filler, mainly serves as a thermal conductor.

[0037] In some embodiments, the raw materials of the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, by weight, include: The composition includes 4.5-5 parts of the epoxy-containing titanate-silicate oligomer, 20-40 parts of the thermoplastic polyurethane elastomer, 50-55 parts of the epoxy resin, 5-6 parts of the epoxy latent curing agent, and 550-650 parts of the thermally conductive filler.

[0038] Optionally, the epoxy-containing titanate-silicate oligomer can be any value between 4.5 parts, 4.6 parts, 4.7 parts, 4.8 parts, 4.9 parts, 5 parts, or 4.5-5 parts; the thermoplastic polyurethane elastomer can be any value between 20 parts, 30 parts, 40 parts, or 20-40 parts; the epoxy resin can be any value between 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, or 50-55 parts; the epoxy latent curing agent can be any value between 5 parts, 5.5 parts, 6 parts, or 5-6 parts; and the thermally conductive filler can be any value between 550 parts, 600 parts, 650 parts, or 550-650 parts.

[0039] In some embodiments, the thermoplastic polyurethane elastomer includes a hydroxyl-terminated thermoplastic polyurethane elastomer; And / or, the epoxy resin includes one or more of bisphenol A type epoxy resin, sulfur-containing epoxy resin, and biphenyl-containing epoxy resin, wherein the kinematic viscosity of the bisphenol A type epoxy resin at 25°C is 15000 mPa·s-30000 mPa·s. Optionally, the kinematic viscosity of the bisphenol A epoxy resin at 25°C can be any value between 15000 mPa·s, 20000 mPa·s, 30000 mPa·s, or 15000 mPa·s-30000 mPa·s. Preferably, the epoxy resin includes bisphenol A type epoxy resin; And / or, the epoxy latent curing agent includes one or more of dicyandiamide compounds, organic hydrazide compounds, boron trifluoride-amine complexes, and photosensitive latent salt compounds; And / or, the thermally conductive filler includes one or more of alumina, magnesium oxide, diamond, boron nitride, and aluminum nitride.

[0040] The fourth aspect of this application provides a method for preparing the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, comprising: The raw materials and organic solvent are mixed to obtain a mixture; Organic solvents include acetone and / or 2-butanone; preferably, organic solvents include 2-butanone. The mixture is coated onto the surface of release PET and cured to obtain a water-resistant, heat-conducting, thermosetting epoxy film.

[0041] It should be noted that epoxy thermally conductive thermosetting adhesive film is in film form, which has good operability. It can be cut into the required material and applied to the place where it is needed. By curing at a high temperature of 150°C for 30 minutes, the substrate is bonded together. Its bonding height is high and it can completely replace screws.

[0042] The fifth aspect of this application provides an electronic instrument including the aforementioned water-resistant, boil-resistant, thermally conductive thermosetting epoxy film.

[0043] The implementation schemes of this application will be described in detail below with reference to specific embodiments. However, those skilled in the art will understand that the following embodiments are only for illustrating this application and should not be regarded as limiting the scope of this application. Unless otherwise specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments used without specified manufacturers are all conventional products that can be purchased commercially.

[0044] Example 1 The first aspect of this embodiment provides an epoxy-containing titanate-silicate oligomer, the raw materials of which include: 10g of KH560 (γ-glycidyl etheroxypropyltrimethoxysilane) and 10g of ethyl acetoacetate titanium complex.

[0045] The second aspect of this embodiment provides a method for preparing epoxy-containing titanate-silicate oligomers, the specific steps of which are as follows: S1: Mix the raw materials, including 10g of deionized water and 90g of ethanol, until homogeneous. Control the pH to 2.0 by adding sulfuric acid. Obtain the first solution at a temperature of 80℃. S2: Add KH560 (γ-glycidyl etheroxypropyltrimethoxysilane) and ethyl acetoacetate titanium complex to the first solution, and continue to mix and stir at a temperature of 80°C to obtain the second solution. Then, remove water and ethanol by vacuum distillation to obtain the epoxy-containing titanate-silicate oligomer. The ethyl acetoacetate titanium complex used is DuPont's TYZOR® 726.

[0046] Infrared detection of KH560 (γ-glycidoxypropyltrimethoxysilane) as follows: Figure 1 As shown, the infrared detection of the ethyl acetoacetate titanium complex is as follows: Figure 2 As shown, infrared detection of epoxy-containing titanate-silicate oligomers is as follows: Figure 3 As shown. Among them, Figure 3 In the infrared spectrum of epoxy-containing titanate-silicate oligomers, 966.93 cm⁻¹ -1 A distinct Ti-O-Si characteristic peak appears at this location, while Figure 1 Infrared spectrum of γ-glycidoxypropyltrimethoxysilane and Figure 2 The infrared spectrum of the ethyl acetoacetate titanium complex showed no characteristic peaks at this point, proving that the reaction proceeded effectively.

[0047] The third aspect of this embodiment provides a water-resistant, boil-proof, thermally conductive thermosetting epoxy film and its preparation method. The specific preparation method is as follows: S3: Dissolve 30g of thermoplastic polyurethane elastomer (Covestro, model DESMOMELT 530 / 3) in 300g of methyl ethyl ketone (MEK), then add 4.5g of epoxy-containing titanate-silicate oligomer, 50g of bisphenol A epoxy resin, 5g of dicyandiamine, 100g of 1μm spherical alumina, 200g of 5μm spherical alumina, and 300g of 40μm spherical alumina. Stir at 800r / min for 60min to obtain the composition; wherein, the viscosity of the bisphenol A epoxy resin is selected as 20000mPa·s. S4: The above composition is coated onto a 50μm single-sided release PET using a coating machine. The thickness is controlled by the roller gap, and the solvent is evaporated completely in a tunnel oven at 60°C to obtain a water-resistant, heat-conducting, thermosetting epoxy film.

[0048] Example 2 The difference from Example 1 is that in step S3, the amount of thermoplastic polyurethane elastomer used is 35g.

[0049] Example 3 The difference from Example 1 is that in step S3, the amount of epoxy-containing titanate-silica oligomer is 5g.

[0050] Example 4 The difference from Example 1 is that in step S3, the amount of bisphenol A epoxy resin used is 55g.

[0051] Example 5 The difference from Example 1 is that in step S3, the amount of dicyandiamine used is 6g.

[0052] Comparative Example 1 The difference from Example 1 is that in step S3, the thermoplastic polyurethane elastomer is replaced with a conventional polyurethane elastomer, specifically BASF model 1190A10 from Germany.

[0053] Comparative Example 2 The difference from Example 1 is that in step S3, the epoxy-containing titanate-silicate oligomer is replaced with a conventional titanate-silicate oligomer, which was purchased from Shenzhen Adal Thermal Technology Co., Ltd.

[0054] Comparative Example 3 The difference from Example 1 is that no epoxy-containing titanate-silicate oligomer is added in step S3.

[0055] Comparative Example 4 The difference from Example 1 is that in step S2, the amount of KH560 (γ-glycidyl etheroxypropyltrimethoxysilane) is 30g and the amount of ethyl acetoacetate titanium complex is 30g.

[0056] Comparative Example 5 The difference from Example 1 is that the pH value is 5 in step S1.

[0057] Comparative Example 6 The difference from Example 1 is that γ-glycidoxypropyltrimethoxysilane is replaced with methyltrimethoxysilane.

[0058] The performance of the epoxy thermally conductive thermosetting film prepared above was tested, and the test results are shown in Table 1. The specific test standards are as follows: Specific gravity after curing: according to the standard in ASTM D792-2007 Test Method for Density and Relative Density of Plastics, the unit is g / cc.

[0059] Shear strength (AL / AL): in accordance with GB / T 7124-2008, the unit is MPa; the shear strength is achieved using a sandwich structure, 6061 aluminum, 0.2mm epoxy thermally conductive thermosetting film, 6061 aluminum.

[0060] Water resistance: The sandwich structure was boiled in 100°C water for 4 hours and then its shear strength was tested.

[0061] Breakdown voltage: ASTM D149-2009, unit is KV / mm.

[0062] Thermal conductivity: according to the standard in ASTM D5470, the unit is W / m·K.

[0063] Table 1 Performance Tests

[0064] Note: In Comparative Example 4, a large amount of flocculent material appeared during the preparation of epoxy-containing titanate-silicate oligomers, indicating that it agglomerated to form silicone resin or titanium resin, making it impossible to proceed to the next step.

[0065] In Comparative Example 5, gelation occurred during the preparation of epoxy-containing titanate-silicate oligomers, directly forming a gel. This demonstrates that acidic conditions (pH≈5) typically promote the condensation of silanols, leading to gelation and preventing further steps.

[0066] analyze: As shown in Table 1, the water-resistant epoxy thermally conductive thermosetting film prepared in this application has high thermal conductivity and good shear strength. This indicates that the epoxy-containing titanate-silicate oligomers used in this application result in a water-resistant epoxy thermally conductive thermosetting film with good shear strength and good water resistance. Conventional polyurethane elastomers, lacking groups that can react with epoxy resin, only act as fillers in the system, making them prone to degumming and resulting in low shear strength. Using epoxy-containing titanate-silicate oligomers without water resistance has poor compatibility, leading to poor shear strength performance. Without the addition of titanate-silicate oligomers, the water resistance is poor, with shear strength decreasing sharply after boiling. Using silanes without epoxy groups to prepare titanate-silicate oligomers also has poor compatibility, resulting in poor shear strength performance.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0068] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, any of the claimed embodiments can be used in any combination. The information disclosed in this background section is intended only to enhance the understanding of the general background of this application and should not be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art.

Claims

1. An epoxy-containing titanate-silicate oligomer, characterized in that, Its raw materials, by weight, include: 5-15 parts of γ-glycidyl etheroxypropyltrimethoxysilane and 5-15 parts of ethyl acetoacetate titanium complex.

2. The epoxy-containing titanate-silicate oligomer of claim 1, characterized in that, include: Water, ethanol, and sulfuric acid are first mixed to obtain a mixed solution; The mixed solution, γ-glycidyl etheroxypropyltrimethoxysilane, and ethyl acetoacetate titanium complex were subjected to a second mixing, heating, and vacuum distillation to obtain the epoxy-containing titanate-silicate oligomer.

3. The epoxy-containing titanate-silicate oligomer according to claim 2, characterized in that, The mass ratio of water to ethanol is 5-15:80-100; And / or, the mass ratio of the water to the γ-glycidoxypropyltrimethoxysilane is 5-15:5-15.

4. The epoxy-containing titanate-silicate oligomer according to claim 2, characterized in that, The pH of the mixed solution is 1.5-2.5; And / or, the heating temperature is 70℃-90℃, and the time is 0.5-2h.

5. A water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, characterized in that, Its raw materials include the epoxy-containing titanate-silica oligomers as described in claim 1.

6. The water-resistant, boil-resistant, thermally conductive thermosetting epoxy film according to claim 5, characterized in that, Its raw materials also include thermoplastic polyurethane elastomers, epoxy resins, epoxy latent curing agents, and thermally conductive fillers.

7. The water-resistant, boil-resistant, thermally conductive thermosetting epoxy film according to claim 6, characterized in that, The raw materials of the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film, by weight, include: The composition includes 4.5-5 parts of the epoxy-containing titanate-silicate oligomer, 20-40 parts of the thermoplastic polyurethane elastomer, 50-55 parts of the epoxy resin, 5-6 parts of the epoxy latent curing agent, and 550-650 parts of the thermally conductive filler.

8. The water-resistant, boil-resistant, thermally conductive thermosetting epoxy film according to claim 6, characterized in that, The thermoplastic polyurethane elastomer includes a hydroxyl-terminated thermoplastic polyurethane elastomer; And / or, the epoxy resin includes one or more of bisphenol A type epoxy resin, sulfur-containing epoxy resin, and biphenyl-containing epoxy resin, wherein the kinematic viscosity of the bisphenol A type epoxy resin at 25°C is 15000 mPa·s-30000 mPa·s. And / or, the epoxy latent curing agent includes one or more of dicyandiamide compounds, organic hydrazide compounds, boron trifluoride-amine complexes, and photosensitive latent salt compounds; And / or, the thermally conductive filler includes one or more of alumina, magnesium oxide, diamond, boron nitride, and aluminum nitride.

9. A method for preparing a water-resistant, boil-resistant, thermally conductive thermosetting epoxy film according to any one of claims 5-8, characterized in that, include: The raw materials and organic solvent are mixed to obtain a mixture; The mixture is coated onto the surface of release PET and cured to obtain a water-resistant, heat-conducting, thermosetting epoxy film.

10. An electronic instrument, characterized in that, Including the water-resistant, boil-resistant, thermally conductive thermosetting epoxy film as described in any one of claims 5-8.

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