Copper particle dissolving and circulating system

Abstract

The invention discloses a copper particle dissolving and circulating system which comprises a main tank body, an auxiliary tank body and a dissolving and circulating module, the auxiliary tank body is nested in the main tank body, and the auxiliary tank body is communicated with the main tank body through the dissolving and circulating module; the main tank body comprises an electroplating chamber and a mounting chamber, the mounting chamber is used for mounting the auxiliary tank body and the circulating pipeline, and the auxiliary tank body is communicated with the electroplating chamber through the circulating pipeline; the dissolving circulation module comprises a pump body, a filtering unit, an output pipeline and a backflow pipeline; the input end of the pump body is connected with the output end of the auxiliary tank body through a pipeline; the output end of the pump body is connected with the input end of the filtering unit through a pipeline; the output end of the filtering unit is connected to the input end of the electroplating chamber through an output pipeline; and the output end of the electroplating chamber is communicated to the input end of the auxiliary tank body through a backflow pipeline. According to the copper particle dissolving and circulating system, the auxiliary tank body is directly nested in the mounting cavity of the main tank body, so that the external occupied area of equipment is remarkably saved.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment technology, and in particular to a copper particle dissolution and circulation system. Background Technology

[0002] The copper particle dissolution and circulation system is a core subsystem in insoluble anodic electroplating processes, specifically designed to continuously replenish the copper ions consumed in the plating solution. Its function is to dissolve metallic copper particles (such as copper balls and copper horns) chemically or electrochemically, and efficiently and cleanly transport the resulting copper ion solution to the main plating tank, maintaining a stable plating solution concentration. Existing copper particle dissolution and circulation systems typically consist of a dissolution tank, a circulation pump, a filtration unit, circulation pipelines, and a control system. The dissolution tank contains the copper particles and the dissolving medium (such as sulfuric acid + oxidant), providing a site for the dissolution reaction. The circulation pump drives the plating solution to circulate between the dissolution tank and the main plating tank. The filtration unit intercepts undissolved copper particles and impurities, preventing contamination of the main plating tank. The circulation pipelines connect the dissolution tank, filter, and main plating tank in a closed channel. The control system, based on ampero-hour meters or ion concentration monitoring, adjusts the dissolution rate and circulation flow rate. Based on this system, the copper particle dissolution and circulation process and reactions mainly include: Sub-tank dissolution reaction (copper particles → ionic state): Fe 3+ +Cu→Fe 2+ +Cu 2+ ; Main tank electrolytic deposition (ionic state → metallic copper): Cathodic reaction (workpiece deposition): Cu 2+ +2e - →Cu; Anode reaction: Fe 2+ →Fe 3+ +e - ; The specific circulating filtration process is as follows: the copper-poor plating solution flows from the main tank into the dissolving tank → the copper-rich solution in the dissolving tank is pressurized by a pump → forced through the filter → the clean, high-copper solution returns to the main tank. The control system calculates the copper ion consumption based on the total electroplating current (ampere-hours) and dynamically adjusts the following: the amount of oxidant added to the dissolving tank, the flow rate of the circulating pump, and the copper particle feeding rate, thereby achieving the purpose of dissolving copper and maintaining the copper ion concentration in the electroplating tank.

[0003] Traditional insoluble anodic electroplating equipment adopts a separate layout of main tank (electrolytic tank) and auxiliary tank (dissolution circulation system). However, this type of electroplating equipment has low space utilization: the dual-tank structure increases the equipment footprint, and the circulation pipeline needs to be connected across areas, increasing flow resistance and leakage risk. Summary of the Invention

[0004] Therefore, it is necessary to provide a copper particle dissolution and circulation system to address the technical problems of low space utilization and increased flow resistance caused by the separate layout of the electrolytic cell and the dissolution cell in the existing copper particle dissolution and circulation system.

[0005] A copper particle dissolution and circulation system includes a main tank, a secondary tank, and a dissolution and circulation module. The main tank is configured as an electroplating tank, and the secondary tank is configured as a dissolution tank. The secondary tank is nested within the main tank and is connected to the main tank through the dissolution and circulation module, thereby realizing the circulation of copper dissolution and electroplating solution between the secondary tank and the main tank.

[0006] The main tank includes an electroplating chamber and an installation chamber. The electroplating chamber is used to contain the electroplating solution and perform electroplating operations. The installation chamber is used to install the auxiliary tank and circulation pipes. The auxiliary tank is connected to the electroplating chamber through the circulation pipes, thereby realizing liquid circulation between the auxiliary tank and the electroplating chamber.

[0007] The dissolution circulation module includes a pump body, a filter unit, an output pipe, and a return pipe. The pump body is located adjacent to the main tank. The filter unit, output pipe, and return pipe are all installed in the mounting chamber. The input end of the pump body is connected to the output end of the auxiliary tank. The output end of the pump body is connected to the input end of the filter unit. The output end of the filter unit is connected to the input end of the electroplating chamber through the output pipe. The output end of the electroplating chamber is connected to the input end of the auxiliary tank through the return pipe, thus forming the basic liquid circulation structure between the auxiliary tank and the electroplating chamber.

[0008] In one embodiment, the pump body is provided with a first ball valve and a first flow meter. The output end of the pump body is connected to the filter unit pipeline in sequence through the first ball valve and the first flow meter. In this way, the first ball valve provides a control node for the flow rate of the fluid output by the pump body, and the first flow meter monitors the flow rate of the fluid output by the pump body.

[0009] In one embodiment, the output pipe is configured as a Y-shaped pipe, with one end of the Y-shaped pipe connected to the output end of the filter unit; the other two ends of the Y-shaped pipe are respectively arranged at both ends of the middle region of the electroplating chamber along the length direction of the electroplating chamber, and are connected to the interior of the electroplating chamber through the bottom wall of the electroplating chamber.

[0010] In one embodiment, the electroplating chamber is provided with a main nozzle, which is located at the bottom of the electroplating chamber; the two ends of the output pipe connected to the bottom wall of the electroplating chamber are respectively connected to the input end of the main nozzle, so that the high-concentration copper ion solution output by the output pipe can be sprayed onto the workpiece for electroplating through the main nozzle.

[0011] In one embodiment, the aforementioned return pipe is equipped with a second ball valve and a three-way pipe. One end of the return pipe is connected to the input end of the sub-tank, and the other end of the return pipe is connected to one end of the three-way pipe through the second ball valve. The other two ends of the three-way pipe are respectively arranged at both ends of the middle region of the electroplating chamber along the length direction of the electroplating chamber and are connected to the bottom wall of the electroplating chamber, so that the electroplating solution in the electroplating chamber can return to the sub-tank through the three-way pipe and the return pipe. The second ball valve can control the return flow rate of the electroplating solution.

[0012] In one embodiment, the second ball valve described above is configured as a digital display electric ball valve to monitor the flow rate of the return pipe.

[0013] In one embodiment, the above-mentioned dissolution circulation module is set into two groups, and the two dissolution circulation modules are configured and connected in the same way with the main tank and the auxiliary tank.

[0014] In one embodiment, both output pipes are configured as Y-shaped pipes, with one end of each output pipe connected to the output end of the corresponding filter unit, and the other two ends of each output pipe connected to both sides of the bottom wall of the electroplating chamber along the length of the electroplating chamber.

[0015] In one embodiment, two main nozzles are arranged along the length of both sides of the bottom of the electroplating chamber, and the two main nozzles are respectively connected to two output pipes.

[0016] In one embodiment, both of the above-mentioned return pipes are provided with T-shaped pipes. One end of each of the two T-shaped pipes is connected to the input end of the corresponding sub-tank, and the other two ends of each of the two T-shaped pipes are connected to both sides of the bottom wall of the electroplating chamber along the length of the electroplating chamber. Thus, the plating solution in the electroplating chamber can return to the sub-tank through the two return pipes.

[0017] In one embodiment, the bottom of the electroplating chamber is provided with a plurality of overflow boxes, which are respectively covered at the ports where the two return pipes connect to the electroplating chamber.

[0018] In one embodiment, the aforementioned sub-slot is configured as a multi-chamber structure.

[0019] In one embodiment, the sub-tank is provided with a plurality of parallel cavity partitions to divide the sub-tank into a plurality of horizontally arranged copper melting chambers.

[0020] In one embodiment, each of the copper melting chambers is provided with several copper block support plates arranged in parallel along the height direction to divide each copper melting chamber into multiple copper block support and melting areas.

[0021] In one embodiment, the electroplating chamber is provided with a VCP electroplating module and a plating solution circulation and dispersion module. Both the VCP electroplating module and the plating solution circulation and dispersion module are located inside the electroplating chamber. The VCP electroplating module is used to perform VCP electroplating on the workpiece, and the plating solution circulation and dispersion module performs self-circulation and dispersion of the plating solution inside the electroplating chamber through several circulation pipes and several circulation nozzles.

[0022] The aforementioned copper particle dissolution and circulation system directly nests the auxiliary tank within the mounting chamber of the main tank, significantly saving external floor space. Specifically, it eliminates the need for a separate dissolution tank (i.e., the auxiliary tank) and its supporting structure, effectively reducing the length and complexity of external connecting pipelines. This makes it suitable for space-constrained workshops or small automated electroplating lines. Simultaneously, the reduced pipeline length and complexity effectively improve the electroplating solution circulation efficiency, enabling high-speed liquid exchange between the auxiliary tank and the electroplating chamber. Continuously pumping liquid back to the auxiliary tank through the return pipeline provides fresh copper-dissolving medium, maintaining a high dissolution rate. Rapidly delivering a high-concentration copper ion solution to the electroplating chamber through the output pipeline shortens the copper ion diffusion path. Therefore, the circulating flow prevents localized areas within the dissolution tank from accumulating copper ions, which could reduce dissolution efficiency. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the copper particle dissolution circulation system in one embodiment; Figure 2 This is a schematic diagram of the exploded structure of a copper particle dissolution cycle system in one embodiment; Figure 3 This is a partial structural schematic diagram of a copper particle dissolution circulation system in one embodiment. Detailed Implementation

[0024] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0030] Please see Figures 1 to 3This invention discloses a copper particle dissolution and circulation system 1, which includes a main tank 10, a secondary tank 20, and a dissolution and circulation module 30. The main tank 10 is configured as an electroplating tank, and the secondary tank 20 is configured as a dissolution tank. The secondary tank 20 is nested within the main tank 10 and is connected to the main tank 10 through the dissolution and circulation module 30, thereby realizing the circulation of copper dissolution and electroplating solution between the secondary tank 20 and the main tank 10. Specifically, the main tank 10 includes an electroplating chamber 11 and an installation chamber 12. The electroplating chamber 11 is used to contain the electroplating solution and perform electroplating operations, while the installation chamber 12 is used to install the secondary tank 20 and circulation pipes. The secondary tank 20 is connected to the electroplating chamber 11 through the circulation pipes, thereby realizing the liquid circulation between the secondary tank 20 and the electroplating chamber 11. Based on the above configuration, more specifically, the dissolution circulation module 30 includes a pump body 31, a filter unit 32, an output pipe 33, and a return pipe 34. The pump body 31 is located adjacent to the main tank 10. The filter unit 32, the output pipe 33, and the return pipe 34 are all installed in the mounting chamber 12. The input end of the pump body 31 is connected to the output end of the secondary tank 20 via a pipe. The output end of the pump body 31 is connected to the input end of the filter unit 32 via a pipe. The output end of the filter unit 32 is connected to the input end of the electroplating chamber 11 via the output pipe 33. The output end of the electroplating chamber 11 is connected to the input end of the secondary tank 20 via the return pipe 34, thereby forming a basic liquid circulation structure between the secondary tank 20 and the electroplating chamber 11. Based on this, the copper particle dissolution circulation system 1 of the present invention directly nests the secondary tank 20 within the mounting chamber 12 of the main tank 10, significantly saving the external floor space of the equipment. Specifically, the copper particle dissolution and circulation system 1 eliminates the need for an additional, independently arranged dissolution tank, i.e., the secondary tank 20, and its supporting structure. This effectively reduces the length and complexity of external connecting pipelines, making it suitable for space-constrained workshops or small automated electroplating lines. Simultaneously, the reduced pipeline length and complexity significantly improve the electroplating solution circulation efficiency, enabling high-speed liquid exchange between the secondary tank 20 and the electroplating chamber 11. Continuously pumping liquid back to the secondary tank 20 via the return pipe 34 provides a fresh copper-dissolving medium, maintaining a high dissolution rate. Rapidly delivering a high-concentration copper ion solution to the electroplating chamber 11 via the output pipe 33 shortens the copper ion diffusion path. Therefore, the circulating flow prevents localized areas within the dissolution tank from experiencing reduced dissolution efficiency due to copper ion accumulation.

[0031] Furthermore, the pump body 31 is equipped with a first ball valve 311 and a first flow meter 312. The output end of the pump body 31 is sequentially connected to the filter unit 32 through the first ball valve 311 and the first flow meter 312. In this way, the first ball valve 311 provides a control node for the flow rate of the fluid output by the pump body 31, and the first flow meter 312 monitors the flow rate of the fluid output by the pump body 31.

[0032] Furthermore, the output pipe 33 is configured as a Y-shaped pipe, with one end connected to the output end of the filter unit 32; the other two ends of the Y-shaped pipe are respectively arranged at both ends of the middle region of the electroplating chamber 11 along the length direction of the electroplating chamber 11, and connected to the interior of the electroplating chamber 11 through the bottom wall of the electroplating chamber 11. Thus, the filtered high-concentration copper ion solution can be uniformly input into the electroplating chamber 11 through the Y-shaped pipe. Specifically, the electroplating chamber 11 is equipped with a main nozzle 111, which is located at the bottom of the electroplating chamber 11; the two ends of the output pipe 33 connected to the bottom wall of the electroplating chamber 11 are respectively connected to the input ends of the main nozzle 111, thereby enabling the high-concentration copper ion solution output by the output pipe 33 to perform spray electroplating on the workpiece through the main nozzle 111.

[0033] Furthermore, the return pipe 34 is equipped with a second ball valve 341 and a three-way pipe 342. One end of the return pipe 34 is connected to the input end of the auxiliary tank 20, and the other end of the return pipe 34 is connected to one end of the three-way pipe 342 through the second ball valve 341. The other two ends of the three-way pipe 342 are respectively arranged at both ends of the middle region of the electroplating chamber 11 along the length direction of the electroplating chamber 11 and are connected to the bottom wall of the electroplating chamber 11, so that the electroplating solution in the electroplating chamber 11 can return to the auxiliary tank 20 through the three-way pipe 342 and the return pipe 34. The second ball valve 341 can control the return flow rate of the electroplating solution. Specifically, in one embodiment, the second ball valve 341 is set as a digital display electric ball valve to monitor the flow rate of the return pipe 34.

[0034] Furthermore, in one embodiment, the dissolution circulation module 30 is configured as two sets, and the two dissolution circulation modules 30 are configured and connected in the same way with the main tank 10 and the secondary tank 20.

[0035] Specifically, both output pipes 33 are configured as Y-shaped pipes, and one end of each output pipe 33 is connected to the output end of the corresponding filter unit 32. The other two ends of each output pipe 33 are connected to the two sides of the bottom wall of the electroplating chamber 11 along the length direction of the electroplating chamber 11. Correspondingly, two main nozzles 111 are arranged along the length direction on both sides of the bottom of the electroplating chamber 11, so that the two main nozzles 111 are respectively connected to the two output pipes 33.

[0036] Specifically, each of the two return pipes 34 is equipped with a three-way pipe 342. One end of each of the two three-way pipes 342 is connected to the input end of the corresponding sub-tank 20, and the other two ends of each of the two three-way pipes 342 are connected to both sides of the bottom wall of the electroplating chamber 11 along the length of the electroplating chamber 11. Thus, the plating solution in the electroplating chamber 11 can be returned to the sub-tank 20 through the two return pipes 34.

[0037] Furthermore, a plurality of overflow boxes 112 are provided at the bottom of the electroplating chamber 11. The overflow boxes 112 are respectively covered at the ports of the two return pipes 34 connecting the electroplating chamber 11. Thus, the overflow boxes 112 can effectively limit the liquid level of the plating solution inside the electroplating chamber 11. When the liquid level of the plating solution exceeds the height of the overflow box 112, the portion of the plating solution that overflows the overflow box 112 seeps in from the top of the overflow box 112 and flows back to the auxiliary tank 20 through the two return pipes 34.

[0038] Furthermore, the sub-tank 20 is configured as a multi-chamber structure. Specifically, the sub-tank 20 is provided with several parallel cavity partitions 21 to divide the sub-tank 20 into several horizontally arranged copper dissolving chambers 22; subsequently, each copper dissolving chamber 22 is provided with several copper block support plates 23 arranged parallel along the height direction to divide each copper dissolving chamber 22 into multiple copper block support and dissolution areas, thereby increasing the contact area between the copper block and the solvent and ensuring copper dissolution efficiency.

[0039] Furthermore, in one embodiment, the electroplating chamber 11 is provided with a VCP electroplating module 113 and a plating solution circulation and dispersion module 114. Both the VCP electroplating module 113 and the plating solution circulation and dispersion module 114 are located inside the electroplating chamber 11. The VCP electroplating module 113 is used to perform VCP electroplating on the workpiece, and the plating solution circulation and dispersion module 114 performs self-circulation and dispersion of the plating solution inside the electroplating chamber 11 through several circulation pipes 1141 and several circulation nozzles 1142.

[0040] In summary, the copper particle dissolution and circulation system disclosed in this invention directly nests the auxiliary tank within the mounting chamber of the main tank, significantly saving external floor space. Specifically, it eliminates the need for a separate dissolution tank (i.e., the auxiliary tank) and its supporting structure, effectively reducing the length and complexity of external connecting pipelines, making it suitable for space-constrained workshops or small automated electroplating lines. Simultaneously, the reduced pipeline length and complexity effectively improve the electroplating solution circulation efficiency, enabling high-speed liquid exchange between the auxiliary tank and the electroplating chamber. Continuously pumping liquid back to the auxiliary tank through the return pipeline provides a fresh copper-dissolving medium, maintaining a high dissolution rate. Rapidly delivering a high-concentration copper ion solution to the electroplating chamber through the output pipeline shortens the copper ion diffusion path. Therefore, the circulating flow prevents localized areas within the dissolution tank from experiencing reduced dissolution efficiency due to copper ion accumulation.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A copper particle dissolution and circulation system, characterized in that, include: The system consists of a main tank, a secondary tank, and a dissolution and circulation module. The main tank is configured as an electroplating tank, and the secondary tank is configured as a dissolution tank. The secondary tank is nested within the main tank and is connected to the main tank via the dissolution and circulation module, thereby enabling the circulation of copper dissolution and electroplating solution between the secondary tank and the main tank. The main tank includes an electroplating chamber and an installation chamber. The electroplating chamber is used to contain the electroplating solution and perform electroplating. The installation chamber is used to install the auxiliary tank and circulation pipes. The auxiliary tank is connected to the electroplating chamber through the circulation pipes to realize liquid circulation between the auxiliary tank and the electroplating chamber. The dissolution circulation module includes a pump body, a filter unit, an output pipe, and a return pipe; the pump body is located adjacent to the main tank; the filter unit, output pipe, and return pipe are all installed in the installation chamber; the input end of the pump body is connected to the output end of the auxiliary tank; the output end of the pump body is connected to the input end of the filter unit; the output end of the filter unit is connected to the input end of the electroplating chamber through the output pipe; the output end of the electroplating chamber is connected to the input end of the auxiliary tank through the return pipe.

2. The copper particle dissolution and circulation system according to claim 1, characterized in that, The pump body is equipped with a first ball valve and a first flow meter. The output end of the pump body is connected to the filter unit pipeline in sequence through the first ball valve and the first flow meter. In this way, the first ball valve provides a control node for the flow rate of the fluid output by the pump body, and the first flow meter monitors the flow rate of the fluid output by the pump body.

3. The copper particle dissolution and circulation system according to claim 2, characterized in that, The output pipe is set as a Y-shaped pipe, with one end of the Y-shaped pipe connected to the output end of the filter unit; the other two ends of the Y-shaped pipe are respectively arranged at both ends of the middle area of ​​the electroplating chamber along the length of the electroplating chamber, and are connected to the inside of the electroplating chamber through the bottom wall of the electroplating chamber.

4. The copper particle dissolution and circulation system according to claim 3, characterized in that, The electroplating chamber is equipped with a main spray pipe, which is located at the bottom of the electroplating chamber. The two ends of the output pipe connected to the bottom wall of the electroplating chamber are respectively connected to the input end of the main spray pipe, so that the high-concentration copper ion solution output by the output pipe can be sprayed onto the workpiece for electroplating through the main spray pipe.

5. The copper particle dissolution and circulation system according to claim 4, characterized in that, The return pipe is equipped with a second ball valve and a three-way pipe. One end of the return pipe is connected to the input end of the sub-tank, and the other end of the return pipe is connected to one end of the three-way pipe through the second ball valve. The other two ends of the three-way pipe are respectively arranged at both ends of the middle area of ​​the electroplating chamber along the length of the electroplating chamber and are connected to the bottom wall of the electroplating chamber. This allows the electroplating solution in the electroplating chamber to return to the sub-tank through the three-way pipe and the return pipe. The second ball valve can control the return flow rate of the electroplating solution.

6. The copper particle dissolution and circulation system according to claim 5, characterized in that, The second ball valve is a digital display electric ball valve for monitoring the flow rate of the return pipeline.

7. The copper particle dissolution and circulation system according to claim 6, characterized in that, The dissolution circulation module is set up in two groups, and the two dissolution circulation modules are set up and connected to the main tank and the auxiliary tank in the same way.

8. The copper particle dissolution and circulation system according to claim 7, characterized in that, Both output pipes are Y-shaped pipes, with one end of each output pipe connected to the output end of the corresponding filter unit, and the other two ends of each output pipe connected to both sides of the bottom wall of the electroplating chamber along the length of the electroplating chamber.

9. The copper particle dissolution and circulation system according to claim 8, characterized in that, Two main nozzles are arranged along the length of the bottom of the electroplating chamber on both sides, and the two main nozzles are respectively connected to two output pipes.

10. The copper particle dissolution and circulation system according to claim 9, characterized in that, Both return pipes are equipped with T-junctions. One end of each T-junction is connected to the input end of the corresponding sub-tank, and the other two ends of each T-junction are connected to the two sides of the bottom wall of the electroplating chamber along the length of the electroplating chamber. Thus, the plating solution in the electroplating chamber can return to the sub-tank through the two return pipes.

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