Sand feeding device and method for diamond wire production

Abstract

The invention belongs to the technical field of diamond wire production, and particularly relates to a sand feeding device for diamond wire production, which comprises a plating solution mother tank and a plurality of sand feeding mechanisms, a liquid inlet cavity, a sand feeding cavity and a reinforcing cavity are sequentially and coaxially arranged in each sand feeding mechanism from bottom to top and are communicated with one another, and cathode conductive wheels are arranged at the upper end and the lower end of each sand feeding mechanism. An anode net cylinder is arranged in the reinforcing cavity, the lower ends of the sand feeding cavity and the reinforcing cavity are of funnel-shaped structures, a first liquid inlet pipe is arranged between the liquid inlet cavity and the plating solution mother tank, a second liquid inlet pipe is arranged between the lower part of the reinforcing cavity and the plating solution mother tank, and a liquid return pipe is arranged between the upper part of the reinforcing cavity and the plating solution mother tank. Sand feeding operation of a diamond wire bus is conducted in a vertical mode, disturbance stirring of carborundum is completed through cooperation of self-gravity deposition of the carborundum and a plating solution conveyed from bottom to top, and it is guaranteed that sand feeding is uniform.

Description

Technical Field

[0001] This invention belongs to the field of diamond wire production technology, specifically relating to a sanding device and method for diamond wire production. Background Technology

[0002] Electroplated diamond wire is a cutting tool made by using electroplated metal as a binder. Through the electrocrystallization effect of the electroplated metal, high-hardness and high-wear-resistant diamond abrasive is firmly bonded to the steel wire matrix, giving the steel wire micro-serrations of diamond. It is used for precision cutting of various artificial crystals, ceramics, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metals.

[0003] Existing diamond wire production equipment includes a master tank and a slave tank. A titanium basket is set in the slave tank and connected to the positive terminal of the power supply. Cathode rollers are set at both ends of the slave tank and connected to the negative terminal of the power supply. The key to the electroplating of diamond on the master wire is to make the diamond in contact with the master wire. At present, diamond is often mixed with additives and added to the master tank, and then circulated between the master tank and the slave tank to ensure effective contact between the diamond and the master wire.

[0004] However, due to the gravity deposition of diamond grit, its distribution in the sub-groove cannot meet the requirement of uniform contact with the diamond wire main wire, resulting in poor uniformity of diamond grit distribution on the diamond wire surface and affecting the quality of the diamond wire. Summary of the Invention

[0005] To address the problem that existing diamond wire sanding methods involve transverse sanding, resulting in poor uniformity of diamond sand on the diamond wire surface due to the deposition of diamond sand, this invention provides a sanding device and method for diamond wire production that achieves uniform sanding and high diamond sand utilization.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows:

[0007] A sanding device for diamond wire production is used to sand-coat diamond wire busbars. It includes a plating solution tank and multiple sanding mechanisms. Each sanding mechanism has a liquid inlet chamber, a sanding chamber, and a reinforcing chamber arranged coaxially and interconnected from bottom to top. Cathode conductive wheels are located at both ends of each sanding mechanism. An anode mesh cylinder is coaxially arranged within the reinforcing chamber, containing nickel. A sand-adding cylinder is located on one side of the anode mesh cylinder, with its upper end extending out of the reinforcing chamber. Both the sanding chamber and the reinforcing chamber have funnel-shaped lower ends. A first liquid inlet pipe is located between the liquid inlet chamber and the plating solution tank. A second liquid inlet pipe is located between the lower part of the reinforcing chamber and the plating solution tank. A return liquid pipe is located between the upper part of the reinforcing chamber and the plating solution tank. Using the cathode conductive wheels as cathodes and the anode mesh cylinder as anodes, nickel in the plating solution within the sanding mechanism is electroplated onto the diamond wire busbars. The plating solution, transported through the first liquid inlet pipe, passes upwards through a perforation into the sanding chamber to agitate the diamond abrasive within.

[0008] Preferably, a drain pipe is provided on one side of the upper sand chamber, and a first valve is provided on the drain pipe.

[0009] Preferably, perforations are provided between the bottom of the sand-applying mechanism and the liquid inlet chamber, and between the liquid inlet chamber and the sand-applying chamber. A rubber ring is fixedly installed on the lower side of the perforation. The inner wall of the rubber ring is in close contact with the diamond wire rod. The perforation ensures that the diamond wire rod passes through, and the rubber ring prevents the plating solution from flowing downward.

[0010] Preferably, a first liquid collection tank is provided below the lower cathode conductive wheel, and a second liquid collection tank is provided on one side below the upper cathode conductive wheel. The first liquid collection tank collects the plating solution that leaks downward out of the sand-applying mechanism, and the second liquid collection tank collects the plating solution carried out by the diamond wire busbar.

[0011] Preferably, the anode mesh cylinder includes a first mesh cylinder, a second mesh cylinder, and a sealing plate. The second mesh cylinder is sleeved on the outside of the first mesh cylinder. Nickel is disposed between the first mesh cylinder and the second mesh cylinder. The sealing plate is an annular plate structure located at the lower end between the first mesh cylinder and the second mesh cylinder. The nickel beads are limited by the two mesh cylinders and the sealing plate, while ensuring contact between nickel and the plating solution. This ensures that the nickel ion content in the plating solution of the sanding mechanism is kept stable at 90-110 g / L, thus ensuring the sanding and reinforcement effect.

[0012] Preferably, both the first and second inlet pipes include a main pipe and multiple branch pipes. Each of the two main pipes is equipped with a pump. One end of the main pipe is connected to the plating solution tank, and the other end is connected to multiple branch pipes. The multiple branch pipes of the first inlet pipe are respectively connected to the corresponding inlet chambers and are each equipped with a flow meter. The multiple branch pipes of the second inlet pipe are respectively connected to the lower part of the corresponding reinforcement chamber and are each equipped with a second valve. The flow rates of the first and second inlet pipes are adjusted by the flow meters and the second valves respectively to ensure the circulation of the plating solution in the reinforcement chamber and the stirring effect of the plating solution on the diamond abrasive in the upper abrasive chamber.

[0013] Preferably, one end of the main pipe of the first inlet pipe is connected to the main plating solution tank, and the other end is connected to multiple branch pipes through a transfer box. An overflow pipe is provided between the transfer box and the main plating solution tank. The transfer box is located above the sand-filling mechanism. The plating solution transported to the transfer box flows down along the branch pipes of the first inlet pipe under the action of gravity.

[0014] Preferably, the transfer box is connected to a spray pipe, which is connected to multiple spray branch pipes. The outlet of each spray branch pipe corresponds vertically to multiple cathode conductive wheels located above, ensuring that the cathode conductive wheels located above are sprayed and preventing the plating solution on them from crystallizing.

[0015] A method for applying abrasive to diamond wire during production, implemented using the aforementioned abrasive application device, includes the following steps: the diamond wire diameter is 420.984 μm, the wire speed is 7-9 m / min, the temperature of the plating solution in the mother tank is 55±2℃, the nickel ion content is 90-110 g / L, 10-20 g of diamond abrasive is added every 25-35 minutes through the abrasive addition cylinder until the diamond abrasive content in the abrasive application chamber is 10-30 g / L, the abrasive application time for the diamond wire is 0.055-0.070 minutes, the nickel plating reinforcement time is 2-3 minutes, and the suspension height of the diamond abrasive in the plating solution within the abrasive application mechanism is 20-40 mm lower than the lower end of the anode mesh cylinder.

[0016] Preferably, the plating solution flow rate of the first inlet pipe is 0.03-0.15 L / min, and the plating solution flow rate of the second inlet pipe is 1.1-1.5 L / min.

[0017] The beneficial effects of the present invention through the above technical solution are as follows:

[0018] 1. This invention adds diamond grit into the upper sanding mechanism, causing the diamond grit to deposit in the lower funnel part of the upper sanding chamber after entering the plating solution. At the same time, the plating solution is transported into the liquid inlet chamber through the first liquid inlet pipe. The plating solution is then transported upward through the lower opening of the funnel-shaped structure in the lower part of the upper sanding chamber, stirring the plating solution in the upper sanding chamber. This also causes the diamond grit to be evenly distributed in the upper sanding chamber, thereby ensuring that the diamond wire passing through it has sufficient and uniform contact with the diamond grit, improving the uniformity of the diamond grit on the surface of the diamond wire, and avoiding diamond grit accumulation.

[0019] 2. The present invention can meet the sand feeding requirements by adding diamond sand to the sand feeding mechanism through the sand feeding cylinder, without adding diamond sand to the plating solution mother tank. That is, diamond sand is almost not required to participate in the plating solution circulation, which effectively reduces the amount of diamond sand input and improves the diamond sand utilization rate.

[0020] 3. The present invention delivers the plating solution to the liquid inlet chamber and then delivers it upward through the corresponding perforation to the upper sand chamber. Since the lower part of the upper sand chamber has a funnel-shaped structure, the plating solution enters the upper sand chamber upward and impacts the deposition center of the diamond, thereby improving the stirring effect on the diamond and disturbing the plating solution in the upper sand chamber, further improving the uniformity of the upper sand.

[0021] 4. The present invention collects the plating solution that flows down from the gap between the diamond wire and the perforation and leaks a small amount through the rubber ring by setting a first liquid collection tank, and collects the plating solution carried out after the diamond wire leaves the sanding mechanism by setting a second liquid collection tank, and reuses the collected plating solution in the subsequent production process, thereby avoiding waste.

[0022] 5. By adjusting the flow rate of the plating solution delivered by the first inlet pipe, the height of the diamond grit suspended in the sand-coating chamber is 20-40mm lower than the lower part of the anode mesh cylinder, thus avoiding the electroplating failure of the diamond grit and ensuring the sand-coating effect.

[0023] 6. The present invention sets the lower end of the reinforcement cavity in a funnel shape to ensure that the diamond abrasive deposited in the reinforcement cavity falls into the upper abrasive cavity. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 .

[0025] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 .

[0026] Figure 3 This is a schematic diagram of the structure of the present invention. Figure 3 .

[0027] Figure 4 This is a schematic diagram of the sand-applying mechanism of the present invention. Figure 1 .

[0028] Figure 5 This is a schematic diagram of the sand-applying mechanism of the present invention. Figure 2 .

[0029] Figure 6 This is a schematic diagram of the sand-applying mechanism of the present invention. Figure 3 .

[0030] Figure 7 For the present invention Figure 6 Enlarged view of point A in the middle.

[0031] Figure 8 For the present invention Figure 6 Enlarged view of point B in the middle.

[0032] Figure 9 This is a schematic diagram of the sand-applying mechanism of the present invention. Figure 4 .

[0033] The numbers in the attached diagram are as follows: 1 is the main plating tank, 11 is the first inlet pipe, 12 is the second inlet pipe, 13 is the return pipe, 14 is the transfer pump, 15 is the transfer box, 16 is the overflow pipe, and 17 is the spray branch pipe.

[0034] 2 is the sand feeding mechanism, 21 is the liquid inlet chamber, 22 is the sand feeding chamber, 23 is the reinforcement chamber, 24 is the liquid drain pipe, and 25 is the perforation.

[0035] 3 is the cathode conductive wheel, 31 is the first liquid collection tank, and 32 is the second liquid collection tank;

[0036] 4 is the anode mesh cylinder, 41 is the first mesh cylinder, 42 is the second mesh cylinder, and 43 is the sealing plate;

[0037] 5 represents the sand-filling cylinder, and 100 represents the diamond wire main wire. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0039] like Figures 1-9 As shown, this embodiment provides a sanding device for diamond wire production, used to sand the diamond wire busbar 100. It includes a plating solution tank 1 and multiple sanding mechanisms 2. The plating solution tank 1 contains plating solution for sanding. Each sanding mechanism 2 has a liquid inlet chamber 21, a sanding chamber 22, and a reinforcing chamber 23 arranged coaxially and interconnected from bottom to top. Cathode conductive wheels 3 are provided at both the upper and lower ends of each sanding mechanism 2. Perforations are provided between the bottom of the sanding mechanism 2 and the liquid inlet chamber 21, and between the liquid inlet chamber 21 and the sanding chamber 22. 25. The diameter of the perforation 25 is 3-10mm. A rubber ring is fixedly installed on the lower side of the perforation 25. The inner wall of the rubber ring is tightly attached to the diamond wire busbar 100. The diamond wire busbar 100 (the diamond wire busbar 100 after pre-plating) passes through the cathode conductive wheel 3 located below and then vertically upwards through the rubber ring, the perforation 25 located below, the liquid inlet chamber 21, the perforation 25 located above, the sanding chamber 22, and the reinforcement chamber 23 before passing through the cathode conductive wheel 3 located above, thus completing the sanding and reinforcement.

[0040] The lower ends of both the upper sand cavity 22 and the reinforcing cavity 23 are configured as funnel-shaped structures. The reinforcing cavity 23 includes an upper cylindrical cavity and a lower funnel-shaped structure. The diameter of the upper cylindrical cavity of the reinforcing cavity 23 is the same as the diameter of the upper opening of the lower funnel-shaped structure. The upper sand cavity 22 includes an upper cylindrical cavity and a lower funnel-shaped structure. The diameter of the upper cylindrical cavity of the upper sand cavity 22 is the same as the diameter of the lower opening of the lower funnel-shaped structure of the reinforcing cavity 23. The upper opening diameter of the lower funnel-shaped structure of the upper sand cavity 22 is the same as the diameter of the upper cylindrical cavity of the upper sand cavity 22. The lower opening diameter of the lower funnel-shaped structure of the upper sand cavity 22 is the same as the diameter of the perforation 25. An anode mesh cylinder 4 is coaxially arranged inside the reinforced cavity 23. Nickel is disposed inside the anode mesh cylinder 4. The anode mesh cylinder 4 includes a first mesh cylinder 41, a second mesh cylinder 42, and a sealing plate 43. The second mesh cylinder 42 is sleeved on the outside of the first mesh cylinder 41. The outer wall of the first mesh cylinder 41 is connected to the outer wall of the second mesh cylinder 42. The gap between the inner walls of the second mesh cylinder 43 is 11-14mm. Nickel is provided between the first mesh cylinder 41 and the second mesh cylinder 42. Specifically, nickel beads are provided between the first mesh cylinder 41 and the second mesh cylinder 42. The diameter of the nickel beads is 1-2mm smaller than the gap between the outer wall of the first mesh cylinder 41 and the inner wall of the second mesh cylinder 43 to achieve full contact between the nickel and the plating solution. The sealing plate 43 is an annular plate structure located at the lower end between the first mesh cylinder 41 and the second mesh cylinder 42. Nickel beads are placed in the annular cavity formed by the first mesh cylinder 41, the second mesh cylinder 42, and the sealing plate 43. The upper side of the annular cavity of the anode mesh cylinder 4 is open to replenish nickel. Mesh holes are evenly distributed on the first mesh cylinder 41 and the second mesh cylinder 42 so that the plating solution can pass through the mesh holes and contact the nickel therein. The diamond wire busbar 100 passes through the central axis of the first mesh cylinder 41. When energized, nickel is electroplated onto the diamond wire busbar 100 to reinforce the diamond grit on the surface of the diamond wire busbar 100.

[0041] A sand-adding cylinder 5 is provided on one side of the anode mesh cylinder 4. The bottom of the sand-adding cylinder 5 is flush with the bottom of the anode mesh cylinder 4. The upper end of the sand-adding cylinder 5 extends out of the reinforcement cavity 23, and diamond sand is added into the sand-adding mechanism 2 through the sand-adding cylinder 5.

[0042] The lower end of the sand-adding cylinder 5 is located inside the lower end of the reinforcement cavity 23, near the funnel-shaped structure at the bottom of the reinforcement cavity 23. Furthermore, the distance between the lower end of the sand-adding cylinder 5, the lower end of the anode mesh cylinder, and the funnel-shaped structure at the bottom of the reinforcement cavity 23 is 20-30mm. The upper opening of the upper sand chamber 22 connects with the lower opening of the reinforcement cavity 23. The diamond abrasive falling through the sand-adding cylinder 5 enters the lower part of the reinforcement cavity 23. The funnel-shaped structure at the bottom of the reinforcement cavity 23 allows the diamond abrasive entering the reinforcement cavity 23 to be reduced by its own gravity. The material moves downward toward the central diamond wire busbar 100 and falls into the upper sand chamber 22. A second inlet pipe 12 is provided between the lower part of the reinforcement chamber 23 and the plating solution mother tank 1. The second inlet pipe 12 is located above the bottom of the sand filling cylinder 5. A return pipe 13 is provided between the upper part of the reinforcement chamber 23 and the plating solution mother tank 1. The plating solution in the plating solution mother tank 1 enters the reinforcement chamber 23 through the second inlet pipe 12. As the liquid level in the reinforcement chamber 23 rises to the return pipe 13, it flows back to the plating solution mother tank 1 through the return pipe 13.

[0043] A first inlet pipe 11 is provided between the liquid inlet chamber 21 and the plating solution mother tank 1. The first inlet pipe 11 transports the plating solution in the plating solution mother tank 1 to the liquid inlet chamber 21, and then transports it upward to the upper sand chamber 22 through the liquid inlet chamber 21. The plating solution entering the upper sand chamber 22 through the lower opening of the funnel-shaped structure at the lower end of the upper sand chamber 22 stirs and agitates the diamond grit in it, so that it is in a suspended state in the upper sand chamber 22, ensuring that the diamond grit is relatively evenly distributed around the diamond wire mother wire 100 in the area of ​​the upper sand chamber 22.

[0044] A drain pipe 24 is provided on one side of the sand-filling chamber 22. A first valve is provided on the drain pipe 24. After the diamond wire preparation is completed, the residual plating solution in the sand-filling mechanism 2 is discharged through the drain pipe. A sand-discharging pipe is provided on the side wall of the lower part of the sand-filling mechanism 2 corresponding to the position of the lower perforation 25. The sand-discharging pipe is close to the bottom of the sand-filling mechanism 2 and is connected to the lower perforation 25. After the diamond wire preparation is completed, the residual diamond grit in the sand-filling mechanism 2 is discharged through the sand-discharging pipe.

[0045] A first liquid collection tank 31 is provided below the lower cathode conductive wheel 3, and a second liquid collection tank 32 is provided on one side below the upper cathode conductive wheel 3. The second liquid collection tank 32 is offset from the upper part of the reinforcement cavity 23 and is located below the diamond wire busbar 100 that winds around the upper cathode conductive wheel 32. As the sanding operation continues, the plating solution that flows out through the lower perforation 25 and leaks a small amount through the rubber ring will fall into the first liquid collection tank 31. The plating solution that is carried out after the diamond wire busbar 100 extends upward out of the reinforcement cavity 23 will fall into the second liquid collection tank 32.

[0046] Both the first inlet pipe 11 and the second inlet pipe 12 include a main pipe and multiple branch pipes. Each of the two main pipes is equipped with a delivery pump 14, which provides power for the plating solution delivery of the first inlet pipe 11 and the second inlet pipe 12 respectively. Based on the different delivery requirements of the two pipes, different delivery power is provided. One end of each of the two main pipes is connected to the plating solution mother tank 1, and the other end is connected to multiple branch pipes. The multiple branch pipes of the first inlet pipe 11 are respectively connected to the corresponding inlet chamber 21, and each branch pipe is equipped with a flow meter. Furthermore, each branch pipe of the first inlet pipe 11 is equipped with a corresponding third valve. The flow rate of the first inlet pipe 11 can be adjusted by the flow meter or the third valve. The multiple branch pipes of the second inlet pipe 12 are respectively connected to the lower part of the corresponding reinforcement chamber 23, and each branch pipe is equipped with a second valve. The flow rate of the second inlet pipe 12 can be adjusted by the second valve.

[0047] One end of the main pipe of the first inlet pipe 11 is connected to the plating solution mother tank 1, and the other end is connected to multiple branch pipes through the transfer box 15. An overflow pipe 16 is provided between the transfer box 15 and the plating solution mother tank 1. The transfer box 15 is located above the sand-coating mechanism 2. The main pipe of the first inlet pipe 11 transports the plating solution to the transfer box 15. The plating solution level rises in the transfer box 15 and flows back to the plating solution mother tank 1 when it reaches the overflow pipe 16. At the same time, since the transfer box 15 is higher than the sand-coating mechanism 2, the plating solution in it is discharged through the multiple branch pipes of the first inlet pipe 11 under the action of gravity and flows into the inlet chambers 21 of the multiple sand-coating mechanisms 2.

[0048] The transfer box 15 is connected to a spray pipe, which is connected to multiple spray branch pipes 17. The outlet of each spray branch pipe 17 corresponds to multiple upper cathode conductive wheels 3. By setting multiple spray pipes, the upper cathode conductive wheels 3 are always sprayed with plating solution during the sand coating operation, thereby preventing the plating solution carried out during the diamond wire conveying process from drying and crystallizing on the cathode conductive wheels 3, and ensuring the quality and effect of sand coating.

[0049] It should be noted that the above-mentioned sanding device for diamond wire production meets the sanding requirements for diamond wires with a specification of 150-500μm.

[0050] A method for sanding diamond wire production, implemented using the aforementioned sanding device, includes the following steps: the diamond wire motherboard 100 has a diameter of 420.984 μm (the diameter before pre-plating is 420 μm, and the pre-plating thickness is 0.492 μm; therefore, the diamond wire motherboard 100 after pre-plating has a diameter of 420.984 μm; pre-plating is a step before sanding in diamond wire production; the diamond wire obtained after sanding has a diameter of 500 μm), and the wire speed is 7-9 m / min. Further, the wire speed of the diamond wire motherboard 100 is 9 m / min. / min, the temperature of the plating solution in the plating bath 1 is 55±2℃ and the nickel ion content is 90-110g / L. After the diamond wire 100 is pre-plated, it is wound around the cathode conductive wheel 3 located below and then vertically upward through the perforation 25 located below, the liquid inlet chamber 21, the perforation 25 located above, the sand chamber 22, and the reinforcement chamber 23. After that, it is wound around the cathode conductive wheel 3 located above. Two liquid pumps 14 are started to transport the plating solution in the plating bath 1 to the lower part of the reinforcement chamber 223 through the second liquid inlet pipe 12, and then return to the plating bath 1 through the return pipe 13.

[0051] The plating solution in the mother tank 1 is transported to the transfer box 15 through the main pipe of the first inlet pipe 11. Then, the plating solution flowing out through the branch pipes of the first inlet pipe 11 is transported to the inlet chamber 21 of the multiple sand-coating mechanisms 2. The plating solution flowing out through the multiple spray pipes sprays the multiple cathode conductive wheels 3 located above through the multiple spray branch pipes 17. After spraying, the plating solution falls into the reinforcement chamber 23.

[0052] The plating solution entering the inlet chamber 21 is conveyed upwards and downwards through two perforations 25. The downward-conveyed plating solution is blocked by a rubber ring as it passes through the lower perforation 25. Even if a small amount of plating solution leaks out through the rubber ring, it will fall into the corresponding first collection tank 31 for collection and reuse. The upward-conveyed plating solution passes through the upper perforation 25 and enters the upper sand chamber 22. Because the diamond grit in the upper sand chamber 22 is deposited at its lower opening, it is disturbed and stirred by the upward-conveyed plating solution, causing it to suspend within the upper sand chamber 22. The plating solution flow rate of the first inlet pipe is 0.03-0.15 L / min, and the plating solution flow rate of the second inlet pipe 12 is 1.1-1.5 L / min, ensuring that the suspended height of the diamond grit in the plating solution within the upper sand chamber 2 is 20-40 mm lower than the lower end of the anode mesh cylinder 4. Specifically, the plating solution flow rate of the first inlet pipe 11 is adjusted to 0.08-0.09 L / min using a flow meter or a corresponding third valve. Furthermore, the flow rate was adjusted to 0.085 L / min.

[0053] Diamond grit (diamond grit particle size 65-80μm) is added to the upper sand chamber 22 through the sand adding cylinder 5, and thereafter 10-20g of diamond grit is added every 25-35 minutes through the sand adding cylinder 5 until the diamond grit content in the upper sand chamber 22 is 10-30g / L, ensuring that the diamond grit content in the upper sand chamber 22 is in a dynamic equilibrium state. The sand adding time for the diamond wire busbar 100 is 0.055-0.070 minutes, and the nickel plating reinforcement time is 2-3 minutes. Furthermore, the sand adding time for the diamond wire busbar... The time interval is 0.06 min (the sanding time refers to the time the diamond wire is in the sanding area, and the sanding area refers to the area between the lower opening of the funnel-shaped structure at the bottom of the reinforcement cavity 23 and the bottom of the sanding cavity 22), and the nickel plating time is 2.4 min (the nickel plating time refers to the time the diamond wire is in the reinforcement area, and the reinforcement area refers to the area between the upper end of the reinforcement cavity 23 and the bottom of its lower funnel-shaped structure). Furthermore, the thickness of the nickel plating layer is 8.53 μm to ensure the sanding effect and the reinforcement effect.

[0054] It should be noted that during the sanding and reinforcement process, the current is provided by the rectifier, and the electroplating of the sanding and reinforcement is carried out with two cathode conductive wheels 3 as cathodes and the anode mesh cylinder 4 as anode. The current is less than or equal to 0.2A.

[0055] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of the present invention should be included within the scope of the present invention.

Claims

1. A sanding device for diamond wire production, used for sanding diamond wire mainframes (100), characterized in that, The system includes a plating bath (1) and multiple sand-applying mechanisms (2). Each sand-applying mechanism (2) has a liquid inlet chamber (21), a sand-applying chamber (22), and a reinforcement chamber (23) arranged coaxially from bottom to top and interconnected. Both ends of the sand-applying mechanism (2) are provided with cathode conductive wheels (3). An anode mesh cylinder (4) is coaxially arranged in the reinforcement chamber (23). Nickel is provided in the anode mesh cylinder (4). A sand-applying device is provided on one side of the anode mesh cylinder (4). The upper end of the sand-adding cylinder (5) extends into the reinforcement cavity (23). The lower ends of the sand-adding cavity (22) and the reinforcement cavity (23) are both funnel-shaped structures. A first liquid inlet pipe (11) is provided between the liquid inlet cavity (21) and the plating solution mother tank (1). A second liquid inlet pipe (12) is provided between the lower part of the reinforcement cavity (23) and the plating solution mother tank (1). A return liquid pipe (13) is provided between the upper part of the reinforcement cavity (23) and the plating solution mother tank (1).

2. The abrasive application device for diamond wire production according to claim 1, characterized in that, A drain pipe (24) is provided on one side of the upper sand chamber (22), and a first valve is provided on the drain pipe (24).

3. The abrasive application device for diamond wire production according to claim 1, characterized in that, The bottom of the sand-filling mechanism (2) is provided with perforations (25) between the bottom and the liquid inlet chamber (21) and between the liquid inlet chamber (21) and the sand-filling chamber (22). A rubber ring is fixedly installed on the lower side of the perforation (25) and the inner wall of the rubber ring is tightly attached to the diamond wire main line (100).

4. The abrasive application device for diamond wire production according to claim 1, characterized in that, A first liquid collection tank (31) is provided below the cathode conductive wheel (3) at the lower end, and a second liquid collection tank (32) is provided on one side below the cathode conductive wheel (3) at the upper end.

5. The abrasive application device for diamond wire production according to claim 1, characterized in that, The anode mesh cylinder (4) includes a first mesh cylinder (41), a second mesh cylinder (42) and a sealing plate (43). The second mesh cylinder (42) is sleeved on the outside of the first mesh cylinder (41). Nickel is disposed between the first mesh cylinder (41) and the second mesh cylinder (42). The sealing plate (43) is an annular plate structure located at the lower end between the first mesh cylinder (41) and the second mesh cylinder (42).

6. The abrasive application device for diamond wire production according to claim 1, characterized in that, Both the first inlet pipe (11) and the second inlet pipe (12) include a main pipe and multiple branch pipes. Both main pipes are equipped with a liquid pump (14). One end of the main pipe is connected to the plating bath (1) and the other end is connected to multiple branch pipes. The multiple branch pipes of the first inlet pipe (11) are respectively connected to the corresponding inlet chamber (21) and are each equipped with a flow meter. The multiple branch pipes of the second inlet pipe (12) are respectively connected to the lower part of the corresponding reinforcement chamber (23) and are each equipped with a second valve.

7. The abrasive application device for diamond wire production according to claim 6, characterized in that, One end of the main pipe of the first liquid inlet pipe (11) is connected to the plating solution mother tank (1), and the other end is connected to multiple branch pipes through the transfer box (15). An overflow pipe (16) is provided between the transfer box (15) and the plating solution mother tank (1). The transfer box (15) is located above the sand loading mechanism (2).

8. The abrasive application device for diamond wire production according to claim 7, characterized in that, The transfer box (15) is connected to a spray pipe, which is connected to multiple spray branch pipes (17). The outlet of each spray branch pipe (17) corresponds to multiple cathode conductive wheels (3) located above.

9. A method for applying abrasive to diamond wire production, characterized in that, The sand-coating device according to any one of claims 1-8 is used to achieve the following steps: the diameter of the diamond wire (100) is 420.984 μm and the wire speed is 7-9 m / min; the temperature of the plating solution in the plating bath (1) is 55±2℃ and the nickel ion content is 90-110 g / L; 10-20 g of diamond sand is added every 25-35 min through the sand-adding cylinder (5) until the diamond sand content in the sand-coating chamber (22) is 10-30 g / L; the sand-coating time of the diamond wire (100) is 0.055-0.070 min and the nickel plating reinforcement time is 2-3 min; the suspension height of the diamond sand in the plating solution in the sand-coating mechanism (2) is 20-40 mm lower than the lower end of the anode mesh cylinder (4).

10. The abrasive application method for diamond wire production according to claim 9, characterized in that, The plating solution flow rate of the first inlet pipe (11) is 0.03-0.15 L / min, and the plating solution flow rate of the second inlet pipe (12) is 1.1-1.5 L / min.

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