Fluid flow limiting assembly for semiconductor equipment

Abstract

The embodiment of the invention provides a fluid flow limiting assembly for semiconductor equipment, which comprises a base body and a flow limiting piece, the base body is provided with a first through hole for accommodating the flow limiting piece, the flow limiting piece is provided with a second through hole for fluid to pass through, the fluid flow limiting assembly also comprises a transition piece, the transition piece is fixedly arranged in the first through hole, and the transition piece is fixedly arranged in the second through hole. A mounting groove is formed in the transition piece, and the flow limiting piece is embedded into the mounting groove; the rigidity of the transition piece is smaller than that of the flow limiting piece. The rigidity of the transition piece is smaller than that of the flow limiting piece, in the expansion process of the flow limiting piece, the transition piece is relatively prone to deformation, when the flow limiting piece is expanded to extrude the transition piece, the transition piece can absorb and buffer force generated by expansion through deformation of the transition piece, and strong reaction extrusion force cannot be generated on the flow limiting piece; and the reliability and the service life of the current limiting piece in a temperature change environment are greatly improved.

Description

Technical Field

[0001] This specification relates to the field of semiconductor manufacturing technology, and specifically to a fluid limiting component for semiconductor equipment. Background Technology

[0002] In the semiconductor manufacturing industry, the accuracy of flow control in gas pipelines plays a crucial role in the stability of semiconductor process technology and product quality. To achieve precise limitation of gas flow, a flow-limiting assembly with a specific structure is commonly used.

[0003] like Figure 1 As shown, this current-limiting assembly mainly consists of a ruby ​​current-limiting gasket with an extremely small diameter and a stainless steel substrate. Specifically, a highly precise mounting hole is machined into the stainless steel substrate using high-precision machining techniques, and then the ruby ​​current-limiting gasket is precisely embedded into this hole. Subsequently, using specialized mechanical tools, the stainless steel substrate material on the outer edge of the ruby ​​is spun, causing the stainless steel material to tightly encapsulate the ruby, thus forming a complete current-limiting assembly. In conventional semiconductor manufacturing processes, this type of current-limiting assembly can generally meet customers' requirements for gas flow control.

[0004] However, with the rapid development of the semiconductor industry, the requirements of process technology on various parameters have become increasingly stringent. The current limiting components of the above-mentioned traditional structure have gradually exposed a series of insurmountable problems and cannot meet the higher standard process requirements.

[0005] On the one hand, when the precision requirements for medium flow rate in the manufacturing process increase to a higher level, the existing embedded structure has significant shortcomings in terms of sealing performance. Due to poor sealing performance, gas leakage occurs when flowing through the flow-limiting assembly, causing the actual gas flow rate to deviate from the expected set value. Moreover, this deviation is difficult to control and predict accurately, which in turn makes it impossible to effectively guarantee the accuracy of the medium flow rate, seriously affecting the stability of semiconductor process technology and product consistency.

[0006] On the other hand, during actual semiconductor manufacturing processes, temperatures often fluctuate to some extent. Ruby and stainless steel substrates have different coefficients of thermal expansion, meaning their expansion and contraction differ with temperature changes. When the temperature change is significant, this difference in thermal expansion coefficients can lead to substantial stress between the ruby ​​and stainless steel substrates. With prolonged use and more frequent temperature changes, this stress accumulates, making the ruby ​​highly susceptible to breakage due to excessive stress. A broken ruby ​​not only loses its current-limiting function but can also damage semiconductor equipment, disrupting the entire production process and increasing production costs and risks.

[0007] In summary, the existing current limiting assembly, which combines ruby ​​current limiting pads with a stainless steel substrate, can no longer meet the demands of high-precision flow control and temperature variation in the face of increasingly demanding semiconductor manufacturing processes. Therefore, it is necessary to improve and optimize it to overcome the shortcomings of the existing technology and provide a more reliable and stable current limiting solution for semiconductor manufacturing. Summary of the Invention

[0008] In view of this, the embodiments of this specification provide a fluid current limiting component for semiconductor devices. The stiffness of the transition component is less than that of the current limiting component. During the expansion process of the current limiting component, the transition component is more likely to deform. The transition component will not generate a strong reaction extrusion force on the current limiting component, which greatly improves the reliability and service life of the current limiting component under temperature change environment.

[0009] This specification provides the following technical solution through its embodiments: a fluid current limiting component for semiconductor devices, comprising a substrate and a current limiting element, wherein the substrate has a first through-hole for accommodating the current limiting element, and the current limiting element has a second through-hole for fluid to pass through. It also includes a transition component, which is fixedly installed in the first through hole. The transition component has an installation groove, and the flow limiting component is embedded in the installation groove. The stiffness of the transition component is less than that of the flow-limiting component.

[0010] Preferably, after the flow restrictor and the transition member are assembled, they form a main sealing surface distributed along the axial direction and an auxiliary sealing surface distributed along the horizontal direction. The area of ​​the auxiliary sealing surface is greater than 50% of the cross-sectional area corresponding to the outer diameter of the flow restrictor.

[0011] Preferably, the transition member includes a columnar body, the mounting groove is formed at one end of the columnar body, and a third through hole for fluid to pass through is formed on the columnar body. The third through hole is concentrically arranged with the second through hole, and the inner diameter of the third through hole is larger than that of the second through hole.

[0012] Preferably, a sealing and fixing part is formed between the columnar body and the first through hole. The sealing and fixing part includes a first mounting structure formed on the inner wall of the first through hole and a second mounting structure formed on the outer periphery of the columnar body. The second mounting structure cooperates with the first mounting structure to make the transition member and the base body securely connected.

[0013] Preferably, the first mounting structure includes an internal thread disposed in the first through hole, and the second mounting structure includes an external thread disposed on the outer periphery of the transition member.

[0014] Preferably, the end of the columnar body away from the mounting groove has a screwing part, through which the transition piece is screwed into the first through hole, so that both ends of the transition piece are not higher than the end face of the base.

[0015] Preferably, the screwing part includes a groove formed on the end face of the columnar body away from the mounting groove; wherein the groove is a polygonal groove symmetrical about the axis of the columnar body or at least two circular grooves.

[0016] Preferably, the current limiting component includes a circular ruby ​​gasket, and the transition component is one of an elastic plastic sleeve, rubber sleeve, or alloy sleeve.

[0017] Preferably, the mounting groove is a circular groove, the outer diameter of the ruby ​​gasket is larger than the inner diameter of the transition member, the ruby ​​gasket is installed in the mounting groove by a temperature difference assembly method, and the outer periphery of the ruby ​​gasket is in contact with the inner wall of the mounting groove.

[0018] Preferably, the height of the mounting groove is greater than the height of the ruby ​​gasket, so as to ensure that the ruby ​​gasket is completely embedded in the mounting groove.

[0019] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least: Because the stiffness of the transition component is less than that of the current limiting component, the transition component is more likely to deform during the expansion of the current limiting component. When the expansion of the current limiting component compresses the transition component, the transition component can absorb and buffer the force generated by the expansion through its own deformation, and will not generate a strong reaction compressive force on the current limiting component, which greatly improves the reliability and service life of the current limiting component under temperature change environment. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a fluid current limiting component for semiconductor devices in the prior art; Figure 2 This is an overall cross-sectional view of the fluid current limiting component for semiconductor devices provided in this application; Figure 3 This is an enlarged structural schematic diagram of the transition mounting portion of the fluid limiting component for semiconductor devices provided in this application; Figure 4This is a three-dimensional structural diagram of the fluid limiting component for semiconductor devices provided in this application after installation; Figure 5 This is a schematic diagram of the structure of the substrate of the fluid limiting component for semiconductor devices provided in this application; Figure 6 This is a schematic diagram of the structure of the transition component of the fluid current limiting assembly for semiconductor devices provided in this application; Figure 7 These are schematic diagrams of different structures of the screwing part of the fluid limiting component for semiconductor devices provided in this application.

[0022] In the figure, 1 is the base; 2 is the flow restrictor; 3 is the transition component; 4 is the first through hole; 5 is the second through hole; 6 is the mounting groove; 7 is the main sealing surface; 8 is the auxiliary sealing surface; 9 is the third through hole; 10 is the first mounting structure; 11 is the second mounting structure; and 12 is the screwing part. Detailed Implementation

[0023] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0024] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0026] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0027] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0028] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0029] like Figures 2-4 As shown, a fluid current limiting component for a semiconductor device includes a substrate 1 and a current limiting element 2. The substrate 1 has a first through-hole 4 for accommodating the current limiting element 2, and the current limiting element 2 has a second through-hole 5 for fluid to pass through. It also includes a transition member 3, which is fixedly installed in the first through hole 4. The transition member 3 has an installation groove 6, and the flow limiting member 2 is embedded in the installation groove 6. The stiffness of the transition member 3 is less than that of the flow limiting member 2.

[0030] The fluid current limiting component for semiconductor equipment is mainly composed of a substrate 1, a current limiting element 2, and a transition element 3. A first through hole 4 is opened on the substrate 1, and the transition element 3 is fixedly installed in the first through hole 4. The transition element 3 is also provided with a mounting groove 6, and the current limiting element 2 is embedded in this mounting groove 6, thereby forming a complete fluid current limiting structure.

[0031] During the operation of semiconductor equipment, ambient temperature or heat generated by the equipment itself can cause temperature changes. When the temperature rises, the current limiting component 2 will expand due to heat. Because the stiffness of the transition component 3 is less than that of the current limiting component 2, the transition component 3 is more prone to deformation during the expansion of the current limiting component 2. When the expansion of the current limiting component 2 compresses the transition component 3, the transition component 3 can absorb and buffer this force generated by the expansion through its own deformation, and will not generate a strong reaction compressive force on the current limiting component 2.

[0032] It should be noted that the current limiting component 2 is generally made of brittle materials (such as ruby). When temperature changes cause expansion, without the buffering effect of the transition component 3, the current limiting component 2 would directly contact the high-rigidity component 1. The strong compressive force generated by the high-rigidity component could easily cause the brittle current limiting component 2 to shatter. The transition component 3, with less rigidity than the current limiting component 2, effectively avoids this situation, greatly improving the reliability and service life of the current limiting component 2 under temperature change environments, and ensuring the normal operation of the fluid current limiting assembly. Through the buffering effect of the transition component 3, the current limiting component 2 is ensured not to be damaged by temperature changes, thus allowing the second through-hole 5 on the current limiting component 2 to continuously and stably limit the fluid flow. Regardless of temperature fluctuations, the fluid can pass through the second through-hole 5 as designed, ensuring the stable operation of the fluid system in the entire semiconductor device, thereby maintaining the overall performance stability of the semiconductor device.

[0033] like Figures 2-3 As shown, in some embodiments, after the flow restrictor 2 and the transition member 3 are assembled, they form a main sealing surface 7 distributed along the axial direction and an auxiliary sealing surface 8 distributed along the horizontal direction. The area of ​​the auxiliary sealing surface 8 is greater than 50% of the cross-sectional area corresponding to the outer diameter of the flow restrictor 2.

[0034] During the assembly of the flow restrictor 2 and the transition component 3, their structural design and assembly process ensure that they come into contact and fit tightly together, forming a main sealing surface 7 distributed axially and an auxiliary sealing surface 8 distributed horizontally. The axial main sealing surface 7 ensures that the flow restrictor 2 and the transition component 3 fit tightly in a direction perpendicular to the component axis during assembly, preventing fluid leakage along the axial direction. The auxiliary sealing surface 8 is the area of ​​tight contact between the flow restrictor 2 and the transition component 3 in the horizontal direction, serving as an auxiliary seal to further prevent fluid leakage from other directions.

[0035] The area of ​​the auxiliary sealing surface 8 is greater than 50% of the cross-sectional area corresponding to the outer diameter of the flow restrictor 2. This is based on considerations of sealing performance and fluid pressure distribution. When the fluid flows in the component, it will exert pressure on the flow restrictor 2 and the transition component 3. The larger area of ​​the auxiliary sealing surface 8 can disperse the pressure of the fluid on the sealing surface, and can provide a larger contact area to resist this fluid pressure and flow impact, making the pressure distribution more uniform, thereby reducing the possibility of fluid leakage from the auxiliary sealing surface 8.

[0036] The main sealing surface 7 and the auxiliary sealing surface 8 together form multiple sealing lines. The main sealing surface 7 primarily prevents fluid leakage along the axial direction, while the auxiliary sealing surface 8 blocks the fluid horizontally. Their cooperation significantly improves the sealing reliability of the entire assembly. Even if the main sealing surface 7 shows minor signs of leakage, the auxiliary sealing surface 8 can further prevent fluid leakage. Simultaneously, the larger area of ​​the auxiliary sealing surface 8 allows for better dispersion of fluid pressure on the sealing surface.

[0037] like Figures 3-6 As shown, in some embodiments, the transition member 3 includes a columnar body, the mounting groove 6 is opened at one end of the columnar body, and a third through hole 9 for fluid to pass through is opened on the columnar body. The third through hole 9 is concentrically arranged with the second through hole 5, and the inner diameter of the third through hole 9 is larger than that of the second through hole 5.

[0038] The transition member 3 is designed as a columnar body with an installation groove 6 at one end for embedding the flow restrictor 2. A third through hole 9 is also formed on the columnar body, and this third through hole 9 is concentrically aligned with the second through hole 5 on the flow restrictor 2. When fluid enters this flow restrictor assembly, it passes sequentially through the second through hole 5 of the flow restrictor 2 and the third through hole 9 of the transition member 3. Because the third through hole 9 and the second through hole 5 are concentric, the fluid can smoothly pass through the assembly along a relatively straight path, reducing bends and collisions during flow and lowering the resistance to fluid flow.

[0039] like Figures 3-6 As shown, in some embodiments, a sealing and fixing part is formed between the columnar body and the first through hole 4. The sealing and fixing part includes a first mounting structure 10 formed on the inner wall of the first through hole 4 and a second mounting structure 11 formed on the outer periphery of the columnar body. The second mounting structure 11 cooperates with the first mounting structure 10 to make the transition member 3 and the base 1 securely connected.

[0040] The first mounting structure 10 is formed on the inner wall of the first through hole 4, and the second mounting structure 11 is formed on the outer periphery of the column. When the column of the transition member 3 is installed into the first through hole 4 of the base 1, the second mounting structure 11 and the first mounting structure 10 cooperate with each other. This cooperation can be of various forms, such as common threaded fit, slot-and-snap fit, interference fit, etc. During the cooperation between the second mounting structure 11 and the first mounting structure 10, due to the interaction force between the two, the outer periphery of the column will be tightly fitted to the inner wall of the first through hole 4. This tight fit results in a good fastening connection between the transition member 3 and the base 1.

[0041] like Figures 5-6As shown, in some embodiments, the first mounting structure 10 includes an internal thread disposed within the first through hole 4, and the second mounting structure 11 includes an external thread disposed on the outer periphery of the transition member 3. The first mounting structure 10 has an internal thread machined into the inner wall of the first through hole 4, and the second mounting structure 11 has an external thread machined into the outer periphery of the columnar body. During installation, by rotating the transition member 3, the external thread and the internal thread are screwed together, and a tight mechanical engagement is formed between the first mounting structure 10 and the second mounting structure 11, thereby realizing the connection between the transition member 3 and the base 1.

[0042] like Figure 7 As shown, in some embodiments, a screwing part 12 is formed at the end of the columnar body away from the mounting groove 6. The transition member 3 is screwed into the first through hole 4 through the screwing part 12, so that both ends of the transition member 3 are not higher than the end face of the base 1.

[0043] A screwing part 12 is provided at the end of the columnar body away from the mounting groove 6. This screwing part 12 typically has a specific shape, such as hexagonal or cross-shaped, to provide an easy point for the installer to apply torque. By applying rotational force to the screwing part 12 with a tool, the transition piece 3 will rotate around its own axis. Because there is a threaded fit between the transition piece 3 and the first through hole 4 of the base 1, the transition piece 3 will gradually screw into the first through hole 4 during rotation. As rotation continues, the transition piece 3 penetrates deeper in the axial direction until it reaches the appropriate installation position.

[0044] like Figure 7 As shown, in some embodiments, the screwing part 12 includes a groove formed on the end face of the columnar body away from the mounting groove 6; wherein the groove is a polygonal groove symmetrical about the axis of the columnar body or at least two circular grooves.

[0045] When a polygonal groove (such as a common hexagonal groove) symmetrical about the axis is cut on the end face of a cylindrical body, a matching polygonal tool (such as an Allen wrench) can be used when installing or removing transition piece 3. The symmetrical structure of the polygonal groove ensures that the contact points between the tool and the groove are evenly distributed and the force is stable during rotation. Compared with circular grooves, the edges of polygonal grooves can provide better friction and constraint, preventing the tool from slipping relative to the groove during rotation.

[0046] When at least two circular grooves are formed on the end face of the cylindrical body, a special tool is required. This tool has protrusions corresponding to the number and position of the circular grooves. The protrusions of the tool are embedded into the circular grooves, and when the tool is rotated, each protrusion simultaneously applies force to the edge of the circular groove. Due to the synergistic effect of multiple circular grooves, the rotational force is dispersed, resulting in a uniform torque on the cylindrical body, thereby enabling the rotational installation or removal of the transition piece 3. The at least two circular grooves serve a positioning function. During tool installation, rotation can only be performed when the protrusions of the tool are accurately embedded in the corresponding circular grooves. This avoids incorrect tool installation and ensures the correct transmission of rotational force. Simultaneously, the combination of multiple circular grooves also prevents the tool from slipping relative to the cylindrical body during rotation, improving operational stability.

[0047] like Figures 2-4 As shown, in some embodiments, the current limiting element 2 includes a circular ruby ​​gasket, and the transition element 3 is a flexible plastic sleeve, rubber sleeve, or alloy sleeve (a composite of metal and plastic or rubber).

[0048] Ruby gaskets can adapt to different fluid media and operating conditions. They maintain good performance in acidic, alkaline, or other corrosive media. Moreover, their flow-limiting effect remains relatively stable under different temperature and pressure environments, demonstrating strong versatility and adaptability.

[0049] The elastic plastic sleeve, rubber sleeve, or alloy sleeve possesses good elasticity and flexibility. When the transition component 3 is installed between the base 1 and the flow restrictor 2, its elastic deformation can fill any minute gaps, forming a good seal. For example, during installation, the plastic sleeve, rubber sleeve, or alloy sleeve, when compressed, will undergo elastic deformation, tightly fitting against the contact surface of the base 1 and the flow restrictor 2, preventing fluid leakage from the gaps. This sealing method is effective for both gases and liquids, ensuring the sealing performance of the flow restrictor assembly under different media.

[0050] like Figures 2-4 As shown, in some embodiments, the mounting groove 6 is a circular groove, the outer diameter of the ruby ​​gasket is larger than the inner diameter of the transition member 3, the ruby ​​gasket is installed in the mounting groove 6 by a temperature difference assembly method, and the outer periphery of the ruby ​​gasket is in contact with the inner wall of the mounting groove 6.

[0051] The circular mounting groove 6 provides a precise installation space for the ruby ​​gasket, allowing for easy positioning during installation and ensuring that its center essentially coincides with the center of the mounting groove 6. The design that the outer diameter of the ruby ​​gasket is larger than the inner diameter of the transition piece 3 forms the basis for the interference fit. During assembly, due to the relatively large size of the ruby ​​gasket, a certain amount of external force is required to insert it into the corresponding mounting position of the transition piece 3 (associated with the mounting groove 6). This interference fit allows the ruby ​​gasket to make tight contact and compression with surrounding components after installation, generating significant friction between the contact surfaces. This prevents the ruby ​​gasket from loosening or shifting during operation, ensuring the stability and reliability of the current-limiting function. The temperature difference assembly method results in high assembly accuracy, a strong and reliable connection, and excellent sealing performance.

[0052] like Figures 2-3 As shown, in some embodiments, the height of the mounting groove 6 is greater than the height of the ruby ​​gasket to ensure that the ruby ​​gasket is completely embedded in the mounting groove 6. The mounting groove 6 is designed to be higher than the height of the ruby ​​gasket, providing a clear installation space and positioning reference for the ruby ​​gasket. During assembly, when the ruby ​​gasket is embedded in the mounting groove 6, the ruby ​​gasket can be smoothly and completely embedded because the mounting groove 6 has sufficient clearance in the height direction. Simultaneously, it protects the ruby ​​gasket, preventing scratches or damage to its surface from friction, thus meeting the cleanliness requirements of the application process.

[0053] like Figures 2-3 As shown, in some embodiments, both ends of the second through-hole 5 expand outwards to form a diffuser. The diffusion effect of the diffuser can improve the distribution of fluid at the inlet and outlet of the second through-hole 5. Without the diffuser, the fluid may concentrate in the central area of ​​the through-hole, resulting in uneven fluid distribution. The diffuser allows the fluid to diffuse more evenly at the outlet, improving the coverage and uniformity of the fluid.

[0054] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0055] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fluid current limiting component for a semiconductor device, comprising a substrate and a current limiting element, wherein the substrate has a first through-hole for accommodating the current limiting element, and the current limiting element has a second through-hole for fluid to pass through, characterized in that, It also includes a transition component, which is fixedly installed in the first through hole. The transition component has an installation groove, and the flow limiting component is embedded in the installation groove. The stiffness of the transition component is less than that of the flow-limiting component.

2. The fluid current limiting component for semiconductor devices according to claim 1, characterized in that, After the flow restrictor and the transition member are assembled, they form a main sealing surface distributed along the axial direction and an auxiliary sealing surface distributed along the horizontal direction. The area of ​​the auxiliary sealing surface is greater than 50% of the cross-sectional area corresponding to the outer diameter of the flow restrictor.

3. The fluid current limiting component for semiconductor devices according to claim 1, characterized in that, The transition member includes a columnar body, the mounting groove is opened at one end of the columnar body, and a third through hole for fluid to pass through is opened on the columnar body. The third through hole is concentrically arranged with the second through hole, and the inner diameter of the third through hole is larger than that of the second through hole.

4. The fluid current limiting component for semiconductor devices according to claim 3, characterized in that, A sealing and fixing part is formed between the columnar body and the first through hole. The sealing and fixing part includes a first mounting structure formed on the inner wall of the first through hole and a second mounting structure formed on the outer periphery of the columnar body. The second mounting structure cooperates with the first mounting structure to make the transition member and the base body tightly connected.

5. The fluid current limiting component for semiconductor devices according to claim 4, characterized in that, The first mounting structure includes an internal thread disposed in the first through hole, and the second mounting structure includes an external thread disposed on the outer periphery of the transition member.

6. The fluid current limiting component for semiconductor devices according to claim 5, characterized in that, The columnar body has a screwing part at one end away from the mounting groove. The transition piece is screwed into the first through hole through the screwing part, so that neither end of the transition piece is higher than the end face of the base.

7. The fluid current limiting component for semiconductor devices according to claim 6, characterized in that, The screwing part includes a groove formed on the end face of the columnar body away from the mounting groove; wherein the groove is a polygonal groove symmetrical about the axis of the columnar body or at least two circular grooves.

8. The fluid current limiting component for semiconductor devices according to any one of claims 1-7, characterized in that, The current limiting component includes a circular ruby ​​gasket, and the transition component is one of an elastic plastic sleeve, rubber sleeve, or alloy sleeve.

9. The fluid current limiting component for semiconductor devices according to claim 8, characterized in that, The mounting groove is a circular groove, the outer diameter of the ruby ​​gasket is larger than the inner diameter of the transition piece, the ruby ​​gasket is installed in the mounting groove by temperature difference assembly, and the outer periphery of the ruby ​​gasket is in contact with the inner wall of the mounting groove.

10. The fluid current limiting component for semiconductor devices according to claim 9, characterized in that, The height of the mounting groove is greater than the height of the ruby ​​gasket to ensure that the ruby ​​gasket is completely embedded in the mounting groove.

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