Test fixture for optical module
By designing a test fixture for optical modules consisting of circuit board assemblies and pressure strip assemblies, the problems of high manufacturing and assembly difficulty and poor testing accuracy in existing technologies have been solved, achieving low-difficulty manufacturing and high-accuracy optical module testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-11
- Publication Date
- 2026-04-03
AI Technical Summary
Existing optical module test fixtures are difficult to manufacture and assemble, have poor testing accuracy, and are prone to problems such as poor contact, momentary open circuit, increased contact resistance, and localized overheating.
A test fixture comprising a circuit board assembly, a base, and a pressure strip assembly was designed. Through the cooperation of the positioning groove and the clamping groove, the pressure strip assembly is used to achieve elastic clamping of the optical module leads, ensuring reliable contact between the leads and the test pad area.
It reduces the difficulty of manufacturing and assembling test fixtures, improves test accuracy, avoids signal transmission problems caused by fatigue wear and dirt, and avoids local heating and increased contact resistance when driven by high current.
Smart Images
Figure CN121784328A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of optical module testing, and in particular to a test fixture for optical modules. Background Technology
[0002] The butterfly-shaped housing is one of the most common hermetically sealed packaging forms in optical modules, designed specifically for high-speed, long-distance fiber optic communication. Its shape resembles a butterfly. The butterfly-shaped housing uses a rectangular metal casing and integrates a ceramic substrate, printed circuit board, optoelectronic / electro-optical conversion chip, MCU control chip, fiber array components, and other optoelectronic devices. The butterfly-shaped housing is wire-bonded on a metallized ceramic plate, resulting in extremely low inductance and capacitance, making it suitable for high-frequency, high-speed applications. The printed circuit board and ceramic plate inside the butterfly-shaped housing are also bonded using gold wire bonding, allowing electrical signals to be led out through leads on the ceramic plate.
[0003] Optical modules packaged in butterfly-shaped housings are tested for photoelectric performance during production using probes or button-shaped fixtures via point contact. These testing fixtures have the following drawbacks: 1) To ensure reliable point contact, the positional tolerance and elastic parameters of the probe or button are required to be very strict. Due to the compact lead layout of the butterfly package, the alignment requirements of the lead position are extremely high, so as to avoid poor contact or momentary open circuit due to the probe or button failing to make reliable contact. This also results in extremely high processing requirements for the test fixture, which increases the difficulty of manufacturing and assembling the test fixture. 2) Probes or hair buttons may experience spring fatigue, tip wear, or surface contamination during frequent insertion and removal. After a period of use, the contact resistance will gradually increase, thus affecting the accuracy of the test.
[0004] 3) The contact resistance of the probe or button may fluctuate slightly due to differences in pressing force, tip shape and surface treatment, which amplifies the error in power and wavelength stability detection of high-speed optical modules, resulting in the need for additional calibration steps. 4) Due to the small contact area of the probe or button, local heating or increased contact resistance is likely to occur when driven by a large current. Summary of the Invention
[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a test fixture for optical modules that is easier to manufacture and assemble, has better testing accuracy, requires no additional calibration, and is less prone to local heating or increased contact resistance.
[0006] The objective of this invention is achieved through the following technical solution: A test fixture for optical modules, comprising: Circuit board assembly; A first base and a second base are respectively disposed on both sides of the circuit board assembly. The second base has a positioning groove and a pressing groove. The positioning groove is connected to the pressing groove. The positioning groove is used to position the optical module so that the lead of the optical module is aligned and abuts against the test pad area of the circuit board assembly in the pressing groove. The gland assembly is connected to the second base; A pressure strip assembly is elastically slidably connected to the pressure cover assembly. The pressure strip assembly is used to elastically press the leads of the optical module against the test pad area through the pressure groove.
[0007] In one embodiment, the gland assembly is detachably connected to the second base.
[0008] In one embodiment, the cap assembly is fastened to the second base.
[0009] In one embodiment, the cap assembly includes a cap, a first latch, and a second latch, wherein the first latch and the second latch are elastically rotatably connected to both sides of the cap; The second base has a first latch and a second latch on both sides respectively. The first latch is elastically engaged in the first latch and the second latch is elastically engaged in the second latch. The pressure strip assembly is elastically slidably connected to the pressure cover.
[0010] In one embodiment, the pressure strip assembly includes a pressure strip and an elastic element. The pressure strip is slidably connected to the cover assembly. The two ends of the elastic element are respectively connected to the pressure strip and the cover assembly. The elastic element is elastically compressed between the pressure strip and the cover assembly. The pressure strip is used to press the lead wire of the optical module to the test pad area through the pressing groove.
[0011] In one embodiment, the pressure cap assembly has a sliding groove, the pressure strip is located in the sliding groove and is slidably connected to the pressure cap assembly, one end of the elastic member abuts against the pressure strip, and the other end of the elastic member abuts against the inner wall of the sliding groove.
[0012] In one embodiment, the inner wall of the sliding groove is provided with a fixing hole, the end of the pressure strip located in the sliding groove is provided with a guide post, one end of the elastic element is located in the fixing hole and connected to the pressure cap assembly, and the other end of the elastic element is sleeved on the guide post.
[0013] In one embodiment, the gland assembly has a protruding alignment flange on one side adjacent to the second base, the second base has an alignment groove, the positioning groove and the pressing groove are both connected to the alignment groove, and the alignment flange is adapted to the alignment groove.
[0014] In one embodiment, the second base has a protruding positioning post, the cover assembly has a positioning hole, and the positioning post is located in the positioning hole and is positioned and connected to the cover assembly.
[0015] In one embodiment, the circuit board assembly has a locking hole that is connected to a positioning groove, and the locking hole is used to lock the optical module in place by a locking member.
[0016] Compared with the prior art, the present invention has at least the following advantages: 1. The aforementioned test fixture for optical modules, with the first base and the second base respectively located on both sides of the circuit board assembly, and the second base having a positioning groove and a clamping groove connected to each other, positions the optical module in the positioning groove so that the leads of the optical module are aligned and contact the test pad area of the circuit board assembly within the clamping groove; and since the pressure strip assembly is elastically slidably connected to the cover assembly, the pressure strip assembly elastically clamps the leads of the optical module to the test pad area through the clamping groove, thereby achieving electrical interconnection between the product and the circuit board assembly. Compared with the probe or button solutions of the prior art, the manufacturing and assembly difficulty of the test fixture is lower. 2. Since the lead wire is elastically pressed against the test pad area by the pressure strip assembly, compared with the existing probe or button solution, it is less likely to have problems with signal transmission quality affected by fatigue wear and dirt, thus improving the test accuracy. 3. The lead wire is elastically pressed into the test soldering area by the pressure strip assembly, which avoids the slight fluctuations in the contact resistance of the probe or button due to differences in pressing force, tip shape and surface treatment, thus eliminating the need for additional calibration steps.
[0017] 4. Since the lead wire is elastically pressed against the test pad area by the pressure strip assembly, the lead wire and the test pad area of the circuit board assembly are in surface contact, which increases the contact area between the lead wire and the test pad area, making the lead wire contact more reliable and less likely to cause local heating or increased contact resistance when driven by high current. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of a test fixture for an optical module according to one embodiment; Figure 2 for Figure 1The exploded view of the test fixture for optical modules shown. Figure 3 for Figure 2 A schematic diagram of the circuit board assembly for the test fixture used for optical modules is shown. Figure 4 for Figure 2 The diagram shows the connection between the pressure strip assembly and the pressure cap assembly; Figure 5 for Figure 1 A schematic diagram of the second base of the test fixture for optical modules is shown. Figure 6 for Figure 5 A schematic diagram of the second base from another perspective; Figure 7 for Figure 2 An exploded view of a portion of the test fixture used for optical modules; Figure 8 for Figure 7 An exploded view of a portion of the test fixture shown. Figure 9 This is a cross-sectional view of a test fixture for an optical module according to another embodiment. Detailed Implementation
[0020] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.
[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0023] This application provides a test fixture for an optical module, comprising: a circuit board assembly; and / or, a first base and a second base respectively disposed on both sides of the circuit board assembly; and / or, the second base having a positioning groove and a clamping groove; and / or, the positioning groove communicating with the clamping groove; and / or, the positioning groove for positioning the optical module, such that the lead of the optical module is aligned and abuts against the test pad area of the circuit board assembly within the clamping groove; and / or, a cover assembly connected to the second base; and / or, a pressure strip assembly elastically slidably connected to the cover assembly; and / or, the pressure strip assembly for elastically clamping the lead of the optical module to the test pad area through the clamping groove.
[0024] The aforementioned test fixture for optical modules, with the first and second bases respectively located on both sides of the circuit board assembly, and the second base having a positioning groove and a clamping groove connected to each other, positions the optical module so that the leads of the optical module are aligned and contact the test pad area of the circuit board assembly within the clamping groove. Furthermore, since the pressure strip assembly is elastically slidably connected to the cover assembly, the pressure strip assembly elastically clamps the leads of the optical module to the test pad area through the clamping groove, thereby achieving electrical interconnection between the product and the circuit board assembly. Compared with the probe or button solutions of the prior art, the manufacturing and assembly difficulty of the test fixture is lower. Because the leads are elastically pressed against the test pad area by the clamping assembly, compared to existing probe or button-based solutions, signal transmission quality is less susceptible to issues caused by fatigue wear and contamination, thus improving test accuracy. The clamping assembly also prevents minor fluctuations in contact resistance caused by differences in clamping force, tip shape, and surface treatment, eliminating the need for additional calibration steps. Furthermore, the elastic pressing of the leads against the test pad area ensures surface contact between the leads and the circuit board assembly, increasing the contact area and making the lead contact more reliable. This also reduces the likelihood of localized overheating or increased contact resistance during high-current operation.
[0025] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments: like Figures 1 to 6 As shown, a test fixture 20 for an optical module 10 in one embodiment includes a circuit board assembly 100, a first base 200, a second base 300, a cover assembly 400, and a pressure strip assembly 500.
[0026] A first base 200 and a second base 300 are respectively disposed on both sides of the circuit board assembly 100. The second base 300 has a positioning groove 302 and a clamping groove 304, the positioning groove 302 and the clamping groove 304 communicating with each other. The positioning groove 302 is used to position the optical module 10, so that the lead wire 12 of the optical module 10 is aligned and abuts against the test pad area 101 of the circuit board assembly 100 within the clamping groove 304.
[0027] Furthermore, the cover assembly 400 is connected to the second base 300. The pressure strip assembly 500 is elastically slidably connected to the cover assembly 400, and the pressure strip assembly 500 is used to elastically press the lead wire of the optical module 10 to the test pad area through the pressure groove 304.
[0028] The aforementioned test fixture 20 for the optical module 10, with the first base 200 and the second base 300 respectively located on both sides of the circuit board assembly 100, and the second base 300 having a positioning groove 302 and a pressing groove 304 connected to each other, positions the optical module 10 so that the leads of the optical module 10 are aligned and contacting the test pad area of the circuit board assembly 100 within the pressing groove 304; and since the pressure strip assembly 500 is elastically slidably connected to the cover assembly 400, the pressure strip assembly 500 elastically presses the leads of the optical module 10 onto the test pad area through the pressing groove 304, so that the leads are reliably pressed and attached to the test pad area, thereby achieving better electrical interconnection between the optical module 10 and the circuit board assembly 100, and testing of the optical module 10 product through the circuit board assembly 100. Compared with the probe or button solution of the prior art, the manufacturing and assembly difficulty of the test fixture 20 is lower. Because the leads are elastically pressed against the test pad area by the pressure strip assembly 500, compared to existing probe or button solutions, signal transmission quality is less likely to be affected by fatigue wear and dirt, thus improving test accuracy. The pressure strip assembly 500 also prevents minor fluctuations in contact resistance caused by pressure, tip shape, and surface treatment differences in probes or buttons, eliminating the need for additional calibration steps. Furthermore, the elastic pressing of the leads against the test pad area by the pressure strip assembly 500 ensures surface contact between the leads and the test pad area of the circuit board assembly 100, increasing the contact area and making the lead contact more reliable. This also reduces the likelihood of localized heating or increased contact resistance during high-current driving.
[0029] like Figure 1 , Figure 2 and Figure 4As shown, in one embodiment, the cover assembly 400 is detachably connected to the second base 300. When the optical module 10 is tested, the cover assembly 400 can be detached from the second base 300, so that the pressure strip assembly 500 leaves the lead wire along with the cover assembly 400, and then the optical module 10 can be taken out. Conversely, when testing the optical module 10, the optical module 10 can be positioned in the positioning groove 302 first, and then the cover assembly 400 can be connected to the second base 300, so that the pressure strip assembly 500 elastically presses the lead wire to the test pad area through the pressing groove 304.
[0030] like Figure 1 , Figure 2 and Figure 4 As shown, in one embodiment, the cap assembly 400 is fastened to the second base 300, allowing the cap assembly 400 to be quickly installed and removed from the second base 300, thereby improving the efficiency of installing and removing the cap assembly 400 from the second base 300 and thus improving the ease of use of the test fixture 20.
[0031] like Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, in one embodiment, the cover assembly 400 includes a cover 410, a first latch 420, and a second latch 430. The first latch 420 and the second latch 430 are elastically rotatably connected to both sides of the cover 410. A first latching groove 302 and a second latching groove 304 are respectively provided on both sides of the second base 300. The first latch 420 elastically engages in the first latching groove 302, and the second latch 430 elastically engages in the second latching groove 304. The pressure strip assembly 500 is elastically slidably connected to the cover 410. Under the engaging action of the first latch 420 and the second latch 430, the cover 410 is reliably pressed against the lead wire by the pressure strip assembly 500. In this embodiment, the cover 410 is also used to abut against the optical module 10 to press it against the optical module 10. The first latch 420 and the second latch 430 are elastically rotatably connected to both sides of the cover 410. When the optical module 10 is tested, the first latch 420 and the second latch 430 can be pressed first, so that the first latch 420 and the second latch 430 are elastically rotatably connected to both sides of the cover 410, so that the second latch 430 and the first latch 420 open relative to each other, thereby allowing the first latch 420 to leave the first latching groove 302 and the second latch 430 to leave the second latching groove 304. In this way, the cover assembly 400 can be disassembled from the second base 300, and the pressure strip assembly 500 can be removed from the lead wire along with the cover assembly 400, and then the optical module 10 can be taken out. Conversely, when testing the optical module 10, the first... Position the optical module 10 in the positioning groove 302, then press the first latch 420 and the second latch 430, causing the first latch 420 and the second latch 430 to elastically rotate and connect to both sides of the cover 410, so that the second latch 430 and the first latch 420 open relative to each other, with the first latch 420 sliding into the first snap-fit groove 302 and the second latch 430 sliding into the second snap-fit groove 304; then release the first latch 420 and the second latch 430, causing the first latch 420 to elastically snap into the first snap-fit groove 302 and the second latch 430 to elastically snap into the second snap-fit groove 304, thereby connecting the cover assembly 400 to the second base 300, so that the pressure strip assembly 500 elastically presses the lead wire to the test pad area through the pressure groove 304. The cover assembly 400 can be quickly installed and removed from the second base 300, while ensuring that the cover assembly 400 is reliably fastened to the second base 300.
[0032] See also Figures 4 to 8Furthermore, the first latch 420 includes a first rotating shaft 422 and a first latch body 424. The first rotating shaft 422 is fixed to the first rotating shaft support ear 412 of the pressure cover 410, and the first latch body 424 is rotatably connected to the first rotating shaft 422, so that the first latch body 424 can be rotatably connected to the pressure cover 410. In this embodiment, the first latch body 424 is provided with a first barb 4242, so that the first barb 4242 can be reliably engaged in the first snap groove 302, thereby making the first latch body 424 and the inner wall of the first snap groove 302 tightly fit together, preventing the pressure cover assembly 400 from falling out. Furthermore, a first baffle 414 protrudes from the pressure cap 410, and a first elastic reset member 4244 protrudes from the side of the first latch body 424 adjacent to the second latch 430. The end of the first elastic reset member 4244 away from the first latch body 424 abuts against the first baffle 414, allowing the first latch 420 to be elastically rotatably connected to the pressure cap 410. When the first latch body 424 is pressed, the first latch body 424 rotates in the forward direction relative to the first pivot 422, and the first elastic reset member 4244 undergoes elastic deformation under pressure. When the first latch body 424 is released, the first latch body 424 rotates in the reverse direction relative to the first pivot 422 under the elastic force of the first elastic reset member 4244 until the first latch body 424 returns to its original position. Specifically, the first baffle 414 is fixedly connected to the pressure cap 410 by screws, making the first baffle 414 and the pressure cap 410 detachably connected. It is understood that in other embodiments, the first baffle 414 and the pressure cap 410 are not limited to being fixedly connected by screws. For example, the first baffle 414 is welded to the pressure cap 410. Alternatively, the first baffle 414 and the pressure cap 410 are integrally formed structures.
[0033] Furthermore, the first baffle 414 is provided with two opposing first blocking ends, which are located at both ends of the first rotating shaft 422, so that the first baffle 414 can prevent the first rotating shaft 422 from coming out, and at the same time provide elastic compression support for the first elastic reset member 4244.
[0034] Furthermore, a first limiting protrusion is provided on one side of the first ear body 424 adjacent to the pressure cover 410. The first limiting protrusion is used to abut against the side wall of the pressure cover 410 when the first ear body 424 is reset, so that the first ear body 424 is relatively limited relative to the pressure cover 410 after it is rotated into place.
[0035] See also Figures 4 to 8Furthermore, the second clip 430 includes a second rotating shaft 432 and a second clip body 434. The second rotating shaft 432 is fixed to the second rotating shaft support ear 413 of the pressure cover 410, and the second clip body 434 is rotatably connected to the second rotating shaft 432, so that the second clip body 434 can be rotatably connected to the pressure cover 410. In this embodiment, the second ear body 434 is provided with a second barb 4342, which reliably engages with the second buckle groove 304, thereby making the second ear body 434 and the inner wall of the second buckle groove 304 tightly fit together to prevent the cover assembly 400 from coming out; the cover 410 is provided with a second baffle 416, and the side of the second ear body 434 adjacent to the first ear 420 is provided with a second elastic reset member 4245. The end of the second elastic reset member 4245 away from the second ear body 434 abuts against the second baffle 416, so that the second ear 430 is elastically rotatably connected to the cover 410. When the second latch body 434 is pressed, it rotates in the forward direction relative to the second pivot 432, and the second elastic reset member 4245 undergoes elastic deformation under pressure. When the second latch body 434 is released, it rotates in the reverse direction relative to the second pivot 432 under the elastic force of the second elastic reset member 4245 until it returns to its original position. Specifically, the second baffle 416 is fixedly connected to the cover 410 by screws, making the second baffle 416 and the cover 410 detachably connected. It can be understood that in other embodiments, the second baffle 416 and the cover 410 are not limited to being fixedly connected by screws; for example, the second baffle 416 is welded to the cover 410. Alternatively, the second baffle 416 and the cover 410 are integrally formed.
[0036] Furthermore, the second baffle 416 is provided with two opposing second blocking ends, which are located at both ends of the second rotating shaft 432, so that the second baffle 416 can prevent the second rotating shaft 432 from coming out, and at the same time provide elastic compression support for the second elastic reset member 4245.
[0037] See also Figures 4 to 8 Furthermore, a second limiting protrusion 4346 is provided on one side of the second clip body 434 adjacent to the pressure cover 410. The second limiting protrusion 4346 is used to abut against the side wall of the pressure cover 410 when the second clip body 434 is reset, so that the second clip body 434 is relatively limited relative to the pressure cover 410 after it is rotated into place.
[0038] In this embodiment, both the first elastic reset member 4244 and the second elastic reset member 4245 are helical springs. In other embodiments, the first elastic reset member 4244 and the second elastic reset member 4245 may also be elastic rubber parts.
[0039] It is understood that in other embodiments, the first latch body 424 is not limited to being elastically rotatably connected to the cover 410 via the first elastic reset member 4244 and the first baffle 414. For example, the first latch body 424 can be rotatably connected to the first rotating shaft 422 via a torsion spring. Similarly, the second latch body 434 can also be rotatably connected to the second rotating shaft 432 via a torsion spring.
[0040] Furthermore, both the first base 200 and the second base 300 are fixed to the circuit board assembly 100 by screws, so that both the first base 200 and the second base 300 can be detachably connected to the circuit board assembly 100.
[0041] See also Figures 1 to 2 Furthermore, both the first base 200 and the second base 300 are made of rigid insulating materials. For example, both the first base 200 and the second base 300 are made of PPS, which gives both the first base 200 and the second base 300 good insulation properties, and at the same time gives both the first base 200 and the second base 300 good structural strength.
[0042] See also Figures 4 to 9 In one embodiment, the pressure strip assembly 500 includes a pressure strip 510 and an elastic element 520. The pressure strip 510 is slidably connected to the cover assembly 400. The two ends of the elastic element 520 are respectively connected to the pressure strip 510 and the cover assembly 400. The elastic element 520 is elastically compressed between the pressure strip 510 and the cover assembly 400. The pressure strip 510 is used to press the lead wire of the optical module 10 against the test pad area through the pressing groove 304. Under the elastic force generated by the compression of the elastic element 520, the pressure strip 510 reliably presses the lead wire against the test pad area, thereby reliably pressing and adhering the lead wire to the test pad area. This achieves better electrical interconnection between the optical module 10 and the circuit board assembly 100, and allows for testing of the optical module 10 product through the circuit board assembly 100. In this embodiment, the elastic element 520 is a coil spring or elastic rubber. Furthermore, the pressure strip 510 is slidably connected to the pressure cover 410, and the two ends of the elastic member 520 are respectively connected to the pressure strip 510 and the pressure cover 410. The elastic member 520 is elastically compressed between the pressure strip 510 and the pressure cover 410.
[0043] See also Figure 4 , Figures 6 to 8In one embodiment, the pressure cap assembly 400 has a sliding groove 402, the pressure strip 510 is located within the sliding groove 402 and is slidably connected to the pressure cap assembly 400, one end of the elastic member 520 abuts against the pressure strip 510, and the other end of the elastic member 520 abuts against the inner wall of the sliding groove 402. In this embodiment, the sliding groove 402 is formed in the pressure cap 410, and the pressure strip 510 is located within the sliding groove 402 and is slidably connected to the pressure cap 410.
[0044] See also Figure 4 , Figure 7 and Figure 9 Furthermore, the pressure strip 510 includes a sliding part 510a and an anti-detachment part 510b connected to each other. The cross-sectional area of the anti-detachment part 510b is larger than that of the sliding part 510a. An anti-detachment flange 511 protrudes from the part of the anti-detachment part 510b connected to the sliding part 510a. The sliding groove 402 includes a sliding groove opening 4022 and a limiting groove 4024 connected to each other. The cross-sectional area of the sliding groove opening 4022 is smaller than that of the limiting groove 4024. The sliding part 510a passes through the sliding groove opening 4022 and is slidably connected to the pressure cover 410. The cross-sectional area of the anti-detachment part 510b is larger than that of the sliding groove opening 4022. The anti-detachment flange 511 is limited within the limiting groove 4024, so that the pressure strip 510 is limited to sliding within the sliding groove 402, thus preventing the pressure strip 510 from sliding off the pressure cover 410. In this embodiment, the sliding part 510a extends out of the lower surface of the pressure cover 410 and is attached to the lead wire of the optical module 10.
[0045] See also Figure 4 , Figures 6 to 9 In one embodiment, a fixing hole 4023 is provided on the inner wall of the sliding groove 402. A guide post 515 is provided at the end of the pressure strip 510 located within the sliding groove 402. One end of the elastic element 520 is located within the fixing hole 4023 and connected to the pressure cap assembly 400. The other end of the elastic element 520 is sleeved on the guide post, allowing the elastic element 520 to effectively elastically act on the pressure strip 510. In this embodiment, the guide post and the elastic element 520 are coaxially arranged, allowing the elastic element 520 to effectively elastically act on the pressure strip 510 along the axial direction of the guide post. Furthermore, both ends of the elastic element 520 are welded to the fixing hole 4023 and the guide post, respectively.
[0046] See also Figure 4 , Figures 6 to 9Furthermore, there are multiple sliding grooves 402 and multiple fixing holes 4023, and multiple pressure strips 510, which are slidably connected to the multiple sliding grooves 402 one by one. There are multiple elastic elements 520, and the two ends of each elastic element 520 are respectively connected to the corresponding pressure strip 510 and the corresponding fixing hole 4023, so that each pressure strip 510 is elastically slidably connected to the cover 410. In this embodiment, there are multiple pressure strips 510, elastic elements 520, sliding grooves 402 and fixing holes 4023, and three elastic elements 520 extend out of the lower surface of the cover 410 and are attached to the three rows of leads corresponding to the optical module 10.
[0047] It is understood that, in one embodiment, the elastic force of the elastic element 520 acts more evenly on the lead wire, so that the lead wire fits more evenly on the test pad area of the circuit board assembly 100, and the signal fluctuation and deviation between channels are smaller during the high-speed optical module 10 test.
[0048] See also Figure 4 , Figures 6 to 9 Furthermore, the cover 410 has an optical module clearance slot 413 and a thermocouple clearance slot 415. The optical module clearance slot 413 and the thermocouple clearance slot 415 are connected. The optical module clearance slot 413 is used to avoid the optical module 10 during assembly. After the cover assembly 400 is assembled, the optical module clearance slot 413 can prevent the housing of the optical module 10 from interfering with the cover assembly 400. When the test fixture 20 is used to conduct a temperature shock test on the optical module 10, the thermocouple can be attached to the upper surface of the housing of the optical module 10 through the thermocouple clearance slot as a sensing device for ambient temperature, which improves the convenience of testing.
[0049] See also Figures 4 to 9 Furthermore, the pressure cover 410 includes a base plate 4102 and an upper cover 4104. The upper cover 4104 is connected to the base plate 4102, a sliding groove 4022 is formed through the base plate 4102, and a limiting groove 4024 is formed on the side of the upper cover 4104 adjacent to the base plate 4102. In this embodiment, the first latch 420 and the second latch 430 are elastically rotatably connected to the base plate 4102, the first baffle 414 and the second baffle 416 are both protruding from the base plate 4102, and the optical module clearance groove 413 and the thermocouple clearance groove 415 are both formed on the base plate 4102.
[0050] See also Figures 4 to 9Furthermore, the upper cover 4104 and the base plate 4102 are detachably connected, allowing for regular maintenance or replacement of the pressure strip 510 and improving the ease of use of the test fixture 20. In this embodiment, the pressure cover 410 also includes a fixing screw 419. The upper cover 4104 has a countersunk groove 4105, and the base plate 4102 has a screw hole 4103. The fixing screw is screwed into the screw hole through the countersunk groove, making the upper cover 4104 and the base plate 4102 detachably connected.
[0051] See also Figures 4 to 9 Furthermore, the upper cover 4104 also has an opening 4106 that communicates with the thermocouple clearance groove 415. The opening 4106 is positioned corresponding to the center of the upper surface of the housing of the optical module 10, serving as a vent for the heat flow meter. In this embodiment, the periphery of the opening of the opening 4106 is chamfered.
[0052] See also Figures 4 to 9 In one embodiment, the pressure cap assembly 400 has a protruding alignment flange 405 on one side adjacent to the second base 300. The second base 300 has an alignment groove 306, and the positioning groove 302 and the clamping groove 304 are both connected to the alignment groove 306. The alignment flange 405 is adapted to fit within the alignment groove 306, allowing the pressure cap assembly 400 and the second base 300 to be better aligned and assembled. This also improves the accuracy of the pressure strip assembly 500 in elastically pressing the leads of the optical module 10 onto the test pad area through the clamping groove 304, thereby ensuring reliable alignment and contact between the leads of the optical module 10 and the test pad area of the circuit board assembly 100 within the clamping groove 304. In this embodiment, the alignment flange 405 protrudes from the pressure cap 410. Specifically, the alignment flange 405 protrudes from the base plate 4102.
[0053] See also Figures 4 to 9 Furthermore, the sliding groove 402 is provided at the part of the pressure cover 410 where the alignment flange 405 is provided, which improves the structural strength of the pressure cover 410. At the same time, with the alignment of the alignment flange 405 and the alignment groove 306, the accuracy of the pressure strip 510 in elastically pressing the lead wire of the optical module 10 into the test pad area through the pressing groove 304 is improved, thereby making the lead wire of the optical module 10 reliably aligned and abutting with the test pad area of the circuit board assembly 100 in the pressing groove 304.
[0054] See also Figures 4 to 9In one embodiment, the second base 300 has a protruding positioning post 303, and the cap assembly 400 has a positioning hole 403. The positioning post 303 is located in the positioning hole and is positioned and connected to the cap assembly 400, so that the cap assembly 400 and the second base 300 are better aligned and assembled. With the cooperation of the positioning post 303 and the positioning hole, the alignment flange 405 and the alignment groove 306 can be quickly aligned and assembled, thereby enabling the cap assembly 400 and the second base 300 to be better aligned and assembled.
[0055] See also Figures 2 to 3 In one embodiment, the circuit board assembly 100 has a locking hole 103, which corresponds to and communicates with the positioning groove 302. The locking hole is used to securely connect the optical module 10 to the circuit board assembly 100 via a fastener 30. Before testing, the fastener can be used to lock and fix the optical module 10 to the circuit board assembly 100 to prevent the optical module 10 from shifting, thereby allowing the pressure strip 510 to better elastically press the leads against the test pad area. After testing, the fastener is loosened so that the optical module 10 can be removed from the second base 300 through the positioning groove 302 after removing the cover assembly 400. In this embodiment, the locking element is a screw or bolt. In this embodiment, the optical module has a connection through hole 12, and the fastener 30 is securely connected to the locking hole 103 through the connection through hole 12.
[0056] See also Figures 2 to 3 In one specific embodiment, the optical module 10 is fixed in the positioning groove 302 of the second base 300 and quickly fixed on the corresponding locking hole of the second base 300 by four fasteners, and the 52 leads of the optical module 10 are precisely aligned with the corresponding elongated test pad area of the circuit board assembly 100.
[0057] Furthermore, the circuit board assembly 100 is provided with a power conversion circuit and power terminals, serving to supply power to the optical module 10 and provide power protection. Even further, the circuit board assembly 100 is also provided with pin headers and SMA interfaces, serving as interfaces for debugging and testing the functions and performance of the optical module 10. In one specific embodiment, the top surface of the circuit board assembly 100 is provided with power terminals, a power conversion chip (5V to 3.3V), and power circuit-related resistors and capacitors, as well as pin headers for debugging and testing. The bottom surface of the circuit board assembly 100 is provided with 16 SMA connectors for leading out the 16 high-speed differential signals of the optical module 10.
[0058] like Figures 4 to 7As shown, the second base 300 is further provided with a first wedge-shaped chamfer surface 3002 and a second wedge-shaped chamfer surface 3004 on both sides. The first wedge-shaped chamfer surface 3002 extends to the first buckle groove 302, so that the first barb 4242 slides and engages better in the first buckle groove 302 along the first wedge-shaped chamfer surface 3002; the second wedge-shaped chamfer surface 3004 extends to the second buckle groove 304, so that the second barb 4342 slides and engages better in the second buckle groove 304 along the second wedge-shaped chamfer surface 3004. This improves the efficiency of the first barb 4242 engaging in the first buckle groove 302 and the efficiency of the second barb 4342 engaging in the second buckle groove 304. In this embodiment, the thermocouple is attached to the upper surface of the housing of the optical module 10 with high-temperature tape. The position of the thermocouple is adjusted so that the position of the thermocouple is exactly aligned with the thermocouple clearance groove of the cover assembly 400. At the same time, the lead strip 510 and the lead of the cover assembly 400 are aligned with the three sets of lead directions of the optical module 10, and the cover assembly 400 is pressed in from top to bottom. Specifically, during assembly, firstly, press down on the first latch 420 and the second latch 430 on both sides simultaneously and slowly apply downward force, sliding along the wedge-shaped chamfered surfaces of the first latching groove 302 and the second latching groove 304 on both sides of the second base 300 until the first barb at the bottom of the first latch 420 engages with the first latching groove 302 and the second barb at the bottom of the second latch 430 engages with the second latching groove 304. Then, release the first latch 420 and the second latch 430 to complete the installation of the cover assembly 400, so that the lower surface of the cover 410 is tightly fitted with the upper surface of the second base 300. At this time, under the elastic force of the internal elastic element 520, the pressure strip 510 simultaneously presses and adheres the three sets of 52 leads to the 52 pads of the test pad area of the circuit board assembly 100. After assembly, the optical module 10 can be debugged and tested through the power supply interface, SMA test interface, pin header, etc. of the circuit board assembly 100. At the same time, it can be debugged and tested under temperature shock environment test through this tooling.
[0059] Compared with the prior art, the present invention has at least the following advantages: 1. The test fixture 20 for the optical module 10 described above, since the first base 200 and the second base 300 are respectively located on both sides of the circuit board assembly 100, the second base 300 has a positioning groove 302 and a pressing groove 304, the positioning groove 302 and the pressing groove 304 are connected, the positioning groove 302 positions the optical module 10, so that the lead wire of the optical module 10 is aligned and abuts against the test pad area of the circuit board assembly 100 in the pressing groove 304; since the pressure strip assembly 500 is elastically slidably connected to the cover assembly 400, the pressure strip assembly 500 elastically presses the lead wire of the optical module 10 against the test pad area through the pressing groove 304, so that the lead wire of the optical module 10 achieves electrical interconnection between the optical module 10 and the circuit board assembly 100 by electrical overlap, thereby achieving electrical interconnection between the product and the circuit board assembly 100. Compared with the probe or button solution of the prior art, the manufacturing and assembly difficulty of the test fixture 20 is lower. 2. Since the lead wire is elastically pressed against the test pad area by the pressure strip assembly 500, compared with the existing probe or button solution, it is less likely to have problems affecting signal transmission quality due to fatigue wear and dirt, thus improving the test accuracy. 3. The lead wire is elastically pressed against the test soldering area by the pressure strip assembly 500, which avoids the slight fluctuations in the contact resistance of the probe or button due to differences in pressing force, tip shape and surface treatment, thus eliminating the need for additional calibration steps.
[0060] 4. Since the lead wire is elastically pressed against the test pad area by the pressure strip assembly 500, the lead wire and the test pad area of the circuit board assembly 100 are in surface contact, which increases the contact area between the lead wire and the test pad area, making the lead wire contact more reliable and less likely to cause local heating or increased contact resistance when driven by high current.
[0061] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A test fixture for optical modules, characterized in that, include: Circuit board assembly; A first base and a second base are respectively disposed on both sides of the circuit board assembly. The second base has a positioning groove and a pressing groove. The positioning groove is connected to the pressing groove. The positioning groove is used to position the optical module so that the lead of the optical module is aligned and abuts against the test pad area of the circuit board assembly in the pressing groove. The gland assembly is connected to the second base; A pressure strip assembly is elastically slidably connected to the pressure cover assembly. The pressure strip assembly is used to elastically press the leads of the optical module against the test pad area through the pressure groove.
2. The test fixture for optical modules according to claim 1, characterized in that, The pressure cap assembly is detachably connected to the second base.
3. The test fixture for optical modules according to claim 2, characterized in that, The cap assembly is fastened to the second base.
4. The test fixture for optical modules according to claim 3, characterized in that, The cap assembly includes a cap, a first latch, and a second latch, wherein the first latch and the second latch are elastically rotatably connected to both sides of the cap; The second base has a first latch and a second latch on both sides respectively. The first latch is elastically engaged in the first latch and the second latch is elastically engaged in the second latch. The pressure strip assembly is elastically slidably connected to the pressure cover.
5. The test fixture for optical modules according to claim 1, characterized in that, The pressure strip assembly includes a pressure strip and an elastic element. The pressure strip is slidably connected to the cover assembly. The two ends of the elastic element are respectively connected to the pressure strip and the cover assembly. The elastic element is elastically compressed between the pressure strip and the cover assembly. The pressure strip is used to press the lead wire of the optical module to the test pad area through the pressing groove.
6. The test fixture for optical modules according to claim 5, characterized in that, The pressure cap assembly has a sliding groove, the pressure strip is located in the sliding groove and is slidably connected to the pressure cap assembly, one end of the elastic member abuts against the pressure strip, and the other end of the elastic member abuts against the inner wall of the sliding groove.
7. The test fixture for optical modules according to claim 6, characterized in that, The inner wall of the sliding groove is provided with a fixing hole, the end of the pressure strip located in the sliding groove is provided with a guide post, one end of the elastic element is located in the fixing hole and connected to the pressure cap assembly, and the other end of the elastic element is sleeved on the guide post.
8. The test fixture for optical modules according to claim 1, characterized in that, The pressure cap assembly has a protruding alignment flange on one side adjacent to the second base, and the second base has an alignment groove. The positioning groove and the pressing groove are both aligned with the alignment groove, and the alignment flange is adapted to fit into the alignment groove.
9. The test fixture for optical modules according to claim 8, characterized in that, The second base has a protruding positioning post, and the cover assembly has a positioning hole. The positioning post is located in the positioning hole and is positioned and connected to the cover assembly.
10. The test fixture for optical modules according to any one of claims 1 to 9, characterized in that, The circuit board assembly has a locking hole, which is connected to the positioning groove. The locking hole is used to lock the optical module in place with a locking component.