Baseband chip and configuration method thereof

Abstract

The invention discloses a baseband chip and a configuration method thereof, the baseband chip comprises an external interface module, an RDSS module, an intermediate layer control module and a radio frequency driving module, and the RDSS module comprises a radio frequency initialization unit; the middle layer control module comprises a radio frequency control middle layer unit; the radio frequency driving module comprises a radio frequency chip read-write driving unit comprising a plurality of read-write driving interfaces; the external interface module is set to receive a model parameter or a radio frequency initialization parameter of a target radio frequency chip and send the model parameter or the radio frequency initialization parameter to the radio frequency initialization unit; the radio frequency initialization unit is set to send a model parameter or a radio frequency initialization parameter to the radio frequency control intermediate layer unit; the radio frequency control middle layer unit is set to load a corresponding read-write drive from the radio frequency chip read-write drive unit according to the model parameters; and generating a radio frequency configuration parameter packet based on the radio frequency initialization parameter, and performing initialization configuration on the target radio frequency chip based on the read-write drive. Therefore, the baseband chip is compatible with signals of various radio frequency modules.

Description

Technical Field

[0001] This article discusses signal processing techniques, particularly a baseband chip and its configuration method. Background Technology

[0002] As a core device integrating navigation, positioning, and satellite communication functions, the BeiDou satellite communication and navigation receiver mainly consists of a baseband processing unit, a radio frequency (RF) unit, an antenna, and a power supply. The software is responsible for implementing the baseband processing function. However, due to significant differences in operating frequency, modulation method, transmission distance, data rate, and power consumption among RF chips on the market, hardware designs (such as antennas and RF front-end circuits) need to be customized for different chips.

[0003] In related technologies, the development model of "one chip, one adapter" is often adopted, which means that dedicated software is developed for each type of radio frequency chip.

[0004] This approach not only significantly increases development and maintenance costs, but also limits the system's scalability and compatibility, making it difficult to meet the needs of rapid deployment across multiple platforms. Summary of the Invention

[0005] This application provides a baseband chip and its configuration method, which is compatible with the signal reception of various radio frequency modules, thereby significantly reducing development and maintenance costs.

[0006] This application provides a baseband chip, which includes: an external interface module, an RDSS module, an intermediate layer control module, and an RF driver module. The RDSS module includes an RF initialization unit; the intermediate layer control module includes an RF control intermediate layer unit; and the RF driver module includes an RF chip read / write driver unit. The external interface module is configured to receive the model parameters or RF initialization parameters of the target RF chip and send them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. The radio frequency initialization unit is configured to send the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit is configured to load the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters; The radio frequency control intermediate layer unit is configured to generate a radio frequency configuration parameter package based on the radio frequency initialization parameters, and to initialize and configure the target radio frequency chip based on the read and write driver; wherein, the radio frequency chip read and write driver unit integrates read and write drivers corresponding to multiple radio frequency chips.

[0007] This application also provides a method for configuring a baseband chip, applied to the baseband chip described above, the method comprising: The external interface module receives the model parameters or RF initialization parameters of the target RF chip and sends them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. The radio frequency initialization unit sends the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit loads the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters; The radio frequency control intermediate layer unit generates a radio frequency configuration parameter package based on the radio frequency initialization parameters, and performs initialization configuration on the target radio frequency chip based on the read / write driver; wherein, the radio frequency chip read / write driver unit integrates read / write drivers corresponding to multiple radio frequency chips.

[0008] Compared with related technologies, the baseband chip and its configuration method provided in this application receive the model parameters of the target RF chip, dynamically load the corresponding read / write driver by the intermediate layer unit, and generate a configuration package based on the initialization parameters to complete the automatic adaptation of the RF chip. Since all RF drivers are pre-integrated, there is no need to repeatedly develop drivers or modify hardware for different RF modules, thereby achieving the compatibility of the baseband chip with signals from multiple RF modules, breaking the strong coupling between baseband and RF, and significantly reducing development cycle, manpower investment, and maintenance and upgrade costs.

[0009] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the embodiments described in the description and the accompanying drawings. Attached Figure Description

[0010] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0011] Figure 1 This is a schematic diagram of the hardware structure of a receiver in related technologies; Figure 2 This is a schematic diagram of the interface structure between the baseband processing unit and the radio frequency system in related technologies. Figure 3 This is a schematic diagram of the structure of a baseband chip according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of another baseband chip according to an embodiment of this application; Figure 5This is a flowchart illustrating a radio frequency signal processing method according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a radio frequency signal processing device according to an embodiment of this application; Figure 7 This is a schematic diagram of a radio frequency signal processing flow according to an embodiment of this application; Figure 8 This is a schematic diagram of another radio frequency signal processing device according to an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a receiver according to an embodiment of this application; Figure 10 This is a schematic diagram of another receiver according to an embodiment of this application. Detailed Implementation

[0012] This application describes several embodiments, but these descriptions are exemplary and not limiting, and it will be apparent to those skilled in the art that many more embodiments and implementations are possible within the scope of the embodiments described herein. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with, or may replace, any feature or element of any other embodiment.

[0013] This application includes and contemplates combinations of features and elements known to those skilled in the art. The embodiments, features, and elements disclosed in this application can also be combined with any conventional features or elements to form unique inventive solutions. Any feature or element of any embodiment can also be combined with features or elements from other inventive solutions to form another unique inventive solution. Therefore, it should be understood that any feature shown and / or discussed in this application can be implemented individually or in any suitable combination. Therefore, the embodiments are not limited except by the limitations imposed by the appended claims and their equivalents. Furthermore, various modifications and changes can be made within the scope of the appended claims.

[0014] Furthermore, in describing representative embodiments, the specification may have presented methods and / or processes as a specific sequence of steps. However, the method or process should not be limited to the specific order of steps described herein, to the extent that it does not depend on such a specific order. As will be understood by those skilled in the art, other sequences of steps are also possible. Therefore, the specific order of steps set forth in the specification should not be construed as a limitation of the claims. Moreover, the claims concerning the method and / or process should not be limited to the steps performed in the written order, and those skilled in the art will readily understand that these orders can be varied and still remain within the spirit and scope of the embodiments of this application.

[0015] The BeiDou satellite communication and navigation receiver is a user terminal device in a satellite navigation and communication system. As a key terminal for realizing the navigation, positioning, and short message communication functions of the BeiDou system, its main function is to receive L-band navigation signals and S-band RDSS (Radio Determination Service) radio frequency signals broadcast by BeiDou satellites. Through signal processing, it acquires observations such as pseudorange, carrier phase, and Doppler shift. After data demodulation, error correction, and positioning calculation, it finally outputs the user's position, velocity, and time (PVT) information, achieving high-precision and high-reliability navigation services. Simultaneously, the receiver supports BeiDou's unique RDSS short message communication function, possessing the ability to receive and transmit satellite signals. It can achieve point-to-point or broadcast-style two-way communication of text, status, and location information in areas without mobile communication network coverage, and is widely used in emergency rescue, marine fisheries, border patrol, transportation, precision agriculture, and other fields.

[0016] The receiver consists of two main parts: hardware and software. The two work together to form a complete technical system of "hardware platform + software algorithm".

[0017] The hardware part can be as follows Figure 1 The aforementioned components mainly include a radio frequency module, a baseband processing unit, an antenna, a clock, a power supply, and a preamplifier.

[0018] The radio frequency (RF) module is responsible for both signal reception and transmission. In the reception path, its function is to process the high-frequency BeiDou RF signal received by the antenna through a preamplifier, performing low-noise amplification (LNA), mixing, and filtering, down-converting it to a lower-frequency intermediate frequency (IF) signal, and then performing gain control and amplification on the IF signal before outputting it to the baseband processing unit. The RF module is based on an RF chip, which commonly supports both analog and digital IF output modes. In the transmission path (for receivers supporting RDSS communication), the RF module receives the IF modulated signal from the baseband processing unit, performs up-conversion and power amplification (PA), modulates it into an L-band RF signal conforming to the BeiDou standard, and then transmits it to the BeiDou satellite via the antenna, completing the communication entry.

[0019] Antennas are responsible for transmitting and receiving electromagnetic waves, converting space signals into circuit signals, and typically have right-hand circular polarization to match the polarization of satellite signals.

[0020] The baseband processing unit, centered around a baseband chip, integrates dedicated signal processing resources such as a CPU, DSP, hardware correlator array, numerically controlled oscillator (NCO), and digital down-converter (DDC). It also includes a crystal oscillator, resistor-capacitor components, on-chip and off-chip memory (RAM / Flash), and user interfaces (such as SPI, UART, GPIO, and I2C), making it the core processing unit of the system. The baseband chip is responsible for the digital processing of the intermediate frequency signal output from the RF unit after analog-to-digital conversion, including signal acquisition, tracking, data demodulation, navigation message parsing, observation extraction, PVT calculation, and communication protocol processing. The power supply module provides a stable, low-noise DC power supply for the entire system, supporting wide voltage input and low-power management, adapting to complex power supply environments such as automotive and field applications.

[0021] The power supply provides stable, low-noise DC power to the entire system, supports wide voltage input and low power consumption management, and is suitable for complex environments such as vehicle and field applications.

[0022] The clock provides a high-precision reference clock for the RF chip and baseband chip, ensuring the system's time synchronization performance.

[0023] The interface structure between the baseband processing unit and the radio frequency system is as follows: Figure 2As shown, a complete hardware interaction link is formed, mainly including a power amplifier enable interface, a receive / transmit control interface, a communication interface, an RF interface, and a sampling clock interface. The power amplifier enable interface is used by the baseband chip to control the operating state of the preamplifier, specifically including a power control interface and a power amplifier control interface. This interface enables precise control of the preamplifier's power supply and power switch. Since different preamplifier models support different trigger modes, including active high, active low, high-to-low transition active, and low-to-high transition active, the baseband software needs to dynamically configure the control signals according to the specific logic of the matched hardware to ensure accurate power amplifier start-up and shutdown. The receive / transmit control interface is output by the baseband chip and is used to control the RF chip to switch between receive and transmit modes, ensuring the correct signal path is established and avoiding transmit / receive conflicts. The communication interface uses the SPI (Serial Peripheral Interface) bus protocol to realize bidirectional data interaction between the baseband chip and the RF chip, used for writing and querying key parameters such as register configuration, status reading, frequency setting, and gain adjustment. Due to significant differences in register address layout, command format, and communication timing between different manufacturers and models of RF chips, the baseband software must possess a high degree of adaptability. The RF interface includes multiple intermediate frequency (IF) receive channels (RF-RX 1~n) and one transmit channel (RF-TX), used to transmit received IF signals from the RF chip and transmitted IF signals to the RF chip, respectively, supporting analog or digital I / Q signal transmission. The sampling clock interface is provided by the baseband chip, serving as the ADC sampling reference clock to ensure the synchronization and stability of the IF signal acquisition process and prevent sampling errors introduced by clock deviations.

[0024] In addition, the baseband processing unit has a user interface module that is responsible for information interaction with external devices or users, including parameter configuration, navigation result output, communication message sending and receiving, firmware upgrade and debugging monitoring, etc. It is usually implemented using UART, I2C, GPIO or dedicated serial interface, and supports host computer control and system status feedback.

[0025] The software component primarily refers to the embedded program running on the baseband chip, i.e., the baseband software. It is the "brain" of the baseband chip and the key to realizing all the receiver's functions. The baseband software controls the hardware to complete core tasks such as signal acquisition, carrier / code loop tracking, data demodulation, navigation calculation, and communication protocol processing by calling the baseband chip's computing resources and peripheral interfaces. The baseband chip, as the hardware carrier, provides the computing resources (such as CPU, DSP, and hardware accelerators) and peripheral interfaces (such as SPI, UART, and GPIO) required for signal processing. The baseband software, on the other hand, is the program code running on this chip, implementing specific algorithm logic and functional flows by calling these hardware resources and interfaces. The two constitute a complete system of "hardware platform + software algorithm," neither of which can be dispensed with. A fully functional, high-quality baseband software should not only fully utilize the performance of the baseband chip but also possess high reliability, real-time performance, ease of use, good scalability, and maintainability to adapt to diverse application scenarios and continuously iterating technical requirements.

[0026] It is worth noting that antenna and RF module designs vary depending on different product forms, application requirements, and project specifications, resulting in diverse hardware implementations. RF chips, as key components, are also numerous, with significant differences between manufacturers and models in operating frequency, modulation methods, transmission distance, data rate, power consumption, and interface communication protocols. These differences lead to variations in hardware design (such as antenna structure, RF front-end circuitry, filter configuration, and gain control methods). To ensure proper system operation, the baseband software must be highly compatible with the selected RF chip in terms of operating mode and hardware characteristics. For example, the software needs to configure the data interface according to the RF chip's output signal format (analog / digital intermediate frequency), send corresponding control commands according to its gain control method (register configuration or level control), set appropriate demodulation parameters according to its supported frequency bands and bandwidth, and configure the RF module's operating parameters, such as frequency, power, and gain, through the user interface.

[0027] Currently, there are many types of commonly used RF chips, with significant differences in key parameters. The mainstream development model is still a customized "one chip, one software" approach, where a dedicated set of baseband software is developed for each RF chip. This model leads to deep coupling between the software and specific RF hardware, resulting in a lack of versatility and a series of prominent problems: First, poor versatility, as the baseband software heavily depends on the hardware design of a specific RF chip, making it difficult to reuse across different hardware platforms and lacking universal adaptability; second, high maintenance costs, as receiver suppliers need to maintain multiple baseband software branches for different RF solutions, resulting in complex version management, a large workload for bug fixing and feature upgrades, and dispersed development resources; third, insufficient scalability, as support for new RF chip models requires redevelopment or significant modification of the baseband software, leading to long development cycles, slow response times, and hindering rapid product iteration and market expansion.

[0028] Therefore, this disclosure provides a baseband chip, such as... Figure 3 As shown, the baseband chip includes: an external interface module 10, an RDSS module 11, an intermediate layer control module 12, and an RF driver module 13. The RDSS module 11 includes: an RF initialization unit 110; the intermediate layer control module 12 includes: an RF control intermediate layer unit 120; and the RF driver module 13 includes: an RF chip read / write driver unit 130. The external interface module 10 is configured to receive the model parameters or RF initialization parameters of the target RF chip and send them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. The radio frequency initialization unit 110 is configured to send the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit 120 is configured to load the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters.

[0029] For example, the model parameters may include: chip model, device ID register value (read via SPI / I2C), vendor ID, and device address.

[0030] For example, RF initialization parameters may include: center frequency, bandwidth, gain settings (Low Noise Amplifier / Programmable Gain Amplifier, LNA / PGA), automatic gain control (AGC) strategy, filter configuration, sampling rate, modulation / demodulation mode, local oscillator (LO) settings, calibration parameters, etc. These parameters need to be precisely configured according to the electrical characteristics, performance specifications, and communication standards of the target RF module.

[0031] The baseband chip provided in this application achieves flexible compatibility with various RF chips through a modular architecture. Specifically, the chip internally includes four main functional units: an external interface module, an RDSS module, an intermediate layer control module, and an RF driver module. The external interface module acts as a bridge between the system and the external configuration environment, responsible for receiving the target RF chip's model parameters (such as chip manufacturer and model identifier) ​​or specific RF initialization parameters (such as frequency, gain, and filter configuration), and passing these parameters to the RF initialization unit in the RDSS module. The RF initialization unit itself does not directly process the driver logic; instead, it further forwards the received parameters to the RF control intermediate layer unit in the intermediate layer control module. This intermediate layer unit is the core of multi-chip compatibility: based on the model parameters, it dynamically searches for and loads a dedicated read / write driver program matching the target RF chip in the RF chip read / write driver unit integrated in the RF driver module. Since the RF chip read / write driver unit pre-integrates driver interfaces for various mainstream RF chips, there is no need to redevelop the underlying driver or modify the hardware design for each new RF chip; adaptation can be achieved simply through parameter configuration. This "parameter input - dynamic driver loading - unified control" mechanism effectively decouples the strong binding relationship between the baseband chip and specific RF hardware, providing highly scalable software compatibility for supporting RF chips from different manufacturers or models.

[0032] The baseband chip provided in this application receives the model parameters of the target RF chip, and the intermediate layer unit dynamically loads the corresponding read / write driver. Based on the initialization parameters, a configuration package is generated to complete the automatic adaptation of the RF chip. Since all RF drivers are pre-integrated, there is no need to repeatedly develop drivers or modify hardware for different RF modules. This achieves the compatibility of the baseband chip with signals from multiple RF modules, breaks the strong coupling between baseband and RF, and significantly reduces development cycle, manpower investment, and maintenance and upgrade costs.

[0033] In one exemplary instance, such as Figure 4 As shown, the RDSS module 11 further includes: a Flash storage unit 111; The external interface module 10 is also configured to write the received model parameters and the received radio frequency initialization parameters to the Flash storage unit 111; The model parameter or the radio frequency initialization parameter received by the radio frequency initialization unit 110 comes from the Flash storage unit 111.

[0034] For example, the RF initialization unit is further configured to obtain the model parameters and RF initialization parameters stored in the Flash storage unit after the baseband chip is powered on again, and send them to the RF control intermediate layer unit; the RF control intermediate layer unit is configured to load the corresponding read / write driver from the RF chip read / write driver unit according to the received model parameters; generate an RF configuration parameter package based on the received RF initialization parameters; and perform initialization configuration on the target RF chip according to the generated RF configuration parameter package and based on the loaded read / write driver.

[0035] The baseband chip provided in this application writes model parameters and RF initialization parameters into the Flash storage unit inside the RDSS module. This not only achieves power-off retention of configuration information but also provides fundamental support for the "one-time configuration, long-term use" of the device, avoiding the need to rely on an external host to resend parameters after each power-on or reset, significantly improving system startup efficiency and operational reliability. Secondly, since the parameters used by the RF initialization unit are directly derived from the local Flash memory rather than real-time external input, the baseband chip can complete the correct initialization of the target RF chip without external intervention, enhancing autonomy and robustness.

[0036] In one exemplary instance, such as Figure 4 As shown, the RDSS module 11 further includes: a radio frequency access interface unit 112; The external interface module 10 is also configured to receive radio frequency adjustment parameters and send them to the radio frequency access interface unit 112; The radio frequency access interface unit 112 is configured to send the received radio frequency adjustment parameters to the radio frequency control intermediate layer unit 120; The radio frequency control intermediate layer unit 120 is further configured to pass through the received radio frequency adjustment parameters to the loaded read / write driver, so that the read / write driver writes the radio frequency adjustment parameters into the target radio frequency chip.

[0037] In related technologies, baseband-RF coupling schemes typically only complete initialization configuration once during system startup, and RF parameters cannot be flexibly adjusted subsequently. The baseband chip provided in this application introduces an RF access interface unit to construct a runtime parameter path independent of the initialization process. This allows the baseband chip to receive and apply new RF adjustment parameters during normal operation, thereby supporting dynamic adaptation to channel changes, environmental interference, or the needs of different application scenarios, significantly improving communication robustness and flexibility.

[0038] In one exemplary instance, the external interface module 10 is further configured to distinguish the received radio frequency adjustment parameters. When it is determined that the received radio frequency adjustment parameters include adjustable radio frequency parameters, the adjustable radio frequency parameters are written into the Flash storage unit 111 to update the radio frequency initialization parameters.

[0039] In one exemplary instance, the adjustable radio frequency parameters include: radio frequency gain adjustment parameters and filter coefficient adjustment parameters.

[0040] The baseband chip provided in this application writes adjustable radio frequency (RF) parameters into Flash memory to update the original RF initialization parameters, achieving a closed loop of "runtime optimization → persistent firmware." For example, during field debugging or adaptive calibration, if a certain set of RF parameters is found to significantly improve communication quality, the adjustable RF parameters of the external interface module are written into the Flash memory. Upon the next power-on, the RF initialization unit directly loads this optimized set of parameters from Flash memory without manual intervention or reprogramming the firmware. This not only improves the product's intelligence level but also greatly enhances its deployment adaptability in complex electromagnetic environments.

[0041] Furthermore, the Flash storage unit provides space for future functional expansion: for example, parameters in the Flash can be dynamically updated via an external interface module to enable online switching of RF chips or firmware upgrades; multiple sets of configuration parameters for different RF chips can also be pre-stored in the Flash, with the middleware control module automatically selecting and loading based on the actual hardware, further enhancing compatibility and flexibility. More importantly, decoupling configuration data from driver logic and centralizing its management within the RDSS module helps simplify the software architecture, reduce system coupling, and provide a foundation for implementing advanced functions such as authentication and security verification (e.g., parameter signature verification).

[0042] In one exemplary instance, such as Figure 4 As shown, the RDSS module 11 further includes an RDSS transmission unit 113, and the intermediate layer control module further includes a transmission control intermediate layer unit 121; The external interface module 10 is also configured to receive initial transmission parameters and send them to the RDSS transmission unit 113; The RDSS transmitting unit 113 is configured to extract the power amplifier activation logic and timing from the received initial transmission parameters and send it to the transmission control intermediate layer unit 121. The transmit control intermediate layer unit 121 is configured to store the power amplifier activation logic and timing for receiving.

[0043] For example, the "Initial Transmission Parameters" are a set of high-level configuration information received by the external interface module to initialize the RDSS transmission process. This includes power amplifier (PA) activation logic and timing related to power amplifier (PA) control. Here, "power amplifier activation logic and timing" does not refer to specific register addresses, enable / disable values, or hardware write instructions, but rather to a control timing strategy describing how the power amplifier should be activated during transmission. Examples include: how many microseconds before the baseband signal output should start, whether it needs to be triggered in conjunction with other transmission units, and the time intervals between different control stages.

[0044] The RDSS transmitting unit identifies and extracts the power amplifier's activation logic and timing from the received initial transmission parameters, and then transmits it to the transmission control intermediate layer unit in the intermediate layer control module. The transmission control intermediate layer unit is responsible for saving the logic and timing information as the basis for coordinating the power amplifier's behavior when subsequently executing RDSS signal transmission.

[0045] In one exemplary instance, such as Figure 4 As shown, the RDSS module 11 further includes: a Flash storage unit 111; The external interface module 10 is also configured to write the received initial transmission parameters into the Flash storage unit 111.

[0046] The baseband chip provided in this application integrates a Flash storage unit in the RDSS module, and the external interface module actively writes the initial transmission parameters into it after receiving them. This design allows transmission-related configuration information (such as power amplifier enable logic, timing constraints, modulation parameters, frequency settings, etc.) to be retained even after the device is powered off, avoiding the cumbersome process of relying on an external host to resend complete parameters every time the device is powered on or reset.

[0047] In one exemplary instance, the RDSS transmission unit 113 is further configured to obtain the initial transmission parameters stored in the Flash storage unit 111 after the baseband chip is powered on again, and send them to the transmission control intermediate layer unit 121.

[0048] For example, when the baseband chip starts up or enters the transmission preparation phase, it can directly read the saved initial transmission parameters from the Flash storage unit, achieving rapid and autonomous initialization, significantly improving the device's startup efficiency and operational reliability. More importantly, this local storage mechanism provides fundamental support for on-site configuration solidification and remote parameter updates. For instance, at the device deployment site, if debugging reveals that a certain set of transmission parameters is better suited to the local electromagnetic environment or antenna characteristics, operators can write the optimized parameters into the Flash through the external interface module, allowing the device to "remember" the optimal configuration. In subsequent operation, regardless of whether it is connected to a host computer, the device can operate according to these optimized parameters. Similarly, in systems supporting remote management, the platform can send new initial transmission parameters through a communication link, and the baseband chip automatically writes them into the Flash upon receipt, achieving configuration upgrades without requiring factory return.

[0049] In one exemplary instance, such as Figure 4 As shown, the radio frequency driving module 13 further includes: a power amplifier and a transmit enable driving unit 131; The external interface module 10 is also configured to receive RDSS data to be transmitted and send it to the RDSS transmitting unit 113; The RDSS transmitting unit 113 is further configured to send a carrier correction command to the radio frequency control intermediate layer unit 120 after receiving the RDSS data to be transmitted, and to encrypt and assemble the received RDSS data to be transmitted into BPSK data, and send it to the transmitting control intermediate layer unit 121. The radio frequency control intermediate layer unit 120 is further configured to generate an RDSS data correction packet based on the model parameters of the target radio frequency chip and real-time Doppler frequency shift data after receiving the carrier correction command, and send the generated RDSS data correction packet to the target radio frequency chip based on the loaded read / write driver. The transmit control intermediate layer unit 121 is further configured to send the obtained BPSK data to the target RF chip by calling the corresponding power amplifier and transmit enable driver from the power amplifier and transmit enable driver unit 131 according to the saved power amplifier enable logic and timing; wherein, the power amplifier and transmit enable driver unit integrates power amplifier and transmit enable drivers for multiple RF chips.

[0050] For example, the RF driver module in the baseband chip adds a power amplifier and transmit enable driver unit. This unit pre-integrates power amplifier control and transmit enable drivers adapted to various RF chips, providing underlying support for hardware compatibility. When the system needs to transmit RDSS signals, the external interface module first receives the RDSS data to be transmitted from the upper layer and passes it to the RDSS transmit unit. After receiving the data, this unit generates a carrier correction command and sends it to the RF control intermediate layer unit to trigger the frequency compensation mechanism. On the other hand, it encrypts and packages the original RDSS data into a baseband data stream that conforms to BPSK modulation requirements and forwards it to the transmit control intermediate layer unit.

[0051] Subsequently, after receiving the carrier correction command, the radio frequency control intermediate layer unit combines the known target radio frequency chip model parameters and the real-time acquired Doppler frequency shift data (such as the frequency offset caused by the relative motion of the satellite calculated by the baseband processor) to dynamically generate an RDSS data correction packet (usually containing information such as frequency compensation value and phase adjustment). Then, through the previously loaded corresponding radio frequency chip read / write driver, the correction packet is written to the target radio frequency chip to ensure the accuracy of the transmitted carrier frequency.

[0052] Meanwhile, the transmit control intermediate layer unit, based on the power amplifier enable logic and timing previously loaded and saved from Flash, calls a dedicated driver program matching the current target RF chip from the power amplifier and transmit enable driver unit. This driver is then used to send the packetized BPSK data to the target RF chip, initiating the actual RF modulation and transmit process. Since the power amplifier and transmit enable driver unit integrates drivers for multiple RF chips, the entire process can adapt to different hardware platforms without firmware modification.

[0053] The baseband chip configuration method provided in this application receives the model parameters of the target RF chip, dynamically loads the corresponding read / write driver by the intermediate layer unit, and generates a configuration package based on the initialization parameters to complete the automatic adaptation of the RF chip. Since all RF drivers are pre-integrated, there is no need to repeatedly develop drivers or modify hardware for different RF modules, thereby achieving baseband chip compatibility with signals from multiple RF modules, breaking the strong coupling between baseband and RF, and significantly reducing development cycle, manpower investment, and maintenance and upgrade costs.

[0054] Corresponding to the baseband chip described above, embodiments of this application also provide a method for configuring the baseband chip. For example... Figure 5 As shown, it includes: Step 200: The external interface module receives the model parameters or RF initialization parameters of the target RF chip and sends them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. Step 201: The radio frequency initialization unit sends the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; Step 202: The radio frequency control intermediate layer unit loads the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters.

[0055] Step 203: The radio frequency control intermediate layer unit generates a radio frequency configuration parameter package based on the radio frequency initialization parameters, and performs initialization configuration on the target radio frequency chip based on the read / write driver; wherein, the radio frequency chip read / write driver unit integrates read / write drivers corresponding to multiple radio frequency chips.

[0056] In one exemplary instance, the RDSS module further includes: a Flash storage unit; the method further includes: The external interface module is also configured to write the received model parameters and the received radio frequency initialization parameters to the Flash storage unit; The model parameter or the radio frequency initialization parameter received by the radio frequency initialization unit comes from the Flash storage unit.

[0057] In one exemplary instance, the RDSS module further includes: a radio frequency access interface unit; the method further includes: The external interface module receives the radio frequency adjustment parameters and sends them to the radio frequency access interface unit; The radio frequency access interface unit sends the received radio frequency adjustment parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit transmits the received radio frequency adjustment parameters to the loaded read / write driver, so that the read / write driver writes the radio frequency adjustment parameters into the target radio frequency chip.

[0058] In one exemplary instance, the method further includes: The external interface module distinguishes the received RF adjustment parameters. When it determines that the received RF adjustment parameters include adjustable RF parameters, it writes the adjustable RF parameters into the Flash storage unit to update the RF initialization parameters. In one exemplary instance, the adjustable radio frequency parameters include: radio frequency gain adjustment parameters and filter coefficient adjustment parameters.

[0059] In one exemplary instance, the RDSS module further includes an RDSS transmission unit, and the intermediate layer control module further includes a transmission control intermediate layer unit; the method further includes: The external interface module receives the initial transmission parameters and sends them to the RDSS transmission unit; The RDSS transmitting unit extracts the power amplifier activation logic and timing from the received initial transmission parameters and sends it to the transmission control intermediate layer unit. The transmission control intermediate layer unit stores the power amplifier activation logic and timing of the received signal.

[0060] In one exemplary instance, the RDSS module further includes: a Flash storage unit; the method further includes: The external interface module writes the received initial transmission parameters into the Flash storage unit.

[0061] In one exemplary instance, the method further includes: After the baseband chip is powered on again, the RDSS transmission unit retrieves the initial transmission parameters stored in the Flash memory unit and sends them to the transmission control intermediate layer unit.

[0062] In one exemplary embodiment, the RF driving module further includes: a power amplifier and a transmit enable driving unit; the method further includes: The external interface module receives the RDSS data to be transmitted and sends it to the RDSS transmission unit; After receiving the RDSS data to be transmitted, the RDSS transmitting unit sends a carrier correction command to the radio frequency control intermediate layer unit, encrypts and packages the received RDSS data to obtain BPSK data, and sends it to the transmitting control intermediate layer unit. The radio frequency control intermediate layer unit is also configured to generate an RDSS data correction packet based on the model parameters of the target radio frequency chip and real-time Doppler frequency shift data after receiving the carrier correction command, and send the generated RDSS data correction packet to the target radio frequency chip based on the loaded read and write driver. The transmit control intermediate layer unit is further configured to send the obtained BPSK data to the target RF chip by calling the corresponding power amplifier and transmit enable driver from the power amplifier and transmit enable driver unit according to the saved power amplifier enable logic and timing; wherein, the power amplifier and transmit enable driver unit integrates power amplifier and transmit enable drivers for multiple RF chips.

[0063] This application also provides a radio frequency signal processing device, such as... Figure 6 As shown, the radio frequency signal processing device adopts a layered structure, arranged sequentially from top to bottom. The first layer is the external interface module 10. The second layer includes: radio frequency initialization unit 110, baseband acquisition and tracking unit 114, radio frequency access interface unit 112, and RDSS transmission unit 113. The third layer includes: radio frequency control intermediate layer unit 120 and transmission control intermediate layer unit 121. The fourth layer includes: radio frequency chip read / write driver unit 130 and power amplifier and transmission enable driver unit 131.

[0064] The external interface module 10 is responsible for interacting with external systems. It includes three main functions: communication protocol processing, configuration parameter forwarding, and parameter storage. It supports the configuration and management of key parameters such as RF chip model, transmit power, receive gain, intermediate frequency signal mode, and transmit control mode.

[0065] The radio frequency control intermediate layer unit 120 is used to abstract and encapsulate the differences in communication protocols of various radio frequency chips, unify multiple protocols into a standardized read and write interface, and realize compatible control of different hardware.

[0066] The transmission control intermediate layer unit 121 is used to uniformly abstract transmission-related functions, provide interfaces for Doppler correction, transmission power configuration, and transmission enable, and clearly define the timing logic for controlling power amplifier activation and RF-TX signal output to ensure the safety and accuracy of the transmission process.

[0067] The radio frequency access interface unit 112, based on the unified interface provided by the intermediate layer, enables direct read and write operations on the registers of the radio frequency chip, such as modifying the receive gain mode and gain value.

[0068] The radio frequency initialization unit 110 is responsible for the initialization work when the system starts up, including configuring the radio frequency control word and initializing the radio frequency chip to bring it into normal working state.

[0069] The RF chip read / write driver unit 130 supports various commonly used RF chip hardware interfaces (such as SPI, I / O, etc.). 2 C) and communication protocols to enable data interaction between the baseband chip and the radio frequency chip.

[0070] The power amplifier and transmit enable driver unit 131 is used to control the level output of the enable pins of each functional module. In addition, the baseband acquisition and tracking software is responsible for acquiring and continuously tracking satellite signals to ensure stable signal reception; the RDSS transmit software processes user transmit requests, executes RDSS transmit control logic, and outputs communication data. The overall software architecture, through layered design and interface abstraction, achieves good scalability, maintainability, and cross-platform compatibility.

[0071] The radio frequency signal processing flow performed by the radio frequency signal processing device provided in the application embodiments can be as follows: Figure 7 As shown, it includes: Step 300: Read the stored configuration parameters and verify them.

[0072] Step 301: Determine whether the configuration parameter verification passes. If the verification result is incorrect, proceed to step 202; if the verification passes, continue to the subsequent process step 303.

[0073] Step 302: Restore the configuration parameters to their default values. Step 303: Communication Protocol Initialization. This involves mounting the communication protocol and initializing the communication buffer and state.

[0074] Step 304: Notify the RF initialization unit, baseband acquisition and tracking unit, and RF driver module to initialize.

[0075] In this step, the parameter distribution process is initiated, sending key configuration information to each functional module: parameters such as RF model, sampling mode (corresponding to intermediate frequency signal mode), and receive gain are notified to the RF unit to complete the initialization of the RF chip; parameters such as sampling mode are passed to the baseband acquisition and tracking unit to complete its initialization; at the same time, parameters such as chip model, transmit gain, and transmit control mode are sent to the RF module driver, and the driver layer loads the corresponding RF communication protocol accordingly and completes its own state initialization.

[0076] Step 305: Determine if the parameters have been modified. If the parameters have been modified, proceed to step 306. If the parameters have not been modified, proceed to step 307.

[0077] Step 306: Save parameter configuration.

[0078] Step 307: Software baseband reset.

[0079] If the user triggers the "software baseband reset" step through the interface, the process will restart from step 300 to ensure that the new parameters take effect.

[0080] Step 308: Determine whether communication has been requested. If communication has been requested, proceed to step 309. If communication has not been requested, proceed to step 305.

[0081] Step 309: RDSS transmission unit processing.

[0082] The RDSS transmitting unit is responsible for parsing communication requests, assembling transmission data packets, and calling the transmission control middleware interface. Step 310: The transmission control intermediate layer, in coordination with the radio frequency module, drives the execution of the complete transmission action.

[0083] The transmission control intermediate layer, in conjunction with the RF module driver software, executes the complete transmission process, including turning on the power amplifier (achieved by outputting a high level), configuring Doppler correction parameters (written to the RF chip via interfaces such as SPI), enabling the transmission channel (TX channel enabled by a high level), and sending the BPSK modulated signal to the RF chip via the RDSS transmission software to complete the actual transmission. After transmission is complete, the transmission channel and power amplifier are sequentially turned off to ensure the process is safe and controllable.

[0084] Throughout the process, the transmit control middleware layer acts as the core control hub, encapsulating the underlying control logic of different RF modules. It achieves unified management of operations such as power amplifier enabling, Doppler configuration, and channel switching, supporting a decoupling mechanism of "higher-level call to requirements, lower-level autonomous execution." For example, when executing the "turn on power amplifier" command, the upper layer only needs to issue a request, while the specific level output method has already been pre-configured by the transmit control middleware layer based on hardware characteristics during the parameter distribution stage, thus ensuring control flexibility and consistency. The overall process structure is clear, possessing excellent parameter management capabilities, module collaboration, and scalability, making it suitable for the integration and control of various RF modules.

[0085] This application also provides a radio frequency signal processing device, such as... Figure 8 As shown, it includes: memory 400 and processor 410; The memory 400 is connected to the processor 410 and is used to store programs; The processor 410 is used to implement the radio frequency signal processing method described in any of the above embodiments by running the program in the memory 400.

[0086] Specifically, the aforementioned electronic device may also include: a bus, a communication interface 420, an input device 430, and an output device 440.

[0087] The processor 410, memory 400, communication interface 420, input device 430, and output device 450 are interconnected via a bus. Among them: A bus can include a pathway for transmitting information between various components of a computer system.

[0088] The processor 410 can be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits used to control the execution of the program of the present invention. It can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0089] Processor 410 may include a main processor, as well as a baseband chip, modem, etc.

[0090] The memory 400 stores a program that executes the technical solution of this invention, and may also store an operating system and other key business functions. Specifically, the program may include program code, which includes computer operation instructions. More specifically, the memory 400 may include read-only memory (ROM), other types of static storage devices capable of storing static information and instructions, random access memory (RAM), other types of dynamic storage devices capable of storing information and instructions, disk storage, flash memory, etc.

[0091] Input device 430 may include a device for receiving user input data and information, such as a keyboard, mouse, camera, scanner, light pen, voice input device, touch screen, pedometer, or gravity sensor.

[0092] Output device 450 may include devices that allow information to be output to a user, such as a display screen, printer, speaker, etc.

[0093] The communication interface 420 may include a device that uses any transceiver to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0094] The processor 410 executes the program stored in the memory 400 and calls other devices, which can be used to implement the various steps of any of the radio frequency signal processing methods provided in the above embodiments of this application.

[0095] In addition to the methods and devices described above, embodiments of this application may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to perform the steps in the radio frequency signal processing methods according to various embodiments of this application as described in any of the above embodiments of this specification.

[0096] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this application. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0097] Furthermore, this application embodiment also provides a storage medium storing a computer program, which, when executed by a processor, implements the radio frequency signal processing method described in any of the above embodiments.

[0098] This application also provides a receiver, such as... Figure 9 As shown, the receiver includes: a first antenna unit 50, a first radio frequency module 51, a first clock 52, a first power supply 53, and a first baseband processing unit 54. The first baseband processing unit 54 includes a baseband chip 540 as described in any of the above embodiments. The first radio frequency module 51 includes: a first radio frequency chip 510 and a first preamplifier 511. The first antenna unit 50 includes: a first antenna 500.

[0099] This application also provides a receiver, such as... Figure 10 As shown, the receiver includes: a second antenna unit 60, a second radio frequency module 61, a second clock 62, a second power supply 63, and a second baseband processing unit 64. The second baseband processing unit 64 includes a baseband chip 640 as described in any of the above embodiments. The second antenna unit 60 includes: a second antenna 600 and a second preamplifier 601. The second radio frequency module includes: a second radio frequency chip 610.

[0100] It will be understood by those skilled in the art that all or some of the steps, systems, or apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software may be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term "computer storage medium" includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

Claims

1. A baseband chip, characterized in that, The baseband chip includes: an external interface module, an RDSS module, an intermediate layer control module, and an RF driver module. The RDSS module includes: an RF initialization unit; the intermediate layer control module includes: an RF control intermediate layer unit; and the RF driver module includes: an RF chip read / write driver unit. The external interface module is configured to receive the model parameters or RF initialization parameters of the target RF chip and send them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. The radio frequency initialization unit is configured to send the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit is configured to load the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters; The radio frequency control intermediate layer unit is configured to generate a radio frequency configuration parameter package based on the radio frequency initialization parameters, and to initialize and configure the target radio frequency chip based on the read and write driver; wherein, the radio frequency chip read and write driver unit integrates read and write drivers corresponding to multiple radio frequency chips.

2. The baseband chip according to claim 1, characterized in that, The RDSS module also includes: a Flash storage unit; The external interface module is also configured to write the received model parameters and the received radio frequency initialization parameters to the Flash storage unit; The model parameter or the radio frequency initialization parameter received by the radio frequency initialization unit comes from the Flash storage unit.

3. The baseband chip according to claim 2, characterized in that, The RDSS module further includes: a radio frequency access interface unit; The external interface module is also configured to receive radio frequency adjustment parameters and send them to the radio frequency access interface unit; The radio frequency access interface unit is configured to send the received radio frequency adjustment parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit is also configured to pass through the received radio frequency adjustment parameters to the loaded read / write driver, so that the read / write driver writes the radio frequency adjustment parameters into the target radio frequency chip.

4. The baseband chip according to claim 3, characterized in that, The external interface module is also configured to distinguish the received radio frequency adjustment parameters. When it is determined that the received radio frequency adjustment parameters include adjustable radio frequency parameters, the adjustable radio frequency parameters are written into the Flash storage unit to update the radio frequency initialization parameters.

5. The baseband chip according to claim 4, characterized in that, The adjustable RF parameters include: RF gain adjustment parameters and filter coefficient adjustment parameters.

6. The baseband chip according to claim 1, characterized in that, The RDSS module further includes an RDSS transmission unit, and the intermediate layer control module further includes a transmission control intermediate layer unit. The external interface module is also configured to receive initial transmission parameters and send them to the RDSS transmission unit; The RDSS transmitting unit is configured to extract the power amplifier activation logic and timing from the received initial transmission parameters and send it to the transmission control intermediate layer unit. The transmission control intermediate layer unit is configured to store the power amplifier activation logic and timing for receiving signals.

7. The baseband chip according to claim 6, characterized in that, The RDSS module also includes: a Flash storage unit; The external interface module is also configured to write the received initial transmission parameters into the Flash storage unit.

8. The baseband chip according to claim 7, characterized in that, The RDSS transmission unit is also configured to retrieve the initial transmission parameters stored in the Flash storage unit after the baseband chip is powered on again, and send them to the transmission control intermediate layer unit.

9. The baseband chip according to claim 6 or 8, characterized in that, The radio frequency driving module further includes: a power amplifier and a transmit enable driving unit; The external interface module is also configured to receive RDSS data to be transmitted and send it to the RDSS transmitting unit; The RDSS transmitting unit is further configured to send a carrier correction command to the radio frequency control intermediate layer unit after receiving the RDSS data to be transmitted, and to encrypt and assemble the received RDSS data to be transmitted into BPSK data, and send it to the transmitting control intermediate layer unit. The radio frequency control intermediate layer unit is also configured to generate an RDSS data correction packet based on the model parameters of the target radio frequency chip and real-time Doppler frequency shift data after receiving the carrier correction command, and send the generated RDSS data correction packet to the target radio frequency chip based on the loaded read and write driver. The transmit control intermediate layer unit is further configured to send the obtained BPSK data to the target RF chip by calling the corresponding power amplifier and transmit enable driver from the power amplifier and transmit enable driver unit according to the saved power amplifier enable logic and timing; wherein, the power amplifier and transmit enable driver unit integrates power amplifier and transmit enable drivers for multiple RF chips.

10. A method for configuring a baseband chip, applied in the baseband chip as described in any one of claims 1-9, the method comprising: The external interface module receives the model parameters or RF initialization parameters of the target RF chip and sends them to the RF initialization unit; wherein, the target RF chip refers to the RF chip that the baseband chip is compatible with. The radio frequency initialization unit sends the received model parameters or radio frequency initialization parameters to the radio frequency control intermediate layer unit; The radio frequency control intermediate layer unit loads the corresponding read / write driver from the radio frequency chip read / write driver unit according to the received model parameters; The radio frequency control intermediate layer unit generates a radio frequency configuration parameter package based on the radio frequency initialization parameters, and performs initialization configuration on the target radio frequency chip based on the read / write driver; wherein, the radio frequency chip read / write driver unit integrates read / write drivers corresponding to multiple radio frequency chips.

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