Electronic device

Abstract

The invention provides an electronic device. The electronic device includes a photonic component including an optical channel and an optical guide configured to optically couple to the optical channel and guide an optical signal to change a transmission direction. According to the electronic equipment, through the optical guider, photoelectric detection of the optical assembly can be executed before single granulation operation. Accordingly, the manufacturing process of the electronic device can be simplified without reworking when it is determined that the photonic component of the singulated unit does not pass the detection after singulation, and the cost can be reduced.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor packaging technology, and more specifically to an electronic device. Background Technology

[0002] Typically, optical coupling between photonic components and optical fibers is achieved through edge coupling, specifically, edge coupling between the optical fiber and the waveguide exposed at the edge of the photonic component. However, given that the edges of wafer-level photonic structures are not exposed, photoelectric detection needs to be performed from above the wafer-level photonic structure rather than from its edges. Therefore, it is difficult to perform photoelectric detection on wafer-level photonic structures unless a monolithic operation is performed to expose the waveguide from the edge of the monolithic photonic structure. However, the monolithic operation process can increase processing time and cost. Summary of the Invention

[0003] This disclosure provides an electronic device.

[0004] In some alternative embodiments, this disclosure proposes an electronic device including a photonic component and an optical guide. The photonic component includes an optical channel. The optical guide is configured to be optically coupled to the optical channel and to guide an optical signal to change its transmission direction.

[0005] In some alternative embodiments, the optical guide includes a first guide structure and a second guide structure that are rotationally symmetrical about the central axis of the optical guide. The optical guide is configured to optically couple an optical signal from the optical channel along a first fundamental horizontal path to a non-horizontal path.

[0006] In some alternative implementations, the optical guide includes a first optical module and a second optical module assembled together to form a generally symmetrical structure. The optical guide is configured to guide optical signals to travel along at least two different directions.

[0007] In some alternative embodiments, the optical guide includes a first guide structure and a second guide structure. The first guide structure includes a first groove and is configured to switch the transmission direction of multiple optical signals from the optical channel. The second guide structure includes a second groove and is configured to switch the transmission direction of the optical signals from the first guide structure. The first groove and the second groove define a rotationally symmetric cross-sectional profile.

[0008] The electronic device of this application, through an optical guide, can perform photoelectric detection of optical components before the unitization process. Therefore, the manufacturing process of the electronic device can be simplified without rework if the photonic components of the unitized cells fail detection after unitization, and costs can be reduced. Attached Figure Description

[0009] A better understanding of the various aspects of this disclosure can be achieved by reading in conjunction with the accompanying drawings. It should be noted that the various features may not be drawn to scale, and the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

[0010] Figure 1A This is a schematic diagram of the cross-sectional structure of an electronic device according to an embodiment of the present disclosure.

[0011] Figure 1B This is a schematic cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0012] Figure 1C This is a top view of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 1D This is a schematic cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0014] Figure 2A This is a schematic diagram of the cross-sectional structure of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 2B This is a schematic cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 2C This is a top view of an electronic device according to an embodiment of the present disclosure.

[0017] Figure 3A This is a top view illustrating one or more stages of an exemplary method for manufacturing an electronic device according to an embodiment of the present disclosure.

[0018] Figure 3B This is a cross-sectional structural schematic diagram illustrating one or more stages of an exemplary method for manufacturing an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0019] Common reference numerals are used throughout the accompanying drawings and detailed description to indicate the same or similar elements. This disclosure will be more clearly understood by reading the following detailed description in conjunction with the accompanying drawings.

[0020] Figure 1A This is a schematic diagram of the cross-sectional structure of an electronic device 1 according to an embodiment of the present disclosure. Figure 1BThis is a schematic cross-sectional view of a portion of an electronic device 1 according to an embodiment of the present disclosure. The electronic device 1 may include a substrate 10, a photonic component 20, electronic components 30 and 50, an optical guide 40, a wire 60, an optical component 70, an electrical contact 81, adhesive elements 83 and 92, and connecting elements 85 and 91.

[0021] Substrate 10 can support photonic component 20 and electronic component 30. Substrate 10 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. Substrate 10 may include interconnect structures, such as multiple conductive traces and / or multiple conductive vias. In some alternative embodiments, substrate 10 includes a ceramic material, a metal plate, an organic substrate, or a lead frame. In some alternative embodiments, substrate 10 may include a bilayer substrate comprising a core layer and conductive material and / or structures disposed on the upper and lower surfaces of substrate 10. The conductive material and / or structures may include multiple conductive traces.

[0022] Substrate 10 may have a surface 101 (also referred to as a top surface or upper surface) and a surface 102 opposite to surface 101 (also referred to as a bottom surface or lower surface). In some alternative embodiments, substrate 10 includes conductive pads 110 and 120, a conductive layer 130 (or conductive trace), a conductive via 140, and a dielectric structure 150. Dielectric structure 150 may include multiple dielectric layers. In some alternative embodiments, conductive layer 130 and conductive via 140 electrically connected to conductive layer 130 and conductive pads 110 and 120 are located within the dielectric layers of dielectric structure 150. Conductive pads 110 and 120, conductive layer 130, and conductive via 140 may independently include conductive materials, such as metals or metal alloys, exemplary of which may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), or alloys thereof. The dielectric structure 150 may include, for example, one or more organic materials (e.g., phosphoric anhydride (PA), polyimide (PI), polybenzoxazole (PBO), epoxy resin and epoxy-based materials) or one or more inorganic materials (e.g., silicon oxide, silicon nitride, glass and ceramics).

[0023] Photonic component 20 may be disposed above substrate 10. In some alternative embodiments, photonic component 20 is configured to provide photoelectric conversion. In some alternative embodiments, photonic component 20 is configured to transmit optical signal L1 (or modulate optical signal L1). One or more optical signals L1 may be labeled L1. Photonic component 20 may include photonic integrated circuit (PIC), laser diode, receiver, waveguide, photodetector, photodiode, semiconductor optical amplifier (SOA), grating coupler, fiber optic coupling structure, optical modulator (e.g., Mach-Zehnder modulator or microring modulator) or combinations thereof.

[0024] In some alternative embodiments, the photonic component 20 includes a circuit layer 210, conductive elements 211, conductive pads 212 and 213, and one or more optical channels 220. The circuit layer 210 may include a combination of photonic devices, such as a PIC, a photodetector, a photodiode, an SOA, an optical modulator, or a combination thereof. The conductive elements 211 may include conductive traces and / or conductive vias electrically connecting the circuit layer 210 to the conductive pads 212 and 213. In some alternative embodiments, the optical channel 220 is (or includes) an optical waveguide.

[0025] The photonic component 20 may have a surface 201 (also referred to as a top surface or upper surface) and a surface 202 opposite to surface 201 (also referred to as a bottom surface or lower surface). In some alternative embodiments, the photonic component 20 defines a recess 230 recessed from surface 201. In some alternative embodiments, an optical channel 220 is exposed to the recess 230. The recess 230 may be defined at least by surfaces 231, 232, and 233 of the photonic component 20. In some alternative embodiments, the optical channel 220 is exposed to the recess 230 through surface 231. In some alternative embodiments, the recess 230 is formed by etching (e.g., dry etching), and the photonic component 20 is monolithically cut (e.g., by a blade saw), so that the roughness of surface 231 is less than the roughness of the sides 203 and 204 of the photonic component 20. In some alternative embodiments, the roughness of surface 231 is less than 1 μm. In some alternative embodiments, the depth d1 of the groove 230 can range from about 20 μm to about 40 μm, or from about 25 μm to about 35 μm, or about 30 μm. In some alternative embodiments, the width W1 of the groove 230 ranges from about 0.8 mm to about 1.2 mm, or from about 0.9 mm to about 1.1 mm, or about 1 mm. In some alternative embodiments, the thickness of the optical channel 220 ranges from about 10 μm to about 30 μm, or from about 15 μm to about 25 μm.

[0026] Electronic component 30 may be disposed on substrate 10. In some alternative embodiments, electronic component 30 is disposed on and electrically connected to photonic component 20. In some alternative embodiments, electronic component 30 is configured to control the modulation of optical signal L1. In some alternative embodiments, electronic component 30 is configured to amplify electrical signals. In some alternative embodiments, electronic component 30 is configured to amplify electrical signals received from photonic component 20 (e.g., a photodetector in photonic component 20). Electronic component 30 may include an electronic integrated circuit (EIC), which may be or include a modulator driver (DRV), a transimpedance amplifier (TIA), or a combination thereof.

[0027] In some alternative embodiments, electronic component 30 includes conductive pads 310 exposed or disposed on an active surface of electronic component 30. In some alternative embodiments, electronic component 30 is electrically connected to photonic assembly 20 via connection element 91. In some alternative embodiments, conductive pad 310 is electrically connected to conductive pad 212 via connection element 91, and protective element 91u further encapsulates connection element 91. Connection element 91 may be (or includes) conductive bumps, such as solder bumps. Protective element 91u may be or includes underfill.

[0028] An optical guide 40 may be disposed on and optically coupled to the photonic component 20. In some alternative embodiments, the optical guide 40 is partially located in a recess 230. In some alternative embodiments, the recess 230 of the photonic component 20 is configured to receive a portion of the optical guide 40. In some alternative embodiments, the optical guide 40 includes an edge portion 40E supported by a surface 201 (e.g., the upper surface) of the photonic component 20. In some alternative embodiments, the width of the edge portion 40E is greater than the depth d1 of the recess 230. In some alternative embodiments, the width of the edge portion 40E ranges from about 150 μm to about 250 μm, or from about 180 μm to about 230 μm, or about 200 μm.

[0029] In some alternative embodiments, the optical guide 40 is configured to be optically coupled to one or more optical channels 220. In some alternative embodiments, the optical guide 40 is partially located in the recess 230 and configured to receive one or more optical signals L1 from one or more optical channels 220. In some alternative embodiments, the optical guide 40 is configured to guide the transmission of one or more optical signals L1 from a generally horizontal direction (e.g., direction DR1) to a non-horizontal direction (e.g., direction DR2). In some alternative embodiments, the optical guide 40 is configured to optically couple one or more optical signals L1 from a substantially horizontal path (e.g., path P1) to a non-horizontal path (e.g., path P2). In some alternative embodiments, the optical guide 40 is configured to optically couple one or more optical signals L1 from the optical channel 220 along a substantially horizontal path (e.g., path P1) to a non-horizontal path (e.g., path P2). Since the optical signal L1 (or light) may continue to diverge as it switches its propagation direction, path P2 can represent a path substantially perpendicular to surface 101, such as... Figure 1A The path is marked as "P2". Furthermore, path P2 can also represent a path that is inclined relative to surface 101, and is neither perpendicular nor parallel to path P1, as shown below. Figure 1A The divergence shape of the optical signal L1 is shown.

[0030] In some alternative embodiments, the optical guide 40 is configured to further guide the transmission of one or more optical signals L1 from a non-horizontal direction (e.g., direction DR2) to a substantially horizontal direction (e.g., direction DR1) to optically couple one or more optical signals L1 to an optical component 70 external to the optical guide 40. In some alternative embodiments, the optical guide 40 is configured to optically couple one or more optical signals L1 from a non-horizontal path (e.g., path P2) to another substantially horizontal path (e.g., path P3) to optically couple one or more optical signals L1 to an optical component 70 external to the optical guide 40. In some alternative embodiments, the optical guide 40 is configured to optically couple one or more optical signals L1 from along a non-horizontal path (e.g., path P2) to a substantially horizontal path (e.g., path P3). In some alternative embodiments, path P3 is configured to optically couple with a plurality of optical fibers 72 external to the optical guide 40.

[0031] In some alternative embodiments, the optical guide 40 includes optical modules 410 and 420. In some alternative embodiments, optical modules 410 and 420 are assembled to form a generally symmetrical structure. In some alternative embodiments, optical modules 410 and 420 are assembled to form a generally rotationally symmetrical structure. In some alternative embodiments, optical modules 410 and 420 are exposed to air and are not encapsulated. In other alternative embodiments, optical modules 410 and 420 may be covered with one or more protective elements (e.g., encapsulant).

[0032] In some alternative embodiments, the optical module 410 has an edge 410e within the recess 230 and is configured to receive one or more optical signals L1 from one or more optical channels 220. In some alternative embodiments, the optical module 410 defines a reflective surface 410S configured to direct the transmission of one or more optical signals L1 from a substantially horizontal direction (e.g., direction DR1) to a substantially vertical direction (e.g., direction DR2) away from the photonic component 20. In some alternative embodiments, the optical module 410 includes a reflector 430 configured to direct the transmission of one or more optical signals L1 from a substantially horizontal direction (e.g., direction DR1) to a substantially vertical direction (e.g., direction DR2) away from the photonic component 20. In some alternative embodiments, the reflector 430 is located on the reflective surface 410S. The reflector 430 may be or include a metal layer, an anti-reflective coating (ARC), or a material layer configured not to affect the reflection or transmission of the optical signal L1 by the reflector 430. In some alternative embodiments, the optical module 410 includes (or defines) a groove 410R2 defined by the reflective surface 410S. In some alternative embodiments, the reflective surface 410S is formed by the groove 410R2. In some alternative embodiments, the optical module 410 also includes (or defines) one or more grooves 410R3 at the edge portion 40E.

[0033] In some alternative embodiments, the optical module 420 defines a reflective surface 420S configured to guide the transmission of one or more optical signals L1 from a substantially vertical direction (e.g., direction DR2) to a substantially horizontal direction (e.g., direction DR1), reaching the optical component 70 outside the optical guide 40. In some alternative embodiments, the optical module 420 includes a reflector 440 configured to guide the transmission of one or more optical signals L1 from a substantially vertical direction (e.g., direction DR2) to a substantially horizontal direction (e.g., direction DR1), reaching the optical component 70 outside the optical guide 40. In some alternative embodiments, the optical module 420 has an edge 420e configured to allow one or more optical signals L1 to penetrate the edge and reach the optical component 70. In some alternative embodiments, the reflector 440 is located on the reflective surface 420S. The reflector 440 may be or include a metal layer, an anti-reflective coating (ARC), or a material layer configured not to affect the reflection or transmission of the optical signal L1 by the reflector 440. In some alternative embodiments, the optical module 420 includes or defines a recess 420R2 defined by the reflective surface 420S. In some alternative embodiments, the reflective surface 420S is formed by the recess 420R2. In some alternative embodiments, the optical module 420 also includes or defines one or more recesses 420R3 located at the edge portion 40E.

[0034] In some alternative embodiments, optical module 410 includes a protrusion 410P. In some alternative embodiments, optical module 410 includes (or defines) a recess 410R1. In some alternative embodiments, optical module 410 is a one-piece structure having a protrusion defining the protrusion 410P and recesses defining the recesses 410R1, 410R2, and 410R3. In some alternative embodiments, optical module 420 includes a protrusion 420P configured to insert into the recess 410R1 to secure optical modules 410 and 420 to each other. In some alternative embodiments, optical module 420 includes or defines a recess 420R1 configured to receive the protrusion 410P to secure optical modules 410 and 420 to each other. In some alternative embodiments, optical module 410 is connected to optical module 420 via a locking mechanism (e.g., recesses 410R1 and 420R1 and protrusions 410P and 420P). In some alternative embodiments, optical modules 410 and 420 are connected together by engagement of protrusions and recesses. In some alternative embodiments, protrusion 410P engages with recess 420R1 to connect optical modules 410 and 420. In some alternative embodiments, protrusion 420P engages with recess 410R1 to connect optical modules 410 and 420. In some alternative embodiments, optical module 420 is a one-piece structure having a protrusion defining protrusion 420P and recesses defining recesses 420R1, 420R2, and 420R3. In some alternative embodiments, recesses 410R1, 420R1, protrusion 420P, and protrusion 410P are located in the peripheral region of optical guide 40.

[0035] In some alternative embodiments, optical module 410 includes or defines a lens 410L, optical module 420 includes or defines a lens 420L, and lenses 410L and 420L are exposed in a cavity S1 defined (or closed) by optical modules 410 and 420. In some alternative embodiments, optical modules 410 and 420 define an optical guide (e.g., lenses 410L and 420L) exposed in a cavity S1 within optical guide 40. In some alternative embodiments, the optical guide of optical guide 40 includes a lens 410L and a lens 420L facing each other. The surfaces of lenses 410L and 420L may be coated with an ARC layer. In some alternative embodiments, optical module 410 is a one-piece structure having one or more concave surfaces defining lens 410L. In some alternative embodiments, optical module 420 is a one-piece structure having one or more concave surfaces defining lens 420L.

[0036] In some alternative embodiments, optical modules 410 and 420 are monolithic structures. In some alternative embodiments, optical modules 410 and 420 may include substantially the same structure. In some alternative embodiments, optical modules 410 and 420 are formed of silicon. In some alternative embodiments, the grooves and protrusions of optical modules 410 and 420 are formed by providing a silicon layer and performing an etching operation on the silicon layer to form the grooves and protrusions. In some alternative embodiments, optical modules 410 and 420 are formed of a polymer. In some alternative embodiments, optical modules 410 and 420 including grooves and protrusions are formed by molding techniques (e.g., injection molding, nanoimprint lithography, etc.). For example, optical modules 410 and 420 formed of polymer can be formed by injecting polymer material into a mold and then demolding. In some alternative embodiments, optical modules 410 and 420 are formed by a mold. According to some alternative embodiments of this disclosure, optical modules 410 and 420 are assembled with each other to collectively construct a substantially rotationally symmetric structure, such that optical modules 410 and 420 have substantially the same structure. Therefore, optical modules 410 and 420 can be formed using the same mold instead of two different molds, which simplifies the manufacturing process.

[0037] In some alternative embodiments, the surface of lens 410L is substantially parallel to the surface 201 of photonic component 20. In some alternative embodiments, the tangent to the surface of lens 410L is substantially parallel to the surface 201 of photonic component 20. In some alternative embodiments, the surface of lens 420L is substantially parallel to the surface 201 of photonic component 20. In some alternative embodiments, the tangent to the surface of lens 420L is substantially parallel to the surface 201 of photonic component 20. In some alternative embodiments, the tangent to the surface of lens 410L is substantially parallel to the tangent to the surface of lens 420L.

[0038] In some alternative embodiments, the optical guide 40 includes guide structures 40A and 40B, and is rotationally symmetric about a central axis C1. In some alternative embodiments, guide structures 40A and 40B together form a structure that is 180° rotationally symmetric about the central axis C1. In some alternative embodiments, guide structures 40A and 40B define a plurality of lenses (e.g., lenses 410L and 420L) exposed to cavities S1 within the optical guide 40. In some alternative embodiments, a portion of guide structure 40A and a portion of guide structure 40B are exposed to air and are not encapsulated with an encapsulant.

[0039] In some alternative embodiments, the guide structure 40A includes a recess 410R2 and is configured to switch the transmission direction of one or more optical signals L1 from one or more optical channels 220. In some alternative embodiments, the guide structure 40A is configured to optically couple the optical signal L1 from transmission along a generally horizontal path (e.g., path P1) to a non-horizontal path (e.g., path P2). In some alternative embodiments, the guide structure 40A has a reflective surface 410S defined by the recess 410R2 and is configured to switch the transmission direction of the optical signal L1 from the optical channel 220. In some alternative embodiments, the guide structure 40A includes a lens 410L facing the guide structure 40B.

[0040] In some alternative embodiments, the guide structure 40B includes a recess 420R2 and is configured to switch the transmission direction of the optical signal L1 from the guide structure 40A. In some alternative embodiments, the guide structure 40B is configured to optically couple the optical signal L1 from transmission along a non-horizontal path (e.g., path P2) to another fundamental horizontal path (e.g., path P3) different from the fundamental horizontal path (e.g., path P1). In some alternative embodiments, the guide structure 40B has a reflective surface 420S defined by the recess 420R2 and is configured to switch the transmission direction of the optical signal L1 from the guide structure 40A. In some alternative embodiments, the guide structure 40B includes a lens 420L facing the guide structure 40A. In some alternative embodiments, the recess 230 of the photonic assembly 20 is configured to receive a portion of the guide structure 40B.

[0041] In some alternative embodiments, grooves 410R2 and 420R2 define a rotationally symmetric cross-sectional profile. In some alternative embodiments, grooves 410R2 and 420R2 together form a structure that is 180° rotationally symmetric about a central axis C1. In some alternative embodiments, a non-horizontal path (e.g., path P2) passes through lenses 410L and 420L. In some alternative embodiments, grooves 410R2, 420R2, reflectors 430 and 440 define a rotationally symmetric cross-sectional profile. In some alternative embodiments, grooves 410R2, 420R2, reflectors 430 and 440 together form a structure that is 180° rotationally symmetric about a central axis C1. In some alternative embodiments, grooves 410R2, 420R2, lenses 410L and 420L define a rotationally symmetric cross-sectional profile. In some alternative embodiments, the grooves 410R2, 420R2, lens 410L, and lens 420L together form a structure that is 180° rotationally symmetrical about the central axis C1.

[0042] Electronic component 50 may be disposed above and electrically connected to substrate 10. In some alternative embodiments, electronic component 50 is electrically connected to substrate 10 via connection element 85. Electronic component 50 may be a chip or die, including a semiconductor substrate, one or more integrated circuit devices, and one or more overlay interconnect structures therein. Integrated circuit devices may include active devices (e.g., transistors) and / or passive devices (e.g., resistors, capacitors, inductors, or combinations thereof). In some alternative embodiments, electronic component 50 may be (or include) a processing component, such as an ASIC, FPGA, GPU, or the like, or a combination thereof. Connection element 85 may be (or include) conductive bumps, such as solder bumps.

[0043] The conductor 60 may be disposed above the substrate 10 and electrically connect the photonic component 20 to the substrate 10. In some alternative embodiments, the conductor 60 electrically connects the conductive pad 213 to the conductive pad 110. The circuit layer 210 may be configured to receive electrical signals from the electronic component 50 through the substrate 10 and the conductor 60.

[0044] Optical element 70 can be optically coupled to optical guide 40. In some alternative embodiments, optical element 70 is optically coupled to photonic assembly 20 via optical guide 40. In some alternative embodiments, optical element 70 is configured to optically couple one or more optical signals L1 to or from optical guide 40. In some alternative embodiments, optical element 70 includes one or more optical fibers 72. Optical element 70 may be (or include) a fiber optic array unit (FAU). In some alternative embodiments, optical element 70 includes a protrusion 70P configured to insert into recesses 410R3 and 420R3 for attachment to optical guide 40. In some alternative embodiments, protrusion 70P engages with recesses 410R3 and 420R3 to connect optical element 70 to optical guide 40.

[0045] Electrical contacts 81 may be disposed on surface 102. In some alternative embodiments, electrical contacts 81 are electrically connected to conductive pads 120 of substrate 10. In some embodiments, electrical contacts 81 include solder elements or solder balls, such as controlled collapse chip connection (C4) bumps, ball grid arrays (BGAs), or pad grid arrays (LGAs).

[0046] An adhesive element 83 may be disposed between the photonic component 20 and the substrate 10. In some alternative embodiments, the adhesive element 83 attaches the photonic component 20 to the surface 101 of the substrate 10. The adhesive element 83 may be (or include) a die-attachable film (DAF).

[0047] An adhesive element 92 may be disposed between the optical guide 40 and the photonic assembly 20. In some alternative embodiments, the adhesive element 92 adheres the optical guide 40 to surfaces 202 and 233 of the photonic assembly 20.

[0048] Figure 1C This is a top view of an electronic device 1 according to some alternative embodiments of the present disclosure. In some alternative embodiments, Figure 1A It is along Figure 1C A schematic diagram of the transverse cross-sectional structure of line 1A-1A' in the diagram.

[0049] In some alternative embodiments, the photonic component 20 includes a plurality of optical channels 220 exposed to the recess 230 via surface 231. In some alternative embodiments, the recess 230 is defined by surfaces 231, 232, 234, and 235 (also referred to as “sides” or “sidewalls”). In some alternative embodiments, from a top view perspective, an edge portion 40E surrounds the recess 230.

[0050] In some alternative embodiments, the optical guide 40 includes a plurality of lenses 410L and a plurality of lenses 420L, which are substantially aligned and overlap with lens 410L. In some alternative embodiments, the optical assembly 70 includes a plurality of optical fibers 72. In some alternative embodiments, grooves 410R2 and 420R2 extend in one direction substantially perpendicular to the extension direction of the optical channel 220 and the optical fibers 72 (e.g., direction DR1). In some alternative embodiments, reflectors 430 and 440 extend in one direction substantially perpendicular to the extension direction of the optical channel 220 and the optical fibers 72 (e.g., direction DR1).

[0051] In some alternative implementations, refer to Figure 1A and Figure 1C The guide structure 40A includes a recess 410R2 and is configured to switch the transmission direction of multiple optical signals L1 from the optical channel 220. In some alternative embodiments, a reflective surface 410S is defined by the recess 410R2 and is configured to switch the transmission direction of the optical signals L1 from the optical channel 220. In some alternative embodiments, the guide structure 40A is configured to optically couple optical signals L1 from multiple basic horizontal paths (e.g., path P1) to multiple non-horizontal paths (e.g., path P2). In some alternative embodiments, the guide structure 40A includes multiple lenses 410L. In some alternative embodiments, each optical channel 220 is configured to be optically coupled to one of the lenses 410L. In some alternative embodiments, the guide structure 40A includes a reflector 430 that overlaps with the lens 410L from a top view angle.

[0052] In some alternative implementations, refer to Figure 1A and Figure 1C The guide structure 40B includes a recess 420R2 and is configured to switch the transmission direction of multiple optical signals L1 from the guide structure 40A. In some alternative embodiments, a reflective surface 420S is defined by the recess 420R2 and is configured to switch the transmission direction of the optical signals L1 from the guide structure 40A. In some alternative embodiments, the guide structure 40B is configured to optically couple optical signals L1 from multiple non-horizontal paths (e.g., path P2) to multiple fundamental horizontal paths (e.g., path P3) different from path P1. In some alternative embodiments, the guide structure 40B includes multiple lenses 420L. In some alternative embodiments, each lens 420L faces and is substantially aligned with each lens 410L. In some alternative embodiments, from a top view perspective, lenses 410L substantially overlap with lenses 420L. In some alternative embodiments, each lens 420L is configured to optically couple to one of the optical fibers 72. In some alternative embodiments, the guide structure 40B includes a reflector 440 that overlaps with the lens 420L from a top view perspective. In some alternative embodiments, the reflector 430 and the reflector 440 partially overlap from a top view perspective.

[0053] According to some optional embodiments of this disclosure, photoelectric detection of the optical component 70a can be performed prior to the unitization operation via the optical guide 40. Therefore, only unitization units that pass the detection (e.g., photonic components 20 on which electronic elements 30 are disposed) can be further connected to the substrate 10 to form the electronic device 1, and unitization units that fail the detection (e.g., photonic components 20 on which electronic elements 30 are disposed) can be discarded or reworked. In this way, only unitization units considered "good chips" can be used to form the electronic device 1. Therefore, the manufacturing process of the electronic device 1 can be simplified without reworking the photonic components 20 of the unitization unit if it fails the detection after unitization, and costs can be reduced.

[0054] Furthermore, according to some alternative embodiments of this disclosure, the optical guide 40 does not include a grating coupler, but can serve as a vertical coupler to guide optical signals upward from the photonic component 20. Therefore, unlike wavelength-sensitive grating couplers, the optical guide 40 can be used for optical coupling of optical signals of various wavelengths. Thus, the optical guide 40 can support optical transmission over a relatively large wavelength range.

[0055] Furthermore, according to some alternative embodiments of this disclosure, the optical guide 40 can amplify the beam size of the optical signal from the optical channel 220 and includes lenses 410L and 420L2 that can collimate the optical signal. Therefore, the tolerance of optical coupling can be improved.

[0056] Furthermore, according to some arrangements of this disclosure, the protrusion 70P engages with the grooves 410R3 and 420R3 to connect the optical element 70 to the optical guide 40. Therefore, the electronic device 1 can include a detachable optical element 70, thereby increasing flexibility.

[0057] Furthermore, according to some arrangements of this disclosure, the optical guide 40 is partially disposed in the recess 230 and connected to the surface 233. Therefore, the depth of the recess 230 can be designed or adjusted to control the passive alignment of the optical guide 40 with the optical channel 220 and the optical element 70. Thus, improved passive alignment in the substantially vertical direction can be provided.

[0058] Figure 1D This is a schematic cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. In some alternative embodiments, Figure 1D It shows Figure 1A A schematic diagram of the cross-sectional structure of a portion of electronic device 1.

[0059] In some arrangements, refer to Figure 1A and Figure 1D The surface of lens 410L is inclined relative to the surface 201 of photon assembly 20. In some alternative embodiments, reference... Figure 1A and Figure 1D The tangent of the surface of lens 410L is inclined relative to the surface 201 of photon assembly 20. In some alternative embodiments, reference... Figure 1A and Figure 1D The surface of lens 420L is inclined relative to the surface 201 of photonic assembly 20. In some alternative embodiments, reference... Figure 1A and Figure 1D The tangent of the surface of lens 420L is inclined relative to the surface 201 of photonic assembly 20. In some alternative embodiments, the tangent of the surface of lens 410L is substantially parallel to the tangent of the surface of lens 420L.

[0060] Figure 2A This is a schematic diagram of the cross-sectional structure of an electronic device 2 according to an embodiment of the present disclosure. Figure 2B This is a schematic cross-sectional view of a portion of an electronic device 2 according to an embodiment of the present disclosure. The electronic device 2 is similar to... Figures 1A to 1C Electronic devices 1 in the series, and the differences between them are described below.

[0061] Electronic device 2 may also include connecting element 87 and connecting elements 96 and 98.

[0062] In some alternative embodiments, the photonic component 20 includes a conductive via 20v electrically connected to the circuit layer 210. In some alternative embodiments, the photonic component 20 is electrically connected to the substrate 10 via the conductive via 20v and a connection element 87. The connection element 87 may be (or include) conductive bumps, such as solder bumps.

[0063] In some arrangements, optical module 410 is connected to optical module 420 via connecting element 96. Connecting element 96 may not protrude into cavity S1. In some arrangements, connecting element 96 does not cover the exposed portion of optical channel 220. In some arrangements, connecting element 96 covers portions of the sidewalls of optical modules 410 and 420. Connecting element 96 may include a UV-curable gel. The UV-curable gel may be an optical gel transparent to the light signal L1.

[0064] In some arrangements, the optical guide 40 is connected to the photonic assembly 20 via a connecting element 98. The connecting element 98 may include a UV-curable gel. The UV-curable gel may be an optical gel that is transparent to the light signal L1.

[0065] Figure 2C This is a top view of an electronic device 2 according to an embodiment of the present disclosure. In some alternative embodiments, Figure 2A It is along Figure 2C A schematic diagram of the transverse cross-section structure of line 2A-2A' in the diagram.

[0066] In some alternative embodiments, the groove 230 extends beyond the edge of the optical guide 40. In some arrangements, a portion of the groove 230 is exposed by the optical guide 40 when viewed from a top view. In some arrangements, the groove 230 is defined by surfaces 231 and 232. In some arrangements, the edge portion 40E of the optical guide 40 overlaps with surfaces 231 and 232 when viewed from a top view.

[0067] Figure 3A This is a top view illustrating one or more stages of an exemplary method for manufacturing an electronic device 1 according to an embodiment of the present disclosure. Figure 3B This is a schematic cross-sectional view illustrating one or more stages of an exemplary method for manufacturing an electronic device 1 according to an embodiment of the present disclosure. In one embodiment, Figure 3B It is along Figure 3A A schematic diagram of the transverse cross-sectional structure of line 3B-3B' in the diagram.

[0068] In some alternative embodiments, a wafer-level photonic structure 20A may be provided, having a plurality of recesses 230 and a plurality of sets of optical channels 220 exposed by the recesses 230, and electronic components 30 may be electrically connected to the photonic structure 20A. The photonic structure 20A may include a plurality of units (e.g., units U1 and U2), each unit including a recess 230 and a set of optical channels 220. Before the photonic structure 20A is monolithically converted into a monolithic unit (e.g., photonic assembly 20), optical signals from the optical channels 220 of the photonic structure 20A can be directed to an elevated position (e.g., edge 420e) by placing an optical guide 40 in the recesses 230 of the photonic structure 20A, thereby optically coupling it with the optical assembly 70, thereby performing photoelectric detection on the wafer-level photonic structure 20A. In some alternative embodiments, the monolithization operation may be performed after the optical assembly 70 performs detection. In some alternative implementations, only monolithic units that pass the test (e.g., photonic components 20 on which electronic elements 30 are disposed) can be further connected to the substrate 10 to form an electronic device. In some alternative implementations, monolithic units that fail the test (e.g., photonic components 20 on which electronic elements 30 are disposed) can be discarded or reworked.

[0069] In some alternative implementations, the optical guide 40 can be permanently attached to the photonic structure 20A or photonic component 20 after the test is passed, thus the monolithic unit is considered a "known qualified chip". Therefore, the manufacturing process of the electronic device can be simplified without rework if the photonic component 20 is determined to have failed the test after monolithization, and costs can be reduced.

[0070] Spatial descriptions, such as "above," "below," "upward," "leftward," "rightward," "downward," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "above," "below," etc., unless otherwise stated, are relative to the directions shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual implementations of the structures described herein can be spatially arranged in any direction or manner, as long as they do not depart from the advantages of the embodiments of this disclosure.

[0071] As used herein, the terms “approximately,” “substantially,” “substantially,” and “about” are used to describe and explain small variations. When used in conjunction with an event or situation, these terms can refer to a situation where the event or situation occurred precisely, or an situation where the event or situation occurred approximately. For example, when used in conjunction with a numerical value, these terms can refer to a range of variation less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value can be considered “substantially” the same as or equal to the second numerical value. For example, “basically” vertical can refer to a range of angular variation relative to 90° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1%, or less than or equal to ±0.05°.

[0072] If the displacement between two surfaces is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, the two surfaces can be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, the surface can be considered substantially flat.

[0073] As used herein, the singular terms “a,” “an,” and “the” may include plural references unless the context clearly indicates otherwise.

[0074] As used herein, the terms “conductive,” “electro-conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials are generally defined as materials that offer little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity greater than about 10⁴ S / m, for example, at least 10⁵ S / m or at least 10⁶ S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise stated, the conductivity of a material is measured at room temperature.

[0075] In addition, this document sometimes presents quantities, ratios, and other numerical values ​​in range format. It should be understood that this range format is used for convenience and brevity, and should be flexibly interpreted to include not only the numerical values ​​explicitly specified as range limits, but also all individual numerical values ​​or subranges contained within that range, as if each numerical value and subrange were explicitly specified.

[0076] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and substitutions may be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. These illustrations are not necessarily drawn to scale. Differences may exist between artistic representations in this disclosure and actual devices due to manufacturing processes and tolerances. Other embodiments of this disclosure may exist that are not specifically described. The specification and drawings should be considered illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, composition, methods, or processes to the purpose, spirit, and scope of this disclosure. All such modifications are intended to fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless expressly stated otherwise herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. An electronic device, comprising: Photonic components, including optical channels; and An optical guide is configured to be optically coupled to the optical channel and to guide the optical signal to change its transmission direction.

2. The electronic device according to claim 1, wherein, The optical guide includes a first guide structure and a second guide structure that are rotationally symmetrical about the central axis of the optical guide, wherein the optical guide is configured to optically couple an optical signal from the optical channel along a first basic horizontal path to a non-horizontal path.

3. The electronic device according to claim 2, wherein, The first guide structure and the second guide structure together form a structure that is approximately 180° rotationally symmetrical about the central axis.

4. The electronic device according to claim 2, wherein, The first guide structure includes a first reflector and a plurality of first lenses that overlap with the first reflector from a top view angle.

5. The electronic device according to claim 4, wherein, The second guide structure includes a second reflector and a plurality of second lenses that overlap with the second reflector from a top view angle.

6. The electronic device according to claim 5, wherein, The first reflector partially overlaps with the second reflector.

7. The electronic device according to claim 5, wherein, The first lens and the second lens substantially overlap.

8. The electronic device according to claim 2, wherein, The optical guide is further configured to optically couple an optical signal from the non-horizontal path to a second basic horizontal path, thereby optically coupling the optical signal to an optical component outside the optical guide.

9. The electronic device according to claim 2, wherein, The first guide structure and the second guide structure define a plurality of lenses exposed in the cavity of the optical guide.

10. The electronic device according to claim 9, wherein, The photonic component includes a plurality of optical channels, and the first guide structure is configured to optically couple multiple optical signals from a plurality of first basic horizontal paths to a plurality of non-horizontal paths.

11. The electronic device according to claim 10, wherein, The non-horizontal path passes through multiple lenses.

12. The electronic device according to claim 1, wherein, The optical guide includes a first optical module and a second optical module assembled together to form a generally symmetrical structure, wherein the optical guide is configured to guide optical signals to be transmitted along at least two different directions.

13. The electronic device according to claim 12, wherein, The first optical module defines a first groove, and the second optical module includes a first protrusion configured to be inserted into the first groove.

14. The electronic device according to claim 13, wherein, The first optical module includes a second protrusion, and the second optical module defines a second groove configured to receive the second protrusion.

15. The electronic device according to claim 14, wherein, The first groove, the second groove, the first protrusion, and the second protrusion are located in the peripheral area of ​​the optical guide.

16. The electronic device according to claim 12, wherein, The first optical module and the second optical module define an optical guide that is exposed to the cavity of the optical guide.

17. The electronic device according to claim 1, wherein, The optical guide includes: A first guide structure includes a first groove and is configured to switch the transmission direction of multiple optical signals from the optical channel; and The second guide structure includes a second groove and is configured to switch the transmission direction of an optical signal from the first guide structure, wherein the first groove and the second groove define a rotationally symmetric cross-sectional profile.

18. The electronic device according to claim 17, wherein, The first guide structure has a first reflective surface defined by the first groove and is configured to switch the transmission direction of the optical signal from the optical channel.

19. The electronic device according to claim 18, wherein, The second guide structure has a second reflective surface defined by the second groove and is configured to switch the transmission direction of the optical signal from the first guide structure.

20. The electronic device of claim 19, further comprising a first reflector disposed on the first reflective surface and a second reflector disposed on the second reflective surface, wherein the first groove, the second groove, the first reflector and the second reflector define the rotationally symmetric cross-sectional profile.

21. The electronic device according to claim 17, wherein, The photonic component defines a recessed groove from its upper surface to accommodate a portion of the second guide structure.

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