3D camera and shell structure thereof
By designing independent mounting and heat dissipation cavities within the 3D camera housing, and combining them with fans and radiators for active heat dissipation, the problem of low heat dissipation efficiency in existing technologies is solved, achieving efficient heat management and protecting precision components and imaging quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-07
- Publication Date
- 2026-04-03
AI Technical Summary
Current 3D cameras mainly rely on passive cooling, which is insufficient to meet the rapid heat dissipation requirements of high-power devices. This leads to increased component temperatures, causing problems such as image distortion, increased signal noise, and shortened hardware lifespan.
The housing structure of the 3D camera is designed with independent mounting cavities and heat dissipation cavities. Active heat dissipation is achieved by using a fan and heat sink in combination with heat-conducting components. The heat in the mounting cavity is conducted to the heat dissipation cavity through the heat-conducting components, and the airflow is driven by the fan to achieve forced convection, thus achieving efficient heat dissipation.
It effectively improves heat dissipation efficiency, avoids the impact of hot airflow on precision optical components, protects optical components and electronic devices, and ensures imaging quality and detection accuracy.
Smart Images

Figure CN121785032A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of optical equipment technology, and in particular to the design of a 3D camera and its housing structure. Background Technology
[0002] 3D cameras achieve real-time acquisition and analysis of three-dimensional spatial data through high-precision sensors and image processing algorithms, and are widely used in fields such as industrial inspection, medical imaging, intelligent security, robot vision, and AR / VR.
[0003] 3D cameras contain circuit boards and precision optical components, such as projection light emitters and image sensors, which generate a significant amount of heat during continuous operation. Poor heat dissipation can lead to increased component temperatures, causing problems such as image distortion, increased signal noise, and shortened hardware lifespan, and in severe cases, may even cause device failure.
[0004] In related technologies, 3D cameras typically rely on heat conduction or natural convection for heat dissipation. While the structure is simple, the heat dissipation effect is poor. Summary of the Invention
[0005] This disclosure provides a 3D camera and its housing structure to improve heat dissipation.
[0006] To achieve the above objectives, the present disclosure adopts the following technical solution:
[0007] In a first aspect, this disclosure provides a housing structure for a 3D camera, comprising: a housing assembly, wherein the housing assembly is configured to form an independent mounting cavity and a heat dissipation cavity;
[0008] The mounting cavity is used to mount the circuit board and optical components of the 3D camera;
[0009] The shell assembly is also configured to form an air inlet and an air outlet, which are respectively connected to the heat dissipation cavity;
[0010] A fan and a radiator are provided inside the heat dissipation cavity, and the fan and the radiator are located between the air inlet and the air outlet; the radiator has at least one heat-conducting element, and the heat-conducting element extends from the heat dissipation cavity to the mounting cavity for conducting heat in the mounting cavity to the heat dissipation cavity.
[0011] Compared with the prior art, the housing structure of the 3D camera provided in this disclosure has the following advantages:
[0012] The housing structure of the 3D camera in this embodiment of the present disclosure forms mutually isolated mounting cavities and heat dissipation cavities within the housing assembly, ensuring a closed environment within the mounting cavity, reducing the impact of the external environment on optical components and electronic devices, and protecting the precision components within the mounting cavity from interference by dust and airflow.
[0013] By installing a fan and a radiator inside the heat dissipation cavity, and by installing heat-conducting components, the heat in the installation cavity is transferred to the heat dissipation cavity. The fan drives the external airflow to enter the radiator through the air inlet. After the airflow exchanges heat with the radiator, it is discharged through the air outlet, thus achieving heat dissipation.
[0014] During the heat dissipation process, heat is conducted from the mounting cavity to the heat dissipation cavity using heat-conducting components, and forced convection is achieved using a fan. This active heat dissipation method, which combines heat conduction and heat convection, effectively improves heat dissipation efficiency.
[0015] By setting up mutually isolated mounting cavities and heat dissipation cavities, airflow isolation is achieved, preventing heat dissipation airflow from passing through precision components such as projection components and lens components. This prevents hot airflow from baking precision optical components, which could lead to temperature drift, distortion, and other issues affecting image quality. It also prevents dust, moisture, and other contaminants from polluting precision optical components, thus protecting optical components and electronic devices.
[0016] As an improvement to the above-described housing structure of this disclosure, the housing assembly includes: an outer housing portion and a partition plate and a heat-conducting plate disposed within the outer housing portion, wherein the partition plate is located between the mounting cavity and the heat dissipation cavity, and the partition plate is provided with a first mounting opening;
[0017] The heat-conducting plate is sealed and installed at the first mounting port, and the heat-conducting plate is opposite to the heat sink;
[0018] The heat-conducting component is sealed to the heat-conducting plate and extends from the heat-conducting plate into the mounting cavity.
[0019] As an improvement to the aforementioned housing structure of this disclosure, a first sealing gasket is provided on the peripheral edge of the heat-conducting plate.
[0020] As an improvement to the housing structure described above in this disclosure, the partition plate has a first side and a second side that are opposite to each other and spaced apart along a first direction, and the first side and the second side are respectively located on both sides of the first mounting opening;
[0021] Along the second direction, from the first end to the second end of the partition plate, the spacing between the first side and the second side increases;
[0022] Wherein, the first direction is the direction in which the air inlet and the air outlet are arranged at intervals, and the second direction is perpendicular to the first direction and perpendicular to the thickness direction of the heat-conducting plate;
[0023] The first end of the partition plate is fixedly connected to the outer shell.
[0024] As an improvement to the housing structure described above in this disclosure, the outer shell includes a housing body and an outer cover that is sealed and connected to the housing body; the mounting cavity and the heat dissipation cavity are located within the space formed by the housing body and the outer cover;
[0025] The partition plate is integrally formed with the shell body.
[0026] As an improvement to the shell structure described above in this disclosure, the partition plate, the heat-conducting plate, and part of the shell body enclose a cavity facing the opening of the outer cover;
[0027] The shell assembly also includes a cover plate, which is sealed to the partition plate, the heat-conducting plate and the shell body to form the heat dissipation cavity.
[0028] As an improvement to the above-described housing structure of this disclosure, the cover plate is fixedly connected to at least one of the partition plate, the heat-conducting plate, and the housing body, and an annular second sealing gasket is provided between the cover plate and the partition plate, the heat-conducting plate, and the housing body, the second sealing gasket being located inside the fixed position of the cover plate.
[0029] As an improvement to the housing structure described above in this disclosure, the housing assembly is provided with a second mounting port, which communicates with the heat dissipation cavity;
[0030] The housing assembly includes an air inlet grille that forms the air inlet, and the air inlet grille is detachable and covers the second mounting opening;
[0031] The fan is opposite to the second mounting port.
[0032] As an improvement to the housing structure described above, the fan is detachably mounted to the heat dissipation cavity via the second mounting port.
[0033] As an improvement to the above-described housing structure, a first electrical connector is provided inside the heat dissipation cavity, and a second electrical connector is provided on the fan; the second electrical connector is detachably electrically connected to the first electrical connector.
[0034] As an improvement to the above-described housing structure, a mating component is provided inside the heat dissipation cavity, and an elastic pin is provided on the fan. The elastic pin abuts against the mating component to make the elastic pin electrically connected to the mating component.
[0035] As an improvement to the housing structure described above, the air outlet includes a first air outlet and a second air outlet. The first air outlet and the air inlet are located on the side of the housing portion away from the mounting cavity along a third direction, and the second air outlet is disposed on the side of the housing portion away from the air inlet along the first direction.
[0036] The third direction is parallel to the thickness direction of the heat-conducting plate.
[0037] As an improvement to the housing structure described above, the heat-conducting element is used to contact the circuit board of the 3D camera within the mounting cavity;
[0038] The heat-conducting element is provided in multiple forms, wherein at least one of the heat-conducting elements is bent and extended within the mounting cavity.
[0039] As an improvement to the housing structure described above, the heat dissipation cavity is located on the side of the mounting cavity away from the shooting end of the optical element of the 3D camera.
[0040] As an improvement to the housing structure described above in this disclosure, the housing assembly is provided with at least one drain hole, which communicates with the heat dissipation cavity.
[0041] In a second aspect, embodiments of this disclosure also provide a 3D camera, which includes: a circuit board, a projection assembly, at least one lens assembly, and a housing structure as described in any of the first aspects;
[0042] The circuit board, the projection assembly, and at least one of the lens assemblies are mounted within the mounting cavity of the housing structure.
[0043] The 3D camera provided in the second aspect of this disclosure, since it includes the housing structure described in the first aspect, also has the same advantages as the housing structure described in the first aspect. Attached Figure Description
[0044] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of this disclosure. These drawings and text descriptions are not intended to limit the scope of the concept of this disclosure in any way, but to illustrate the concept of this disclosure to those skilled in the art by referring to specific embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0045] Figure 1 An exploded view of a 3D camera provided in an embodiment of this disclosure;
[0046] Figure 2 for Figure 1 Gas flow diagram after removing the outer cover and lid using a 3D camera;
[0047] Figure 3 This is a schematic diagram of the structure of a 3D camera provided in an embodiment of the present disclosure;
[0048] Figure 4 for Figure 3 AA section view in the middle;
[0049] Figure 5 An exploded view of a 3D camera provided in an embodiment of this disclosure;
[0050] Figure 6 This is a schematic diagram of the structure of the heat-conducting plate provided in an embodiment of this disclosure;
[0051] Figure 7 This is a schematic diagram of the structure of the shell body provided in an embodiment of this disclosure;
[0052] Figure 8 for Figure 7 BB section view in the middle;
[0053] Figure 9 An exploded view of a portion of the structure of a 3D camera provided in an embodiment of this disclosure.
[0054] Explanation of reference numerals in the attached figures:
[0055] 100. Shell assembly; 101. Mounting cavity; 102. Heat dissipation cavity; 103. Light transmission window; 104. Second mounting port;
[0056] 110. Outer shell; 111. Shell body; 112. Outer cover; 113. Air inlet; 114. Air outlet; 1141. First air outlet; 1142. Second air outlet; 115. Fourth fixing part;
[0057] 120. Partition plate; 121. First mounting port; 122. First side; 123. Second side; 124. Third fixing part; 125. Mating part; 126. First plate part; 127. Second plate part; 128. Third plate part; 129. Fourth plate part;
[0058] 130. Heat-conducting plate; 131. First sealing gasket; 1311. First sealing groove; 132. Plate body; 133. First fixing part; 134. Mating groove; 135. Second fixing part;
[0059] 140. Cover plate; 141. Second sealing gasket; 1411. Second sealing groove;
[0060] 200. Fan; 210. Mounting part; 220. Flexible ejector pin;
[0061] 300, radiator; 310, heat-conducting component; 320, finned portion; 330, heat conductor. Detailed Implementation
[0062] 3D cameras, as devices capable of acquiring geometric and textural information of objects in three-dimensional space, are widely used in fields such as industrial inspection, medical imaging, intelligent security, robot vision, and AR / VR.
[0063] In industrial settings, 3D cameras need to operate stably for extended periods in high-temperature, high-humidity, or dusty environments, such as in semiconductor manufacturing workshops, automotive assembly lines, or outdoor monitoring systems. The delicate optical components (such as projection light emitters and image sensors) and computing components (such as processors) inside a 3D camera generate significant heat during continuous operation. Poor heat dissipation can lead to elevated component temperatures, causing problems such as image distortion, increased signal noise, and shortened hardware lifespan, potentially resulting in equipment failure in severe cases.
[0064] In related technologies, 3D cameras primarily rely on passive cooling, such as metal heat sinks, for heat dissipation. Passive cooling structures typically transfer heat to the casing surface through thermally conductive materials, but their heat dissipation efficiency is limited by ambient temperature and airflow, making it difficult to meet the rapid heat dissipation requirements of high-power devices.
[0065] In view of this, the present disclosure provides a 3D camera that utilizes a combination of heat conduction and forced convection to achieve heat dissipation while avoiding the impact of heat dissipation airflow passing through precision components such as the camera's lens assembly and projection assembly.
[0066] The 3D camera features an independent mounting cavity and a heat dissipation cavity within its housing. The mounting cavity houses the camera's lens assembly, projection assembly, and circuit board. The heat dissipation cavity contains a fan and a heat sink, which extends into the mounting cavity via a heat-conducting component. In this way, heat from the mounting cavity is conducted to the heat sink via the heat-conducting component, and the fan forces air convection through the heat sink, carrying away the heat and achieving active cooling for the 3D camera.
[0067] Moreover, since the heat dissipation cavity is independent of the mounting cavity, the fan-driven airflow will not enter the mounting cavity, thus isolating the heat dissipation airflow from the mounting cavity. This avoids the impact of hot airflow on precision components such as the lens assembly and projection assembly, ensuring imaging quality and detection accuracy.
[0068] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting this disclosure.
[0069] Combination Figure 1 This disclosure provides a 3D camera, which includes: a housing structure and electrical components and optical elements installed within the housing structure.
[0070] The electrical components may include the circuit board of the 3D camera, which integrates control devices, processing devices, and storage devices to control the operation of the 3D camera and thus control its working state.
[0071] The optical elements of a 3D camera may include a projection component and at least one lens component. The projection component is configured to project a pattern toward the surface of the object being measured, and the light reflected from the surface of the object being measured forms a detection image via the lens component.
[0072] The circuit board is electrically connected to the controller of the projection assembly to control the working state of the projection assembly; the circuit board is also electrically connected to the image sensor of the lens assembly to receive the detection image signal from the image sensor.
[0073] There can be one lens assembly, or two or more lens assemblies.
[0074] For this purpose, the housing structure is provided with at least two light-transmitting windows 103, through which the projection component projects an image outward; and through which the lens component receives the light reflected by the object being detected.
[0075] 3D cameras inevitably generate heat during operation. This heat can be generated by components such as processing chips on circuit boards.
[0076] The housing structure of this embodiment not only provides mounting positions for the electrical components and optical elements of the 3D camera and forms the external structure of the 3D camera, but also serves to dissipate heat.
[0077] In this embodiment of the disclosure, the structure may include a shell assembly 100, which serves as the main frame of the 3D camera, forming the appearance of the 3D camera and also housing optical components, electrical components, and other structures.
[0078] The housing assembly 100 has an internal structure that forms an independent mounting cavity 101 and a heat dissipation cavity 102. "Independent" can be understood as the mounting cavity 101 and the heat dissipation cavity 102 being isolated from each other and not connected.
[0079] In some embodiments, the shell assembly 100 includes an outer shell portion 110 and an internal structure disposed within the outer shell portion 110. The outer shell portion 110 is configured to form a shell structure with a certain accommodating space, and the internal structure is disposed within the outer shell portion 110, forming mutually isolated and non-communicating heat dissipation cavities 102 within the outer shell portion 110.
[0080] like Figure 1 As shown, the outer casing 110 includes a casing body 111 and an outer cover 112 that is sealed to the casing body 111; the mounting cavity 101 and the heat dissipation cavity 102 are located in the space formed by the casing body 111 and the outer cover 112.
[0081] Among them, Figure 1 The outer shell 110 is rectangular in shape, with a regular and compact structure. However, this is not a limitation on the shape of the outer shell 110.
[0082] The shell body 111 may include a bottom wall and a side wall surrounding the edge of the bottom wall. The side wall may be arranged perpendicular to the bottom wall, and the side wall and the bottom wall together form an open shell structure with an opening on one side. The outer cover 112 is fixedly connected to the side wall to form a closed space.
[0083] There are several ways to fix the shell body 111 and the outer cover 112. For example, the shell body 111 and the outer cover 112 are connected by screws, which is stable and reliable. Another example is that the shell body 111 is snapped into the outer shell, which is convenient for assembly. Yet another example is that the shell body 111 and the outer cover 112 are bonded together, which achieves a fixed connection while ensuring sealing performance.
[0084] In some specific implementations, the shell body 111 and the outer cover 112 are fixedly connected by screws. For example, screws are respectively provided at the four corners of the rectangular shell body 111 to fix the shell body 111 and the outer cover 112. Furthermore, a sealing ring or sealant is provided between the shell body 111 and the outer cover 112 to achieve a seal.
[0085] The outer shell 110 is divided into two parts: the shell body 111 and the outer cover 112. This facilitates the assembly of the internal structure into the internal space of the outer shell 110. Furthermore, the body and the outer cover 112 can be sealed together to ensure the sealing performance of the internal space of the outer shell 110, thereby improving the waterproof performance of the 3D camera and protecting the internal electrical components.
[0086] Continue to refer to Figure 1 In this embodiment of the present disclosure, the heat dissipation cavity 102 is located on the side of the mounting cavity 101 away from the shooting end of the lens assembly.
[0087] With this configuration, the heat dissipation cavity 102 is positioned away from the lens assembly, creating an isolation between the heat dissipation cavity 102 and the lens assembly through the mounting cavity 101. This reduces the temperature rise of the lens assembly caused by the housing body 111 through heat conduction. Furthermore, it provides sufficient space for the installation and wiring of the lens assembly.
[0088] Combination Figure 1The housing assembly 100 is also configured to form an air inlet 113 and an air outlet 114, which are respectively connected to the heat dissipation cavity 102. In this way, external airflow can enter the heat dissipation cavity 102 through the air inlet 113 and be discharged through the air outlet 114. During the process of the gas flowing through the heat dissipation cavity 102, heat is carried away, thereby achieving heat dissipation.
[0089] The air inlet 113 and the air outlet 114 are both located on the shell body 111 of the outer shell portion 110 of the shell assembly 100, so as to connect the heat dissipation cavity 102 inside the outer shell portion 110 and the external space outside the outer shell portion 110.
[0090] The air inlet 113 and the air outlet 114 are spaced apart to reduce the possibility of the airflow discharged from the air outlet 114 re-entering the air inlet 113.
[0091] In some possible embodiments of this disclosure, the air inlet 113 and the air outlet 114 are arranged at intervals along the length of the housing assembly 100, so that the air inlet 113 and the air outlet 114 have a large arrangement space and a large gap between the air inlet 113 and the air outlet 114, which helps to reduce the occurrence of airflow short circuit, that is, to reduce the possibility of the airflow discharged from the air outlet 114 re-entering the air inlet 113.
[0092] In some embodiments, the air inlet 113 and the air outlet 114 may be provided with grilles, which can reduce the entry of impurities into the heat dissipation cavity 102 while ensuring ventilation capacity, and can also shield and protect the structure inside the heat dissipation cavity 102.
[0093] Reference Figure 1 In some embodiments of this disclosure, the air outlet 114 includes a first air outlet 1141 and a second air outlet 1142. The first air outlet 1141 and the air inlet 113 are located on the side of the outer shell 110 away from the mounting cavity 101 along a third direction, and the second air outlet 1142 is disposed on the side of the outer shell 110 away from the air inlet 113 along a first direction.
[0094] Among them, the third direction is parallel to the thickness direction of the heat-conducting plate 130, and the third direction is parallel to the width direction of the shell assembly 100, corresponding to Figure 1 In the Y-axis direction.
[0095] The first air outlet 1141 and the air inlet 113 are both located on the side wall of the shell body 111 opposite to the partition plate 120. The second air outlet 1142 is opposite to the fin portion 320 of the radiator 300 along the first direction and away from the air inlet 113.
[0096] In this embodiment, by providing air outlets on the shell body 111 of the outer shell portion 110 in different directions, the air outlet area and direction are increased, which facilitates faster heat dissipation and improves heat dissipation efficiency. Moreover, the second air outlet 1142 and the air inlet 113 are located on the sidewalls of the shell body 111 in different directions, which effectively prevents the exhausted hot air from being immediately re-inhaled into the air inlet 113, thus avoiding a thermal short circuit and helping to ensure heat dissipation efficiency.
[0097] Reference Figure 1 A fan 200 and a radiator 300 are installed inside the heat dissipation cavity 102, and the fan 200 and the radiator 300 are located between the air inlet 113 and the air outlet 114.
[0098] like Figure 2 As shown, the fan 200 is configured to, when started, drive the cooler air outside the housing assembly 100 into the heat dissipation chamber 102 through the air inlet 113, exchange heat with the radiator 300 when passing through the radiator 300, carry away the heat of the radiator 300 and discharge it through the air outlet 114, thereby achieving heat dissipation.
[0099] exist Figure 2 In the diagram, dashed lines with arrows represent the main heat transfer paths, while solid lines with arrows represent the airflow paths.
[0100] Continue to refer to Figure 3 and Figure 4 The radiator 300 has at least one heat-conducting element 310, which extends from the heat dissipation cavity 102 to the mounting cavity 101 for conducting heat in the mounting cavity 101 to the heat dissipation cavity 102.
[0101] A portion of the heat-conducting element 310 is located in the mounting cavity 101, and the other portion of the heat-conducting element 310 is located in the heat dissipation cavity 102, and conducts heat from the mounting cavity 101 to the heat dissipation cavity 102.
[0102] The thermally conductive component 310 can be made of metal, which has good thermal conductivity. Of course, the thermally conductive component 310 can also be made of plastic or other materials with good thermal conductivity.
[0103] The heat-conducting component 310 can be a heat pipe, which is easy to set in a longer size, increases the heat conduction area, and has little impact on the overall weight of the 3D camera.
[0104] In some embodiments, the heat-conducting element 310 contacts the circuit board within the mounting cavity 101, so that the heat-conducting element 310 directly contacts the heat source within the mounting cavity 101, achieving precise heat conduction and reducing the conduction of heat toward the projection assembly and lens assembly.
[0105] Continue to refer to Figure 4Multiple heat-conducting elements 310 are provided to improve heat transfer efficiency. These multiple heat-conducting elements 310 extend from the heat dissipation cavity 102 to the mounting cavity 101 at different locations, ensuring a gap between adjacent heat-conducting elements 310. This helps reduce heat crosstalk between adjacent heat-conducting elements 310 and improves the directionality of heat transfer from the mounting cavity 101 to the heat dissipation cavity 102. It also increases the contact area between the heat-conducting elements 310 and the mounting cavity 101, further improving heat transfer efficiency.
[0106] like Figure 4 As shown, within the plane containing the partition wall between the heat dissipation cavity 102 and the mounting cavity 101, a plurality of heat-conducting elements 310 extend along a first direction of this plane (corresponding to...). Figure 4 The X-axis direction), the second direction (corresponding to) Figure 4 The Y-axis direction has intervals.
[0107] In some embodiments, at least one heat-conducting element 310 is bent and extended within the mounting cavity 101 to increase the extension length of the heat-conducting element 310 within the mounting cavity 101, thereby helping to increase the heat conduction efficiency. Moreover, by bending and extending the heat-conducting element 310, the heat-conducting element 310 can be brought close to, or even in contact with, the heat source within the mounting cavity 101, improving the accuracy of heat conduction and reducing the possibility of heat dissipation within the mounting cavity 101.
[0108] It should be noted that the present invention does not limit the bending and extension shape of the heat-conducting component 310 in the mounting cavity 101, and can be set according to the layout of electrical components in the mounting cavity 101.
[0109] Continue to refer to Figure 4 The radiator 300 may also include a finned portion 320, which is located inside the heat dissipation cavity 102 and is connected to the heat-conducting element 310, so that the heat of the heat-conducting element 310 can be conducted to the finned portion 320.
[0110] The finned section 320 includes multiple spaced heat dissipation fins, which exchange heat with the airflow through the contact between the heat dissipation fins and achieve the purpose of heat dissipation.
[0111] like Figure 4 As shown, the heat-conducting element 310 can extend the finned portion 320 to the side opposite to the mounting cavity 101, increasing the contact surface between the heat-conducting element 310 and the finned portion 320 to improve heat dissipation efficiency. Furthermore, increasing the contact surface between the heat-conducting element 310 and the airflow also helps improve heat dissipation.
[0112] Continue to refer to Figure 2 and Figure 4The radiator 300 may also include a heat conductor 330 located within the mounting cavity 101 and connected to at least one heat conductor 310 to increase the contact area of the heat conductor 310 within the mounting cavity 101.
[0113] For example, the heat conductor 330 may be plate-shaped to reduce its space occupation within the mounting cavity 101. Of course, this is not limiting; the heat conductor 330 may also be configured with different shapes depending on the space within the mounting cavity 101, the location of the heat source, etc.
[0114] One heat conductor 330 can be provided, or multiple heat conductors 330 can be provided, in order to increase the contact area of the heat conductor 330 in the mounting cavity 101 and improve the efficiency of heat conduction.
[0115] The partition wall between the heat dissipation cavity 102 and the mounting cavity 101 may at least partially have thermal conductivity to improve the efficiency of heat conduction from the mounting cavity 101 to the heat dissipation cavity 102, thereby improving heat dissipation performance.
[0116] Therefore, the housing structure of the 3D camera in this embodiment of the present disclosure, by constructing mutually isolated mounting cavity 101 and heat dissipation cavity 102 within the housing assembly 100, ensures a closed environment within the mounting cavity 101, reduces the influence of the external environment on optical components and electronic devices, and ensures that the precision components within the mounting cavity 101 are protected from interference by dust and airflow.
[0117] By installing a fan 200 and a radiator 300 in the heat dissipation cavity 102 and installing a heat-conducting component 310, the heat in the mounting cavity 101 is conducted to the heat dissipation cavity 102. The fan 200 drives the external airflow to enter the radiator 300 through the air inlet 113. After the airflow exchanges heat with the radiator 300, it is discharged through the air outlet 114, thus achieving heat dissipation.
[0118] During the heat dissipation process, the heat in the mounting cavity 101 is conducted to the heat dissipation cavity 102 by the heat conduction component 310, and the fan 200 is used for forced convection. The active heat dissipation method, which combines heat conduction and heat convection, effectively improves the heat dissipation efficiency.
[0119] By setting up mutually isolated mounting cavity 101 and heat dissipation cavity 102, airflow isolation is achieved, preventing heat dissipation airflow from passing through precision components such as projection components and lens components. This prevents hot airflow from baking precision optical components, which could lead to temperature drift, distortion, and other image quality issues. It also prevents dust, moisture, and other contaminants from polluting precision optical components, thus protecting optical components and electronic devices.
[0120] In some embodiments of this disclosure, combined with Figure 2 The internal structure of the shell assembly 100 may include a partition plate 120 and a heat-conducting plate 130 disposed within the outer shell portion 110.
[0121] Reference Figure 5 The partition plate 120 is located between the mounting cavity 101 and the heat dissipation cavity 102, and the partition plate 120 is provided with a first mounting port 121.
[0122] The partition plate 120 is fixedly connected to the shell body 111. Exemplarily, the partition plate 120 is connected to the bottom wall of the shell body 111. The partition plate 120 is located inside the shell side wall, and the partition plate 120 can be arranged perpendicular to the bottom wall of the shell.
[0123] In this embodiment, the partition plate 120 is integrally formed with the shell body 111, which reduces the number of parts and assembly steps, and helps to improve structural strength and assembly efficiency. Moreover, the integral forming avoids potential gaps at the connection between the partition plate 120 and the shell body 111, which helps to improve the overall sealing of the mounting cavity 101.
[0124] Along the length direction of the shell body 111 (corresponding to) Figure 5 (In the X-axis direction), the partition plate 120 can be a bent plate. The partition plate 120, which is set by bending, constrains the airflow, improves the airflow velocity and directionality, and reduces the loss of airflow velocity.
[0125] For example, combined Figure 5 The partition plate 120 may include a first plate portion 126, a second plate portion 127, a third plate portion 128, and a fourth plate portion 129. Along the length direction of the shell body 111, the first end of the first plate portion 126 is connected to the shell body 111 on the side of the air inlet 113, and the second end of the first plate portion 126 is connected to the first end of the second plate portion 127. The second end of the second plate portion 127 is connected to the first end of the third plate portion 128. The second end of the third plate portion 128 is connected to the first end of the fourth plate portion 129. The second end of the fourth plate portion 129 is connected to the side of the shell body 111 where the air outlet 114 is provided.
[0126] The first plate portion 126 is arranged at an angle relative to the length direction of the shell body 111. Along the length direction of the shell body 111, from the first end to the second end of the first plate portion 126, the first plate portion 126 is inclined toward the mounting cavity 101.
[0127] The second plate portion 127 may be parallel to the length direction of the shell body 111, and the first mounting port 121 is provided on the second plate portion 127.
[0128] The third plate portion 128 is arranged at an angle relative to the length direction of the shell body 111. Along the length direction of the shell body 111, from the first end to the second end of the third plate portion 128, the first plate portion 126 is inclined toward the heat dissipation cavity 102.
[0129] The fourth plate 129 can be parallel to the length direction of the shell body 111.
[0130] Thus, the first plate 126 constrains the airflow entering through the air inlet 113, allowing it to pass through the fan 200 into the fin section 320 of the radiator 300, reducing the kinetic energy loss caused by the impact of the airflow with the first plate 126; the second plate 127 provides sufficient space in the heat dissipation cavity 102 to accommodate the radiator 300, and also helps to improve the convenience of connecting the heat conduction plate 130 to the second mounting port 104; the third plate 128 constrains the airflow about to exit the heat dissipation cavity 102, allowing the airflow to be quickly discharged through the air outlet 114.
[0131] A heat-conducting plate 130 is sealed and installed in the first mounting port 121, and the heat-conducting plate 130 is opposite to the heat sink 300. Specifically, the heat-conducting plate 130 is opposite to the fin portion 320 of the heat sink 300. The heat-conducting plate 130, together with the partition plate 120, serves to separate the mounting cavity 101 and the heat dissipation cavity 102, and the heat-conducting plate 130 also conducts heat from the mounting cavity 101 to the heat dissipation cavity 102.
[0132] In some embodiments, the thermal conductivity of the heat-conducting plate 130 is better than that of the partition plate 120, so as to improve the efficiency of heat conduction from the mounting cavity 101 to the heat dissipation cavity 102.
[0133] The heat-conducting component 310 is sealed to the heat-conducting plate 130 and extends from the heat-conducting plate 130 into the mounting cavity 101.
[0134] The heat-conducting component 310 is sealed to the heat-conducting plate 130 to ensure that the heat dissipation cavity 102 and the mounting cavity 101 are independent of each other and not connected.
[0135] In this embodiment of the present disclosure, by providing a first mounting port 121 on the partition plate 120, a heat-conducting plate 130 is installed. On the one hand, the heat-conducting plate 130 and the partition plate 120 jointly separate the mounting cavity 101 and the heat dissipation cavity 102. On the other hand, the provision of the heat-conducting plate 130 can increase the heat conduction efficiency from the mounting cavity 101 to the heat dissipation cavity 102. The heat-conducting plate 130 is opposite to the heat sink 300, which is conducive to improving the heat dissipation efficiency.
[0136] In actual product assembly, the heat-conducting plate 130 can be used as part of the heat sink 300, and the heat-conducting plate 130 is fixedly connected to the heat-conducting component 310. Therefore, a first mounting port 121 needs to be provided in the partition plate 120 between the mounting cavity 101 and the heat sink 102. This allows the heat-conducting component 310 to be partially located in the mounting cavity 101 for heat conduction, and also allows the heat-conducting plate 130 to separate the mounting cavity 101 and the heat sink 102 while conducting heat.
[0137] The heat-conducting plate 130 is fixedly connected to the heat-conducting component 310, so that the heat-conducting plate 130 supports the heat-conducting component 310, thereby improving the structural strength and stability of the heat-conducting component 310.
[0138] Combination Figure 5 In some embodiments of this disclosure, a first sealing gasket 131 is provided on the peripheral edge of the heat-conducting plate 130 to enhance the sealing between the heat-conducting plate 130 and the partition plate 120, and to prevent airflow in the heat dissipation cavity 102 and any dust, moisture or other impurities that may be carried by it from entering the mounting cavity 101 through the gap.
[0139] Combination Figure 6 The heat-conducting plate 130 includes a plate body portion 132. A first sealing groove 1311 is provided on the periphery of the plate body portion 132. A first sealing gasket 131 is disposed in the first sealing groove 1311. The first sealing groove 1311 is used to constrain the position of the first sealing gasket 131, so as to prevent the first sealing gasket 131 from shifting due to the influence of the side wall of the first mounting port 121 when the heat-conducting plate 130 is installed to the first mounting port 121, thereby affecting the reliability of the seal.
[0140] Continue to refer to Figure 6 The heat-conducting plate 130 may also include a first fixing part 133. The first fixing part 133 may be disposed on the side of the plate body part 132 facing the mounting cavity 101. The first fixing part 133 is fixedly connected to the shell body 111 by screws or bolts, thereby fixing the heat-conducting plate 130 in the first mounting port 121.
[0141] There may be two first fixing parts 133, which are respectively located on both sides of the plate body 132 along the length direction. The first fixing parts 133 are respectively located on both sides of the first mounting port 121 along the length direction, so as to improve the reliability of the fixed connection between the heat conduction plate 130 and the shell body 111, and also reduce the influence of the first fixing parts 133 on the heat conduction of the heat conduction plate 130.
[0142] Reference Figure 7 and Figure 8 In some embodiments of this disclosure, the partition plate 120 has a first side 122 and a second side 123 that are opposite to each other and spaced apart along a first direction, and the first side 122 and the second side 123 are respectively located on both sides of the first mounting opening 121.
[0143] The first direction is the direction in which the air inlet 113 and the air outlet 114 are arranged alternately. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the heat-conducting plate 130. The first direction corresponds to... Figure 7 and Figure 8 The X-axis direction in the middle, the second direction corresponds to Figure 8 In the Z-axis direction, the thickness direction of the heat-conducting plate 130 corresponds to Figure 7 In the Y-axis direction.
[0144] like Figure 8 As shown, along the second direction, from the first end to the second end of the partition plate 120, the spacing between the first side surface 122 and the second side surface 123 increases. The first end of the partition plate 120 is fixedly connected to the outer casing portion 110.
[0145] The first end of the partition plate 120 is connected to the bottom wall of the shell body 111. Thus, the first mounting opening 121 is formed by the first side surface 122, the second side surface 123, and the bottom surface. The bottom surface of the first mounting opening 121 is connected to the first side surface 122 and the second side surface 123, respectively, and the bottom surface of the first mounting opening 121 is aligned with the outer cover 112 of the outer shell portion 110 along the height direction of the shell assembly 100 (corresponding to...). Figure 8 (in the Z-axis direction) relative to each other and spaced apart.
[0146] Combination Figure 8 As shown, the dimension of the first mounting opening 121 along the X-axis increases along the positive direction of the Z-axis, forming a trapezoidal opening shape.
[0147] The heat-conducting plate 130 can be matched and installed in the first mounting port 121. Part of the first sealing gasket 131 between the heat-conducting plate 130 and the partition plate 120 is located between the first side 122 and the heat-conducting plate 130, and part is located between the second side 123 and the heat-conducting plate 130.
[0148] By designing the shape of the first mounting port 121, when the heat-conducting plate 130 is installed into the first mounting port 121, the first sealing gasket 131 between the heat-conducting plate 130 and the partition plate 120 is gradually compressed. On the one hand, this improves the reliability of the seal between the heat-conducting plate 130 and the partition plate 120. On the other hand, it prevents the first sealing gasket 131 from shifting due to friction between the heat-conducting plate 130 and the partition plate 120, thus ensuring the reliability of the position of the first sealing gasket 131 and ensuring the sealing effect, effectively blocking airflow.
[0149] Continue to refer to Figure 6 The heat-conducting plate 130 has a third side and a fourth side that are opposite to each other along a first direction. Specifically, the plate body portion 132 has a third side and a fourth side that are opposite to each other along the first direction. When the heat-conducting plate 130 is installed into the first mounting opening 121, the third side is opposite to and in contact with the first side 122, and the fourth side is opposite to and in contact with the second side 123.
[0150] The third and fourth sides are each provided with a mating groove 134, which extends along the second direction. The mating groove 134 on the third side is opposite to the opening on the fourth side, and the mating groove 134 on the fourth side is opposite to the opening on the third side. A first sealing groove 1311 is provided on the bottom wall of the mating groove 134, and the bottom wall of the mating groove 134 is opposite to the opening.
[0151] Thus, the mating groove 134 of the heat-conducting plate 130 cooperates with the partition plate 120 at the edge of the first mounting port 121. On the one hand, it can provide guidance and cooperation for the heat-conducting plate 130 to be installed into the first mounting port 121, thereby improving the convenience of assembling the heat-conducting plate 130. On the other hand, it makes the contact surface between the heat-conducting plate 130 and the partition plate 120 a bent surface, which helps to improve the sealing performance.
[0152] like Figure 1 As shown, in some embodiments of this disclosure, the partition plate 120, the heat-conducting plate 130, and the shell body 111 partially enclose to form a cavity that opens toward the outer cover 112.
[0153] The shell assembly 100 also includes a cover plate 140, which is sealed to the partition plate 120, the heat-conducting plate 130 and the shell body 111 to form a heat dissipation cavity 102.
[0154] In this embodiment, an open chamber is formed by the partition plate 120, the heat-conducting plate 130, and the shell body 111, opening towards the outer cover 112, facilitating the installation of the fan 200 and the radiator 300. The chamber is then closed by a cover plate 140, forming a closed heat dissipation chamber 102. This makes the heat dissipation chamber 102 independent of the mounting chamber 101, preventing airflow from the heat dissipation chamber 102 from dissipating into the mounting chamber 101.
[0155] The cover plate 140 is bonded to the partition plate 120, the heat-conducting plate 130 and the shell body 111 respectively, so as to achieve a fixed connection and ensure airtightness.
[0156] Alternatively, the cover plate 140 can also achieve a sealed connection by combining mechanical fixing and the setting of a sealing gasket.
[0157] Combination Figure 5 In some embodiments of this disclosure, the cover plate 140 is fixedly connected to at least one of the partition plate 120, the heat-conducting plate 130, and the shell body 111.
[0158] Combination Figure 6 The heat-conducting plate 130 also includes a second fixing part 135, which is located on the side of the plate body facing the mounting cavity 101. The second fixing part 135 is fixedly connected to the cover plate 140 by screws or bolts.
[0159] Combination Figure 7 The partition plate 120 is provided with a third fixing part 124, which is located in the mounting cavity 101. The third fixing part 124 is fixedly connected to the cover plate 140 by screws or bolts.
[0160] Continue to refer to Figure 8A fourth fixing part 115 is provided on the shell side wall forming the heat dissipation cavity 102. The fourth fixing part 115 is located on the inner side of the shell side wall facing the heat dissipation cavity 102. The fourth fixing part 115 is fixedly connected to the cover plate 140 by screws or bolts.
[0161] Reference Figure 5 An annular second sealing gasket 141 is provided between the cover plate 140, the partition plate 120, the heat-conducting plate 130, and the shell body 111. This further enhances the sealing performance of the heat dissipation cavity 102, ensuring that the airflow of the heat dissipation cavity 102 itself flows from the air inlet 113 to the air outlet 114 according to the design path, preventing internal air leakage and reducing heat dissipation efficiency; at the same time, it prevents airflow from entering the mounting cavity 101, ensuring the mutual isolation between the mounting cavity 101 and the heat dissipation cavity 102.
[0162] In this embodiment of the disclosure, combined with Figure 7 An annular second sealing groove 1411 is formed on the partition plate 120, the heat-conducting plate 130 and the shell body 111. The second sealing gasket 141 is installed in the second sealing groove 1411, which helps to improve the position limitation of the second sealing gasket 141 and avoid the second sealing gasket 141 from shifting due to the mechanical fixation of the cover plate 140, thus affecting the reliability of the seal.
[0163] The second sealing groove 1411 provided on the shell body 111 is disposed on the fourth fixing part 115. In this way, the fourth fixing part 115 is flush with the top surface of the outer cover 112, the partition plate 120 is flush with the top surface of the outer cover 112, and the heat conducting plate 130 is flush with the top surface of the outer cover 112, that is, at the same height. This facilitates the setting of the second sealing groove 1411 and helps the installation of the second sealing gasket 141.
[0164] In this embodiment, the second sealing gasket 141 is located inside the fixed position of the cover plate 140. This arrangement ensures that the second sealing gasket 141 is located inside the fasteners such as screws, guaranteeing that the pressure during tightening is applied to the second sealing gasket 141, achieving an effective seal and preventing the fixed connection of the cover plate 140 from affecting the sealing effect of the second sealing gasket 141.
[0165] Continue to refer to Figure 3 In some embodiments of this disclosure, the shell assembly 100 is provided with a second mounting port 104, which is connected to the heat dissipation cavity 102.
[0166] Specifically, a second mounting port 104 is provided on the shell side wall of the outer shell portion 110.
[0167] The housing assembly 100 includes an air inlet grille (not shown) configured to form an air inlet 113. The air inlet grille is removable and covers a second mounting opening 104.
[0168] The air intake grille can be connected to the shell body 111 of the outer casing 110 by screws, and the connection is stable; or, the air intake grille can be snapped onto the shell body 111, and the disassembly and assembly are convenient.
[0169] In this embodiment of the present disclosure, by providing an air inlet grille plate in the second mounting port 104, on the one hand, it can ensure that the heat dissipation cavity 102 is connected to the outside through the air inlet 113 of the air inlet grille plate, and on the other hand, the air inlet grille plate can be used to shield and protect the structure inside the heat dissipation cavity 102.
[0170] Reference Figure 3 The fan 200 is opposite to the second mounting port 104, and the air inlet grille is detachably connected to the housing assembly 100. This allows the air inlet grille to be removed, and the fan 200 to be cleaned and maintained through the second mounting port 104, improving convenience.
[0171] In some embodiments of this disclosure, the fan 200 is detachably mounted to the heat dissipation cavity 102 via the second mounting port 104. This configuration allows the fan 200 to be removed via the second mounting port 104 without disassembling the entire 3D camera when it needs to be replaced or repaired. This simplifies the operation, reduces maintenance costs and complexity.
[0172] The fan 200 is detachably connected to the cavity wall that forms the heat dissipation cavity 102. For example, the fan 200 is detachably connected to the bottom wall of the housing body 111; or, for another example, the fan 200 is detachably connected to the partition plate 120 opposite to the second mounting port 104. Thus, the fixed connection position between the fan 200 and the partition plate 120 is directly opposite the second mounting port 104, which helps to improve the convenience of assembling and disassembling the fan 200.
[0173] Combination Figure 3 The fan 200 is configured to form a mounting part 210, which is offset from the impeller and motor parts of the fan 200; the mounting part 210 is opposite to the second mounting port 104. The mounting part 210 is detachably mounted on the partition plate 120 opposite to the second mounting port 104.
[0174] For example, the mounting part 210 and the partition plate 120 are fixedly connected by screws or bolts, the connection is stable, and the second mounting port 104 makes it easy to install and remove.
[0175] In some embodiments of this disclosure, a first electrical connector is provided inside the heat dissipation cavity 102, and a second electrical connector is provided on the fan 200; the second electrical connector is detachably electrically connected to the first electrical connector.
[0176] For example, the first electrical connector may be disposed on the portion of the partition plate 120 opposite to the second mounting port 104.
[0177] The second electrical connector is electrically connected to the power supply of the 3D camera to power the fan 200. Furthermore, the second electrical connector is electrically connected to the control device of the 3D camera, such as a processor on a circuit board, to control the operating state of the fan 200.
[0178] When the fan 200 is installed in the heat dissipation cavity 102, the first electrical connector and the second electrical connector are electrically connected, thereby supplying power to the fan 200 and transmitting control signals.
[0179] When the fan 200 is removed from the heat dissipation cavity 102, the first electrical connector and the second electrical connector are disconnected.
[0180] The first and second electrical connectors can be male and female connectors that can be electrically connected and plugged in and fixed, or male and female connectors that can be magnetically engaged, etc.
[0181] Therefore, the fan 200 can be electrically connected or disconnected through the first and second electrical connectors, enabling quick plugging and unplugging, further improving the convenience and safety of fan 200 maintenance; and avoiding the inconvenience of fan assembly and disassembly caused by using wire connections.
[0182] In some embodiments, combined with Figure 9 A flexible ejector pin 220 is provided inside the heat dissipation cavity 102, and a mating part 125 is provided on the fan 200; or, a mating part 125 is provided inside the heat dissipation cavity 102, and a flexible ejector pin 220 is provided on the fan 200.
[0183] The elastic ejector pin 220 abuts against the mating part 125 to make the elastic ejector pin 220 and the mating part 125 electrically connected.
[0184] For example, the resilient pin 220 may be a pogo pin, and the mating part 125 may be a conductive contact or pad that mates with it.
[0185] One of the elastic ejector pin 220 and the mating part 125 is a first electrical connector, and the other is a second electrical connector.
[0186] In this embodiment, the fan 200 uses the elastic pin 220 and the mating part 125 to achieve electrical connection and disconnection, which is not only simple and convenient to operate, but also the elastic contact can compensate for installation tolerances, ensure the reliability of the contact, make the structure more compact, and make assembly faster.
[0187] In some embodiments of this disclosure, the housing assembly 100 is provided with at least one drain hole, which communicates with the heat dissipation cavity 102.
[0188] For example, a drainage hole is provided on the bottom wall of the shell body 111 that forms the heat dissipation cavity 102.
[0189] When the 3D camera is in a humid environment or under the action of condensation, liquid may accumulate in the heat dissipation cavity 102. The drainage hole can drain any liquid that may be present, preventing liquid accumulation from causing short circuits, damage to the fan 200, or corrosion of components, thereby improving the protection level and reliability of the equipment.
[0190] By way of example, the 3D camera of this disclosure embodiment can meet the IP65 waterproof rating through the above-described structure and sealing of the heat dissipation cavity 102 and the mounting cavity 101, and the setting of the drainage hole.
[0191] In the above description, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.
Claims
1. A housing structure for a 3D camera, characterized in that, include: A housing assembly, wherein the housing assembly is internally configured to form independent mounting cavities and heat dissipation cavities; The mounting cavity is used to mount the circuit board and optical components of the 3D camera; The shell assembly is also configured to form an air inlet and an air outlet, which are respectively connected to the heat dissipation cavity; A fan and a radiator are provided inside the heat dissipation cavity, and the fan and the radiator are located between the air inlet and the air outlet; the radiator has at least one heat-conducting element, and the heat-conducting element extends from the heat dissipation cavity to the mounting cavity for conducting heat in the mounting cavity to the heat dissipation cavity.
2. The shell structure according to claim 1, characterized in that, The shell assembly includes: an outer shell portion and a partition plate and a heat-conducting plate disposed within the outer shell portion, the partition plate being located between the mounting cavity and the heat dissipation cavity, and the partition plate being provided with a first mounting opening; The heat-conducting plate is sealed and installed at the first mounting port, and the heat-conducting plate is opposite to the heat sink; The heat-conducting component is sealed to the heat-conducting plate and extends from the heat-conducting plate into the mounting cavity.
3. The shell structure according to claim 2, characterized in that, A first sealing gasket is provided on the peripheral edge of the heat-conducting plate.
4. The shell structure according to claim 3, characterized in that, The partition plate has a first side and a second side that are opposite to each other and spaced apart along a first direction, and the first side and the second side are respectively located on both sides of the first mounting opening; Along the second direction, from the first end to the second end of the partition plate, the spacing between the first side and the second side increases; Wherein, the first direction is the direction in which the air inlet and the air outlet are arranged at intervals, and the second direction is perpendicular to the first direction and perpendicular to the thickness direction of the heat-conducting plate; The first end of the partition plate is fixedly connected to the outer shell.
5. The shell structure according to claim 2, characterized in that, The outer casing includes a casing body and an outer cover that is sealed to the casing body; the mounting cavity and the heat dissipation cavity are located within the space formed by the casing body and the outer cover; The partition plate is integrally formed with the shell body.
6. The shell structure according to claim 5, characterized in that, The partition plate, the heat-conducting plate, and part of the shell body enclose a cavity facing the opening of the outer cover; The shell assembly also includes a cover plate, which is sealed to the partition plate, the heat-conducting plate and the shell body to form the heat dissipation cavity.
7. The shell structure according to claim 6, characterized in that, The cover plate is fixedly connected to at least one of the partition plate, the heat-conducting plate, and the shell body, and an annular second sealing gasket is provided between the cover plate and the partition plate, the heat-conducting plate, and the shell body, the second sealing gasket being located inside the fixed position of the cover plate.
8. The shell structure according to any one of claims 1-7, characterized in that, The shell assembly is provided with a second mounting port, which communicates with the heat dissipation cavity; The housing assembly includes an air inlet grille that forms the air inlet, and the air inlet grille is detachable and covers the second mounting opening; The fan is opposite to the second mounting port.
9. The shell structure according to claim 8, characterized in that, The fan is detachably mounted to the heat dissipation cavity through the second mounting port.
10. The shell structure according to claim 9, characterized in that, A first electrical connector is provided inside the heat dissipation cavity, and a second electrical connector is provided on the fan; the second electrical connector is detachably electrically connected to the first electrical connector.
11. The shell structure according to claim 9, characterized in that, The heat dissipation cavity is provided with a mating component, and the fan is provided with an elastic pin. The elastic pin abuts against the mating component to make the elastic pin electrically connected to the mating component.
12. The shell structure according to claim 4, characterized in that, The air outlet includes a first air outlet and a second air outlet. The first air outlet and the air inlet are located on the side of the outer shell that is away from the mounting cavity along a third direction. The second air outlet is located on the side of the outer shell that is away from the air inlet along the first direction. The third direction is parallel to the thickness direction of the heat-conducting plate.
13. The shell structure according to any one of claims 1-7, characterized in that, The heat-conducting component is used to contact the circuit board of the 3D camera within the mounting cavity; The heat-conducting element is provided in multiple forms, wherein at least one of the heat-conducting elements is bent and extended within the mounting cavity.
14. The shell structure according to any one of claims 1-7, characterized in that, The heat dissipation cavity is located on the side of the mounting cavity away from the shooting end of the optical element of the 3D camera.
15. The shell structure according to any one of claims 1-7, characterized in that, The shell assembly is provided with at least one drain hole, which is in communication with the heat dissipation cavity.
16. A 3D camera, characterized in that, include: Circuit board, projection assembly, at least one lens assembly, and housing structure as described in any one of claims 1-15; The circuit board, the projection assembly, and at least one of the lens assemblies are mounted within the mounting cavity of the housing structure.