Touch chip application implementation structure and application

Abstract

The invention discloses a touch chip application implementation structure and application, and belongs to the field of touch chip packaging. The touch control chip application implementation structure comprises a touch control chip which is pasted on a circuit board, and a deformation space is reserved on the periphery of the touch control chip. The deformation space is filled with a soft material or the deformation space is realized by covering the touch chip with a protective cover. When the touch control chip is pressed or slid, the touch control chip has enough space to deform to generate a touch control signal, so that an accurate control effect is realized. The touch chip application implementation structure is suitable for the fields of intelligent rings, intelligent glasses and the like.

Description

Technical Field

[0001] This invention relates to the field of touch chip technology, and in particular to a touch chip application implementation structure and application. Background Technology

[0002] The current structure of smart rings is as follows: Figure 1 As shown: the outer ring is a metal shell, and the arc-shaped FPC (flexible printed circuit board) is attached to the inner ring of the metal shell. The radio frequency chip, Bluetooth chip, battery and other components are covered with hard glue to achieve a sealed and waterproof effect.

[0003] The current requirement is to add a touch chip to the smart ring to enable button and touch functions. If the ring is pressed, the force will be transmitted throughout the ring. Due to the high hardness of the hard plastic, it is difficult to deform and thus cannot achieve precise control. Summary of the Invention

[0004] The purpose of this invention is to provide a touch chip application implementation structure and application to solve the problems in the background art.

[0005] To address the aforementioned technical problems, this invention provides a touch chip application implementation structure and application, including: The touch chip is attached to the circuit board. Furthermore, the touch chip has a pre-reserved deformation space around its periphery, which may be a vacuum or filled with a gas or a soft material.

[0006] In one feasible implementation, the periphery of the touch chip is covered by injection molding, encapsulation, dispensing or welding assembly, and is kept at a distance from the touch chip to avoid contact with it, thereby forming a deformation space around the touch chip.

[0007] In one feasible implementation, the deformation space is achieved by covering the touch chip with a protective cover, which simultaneously covers one or more touch chips.

[0008] In one feasible implementation, the filler in the deformation space covers the touch chip.

[0009] In one feasible implementation, the flexible material simultaneously covers one or more touch chips.

[0010] In one feasible implementation, the soft material includes, but is not limited to, soft rubber, silicone, and foam materials.

[0011] In one feasible implementation, the number of touch chips is one, to achieve the function of press control.

[0012] In one feasible implementation, the number of touch chips is at least two to enable press and slide control functions.

[0013] This invention also provides a touch chip application implementation structure for use in smart rings and smart glasses.

[0014] This invention provides a touch chip application implementation structure and application, including a touch chip mounted on a circuit board, with a pre-reserved deformation space around the touch chip. This deformation space can be a vacuum or filled with a gas or a soft material. When the touch chip is pressed or slid, it has sufficient space to deform and generate a touch signal, achieving precise control. This touch chip application implementation structure is applicable to fields such as smart rings and smart glasses. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural diagram of an existing smart ring.

[0017] Figure 2 This is a schematic diagram of the first implementation of the touch chip application structure provided by the present invention.

[0018] Figure 3 This is a schematic diagram of the second implementation of the touch chip application structure provided by the present invention.

[0019] Figure 4 This is a schematic diagram of the third implementation of the touch chip application structure provided by the present invention.

[0020] Figure 5 This is a schematic diagram of the fourth implementation of the touch chip application structure provided by the present invention.

[0021] Figure 6 This is a schematic diagram of the fifth implementation of the touch chip application structure provided by the present invention. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] The serial numbers assigned to components in this application, such as "first" and "second," are merely for distinguishing the described objects and have no sequential or technical meaning. The terms "connection" and "linkage," unless otherwise specified, are not limited to physical or mechanical connections and can include electrical communication connections, whether direct or indirect. In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "middle," "between," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0024] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion.

[0025] This invention provides a touch chip application implementation structure, the structure of which is as follows: Figure 2 As shown, the device includes a touch chip 1, which is attached to a circuit board 2, preferably a flexible circuit board. The touch chip 1 is assembled by injection molding, encapsulation, dispensing, or welding, with a covering material 4 covering the touch chip 2. The covering material 4 is controlled to not contact the touch chip 2, maintaining a certain distance from it, and a deformation space 5 is left around the touch chip 1. When the touch chip 1 is pressed, it deforms to generate a signal.

[0026] Furthermore, such as Figure 3As shown, the deformation space 5 can be a vacuum or filled with a material, which can be a gas or a soft material 31. The soft material 31 covers the touch chip 1 and has less rigidity than the covering material 4. When the touch chip 1 is pressed, the soft material 31 will be squeezed accordingly, without hindering the deformation of the touch chip 1 to generate a signal. The implementation method is as follows: after the touch chip 1 is pasted on the circuit board 2, soft glue is first applied to cover the touch chip 1, and then the covering material 4 is used to cover the soft glue-covered touch chip 1, RF chip, Bluetooth chip, battery and other components.

[0027] like Figure 4 As shown, the deformation space 5 can also be achieved by covering the touch chip 1 with a protective cover 32. The protective cover 32 is soldered onto the circuit board 2. The implementation method is as follows: after the touch chip 1 is pasted onto the circuit board 2, the protective cover 32 is first soldered onto the circuit board 2 and covers the touch chip 1, and then the protective cover 32, the radio frequency chip, the Bluetooth chip, the battery, and other components are covered with a covering material 4.

[0028] Of course, it is also possible to Figure 3 and Figure 4 The solution combines the following steps: after attaching the touch chip 1 to the circuit board 2, first apply soft glue to cover the touch chip 1, then solder the protective cover 32 to the circuit board 2 and cover the touch chip 1 together with the soft glue, and then use the covering material 4 to cover it.

[0029] Furthermore, the number of touch chips can be one, used only to generate press control signals; or the number of touch chips can be two or more, capable of generating both press control signals and swipe control signals.

[0030] When there is a single touch chip, only one corresponding deformation space is left around the perimeter of that touch chip; when there are multiple touch chips, each touch chip has its own corresponding deformation space around its perimeter, such as... Figures 2-4 As shown; or each deformation space contains any number of touch chips, such as Figure 5 and Figure 6 As shown.

[0031] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A touch chip application implementation structure, characterized in that, include: The touch chip is attached to the circuit board. Furthermore, the touch chip has a pre-reserved deformation space around its periphery, which may be a vacuum or filled with a gas or a soft material.

2. The touch chip application implementation structure as described in claim 1, characterized in that, The touch chip is surrounded by a coating through injection molding, encapsulation, dispensing, or welding assembly, and the coating is kept at a distance from the touch chip and does not come into contact with it, thus forming a deformation space around the touch chip.

3. The touch chip application implementation structure as described in claim 1, characterized in that, The deformation space is achieved by covering the touch chip with a protective cover, which covers one or more touch chips at the same time.

4. The touch chip application implementation structure as described in claim 2 or 3, characterized in that, The touch chip is filled in the deformation space.

5. The touch chip application implementation structure as described in claim 1, characterized in that, The flexible material simultaneously encapsulates one or more touch chips.

6. The touch chip application implementation structure as described in claim 1, characterized in that, The soft materials include, but are not limited to, soft rubber, silicone, and foam materials.

7. The touch chip application implementation structure as described in claim 1, characterized in that, The number of touch chips is one, in order to realize the function of press control.

8. The touch chip application implementation structure as described in claim 1, characterized in that, The number of touch chips is at least two, in order to enable the functions of pressing and sliding control.

9. A touch chip application implementation structure based on any one of claims 1-8, characterized in that, The touch chip application structure is used in smart rings and smart glasses.

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