Display device

By introducing anti-sagging components and wing plate structural design into the display device, and combining plate structure of metal and non-metal materials, the sagging problem of foldable display devices during folding is solved, achieving stable folding and unfolding, and supporting multiple input methods.

CN121789564APending Publication Date: 2026-04-03SAMSUNG DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2021-08-06
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing foldable display devices are prone to sagging or deformation during the folding process, which affects the display effect and user experience.

Method used

The structure includes a display panel, a digitizer, an anti-sagging component, and a wing plate. By setting the anti-sagging component and wing plate below the display panel, and combining a plate structure of metal and non-metal materials, the display device can be stably folded and unfolded.

Benefits of technology

It effectively prevents the display panel from sagging and deforming during the folding process, improving the stability of the display device and the user experience, and supports multiple input methods such as pen input.

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Abstract

The invention relates to a display device. The display device includes a display area and a folding area, the display device including: a display panel; the digitizer is arranged below the display panel; an anti-sag member disposed in a portion overlapping the folding area below the display panel; and a lower cover disposed below the sag prevention member.
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Description

[0001] This application is a divisional application of application number 202110901642.9, filed on August 6, 2021, entitled "Display Device".

[0002] Cross-reference of related applications

[0003] This application claims priority and benefit to Korean Patent Application No. 10-2020-0113218, filed on September 4, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0004] One or more embodiments relate to display devices, and to foldable display devices. Background Technology

[0005] Mobile electronic devices are widely used. Examples of such mobile electronic devices include compact devices like mobile phones and tablet PCs.

[0006] These mobile electronic devices may include display devices that support various functions and provide users with visual information such as images or pictures. Recently, as the size of the components used to drive the display device has decreased, the proportion of display devices in electronic devices has gradually increased, and display devices with structures that can be folded at an angle in a flat state have been developed.

[0007] It will be understood that the background section of this technical section is partly intended to provide useful context for understanding the technology. However, the background section may also include ideas, concepts, or knowledge prior to the relevant valid application date of the subject matter disclosed herein that were not known or understood by one of ordinary skill in the art. Summary of the Invention

[0008] One or more embodiments include a display device that includes a digitizer for inputting external signals to provide a user with various input methods, such as using a pen, within the spirit and scope of this disclosure. However, these objectives are merely examples, and the scope of this disclosure is not limited thereto.

[0009] Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of this disclosure.

[0010] According to one or more embodiments, the display device may include a display area and a folding area, the display device including: a display panel; a digitizer disposed below the display panel; an anti-sagging member disposed in the portion of the display panel that overlaps with the folding area; and a lower cover disposed below the anti-sagging member.

[0011] The display area may include a first display area and a second display area spaced apart from each other, the folded area may be disposed between the first display area and the second display area, and the digitizer may include: a first digitizer overlapping the first display area; a second digitizer overlapping the second display area; and a third digitizer overlapping the folded area.

[0012] The first digitizer and the second digitizer can be spaced apart from each other.

[0013] The third digitizer can be placed between the first digitizer and the second digitizer.

[0014] The third digitizer can be spaced apart from each of the first and second digitizers.

[0015] The third digitizer can be installed above the anti-sagging component.

[0016] The display device may also include a plate disposed between the display panel and the digitizer.

[0017] The board may include: a first portion that overlaps with a first display area and a second display area; and a second portion that overlaps with a folded area.

[0018] The first part of the plate may include a non-metallic material, and the second part of the plate may include a metallic material.

[0019] The display device may also include a folding structure disposed in the second part of the plate.

[0020] The display device may also include an electromagnetic wave absorbing layer disposed below the digitizer.

[0021] The electromagnetic wave absorbing layer may include: a first electromagnetic wave absorbing layer that overlaps with the first display area; a second electromagnetic wave absorbing layer that overlaps with the second display area; and a third electromagnetic wave absorbing layer that overlaps with the folded area.

[0022] The first electromagnetic wave absorbing layer, the second electromagnetic wave absorbing layer, and the third electromagnetic wave absorbing layer can be spaced apart from each other.

[0023] The third electromagnetic wave absorbing layer can be placed between the anti-sagging component and the third digitizer.

[0024] The display device may also include a wing plate disposed below the electromagnetic wave absorbing layer.

[0025] The wing panel may include: a first wing panel that overlaps with a first display area; and a second wing panel that overlaps with a second display area.

[0026] The first and second wing plates can be spaced apart from each other.

[0027] The anti-sagging component can be installed between the first wing plate and the second wing plate.

[0028] The display device may also include an optical functional layer disposed above the display panel.

[0029] According to one or more embodiments, a display device may include a display area and a folding area. The display device includes: a display panel; a plate disposed below the display panel and including a first portion and a second portion, the first portion overlapping the display area and the second portion overlapping the folding area; a digitizer disposed below the plate; and an anti-sagging member disposed below the plate and overlapping the folding area.

[0030] The first part and the second part of the plate may be made of different materials.

[0031] The display area may include a first display area and a second display area spaced apart from each other, the folded area may be disposed between the first display area and the second display area, and the digitizer may include: a first digitizer overlapping the first display area; a second digitizer overlapping the second display area; and a third digitizer overlapping the folded area.

[0032] The first and second digitizers may overlap with the first portion of the board, and the third digitizer may overlap with the second portion of the board.

[0033] The third digitizer can be installed above the anti-sagging component.

[0034] The display device may further include a wing plate disposed below the digitizer, wherein the wing plate may include: a first wing plate overlapping the first display area; and a second wing plate overlapping the second display area.

[0035] The first and second wing plates can be spaced apart from each other.

[0036] The anti-sagging component can be installed between the first wing plate and the second wing plate.

[0037] The display device may further include a pad layer disposed above the wing plate, wherein the pad layer may include: a first pad layer overlapping the first display area; and a second pad layer overlapping the second display area.

[0038] The first and second cushion layers can be spaced apart from each other.

[0039] Anti-sagging components can be installed between the first and second cushion layers.

[0040] Other aspects, features, and advantages, in addition to those described above, will become apparent from the accompanying drawings, the appended claims, and the detailed description of this disclosure. Attached Figure Description

[0041] The above and other aspects, features and advantages of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view of the display device according to the embodiment; Figure 2 It is along Figure 1 A schematic cross-sectional view of the display device taken by line I-I'; Figure 3 This is a schematic plan view of a plate included in a display device according to an embodiment; Figure 4 This is a schematic plan view of a digitizer included in a display device according to an embodiment; Figure 5 This is a schematic cross-sectional view illustrating a digitizer included in a display device according to an embodiment; Figure 6 The positions of the wing plate and anti-sagging member are schematically shown when the device is folded within the display device according to the embodiment. Figure 7 The positions of the wing plate and anti-sagging member are schematically shown when the display device according to the embodiment is deployed; Figure 8 This is a schematic cross-sectional view of the display device according to an embodiment; Figure 9 This is a schematic plan view of a display panel included in a display device according to an embodiment; Figure 10 It is along Figure 9 A schematic cross-sectional view of the display panel taken by line II-II'; and Figure 11 This is a schematic cross-sectional view of a display device according to an embodiment. Detailed Implementation

[0042] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals denote the same elements throughout the text. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to explain the described aspects. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or variations thereof.

[0043] Because this disclosure can have various modifications and several embodiments, embodiments are shown in the accompanying drawings and will be described in detail thereon. Effects, features, and methods for achieving said effects and features will be described with reference to the embodiments described in detail below in conjunction with the accompanying drawings.

[0044] While terms such as "first" and "second" can be used to describe various components, these components should not be limited to these terms. These terms are used only to distinguish one component from another.

[0045] A singular expression may encompass a plural expression unless it has a distinctly different meaning in the context.

[0046] In this specification, it will be understood that terms such as “comprising” or “including” or “having” and variations thereof are intended to indicate the presence of a feature or component disclosed in the specification and are not intended to exclude the possibility of adding one or more other features or components.

[0047] It will be understood that when a layer, region, or component is referred to as being "formed on," "set on," "arranged on," "located on," or "provided on" another layer, region, or component, it may be formed on, set on, arranged on, located on, or provided on said other layer, region, or component, either directly or indirectly. That is, for example, intermediate layers, regions, or components may exist.

[0048] For ease of explanation, the dimensions of the components in the accompanying drawings may be exaggerated. For example, since the dimensions and thicknesses of the components in the accompanying drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0049] In the following embodiments, the description of a line "extending in a first direction or a second direction" includes not only lines extending in a linear form, but also lines extending in a generally zigzag or generally curved shape in the first or second direction.

[0050] In the following embodiments, the expression "in a plan view" means viewing the object from above, and the expression "in a schematic cross-section" means viewing the cross-section of a vertically cut object from the side.

[0051] For ease of description, the spatial relative terms “below,” “under,” “lower,” “above,” “upper,” etc., may be used herein to describe the relationship between one element or component and another, as shown in the accompanying drawings. It will be understood that the spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the drawings. For example, in the case where the device shown in the drawings is flipped, a device located “below” or “under” another device may be placed “above” the other device. Therefore, the illustrative term “below” may include both a lower position and an upper position. The device may also be oriented in other directions, and therefore the spatial relative terms may be interpreted differently depending on the orientation.

[0052] Additionally, the terms "overlapping" or "overlapping" mean that the first object may be above, below, or to the side of the second object, and that the second object may be above, below, or to the side of the first object. Furthermore, the term "overlapping" may include layer, stack, face, or facing, extending over, covering, or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art. The terms "face" and "facing" mean that the first element may be directly or indirectly opposite the second element. In the case where a third element is located between the first and second elements, the first and second elements may be understood as indirectly opposite each other, although still facing each other. When an element is described as "not overlapping" or "will not overlap" with another element, this may include elements spaced apart from each other, offset from each other, or arranged side by side, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art.

[0053] The embodiments will now be described in more detail with reference to the accompanying drawings. Unless otherwise specified by the figure numbers, the same or corresponding components are represented by the same reference numerals.

[0054] As used herein, “about” or “approximately” includes the value as well as the average of the value within an acceptable range of deviations from the particular value, as determined by a person of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value.

[0055] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0056] Figure 1 This is a perspective view of the display device according to the embodiment, and Figure 2 It is along Figure 1 A schematic cross-sectional view of the display device taken by line I-I'.

[0057] Reference Figure 1 and Figure 2 The display device 1 is a device for displaying one or more moving images or one or more still images, and can be used not only as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, personal digital assistants (PDAs), e-books, portable multimedia players (PMPs), navigation devices, or ultra-mobile PCs, but also as a display screen for various other products within the spirit and scope of this disclosure such as TVs, laptops, monitors, billboards, Internet of Things (IoT), etc.

[0058] Display device 1 can be used in wearable devices such as smartwatches, smartwatch phones, glasses-type displays, or head-mounted displays (HMDs). For example, display device 1 can be used as a display in a vehicle's instrument panel, a central information display (CID) arranged or mounted on the center dashboard or instrument cluster of a vehicle, a side mirror display replacing the vehicle's side mirrors, or a display arranged or mounted on the rear surface of the front seats to provide entertainment content to passengers in the rear seats of the vehicle. Figure 1 and Figure 2 For ease of description, a display device 1 used as a smartphone is illustrated by example.

[0059] The display device 1 may include a display area DA and a peripheral area DPA, wherein the peripheral area DPA is outside or adjacent to the display area DA. The display device 1 may include a folding area FA, and the display area DA may include a first display area DA1 and a second display area DA2, which may be spaced apart from each other, with the folding area FA located between them. The peripheral area DPA may be a non-display area type in which display elements may not be arranged or disposed.

[0060] In this embodiment, the display area DA and the folding area FA can display images individually or jointly. Specifically, pixels P can be arranged or disposed in the display area DA and the folding area FA. Therefore, the display device 1 can provide an image by using pixels P arranged or disposed in the display area DA and the folding area FA.

[0061] In this specification, "above" or "in the upper part" refers to the +Z direction relative to the display panel 10, and "below" or "in the lower part" refers to the -Z direction relative to the display panel 10.

[0062] In addition, "left", "right", "up", and "down" indicate the directions for viewing the display panel 10 from a flat surface. For example, "left" indicates the -X direction, "right" indicates the +X direction, "up" indicates the +Y direction, and "down" indicates the -Y direction.

[0063] Display device 1 may have a substantially planar rectangular shape. For example, such as Figure 1 As shown, the display device 1 may have a substantially planar rectangular shape, having a short side in a first direction (X direction) and a long side in a second direction (Y direction). The angle at the point where the short side in the first direction (X direction) and the long side in the second direction (Y direction) meet may be rounded to have a certain or predetermined curvature, or it may be a right angle. The substantially planar shape of the display device 1 is not limited to a substantially rectangular shape, and may also be other polygonal, elliptical, or amorphous shapes.

[0064] The display device 1 described above can have various shapes. In one embodiment, the display device 1 can have an invariable shape. In another embodiment, the display device 1 can have a shape in which at least a portion thereof is hinged. In this case, the display device 1 can have an inwardly folded shape in which the display areas DA of the display panel 10 can face each other when the display device 1 is hinged, or it can have an outwardly folded shape in which the display areas DA of the display panel 10 are exposed to the outside when the display device 1 is hinged. Hereinafter, for ease of description, the description will focus on the display device 1 having an inwardly folded shape.

[0065] In the above case, the display device 1 can be hinged relative to the folding axis FAX. When the display device 1 is hinged relative to the folding axis FAX, the size of the display area DA can be reduced, and when the display device 1 is fully unfolded, since the display area DA displays the image while forming a flat surface, a large screen can be realized.

[0066] Display panel 10 may be a light-emitting display panel that includes light-emitting elements. For example, display panel 10 may be an organic light-emitting display panel that uses organic light-emitting diodes (OLEDs) including organic emission layers, a micro-LED display panel that uses micro-LEDs, a quantum dot light-emitting display panel that uses quantum dot LEDs including quantum dot emission layers, or an inorganic light-emitting display panel that uses inorganic light-emitting elements that include inorganic semiconductors.

[0067] The display panel 10 can be a rigid display panel, which is rigid and therefore not easily bent, or it can be a flexible display panel, which is flexible and easily bent, folded, or rolled up. For example, the display panel 10 can be a foldable display panel, a curved display panel with a substantially curved display surface, a bent display panel with a substantially curved area in addition to the display surface, a rollable or unfoldable rollable display panel, and a retractable display panel.

[0068] Display panel 10 may be a transparent display panel, which is transparent so that objects or backgrounds on the lower surface of display panel 10 can be viewed from the upper surface of display panel 10. Alternatively, display panel 10 may be a reflective display panel capable of reflecting objects or backgrounds on the upper surface of display panel 10.

[0069] The lower cover 90 may be disposed or positioned below the display panel 10. The lower cover 90 may form the appearance of the display device 1. The lower cover 90 may be made of plastic, metal, or both plastic and metal.

[0070] A panel protection member PB may be arranged or disposed below the display panel 10. The panel protection member PB may be attached below the display panel 10 to support and protect the display panel 10. The panel protection member PB may include polyethylene terephthalate (PET) or polyimide (PI).

[0071] In one embodiment, the panel protection member PB can be attached to the underside of the display panel 10 via a first adhesive layer 21. The first adhesive layer 21 can be a pressure-sensitive adhesive (PSA).

[0072] Figure 3 This is a schematic plan view of a plate included in a display device according to an embodiment.

[0073] Reference Figure 2 and Figure 3 The panel 30 may be arranged or disposed below the panel protection member PB. The panel 30 may include a first portion 30a corresponding to the first display area DA1 and the second display area DA2 and a second portion 30b corresponding to the folding area FA. In an embodiment, the first portion 30a of the panel 30 may at least partially overlap with the first display area DA1 and the second display area DA2, and the second portion 30b of the panel 30 may at least partially overlap with the folding area FA.

[0074] As will be described later, the digitizer 40 may be arranged or disposed below the plate 30. The digitizer 40 may be attached to the underside of the plate 30 via a third adhesive layer 24. The third adhesive layer 24 may be a PSA. In embodiments, the third adhesive layer 24 may be arranged or disposed not only in the portion of the plate 30 to which the digitizer 40 may be attached, corresponding to the first portion 30a, but also in the portion corresponding to the folding area FA. For example, the third adhesive layer 24 may be formed as a single body corresponding to the display area DA and the folding area FA. Thus, it can also be seen that the first portion 30a and the second portion 30b of the plate 30 may be formed or disposed on the third adhesive layer 24.

[0075] In embodiments, the first portion 30a and the second portion 30b of the plate 30 may comprise different materials. The first portion 30a of the plate 30 may comprise a non-metallic material. For example, within the spirit and scope of this disclosure, the first portion 30a of the plate 30 may comprise glass, polymer resin, etc. Because the first portion 30a of the plate 30 may comprise a non-metallic material, input signals, etc., can be input precisely.

[0076] In one embodiment, the second portion 30b of the plate 30 may correspond to the folded area FA and include a metallic material.

[0077] The second portion 30b of the plate 30 may be arranged or configured to correspond to (overlap with) the folding area FA, and therefore, the second portion 30b of the plate 30 may be a foldable portion when the display device 1 is folded. Since the second portion 30b of the plate 30 may include a metallic material, the second portion 30b of the plate 30 may be easily folded.

[0078] In one embodiment, the second portion 30b of the plate 30 may include a folding structure. The folding structure may include portions 30c for arranging or setting metal material and openings 30d between portions 30c. Because the folding structure included in the second portion 30b of the plate 30 includes portions 30c for arranging or setting metal material and openings 30d between portions 30c for arranging or setting metal material, the second portion 30b of the plate 30 can be easily folded.

[0079] In embodiments, within the spirit and scope of this disclosure, the folded structure included in the second part 30b of the plate 30 may have a substantially non-uniform structure, rotatably connected links, etc.

[0080] In one embodiment, the panel 30 may be attached to or disposed beneath the panel protection member PB via the second adhesive layer 23. The second adhesive layer 23 may be a PSA.

[0081] Figure 4This is a schematic plan view of a digitizer included in a display device according to an embodiment, and Figure 5 This is a schematic cross-sectional view illustrating a digitizer included in a display device according to an embodiment.

[0082] Reference Figure 2 , Figure 4 and Figure 5 The digitizer 40 may be arranged or disposed below the plate 30. The digitizer 40 may include a first digitizer 40a corresponding to the first display area DA1, a second digitizer 40b corresponding to the second display area DA2, and a third digitizer 40c corresponding to the folded area FA.

[0083] The first digitizer 40a may at least partially overlap with the first display area DA1, the second digitizer 40b may at least partially overlap with the second display area DA2, and the third digitizer 40c may at least partially overlap with the folded area FA.

[0084] The first digitizer 40a may be arranged or disposed below the plate 30 to correspond to (overlap with) the first display area DA1, the second digitizer 40b may be arranged or disposed below the plate 30 to correspond to (overlap with) the second display area DA2, and the third digitizer 40c may be arranged or disposed below the plate 30 to correspond to (overlap with) the folded area FA. The first digitizer 40a and the second digitizer 40b may be arranged or disposed below the first portion 30a of the plate 30, and the third digitizer 40c may be arranged or disposed below the second portion 30b of the plate 30.

[0085] In one embodiment, the first digitizer 40a and the second digitizer 40b may be spaced apart from each other by a certain or predetermined distance, and the third digitizer 40c may be arranged (positioned or set) between the first digitizer 40a and the second digitizer 40b. The third digitizer 40c may be spaced apart from each of the first digitizer 40a and the second digitizer 40b by a certain or predetermined distance.

[0086] In one embodiment, the first digitizer 40a and the second digitizer 40b may be formed as a single body, and an opening or hole may be defined or formed in the first digitizer 40a and the second digitizer 40b, which may be formed as a single body. The third digitizer 40c may be arranged or disposed in the opening or hole defined or formed in the first digitizer 40a and the second digitizer 40b.

[0087] As described later, a third digitizer 40c may be arranged or disposed above the anti-sagging member 80 included in the folded region FA. Since the third digitizer 40c is spaced apart from the first digitizer 40a and the second digitizer 40b, and is arranged or disposed above the anti-sagging member 80 in the folded region FA, digitizers (e.g., the third digitizer 40c) may also be arranged or disposed in the folded region FA, and thus, various input methods using a pen, etc., can be provided to the user. The anti-sagging member 80 may also be referred to as an anti-deformation member or an anti-distortion member.

[0088] In one embodiment, the thickness of the first digitizer 40a may be different from the thickness of the third digitizer 40c. In another embodiment, the thickness of the first digitizer 40a may be equal to the thickness of the third digitizer 40c.

[0089] The digitizer 40 may include a first layer 41, a first pattern layer 43, a second layer 44, a second pattern layer 45, and a third layer 47. In one embodiment, the first pattern layer 43 and the second pattern layer 45 may be arranged or disposed on different surfaces of the second layer 44. In another embodiment, the first pattern layer 43 and the second pattern layer 45 may be stacked on top of each other. In this case, the first pattern layer 43 and the second pattern layer 45 may be stacked on top of each other in different layers. Hereinafter, for ease of description, the case where the first pattern layer 43 and the second pattern layer 45 of the digitizer 40 are arranged or disposed on different surfaces of the second layer 44 will be described.

[0090] A first pattern layer 43 may be disposed or located on the lower surface of the second layer 44 (below or beneath the second layer 44), and a second pattern layer 45 may be disposed or located on the upper surface of the second layer 44 (on the second layer 44). The first pattern layer 43 may directly contact the lower surface of the second layer 44, and the second pattern layer 45 may directly contact the upper surface of the second layer 44. The first pattern layer 43 and the second pattern layer 45 may be formed by forming a pattern layer on each of the lower and upper surfaces of the second layer 44, leaving a portion of the pattern layer and removing another portion of the pattern layer.

[0091] The first pattern layer 43 and the second pattern layer 45 may be in the form of a loop coil. When a stylus touches or hovers over the display device 1, an induced current can be induced in the first pattern layer 43 and the second pattern layer 45, and therefore, the first pattern layer 43 and the second pattern layer 45 can be used to detect the position of the stylus. Here, the first pattern layer 43 and the second pattern layer 45 may be arranged or positioned in different directions from each other. For example, if the second pattern layer 45 is arranged or positioned in one of the first direction (X direction) and the second direction (Y direction), the first pattern layer 43 may be arranged or positioned in the other of the first direction (X direction) and the second direction (Y direction). For example, if the second pattern layer 45 is arranged or positioned in the first direction (X direction), the first pattern layer 43 may be arranged or positioned in the second direction (Y direction), and if the second pattern layer 45 is arranged or positioned in the second direction (Y direction), the first pattern layer 43 may be arranged or positioned in the first direction (X direction). In this case, the first pattern layer 43 and the second pattern layer 45 may be arranged or positioned so that they intersect or cross each other.

[0092] The first layer 41 may be arranged or disposed below the first pattern layer 43, and the third layer 47 may be arranged or disposed above the second pattern layer 45. Since the first layer 41 and the third layer 47 respectively shield the first pattern layer 43 and the second pattern layer 45, the first pattern layer 43 and the second pattern layer 45 are prevented from being exposed to external moisture or oxygen and their oxidation.

[0093] In one embodiment, the first layer 41 and the third layer 47 may comprise PI resin. In another embodiment, the first layer 41 and the third layer 47 may comprise PI resin and a light-absorbing material, such as at least one of black pigment, black dye, and black filler.

[0094] A fourth adhesive layer 42 may be disposed between the first layer 41 and the first pattern layer 43. In an embodiment, the fourth adhesive layer 42 may be formed as a single body with the first layer 41. The fourth adhesive layer 42 may be a PSA (Polyester Substrate Alternating Current).

[0095] A fifth adhesive layer 46 may be disposed between the third layer 47 and the second patterned layer 45. In an embodiment, the fifth adhesive layer 46 may be formed as a single body with the third layer 47. The fifth adhesive layer 46 may be a PSA (Polyester Substrate Alternating Current).

[0096] In this embodiment, the first layer 41 and the third layer 47 may comprise materials that are the same as or similar to those of the second layer 44. For example, the second layer 44 may comprise PI resin.

[0097] Return to reference Figure 2The electromagnetic wave absorbing layer 50 may be arranged or disposed below or beneath the digitizer 40. The electromagnetic wave absorbing layer 50 may include a first electromagnetic wave absorbing layer 50a corresponding to the first display area DA1, a second electromagnetic wave absorbing layer 50b corresponding to the second display area DA2, and a third electromagnetic wave absorbing layer 50c corresponding to the folded area FA.

[0098] The first electromagnetic wave absorbing layer 50a may at least partially overlap with the first display area DA1, the second electromagnetic wave absorbing layer 50b may at least partially overlap with the second display area DA2, and the third electromagnetic wave absorbing layer 50c may at least partially overlap with the folded area FA.

[0099] The first electromagnetic wave absorbing layer 50a may be arranged or disposed below the first digitizer 40a to correspond to (overlap with) the first display area DA1, the second electromagnetic wave absorbing layer 50b may be arranged or disposed below the second digitizer 40b to correspond to (overlap with) the second display area DA2, and the third electromagnetic wave absorbing layer 50c may be arranged or disposed below the third digitizer 40c to correspond to (overlap with) the folded area FA.

[0100] In this embodiment, the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b may be spaced apart from each other at a certain or predetermined distance. A third electromagnetic wave absorbing layer 50c may be arranged (positioned or disposed) between the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b. The third electromagnetic wave absorbing layer 50c may be spaced apart from each of the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b at a certain or predetermined distance.

[0101] In one embodiment, the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b may be formed as a single body, and an opening or hole may be defined or formed in the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b, which may be formed as a single body. In this case, the third electromagnetic wave absorbing layer 50c may be arranged or disposed in the opening or hole defined or formed in the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b.

[0102] The electromagnetic wave absorbing layer 50 may include magnetic metal powder (MMP). Since the electromagnetic wave absorbing layer 50 may include MMP, it can absorb electromagnetic waves incident on or emitted from the digitizer 40.

[0103] In the implementation, the first electromagnetic wave absorbing layer 50a, the second electromagnetic wave absorbing layer 50b, and the third electromagnetic wave absorbing layer 50c can be arranged or configured to correspond to (overlap with) the first digitizer 40a, the second digitizer 40b, and the third digitizer 40c, respectively. Therefore, the first electromagnetic wave absorbing layer 50a, the second electromagnetic wave absorbing layer 50b, and the third electromagnetic wave absorbing layer 50c can absorb electromagnetic waves incident on the first digitizer 40a, the second digitizer 40b, and the third digitizer 40c, or electromagnetic waves emitted from the first digitizer 40a, the second digitizer 40b, and the third digitizer 40c, respectively.

[0104] The padding layer 60 may be arranged or disposed below or beneath the electromagnetic wave absorbing layer 50. The padding layer 60 may include a first padding layer 60a arranged or disposed corresponding to the first display area DA1 and a second padding layer 60b arranged or disposed corresponding to the second display area DA2. The first padding layer 60a and the second padding layer 60b may be spaced apart from each other at a certain or predetermined distance. An anti-sagging member 80 may be disposed between the first padding layer 60a and the second padding layer 60b.

[0105] In an embodiment, the first pad 60a and the second pad 60b may be formed as a single body, and openings or holes may be defined or formed in the first pad 60a and the second pad 60b.

[0106] The padding layer 60 can absorb impacts from the outside to protect the display panel 10.

[0107] The wing plate 70 may be arranged or disposed below the pad 60. The wing plate 70 may include a first wing plate 70a arranged or disposed corresponding to the first display area DA1 and a second wing plate 70b arranged or disposed corresponding to the second display area DA2. The first wing plate 70a may be arranged or disposed below the first pad 60a, and the second wing plate 70b may be arranged or disposed below the second pad 60b. The adhesive layer 25 may be disposed between the first pad 60a and the first wing plate 70a, and between the second pad 60b and the second wing plate 70b. The adhesive layer 25 may not completely cover the first pad 60a and the first wing plate 70a, the second pad 60b, and the second wing plate 70b, or may not completely overlap with the first pad 60a and the first wing plate 70a, the second pad 60b, and the second wing plate 70b.

[0108] In an embodiment, the first wing plate 70a and the second wing plate 70b may be spaced apart from each other at a certain or predetermined distance.

[0109] In the embodiment, the anti-sagging member 80 may be arranged or disposed between the first digitizer 40a and the second digitizer 40b, which may be spaced apart from each other at a certain or predetermined distance; between the first electromagnetic wave absorbing layer 50a and the second electromagnetic wave absorbing layer 50b, which may be spaced apart from each other at a certain or predetermined distance; between the first pad 60a and the second pad 60b, which may be spaced apart from each other at a certain or predetermined distance; and disposed between the first wing plate 70a and the second wing plate 70b, which may be spaced apart from each other at a certain or predetermined distance.

[0110] In one embodiment, the anti-sagging member 80 may be arranged or configured to correspond to the folding area FA. Since the anti-sagging member 80 may be arranged or configured to correspond to the folding area FA, sagging or deformation of components arranged or configured in the folding area FA (e.g., display panel 10, plate 30, etc.) in the -Z direction can be prevented or minimized.

[0111] In this embodiment, the third electromagnetic wave absorbing layer 50c and the third digitizer 40c may be arranged or disposed on the anti-sagging member 80. Since the third digitizer 40c may be arranged or disposed above the anti-sagging member 80 in the folded area FA, the digitizer (e.g., the third digitizer 40c) may be arranged or disposed below the portion of the display panel 10 that corresponds to (overlaps with) the folded area FA, and thus, various input methods such as using a pen may be provided to the user.

[0112] In one embodiment, the lower cover 90 may be arranged or disposed below the anti-sagging member 80. The lower cover 90 may form the appearance of the lower surface of the display device 1. The lower cover 90 may cover the side surface of the display device 1 or overlap with the side surface of the display device 1.

[0113] Figure 6 The positions of the wing plate and anti-sagging member are schematically shown when the display device is folded according to the embodiment. Figure 7 The positions of the wing plate and anti-sagging member are schematically shown when the display device according to the embodiment is deployed.

[0114] Reference Figure 2 , Figure 6 and Figure 7 In this embodiment, when the display device 1 is folded inward in the +Z direction, the portion of the wing plate 70 adjacent to the folding area FA and the anti-sagging member 80 can move in the -Z direction. Specifically, when the display device 1 is folded inward in the +Z direction, the right portion of the first wing plate 70a adjacent to the folding area FA and the left portion of the second wing plate 70b adjacent to the folding area FA can move in the -Z direction, and the anti-sagging member 80 between the first wing plate 70a and the second wing plate 70b can move in the -Z direction.

[0115] In one embodiment, when the display device 1 is folded inward in the +Z direction, instead of the wing plate 70 and the anti-sagging member 80 moving in the -Z direction, the display panel 10 can move in the +Z direction.

[0116] In this embodiment, when the display device 1 is unfolded, the portion of the wing plate 70 adjacent to the folding area FA and the anti-sagging member 80 can move in the +Z direction. Specifically, when the display device 1 is unfolded, the right portion of the first wing plate 70a adjacent to the folding area FA and the left portion of the second wing plate 70b adjacent to the folding area FA can move in the +Z direction, and the anti-sagging member 80 between the first wing plate 70a and the second wing plate 70b can move in the +Z direction.

[0117] In this embodiment, the third digitizer 40c may be arranged or positioned above the anti-sagging member 80. When the display device 1 is unfolded, when the anti-sagging member 80 above which the third digitizer 40c may be arranged or positioned moves in the +Z direction, the third digitizer 40c may be positioned or positioned adjacent to the display panel 10, and thus, various input methods such as using a pen may be provided to the user.

[0118] In one embodiment, when the display device 1 is deployed, instead of the wing plate 70 and the anti-sagging member 80 moving in the +Z direction, the display panel 10 can move in the -Z direction.

[0119] Although not shown in the accompanying drawings, in an embodiment, the anti-sagging member 80 may be arranged or disposed in a portion of the lower cover 90. Alternatively, the anti-sagging member 80 may be connected to a component (e.g., a housing) additionally provided or disposed below the wing 70.

[0120] Figure 8 This is a schematic cross-sectional view of a display device according to an embodiment.

[0121] Reference Figure 8 The display device 1 may include a display panel 10, and a panel protection member PB may be arranged or disposed below the display panel 10, and a cover window 700 may be arranged or disposed above the display panel 10.

[0122] The panel protective member PB can be attached to or disposed under the display panel 10 using the first adhesive layer 21, and the cover window 700 can be adhered to the display panel 10 using the sixth adhesive layer 27. The sixth adhesive layer 27 can be PSA or optically clear adhesive (OCA).

[0123] The cover window 700 can be attached to or positioned above the display panel 10 to protect the display panel 10.

[0124] Figure 9 This is a schematic plan view of a display panel included in a display device according to an embodiment. Figure 10 It is along Figure 9 A schematic cross-sectional view of the display panel taken by line II-II'.

[0125] Reference Figure 9 and Figure 10 The display panel 10 may include a display area DA and a peripheral area DPA, wherein the peripheral area DPA is outside or adjacent to the display area DA. The display panel 10 may provide an image by using pixels P arranged or disposed in the display area DA.

[0126] Pixel P can be implemented as a display element such as an organic light-emitting diode (OLED). Each pixel P can emit light, for example, red, green, blue, or white. Within the spirit and scope of this disclosure, the display area DA can be covered or overlapped using encapsulation components to protect it from external air or moisture.

[0127] The first flexible film 14 may be attached to the boundary of one side or one side of the display panel 10. One side or one side of the first flexible film 14 may be attached to the boundary of one side of the display panel 10 by using an anisotropic conductive film. The first flexible film 14 may be a bendable flexible film.

[0128] The display driver 12 may be arranged or disposed on the first flexible film 14. The display driver 12 may receive control signals and power supply voltages, and may generate and output signals and voltages for driving the display panel 10. The display driver 12 may be formed using an integrated circuit (IC).

[0129] The display circuit board 11 can be attached to or disposed on another side of the first flexible film 14. The other side of the first flexible film 14 can be attached to the upper surface of the display circuit board 11 using an anisotropic conductive film. The display circuit board 11 can be a bendable flexible printed circuit board (FPCB), a rigid PCB that is not easily bent, or a complex PCB that includes both a rigid PCB and a flexible FPCB.

[0130] The touch sensor driver 13 can be arranged or disposed on the display circuit board 11. The touch sensor driver 13 can be formed using an IC. The touch sensor driver 13 can be attached to the display circuit board 11. The touch sensor driver 13 can be electrically connected to the touch screen layer 400 of the display panel 10 via the display circuit board 11. Figure 11 ( ) touch electrodes.

[0131] Within the spirit and scope of this disclosure, the touchscreen layer 400 of the display panel 10 can detect user touch input using at least one of various touch methods, such as resistive film methods, capacitive methods, etc. For example, when the touchscreen layer 400 of the display panel 10 detects user touch input using a capacitive method, the touch sensor driver 13 can apply a drive signal to a drive electrode among the touch electrodes. Then, by using a sensing electrode among the touch electrodes, it can be determined whether the user has touched the screen by detecting the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode. User touch can include contact touch and proximity touch. Contact touch can refer to direct contact with a cover window 700 arranged or disposed on the touchscreen layer 400 by the user's finger or an object such as a pen. Similar to hover, proximity touch can refer to the approach of the cover window 700 by the user's finger or an object such as a pen. The touch sensor driver 13 can transmit sensor data to the main processor based on the detected voltage, and by analyzing the sensor data, the main processor can calculate the touch coordinates of the touch input that has occurred.

[0132] A power supply unit for providing driving voltage to drive the pixels P, scan driver, and display driver 12 of the display panel 10 may also be arranged or disposed on the display circuit board 11. Alternatively, the power supply unit may be combined with the display driver 12, and as an example, the display driver 12 and the power supply unit may be formed using a single IC.

[0133] Within the spirit and scope of this disclosure, substrate 100 may include insulating materials such as glass, quartz, polymer resins, etc. For example, substrate 100 may include polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, PI, polycarbonate, or cellulose acetate propionate. Substrate 100 may have a multilayer structure, including a layer containing the aforementioned polymer resin and an inorganic layer (not shown). For example, substrate 100 may include two layers containing the aforementioned polymer resin and an inorganic barrier layer between the two layers. Substrate 100 may be a rigid substrate or a flexible substrate that is bendable, foldable, or rollable.

[0134] A buffer layer 111 may be positioned or disposed on the substrate 100 and reduces or prevents the infiltration of foreign matter, moisture, or external air from beneath the substrate 100, providing a flat surface on the substrate 100. The buffer layer 111 may comprise inorganic materials, organic materials, or organic-inorganic composite materials such as oxides or nitrides, and may have a single-layer or multi-layer structure of inorganic and organic materials. A barrier layer (not shown) that blocks the infiltration of external air may also be included between the substrate 100 and the buffer layer 111. In embodiments, the buffer layer 111 may be made of silicon oxide (SiO2) or silicon nitride (SiN). XThe buffer layer 111 may include a stackable first buffer layer 111a and a second buffer layer 111b. In this case, the first buffer layer 111a may include silicon oxide (SiO2), and the second buffer layer 111b may include silicon nitride (SiN). X Alternatively, the first buffer layer 111a may include silicon nitride (SiN). X The first buffer layer 111a and the second buffer layer 111b may comprise silicon oxide (SiO2). Alternatively, the first buffer layer 111a and the second buffer layer 111b may comprise the same or similar materials.

[0135] The pixel circuit PC can be arranged or disposed on the buffer layer 111. The pixel circuit PC may include a thin-film transistor (TFT) and a storage capacitor Cst. The thin-film transistor (TFT) can be arranged or disposed on the buffer layer 111. The thin-film transistor (TFT) may include a semiconductor layer A, a gate electrode G, a source electrode S, and a drain electrode D. The thin-film transistor (TFT) can be electrically connected to an organic light-emitting diode (OLED) to drive the OLED.

[0136] Semiconductor layer A may be disposed or located on buffer layer 111 and may include polycrystalline silicon. In one embodiment, semiconductor layer A may include amorphous silicon. In another embodiment, semiconductor layer A may include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Semiconductor layer A may include a channel region and source and drain regions that may be doped with impurities.

[0137] The first insulating layer 112 may be included to cover or overlap with the semiconductor layer A. Within the spirit and scope of this disclosure, the first insulating layer 112 may include an inorganic insulating material, such as silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y The first insulating layer 112 may be a single layer or multiple layers comprising the above-mentioned inorganic insulating materials, such as aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2).

[0138] The gate electrode G may be arranged or disposed on the first insulating layer 112 to overlap with the semiconductor layer A. The gate electrode G may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a single layer or multiple layers. In an embodiment, the gate electrode G may be a single layer of molybdenum (Mo).

[0139] The second insulating layer 113 may cover or overlap the gate electrode G. Within the spirit and scope of this disclosure, the second insulating layer 113 may include an inorganic insulating material, such as silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y The materials used include, for example, aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2). The second insulating layer 113 can be a single layer or multiple layers comprising the above-mentioned inorganic insulating materials.

[0140] The upper electrode CE2 of the storage capacitor Cst may be arranged or disposed on the second insulating layer 113. The upper electrode CE2 arranged or disposed on the second insulating layer 113 may overlap with the gate electrode G arranged or disposed below or beneath the second insulating layer 113. The overlapping gate electrode G and the upper electrode CE2, together with the second insulating layer 113 between them, form the storage capacitor Cst. In an embodiment, the gate electrode G may be the lower electrode CE1 of the storage capacitor Cst. In an embodiment, the lower electrode CE1 of the storage capacitor Cst may be included as a separate component. In this case, the lower electrode CE1 and the gate electrode G may be spaced apart from each other at a certain or predetermined distance.

[0141] The upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may include a single layer or multiple layers containing the above materials.

[0142] The third insulating layer 115 may cover or overlap the upper electrode CE2. Within the spirit and scope of this disclosure, the third insulating layer 115 may include an inorganic insulating material, such as silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y The materials used include, for example, aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2). The third insulating layer 115 may include a single layer or multiple layers containing the above-mentioned inorganic insulating materials. The first insulating layer 112, the second insulating layer 113, and the third insulating layer 115 may be collectively referred to as insulating layer IIL.

[0143] The source electrode S and drain electrode D may be disposed or disposed on the third insulating layer 115. The source electrode S and drain electrode D may include conductive materials, such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single-layer structure including the above materials. In an embodiment, the source electrode S and drain electrode D may have a multilayer structure including titanium (Ti) / aluminum (Al) / titanium (Ti).

[0144] The planarization layer 117 may be disposed on the source electrode S and the drain electrode D. The planarization layer 117 may have a flat upper surface, such that the pixel electrode 121 disposed on it can be flat.

[0145] The planarization layer 117 may comprise organic or inorganic materials and may have a single-layer or multi-layer structure. The planarization layer 117 may comprise general-purpose polymers such as benzocyclobutene (BCB), PI, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoropolymers, p-xylyl polymers, or vinyl alcohol polymers. Within the spirit and scope of this disclosure, the planarization layer 117 may comprise inorganic insulating materials such as silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y Materials such as aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2) are used. In the case of forming planarization layer 117, in order to provide a flat upper surface after forming planarization layer 117, chemical mechanical polishing can be performed on the upper surface of planarization layer 117.

[0146] The planarization layer 117 may have a via that exposes one of the source electrode S and the drain electrode D of the thin-film transistor TFT, and the pixel electrode 121 may be electrically connected to the thin-film transistor TFT via the via to make electrical contact with the source electrode S or the drain electrode D.

[0147] Although Figure 10 The diagram shows one planarization layer, but in implementations, two planarization layers may also be included. Two planarization layers may be more advantageous for achieving higher integration.

[0148] Pixel electrode 121 may be disposed or disposed on planarization layer 117. Pixel electrode 121 may include conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). Pixel electrode 121 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. For example, pixel electrode 121 may have a structure in which a layer comprising ITO, IZO, ZnO, or In2O3 may be above or below the aforementioned reflective layer. Pixel electrode 121 may have a structure in which indium tin oxide (ITO) / silver (Ag) / indium tin oxide (ITO) can be stacked.

[0149] A pixel defining layer 119 may be disposed on or on the planarization layer 117. The pixel defining layer 119 may be disposed on or on the planarization layer 117 and may cover or overlap the edge of the pixel electrode 121. A first opening OP1 may be defined or formed in the pixel defining layer 119, exposing at least a portion of the pixel electrode 121. The size and shape of the emission region EA of the organic light-emitting diode (OLED), for example, the pixel P, may be defined or formed by the first opening OP1.

[0150] The pixel defining layer 119 can increase the distance between the edge of the pixel electrode 121 and the opposite electrode 123 above the pixel electrode 121, thereby preventing electric arcs at the edge of the pixel electrode 121. The pixel defining layer 119 may include, for example, organic insulating materials such as PI, polyamide, acrylic resin, benzoylbutene, HMDSO, phenolic resin, etc., and can be formed by spin coating or the like within the spirit and scope of this disclosure.

[0151] Although not shown, spacers for preventing mask stamping may also be arranged or disposed on the pixel defining layer 119. These spacers may be formed as a single body with the pixel defining layer 119. For example, the spacers and the pixel defining layer 119 may be formed simultaneously in the same process using a halftone mask process.

[0152] The emitting layer 122b may be disposed or disposed in a first opening OP1 defined or formed in the pixel defining layer 119 to correspond to the pixel electrode 121. The emitting layer 122b may comprise a polymer material or a low molecular weight material and may emit red, green, blue or white light.

[0153] The organic functional layer 122e may be disposed on and / or below or beneath the emitting layer 122b. In an embodiment, the organic functional layer 122e may include a first functional layer 122a and / or a second functional layer 122c. In an embodiment, either the first functional layer 122a or the second functional layer 122c may be omitted.

[0154] The first functional layer 122a may be disposed below or beneath the emitter layer 122b. The first functional layer 122a may have a single-layer or multi-layer structure comprising organic materials. The first functional layer 122a may be a hole transport layer (HTL) with a single-layer structure. Alternatively, the first functional layer 122a may include a hole injection layer (HIL) and an HTL. The first functional layer 122a may be formed as a single body to correspond to an organic light-emitting diode (OLED) included in the display area DA.

[0155] The second functional layer 122c may be disposed or disposed on the emitting layer 122b. The second functional layer 122c may be a single layer or multiple layers comprising organic materials. The second functional layer 122c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 122c may be formed as a single body to correspond to an organic light-emitting diode (OLED) included in the display area DA.

[0156] The counter electrode 123 may be disposed or disposed on the second functional layer 122c. The counter electrode 123 may comprise a conductive material having a low work function. For example, the counter electrode 123 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the counter electrode 123 may further comprise a layer such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the aforementioned materials. The counter electrode 123 may be formed as a single body to correspond to an organic light-emitting diode (OLED) included in the display area DA.

[0157] The layers from pixel electrode 121 to opposite electrode 123 can form an organic light-emitting diode (OLED).

[0158] An upper layer 150, comprising an organic material, may be formed or disposed on the counter electrode 123. The upper layer 150 may be provided to protect the counter electrode 123 and also to improve light extraction efficiency. The upper layer 150 may comprise an organic material having a higher refractive index than the counter electrode 123. Alternatively, the upper layer 150 may comprise layers with different refractive indices stacked on top of each other. For example, the upper layer 150 may be formed by stacking a high refractive index layer / a low refractive index layer / a high refractive index layer. The refractive index of the high refractive index layer may be about 1.7 or higher, and the refractive index of the low refractive index layer may be about 1.3 or lower.

[0159] The upper layer 150 may also include LiF. Alternatively, the upper layer 150 may also include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). X The upper layer 150 may be omitted. However, for ease of description, the description will focus on embodiments in which the upper layer 150 may be arranged or disposed on the opposite electrode 123.

[0160] Figure 11 This is a schematic cross-sectional view illustrating a display device according to an embodiment. Figure 11 In, with Figure 10 The same reference numerals in the figures denote the same elements, and therefore repeated descriptions thereof will be omitted.

[0161] Reference Figure 11 The thin-film encapsulation layer 300 may be disposed or disposed on an organic light-emitting diode (OLED). The thin-film encapsulation layer 300 may include at least one inorganic film layer and at least one organic film layer. For example, the thin-film encapsulation layer 300 may include a first inorganic film layer 310, an organic film layer 320, and a second inorganic film layer 330.

[0162] The first inorganic film layer 310 and the second inorganic film layer 330 may each comprise one or more inorganic insulating materials. Within the spirit and scope of this disclosure, the inorganic insulating material may include silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO2), etc.

[0163] The organic film layer 320 may include a polymer-based material. Examples of polymer-based materials within the spirit and scope of this disclosure include acrylic resins, epoxy resins, PI, polyethylene, etc. For example, within the spirit and scope of this disclosure, the organic film layer 320 may include acrylic resins such as polymethyl methacrylate, polyacrylic acid, etc. The organic film layer 320 may be formed by curing monomers or applying a polymer.

[0164] The touchscreen layer 400 may be disposed or disposed on the thin-film encapsulation layer 300. The touchscreen layer 400 may include a first conductive layer MTL1 and a second conductive layer MTL2, which include sensing electrodes and / or traces within the spirit and scope of this disclosure. A first touch insulating layer 410 may be disposed or disposed between the thin-film encapsulation layer 300 and the first conductive layer MTL1, and a second touch insulating layer 430 may be disposed or disposed between the first conductive layer MTL1 and the second conductive layer MTL2.

[0165] The first conductive layer MTL1 and the second conductive layer MTL2 may include conductive materials. Conductive materials may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include multiple layers or a single layer containing the above materials. In an embodiment, the first conductive layer MTL1 and the second conductive layer MTL2 may have a structure in which titanium layers, aluminum layers, and titanium layers are sequentially stacked (Ti / Al / Ti).

[0166] The first touch insulating layer 410 and the second touch insulating layer 430 may comprise inorganic insulating materials and / or organic insulating materials. Within the spirit and scope of this disclosure, the inorganic insulating material may comprise silicon oxide (SiO2). X Silicon nitride (SiN) X ), silicon oxynitride (SiO) X N Y Organic insulating materials include, for example, aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2). Within the spirit and scope of this disclosure, organic insulating materials may include acrylic organic materials, imide organic materials, etc.

[0167] The filter plate 600 can be arranged or disposed on the touch screen layer 400 as an optical functional layer. The filter plate 600 may include a black matrix 610, a color filter 620, and an outer coating 630.

[0168] The black matrix 610 can be positioned or disposed in a non-emission area surrounding and around the emission area EA. In an embodiment, the black matrix 610 can passivate the touch electrodes of the touchscreen layer 400. For example, as in... Figure 11 As shown, the second conductive layer MTL2 of the touchscreen layer 400 may overlap with the black matrix 610, and the second conductive layer MTL2 may be covered or overlapped using the black matrix 610. The black matrix 610 may include an insulating material (e.g., an organic insulating material) comprising a pigment or dye having a black color. The black matrix 610 may include materials that may be included in the pixel defining layer 119.

[0169] The black matrix 610 may have a second opening OP2 corresponding to the emission region EA. The second opening OP2 defined or formed in the black matrix 610 may be formed to be the same size as or larger than the first opening OP1 defined or formed in the pixel defining layer 119.

[0170] The color filter 620 can be arranged or disposed in the emission region EA of the organic light-emitting diode (OLED). Depending on the color of the light emitted from the OLED, the color filter 620 can have red, green, or blue pigments or dyes.

[0171] An outer coating 630 covering or overlapping the black matrix 610 and the color filter 620 to flatten the upper surface of the filter plate 600 may be arranged or disposed on the black matrix 610 and the color filter 620.

[0172] Although not shown, in an embodiment, instead of the filter plate 600, an optical functional layer including a polarizing plate may be arranged or disposed on the touch screen layer 400. In this case, the optical functional layer may include an anti-reflective layer. The anti-reflective layer can reduce the reflectivity of light (external light) incident on the display device 1 from the outside.

[0173] In one embodiment, the antireflective layer may include a polarizing film. The polarizing film may include a linear polarizer and a phase retardation film, such as a quarter-wavelength (λ / 4) plate. The phase retardation film may be disposed or arranged on the touchscreen layer 400, and the linear polarizer may be disposed or arranged on the phase retardation film. In another embodiment, the antireflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed or arranged on different layers from each other. First reflected light and second reflected light reflected by the first reflective layer and the second reflective layer, respectively, may undergo destructive interference, thereby reducing the external light reflectivity.

[0174] The cover window 700 can be arranged or positioned above the filter plate 600. The cover window 700 can be attached to the filter plate 600 using a sixth adhesive layer 27. The sixth adhesive layer 27 can be PSA or OCA.

[0175] In the implementation, in the display device 1 that includes a display area DA and a folding area FA, since the digitizer 40 can be arranged or placed below the display panel 10, various input methods such as using a pen can be provided to the user.

[0176] In the implementation, since the anti-sagging member 80 can be arranged or configured to correspond to the folded area FA, and the digitizer (e.g., the third digitizer 40c) can be arranged or configured above the anti-sagging member 80, various input methods such as using a pen can be provided to the user in the folded area FA.

[0177] For example, in one embodiment, since the folding structure may be included in the second portion 30b of the plate 30 arranged or disposed below the display panel 10, the second portion 30b corresponding to the folding area FA can be easily folded inward.

[0178] According to the embodiments described above, since the digitizer can be included below a foldable display panel that can be folded or unfolded, various input methods such as using a pen can be provided to the user. However, the scope of this disclosure is not limited to the effects described above.

[0179] It should be understood that the embodiments described herein are to be considered descriptive only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, comprising: Display area and collapsed area; Display panel; A digitizer is located below the display panel; as well as A padding layer is disposed below the digitizer; in, The display area includes a first display area and a second display area that are spaced apart from each other. The folding area is disposed between the first display area and the second display area, and The digitizer includes: The first digitizer overlaps with the first display area; A second digitizer overlaps with the second display area; and The third digitizer overlaps with the folded area. The third digitizer is configured to be movable.

2. The display device according to claim 1, wherein, The third digitizer is spaced apart from each of the first digitizer and the second digitizer.

3. The display device according to claim 1 further includes a plate disposed between the display panel and the digitizer.

4. The display device according to claim 3, wherein, The plate includes: The first portion overlaps with the first display area and the second display area; and The second part overlaps with the folded area.

5. The display device according to claim 4, wherein, The first portion of the plate comprises a non-metallic material, and The second portion of the plate comprises a metallic material.

6. The display device according to claim 4, wherein, The second portion of the plate includes a plurality of holes.

7. The display device according to claim 1 further includes a wing plate disposed below the digitizer.

8. The display device according to claim 7, wherein, The wing plate includes: The first wing plate overlaps with the first display area, and The second wing overlaps with the second display area.

9. The display device according to claim 8, wherein, The first wing and the second wing are spaced apart from each other.

10. The display device according to claim 1, wherein, The cushion layer includes: A first cushion layer overlaps with the first display area; and The second padding layer overlaps with the second display area.

11. The display device according to claim 10, wherein, The cushion layer further includes a third cushion layer disposed below the third digitizer.

Citation Information

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