Power conversion equipment, power assembly and electric vehicle

Abstract

The invention provides power conversion equipment, a power assembly and an electric vehicle. The power conversion equipment comprises a power module, an adapter and a capacitor module, the power module comprises a first terminal and a second terminal, the first terminal comprises a wiring end surface exposed out of the top surface of the power module, the second terminal comprises a wiring end part exposed out of the side surface of the power module, the wiring end surface and the wiring end part are arranged along a first direction, and the first direction is perpendicular to the thickness direction of the power module; the adapter is arranged on one side of the top surface of the power module and comprises a first section and a second section which are opposite in the first direction, the first section is connected with the wiring end surface, and the second section and the wiring end part are arranged at intervals in the thickness direction of the power module; the capacitor module comprises two electric connection terminals, one electric connection terminal is used for being connected with the wiring end part, and the other electric connection terminal is used for being connected with the second section. The power conversion device has small parasitic inductance, and the performance of the device can be improved.

Description

Technical Field

[0001] This application relates to the field of power conversion technology, and in particular to a power conversion device, powertrain, and electric vehicle. Background Technology

[0002] Power modules are core components in power electronic devices. They integrate one or more power semiconductor devices to achieve the conversion and management of electrical energy, and are therefore widely used in photovoltaics, energy storage, electric vehicles and other fields.

[0003] Power semiconductor devices in power modules generate drastic current changes during switching, which induce voltage spikes and oscillations on the parasitic inductance of the commutation circuit, leading to overvoltage and deterioration of the device's electromagnetic interference (EMI) characteristics. Existing connection methods between power modules and bus capacitors are insufficient to meet the requirements for managing parasitic inductance. Summary of the Invention

[0004] This application provides a power conversion device, a powertrain, and an electric vehicle. The power conversion device has a small parasitic inductance, which is beneficial to improving device performance.

[0005] In a first aspect, this application provides a power conversion device, which includes a power module, an adapter, and a capacitor module. The power module includes a first terminal and a second terminal. The first terminal includes a wiring end face exposed on the top surface of the power module, and the second terminal includes a wiring end face exposed on the side surface of the power module. The wiring end face and the wiring end face are arranged along a first direction, which is perpendicular to the thickness direction of the power module. The adapter is disposed on one side of the top surface of the power module. The adapter includes a first segment and a second segment opposite to each other along the first direction. The first segment is connected to the wiring end face, and the second segment is spaced apart from the wiring end face along the thickness direction of the power module. The capacitor module includes two electrical connection terminals, one for connecting the wiring end face and the other for connecting the second segment face.

[0006] In the aforementioned power conversion equipment, the first terminal of the power module uses a top-outlet cable and connects to the capacitor module via an adapter, while the second terminal uses a side-outlet cable and directly connects to the capacitor module. The adapter and wiring terminals can be distributed on the same side of the power module. The alternating stacked distribution of the adapter and wiring terminals reduces parasitic inductance in the converter circuit. This reduction in parasitic inductance improves the switching speed of the power module, reduces dynamic energy consumption, and thus improves the operating efficiency of the power conversion, enhancing the performance of the power conversion equipment.

[0007] In one embodiment, the adapter includes a through hole that extends through the second segment and is opposite to the wiring end along the thickness direction of the power module. The through hole can serve as a process window for connecting the wiring end to the electrical connection terminal. The two process steps of connecting the adapter to the electrical connection terminal of the capacitor module and connecting the wiring end to the electrical connection terminal can be performed concurrently, which can optimize the connection process between the power module and the capacitor module and improve process flexibility.

[0008] In one embodiment, the power conversion device includes an insulating member disposed between the second segment and the wiring end. The insulating member includes a connecting hole opposite to the through hole along the thickness direction of the power module. One end of the insulating member facing the power module extends along a first direction between the adapter and the top surface of the power module, and the other end of the insulating member away from the power module extends along the thickness direction of the power module to at least partially cover the end of the wiring end away from the power module. The insulating member can increase the creepage distance between the adapter and the wiring end, thereby improving the insulation between them. The connecting hole connects the through hole and the wiring end, allowing the wiring end to be exposed through the connecting hole and the through hole.

[0009] In one embodiment, the insulating element includes two side walls arranged opposite each other on both sides of at least one of the adapter and the wiring terminal along a second direction perpendicular to the first direction and the thickness direction of the power module. The side walls can increase the creepage distance between the sides of the adapter and the wiring terminal in the second direction, thereby improving the insulation between the adapter and the wiring terminal.

[0010] In one embodiment, along the thickness of the power module, a side wall protrudes from the surface of the adapter opposite to the wiring end, without affecting the connection between the wiring end and the electrical connection terminal. In a first direction, the distance between the side wall and the wiring end face is smaller than the distance between the wiring end and the wiring end face. One end of the side wall along the first direction is located on the top surface of the power module, further increasing the creepage distance between the adapter and the wiring end.

[0011] In one embodiment, the insulating element includes an annular barrier, the inner diameter of which surrounds the through hole and extends into the through hole along the thickness direction of the power module. The annular barrier can increase the creepage distance of the adapter and wiring terminals at the through hole, thereby improving the insulation of the adapter and wiring terminals.

[0012] In one embodiment, along the thickness direction of the power module, an annular retaining wall protrudes from the surface of the adapter opposite to the wiring end, which can further increase the creepage distance between the adapter and the wiring end. In a plane perpendicular to the thickness direction of the power module, the inner diameter of the annular retaining wall is greater than or equal to 5 mm and less than or equal to 20 mm, which meets the requirements of process operation.

[0013] In one embodiment, the power module includes a package, a substrate encapsulated by the package, and multiple power semiconductor devices. The multiple power semiconductor devices, a first terminal, and a second terminal are all electrically connected to the substrate. The package includes a window exposing the terminal face, the diameter of which is smaller than or equal to the area of ​​the terminal face. The package covers the surface of the substrate and exposes the terminal face of the first terminal through the window, balancing packaging effectiveness and electrical connection requirements.

[0014] In one embodiment, the terminal face is lower than the top surface of the power module along its thickness direction; or, the terminal face is flush with the top surface of the power module. This structural design does not increase the dimension of the power module in the thickness direction.

[0015] In one embodiment, the distance between the wiring end and the second segment is 0.5-1.5mm along the thickness direction of the power module, which balances low parasitic inductance and good insulation.

[0016] In one embodiment, the power module includes a plurality of first terminals, at least two of which are connected to the same adapter, reducing the number of parts and optimizing electrical performance.

[0017] In one embodiment, a plurality of first terminals are symmetrically distributed with their axes of symmetry parallel to a first direction. This symmetrical distribution of the first terminals helps maintain balanced connection stress when connecting the adapter, which is beneficial to the overall stability and connection reliability of the power module.

[0018] In one embodiment, the capacitor module is disposed on one side of the bottom surface of the power module along the thickness direction of the power module, which is beneficial for miniaturization of the device. Along the first direction, a second segment protrudes from the end of the wiring terminal away from the power module. One electrical connection terminal is bent towards the power module to connect to the surface of the wiring terminal away from the second segment, and the other electrical connection terminal is bent away from the power module to connect to the surface of the second segment facing the wiring terminal. The two electrical connection terminals extend in opposite directions along the first direction, ensuring reliable positive and negative connection while achieving structural avoidance and improving insulation reliability.

[0019] In one embodiment, the power conversion device includes multiple power modules arranged at intervals along a second direction, which is perpendicular to the first direction and the thickness direction of the power modules. Each electrical connection terminal includes multiple electrical connection ends arranged at intervals along the second direction. The multiple connection ends of one electrical connection terminal are used to connect one-to-one with the wiring terminals of the multiple power modules, and the multiple connection ends of another electrical connection terminal are used to connect one-to-one with the second segment of the multiple power modules. The multiple power modules are connected in DC parallel, which reduces the number of parts and simplifies the structure.

[0020] In one embodiment, the second segments of multiple power modules are connected along a second direction. Connecting multiple adapters into a single structure can also simplify the structure and reduce the number of parts.

[0021] In one embodiment, the power conversion device includes a heat sink disposed between the power module and the capacitor module. The heat sink contacts the bottom surface of the power module and is spaced apart from the capacitor module. This prevents heat from the heat sink from being transferred to the capacitor module and affecting its function, and also provides space for the heat sink to exchange heat with the external environment, maintaining good heat dissipation.

[0022] Secondly, this application provides a powertrain including a motor controller and a motor. The motor controller is the power conversion device provided in the first aspect above. The capacitor module is used to connect to a power source, and the power module is used to output AC power to drive the motor.

[0023] Thirdly, this application provides an electric vehicle, which includes wheels, a reducer, and the powertrain provided in the second aspect above, wherein the motor is connected to the wheels via the reducer. Attached Figure Description

[0024] Figure 1 This application provides a schematic diagram of the structure of an electric vehicle.

[0025] Figure 2 This is a schematic diagram of the structure of a powertrain provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0027] Figure 4a This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0028] Figure 4b This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0029] Figure 5 This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0030] Figure 6a This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0031] Figure 6b This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0032] Figure 7a This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0033] Figure 7b This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0034] Figure 8 This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0035] Figure 9a This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0036] Figure 9b This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0037] Figure 10a This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0038] Figure 10b This is a partial cross-sectional structural diagram of a power conversion device provided in an embodiment of this application;

[0039] Figure 11 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0040] Figure 12a This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0041] Figure 12b This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0042] Figure 12c This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0043] Figure 12d This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0044] Figure 12e This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application.

[0045] Figure label:

[0046] 1000, Powertrain; 2000, Frame; 3000, Wheels; 4000, Battery;

[0047] 100. Motor controller; 200. Electric motor;

[0048] 10. Power conversion equipment; 1. Power module; 111. First terminal; 112. Second terminal; 12. Substrate; 120. Insulating base plate; 121. First metal layer; 122. Second metal layer; 13. Package; 14. Power semiconductor device; 15. Interconnector; 2. Capacitor module; 21. Electrical connection terminal; 211. Connection end; 3. Adapter; 31. First section; 32. Second section; 33. Protruding section; 4. Heat sink; 5. Insulating component; 51. Annular retaining wall; 52. Side retaining wall;

[0049] A1 - First direction; A2 - Second direction; A3 - Third direction; B - Wiring end; C - Window; G - Recessed structure; K - Through hole; M - Wiring end face; T - Connecting hole. Detailed Implementation

[0050] Power modules convert and manage electrical energy, finding wide application in photovoltaics, energy storage, and electric vehicles. A power module is equipped with a bus capacitor connected between the power source and the module itself, used to filter the DC power supplied by the power source. The power module integrates multiple power devices connected to form a converter circuit for power conversion. The drastic current changes caused by the switching process of these power devices can induce voltage spikes and oscillations on the parasitic inductance of the converter circuit. Reducing the parasitic inductance of the converter circuit is crucial for improving the switching speed of the power module, reducing dynamic losses, and enhancing operating efficiency. In traditional technologies, the DC interface of power modules is typically planar, requiring sufficient insulation clearance between it and the bus capacitor, resulting in relatively high parasitic inductance in the converter circuit.

[0051] Based on this, embodiments of this application provide a power conversion device, a powertrain, and an electric vehicle, wherein the connection structure between the power module and the capacitor module can reduce the parasitic inductance in the converter circuit and improve the operating efficiency of the device.

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0053] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0054] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0055] Figure 1 This application provides a structure for an electric vehicle according to an embodiment. For example... Figure 1 As shown, the electric vehicle includes a frame 2000, a power battery 4000, and a powertrain 1000, as... Figure 1 As shown, the frame 2000 is used to fix the power battery 4000 and the powertrain 1000. In this embodiment, an electric vehicle refers to a wheeled device driven or towed by a power unit, including electric vehicles (EVs), pure electric vehicles (PEVs / BEVs), hybrid electric vehicles (HEVs), range-extended electric vehicles (REEVs), plug-in hybrid electric vehicles (PHEVs), and new energy vehicles. In some embodiments, electric vehicles include passenger cars and various special-purpose vehicles with specific functions, such as emergency rescue vehicles, water trucks, sewage suction trucks, cement mixer trucks, crane trucks, and medical vehicles. Electric vehicles can also be robots capable of driving. In this embodiment, the powertrain 1000 is used to receive power from the power battery 4000 and to drive the wheels 3000.

[0056] In one embodiment, such as Figure 2As shown, the powertrain 1000 includes a motor control unit (MCU) 100 and a motor 200. The motor control unit 100 is connected to the power battery 4000. The motor control unit 100 is used to convert the DC power of the power battery 4000 into AC power and supply it to the motor 200. The motor 200 converts the electrical energy into mechanical energy and transmits the mechanical energy to the wheel 3000 through a transmission structure such as a reducer to drive the wheel 3000 to rotate.

[0057] In this embodiment, the function of the motor controller 100 is to receive commands such as gear position, throttle, and brake from the vehicle controller, convert the DC power stored in the powertrain 1000 into AC power to drive the motor 200, and control the speed and torque of the motor 200.

[0058] This application provides an embodiment of, as follows: Figure 3 The power conversion device 10 shown above, and the motor controller 100 described above are specific implementations of the power conversion device 10. For example... Figure 3 As shown, the power conversion device 10 includes a power module 1, a capacitor module 2, and an adapter 3. The DC terminal of the power module 1 is connected to the DC terminal of the capacitor module 2. The power module 1 can receive the DC power converted by the capacitor module 2 and convert the DC power into AC power for output. In some embodiments, the capacitor module 2 is also referred to as a bus capacitor or mains capacitor. The adapter 3 is used to assist in the circuit connection between the power module 1 and the capacitor module 2.

[0059] Please continue to refer to Figure 3 As shown, the power module 1 includes a first terminal 111 and a second terminal 112 for connecting DC power. The first terminal 111 includes a wiring end face M exposed on the top surface of the power module 1, and the second terminal 112 includes a wiring end B exposed on the side surface of the power module 1. The wiring end face M and the wiring end B are arranged along a first direction A1, which is perpendicular to the thickness direction of the power module 1. The thickness direction of the power module 1 is also the direction between the top and bottom surfaces of the power module 1. An adapter 3 is disposed on one side of the top surface of the power module 1. The adapter 3 includes a first segment 31 and a second segment 32 opposite to each other along the first direction A1. The first segment 31 is connected to the wiring end face M, and the second segment 32 is arranged at intervals from the wiring end B along the thickness direction of the power module 1. The capacitor module 2 includes two electrical connection terminals 21, one for connecting the wiring end B and the other for connecting the second segment 32.

[0060] For ease of understanding, such as Figure 3As shown, a three-dimensional coordinate system is established based on the structure of power module 1. This three-dimensional coordinate system includes a first direction A1, a second direction A2, and a third direction A3, which are perpendicular to each other. The third direction A3 is the thickness direction of power module 1, the first direction A1 is the arrangement direction of the terminal face M and the terminal end B, and the second direction A2 is perpendicular to the first direction A1 and the third direction A3. It should be understood that the pairwise perpendicularity between the first direction A1, the second direction A2, and the third direction A3 can have small positive and negative deviations.

[0061] The power module 1 encapsulates the substrate, power devices, and other structures internally. Both the first terminal 111 and the second terminal 112 are connected to the substrate, enabling the first terminal 111 and the second terminal 112 to connect to the functional circuit formed by the power devices. Parts of both the first terminal 111 and the second terminal 112 are exposed outside the power module 1 to facilitate external circuit connection. There may be one or more first terminals 111 and one or more second terminals 112.

[0062] The capacitor module 2 is used to connect between the DC input side of the power module 1 and the power supply. The first terminal 111 and the second terminal 112 are used to connect the positive and negative terminals of the capacitor module 2, respectively. That is, one of the first terminal 111 and the second terminal 112 is connected to the positive terminal of the capacitor module 2, and the other is connected to the negative terminal of the capacitor module 2. Corresponding to the first terminal 111 and the second terminal 112 of the power module 1, the two electrical connection terminals 21 of the capacitor module 2 are used to connect the first terminal 111 and the second terminal 112, respectively.

[0063] In one embodiment, such as Figure 3 As shown, the terminal face M of the first terminal 111 is exposed on the top surface of the power module 1, and the first terminal 111 is a DC terminal exiting from the top of the power module 1. The terminal face B of the second terminal 112 is exposed on the side of the power module 1, and the second terminal 112 is a DC terminal exiting from the side of the power module 1. The first terminal 111 and the second terminal 112 exit from different sides of the power module 1. One electrical connection terminal 21 is connected to the terminal face M of the first terminal 111 via an adapter 3, and the other electrical connection terminal 21 is directly connected to the terminal face B of the second terminal 112.

[0064] The adapter 3 and the second terminal 112 are arranged at intervals along the thickness direction of the power module 1. One end of the adapter 3 is connected to the wiring end face M of the first terminal 111, and the other end extends along the first direction A1 to the side where the wiring end B is located, so that the other end of the adapter 3 and the wiring end B are arranged at intervals along the third direction A3. For ease of understanding, the structure of the adapter 3 is divided into regions along the first direction A1. The adapter 3 includes a first segment 31 and a second segment 32 that are opposite each other along the first direction A1. Along the first direction A1, the first segment 31 extends to the top surface of the power module 1 to connect to the wiring end face M of the first terminal 111, and the second segment 32 extends to the side where the second terminal 112 of the power module 1 is output. The adapter 3 connects to the terminal face M of the first terminal 111. The adapter 3 and the first terminal 111 are at the same potential. The first terminal 111 is connected to the DC power of the capacitor module 2 through the adapter 3. The terminal B of the second terminal 112 is connected to the DC power of the capacitor module 2, thus realizing the commutation circuit connection between the power module 1 and the capacitor module 2. The power module 1 is connected to the capacitor module 2 on the output side of the second terminal 112. The output side of the second terminal 112 of the power module 1 is the DC side of the power module 1. Both the adapter 3 and the second terminal 112 are planar plate structures. The adapter 3 is parallel to the plane formed by the first direction A1 and the second direction A2. The terminal B is parallel to the plane formed by the first direction A1 and the second direction A2. The adapter 3 and the terminal B are spaced apart and parallel to each other along the third direction A3. The adapter 3 and the terminal B are stacked at intervals, which can reduce the parasitic inductance in the commutation circuit. Reducing the parasitic inductance in the commutation circuit can improve the switching speed of power module 1, reduce dynamic energy consumption, and thus improve the operating efficiency of power conversion and enhance the performance of the power conversion equipment. It can be seen that this power conversion equipment uses an adapter 3 to connect the circuit between power module 1 and capacitor module 2 on the same side of power module 1. The positional arrangement of the adapter 3 and the second terminal 112 reduces the parasitic inductance in the circuit. The structure is simple and easy to implement, and the inductance reduction effect is significant, showing good application prospects.

[0065] In one embodiment, the adapter 3 can be made of a metal with good electrical conductivity, such as copper, gold, or silver. As an example, a copper busbar is used for the adapter 3, and the adapter 3 is welded to the wiring end face M of the first terminal 111. It should be understood that the first segment 31 and the second segment 32 are both part of the structure of the adapter 3, divided by structural regions at different locations on the adapter 3, and are not independent structures.

[0066] Please continue to refer to Figure 3As shown, in the power conversion device provided in this application embodiment, the power module 1 and the capacitor module 2 are arranged in the thickness direction of the power module 1, and the capacitor module 2 is specifically arranged on one side of the bottom surface of the power module 1. This is beneficial to reducing the size of the device in the thickness direction of the power module 1 and also to achieving miniaturization of the device.

[0067] To connect the adapter 3 and the wiring end B of the second terminal 112, two electrical connection terminals 21 of the capacitor module 2 extend along the surface of the capacitor module 2 to the wiring end B of the power module 1 and extend in the third direction A3 toward the power module 1 to approach the adapter 3 and the wiring end B of the second terminal 112. With reference to the structure of the power module 1, the connection between the power module 1 and the capacitor module 2 is realized on the DC side of the power module 1.

[0068] In the power conversion device provided in this application embodiment, the first terminal 111 of the power module 1 is connected to one electrical connection terminal 21 of the capacitor module 2 via an adapter 3, and the second terminal 112 is directly connected to the other electrical connection terminal 21 of the capacitor module 2. The second segment 32 of the adapter 3, the wiring end B of the second terminal 112, and the capacitor module 2 are arranged at intervals along the third direction A3. To facilitate the connection of the two electrical connection terminals 21 to the second segment 32 and the wiring end B respectively, the second segment 32 protrudes from the wiring end B along the first direction A1, away from the end of the power module 1. The wiring end B is opposite to the capacitor module 2 along the third direction A3, and the portion of the second segment 32 protruding from the wiring end B is opposite to the capacitor module 2 along the third direction A3.

[0069] Based on the structure of the adapter 3 and the wiring end B, the two electrical connection terminals 21 of the capacitor module 2 extend toward the power module 1 in a spaced-apart manner along the first direction A1. The arrangement of the two electrical connection terminals 21 along the first direction A1 corresponds to the wiring end B and the portion of the second segment 32 protruding from the wiring end B. One electrical connection terminal 21 is connected to the wiring end B, and the other electrical connection terminal 21 is connected to the portion of the second segment 32 protruding from the wiring end B.

[0070] In one embodiment, to improve connection reliability, one electrical connection terminal 21 is bent towards the power module 1 to connect the terminal B away from the surface of the second segment 32. This electrical connection terminal 21 is connected to the terminal B in a surface contact manner, providing a larger connection area, maintaining current carrying capacity, and improving connection reliability. Similarly, another electrical connection terminal 21 is bent away from the power module 1 to connect the surface of the second segment 32 facing the terminal B. The two electrical connection terminals 21 extend in opposite directions along the first direction A1, ensuring reliable positive and negative connection while achieving structural avoidance and improving insulation reliability.

[0071] In some embodiments, insulating paper is provided between the two electrical connection terminals 21 of the capacitor module 2 to maintain good insulation.

[0072] Figure 4a An example of a power module 1 is provided. The power module 1 includes a substrate 12, a package 13, and a plurality of power semiconductor devices 14. The plurality of power semiconductor devices 14, a first terminal 111, and a second terminal 112 are all electrically connected to the substrate 12. The substrate 12 and the plurality of power semiconductor devices 14 are packaged within the package 13. The first terminal 111 is packaged within the package 13 and its surface facing away from the substrate 12 is exposed within the package 13 to form a wiring terminal M. The second terminal 112 is packaged within the package 13 and one end extends out of the package 13 along a first direction A1 to form a wiring terminal B.

[0073] In this embodiment, the substrate 12 provides support for other structures. Each power semiconductor device 14 is disposed on the surface of the substrate 12 facing the adapter 13. Multiple power semiconductor devices 14 can be interconnected through the substrate 12 to form a functional circuit. In one embodiment, the substrate 12 includes an insulating base plate 120 and multiple first metal layers 121 disposed on the surface of the insulating base plate 120, with adjacent first metal layers 121 spaced apart to provide insulation. Each power semiconductor device 14 is disposed on one first metal layer 121 and connected to another first metal layer 121 through an interconnect 15. Depending on the different functions of the power module 1, there are various ways to connect the multiple first metal layers 121 of the substrate 12 to the multiple power semiconductor devices 14. In this embodiment, the substrate 12 can be a ceramic substrate, a metal substrate, a single-sided or double-sided copper-clad ceramic substrate (which can be a DBC board or a DCB board), an active metal bonding (AMB) ceramic board, an insulated metal substrate (IMS), a printed circuit board (PCB), or other packaging substrates. DBC is short for direct bond copper, and DCB is short for direct copper bonding.

[0074] In one embodiment, the substrate 12 is a double-sided metal-ceramic plate, and further includes a second metal layer 122. The second metal layer 122 is disposed on the surface of the insulating base plate 120 opposite to the plurality of first metal layers 121. The second metal layer 122 is exposed on the bottom surface of the power module 1 and can be used for heat dissipation of the power module 1.

[0075] The power semiconductor device 14 can be one or a combination of a chip, a power element, and a passive element. For example, the chip can be an integrated circuit (IC) chip. The power element can be a diode, a transistor, etc., wherein the transistor can be an insulated-gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), etc. The passive element can be a capacitor, a resistor, an inductor, etc. Furthermore, the power semiconductor device 14 can also be a fan-in or fan-out structure chip or a complete pre-packaged structure derived from the chip, power element, or passive element. The packaging form of the power semiconductor device 14 can be a ball grid array package (BGA), a quad flat non-leaded package (QFN), a small outline package (SOP), a transistor outline package (TO), etc. The number of chips packaged can be a single chip or multiple chips in a single package. The chip orientation can be either face-up or face-down (flip chip). The package 13 may include materials such as silicone gel, epoxy molding compound, and epoxy potting compound.

[0076] In the power module 1 of the power conversion device provided in this application embodiment, the first terminal 111 is arranged with a top-out wiring configuration. Referring to the structure of the power module 1, the first terminal 111 is connected to a first metal layer 121 and needs to expose the surface of the power module 1 facing away from the substrate 12 to form a wiring terminal face M. Figure 4a In the power module 1 shown, the top surface of the power module 1, which is also the surface of the package 13 facing away from the first metal layer 121, is a window C in order to expose the first terminal 111. The portion of the first terminal 111 exposed through the window C is the terminal face M. The window C of the package 13 extends through the first metal layer 121 on the side of the package 13 facing away from the insulating substrate 120. The package 13 encapsulates the substrate 1 and the power semiconductor device 14 to provide protection and insulation. The window C of the package 13 also needs to expose the terminal face M of the first terminal 111. To balance the encapsulation effect and the electrical connection effect of the first terminal 111, the diameter of the window C is smaller than or equal to the area of ​​the terminal face M.

[0077] In one embodiment, the terminal face M does not protrude from the top surface of the power module 1 along the third direction A3, that is, the terminal face M is lower than the top surface of the power module 1 or the terminal face M is flush with the top surface of the power module 1, so as not to increase the dimension of the power module 1 in the thickness direction.

[0078] Figure 4a In the example, the terminal face M of the power module 1 is flush with the top surface of the power module 1. Along the thickness direction of the power module 1, i.e., along the third direction A3, the thickness of the first terminal 111 is equal to the distance between the first metal layer 121 and the surface of the package 13 facing away from the first metal layer 121, which is also the thickness of the package 13 on the side of the first metal layer 121 facing away from the insulating base plate 120 and the depth of the window C of the package 13. In this structural example, the first terminal 111 can be a copper block, which fills the window C and is flush with the surface of the package 13.

[0079] Figure 4b Another power module 1 structure is illustrated, and... Figure 4a The difference is that the wiring terminal M is lower than the top surface of power module 1. For example... Figure 4b As shown, along direction A3, the thickness of the first terminal 111 is equal to the distance between the first metal layer 121 and the surface of the package 13 facing away from the first metal layer 121, and is less than the depth of the window C of the package 13. The wiring terminal face M is lower than the top surface of the power module 1. When the first segment 31 of the adapter 3 extends along the top surface of the power module 1 to the first terminal 111, it has a recessed structure G. That is, the first segment 31 of the adapter 3 protrudes towards the power module 1 at this point to form a recessed structure G, and the adapter 3 is connected to the wiring terminal face M through the recessed structure G to realize the connection between the adapter 3 and the first terminal 111. As a structural example, part of the structure of the first segment 31 of the adapter 3 can be formed by bending, sheet metal, stamping and other processes to form a structure protruding towards the power module 1. This structure is the recessed structure G. The area of ​​the recessed structure G is smaller than the diameter of the window C.

[0080] Combination Figure 3 as well as Figure 4a and Figure 4b As shown, the first terminal 111 and the second terminal 112 are ports of the power module 1 for connecting to a DC circuit. The first terminal 111 and the second terminal 112 are metal parts with good conductivity to achieve a good electrical connection effect. In some embodiments, the first terminal 111 and the first metal layer 121 of the substrate 12 are an integral structure, or a portion of the first metal layer 121 can be used as a window C for the first terminal 111 to expose the package 13.

[0081] like Figure 5The example power module 1 includes a plurality of first terminals 111, each of which protrudes from the top surface of the power module 1 for connection to a capacitor module 2 via an adapter 3. Each first terminal 111 may be connected to the capacitor module 2 via a corresponding adapter 3, or two or more first terminals 111 may be connected to the capacitor module 2 via the same adapter 3. In one embodiment, at least two first terminals 111 are connected to the same adapter 3, which can reduce the number of components and optimize electrical performance.

[0082] In one embodiment, the power module 1 includes a plurality of first terminals 111, which are symmetrically distributed along an axis of symmetry parallel to a first direction A1. When the plurality of first terminals 111 are connected to the capacitor module 2 through the same adapter 3, the symmetrical distribution of the plurality of first terminals 111 can maintain a balanced connection stress when connecting to the adapter 3, which is beneficial to the overall structural stability and connection reliability of the power module 1. Figure 5 The example power module 1 includes two first terminals 111, the wiring end faces M of which are spaced apart along the second direction A2 and connected to the same adapter 3.

[0083] Based on the above-described structural examples, in the power conversion device provided in this application, the adapter 3 and the wiring terminals B of the power module 1 are stacked at intervals along a third direction A3, and there is structural obstruction between the adapter 3 and the wiring terminals B along the third direction A3. When connecting the power module 1 to the capacitor module 2, the wiring terminals B can be connected to one electrical connection terminal 21 of the capacitor module 2 first, and then the adapter 3 can be connected between the wiring terminal M of the power module 1 and the other electrical connection terminal 21 of the capacitor module 2. In this implementation, there are requirements for the sequence of connection operations, and it is necessary to avoid the adapter 3 affecting the connection between the wiring terminals B and the electrical connection terminals 21.

[0084] In one embodiment, such as Figure 6a As shown, in order to reduce the operational difficulty of connecting the power module 1 and the capacitor module 2 and reduce the requirements of the process implementation sequence, the adapter 3 includes a through hole K, which passes through the second segment 32 of the adapter 3 and is opposite to the wiring end B along the third direction A3.

[0085] Combination Figure 6bThe schematic cross-sectional view of the power module 1 and adapter 3 shows that the wiring end B can be observed through the through hole K from the top surface of the power module 1 along the third direction A3. The through hole K serves as a process window for connecting the wiring end B to the electrical connection terminal 21. During the connection operation of the power module 1 to the capacitor module 2, the first segment 31 of the adapter 3 can be connected to the wiring end face M of the power module 1, and the second segment 32 of the adapter 3 extends to the wiring end B, spaced apart along the third direction A3. The connection operation between the wiring end B and an electrical connection terminal 21 can be performed through the through hole K, and the adapter 3 will not affect the connection operation between the wiring end B and the electrical connection terminal 21. In other words, the two process steps of connecting the adapter 3 to the electrical connection terminal 21 of the capacitor module 2 and connecting the wiring end B to the electrical connection terminal 21 can be performed concurrently, optimizing the connection process between the power module 1 and the capacitor module 2 and improving process flexibility.

[0086] The power conversion device provided in this application embodiment has the second segment 32 of the adapter 3 and the terminal B stacked at intervals along the third direction A3. Reducing the spacing can reduce the parasitic inductance in the converter circuit. Simultaneously, the second segment 32 and the terminal B of the adapter 3 are used to connect positive and negative DC currents respectively, and they need to be kept insulated. The smaller the spacing between the second segment 32 and the terminal B, the smaller the area of ​​the converter circuit, and consequently, the smaller the parasitic inductance. However, the smaller the spacing between the second segment 32 and the terminal B, the worse the insulation effect between them. In the electrical connection structure design, lower parasitic inductance and better insulation characteristics have opposite requirements for the spacing between the second segment 32 and the terminal B.

[0087] To balance the need to reduce inductance and maintain insulation, such as Figure 7a As shown, the power conversion device also includes an insulating element 5, which is disposed between the adapter 3 and the terminal B to improve the insulation effect between the second segment 32 of the adapter 3 and the insulating terminal B. Specifically, the end of the insulating element 5 facing the power module 1 extends along the first direction A1 to the space between the top surface of the adapter 3 and the power module 1, and the end of the insulating element 5 away from the power module 1 extends along the thickness direction of the power module and at least partially covers the end of the terminal B away from the power module 1.

[0088] like Figure 7aAs shown, taking the structure of power module 1 as a reference, the second segment 32 and the terminal B of the adapter 3 are both exposed outside the encapsulation structure of power module 1. The insulating member 5 located between the second segment 32 and the terminal B can isolate the second segment 32 and the terminal B to achieve insulation. If the insulating member 5 is only distributed between the second segment 32 and the terminal B, that is, the insulating member 5 is distributed on the DC side of the encapsulation structure of power module 1, the creepage distance between the adapter 3 and the terminal B is the distance between the second segment 32 and the terminal B. In the power conversion device provided in the embodiments of this application, the insulating member 5 extends towards the side closer to power module 1 between the top surface of the adapter 3 and power module 1, and extends away from power module 1 to protrude from the terminal B. The creepage distances of the adapter 3 and the terminal B at both ends along the first direction A1 are greater than the distance between the second segment 32 and the terminal B, that is, the creepage distance between the adapter 3 and the terminal B is increased, which can improve the insulation between the two.

[0089] like Figure 7a As shown, the insulating member 5 extends away from the power module 1 to protrude from the wiring end B and at least partially covers the wiring end B away from the power module 1, which can increase the creepage distance between the two.

[0090] Please continue to refer to Figure 7a As shown, the first segment 31 of the adapter 3 is attached to the top surface of the power module 1. In order to meet the requirement that the insulating member 5 can extend to the top surface of the adapter 3 and the power module 1 on the side facing the terminal M, the adapter 3 also includes a protruding segment 33 connected between the first segment 31 and the second segment 32. The protruding segment 33 arches away from the power module 1 along the third direction A3, so that a gap appears between the adapter 3 at the position of the protruding segment 33 and the top surface of the power module 1. This gap communicates with the space on the DC side of the power module 1, so that it can communicate with the space between the terminal B and the second segment 32. The insulating member 5 between the terminal B and the second segment 32 can extend into the gap and be distributed between the protruding segment 33 and the top surface of the power module 1.

[0091] Combination Figure 7b The schematic diagram of the cross-sectional structure of the power module 1, the adapter 3, and the insulating component 5 shown is based on the through hole K of the adapter 3. In order to maintain the function of the through hole K as a connection window for connecting the terminal B, the insulating component 5 includes a connecting hole T opposite to the through hole K along the thickness direction of the power module 1. The connecting hole T can connect the through hole K and the terminal B, so that the terminal B is exposed through the connecting hole T and the through hole K.

[0092] Refer to together Figure 7a and Figure 7bAs shown, in one embodiment, the distance between the terminal B and the second segment 32 along the thickness direction of the power module 1 is 0.5-1.5mm. Alternatively, the height of the insulating part 5 between the terminal B and the second segment 32 can be considered to be 0.5-1.5mm. This range can balance low parasitic inductance and good insulation.

[0093] based on Figure 7a and Figure 7b The insulating component 5 shown is as follows: Figure 8 The diagram shows a partial structural schematic of a power conversion device. When the power module 1 and the capacitor module 2 are connected to their two electrical connection terminals 21, the insulating part 5 extends between the two electrical connection terminals 21, which can also increase the creepage distance between the wiring end B and the electrical connection terminal 21. Figure 8 As shown, the end of the insulating member 5 away from the power module 1 extends along the third direction A3 and protrudes from the surface of the wiring end B away from the second segment 32. It can maintain the insulation between the two electrical connection terminals 21 and also serve as a structural support between the two electrical connection terminals 21. When the two electrical connection terminals 21 are provided with insulating paper, the insulating member 5 can extend to contact the insulating paper.

[0094] like Figure 9a The diagram illustrates a partial structure of a power conversion device. The insulating element 5 between the terminal B and the adapter 3 includes a connecting hole T, resulting in a closer creepage distance between the second segment 32 of the adapter 3 and the terminal B at the connecting hole T. To maintain good insulation between the adapter 3 and the terminal B, in one embodiment, the insulating element 5 includes an annular retaining wall 52. The inner diameter of the annular retaining wall 52 surrounds the connecting hole T and extends into the through hole K along the thickness direction of the power module 1. The annular retaining wall 51 can increase the creepage distance between the adapter 3 and the terminal B at the connecting hole T, thereby improving the insulation between the adapter 3 and the terminal B.

[0095] Combination Figure 9b The schematic cross-sectional structure shown illustrates that, in one embodiment, the annular retaining wall 51 protrudes along the third direction A3 from the surface of the adapter 3 opposite to the wiring end B, further increasing the creepage distance between the adapter 3 and the wiring end B. When connecting the wiring end B and the electrical connection terminal 21 using the through hole K as the working window, the diameter of the inner surface of the annular retaining wall 51 needs to meet the requirements of the process operation.

[0096] In one embodiment, in a plane perpendicular to the thickness direction of the power module 1, the inner diameter of the annular baffle 51 is greater than or equal to 5 mm and less than or equal to 20 mm. Taking the annular baffle 51 as an example of a ring structure, the radial direction of the annular baffle 51 is any direction within the plane perpendicular to the thickness direction of the power module 1. The inner diameter of the annular baffle 51 may have multiple directions, and the radial dimension of the inner surface of the annular baffle 51 in any direction satisfies this dimensional requirement.

[0097] It should be understood that the shape of the annular retaining wall 51 can be circular, a regular polygon, an irregular polygon, or other irregular shapes, as long as the diameter area of ​​the annular retaining wall 51 can meet the processing requirements. The annular retaining wall 51 can enclose a space for process operation, which is defined by the inner surface of the annular retaining wall 51. The cross-sectional area of ​​the space enclosed by the inner surface of the annular retaining wall 51 perpendicular to the third direction A3 is the diameter area of ​​the annular retaining wall 51. In one embodiment, the diameter area of ​​the annular retaining wall 51 is greater than or equal to 5mm*5mm and less than or equal to 20mm*20mm.

[0098] In one embodiment, such as Figure 10a As shown, the insulating member 5 also includes two side walls 52, which are arranged opposite to each other along the second direction A2 on both sides of at least one of the adapter 3 and the terminal B. The side walls 52 are formed by the portion of the insulating member 5 located between the adapter 3 and the terminal B protruding outwards and extending along the third direction A3, increasing the creepage distance between the sides of the adapter 3 and the terminal B in the second direction A2, and improving the insulation between the adapter 3 and the terminal B. When the side walls 52 extend away from the capacitor module 2, they cover the side of the adapter 3 along the second direction A2. When the side walls 52 extend towards the capacitor module 2, they cover the side of the terminal B along the second direction A2.

[0099] Combination Figure 10b The partial structural cross-sectional view shown indicates that, along the third direction A3, the surface of the wiring end B facing the capacitor module 2 is used to connect to an electrical connection terminal 21 of the capacitor module 2. To avoid affecting the connection between the wiring end B and the electrical connection terminal 21, the side wall 52 is configured to extend away from the capacitor module 2 to cover the side of the adapter 3 along the second direction A2. In one embodiment, the side wall 52 protrudes from the surface of the adapter 3 away from the wiring end B, and the creepage distance between the adapter 3 and the wiring end B needs to bypass the side wall 52 to meet insulation requirements.

[0100] In one embodiment, the side baffle 52 extends along the first direction A1 toward the power module 1, such that the distance between the side baffle 52 and the terminal face M is less than the distance between the terminal B and the terminal face M. For example... Figure 10a and Figure 10bAs shown, one end of the side wall 52 along the first direction A1 is located on the top surface of the power module 1, which further increases the creepage distance between the adapter 3 and the wiring end B.

[0101] Based on the above structural example, in the power conversion device provided in this application embodiment, the power module 1 and the capacitor module 2 are connected on the DC side of the power module 1. The first terminal 111 of the power module 1 exemplarily has a top lead-out, and the second terminal 112 exemplarily has a DC lead-out. The wiring end face M of the first terminal 111 is connected to one electrical connection terminal 21 of the capacitor module 2 via an adapter 3. The wiring end B of the second terminal 112 is directly connected to the other electrical connection terminal 21 of the capacitor module 2. The adapter 3 is used to connect the second segment 32 of the electrical connection terminal 21 and the wiring end B in a stacked and spaced manner along a third direction A3. The small distance between the second segment 32 and the wiring end B can reduce the parasitic inductance in the circuit formed by the connection of the power module 1 and the capacitor module 2, thereby optimizing the switching performance of the power module 1, reducing the dynamic loss of power conversion, and improving the operating efficiency of power conversion. To facilitate the connection between the power module 1 and the capacitor module 2, a through hole K is provided in the second section 32 of the adapter 3 to form an operation window for the wiring terminal B. The connection between the wiring terminal B and the electrical connection terminal 21 of the capacitor module 2 can be performed through this through hole K, achieving single-process welding interconnection and reducing assembly and welding steps. An insulating component 5 is provided between the adapter 3 and the wiring terminal B to ensure insulation performance and reduce parasitic inductance. An annular barrier 51 and a side barrier 52 are designed for the insulating component 5 to increase the creepage distance between the adapter 3 and the second terminal 112, thereby improving the insulation effect.

[0102] like Figure 11 The power conversion device shown includes a power module 1, a capacitor module 2, and a heat sink 4. The connection between the power module 1 and the capacitor module 2 is similar to the structure shown in the previous embodiment, and will not be repeated here. The power module 1 and the capacitor module 2 are arranged along the thickness direction of the power module 1 and are spaced apart. The heat sink 4 is disposed in the gap between the power module 1 and the capacitor module 2, and the heat sink 4 is in contact with the bottom surface of the power module 1. The heat generated by the devices in the power module 1 can be transferred to the heat sink 4 for heat dissipation. The heat sink 4 can be a liquid-cooled heat sink or an air-cooled heat sink. The space between the heat sink 4 and the capacitor module 2 can, on the one hand, prevent the heat from the heat sink 4 from being transferred to the capacitor module 2 and affecting the function of the capacitor module 2, and on the other hand, provide space for the heat sink 4 to exchange heat with the external environment, maintaining a good heat dissipation effect.

[0103] In one embodiment, the substrate 12 in the power module 1 is as follows: Figure 4aWhen the second metal layer 122 is included, the power module 1 can be connected to the heat sink 4 through the second metal layer 122. The heat generated by the operation of the power semiconductor device 14 can be transferred to the second metal layer 122 through the first metal layer 121 and the insulating base plate 120, and then transferred to the heat sink 4 for heat dissipation through the second metal layer 122.

[0104] The power conversion device provided in this application embodiment is configured with multiple power modules 1 in some working scenarios. The DC terminal of each power module 1 is connected to a capacitor module 2. The power devices of each power module 1 are electrically connected to form a functional circuit and are powered by the capacitor module 2.

[0105] like Figure 12a The power conversion device shown includes three power modules 1 arranged along the second direction A2. Each power module 1 is electrically connected to a capacitor module 2 through the connection structure provided in the above embodiment. Specifically, a wiring end face M is formed by a wire emerging from the top of the first terminal 111 of each power module 1. The wiring end face M is connected to an electrical connection terminal 21 of the capacitor module 2 via an adapter 3. A wiring end B is formed by a wire emerging from the side of the second terminal 112 of each power module 1. The wiring end B is connected to another electrical connection terminal 21 of the capacitor module 2.

[0106] exist Figure 12a In the structure shown, the capacitor module 2 includes three sets of electrical connection terminals 21, each set including two electrical connection terminals 21 serving as positive and negative terminals respectively. The first terminal 111 of each power module 1 and the adapter 3 are respectively connected to one set of electrical connection terminals 21, and each power module 1 is connected to the capacitor module 2 through an independent set of electrical connection terminals 21. Each electrical connection terminal 21 is attached to the surface of the capacitor module 1, which facilitates structural miniaturization.

[0107] like Figure 12b The power conversion device 10 shown includes a capacitor module 2 with two electrical connection terminals 21 for structural simplification. One terminal 21 is connected to the first terminal 111 of multiple power modules 1, and the other terminal 21 is connected to the adapter 3 of the multiple power modules 1. It can be considered that the multiple power modules 1 are connected to the positive terminal of the capacitor module 2 through one terminal 21 and to the negative terminal through the other terminal 21, thus achieving DC parallel connection of the multiple power modules 1. This reduces the number of parts and simplifies the structure.

[0108] like Figure 12cIn another power conversion device 1 shown, each electrical connection terminal 21 of the capacitor module 2 includes a plurality of connection ends 211 spaced apart along the second direction A2. The plurality of connection ends 211 of one electrical connection terminal 21 are used to connect one-to-one with the wiring ends B of a plurality of power modules 1, and the plurality of connection ends 211 of another electrical connection terminal 21 are used to connect one-to-one with the second segment 32 of the adapter 3 to which the plurality of power modules 1 are connected. The plurality of power modules 1 are also connected to the positive terminal of the capacitor module 2 through one electrical connection terminal 21 and to the negative terminal of the capacitor module 2 through another electrical connection terminal 21. However, the part of each electrical connection terminal 21 used to connect to the power modules 1 is structurally decoupled for the plurality of power modules 1. That is, each electrical connection terminal 21 is connected to the plurality of power modules 1 through a plurality of relatively independent connection ends 211. The connection between each connection end 211 and the corresponding power module 1 is not affected by the connection of other connection ends 211, which can improve the connection reliability and stability. Among them, multiple connection terminals 211 extend along the third direction A2 to the DC side of the power module 1 to connect multiple power modules 1.

[0109] In one embodiment, such as Figure 12d As shown, the second segments 32 of multiple adapters 3 are connected along the second direction A2, so that the multiple adapters 3 are connected into a single structure, which can also simplify the structure and reduce the number of parts.

[0110] In one embodiment, such as Figure 12e As shown, the multiple insulating components 5 corresponding to the multiple power modules 1 can also be connected along the second direction A2, so that the multiple insulating components 5 are connected into a whole structure, simplifying the structure and reducing the number of parts.

[0111] As an example of an application scenario, the embodiments provided in this application... Figures 12a to 12e The power conversion device shown is part of the motor controller of an electric vehicle. The motor controller includes three power modules 1 to realize the conversion of three-phase electricity. The three power modules 1 can convert the DC power input from the capacitor module 2 into three-phase AC power to provide power to the motor.

[0112] In one embodiment, the power conversion device can be integrated through a packaged power module 1. Figures 12a to 12eThe three power modules 1 have the following functions. The power semiconductor devices 14 of the power module 1 are electrically connected to form three power conversion circuits. The DC terminals of these three power conversion circuits are connected in parallel, meaning they are connected to the capacitor module 2 through the same first terminal 111 and the same second terminal 112. Taking a power module 1 with one first terminal 111 and one second terminal 112 as an example, the DC input of the three power conversion circuits is connected to one of the first terminal 111 and the second terminal 112, and the DC output of the three power conversion circuits is connected to the other of the first terminal 111 and the second terminal 112. The first terminal 111 and the second terminal 112 are respectively connected to the two electrical connection terminals 21 of the capacitor module 2. It should be understood that in this power module 1, the multiple power devices corresponding to the three power conversion circuits are structurally encapsulated in one module. The DC sides of the three power conversion circuits are connected to the power supply through the same DC terminal, while the AC output terminals of the three power conversion circuits are independent, outputting three-phase AC power.

[0113] It should be understood that the power conversion device provided in this application embodiment can be applied not only to electric vehicle motor controllers, but also to on-board chargers, electric drive assemblies, charging piles, photovoltaic inverters and other power conversion scenarios for electric vehicles.

[0114] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0115] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device, characterized in that, The power conversion device includes a power module, an adapter, and a capacitor module; The power module includes a first terminal and a second terminal. The first terminal includes a wiring end face exposed on the top surface of the power module, and the second terminal includes a wiring end face exposed on the side surface of the power module. The wiring end face and the wiring end face are arranged along a first direction, which is perpendicular to the thickness direction of the power module. The adapter is disposed on one side of the top surface of the power module. The adapter includes a first segment and a second segment that are opposite to each other along the first direction. The first segment is connected to the wiring end face, and the second segment is arranged at intervals with the wiring end face along the thickness direction of the power module. The capacitor module includes two electrical connection terminals, one of which is used to connect to the wiring end, and the other of which is used to connect to the second segment.

2. The power conversion device as described in claim 1, characterized in that, The adapter includes a through hole that passes through the second segment and is opposite to the wiring end along the thickness direction of the power module.

3. The power conversion device as described in claim 2, characterized in that, The power conversion device includes an insulating component disposed between the second section and the wiring end, the insulating component including a through hole opposite to the through hole along the thickness direction of the power module; The insulating member extends along the first direction at one end facing the power module to between the adapter and the top surface of the power module, and the insulating member extends along the thickness direction of the power module at one end away from the power module to at least partially cover the end of the wiring terminal away from the power module.

4. The power conversion device as described in claim 3, characterized in that, The insulating component includes two side walls, which are arranged opposite each other on both sides of at least one of the adapter and the wiring end along a second direction, the second direction being perpendicular to the first direction and the thickness direction of the power module.

5. The power conversion device as described in claim 4, characterized in that, Along the thickness of the power module, the side wall protrudes from the surface of the adapter opposite to the wiring end; Along the first direction, the distance between the side retaining wall and the terminal face is less than the distance between the terminal end and the terminal face.

6. The power conversion device according to any one of claims 3-5, characterized in that, The insulating component includes an annular retaining wall, the inner diameter of which surrounds the communicating hole and extends into the through hole along the thickness direction of the power module.

7. The power conversion device as described in claim 6, characterized in that, Along the thickness direction of the power module, the annular retaining wall protrudes from the surface of the adapter opposite to the wiring end; In a plane perpendicular to the thickness direction of the power module, the inner diameter of the annular retaining wall is greater than or equal to 5 mm and less than or equal to 20 mm.

8. The power conversion device according to any one of claims 1-7, characterized in that, The power module includes a package and a substrate encapsulated by the package, and multiple power semiconductor devices. The plurality of power semiconductor devices, the first terminal and the second terminal are all electrically connected to the substrate, the first terminal forms the wiring terminal face on the surface opposite to the substrate, and the package includes a window for exposing the wiring terminal face.

9. The power conversion device as described in claim 8, characterized in that, Along the thickness direction of the power module, the terminal face is lower than the top surface of the power module; or, the terminal face is flush with the top surface of the power module.

10. The power conversion device according to any one of claims 1-9, characterized in that, Along the thickness direction of the power module, the distance between the wiring end and the second segment is 0.5-1.5mm.

11. The power conversion device according to any one of claims 1-10, characterized in that, The power module includes a plurality of first terminals, and at least two of the first terminals are connected to the same adapter.

12. The power conversion device as described in claim 11, characterized in that, The plurality of first terminals are symmetrically distributed and the axis of symmetry is parallel to the first direction.

13. The power conversion device according to any one of claims 1-12, characterized in that, The capacitor module is disposed on one side of the bottom surface of the power module along the thickness direction of the power module; Along the first direction, the second segment protrudes from the end of the wiring terminal away from the power module, one of the electrical connection terminals is bent toward the power module to connect the surface of the wiring terminal away from the second segment, and the other electrical connection terminal is bent away from the power module to connect the surface of the second segment toward the wiring terminal.

14. The power conversion device as described in claim 13, characterized in that, The power conversion device includes a plurality of power modules, which are spaced apart along a second direction, the second direction being perpendicular to the first direction and the thickness direction of the power modules. Each of the electrical connection terminals includes a plurality of electrical connection ends arranged at intervals along the second direction. The plurality of electrical connection ends of one electrical connection terminal are used to connect one-to-one with the wiring ends of the plurality of power modules, and the plurality of electrical connection ends of another electrical connection terminal are used to connect one-to-one with the second segment of the plurality of power modules.

15. The power conversion device as described in claim 14, characterized in that, The second segments of the plurality of power modules are connected along the second direction.

16. The power conversion device according to any one of claims 1-15, characterized in that, The power conversion device includes a heat sink, which is disposed between the power module and the capacitor module. The heat sink is in contact with the bottom surface of the power module and spaced apart from the capacitor module.

17. A powertrain, characterized in that, The powertrain includes a motor controller and a motor, wherein the motor controller is a power conversion device as described in any one of claims 1-16, the capacitor module is used to connect to a power source, and the power module is used to output AC power to drive the motor.

18. An electric vehicle, characterized in that, The electric vehicle includes wheels, a reducer, and a powertrain as described in claim 17, wherein the motor is connected to the wheels via the reducer.

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