Controller assembly
By using PIN soldering for fixation, double-bevel mechanical locking, sealant filling, and an aluminum lower shell design, the problems of connection reliability, sealing, and heat dissipation of traditional controllers are solved, resulting in a compact controller assembly suitable for modern electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-04-03
AI Technical Summary
Traditional controllers have shortcomings in terms of connection reliability, sealing, heat dissipation efficiency, and structural size. They are particularly prone to loosening in harsh environments, have insufficient heat dissipation, and are bulky, making them difficult to adapt to the integration requirements of modern electronic devices.
It adopts a design with PIN pin soldering, double-bevel mechanical locking, sealant filling, aluminum lower shell and heat dissipation boss, combined with irregular hole crimping and PCB heat dissipation adhesive, to achieve high reliability connection, good heat dissipation and sealing, and compact structure layout.
It achieves highly reliable connectivity, excellent heat dissipation and sealing, and has a compact structure, making it suitable for size and weight-sensitive applications such as automotive electronics and portable devices.
Smart Images
Figure CN121793293A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of controller technology, and in particular to a controller assembly. Background Technology
[0002] In traditional controller assembly, the connections between different components (such as connectors, housings, and PCBs) often suffer from problems such as low fitting precision, easy loosening, or complex assembly. Controllers need to have high sealing performance in harsh environments (such as humid and dusty environments). At the same time, high-power controllers generate a lot of heat when operating, and insufficient heat dissipation can lead to overheating and failure of PCB components.
[0003] Traditional screw or snap-fit connections are prone to loosening under strong vibration, leading to connection failure. Simple plug-in mating between connectors and PCBs can result in accumulated tolerances, causing poor contact or pin damage. Separate sealing rings may suffer from improper installation, aging, or cracking, leading to seal failure. Applying sealant individually results in inconsistent processes and can contaminate connector terminals. Traditional heat dissipation designs often have long heat conduction paths and high thermal resistance, resulting in insufficient contact between the heat sink and the heat source, causing heat buildup and performance degradation or even damage to the controller at high temperatures. To balance connection strength, heat dissipation, and sealing, traditional designs often require additional fixing components, heat sink fins, or seals, resulting in bulky products that are difficult to fit into the space requirements of highly integrated modern electronic devices.
[0004] In summary, existing controller assembly technologies have shortcomings in terms of connection reliability, sealing, heat dissipation efficiency, and structural dimensions. Summary of the Invention
[0005] The purpose of this invention is to overcome the shortcomings of the prior art by providing a controller assembly with high reliability, good heat dissipation and sealing, and good integration.
[0006] The objective of this invention can be achieved through the following technical solutions: This invention provides a controller assembly, comprising: an upper housing, a PCB circuit board, a lower housing, and a connector; The connector's pins are connected to the PCB circuit board; the upper shell is connected to the connector's beveled surface via two beveled surfaces, and the assembly gap between the upper shell and the connector is filled with sealant; the upper shell is connected to the holes on the PCB circuit board via pins; the upper shell and lower shell are pressed together via four pins of the upper shell and four irregular holes of the lower shell, and the assembly gap between the upper shell and the lower shell is filled with sealant; the lower shell has a heat dissipation surface, and thermal adhesive is applied between the heat dissipation surface of the lower shell and the PCB circuit board to enhance heat conduction.
[0007] Furthermore, the PIN pins are soldered to the PCB circuit board.
[0008] Furthermore, the inclined mating structure between the upper shell and the connector is a double-tapered surface structure.
[0009] Furthermore, the PIN pins are provided in 48 units.
[0010] Furthermore, the PIN pins are provided in four units.
[0011] Furthermore, the lower shell is made of aluminum with a wall thickness of 1.5mm. Its thermal conductivity is 217.7W / mK, achieving optimal heat dissipation.
[0012] Furthermore, the lower shell has three heat dissipation surfaces.
[0013] Furthermore, the PCB circuit board is mechanically fixed to the upper and lower shells via pins.
[0014] Furthermore, the controller assembly has a main label and an auxiliary label affixed to its exterior.
[0015] Furthermore, the heat dissipation surface of the lower shell is a heat dissipation protrusion, which is a platform-shaped or rib-shaped structure that protrudes towards the PCB circuit board.
[0016] Compared with the prior art, the present invention has the following advantages: (1) High-reliability connection. The connector and PCB are fixed by 48-pin soldering to ensure the stability of the electrical connection and the integrity of signal transmission; the upper shell and connector are mechanically locked by a double-bevel mating structure and filled with sealant, which combines connection strength and sealing. Through mechanical connection methods such as double-bevel mating structure (upper shell and connector) and PIN pin and irregular hole crimping, the precise positioning and stable assembly of each component are ensured, avoiding connection failure due to vibration or external force.
[0017] (2) Good heat dissipation and sealing. Sealant is filled at the connection between the upper shell and the connector, and in the assembly gap between the upper shell and the lower shell. A closed-loop sealant design effectively prevents external contaminants from entering, improving the product's environmental adaptability. An aluminum lower shell (thermal conductivity 217.7 W / m·K) combined with a heat dissipation boss design and PCB heat dissipation adhesive coating, along with the 1.5mm wall thickness of the lower shell and three heat dissipation surfaces, efficiently conducts heat, significantly improving overall heat dissipation performance.
[0018] (3) Good integration. The high integration of components is achieved through a compact structural layout (such as high-density multi-pin connection and irregular hole crimping), which reduces the overall volume while maintaining functional integrity. The compact structural layout enables the controller assembly to achieve multi-functional integration in a limited space, which is suitable for applications that are sensitive to size and weight (such as automotive electronics and portable devices). Attached Figure Description
[0019] Figure 1 This is an exploded view of the controller assembly; Figure 2 A schematic diagram showing the connection between the PCB circuit board and the connector; Figure 3 Bottom view and BB section view of the controller assembly; Figure 4 This is a magnified view of D (the assembly gap between the upper and lower shells). Figure 5 Enlarged view of E (assembly clearance between the upper and lower shells); Figure 6 Enlarged view of C (assembly clearance between the upper shell and the connector); Figure 7 This is a schematic diagram of the controller assembly.
[0020] Reference numerals: 1-Upper shell; 2-PCB circuit board; 3-Lower shell; 4-Connector; 5-Auxiliary label; 6-Main label; 7-PIN pin; 8-PIN pin. Detailed Implementation
[0021] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Component models, material names, connection structures, control methods, algorithms, and other features not explicitly described in this technical solution are considered common technical features disclosed in the prior art.
[0022] Example 1 This embodiment provides a controller assembly, such as Figure 1 , 2 As shown in Figures 7 and 8, the components include: an upper shell 1, a PCB circuit board 2, a lower shell 3, and a connector 4. The PIN pin 7 of the connector 4 is connected to the PCB circuit board 2; the upper shell 1 is connected to the connector 4 via two beveled surfaces, and the assembly gap between the upper shell 1 and the connector 4 is filled with sealant, such as... Figure 3 , 6 As shown; the upper shell 1 is connected to the hole on the PCB circuit board 2 via a PIN pin 8; the upper shell 1 and the lower shell 3 are pressed together via four pins of the upper shell 1 and four irregular holes of the lower shell 3, and the assembly gap between the upper shell 1 and the lower shell 3 is filled with sealant, such as... Figure 3 , 4 As shown in Figures 5 and 6; the lower shell 3 is provided with a heat dissipation surface, and thermal adhesive is applied between the heat dissipation surface of the lower shell 3 and the PCB circuit board 2 to enhance heat conduction.
[0023] Example 2 This embodiment provides a controller assembly, such as Figure 1 , 2 As shown in Figures 7 and 8, the components include: an upper shell 1, a PCB circuit board 2, a lower shell 3, and a connector 4. The PIN pins 7 of the connector 4 are connected to the PCB circuit board 2; the upper shell 1 is connected to the connector 4 via two bevels, and the assembly gap between the upper shell 1 and the connector 4 is filled with sealant; the upper shell 1 is connected to the hole on the PCB circuit board 2 via PIN pins 8; the upper shell 1 and the lower shell 3 are pressed together via four pins of the upper shell 1 and four irregular holes of the lower shell 3, and the assembly gap between the upper shell 1 and the lower shell 3 is filled with sealant; the lower shell 3 is provided with a heat dissipation surface, and heat dissipation adhesive is applied between the heat dissipation surface of the lower shell 3 and the PCB circuit board 2 to enhance heat conduction.
[0024] In a specific embodiment, the PIN pin 7 is soldered to the PCB circuit board 2.
[0025] In a specific embodiment, the inclined mating structure between the upper shell 1 and the connector 4 is a double-tapered surface structure.
[0026] In a specific embodiment, the PIN pins 7 are provided with 48 pins.
[0027] In a specific embodiment, there are four PIN pins 8.
[0028] In a specific embodiment, the lower shell 3 is made of aluminum with a wall thickness of 1.5 mm. Its thermal conductivity is 217.7 W / mK, achieving optimal heat dissipation.
[0029] In a specific embodiment, the lower shell 3 has three heat dissipation surfaces.
[0030] In a specific implementation, the PCB circuit board 2 is mechanically fixed to the upper shell 1 and the lower shell 3 through pins.
[0031] In a specific implementation, a main label 6 and an auxiliary label 5 are affixed to the outside of the controller assembly.
[0032] In a specific embodiment, the heat dissipation surface of the lower shell 3 is a heat dissipation protrusion, which is a platform-shaped or rib-shaped structure that protrudes towards the PCB circuit board 2.
[0033] Components not described in detail in this embodiment are all existing components that can be purchased through public channels.
[0034] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.
Claims
1. A controller assembly, characterized in that, include: Upper shell (1), PCB circuit board (2), lower shell (3), connector (4); The PIN pin (7) of the connector (4) is connected to the PCB circuit board (2); the upper shell (1) is connected to the connector (4) through two bevels, and the assembly gap between the upper shell (1) and the connector (4) is filled with sealant; the upper shell (1) is connected to the hole on the PCB circuit board (2) through the PIN pin (8); the upper shell (1) and the lower shell (3) are pressed together through the pin of the upper shell (1) and the irregular hole of the lower shell (3), and the assembly gap between the upper shell (1) and the lower shell (3) is filled with sealant; the lower shell (3) is provided with a heat dissipation surface, and heat dissipation adhesive is applied between the heat dissipation surface of the lower shell (3) and the PCB circuit board (2) to enhance heat conduction.
2. The controller assembly according to claim 1, characterized in that, The PIN pin (7) is soldered to the PCB circuit board (2).
3. A controller assembly according to claim 1, characterized in that, The inclined surface mating structure between the upper shell (1) and the connector (4) is a double-tapered surface structure.
4. A controller assembly according to claim 1, characterized in that, The PIN pins (7) are provided in 48 units.
5. A controller assembly according to claim 1, characterized in that, The PIN pin (8) has 4 pins.
6. A controller assembly according to claim 1, characterized in that, The lower shell (3) is made of aluminum and has a wall thickness of 1.5 mm.
7. A controller assembly according to claim 1, characterized in that, The lower shell (3) has three heat dissipation surfaces.
8. A controller assembly according to claim 1, characterized in that, The PCB circuit board (2) is mechanically fixed to the upper shell (1) and the lower shell (3) through pins.
9. A controller assembly according to claim 1, characterized in that, The controller assembly has a main label (6) and an auxiliary label (5) affixed to its exterior.
10. A controller assembly according to claim 1, characterized in that, The heat dissipation surface of the lower shell (3) is a heat dissipation protrusion, which is a platform-shaped or rib-shaped structure that protrudes towards the PCB circuit board (2).