Splash adhesion suppression device for laser processing machine, laser processing machine, and laser processing method

Abstract

The invention provides a splash adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method. This splash adhesion suppression device for a laser processing machine is provided with: a splash guard having a tip section that is inserted into a tube and that receives splash generated by irradiation of laser light onto the tube; an ejection unit that ejects a fluid toward the tip of the splash guard; and a discharge device that discharges a splash adhesion prevention agent toward the tip of the splash guard and the inner surface of the pipe.

Description

Technical Field

[0001] This invention relates to a spatter adhesion suppression device for laser processing machines, a laser processing machine, and a laser processing method. Background Technology

[0002] A technique is known for preventing molten metal chips from adhering to the inner surface of a tubular workpiece during laser processing.

[0003] As a related technology, Patent Document 1 discloses a molten metal chip removal mechanism in a laser processing apparatus. The molten metal chip removal mechanism described in Patent Document 1 includes a receiving member inserted into a tubular workpiece. During the cutting process of the tube, the receiving member catches the molten metal chips.

[0004] Patent Document 1: CD-ROM of Japanese Patent Application No. 3-88410 (Japanese Patent Application No. 5-39783) Summary of the Invention

[0005] The purpose of this invention is to provide a spatter adhesion suppression device, a laser processing machine, and a laser processing method for laser processing machines that can suppress the accumulation of spatter on a spatter protection component and effectively suppress spatter adhesion to the inner surface of the tube during laser processing of tubular workpieces.

[0006] The embodiments of the present invention relate to a spatter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method as shown below.

[0007] (1) A spatter adhesion suppression device for a laser processing machine, comprising: a spatter protection member having a top end portion into which a tube is inserted to receive spatter generated by irradiating the tube with a laser; a spraying part for spraying fluid onto the top end portion of the spatter protection member; and a spraying device for spraying a spatter adhesion inhibitor onto the top end portion of the spatter protection member and the inner surface of the tube. (2) A laser processing machine comprising: a support device, a support tube; a rotation drive device for rotating the tube about a first axis; a laser irradiation device having a laser head for irradiating the tube with laser light; a moving device for moving the laser head relative to the tube; a spatter adhesion suppression device; and a control device for controlling the rotation drive device, the laser irradiation device, the moving device, and the spatter adhesion suppression device, the spatter adhesion suppression device comprising: a spatter guard having a tip portion inserted into the tube from a first end of the tube for receiving spatter generated due to irradiation of the tube with laser light; a spatter guard moving device for moving the spatter guard; a spraying part for spraying fluid onto the tip portion of the spatter guard; and a spraying device for spraying a spatter adhesion inhibitor onto the tip portion of the spatter guard and the inner surface of the tube. (3) A laser processing method comprising: spraying a spatter adhesion inhibitor onto the top end of a spatter protector and the inner surface of a tube; irradiating the tube with a laser while the top end of the spatter protector is inserted into the tube; and blowing spatter generated by irradiating the tube with the laser from the top end of the spatter protector onto the inner surface of the tube, wherein the step of blowing away the spatter is performed by spraying fluid from the spraying part of the spatter protector onto the top end of the spatter protector.

[0008] According to the present invention, a laser processing machine, a laser processing method, and a laser processing machine are provided that can suppress the accumulation of spatter on a spatter guard and effectively suppress spatter adhesion to the inner surface of the tube during laser processing of a tubular workpiece. Attached Figure Description

[0009] Figure 1 It is a schematic cross-sectional view showing the spraying device spraying a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube. Figure 2 It is a schematic cross-sectional view illustrating the situation in laser processing where spatter is blown from the top of a spatter guard onto the inner surface of the tube. Figure 3 yes Figure 2 An enlarged view of the area enclosed by circle A3. Figure 4 This diagram schematically illustrates the situation where the first example of the spraying device sprays a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube. Figure 5 This diagram schematically illustrates the situation in laser processing where spatter is blown from the top of a spatter shield onto the inner surface of a tube. Figure 6 This diagram schematically illustrates the situation in laser processing where spatter is blown from the top of a spatter shield onto the inner surface of a tube. Figure 7 This diagram schematically illustrates the second example of the spraying device spraying a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube. Figure 8 This diagram schematically illustrates the situation in laser processing where spatter is blown from the top of a spatter shield onto the inner surface of a tube. Figure 9 This is a schematic cross-sectional view showing the splash guard connected to the connector via the first tube. Figure 10 This is a schematic cross-sectional view showing the second splash guard connected to a connector via an additional tube. Figure 11 It is a schematic three-dimensional diagram representing the pipe and splash guards. Figure 12 yes Figure 2 The cross-sectional view of arrow A2-A2 in the figure. Figure 13 It is a schematic three-dimensional diagram representing the pipe and splash guards. Figure 14 It is a schematic three-dimensional diagram representing the pipe and splash guards. Figure 15 yes Figure 1 The cross-sectional view of arrow A1-A1 in the figure. Figure 16 This is a schematic front view showing the spraying device spraying a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube. Figure 17 This is a schematic cross-sectional view of the jet section in a modified example. Figure 18 It is an enlarged representation Figure 16 A portion of the image. Figure 19 This is a schematic front view illustrating the situation in laser processing where spatter is blown from the top of a spatter shield onto the inner surface of a tube. Figure 20 This is a schematic front view illustrating the situation of spatter being drawn into the tube by a suction device during laser processing. Figure 21 This is a schematic front view illustrating the situation of spatter being drawn into the tube by a suction device during laser processing. Figure 22 This is a schematic front view showing the top of the protective part being cleaned by a cleaning device to remove splashes. Figure 23 This is a schematic diagram illustrating the spatter adhesion suppression device of the laser processing machine according to the second embodiment. Figure 24 This is a schematic diagram illustrating the spatter adhesion suppression device of the laser processing machine according to the second embodiment. Figure 25 It is a schematic cross-sectional view illustrating the situation in laser processing where spatter is blown from the top of a spatter guard onto the inner surface of the tube. Figure 26 This is a schematic diagram illustrating the spatter adhesion suppression device of the laser processing machine according to the third embodiment. Figure 27 This is a schematic diagram illustrating a spatter adhesion suppression device for a laser processing machine according to a first variation of the third embodiment. Figure 28 This is a schematic front view of the laser processing machine according to the fourth embodiment. Figure 29 It is a schematic cross-sectional view showing the spraying device spraying a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube. Figure 30 This is a schematic front view of the laser processing machine according to the fourth embodiment. Figure 31 This is a schematic front view of the laser processing machine according to the fourth embodiment. Figure 32 This diagram schematically illustrates a situation where a control device can control multiple controlled objects. Figure 33 This is a flowchart illustrating an example of the laser processing method according to the fifth embodiment. Detailed Implementation

[0010] The following description, with reference to the accompanying drawings, will explain the spatter adhesion suppression device 2, the laser processing machine 1, and the laser processing method of the embodiment. Furthermore, in the following description of the embodiment, parts and components with the same function will be given the same reference numerals, and repeated descriptions of parts and components with the same reference numerals will be omitted.

[0011] (Definition of the term) In this specification, the end of the tube P into which the splash guard 30 is inserted is defined as the first end Pa. Furthermore, the end of the tube P opposite to the first end Pa is defined as the second end Pb.

[0012] like Figure 9As illustrated, in this specification, the direction from the base end 30d of the splash guard 30 toward the top end 30e of the splash guard 30 is defined as the first direction DR1, and the direction from the top end 30e of the splash guard 30 toward the base end 30d of the splash guard 30 is defined as the second direction DR2.

[0013] In this specification, the direction in which the tip 31 of the splash guard 30 is inserted into the tube P is defined as the third direction DR3, and the direction opposite to the third direction DR3 is defined as the fourth direction DR4. Figure 16 In the recorded example, the third direction DR3 is the same direction as the direction from the first end Pa of pipe P toward the second end Pb of pipe P, and the fourth direction DR4 is the same direction as the direction from the second end Pb of pipe P toward the first end Pa of pipe P. Furthermore, in Figure 16 In the recorded example, the third direction DR3 is the same direction as the first direction DR1.

[0014] In this specification, the vertical upward direction is defined as the fifth direction DR5, and the vertical downward direction is defined as the sixth direction DR6.

[0015] (First Implementation) Reference Figures 1 to 22 The spatter adhesion suppression device 2A of the laser processing machine according to the first embodiment will be described. Figure 1 This is a schematic cross-sectional view showing the spraying device 3 spraying the anti-splash agent C1 onto the top part 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 2 This is a schematic cross-sectional view illustrating the situation in laser processing where spatter B is blown from the top end 31 of the spatter guard 30 onto the inner surface Pn of the tube P. Figure 3 yes Figure 2 An enlarged view of the area enclosed by circle A3. Figure 4 This diagram schematically illustrates the situation where the ejection device 3 of the first example ejects the anti-splash agent C1 to the top part 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 5 and Figure 6 This diagram schematically illustrates the situation in laser processing where spatter B is blown from the top end 31 of the spatter protector 30 onto the inner surface Pn of the tube P. Figure 7 This diagram schematically illustrates the situation where the ejection device 3 of the first example ejects the anti-splash agent C1 to the top part 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 8 This diagram schematically illustrates the situation in laser processing where spatter B is blown from the top end 31 of the spatter protector 30 onto the inner surface Pn of the tube P. Figure 9This is a schematic cross-sectional view showing the splash guard 30 connected to the connector 48 via the first tube 47a. Figure 10 This is a schematic cross-sectional view showing the second splash guard 30-2 connected to the connector 48 via another tube 47a-2. Figure 11 It is a schematic perspective view of the pipe P and the splash guard 30. Figure 12 yes Figure 2 The cross-sectional view of arrow A2-A2 in the figure. Figure 13 and Figure 14 It is a schematic perspective view of the pipe P and the splash guard 30. Figure 15 yes Figure 1 The cross-sectional view of arrow A1-A1 in the figure. Figure 16 This is a schematic front view showing the spraying device 3 spraying the anti-splash agent C1 onto the top part 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 17 This is a schematic cross-sectional view of the jet section 36 in a modified example. Figure 18 It is an enlarged representation Figure 16 A portion of the image. Figure 19 This is a schematic front view illustrating the situation in laser processing where spatter B is blown from the top end 31 of the spatter guard 30 onto the inner surface Pn of the tube P. Figure 20 and Figure 21 This is a schematic front view illustrating the situation of spatter in the suction tube P of the suction device 55 during laser processing. Figure 22 This is a schematic front view showing the top portion 31 of the splash guard 30 being cleaned by the cleaning device 57. Additionally, in Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 19 In the figure, multiple radial dashed lines represent the state of fluid D ejected from the jet section 36.

[0016] like Figure 1 As illustrated, the splatter adhesion suppression device 2A of the laser processing machine includes a splatter protection component 30, a spray section 36, and an ejection device 3.

[0017] like Figure 2 As illustrated, the splash guard 30 has a tip 31 for inserting the tube P. Figure 2 In the described example, the tip 31 of the spatter protector 30 receives spatter B generated by irradiating the tube P with laser LB. Spatter B is a metal block generated from the tube P by irradiating the tube P with laser LB. Figure 2In the described example, the splash guard 30 prevents the splash B (e.g., molten splash B) from adhering to the inner surface Pn of the pipe P by receiving the splash B (e.g., molten splash B).

[0018] In this specification, the cross-sectional shape of tube P in the plane perpendicular to the long side direction of tube P can be circular, rectangular (e.g., approximately square or approximately rectangular), or other shapes. In other words, tube P processed by laser LB (i.e., tube P as the object of processing) can be circular, rectangular, or other types of tubes.

[0019] exist Figure 2 In the documented example, the tip 31 of the splash guard 30 is inserted into the tube P. Figure 3 In the described example, the tip 31 of the spatter protector 30 is positioned on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB). Therefore, the tip 31 of the spatter protector 30 effectively prevents spatter B generated by irradiating the tube P with laser light from adhering to the inner surface Pn of the tube P (see reference). Figure 2 ).

[0020] like Figure 2 As illustrated, the jet section 36 jets fluid D toward the tip 31 of the splash guard 30. More specifically, the jet section 36 jets fluid D toward the tip 31 of the splash guard 30 to blow splashes B from the tip 31 of the splash guard 30 onto the inner surface Pn of the tube P. Fluid D is a blowing fluid for blowing away splashes B. Fluid D (in other words, the blowing fluid) may or may not contain a splash adhesion inhibitor C1.

[0021] exist Figure 1 In the described example, the spraying device 3 sprays a splash adhesion inhibitor C1 onto the tip 31 of the splash guard 30 and the inner surface Pn of the tube P. For example... Figure 1As illustrated, the spraying device 3 that sprays the anti-splash agent C1 onto the tip 31 of the splash guard 30 and the spraying device that sprays the anti-splash agent C1 onto the inner surface Pn of the pipe P can be the same device. Alternatively, the spraying device that sprays the anti-splash agent onto the tip 31 of the splash guard 30 can be a different device from the spraying device that sprays the anti-splash agent onto the inner surface Pn of the pipe P. The composition of the anti-splash agent C1 sprayed onto the tip 31 of the splash guard 30 can be the same as the composition of the anti-splash agent C1 sprayed onto the inner surface Pn of the pipe P. Alternatively, the composition of the anti-splash agent C1 sprayed onto the tip 31 of the splash guard 30 can be different from the composition of the anti-splash agent sprayed onto the inner surface Pn of the pipe P.

[0022] The splatter adhesion suppression device 2A for a laser processing machine according to the first embodiment includes a splatter protection member 30, which has a top end portion 31 of the insertion tube P (see reference). Figure 2 The top part 31 of the spatter protection component 30 prevents spatter B that flies out from tube P during laser processing from adhering to the inner surface Pn of tube P.

[0023] The first embodiment of the splatter adhesion suppression device 2A for a laser processing machine includes a jetting section 36, which jets fluid D (in other words, a blow-off fluid) toward the tip 31 of the splatter protection member 30 (see reference). Figure 2 The fluid D sprayed onto the tip 31 of the splash guard 30 blows the splash B away from the tip 31. This prevents the splash B from accumulating on the tip 31 of the splash guard 30. Consequently, it prevents the tip 31 from being unable to adequately catch the splash B due to the accumulation of splash B on the tip 31. Furthermore, it prevents a decrease in the adhesion prevention effect of the splash guard 30 in preventing splash B from adhering to the inner surface Pn of the pipe P due to the tip 31 not being able to adequately catch the splash B.

[0024] exist Figure 2 In the described example, the splash guard 30 catches the splash B at its tip 31. Therefore, the distance between the caught splash B and the tip 30e of the splash guard 30 is small. Therefore, the fluid D ejected from the spray section 36 can easily blow the splash B away from the splash guard 30.

[0025] The first embodiment of the laser processing machine's spatter adhesion suppression device 2A includes a spraying device 3 that sprays a spatter adhesion prevention agent C1 onto the top end 31 of the spatter protection member 30 and the inner surface Pn of the tube P (see reference). Figure 1 ).

[0026] Because the spatter adhesion inhibitor C1 is sprayed onto the tip 31 of the spatter protector 30, the spatter B that flies from the tube P during laser processing can be prevented from adhering to the tip 31 of the spatter protector 30. More specifically, although the spatter B that flies from the tube P is received by the tip 31 of the spatter protector 30, the spatter adhesion inhibitor C1 can be used to suppress the adhesion of the spatter B to the tip 31 caused by this reception. In order to suppress the adhesion of the spatter B to the tip 31 of the spatter protector 30, the fluid D sprayed from the spray section 36 can be used to easily blow the spatter B away from the tip 31 of the spatter protector 30 and out of the spatter protector 30.

[0027] exist Figure 2 In the described example, by applying the splash adhesion inhibitor C1 to the inner surface Pn of the pipe P, it is possible to suppress the adhesion of splashes B blown from the tip 31 of the splash guard 30 to the inner surface Pn of the pipe P. More specifically, although the splashes B blown from the tip 31 of the splash guard 30 are received by the inner surface Pn of the pipe P, the splash adhesion inhibitor C1 can be used to suppress the adhesion of splashes B to the inner surface Pn caused by this reception.

[0028] The splash guard 30 is a component that prevents splash B from reaching the inner surface Pn of the pipe P. Therefore, conventionally, the action of blowing splash B from the splash guard 30 onto the inner surface Pn of the pipe P is not performed. In this case, although the adhesion of splash B to the inner surface Pn of the pipe is prevented, the accumulation of splash B on the splash guard 30 cannot be avoided. Figure 1 and Figure 2 In the described example, a splash adhesion inhibitor C1 is sprayed onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P, and splash B is blown from the tip 31 of the splash guard 30 onto the inner surface Pn of the pipe P. In this way, both the accumulation of splash B on the splash guard 30 and the adhesion of splash B to the inner surface Pn of the pipe P can be suppressed.

[0029] (arbitrarily added structure) Next, refer to Figures 1 to 22 Any additional structures that can be used in the first embodiment (or the second, third, fourth or fifth embodiment described later) will be described.

[0030] (Splash Adhesion Inhibitor C1) In this specification, the anti-splash agent C1 is, for example, oil. The anti-splash agent C1 can also be sprayed in the form of oil air onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. For oil air, the oil is transported by air. In other words, for oil air, air functions as the transport fluid for the oil. When the anti-splash agent C1 is oil, it can be supplied at low cost. Furthermore, the anti-splash agent C1 is easy to handle. When the anti-splash agent C1 is sprayed in the form of oil air onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P, it is easy to apply oil to the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P over a wide range.

[0031] As the anti-splash agent C1 sprayed onto the tip 31 of the splash guard 30 and the inner surface Pn of the tube P, any known anti-splash agent may be used. The anti-splash agent C1 may also be a water-soluble anti-splash agent (e.g., an aqueous solution containing a water-soluble resin, water-soluble polymer, alcohol, and / or surfactant). The anti-splash agent C1 may also be a non-water-soluble anti-splash agent (e.g., an oil-based anti-splash agent). Oil-based anti-splash agents may also contain organic solvents and substances soluble in organic solvents. Furthermore, in this specification, the anti-splash agent C1 may be a liquid anti-splash agent or a powdered anti-splash agent. The liquid anti-splash agent C1 may or may not contain powder.

[0032] Alternatively, the anti-splash agent C1 sprayed onto the inner surface Pn of the tube P can be removed from the product during the cleaning process before shipment. This cleaning process can be omitted if there is no problem even if the anti-splash agent C1 adheres to the inner surface of the product made from the tube P.

[0033] (Jet section 36) exist Figure 1 In the described example, the ejection device 3 includes the aforementioned ejection section 36. Furthermore, the ejection section 36 can eject a splash adhesion inhibitor C1 (e.g., oil) onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. In this case, compared to a situation where the ejection section ejecting the splash adhesion inhibitor C1 and the ejection section 36 ejecting the fluid D (in other words, the fluid used to blow away splashes) are located in different places, the space occupied by the splash adhesion suppression device 2A is smaller. Furthermore, the manufacturing cost of the splash adhesion suppression device 2A can be reduced. Figure 1In the described example, the spray section 36 includes a spray hole 36h that sprays a mixed fluid D2 containing gas and a splash adhesion inhibitor C1 (e.g., oil).

[0034] (Ejection device 3) exist Figure 4 In the described example, the ejection device 3 includes a first flow channel 45a, which supplies a mixed fluid D2 containing gas and a splash adhesion inhibitor C1 to the ejection section 36 (more specifically, the ejection orifice 36h). Furthermore, the ejection device 3 is capable of ejecting this mixed fluid D2 from the ejection section 36 (more specifically, the ejection orifice 36h) onto the inner surface Pn of the pipe P. Figure 4 and Figure 5 In the recorded example, the jet section 36 is capable of ejecting the mixed fluid D2 (see reference). Figure 4 The jet section 36 is capable of jetting fluid D (in other words, the fluid used for blowing away) (see reference). Figure 5 In this case, compared to the situation where the jet section ejecting the mixed fluid D2 and the jet section 36 ejecting the fluid used to blow away splashes are located in different places, the space occupied by the splash adhesion suppression device 2A is relatively small. Figure 4 and Figure 5 In the described example, the injection orifice 36h for spraying the mixed fluid D2 is the same as the injection orifice 36h for spraying the fluid used to blow away splashes. Alternatively, the injection section 36 may also include the injection orifice 36h for spraying the mixed fluid D2, as well as other injection orifices for spraying the fluid used to blow away splashes.

[0035] exist Figure 4 In the described example, the ejection device 3 can adjust the proportion of the anti-splash agent C1 (e.g., oil) in the mixed fluid D2 ejected from the ejection section 36. In this case, the ejection device 3 can eject the mixed fluid D2 with a high content of anti-splash agent C1 to the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P (see reference). Figure 4 Furthermore, the ejection device 3 can use a fluid D with a low content of splash adhesion inhibitor C1 or a fluid D with a zero content of splash adhesion inhibitor C1 to blow splash B from the top end 31 of the splash guard 30 to the inner surface Pn of the tube P (see reference). Figure 5 or Figure 6 ).

[0036] exist Figure 4In the described example, the ejection device 3 has a mixer 41 that mixes gas D1 (e.g., air) with a splash adhesion inhibitor C1 (e.g., oil). The ejection device 3 adjusts the ratio of the flow rate of gas D1 (e.g., air) supplied to the mixer 41 to the flow rate of the splash adhesion inhibitor C1 (e.g., oil) supplied to the mixer 41, thereby adjusting the proportion of the splash adhesion inhibitor C1 (e.g., oil) in the fluid D ejected from the ejection section 36.

[0037] exist Figure 4 In the described example, the ejection device 3 includes an air source AS (e.g., an air compressor), a mixer 41, a container 42, a pump 43, an air supply pipe 44, and a first flow channel 45a. The air source AS can also supply air to structural components 12 of the laser processing machine other than the ejection device 3 (e.g., cylinder 12a, or actuator as a gripper moving device 66, described later).

[0038] Air source AS supplies air to mixer 41 via air supply pipe 44. Pump 43 supplies splash adhesion inhibitor C1 (e.g., oil) from container 42 to mixer 41. Mixer 41 mixes the air received from air source AS via air supply pipe 44 with splash adhesion inhibitor C1 (e.g., oil) received from container 42 to form a mixed fluid D2 containing splash adhesion inhibitor C1 (e.g., oil) and air. Furthermore, mixer 41 delivers the mixed fluid D2 to injection section 36 via first flow channel 45a. Alternatively, mixer 41 can also be a lubricator (explained later). In this case, pump 43 can be omitted. The lubricator can also be capable of adjusting the proportion of splash adhesion inhibitor C1 (e.g., oil) in the mixed fluid D2 injected from injection section 36.

[0039] exist Figure 4 and Figure 5 In the described example, the ejection device 3 can adjust the proportion of the splash adhesion inhibitor C1 (e.g., oil) in the mixed fluid D2 ejected from the ejection section 36 between a first proportion and a second proportion that is greater than zero and less than the first proportion.

[0040] Figure 4In the described example, with the splash adhesion inhibitor C1 (e.g., oil) comprising a first proportion in the mixed fluid D2 ejected from the spray section 36, the ejection device 3 ejects the mixed fluid D2 containing the splash adhesion inhibitor C1 (e.g., oil) from the spray section 36 toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. By ejecting the mixed fluid D2 containing the splash adhesion inhibitor C1 (e.g., oil) toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P in a first proportion, sufficient splash adhesion inhibitor C1 (e.g., oil) can be applied to the tip 31 and the inner surface Pn.

[0041] Figure 5 In the described example, when laser processing is performed on tube P, with the proportion of anti-splatter agent C1 (e.g., oil) in the mixed fluid D2 ejected from the ejection section 36 at a second ratio, the ejection device 3 ejects the mixed fluid D2 containing anti-splatter agent C1 (e.g., oil) from the ejection section 36 toward the tip 31 of the splatter protection member 30. By ejecting the mixed fluid D2 containing anti-splatter agent C1 (e.g., oil) toward the tip 31 of the splatter protection member 30 at the second ratio, the consumption of anti-splatter agent C1 (e.g., oil) can be suppressed, and the spatter B on the tip 31 of the splatter protection member 30 can be blown away from the tip 31.

[0042] Imagine a scenario where the splash B is recovered by the suction device 55, described later. Figure 5 In the described example, since the mixed fluid D2 contains a relatively small amount of anti-splash agent C1, the amount of anti-splash agent C1 recovered by the suction device 55 needs to be small. Therefore, the adverse effects of the anti-splash agent C1 (e.g., oil) on the suction device 55 are minimal, and the suction device 55 is less prone to malfunction. Furthermore, in Figure 5 In the recorded example, because a mixed fluid D2 containing a splash adhesion inhibitor C1 (e.g., oil) is additionally sprayed onto the inner surface Pn of pipe P, the adhesion of splash B to the inner surface Pn of pipe P can be suppressed more effectively.

[0043] like Figure 4 As illustrated, the ejection device 3 may also have a first on / off valve 49a and / or a first flow regulating valve 49b. Figure 4 In the described example, the first on / off valve 49a is disposed between the air source AS and the mixer 41 to open and close the flow channel between the air source AS and the mixer 41. The first flow regulating valve 49b regulates the flow rate of the air flowing in the flow channel between the air source AS and the mixer 41. Alternatively, the pump 43 may be able to regulate the flow rate of the splash adhesant C1 (e.g., oil) supplied from the container 42 to the mixer 41 based on instructions received from the control device 9.

[0044] exist Figure 4 and Figure 6 In the described example, the ejection device 3 is able to adjust the proportion of the splash adhesion inhibitor C1 (e.g., oil) in the fluid D ejected from the ejection section 36 between zero and a first proportion greater than zero.

[0045] Figure 4 In the described example, with the splash adhesion inhibitor C1 (e.g., oil) comprising a first proportion in the mixed fluid D2 ejected from the spray section 36, the ejection device 3 ejects the mixed fluid D2 containing the splash adhesion inhibitor C1 (e.g., oil) from the spray section 36 toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. By ejecting the mixed fluid D2 containing the splash adhesion inhibitor C1 (e.g., oil) toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P in a first proportion, sufficient splash adhesion inhibitor C1 (e.g., oil) can be applied to the tip 31 and the inner surface Pn.

[0046] Figure 6 In the described example, during laser processing of tube P, the ejection device 3 ejects fluid D from the ejection section 36 towards the tip 31 of the splash guard 30 when the proportion of the anti-splatter agent C1 (e.g., oil) in the fluid D ejected from the ejection section 36 is zero. By ejecting fluid D, which does not contain the anti-splatter agent C1, towards the tip 31 of the splash guard 30, the splashes B on the tip 31 of the splash guard 30 can be blown away from the tip 31 without consuming the anti-splatter agent C1.

[0047] Imagine a scenario where the splash B is recovered by the suction device 55, described later. Figure 6 In the described example, since the fluid D does not contain the anti-splash agent C1, the amount of anti-splash agent C1 recovered by the suction device 55 can be reduced. Therefore, the adverse effects of the anti-splash agent C1 (e.g., oil) on the suction device 55 can be minimized, and the suction device 55 is less prone to failure.

[0048] exist Figure 4 and Figure 6 (or Figure 7 and Figure 8 In the example described, the ejection device 3 can selectively execute a gas supply mode N2 in which only gas D1 (e.g., air) is supplied to the ejection section 36 (see reference). Figure 6 or Figure 8 ), and a mixed fluid supply mode N1 (refer to) supplying the injection section 36 with a mixed fluid D2 containing gas D1 (e.g., air) and a splash adhesion inhibitor C1 (e.g., oil). Figure 4 or Figure 7 ).

[0049] The ejection device 3 executes the mixed fluid supply mode N1 (refer to...) Figure 4 or Figure 7 This causes the spraying device 3 to spray a mixed fluid D2 containing gas D1 (e.g., air) and a splash adhesion inhibitor C1 (e.g., oil) onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. Furthermore, the spraying device 3 executes a gas supply mode N2 (see...) Figure 6 or Figure 8 This causes the splash B received by the top part 31 of the splash guard 30 to be blown from the top part 31 of the splash guard 30 to the inner surface Pn of the tube P.

[0050] exist Figure 7 In the described example, the ejection device 3 includes: a first flow channel 45a that supplies a mixed fluid D2 (e.g., oil-gas) containing gas D1 (e.g., air) and splash adhesion inhibitor C1 (e.g., oil) to the ejection section 36 (more specifically, the ejection orifice 36h); and a first supply device 46a (e.g., a mixer 41) that supplies the mixed fluid D2 (e.g., oil-gas) containing gas D1 (e.g., air) and splash adhesion inhibitor C1 (e.g., oil) to the first flow channel 45a. The first supply device 46a (e.g., the mixer 41) mixes gas D1 (e.g., air) received from a second supply device 46b (e.g., an air source AS) via an air supply pipe 44 with splash adhesion inhibitor C1 (e.g., oil) received from a container 42 to form a mixed fluid D2 containing gas D1 (e.g., air) and splash adhesion inhibitor C1 (e.g., oil).

[0051] exist Figure 7 In the described example, the dispensing device 3 (more specifically, the first supply device 46a) includes a refiller 41a. The refiller 41a mixes the anti-splash agent C1 (e.g., oil) with a gas (e.g., air). The refiller 41a is one type of mixer 41. The refiller 41a uses the pressure of gas D1 (more specifically, air) supplied from the second supply device 46b (e.g., air source AS) to remove the anti-splash agent C1 (e.g., oil) from the container 42 and mixes the removed anti-splash agent C1 (e.g., oil) with gas D1 (more specifically, air). Therefore, the pump for removing the anti-splash agent C1 from the container 42 can be omitted. Furthermore, in Figure 7 In the examples described, any known refueling device can be used as refueling device 41a.

[0052] Alternatively, mixer 41 can also mix the splash adhesion inhibitor C1, which is pumped from container 42, with gas supplied from a second supply device 46b (e.g., air source AS). Further alternatively, mixer 41 can also be configured as a connector that connects the supply line for the gas to the supply line for the splash adhesion inhibitor C1.

[0053] exist Figure 8 In the described example, the ejection device 3 includes a second flow channel 45b that supplies gas D1 (e.g., air) to the ejection section 36 (more specifically, the ejection orifice 36h). In addition, the ejection device 3 includes a second supply device 46b (e.g., an air source AS) that supplies gas D1 (e.g., air) to the second flow channel 45b.

[0054] like Figure 7 and Figure 8 As illustrated, a portion of the first flow channel 45a may also be shared with a portion of the second flow channel 45b. In other words, the ejection device 3 may also include a common flow channel 45c that functions as part of both the first flow channel 45a and the second flow channel 45b.

[0055] like Figure 7 As illustrated, the ejection device 3 may also include a first on / off valve 49a and a second on / off valve 49c. The first on / off valve 49a opens and closes the first flow channel 45a. The second on / off valve 49c opens and closes the second flow channel 45b. Figure 7 In the described example, the control device 9 opens the first on / off valve 49a and closes the second on / off valve 49c. By opening the first on / off valve 49a and closing the second on / off valve 49c, the first supply device 46a (e.g., a mixer 41 such as a fuel dispenser 41a) supplies a mixed fluid D2 containing gas D1 and a splash adhesion inhibitor C1 to the injection section 36. Furthermore, in Figure 8 In the described example, the control device 9 closes the first on / off valve 49a and opens the second on / off valve 49c. By closing the first on / off valve 49a and opening the second on / off valve 49c, the second supply device 46b (e.g., an air source AS such as an air compressor) supplies gas D1 to the injection unit 36.

[0056] exist Figure 7 In the documented example, the first on / off valve 49a is positioned between the air source AS and the mixer 41 (more specifically, the refueling device 41a). Alternatively, as... Figure 28 As illustrated, the first on / off valve 49a can also be configured between the mixer 41 (more specifically, the refueling nozzle 41a) and the injection unit 36. Figure 7In the documented examples, in the mixed fluid supply mode N1 (or Figure 28 In the splash adhesion inhibitor spraying mode M1 shown, the mixer 41 (more specifically, the refueling device 41a) forms a mixed fluid D2 by mixing gas D1 (e.g., air) with splash adhesion inhibitor C1 (e.g., oil) and supplies the mixed fluid D2 to the first flow channel 45a.

[0057] exist Figure 8 In the described example, the second on / off valve 49c is positioned between the air source AS and the injection unit 36. The second on / off valve 49c can also be positioned between the air source AS and the common flow path 45c. Figure 8 In the documented examples, in gas supply mode N2 (or Figure 30 In the first processing mode M2 ​​(described later), the second on / off valve 49c is opened, and air is supplied from the air source AS to the second flow channel 45b via the second on / off valve 49c.

[0058] The ejection device 3 may also have a second flow regulating valve 49d. The second flow regulating valve 49d regulates the flow rate of the air flowing in the second flow channel 45b.

[0059] exist Figure 7 In the described example, the ejection device 3 supplies a mixed fluid D2 containing gas D1 (e.g., air) and a splash adhesion inhibitor C1 (e.g., oil) to the ejection section 36. Furthermore, the ejection device 3 sprays this mixed fluid D2 from the ejection section 36 toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. By spraying the mixed fluid D2 toward the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P, the splash adhesion inhibitor C1 (e.g., oil) can be applied to the tip 31 and the inner surface Pn.

[0060] exist Figure 8 In the described example, during laser processing of tube P, the ejection device 3 supplies gas D1, which does not contain a spatter adhesion inhibitor, to the ejection section 36. Furthermore, the ejection device 3 ejects this gas D1 from the ejection section 36 toward the tip 31 of the spatter protection member 30. By ejecting gas D1, which does not contain a spatter adhesion inhibitor, toward the tip 31 of the spatter protection member 30, spatter B on the tip 31 of the spatter protection member 30 can be blown away from the tip 31 without consuming the spatter adhesion inhibitor.

[0061] exist Figure 4 or Figure 7In the described example, the ejection device 3 (more specifically, the ejection section 36) can simultaneously eject the spatter adhesion inhibitor C1 onto the tip 31 of the spatter protection member 30 and the inner surface Pn of the tube P. In this case, the time required to apply the spatter adhesion inhibitor C1 is relatively short, and the preparation time before laser processing is also relatively short.

[0062] exist Figure 1 In the described example, with the jetting section 36 located outside the tube P, the jetting device 3 can jet a mixed fluid D2 containing gas D1 and a spatter adhesion inhibitor C1 towards the inner surface Pn of the tube P. In this case, it is easy to apply the spatter adhesion inhibitor C1 to the end edge Pe on the fourth direction DR4 side of the inner surface Pn of the tube P. Furthermore, when the processing area of ​​the laser processing machine can be visually confirmed from the outside of the laser processing machine, the user can easily visually confirm the mixed fluid D2 (e.g., oil-gas) being jetted from the jetting section 36 toward the inner surface Pn of the tube P (see reference). Figure 16 ).

[0063] The ejection device 3 (more specifically, the ejection section 36) can also eject an oil vapor containing oil and air onto the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. By using air to transport the oil, it is easy to apply oil to the inner surface Pn of the pipe P.

[0064] like Figure 1 As illustrated, a portion of the splash adhesion inhibitor C1 ejected from the spray section 36 can also be dispersed outside the tube P.

[0065] exist Figure 1 In the described example, the spray section 36 can spray a splash adhesion inhibitor C1 (e.g., oil) onto the upper surface 31u of the tip portion 31 of the splash guard 30. In this case, when the splash B is received by the upper surface 31u of the tip portion 31, it is possible to prevent the splash B from adhering to the upper surface 31u (see reference). Figure 2 ).

[0066] exist Figure 2 In the described example, the jet section 36 forms a fluid flow of fluid D along the upper surface 31u of the tip portion 31 of the splash guard 30. Figure 2 In the example described, the jet section 36 has a jet hole 36h.

[0067] The spray nozzle 36h can also be configured at approximately the same height as the upper surface 31u of the top portion 31 of the splash guard 30. Alternatively, the height of the spray nozzle 36h can be intentionally higher than the height of the upper surface 31u of the top portion 31 of the splash guard 30.

[0068] exist Figure 2In the described example, the extension direction of the jet orifice 36h is approximately parallel to the long side direction of the splash guard 30. Alternatively, the extension direction of the jet orifice 36h may also be inclined relative to the long side direction of the splash guard 30. Figure 2 In the example described, the number of injection holes 36h in the injection section 36 is one. Alternatively, the injection section 36 may have multiple injection holes 36h.

[0069] exist Figure 1 In the described example, the ejection device 3 has an ejection orifice 36h for ejecting the anti-splash agent C1 onto the top end 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 1 In the described example, the upper end 360u of the outlet 360 of the injection hole 36h is located further to the second direction DR2 side than the lower end 360w of the outlet 360 of the injection hole 36h. In this case, the fluid containing the anti-splash agent C1 (e.g., a mixture of anti-splash agent C1 and gas D2) easily diffuses from the upper end 360u of the outlet 360 in an obliquely upward direction. Figure 1 As illustrated, a splash adhesion preventer C1, which diffuses obliquely upward from the upper end 360u of the outlet 360, can be appropriately applied to the inner surface Pn of the pipe P.

[0070] (Splash protection part 30) exist Figure 2 In the described example, the spray section 36 is disposed on the splash guard 30. When the spray section 36 is disposed on the splash guard 30, the space occupied by the splash adhesion suppression device 2A is smaller compared to the case where the spray section 36 and the splash guard 30 are disposed independently.

[0071] exist Figure 9 In the described example, the splash guard 30 has: a top portion 31; a middle portion 35, on which a spray portion 36 (more specifically, a spray hole 36h) is disposed; and a base portion 38, defining a fluid flow channel 38v communicating with the spray portion 36 (more specifically, the spray hole 36h). The top portion 31 is disposed further toward the first direction DR1 than the middle portion 35. Furthermore, the middle portion 35 is disposed further toward the first direction DR1 than the base portion 38.

[0072] exist Figure 9 In the described example, the cross-sectional area of ​​the flow channel of the injection hole 36h is smaller than the cross-sectional area of ​​the fluid flow channel 38v at the base end 38. In this case, the injection hole 36h can inject fluid at high speed toward the tip 31. It is also possible to configure the flow channel cross-sectional area to decrease stepwise or continuously from the fluid flow channel 38v at the base end 38 toward the injection hole 36h.

[0073] Alternatively, the splash guard 30 can be replaced with a second splash guard 30-2, which is of a different size. Figure 9 In the described example, the splatter adhesion suppression device 2A of the laser processing machine includes: a splatter protector 30; a first tube 47a (e.g., a rigid tube) supplying fluid to the fluid flow channel 38v of the splatter protector 30; and a second tube 47b (e.g., a flexible tube) connected to the first tube 47a via a connector 48. Figure 9 and Figure 10 In the described example, the first tube 47a can be detached from the connector 48, and the second splash guard 30-2 can be installed on the connector 48 through a tube 47a-2 different from the first tube 47a. The internal flow channel defined by the first tube 47a and the second tube 47b can also function as part of the aforementioned common flow channel 45c.

[0074] exist Figure 11 In the described example, the top portion 31 of the splash guard 30 has a bottom wall 321, a first side wall 323, and a second side wall 325 opposite to the first side wall 323. Figure 12 In the described example, the first sidewall 323 and the second sidewall 325 prevent the splash B that collides with the tip 31 of the splash guard 30 from spreading laterally across the first sidewall 323 or the second sidewall 325. In this way, the tip 31 of the splash guard 30 can properly receive the splash B.

[0075] exist Figure 11 In the described example, an elongated space SP1 extending in a first direction DR1 is defined by a bottom wall 321, a first side wall 323, and a second side wall 325. Furthermore, the elongated space SP1 is open above (in other words, an elongated opening OP exists above the elongated space SP1). Figure 13 In the described example, the spatter generated by irradiating the tube P with laser LB is contained in the elongated space SP1 through the elongated opening OP between the upper edge 323e of the first sidewall 323 and the upper edge 325e of the second sidewall 325.

[0076] exist Figure 14 In the described example, the jet section 36 (more specifically, the jet hole 36h) jets fluid D (e.g., air) into the elongated space SP1. The elongated space SP1 is surrounded by the bottom wall 321, the first side wall 323, and the second side wall 325 in three directions, so the fluid D jetted from the jet section 36 appropriately blows the splashes in the first direction DR1.

[0077] exist Figure 12In the described example, when viewed along the direction of the long side of the splash guard 30 (more specifically, when viewed along the direction of the second direction DR2), the inner surface 320n of the defined elongated space SP1 in the top portion 31 of the splash guard 30 has a generally U-shaped shape.

[0078] Viewed along the longitudinal direction of the splash guard 30 (more specifically, along the second direction DR2), the upper surface 321u of the bottom wall 321 may also have a generally arcuate shape. Viewed along the longitudinal direction of the splash guard 30 (more specifically, along the second direction DR2), the first side surface 323n of the first side wall 323 facing the elongated space SP1 may also have a generally straight shape. Viewed along the longitudinal direction of the splash guard 30 (more specifically, along the second direction DR2), the second side surface 325n of the second side wall 325 facing the elongated space SP1 may also have a generally straight shape.

[0079] exist Figure 12 In the described example, the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323 facing the elongated space SP1 are smoothly connected without corners. In this case, it is difficult for the splash B to adhere between the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323.

[0080] exist Figure 12 In the described example, the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325 facing the elongated space SP1 are smoothly connected without corners. In this case, the splash B is unlikely to adhere between the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325.

[0081] exist Figure 15 In the described example, the spray section 36 (more specifically, the spray hole 36h) is capable of simultaneously spraying the anti-splash agent C1 into the elongated space SP1 in a diffuse manner (more specifically, a mixture of anti-splash agent C1 and gas D2). This is done by simultaneously spraying the anti-splash agent C1 onto the upper surface 321u of the bottom wall 321, the first side surface 323n of the first side wall 323, and the second side surface 325n of the second side wall 325. Furthermore, the mixture D2 is, for example, an oil-gas mixture containing oil and air.

[0082] exist Figure 15In the described example, the spray section 36 (more specifically, the spray hole 36h) can diffusely spray a splash adhesion inhibitor C1 (more specifically, a mixed fluid D2 containing the splash adhesion inhibitor C1 and gas) into the elongated space SP1 to apply the splash adhesion inhibitor C1 to most of (more preferably, substantially the entirety of) the inner surface 320n of the defined elongated space SP1 in the top portion 31 of the splash guard 30. By applying the splash adhesion inhibitor C1 to most of the inner surface 320n of the defined elongated space SP1, the adhesion of splash B to the inner surface 320n can be appropriately suppressed.

[0083] exist Figure 15 In the described example, the spray section 36 (more specifically, the spray hole 36h) is able to diffusely spray the anti-splash agent C1 (more specifically, a mixture of fluid D2 containing anti-splash agent C1 and gas) into the elongated space SP1 in such a way that the anti-splash agent C1 passing through the elongated opening OP above the elongated space SP1 reaches the inner surface Pn of the tube P.

[0084] exist Figure 1 In the described example, the anti-splash agent C1, directed from the spray section 36 (more specifically, the spray hole 36h) toward the inner surface Pn of the pipe P, has a motion quantity component in the first direction DR1 and a motion quantity component in the fifth direction DR5. In this case, compared to the case where the anti-splash agent C1 only has a motion quantity component in the fifth direction DR5, the anti-splash agent C1 can be applied more extensively to the inner surface Pn of the pipe P.

[0085] exist Figure 15 In the described example, when viewed along the direction of the long side of the splash guard 30 (more specifically, when viewed along the direction of the second direction DR2), the spray hole 36h is located approximately at the center of the top portion 31 of the splash guard 30.

[0086] exist Figure 15 In the described example, viewed along the long side of the splash guard 30 (more specifically, along the second direction DR2), the spray hole 36h is positioned to overlap with the bottom of the elongated space SP1. In this case, fluid (e.g., air) is sprayed from the spray hole 36h towards the bottom of the elongated space SP1. Therefore, this fluid (e.g., air) is able to properly blow the splashes on the bottom wall 321 of the top portion 31 toward the first direction DR1.

[0087] Furthermore, the shape of the tip 31 of the splash guard 30 is not limited to... Figure 14 and Figure 15The shape shown. For example, the upper surface 31u of the top portion 31 of the splash guard 30 can also be a flat surface.

[0088] (Rotary drive device 63) exist Figure 16 In the described example, the spatter adhesion suppression device 2A of the laser processing machine includes a rotary drive device 63, which rotates the tube P about its long side central axis AT. Figure 16 In the described example, the rotary drive device 63 can rotate the pipe P about its long-side central axis AT (refer to arrow R1) while the spraying device 3 (more specifically, the spraying part 36) is spraying the anti-splash agent C1 towards the inner surface of the pipe P. In this case, the anti-splash agent C1 can be effectively applied throughout the entire circumference of the inner surface Pn of the pipe P (refer to...). Figure 15 (Arrow R1 in the image).

[0089] exist Figure 15 In the described example, the spray section 36 has a spray hole 36h capable of spraying the anti-splash agent C1 upwards from the splash guard 30. Figure 15 In the documented example, the spray nozzle 36h cannot spray the anti-splash agent C1 further downward than the splash guard 30. Alternatively, as... Figure 17 As illustrated, the spray section 36 may have, in addition to a spray hole 36h capable of spraying the anti-splash agent C1 upwards above the splash guard 30, an auxiliary spray hole 36j capable of spraying the anti-splash agent C1 downwards above the splash guard 30. Figure 17 In the described example, the spray section 36 can apply the anti-splash agent C1 to the entire circumference of the inner surface Pn of the stationary pipe P. In this case, when spraying the anti-splash agent C1 onto the inner surface Pn of the pipe P, it is not necessary to rotate the pipe P about its central axis in the long side direction.

[0090] (Splash protection moving device 51) exist Figure 16 In the described example, the splatter adhesion suppression device 2A of the laser processing machine includes a splatter protector moving device 51 that moves the splatter protector 30. The splatter protector moving device 51 may also have a first drive device 51a that moves the splatter protector 30 in a direction substantially parallel to the long side direction of the tube P (e.g., a third direction DR3 or a fourth direction DR4). Furthermore, the splatter protector moving device 51 may also have a second drive device 51b that moves the splatter protector 30 in a direction substantially parallel to the vertical direction (e.g., a fifth direction DR5 or a sixth direction DR6).

[0091] exist Figure 16 In the described example, the splash guard moving device 51 has a first slider 52a that holds the first tube 47a. The first drive device 51a moves the first slider 52a in a third direction DR3 (or a fourth direction DR4). When the first slider 52a moves in the third direction DR3 (or the fourth direction DR4), the first tube 47a and the splash guard 30 move together with the first slider 52a in the third direction DR3 (or the fourth direction DR4).

[0092] exist Figure 16 In the described example, the splash guard moving device 51 has a second slider 52b that supports the first slider 52a. The second drive device 51b moves the second slider 52b in the fifth direction DR5 (or the sixth direction DR6). When the second slider 52b moves in the fifth direction DR5 (or the sixth direction DR6), the first slider 52a, the first tube 47a, and the splash guard 30 move together with the second slider 52b in the fifth direction DR5 (or the sixth direction DR6).

[0093] exist Figure 18 and Figure 19 In the described example, the splash guard moving device 51 (more specifically, the first drive device 51a and the second drive device 51b) enables the splash guard 30 to move between a first position P1 and a second position P2. Figure 18 In the recorded example, when the splash guard 30 is in the first position P1, the splash guard 30 is entirely outside the pipe P. Figure 19 In the described example, when the splash guard 30 is in the second position P2, the top end 31 of the splash guard 30 is inserted into the tube P. Figure 18 and Figure 19 In the recorded example, the second position P2 is located further to the third direction DR3 than the first position P1. Furthermore, in Figure 18 and Figure 19 In the recorded example, the second position P2 is located above the first position P1 (more specifically, the second position P2 is slightly above the first position P1).

[0094] exist Figure 18 In the described example, with the splash guard 30 in the first position P1, a fluid containing a splash adhesion inhibitor C1 (e.g., a mixture of oil and air D2) is sprayed from the spray section 36 of the splash guard 30 toward the inner surface Pn of the pipe P. Figure 19In the described example, when the splash guard 30 is in the second position P2, the splash guard 30 receives splashes generated by irradiating the tube P with a laser. Furthermore, when the splash guard 30 is in the second position P2, a fluid D (e.g., a gas D1 such as air) is ejected from the ejection section 36 of the splash guard 30 toward the inner surface Pn of the tube P.

[0095] The spatter adhesion suppression device 2A of the laser processing machine may also have a guide roller 54 that guides the movement of the first tube 47a toward the third direction DR3. Figure 19 In the example described, the guide roller 54 is supported on the second slider 52b.

[0096] (Suction device 55) like Figure 20 As illustrated, the spatter adhesion suppression device 2A of the laser processing machine may also include an attraction device 55 for attracting spatter B. Figure 21 In the described example, the suction device 55 attracts the splash B to discharge it from the internal space SP2 of the tube P through the second end Pb of the tube P to the outside of the tube P. By discharging the splash B to the outside of the tube P, it is possible to prevent the splash B from adhering to the inner surface Pn of the tube P.

[0097] exist Figure 21 In the described example, the suction device 55 draws the splash-adhesion inhibitor C1 (e.g., oil) adhering to the inner surface Pn of the pipe P in a third direction DR3 (more specifically, toward the first chuck 61). Thus, the splash-adhesion inhibitor C1 applied to the inner surface of the first end Pa of the pipe P moves in a third direction DR3 (see reference). Figure 21 (The dashed arrow in the image). Therefore, the spraying device 3 does not need to spray the anti-splash agent C1 onto the entire inner surface Pn of the pipe P.

[0098] The suction device 55 cannot move the anti-splash agent C1 applied to the inner surface Pn of the pipe P in the fourth direction DR4. Therefore, it is preferable that the spraying device 3 sprays the anti-splash agent C1 onto the inner surface Pn of the first end Pa of the pipe P, which includes the end edge Pe on the fourth direction DR4 side of the pipe P. The anti-splash agent C1 applied to the end edge Pe on the fourth direction DR4 side of the inner surface Pn of the pipe P is moved from the end edge Pe to the third direction DR3 by the suction of the suction device 55.

[0099] (Cleaning device 57) like Figure 22As illustrated, the splatter adhesion suppression device 2A of the laser processing machine may also include a cleaning device 57 (e.g., a brush 57b) that removes splatter B adhering to the splatter protection member 30. In the first embodiment, a splatter adhesion inhibitor C1 is sprayed onto the tip 31 of the splatter protection member 30, and the splatter B on the tip 31 of the splatter protection member 30 is blown away by the fluid. Therefore, a large amount of splatter B will not accumulate on the tip 31 of the splatter protection member 30. On the other hand, it is conceivable that a small amount of splatter B may adhere to the tip 31 of the splatter protection member 30. Figure 22 In the described example, the splash B remaining on the tip 31 of the splash guard 30 is removed by the cleaning device 57 (e.g., brush 57b).

[0100] exist Figure 22 In the described example, the splash guard moving device 51 (more specifically, the first drive device 51a and the second drive device 51b) enables the splash guard 30 to move to a third position P3 where the tip 31 of the splash guard 30 contacts the cleaning device 57 (e.g., brush 57b). By moving the splash guard 30 through the splash guard moving device 51, the tip 31 of the splash guard 30 contacts the cleaning device 57 (e.g., brush 57b) and moves relative to it. Thus, the cleaning device 57 (e.g., brush 57b) removes the splashes B remaining on the tip 31 of the splash guard 30.

[0101] (Second Implementation) Reference Figures 23 to 25 The spatter adhesion suppression device 2B of the laser processing machine according to the second embodiment will be described. Figure 23 and Figure 24 This is a schematic diagram illustrating the spatter adhesion suppression device 2B of the laser processing machine according to the second embodiment. Figure 25 This is a schematic cross-sectional view illustrating the situation where spatter B is blown from the tip 31 of the spatter shield 30 onto the inner surface Pn of the tube P during laser processing. Additionally, in Figure 25 In the figure, multiple radial dashed lines represent the state of fluid D ejected from the jet section 36.

[0102] The spatter adhesion suppression device 2B of the laser processing machine in the second embodiment differs from the spatter adhesion suppression device 2A of the first embodiment in that the spraying device 3 for spraying the spatter adhesion inhibitor C1 to the top end 31 of the spatter protection member 30 and the inner surface Pn of the tube P is completely independent of the spatter protection member 30. In other aspects, the spatter adhesion suppression device 2B of the laser processing machine in the second embodiment is the same as the spatter adhesion suppression device 2A of the laser processing machine in the first embodiment.

[0103] In the second embodiment, the description focuses on the differences from the first embodiment. Furthermore, in the second embodiment, repetitive explanations of matters already described in the first embodiment are omitted. Therefore, even if not explicitly stated, matters already described in the first embodiment can certainly be applied to the second embodiment.

[0104] like Figures 23 to 25 As illustrated, the spatter adhesion suppression device 2B of the laser processing machine in the second embodiment includes: (1) a spatter guard 30 having a tip portion 31, the tip portion 31 being inserted into a tube P to receive spatter generated due to laser irradiation onto the tube P; (2) a spray portion 36 (more specifically, a spray orifice) for spraying fluid onto the tip portion 31 of the spatter guard 30; and (3) a spraying device 3 for spraying a spatter adhesion inhibitor C1 (see reference) onto the tip portion 31 of the spatter guard 30 and the inner surface Pn of the tube P. Figure 23 and Figure 24 ).

[0105] Therefore, the spatter adhesion suppression device 2B of the laser processing machine according to the second embodiment can achieve the same effect as the spatter adhesion suppression device 2A of the laser processing machine according to the first embodiment.

[0106] exist Figure 23 and Figure 24 In the described example, the ejection device 3 has a nozzle 301 that is separately disposed from the splash guard 30. For example... Figure 23 As illustrated, nozzle 301 applies a splash-preventing agent C1 to the inner surface Pn of tube P. Furthermore, as... Figure 24 As illustrated, the nozzle 301 applies a splash adhesion inhibitor C1 to the tip 31 of the splash guard 30.

[0107] The fluid ejected from nozzle 301 can also be a mixture of oil and air, D2. In this case, nozzle 301 sprays oil in a mist onto the tip 31 of the splash guard 30. Alternatively, nozzle 301 can also drip a splash adhesion inhibitor C1 (e.g., oil) onto the tip 31 of the splash guard 30.

[0108] exist Figure 23 and Figure 24 In the described example, nozzle 301 is tiltably supported on nozzle support 302. Nozzle 301 is capable of a first posture for spraying splash adhesant C1 onto the inner surface Pn of pipe P (see reference). Figure 23 ) and the second posture for spraying the anti-splash agent C1 onto the tip 31 of the splash guard 30 (see reference) Figure 24Change posture between (more specifically, tilt and move).

[0109] (Third implementation method) Reference Figure 26 and Figure 27 The spatter adhesion suppression device 2C of the laser processing machine according to the third embodiment will be described. Figure 26 This is a schematic diagram of the spatter adhesion suppression device 2C of the laser processing machine according to the third embodiment. Figure 27 This is a schematic diagram of a spatter adhesion suppression device 2C for a laser processing machine according to a first variation of the third embodiment.

[0110] like Figure 26 or Figure 27 As illustrated, the spatter adhesion suppression device 2C of the laser processing machine according to the third embodiment includes: a first ejection device 3a for ejecting a spatter adhesion inhibitor onto the tip 31 of the spatter protection member 30; and a second ejection device 3b for ejecting a spatter adhesion inhibitor onto the inner surface Pn of the tube P. The spatter adhesion suppression device 2C of the laser processing machine according to the third embodiment differs from the spatter adhesion suppression device 2A of the first embodiment and the spatter adhesion suppression device 2B of the laser processing machine according to the second embodiment in that the first ejection device 3a ejects the spatter adhesion inhibitor onto the tip 31 of the spatter protection member 30 and the second ejection device 3b ejects the spatter adhesion inhibitor onto the inner surface Pn of the tube P. In other aspects, the spatter adhesion suppression device 2C of the laser processing machine according to the third embodiment is the same as the spatter adhesion suppression device 2A of the first embodiment or the spatter adhesion suppression device 2B of the second embodiment.

[0111] exist Figure 26 In the described example, the second ejection device 3b includes a nozzle 301 disposed independently of the splash guard 30. The nozzle 301 ejects a splash adhesion inhibitor C1 onto the inner surface Pn of the pipe P. Figure 26 In the described example, the first ejection device 3a (more specifically, the ejection section 36 disposed on the splash guard 30) ejects the splash adhesion inhibitor C1 onto the tip 31 of the splash guard 30. Furthermore, when laser processing is performed on the tube P, the ejection section 36 can eject a fluid for blowing away splashes onto the tip 31 of the splash guard 30.

[0112] exist Figure 27 In the described example, the first ejection device 3a includes a nozzle 301 disposed independently of the splash guard 30. The nozzle 301 ejects a splash adhesion inhibitor C1 towards the tip 31 of the splash guard 30. Figure 27In the described example, the second ejection device 3b (more specifically, the ejection section 36 disposed on the spatter protection member 30) ejects the spatter adhesion prevention agent C1 onto the inner surface Pn of the tube P. Furthermore, when the tube P is laser-processed, the ejection section 36 can eject a fluid for blowing away spatter onto the tip 31 of the spatter protection member 30.

[0113] exist Figure 27 In the described example, the second ejection device 3b includes a first on / off valve 49a, which opens and closes a first flow channel 45a (more specifically, a first flow channel 45a that supplies the ejection section 36 with a mixed fluid D2 containing gas D1 and a splash adhesion inhibitor C1). Figure 27 In the described example, the first on / off valve 49a is positioned between the mixer 41 (more specifically, the refueling nozzle 41a) and the injection unit 36. For example... Figure 27 As illustrated, the first ejection device 3a may also include: a third flow channel 45e for supplying a mixed fluid D2 containing gas D1 and a splash adhesion inhibitor C1 to the nozzle 301; and a third on / off valve 49e for opening and closing the third flow channel 45e. Figure 27 In the documented example, the third on / off valve 49e is configured between the mixer 41 (more specifically, the refueling nozzle 41a) and the nozzle 301.

[0114] exist Figure 27 In the described example, the ejection device, which includes a first ejection device 3a and a second ejection device 3b, can simultaneously eject a splash adhesion inhibitor C1 (more specifically, a mixture of gas and splash adhesion inhibitor C1) to the tip 31 of the splash guard 30 and the inner surface Pn of the tube P.

[0115] (Fourth Implementation) Reference Figures 1 to 32 The laser processing machine 1 of the fourth embodiment will be described. Figure 28 This is a schematic front view of the laser processing machine 1 according to the fourth embodiment. Figure 29 This is a schematic cross-sectional view showing the spraying device 3 spraying the anti-splash agent C1 onto the top part 31 of the splash guard 30 and the inner surface Pn of the tube P. Figure 30 and Figure 31 This is a schematic front view of the laser processing machine 1 according to the fourth embodiment. Figure 32 This diagram schematically illustrates a situation where the control device 9 can control multiple controllable devices.

[0116] In the fourth embodiment, the description focuses on the differences from the first, second, and third embodiments. On the other hand, in the fourth embodiment, repeated descriptions of matters already described in the first, second, or third embodiments are omitted. Therefore, in the fourth embodiment, even if not explicitly stated, matters already described in the first, second, or third embodiments can be applied to the fourth embodiment. Conversely, all matters described in the fourth embodiment can be applied to the first, second, and third embodiments.

[0117] like Figure 28 As illustrated, the laser processing machine 1 of the fourth embodiment includes a support device 60, a rotary drive device 63, a laser irradiation device 70, a moving device 75, a spatter adhesion suppression device 2, and a control device 9.

[0118] Support device 60, support pipe P. In Figure 28 In the described example, the support device 60 includes a first chuck 61 having a clamping member 64 for clamping the tube P. Figure 28 In the described example, the clamping member 64 clamps the second end Pb of the tube P. The support device 60 may also have a second chuck 62 supporting the tube P. Figure 28 In the example described, the middle part Pm of the second chuck 62 support tube P.

[0119] The rotary drive 63 rotates the tube P about the first axis AX. The rotary drive 63 may also include a first rotary drive 63a that rotates the clamping member 64 about the first axis AX. In addition, the rotary drive 63 may also include a second rotary drive 63b that rotates a plurality of guide rollers 67 of the second chuck 62 about the first axis AX.

[0120] The laser irradiation device 70 has a laser head 71 that irradiates the laser LB into the tube P.

[0121] The moving device 75 causes the laser head 71 to move relative to the tube P. Figure 28 In the described example, the moving device 75 moves the laser head 71 relative to the support device 60 (more specifically, the first chuck 61 and the second chuck 62).

[0122] The splash adhesion suppression device 2 can be the splash adhesion suppression device 2A of the first embodiment, or the splash adhesion suppression device 2B of the second embodiment (see reference). Figure 23 ), or it could be the splash adhesion suppression device 2C of the third embodiment (see Figure 26 or Figure 27Other splash adhesion suppression devices may also be used. Since the splash adhesion suppression devices (2A, 2B, 2C) have already been described in the first to third embodiments, repeated descriptions of the splash adhesion suppression devices (2A, 2B, 2C) are omitted.

[0123] The splash adhesion suppression device 2 includes: (1) a splash guard 30 having a tip portion 31 inserted into the tube P from a first end Pa of the tube P to receive splashes generated by irradiating the tube P with a laser; (2) a splash guard moving device 51 for moving the splash guard 30; (3) a spraying part 36 for spraying fluid onto the tip portion 31 of the splash guard 30; and (4) a spraying device 3 for spraying a splash adhesion inhibitor C1 onto the tip portion 31 of the splash guard 30 and the inner surface Pn of the tube P. Since the splash guard 30, the splash guard moving device 51, the spraying part 36, and the spraying device 3 have already been described in the first to third embodiments, repeated descriptions of these structures are omitted.

[0124] The control device 9 controls the rotary drive device 63, the laser irradiation device 70, the moving device 75, and the splash adhesion suppression device 2.

[0125] The laser processing machine 1 of the fourth embodiment can achieve the same effect as the spatter adhesion suppression device 2A of the laser processing machine of the first embodiment, the spatter adhesion suppression device 2B of the laser processing machine of the second embodiment, or the spatter adhesion suppression device 2C of the laser processing machine of the third embodiment.

[0126] (arbitrarily added structure) Next, refer to Figures 1 to 32 Any additional structures that can be used in the fourth embodiment (or the first embodiment, the second embodiment, or the third embodiment described above) will be described.

[0127] (First cassette 61) exist Figure 28 In the described example, the first chuck 61 has: a clamping member 64 having a plurality of clamping claws 65; a clamping claw moving device 66; and a first rotary drive device 63a.

[0128] The clamping member 64 has a plurality of clamping jaws 65, including a first clamping jaw 65a and a second clamping jaw 65b. A clamping jaw moving device 66 is capable of moving the plurality of clamping jaws 65 toward the first axis AX and also capable of moving the plurality of clamping jaws 65 away from the first axis AX. More specifically, the clamping jaw moving device 66 moves the plurality of clamping jaws 65 between a clamping position in contact with the tube P and a release position after separation from the tube P.

[0129] The first rotary drive 63a causes the clamping member 64 (more specifically, a plurality of clamping jaws 65) to rotate about the first axis AX. Figure 28 In the recorded example, the first axis AX is essentially coaxial with the central axis AT of the long side of tube P.

[0130] (Second chuck 62) exist Figure 28 In the described example, the second chuck 62 has multiple guide rollers 67, a guide roller moving device 68, and a second rotary drive device 63b. Figure 28 In the recorded example, the second chuck 62 is positioned between the first chuck 61 and the laser head 71 in the direction along the first axis AX.

[0131] Multiple guide rollers 67 guide the movement of tube P in a direction parallel to the first axis AX. A guide roller moving device 68 is capable of moving the multiple guide rollers 67 towards the first axis AX and also capable of moving them away from the first axis AX. More specifically, the guide roller moving device 68 moves the multiple guide rollers 67 between a contact position with tube P and a separation position from tube P.

[0132] The second rotary drive device 63b causes multiple guide rollers 67 to rotate around the first axis AX.

[0133] (Mobile device 75) exist Figure 28 In the described example, the moving device 75 includes a first chuck moving device 76 that moves the first chuck 61. The first chuck moving device 76 moves the first chuck 61 in a direction substantially parallel to the first axis AX.

[0134] exist Figure 28 In the described example, the moving device 75 includes a laser head moving device 77 that moves the laser head 71. The laser head moving device 77 can also be a device capable of moving the laser head 71 in two dimensions along a plane substantially perpendicular to the first axis AX. The laser head moving device 77 can also be a device capable of moving the laser head 71 in three dimensions.

[0135] exist Figure 28 In the described example, the laser head moving device 77 includes a first linear motion device 77a that moves the laser head 71 along the vertical direction. For example... Figure 28 As illustrated, the laser head moving device 77 may also include a second linear motion device 77b that moves the laser head 71 along the first axis AX. Figure 28As illustrated, the laser head moving device 77 may also include a third linear motion device 77c that moves the laser head 71 along a direction perpendicular to both the vertical direction and the first axis AX. Furthermore, the laser head moving device 77 may also have a tilting motion device that tilts the laser head 71 about a horizontal axis.

[0136] (Laser irradiation device 70) exist Figure 28 In the described example, the laser irradiation device 70 has a laser head 71 that emits laser light. For example... Figure 12 As illustrated, the laser irradiation device 70 (more specifically, the laser head 71) may also have an auxiliary gas injection section 72 that injects auxiliary gas G onto the surface of the tube P.

[0137] exist Figure 12 In the described example, the laser irradiation device 70 simultaneously performs the emission of laser LB and the injection of auxiliary gas G. The auxiliary gas G can be either nitrogen or oxygen. Nitrogen, as the auxiliary gas G, is supplied to the surface of the tube P at a relatively high supply pressure. On the other hand, to suppress excessive oxidation, oxygen, as the auxiliary gas G, is supplied to the surface of the tube P at a relatively low supply pressure. When nitrogen is used as the auxiliary gas G, it is difficult to form an oxide coating at the cut or perforated portions of the tube P. On the other hand, when oxygen is used as the auxiliary gas G, it is possible to appropriately perform laser processing on tubes with larger plate thicknesses.

[0138] When nitrogen gas is injected onto the surface of tube P by the auxiliary gas injection unit 72, the tube material that has been vaporized or melted due to laser LB irradiation is removed from the laser irradiation area by the nitrogen gas. In this case, the spatter B generated from tube P is prone to become small particles. The small particles of spatter B generated from tube P move towards the tip 31 of the spatter protection member 30 due to the nitrogen gas and gravity, and are blown away from the tip 31 of the spatter protection member 30 by the fluid D injected from the injection unit 36.

[0139] When oxygen is injected onto the surface of pipe P by the auxiliary gas injection section 72, the pipe material melts due to the heat input to pipe P caused by laser LB irradiation and the heat of reaction caused by the chemical reaction between the pipe material and oxygen. In this case, the spatter B generated from pipe P tends to become large particles. The large spatter B generated from pipe P (e.g., large spatter B in a molten state) moves towards the tip 31 of the spatter guard 30 due to oxygen and gravity, and is blown away from the tip 31 of the spatter guard 30 by the fluid D injected from the injection section 36.

[0140] Alternatively, the laser irradiation device 70 may be able to switch the auxiliary gas G ejected from the auxiliary gas injection unit 72 between nitrogen and oxygen.

[0141] (Suction device 55) The laser processing machine 1 may also include an attraction device 55 for attracting the spatter B. Figure 21 In the described example, the suction device 55 attracts the splash B to discharge it from the internal space SP2 of the tube P through the second end Pb of the tube P to the outside of the tube P. By discharging the splash B to the outside of the tube P, it is possible to prevent the splash B from adhering to the inner surface Pn of the tube P.

[0142] like Figure 21 As illustrated, the splash suction port 56 of the suction device 55 can also be configured in the first chuck 61. Viewed along the third direction DR3, the splash suction port 56 can also be configured between the first gripping jaw 65a and the second gripping jaw 65b. Figure 21 In the described example, when the first chuck 61 clamps the second end Pb of the tube P, the splash suction port 56 is aligned with the opening of the second end Pb of the tube P. In other words, when the first chuck 61 performs the action of clamping the second end Pb of the tube P, the splash suction port 56 is automatically aligned with the opening of the second end Pb of the tube P.

[0143] (Control device 9) exist Figure 28 and Figure 30 In the recorded example, the control device 9 controls the rotary drive device 63 (more specifically, the first rotary drive device 63a and the second rotary drive device 63b), the laser irradiation device 70, the moving device 75 (more specifically, the first chuck moving device 76 and the laser head moving device 77) and the splash adhesion suppression device 2.

[0144] (Splash prevention agent spraying mode M1) exist Figure 28 In the described example, the control device 9 is capable of executing a splash adhesion inhibitor spraying mode M1, which sprays the splash adhesion inhibitor C1 onto the top end 31 of the splash guard 30 and the inner surface Pn of the tube P.

[0145] exist Figure 28 In the described example, the splash adhesion inhibitor spraying mode M1 includes sending control command E1 (more specifically, control command E1 of the first group) from the control device 9 to the splash adhesion suppression device 2 to spray splash adhesion inhibitor C1 onto the top end 31 of the splash guard 30 and the inner surface Pn of the tube P.

[0146] The splash adhesion inhibitor spraying mode M1 may also include sending a first movement command E1-1 from the control device 9 to the splash guard moving device 51 of the splash adhesion suppression device 2, so that the splash guard 30 moves to a first position P1. Figure 28In the described example, when the splash guard 30 is in the first position P1, the entire splash guard 30 is located outside the tube P. Preferably, when the splash guard 30 is in the first position P1, the end edge Pe on the fourth direction DR4 side of the inner surface Pn of the tube P can be extended from the spray portion 36 of the splash guard 30 towards the inner surface Pn of the tube P (see, if necessary). Figure 1 Spray splash adhesion preventer C1.

[0147] exist Figure 28 In the described example, the splash adhesion inhibitor spraying mode M1 includes sending a first spraying command E1-2 from the control device 9 to the splash adhesion suppression device 2 (more specifically, the spraying device 3) to spray a fluid (e.g., oil or gas) containing the splash adhesion inhibitor C1 from the spraying part 36 of the splash guard 30 located at the first position P1 to both the top part 31 of the splash guard 30 and the inner surface Pn of the pipe P.

[0148] Alternatively, the anti-splash agent spraying mode M1 may also include sending a first rotation command E1-3 from the control device 9 to the rotation drive device 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b) to rotate the tube P about the first axis AX. By simultaneously executing the spraying of the anti-splash agent C1 onto the inner surface Pn of the tube P and the rotation of the tube P about the first axis AX, the anti-splash agent C1 can be effectively applied throughout the entire circumference of the inner surface Pn of the tube P (see reference). Figure 15 (Arrow R1 in the image).

[0149] Alternatively or additionally, the anti-splash agent dispensing mode M1 may also include sending additional movement commands E1-4 from the control device 9 to at least one of the splash guard moving device 51 and the first chuck moving device 76, so as to move the spray portion 36 of the splash guard 30 relative to the tube P in a direction along the first axis AX. By executing the dispensing of the anti-splash agent C1 onto the inner surface Pn of the tube P and the relative movement of the spray portion 36 of the splash guard 30 relative to the tube P in a direction along the first axis AX, it is possible to apply the anti-splash agent C1 to the inner surface Pn of the tube P over a wider range (see reference). Figure 29 (Arrow AR1 in the image). Figure 29 As illustrated, when performing the splash adhesion inhibitor spraying mode M1, the spraying of a fluid (e.g., oil or gas) containing the splash adhesion inhibitor C1 from the spraying section 36, the rotation of the pipe P about the first axis AX, and the movement of the splash protection member 30 in the direction along the first axis AX can also be performed simultaneously.

[0150] (First processing mode M2) exist Figure 30In the described example, the control device 9 is capable of executing a first processing mode M2, in which laser LB is irradiated onto tube P while the tip 31 of the splash guard 30 is inserted into tube P. Figure 30 In the recorded example, when the first processing mode M2 ​​is executed, the top part 31 of the spatter protection member 30 is located on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB).

[0151] exist Figure 30 In the described example, the first processing mode M2 ​​includes sending control commands E2 (more specifically, the second set of control commands E2) from the control device 9 to at least the laser irradiation device 70 and the spatter adhesion suppression device 2 to perform irradiation of the laser LB from the laser head 71 onto the tube P, and blowing away the spatter B from the tip 31 of the spatter protector 30 onto the inner surface Pn of the tube P. Alternatively, the first processing mode M2 ​​may also include sending control commands E2 to the suction device 55 to suction the spatter B within the internal space SP2 of the tube P.

[0152] The first processing mode M2 ​​may also include a second movement command E2-1 sent from the control device 9 to the splash guard moving device 51 of the splash attachment suppression device 2, so as to move the splash guard 30 to the second position P2. When the splash guard 30 is in the second position P2, the top end 31 of the splash guard 30 is inserted into the tube P.

[0153] exist Figure 30 In the recorded example, the first processing mode M2 ​​includes: (1) sending a laser emission command E2-2 from the control device 9 to the laser irradiation device 70 to irradiate the laser LB from the laser head 71 to the tube P; and (2) sending a second spray command E2-3 from the control device 9 to the spatter adhesion suppression device 2 (more specifically, the ejection device 3) to spray fluid D (e.g., gas D1 such as air, or a mixed fluid D2 containing spatter adhesion inhibitor C1 and gas D1) from the spraying part 36 of the spatter protection member 30 located at the second position P2 to the top part 31 of the spatter protection member 30.

[0154] Additional information may be provided, such as Figure 30 As illustrated, the first processing mode M2 ​​may also include sending a second rotation command E2-4 from the control device 9 to the rotary drive device 63 (more specifically, the first rotary drive device 63a and the second rotary drive device 63b) to rotate the tube P about the first axis AX. In other words, in the first processing mode M2, the irradiation of the tube P by the laser LB, the rotation of the tube P about the first axis AX, and the spraying of fluid D (e.g., gas D1 such as air, or a mixed fluid D2 containing a splash adhesion inhibitor C1 and gas D1) onto the tip 31 of the splash guard 30 may be performed simultaneously.

[0155] Alternatives or additions include, for example Figure 30 As illustrated, the first processing mode M2 ​​may also include sending a third movement command E2-5 from the control device 9 to the moving device 75 (e.g., the first chuck moving device 76 and / or the laser head moving device 77) to move the laser head 71 relative to the tube P. In other words, in the first processing mode M2, the irradiation of the laser LB onto the tube P, the relative movement of the laser head 71 relative to the tube P, and the spraying of fluid D (e.g., gas D1 such as air, or a mixed fluid D2 containing a splash adhesion inhibitor C1 and gas D1) onto the tip 31 of the splash guard 30 may be performed simultaneously.

[0156] Alternatives or additions include, for example Figure 30 As illustrated, the first processing mode M2 ​​may also include sending a suction command E2-6 to the suction device 55 to suction the splash B from the internal space SP2 of the tube P. In other words, in the first processing mode M2, the irradiation of the tube P by the laser LB, the spraying of the fluid D (e.g., gas D1 such as air, or a mixed fluid D2 containing a splash adhesion inhibitor C1 and gas D1) to the tip 31 of the splash guard 30, and the suction of the splash B from the internal space SP2 of the tube P to the suction device 55 may also be performed simultaneously.

[0157] exist Figure 28 and Figure 30 In the described example, the control device 9 is capable of sequentially executing the anti-splash agent spraying mode M1 and the first processing mode M2. More specifically, the control device 9 executes the anti-splash agent spraying mode M1 and then executes the first processing mode M2.

[0158] (Second processing mode M3) exist Figure 31 In the described example, the control device 9 is capable of executing a second processing mode M3 where laser LB is irradiated onto tube P without inserting the tip 31 of the splash guard 30 into tube P. Figure 31 In the recorded example, when the second processing mode M3 is executed, the top part 31 of the splash guard 30 is positioned to retreat from the axis of the laser LB emitted by the laser head 71.

[0159] Alternatively, the control device 9 can sequentially execute the splash adhesion inhibitor spraying mode M1 and the second processing mode M3. In this case, the splash guard 30 is not inserted into the tube P. However, since the splash adhesion inhibitor is applied to the inner surface Pn of the tube P, the adhesion of splashes to the inner surface Pn of the tube P can be suppressed.

[0160] exist Figure 28 , Figure 30and Figure 31 In the described example, the control device 9 can selectively execute the splash adhesion preventer spraying mode M1, the first processing mode M2, and the second processing mode M3.

[0161] The control device 9 can be composed of one computer or multiple computers. For example... Figure 32 As illustrated, the control device 9 includes a hardware processor 90 (hereinafter referred to as "processor 90"), a memory 92, a communication circuit 94, and an input device 96 (e.g., a display 962 with a touch panel). The processor 90, memory 92, communication circuit 94, and input device 96 are interconnected via a bus 98. Data required for the processing of tube P (e.g., workpiece data 926 containing shape data and processing position data of tube P) can be input to the control device 9 via the input device 96, or it can be input from another computer via the communication circuit 94. Furthermore, the input device 96 is not limited to a display 962 with a touch panel. For example, the control device 9 may also include input devices 96 such as buttons, switches, joysticks, pointing devices, and keyboards, as well as a display that shows the data or other information input to the input device 96.

[0162] The control device 9 generates multiple control commands (e.g., the first set of control commands E1 and the second set of control commands E2 described above) by executing the machining program 922 stored in the memory 92. Furthermore, the communication circuit 94 sends the multiple control commands generated by the control device 9 to multiple controlled devices (e.g., the rotary drive device 63, the laser irradiation device 70, the moving device 75, the spatter adhesion suppression device 2, the gripper moving device 66, and the guide roller moving device 68, etc.). In this way, the control device 9 can control multiple controlled devices.

[0163] (Fifth Implementation) Reference Figures 1 to 33 The laser processing method of the implementation method will be described. Figure 33 This is a flowchart illustrating an example of the laser processing method according to the fifth embodiment.

[0164] The laser processing machine 1 used in the laser processing method of the fifth embodiment can be the laser processing machine 1 of the fourth embodiment, or it can be another laser processing machine. Since the structural components of the laser processing machine 1 have already been described in the first to fourth embodiments, repeated descriptions of the structural components of the laser processing machine 1 are omitted.

[0165] In the first step ST1, a splash adhesion inhibitor C1 is sprayed onto the top end 31 of the splash guard 30 and the inner surface Pn of the tube P. The first step ST1 is the splash adhesion inhibitor spraying process.

[0166] exist Figure 1 , Figure 4 , Figure 7 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 27 , Figure 28 , Figure 29 In the described example, the spraying of anti-splash agent C1 to the tip 31 of the anti-splash member 30 and the spraying of anti-splash agent C1 to the inner surface Pn of the tube P are performed simultaneously. On the other hand, in Figure 23 , Figure 24 , Figure 26 In the recorded examples, the spraying of the anti-splash agent C1 to the tip 31 of the splash guard 30 and the spraying of the anti-splash agent C1 to the inner surface Pn of the tube P were performed at different times.

[0167] like Figure 1 , Figure 4 , Figure 7 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 28 , Figure 29 As illustrated, the splash adhesion inhibitor spraying process (first step ST1) may also include spraying a fluid (e.g., an oil vapor containing oil and air) containing splash adhesion inhibitor C1 from the spraying portion 36 of the splash guard 30 to both the top end 31 of the splash guard 30 and the inner surface Pn of the pipe P. Figure 1 , Figure 4 , Figure 7 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 28 In the described example, the splash adhesion inhibitor spraying process (first step ST1) includes spraying a fluid (e.g., an oil-air mixture containing splash adhesion inhibitor C1) from a spray section 36 located outside the pipe P onto both the tip 31 of the splash guard 30 and the inner surface Pn of the pipe P. Alternatively or additionally, such as... Figure 29 As illustrated, the splash adhesion inhibitor spraying process (first step ST1) may also include spraying a fluid containing splash adhesion inhibitor C1 (e.g., oil vapor containing oil and air) from the spray section 36 located inside the pipe P to both the top end 31 of the splash guard 30 and the inner surface Pn of the pipe P.

[0168] like Figure 15 , Figure 16 , Figure 26 , Figure 28 , Figure 29 As illustrated, the splash adhesion inhibitor spraying process (first step ST1) may also include rotating the tube P about the central axis in the long side direction of the tube P while the splash adhesion inhibitor C1 is being sprayed (more specifically, while the splash adhesion inhibitor C1 is being sprayed from the spray section 36 or nozzle 301 of the splash guard 30).

[0169] In this case, splash adhesion inhibitor C1 can be effectively applied throughout the entire circumference of the inner surface Pn of pipe P.

[0170] exist Figure 15 , Figure 16 , Figure 28 , Figure 29 In the described example, the splash adhesion inhibitor spraying process (first step ST1) includes spraying a mixed fluid D2 containing gas and splash adhesion inhibitor C1 (e.g., oil gas containing oil and air) from the spraying part 36 of the splash protection member 30 onto the inner surface Pn of the pipe P while rotating the pipe P about the first axis AX.

[0171] like Figure 1 As illustrated, the splash adhesion inhibitor spraying process (first step ST1) may also include spraying the splash adhesion inhibitor C1 onto the end edge Pe of the inner surface Pn of the pipe P in the fourth direction DR4.

[0172] In the second step ST2, laser LB is irradiated onto tube P. Step ST2 is the laser irradiation process. By irradiating tube P with laser LB, tube P is processed. Alternatively, by irradiating tube P with laser LB, a through hole of any shape can be formed in tube P. Alternatively or additionally, by irradiating tube P with laser LB, a cut can be formed in tube P. Alternatively or additionally, by irradiating tube P with laser LB, tube P can be separated into a first tube and a second tube.

[0173] exist Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 12 , Figure 13 , Figure 14 , Figure 19 , Figure 20 , Figure 21 , Figure 25 , Figure 30 In the recorded example, the laser irradiation process (second step ST2) is performed with the tube P inserted into the top part 31 of the splash guard 30.

[0174] The laser irradiation process (in other words, irradiating tube P with laser LB inserted at the tip 31 of the spatter shield 30) and the rotation of tube P around the first axis AX can be performed simultaneously. Alternatively or additionally, the laser irradiation process (in other words, irradiating tube P with laser LB inserted at the tip 31 of the spatter shield 30) and the movement of tube P in the direction along the first axis AX can be performed simultaneously. Alternatively or additionally, the laser irradiation process (in other words, irradiating tube P with laser LB inserted at the tip 31 of the spatter shield 30) and the movement of the laser head 71 can be performed simultaneously.

[0175] Preferably, the spatter adhesion prevention agent spraying process (first step ST1) is performed before the laser irradiation process (second step ST2). The spatter adhesion prevention agent spraying process (first step ST1) and the laser irradiation process (second step ST2) can also be performed alternately. For example, the spatter adhesion prevention agent C1 can be sprayed onto the inner surface of the first portion of the tube P before laser processing. Furthermore, the spatter adhesion prevention agent C1 can be sprayed onto the inner surface of the second portion of the tube P after laser processing of the first portion and before laser processing of the second portion. Laser processing of the second portion of the tube P can then be performed thereafter.

[0176] By performing a laser irradiation process (second step ST2), spatter B is generated from tube P. This spatter B is received by the tip 31 of the spatter protector 30.

[0177] In the third step ST3, the spatter B generated by the laser LB irradiating tube P is blown from the top end 31 of the spatter protection member 30 to the inner surface Pn of tube P. The third step ST3 is the blowing process.

[0178] exist Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 12 , Figure 13 , Figure 14 , Figure 19 , Figure 20 , Figure 21 , Figure 25 , Figure 30 In the described example, the blowing-off process (in other words, the process of blowing off the splashes B) is performed by spraying fluid D (such as air or gas D1, or a mixture of fluid D2 containing splash adhesion inhibitor C1 and gas D1) from the spraying part 36 of the splash protector 30 to the top part 31 of the splash protector 30.

[0179] In the blow-off process (third step ST3), the type of fluid D ejected from the spray section 36 of the splash guard 30 may differ from the type of fluid D ejected from the spray section 36 of the splash guard 30 in the splash adhesion inhibitor ejection process (first step ST1). For example, in the blow-off process (third step ST3), the fluid D ejected from the spray section 36 of the splash guard 30 is a gas (e.g., air) that does not contain splash adhesion inhibitor, while in the splash adhesion inhibitor ejection process (first step ST1), the fluid D ejected from the spray section 36 of the splash guard 30 is a fluid (e.g., oil gas) containing splash adhesion inhibitor C1.

[0180] Alternatively or additionally, in the blow-off process (third step ST3), the proportion of the anti-splash agent C1 in the fluid D ejected from the spray section 36 of the splash guard 30 may be less than the proportion of the anti-splash agent C1 in the fluid D ejected from the spray section 36 of the splash guard 30 in the anti-splash agent ejection process (first step ST1).

[0181] In the blowing-off process (third step ST3), if the proportion of the anti-splash agent C1 in the fluid D ejected from the spray section 36 of the splash guard 30 is small or zero, the consumption of the anti-splash agent C1 can be minimized. Furthermore, if the splash B is recovered by the suction device 55, the amount of anti-splash agent C1 (e.g., oil) recovered by the suction device 55 can be minimized. Therefore, the adverse effects of the anti-splash agent C1 (e.g., oil) on the suction device 55 can be minimized, and the suction device 55 is less prone to malfunction.

[0182] Preferably, the blowing process (in other words, the fluid D is ejected from the ejection section 36 of the splash guard 30 to the tip 31 of the splash guard 30) is performed in parallel with the laser irradiation process (in other words, the laser LB is irradiated onto the tube P while the tip 31 of the splash guard 30 is inserted into the tube P).

[0183] Alternatively, during the laser irradiation process (in other words, irradiating the tube P with the tip 31 of the splash guard 30 inserted into the tube P), fluid D (e.g., gas D1 such as air, or a mixture D2 containing splash adhesion inhibitor C1 and gas D1) may be continuously sprayed from the spray section 36 of the splash guard 30 to the tip 31 of the splash guard 30. Alternatively, during the laser irradiation process (in other words, irradiating the tube P with the tip 31 of the splash guard 30 inserted into the tube P), fluid D (e.g., gas D1 such as air, or a mixture D2 containing splash adhesion inhibitor C1 and gas D1) may be intermittently sprayed from the spray section 36 of the splash guard 30 to the tip 31 of the splash guard 30.

[0184] The laser processing method of the fifth embodiment may also include an attraction step for attracting the spatter B. More specifically, as... Figure 21 As illustrated, in the fourth step ST4, the splash B is drawn from the internal space SP2 of the tube P by the suction device 55 (suction process). By discharging the splash B out of the tube P, it is possible to prevent the splash B from adhering to the inner surface Pn of the tube P.

[0185] exist Figure 21 In the recorded example, during the suction process (fourth step ST4), the suction device 55 suctions the splash B to discharge the splash B out of the pipe P via the second end Pb of the pipe P.

[0186] Preferably, the suction process (in other words, the suction device 55 suctions the splash B from the internal space SP2 of the pipe P) is performed in parallel with the blowing process (in other words, the fluid D is ejected from the spray section 36 of the splash guard 30 to the top section 31 of the splash guard 30). Figure 21 In the described example, the fluid D (e.g., gas D1 such as air, or a mixed fluid D2 containing a splash adhesion inhibitor C1 and gas D1) ejected from the spray section 36 of the splash guard 30 in parallel blows the splash B from the top part 31 of the splash guard 30 to the inner surface Pn of the tube P, and the splash B is attracted by the suction device 55 from the internal space SP2 of the tube P via the second end Pb of the tube P.

[0187] exist Figure 21 In the described example, the suction process (fourth step ST4) includes suctioning the splash B towards DR3 and suctioning the splash adhering agent C1 (e.g., oil) adhering to the inner surface Pn of the suction tube P towards DR3. In this case, the splash adhering agent C1 sprayed onto the inner surface of the first end Pa of tube P diffuses towards DR3 (see reference). Figure 21 (The dashed arrow in the middle).

[0188] Preferably, the suction process (fourth step ST4) is performed in parallel with the laser irradiation process (second step ST2). Alternatively, the suction process (fourth step ST4) can be started before the laser irradiation process (second step ST2). In this case, before the laser processing of tube P, the spatter adhesion inhibitor C1 sprayed onto the inner surface of the first end Pa of tube P diffuses to the third direction DR3.

[0189] In the laser processing method of the fifth embodiment, laser LB is irradiated onto tube P while the top end 31 of the spatter protection member 30 is inserted into tube P. Therefore, the top end 31 of the spatter protection member 30 receives the spatter B that flies out from tube P during laser processing, and it is possible to suppress the spatter B from adhering to the inner surface Pn of tube P.

[0190] In the laser processing method of the fifth embodiment, a spatter adhesion prevention agent C1 is sprayed onto the top end 31 of the spatter protection member 30 and the inner surface Pn of the tube P.

[0191] Because the spatter adhesion inhibitor C1 is sprayed onto the tip 31 of the spatter protector 30, the spatter B that flies off from tube P during laser processing of tube P can be prevented from adhering to the tip 31 of the spatter protector 30. More specifically, although the tip 31 of the spatter protector 30 receives the spatter B that flies off from tube P, the spatter adhesion inhibitor C1 can be used to suppress the adhesion of the spatter B to the tip 31 caused by this reception.

[0192] In the laser processing method of the fifth embodiment, the fluid D sprayed onto the tip 31 of the spatter protector 30 is used to blow the spatter B from the tip 31 of the spatter protector 30 onto the inner surface Pn of the tube P. Therefore, it is possible to suppress the accumulation of spatter B on the tip 31 of the spatter protector 30.

[0193] Furthermore, by applying the anti-splash agent C1 to the inner surface Pn of the pipe P, it is possible to suppress the adhesion of splashes B blown from the tip 31 of the splash guard 30 to the inner surface Pn of the pipe P. More specifically, although the splashes B blown from the tip 31 of the splash guard 30 are received by the inner surface Pn of the pipe P, the anti-splash agent C1 can be used to suppress the adhesion of splashes B to the inner surface Pn caused by this reception.

[0194] This invention is not limited to the embodiments or modifications described above. It is obvious that modifications or alterations can be made to the embodiments or modifications within the scope of the inventive concept. Furthermore, as long as no technical contradiction arises, the various techniques employed in the embodiments or modifications can also be applied to other embodiments or modifications. Moreover, any additional structures in the embodiments or modifications can be appropriately omitted. Explanation of reference numerals in the attached figures

[0195] 1 Laser processing machine; 2, 2A, 2B, 2C Spatter adhesion suppression device; 3 Ejection device; 3a First ejection device; 3b Second ejection device; 9 Control device; 12 Structural components of laser processing machine; 12a Cylinder; 30 Spatter protection component; 30-2 Second spatter protection component; 30d Base end; 30e Top end; 31 Top end portion; 31u Upper surface; 35 Middle portion; 36 Spraying portion; 36h Spray hole; 36j Auxiliary spray hole; 38 Base end portion; 38v Fluid flow channel; 41 Mixer; 41a Oiler; 42 Container; 43 Pump; 44 Air supply pipe; 45a First flow channel; 45b Second flow channel; 45c Common flow channel; 45e Third flow channel; 46a First supply device; 46b Second supply device; 47a First pipe; 47a-2 Pipe different from the first pipe; 47b Second tube, 48 Connector, 49a First on / off valve, 49b First flow regulating valve, 49c Second on / off valve, 49d Second flow regulating valve, 49e Third on / off valve, 51 Splash protection moving device, 51a First drive device, 51b Second drive device, 52a First slider, 52b Second slider, 54 Guide roller, 55 Suction device, 56 Splash suction port, 57 Cleaning device, 57b Brush, 60 Support device, 61 First chuck, 62 Second chuck, 63 Rotary drive device, 63a First rotary drive device, 63b Second rotary drive device, 64 Clamping member, 65 Clamping jaw, 65a First clamping jaw, 65b Second clamping jaw, 66 Clamping jaw moving device, 67 Guide roller, 68 Guide roller moving device, 70 Laser irradiation device, 71 Laser head, 72 Auxiliary gas injection section, 75 Moving device, 76 77 First chuck moving device, 77 Laser head moving device, 77a First linear motion device, 77b Second linear motion device, 77c Third linear motion device, 90 Hardware processor, 92 Memory, 94 Communication circuit, 96 Input device, 98 Bus, 301 Nozzle, 302 Nozzle support, 320n Inner surface, 321 Bottom wall, 321u Upper surface, 323 First side wall, 323e Upper edge, 323n First side, 325 Second side wall, 325e Upper edge, 325n Second side, 360 Exit, 360u Upper end, 360w Lower end, 922 Machining program, 926 Workpiece data, 962 Display with touch panel, AS Air source, AT Central axis of the long side of the tube, AX First axis, B Spatter, C1 Spatter adhesion inhibitor, D Fluid, D1 Gas, D2 Mixed fluid, DR1 First direction, DR2; Second direction, DR3; Third direction, DR4; Fourth direction, DR5; Fifth direction, DR6; Sixth direction, E1 control command.E1-1 First movement command, E1-2 First jet command, E1-3 First rotation command, E1-4 Movement command, E2 Control command, E2-1 Second movement command, E2-2 Laser emission command, E2-3 Second jet command, E2-4 Second rotation command, E2-5 Third movement command, E2-6 Suction command, G Assist gas, LB Laser, M1 Splash prevention agent ejection mode, M2 First processing mode, M3 Second processing mode, N1 Mixed fluid supply mode, N2 Gas supply mode, OP Opening, P Pipe, P1 First position, P2 Second position, P3 Third position, Pa First end, Pb Second end, Pe End edge of the inner surface of the pipe in the fourth direction, Pm Middle part, Pn Inner surface, SP1 Elongated space, SP2 Internal space.

Claims

1. A spatter adhesion suppression device for a laser processing machine, comprising: A splash protector having a top end that is inserted into a tube to receive splashes generated by laser irradiation onto the tube. The jetting section sprays fluid onto the tip portion of the splash guard; and The spraying device sprays a splash adhesion inhibitor onto the top part of the splash guard and the inner surface of the tube.

2. The spatter adhesion suppression device for a laser processing machine according to claim 1, wherein, The ejection device includes a first flow channel that supplies the ejection section with a mixed fluid containing gas and the splash adhesion inhibitor. The ejection device is capable of ejecting the mixed fluid from the injection section onto the inner surface of the tube.

3. The spatter adhesion suppression device for a laser processing machine according to claim 2, wherein, The ejection device can adjust the proportion of the anti-splash agent in the mixed fluid ejected from the ejector.

4. The spatter adhesion suppression device for a laser processing machine according to claim 2 or 3, wherein, The ejection device includes a second flow channel for supplying the gas to the ejection section.

5. The spatter adhesion suppression device for a laser processing machine according to claim 4, wherein, The ejection device includes: The first on / off valve opens and closes the first flow channel; and The second on / off valve opens and closes the second flow channel.

6. The spatter adhesion suppression device for a laser processing machine according to any one of claims 2 to 5, wherein, With the injection section located outside the tube, the ejection device is capable of ejecting the mixed fluid onto the inner surface of the tube.

7. The spatter adhesion suppression device for a laser processing machine according to claim 1, wherein, The ejection device can selectively perform a gas supply mode that supplies only gas to the ejector, and a mixed fluid supply mode that supplies the ejector with a mixed fluid containing the gas and the splash adhesion inhibitor.

8. The spatter adhesion suppression device for a laser processing machine according to any one of claims 2 to 7, wherein, The spraying device includes a refueling device that mixes the splash adhesion inhibitor with the gas.

9. The spatter adhesion suppression device for a laser processing machine according to any one of claims 1 to 8, wherein, The spray section is disposed on the splash protection component.

10. The spatter adhesion suppression device for a laser processing machine according to any one of claims 1 to 9, wherein, The top portion has a bottom wall, a first side wall, and a second side wall opposite to the first side wall. When the direction from the base of the splash guard toward the top of the splash guard is defined as a first direction, the bottom wall, the first side wall, and the second side wall define an elongated space extending in the first direction. The jetting section sprays the fluid into the elongated space.

11. A laser processing machine, comprising: Support device, support pipe; A rotary drive device causes the tube to rotate about a first axis; A laser irradiation device having a laser head that irradiates the tube with laser light; A moving device that moves the laser head relative to the tube; Splash adhesion suppression device; as well as The control device controls the rotation drive device, the laser irradiation device, the moving device, and the splash adhesion suppression device. The splash adhesion suppression device includes: A splash protector having a tip portion that is inserted into the tube from a first end of the tube to receive splashes generated by irradiating the tube with the laser. A device for moving the splash guard, which allows the splash guard to move; The jetting section sprays fluid onto the tip portion of the splash guard; and The spraying device sprays a splash adhesion inhibitor onto the top part of the splash guard and the inner surface of the tube.

12. The laser processing machine according to claim 11, wherein, The laser processing machine includes a suction device that attracts the spatter to discharge it from the interior space of the tube through a second end of the tube to the outside of the tube.

13. The laser processing machine according to claim 11 or 12, wherein, The control device is capable of executing a splash adhesion prevention agent spraying mode and a first processing mode. The splash adhesion inhibitor spraying mode includes sending a control command from the control device to at least the splash adhesion suppression device to spray the splash adhesion inhibitor onto the tip portion of the splash protection member and the inner surface of the tube. The first processing mode includes sending control commands from the control device to at least the laser irradiation device and the spatter adhesion suppression device to perform laser irradiation from the laser head to the tube and blowing away the spatter from the top of the spatter protector to the inner surface of the tube.

14. A laser processing method, comprising: The process of spraying a splash adhesion inhibitor onto the tip of the splash guard and the inner surface of the tube; The process of irradiating the tube with a laser while the tube is inserted into the tip of the splash guard; and The process of blowing spatter generated by irradiating the tube with the laser from the top of the spatter protector onto the inner surface of the tube. The process of blowing away the splashes is performed by spraying fluid from the spray section of the splash protector to the top of the splash protector.

15. The laser processing method according to claim 14, wherein, The process of spraying the anti-splashing agent includes rotating the tube about its central axis along its long side while the anti-splashing agent is being sprayed.

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