Camera module fixing device and electronic equipment

Abstract

The embodiment of the invention provides a camera module fixing device and electronic equipment, and relates to the technical field of electronic equipment. The camera module fixing device comprises a main board, the main board comprises a main board body, and the main board body is provided with a signal wire; at least part of the edge of the camera module setting area is surrounded by the mainboard body, the camera module setting area is not provided with signal wiring, and the camera module setting area comprises an occupying part and a first-shape camera window; the removable occupying part can enable the space originally occupied by the occupying part and the camera window in the first shape to be combined into a whole to form a camera window in a second shape; wherein the first-shape camera window is used for placing a first camera, and the second-shape camera window is used for placing a second camera. According to the arrangement mode, two types of mobile phones which are of the same type but are provided with different cameras can share various parts. The universal rate of parts between the two mobile phones is increased, and the cost of design and pilot production is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a camera module fixing device and an electronic device. BACKGROUND

[0002] In recent years, with the rapid development and rapid popularization of electronic devices, people's demand for electronic devices is increasing. Therefore, the photographing function of electronic devices is developing towards diversification and specialization. In order to meet the different shooting needs of different consumers, the same electronic device is often provided with different types of main camera.

[0003] However, taking the same electronic device with a periscopic telephoto camera and an upright telephoto camera as an example, the periscopic telephoto camera and the upright telephoto camera have different shapes and occupy different spaces. Therefore, different mainboards and middle frames need to be designed and manufactured for the same electronic device with different models. This will result in high design cost of electronic devices and low component commonality. SUMMARY

[0004] In order to solve the above technical problems, the present application provides a camera module fixing device and an electronic device, which can improve the component commonality and reduce the design and trial production cost of electronic devices.

[0005] In a first aspect, the present application provides a camera module fixing device, comprising a mainboard, the mainboard comprising: a mainboard body, the mainboard body being provided with signal lines; a camera module setting area, at least part of the edges of the camera module setting area being surrounded by the mainboard body, the camera module setting area being not provided with signal lines, the camera module setting area comprising a placeholder and a first shape camera window; the placeholder can be removed, and removing the placeholder can combine the space originally occupied by the placeholder and the first shape camera window to form a second shape camera window; wherein the first shape camera window is used for placing a first camera, and the second shape camera window is used for placing a second camera.

[0006] The present application provides a camera module fixing device and an electronic device, which can improve the component commonality and reduce the design and trial production cost of electronic devices.

[0007] In some possible implementations, the placeholder includes a placeholder body and a placeholder connecting sub-part, which is disposed between the placeholder body and the motherboard body to connect the placeholder body and the motherboard body. This arrangement makes the placeholder easier to remove.

[0008] In some possible implementations, the spacer connecting sub-part includes a cutout area and a connecting area. The spacer body on both sides of the cutout area is not connected to the main board body, while the spacer body on both sides of the connecting area is connected to the main board body. When the spacer needs to be removed, only the connecting area needs to be cut to remove the spacer, improving the efficiency of the cutting process.

[0009] In some possible implementations, there are multiple cutout areas and connecting areas, arranged alternately. This arrangement allows the connecting areas to be evenly distributed within the spacer connector, providing more reliable Z-axis support for components such as the flash unit.

[0010] In some possible implementations, the motherboard body includes flash assembly electrical connection terminals for electrically connecting the flash assembly. These flash assembly electrical connection terminals allow for convenient electrical connection between the flash assembly and the motherboard body.

[0011] In some possible implementations, the flash assembly electrical connection terminals include FPC connector springs, BTB connectors, or FOB terminals. These connection methods allow for a convenient and quick establishment of an electrical connection between the flash assembly and the motherboard.

[0012] In some possible implementations, a support connector is also included. This connector fills the space between the flash assembly and the placeholder, and establishes an electrical connection between the flash assembly and the motherboard. The support connector provides Z-axis support for the flash assembly and enables electrical connection between the flash assembly and the motherboard, allowing not only the lens elements of two different cameras to be in the same position, but also the flash positions to be completely identical.

[0013] In some possible implementations, the support connector includes a connector circuit board, connector pins, and connector pads. The connector circuit board includes a first side, a second side, and internal traces. The first side is fixedly connected to the connector pins, which are used for electrical connection to the flash assembly. The second side has connector pads attached, which are used for electrical connection to the motherboard. The internal traces connect the connector pins and the connector pads. This support connector effectively provides Z-axis support for the flash assembly and provides electrical connection between the flash assembly and the motherboard.

[0014] In some possible implementations, a motherboard bracket is also included. This bracket is positioned on the side of the flash assembly furthest from the motherboard and is used to constrain the position of the flash assembly. The motherboard bracket secures the flash assembly in place, providing high reliability.

[0015] Secondly, embodiments of this application also provide an electronic device, including any of the above-mentioned camera module fixing devices, which has the same beneficial effects as the above-mentioned camera module fixing devices. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a mobile phone provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of a motherboard structure provided in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the structure of a camera module setting area provided in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the structure of a spacer provided in an embodiment of this application;

[0020] Figure 5 This is another structural schematic diagram of a motherboard provided in an embodiment of this application;

[0021] Figure 6 This is a schematic diagram of the structure of the motherboard paired with a periscope telephoto camera in an embodiment of this application;

[0022] Figure 7 This is a schematic diagram of the structure of the motherboard paired with a vertical telephoto camera in an embodiment of this application;

[0023] Figure 8 This is a structural schematic diagram of a support connector provided in an embodiment of this application;

[0024] Figure 9 This is a schematic diagram of the structure of a PCB for a flash assembly provided in an embodiment of this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0027] The terms "up," "down," "left," and "right," used in this document to indicate direction, are intended only to clearly explain the embodiments and describe one possible arrangement or layout of the components. They are not intended to limit the relationship between components or the orientation of the components.

[0028] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0029] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0030] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0031] This application provides an electronic device, which may be a mobile phone, tablet computer, personal digital assistant (PDA), in-vehicle computer, smart wearable device, smart home device, etc. This application does not specifically limit the specific form of the above-mentioned electronic device. Figure 1 As shown, for ease of explanation, a mobile phone will be used as an example. To clearly describe the various structural features and their positional relationships, the X, Y, and Z axes will be used to define the positional relationships of the structures within the mobile phone. The X-axis represents the width of the mobile phone, the Y-axis represents its length, and the Z-axis represents its thickness.

[0032] Figure 1 This is a schematic diagram of the structure of a mobile phone provided in an embodiment of this application. See also... Figure 1The mobile phone 100 includes a mid-frame 10, a back cover 20, a display panel 30, and a camera module 40. The back cover 20 and the display panel 30 are positioned opposite each other, and the mid-frame 10 is located between the back cover 20 and the display panel 30.

[0033] Combination Figure 1 The middle frame 10 includes a first surface 101 and a second surface 102 arranged opposite to each other. The rear cover 20 is disposed on the first surface 101, and the display panel 30 is disposed on the second surface 102. The middle frame 10, the rear cover 20, and the display panel 30 can form a receiving cavity. The receiving cavity houses the motherboard 50, the battery, and a retaining wall (not shown in the figure) for fixing the battery. The motherboard 50 is equipped with a processor and a memory. The memory is used to store computer program code. The computer program code includes computer instructions. The processor is used to call the computer instructions to make the mobile phone 100 perform corresponding operations. The motherboard 50 is also provided with a window, in which a camera module 40 is disposed. That is, the camera module 40 is placed in the window of the motherboard 50 and extends to the camera hole of the rear cover 20 through the window.

[0034] The material of the back cover 20 may include, for example, opaque materials such as plastic, vegan leather, and fiberglass; or it may include translucent materials such as glass. This application does not limit the material of the back cover 20.

[0035] The display panel 30 includes, for example, a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, and an LED display panel, wherein the LED display panel includes, for example, a micro-LED display panel and a mini-LED display panel. This application embodiment does not limit the type of the display panel 30.

[0036] The camera module 40 may include any type of camera, such as a periscope telephoto camera or a vertical telephoto camera, and this application embodiment does not specifically limit it.

[0037] The specific structure and positional relationship between the motherboard 50 and the camera module 40 are explained below.

[0038] Figure 2 A schematic diagram of a motherboard structure provided in an embodiment of this application is shown below. Figure 2The motherboard 50 includes a motherboard body 51 and a camera module mounting area 52. The motherboard body 51 has signal traces for transmitting electrical signals and power traces for supplying power. The motherboard body 51 surrounds the camera module mounting area 52. In some embodiments, the motherboard body 51 may partially surround the camera module mounting area 52. The camera module mounting area 52 has no traces and is used to house the camera module 40 and flash, among other functional components. On the motherboard body 51 near the camera module mounting area 52, a flash assembly electrical connection terminal 511 is provided for connecting to the flash assembly, supplying power to the flash assembly, and outputting flash assembly control signals. This enables the motherboard 50 to supply power to the flash assembly and transmit communication signals between the motherboard 50 and the flash assembly. The flash assembly may include not only a flash unit but also devices such as a color temperature sensor and an infrared sensor.

[0039] The flash assembly electrical connection terminal 511 can be an FPC connection spring for connecting a flexible printed circuit board (FPC). Electrical connection between the FPC and the motherboard 50 is achieved by pressing the FPC contacts onto the FPC connection spring. Of course, the flash assembly electrical connection terminal 511 can also be any other type of terminal capable of achieving an electrical connection. For example, it can be a board-to-board (BTB) connector or a film-on-board (FOB) terminal, etc.

[0040] Figure 3 This is a schematic diagram of the structure of a camera module setting area provided in an embodiment of this application. See also... Figure 2 and Figure 3 The camera module setting area 52 includes a placeholder 521 and a first-shaped camera window 522. The motherboard body 51 and the placeholder 521 are arranged around the first-shaped camera window 522, jointly constraining the shape of the first-shaped camera window 522. The placeholder 521 and the camera window can be arranged adjacent to each other. For example, a vertical telephoto camera can be inserted into the first-shaped camera window 522, so that the motherboard body 51 and the placeholder 521 surround the vertical telephoto camera. In this way, the motherboard body 51 and the placeholder 521 can constrain the position of the vertical telephoto camera.

[0041] Figure 4 A schematic diagram of a spacer provided in an embodiment of this application is shown below. Figures 2 to 4The placeholder portion 521 includes a placeholder body 5211 and a placeholder connecting sub-portion 5212. The placeholder connecting sub-portion 5212 is disposed between the placeholder body 5211 and the motherboard body 51, and is used to connect the placeholder body 5211 and the motherboard body 51. For example, the placeholder connecting sub-portion 5212 can be cut before installing the periscope telephoto camera, causing the placeholder body 5211 to detach. The space originally occupied by the placeholder portion 521 and the first-shaped camera window 522 are combined to form a second-shaped camera window. The periscope telephoto camera can be inserted into the second-shaped camera window, so that the motherboard body 51 surrounds the periscope telephoto camera, thus allowing the motherboard body 51 to constrain the position of the periscope telephoto camera.

[0042] As can be seen from the above, when the placeholder 521 is not removed, it serves as a placeholder, constraining the first-shaped camera window 522 together with the motherboard body 51, thereby constraining the position of the vertical telephoto camera. After being removed, a second-shaped camera window is formed, which can be used to house the periscope telephoto camera, thus constraining its position. This setup allows for the use of a single motherboard to adapt to two mobile phones with different types of cameras. Furthermore, since the motherboard is identical, the internal architecture of the phone does not need to be changed; therefore, two identical but different models of mobile phones only need to be designed and use the same mid-frame 10.

[0043] See also Figures 2 to 4 The occupant connecting sub-part 5212 may include a cutout area 52121 and a connecting area 52122. The occupant bodies 5211 on both sides of the cutout area 52121 are not connected to the motherboard body 51, while the occupant bodies 5211 on both sides of the connecting area 52122 are connected to the motherboard body 51. There can be at least one cutout area 52121 and at least one connecting area 52122. If there are multiple cutout areas 52121 and at least one connecting area 52122, they can be spaced apart. The cutout area 52121 and the connecting area 52122 can be formed by removing the material from the cutout area of ​​the motherboard to be processed, while retaining the material from the connecting area 52122, thereby forming the cutout area 52121 and the connecting area 52122.

[0044] The following section will further introduce and explain the application scenarios of the motherboard 50 in conjunction with the specific internal structure of the mobile phone 100.

[0045] Scene 1

[0046] Figure 5 This is another structural schematic diagram of a motherboard provided in an embodiment of this application. Figure 6 This is a schematic diagram of the motherboard paired with a periscope telephoto camera solution according to an embodiment of this application. See also... Figure 5 andFigure 6 When using a periscope telephoto camera as the telephoto camera of mobile phone 100, the connecting area 52122 can be cut using CNC machining or other processes to remove the occupying part 521, thus forming a second-shaped camera window in the camera module setting area 52. The periscope telephoto camera (not shown in the figure) is then placed into the second-shaped camera window and connected to the motherboard 50 via a ribbon cable or other connecting cable. A flash assembly FPC60 is also included, placed on the surface of the periscope telephoto camera, with its position corresponding to the original occupying part 521. A motherboard bracket (not shown in the figure) can also be provided on the side of the flash assembly FPC60 away from the periscope telephoto camera, pressing down on the flash assembly FPC60 to better constrain it to the surface of the periscope telephoto camera. The electrical connection terminals of the flash assembly FPC60 can be placed at positions corresponding to the FPC connection springs on the motherboard 50, and pressed onto the FPC connection springs by the motherboard bracket to form an electrical connection between the flash assembly FPC60 and the motherboard 50.

[0047] Scene 2

[0048] Figure 7 This is a schematic diagram of the motherboard paired with a vertical telephoto camera in an embodiment of this application. See also... Figure 7 When using a vertical telephoto camera as the telephoto camera of mobile phone 100, the vertical telephoto camera (not shown in the figure) can be placed inside the first-shaped camera window 522. A support connector 70 is placed on one side of the occupier 521, and a flash assembly circuit board 80 (Printed Circuit Board, PCB) is placed on the side of the support connector 70 away from the motherboard 50, so that the flash in the flash assembly PCB 80 faces the same direction as the camera. The support connector 70 has a certain thickness to fill the gap between the flash assembly PCB 80 and the occupier 521, allowing the flash in the flash assembly PCB 80 to fit snugly against the back cover 20 of mobile phone 100. This compensates for the problem in other solutions where a vertical telephoto camera, due to its small size, cannot provide Z-axis support for the flash assembly PCB 80. The flash assembly PCB80 is usually electrically connected to the motherboard 50 via contacts located on the back. Since the occupier 521 does not have any circuitry, the support connector 70 is used in this embodiment to complete the electrical connection between the flash assembly PCB80 and the motherboard 50.

[0049] Figure 8 This is a structural schematic diagram of a support connector provided in an embodiment of this application. Figure 9This is a schematic diagram of the structure of a flash assembly PCB provided in an embodiment of this application. See also... Figure 8 and Figure 9 The support connector 70 includes a connector circuit board 71, connector pins 72, and connector pads (not shown). The connector circuit board includes a first side facing the flash assembly PCB 80 and a second side facing the motherboard 50. Connector pins 72 are connected to the first side of the connector circuit board. Connector pads are connected to the second side of the connector circuit board. The system also includes a flash assembly PCB 80, which includes a flash PCB body 81 and flash PCB contacts 82. Flash PCB contacts 82 are located on the side of the flash PCB body 81 facing the support connector 70. The positions of the connector pins 72 correspond to the positions of the flash PCB contacts 82, and the positions of the connector pads correspond to the positions of the FPC connection springs. Inside the connector circuit board, traces are provided for connecting the connector pins 72 and the connector pads. During assembly, the FPC connection springs can be removed to expose the pads, and the connector pads can be soldered together with the FPC connection spring pads. The position of the flash assembly PCB80 is constrained and fixed by the motherboard bracket (not shown in the figure), thereby completing the assembly of the flash assembly PCB80.

[0050] Scene 3

[0051] When using a periscope telephoto camera as the telephoto camera for mobile phone 100, the connecting area 52122 can be cut using CNC machining and other processes to remove the occupying part 521, thus forming a second-shaped camera window in the camera module setting area 52. The periscope telephoto camera is then placed into this second-shaped camera window and connected to the motherboard 50 via a ribbon cable or other connecting wires. The flash assembly FPC60 is placed on the surface of the periscope telephoto camera, with its position corresponding to the original occupying part 521. A motherboard bracket can also be installed on the side of the flash assembly FPC60 furthest from the periscope telephoto camera to better constrain the flash assembly FPC60 to the surface of the periscope telephoto camera. The electrical connection terminal of the flash assembly FPC60 is a BTB connector. The motherboard 50 does not have an FPC connection spring; instead, it uses a BTB connector for electrical connection with the flash assembly FPC60. The BTB connector of the flash assembly FPC60 is inserted into the BTB connector of the motherboard 50. Additionally, the electrical connection between the flash assembly FPC60 and the motherboard 50 can be secured by pressing the motherboard bracket onto the BTB connector.

[0052] Scene 4

[0053] See also Figure 7When using a vertical telephoto camera as the telephoto camera of mobile phone 100, the vertical telephoto camera can be placed inside the first-shaped camera window 522. A support connector 70 is placed on one side of the occupant 521, and a flash assembly circuit board (PCB) is placed on the side of the support connector 70 away from the motherboard 50, so that the flash in the flash assembly PCB 80 faces the same direction as the camera. The support connector 70 has a certain thickness to fill the gap between the flash assembly PCB 80 and the occupant 521, allowing the flash in the flash assembly PCB 80 to fit snugly against the back cover 20 of mobile phone 100. This compensates for the problem in other solutions where a vertical telephoto camera, due to its small size, cannot provide Z-axis support for the flash assembly PCB 80. The flash assembly PCB80 is usually electrically connected to the motherboard 50 via contacts located on the back. Since the occupier 521 does not have any circuitry, the support connector 70 is used in this embodiment to complete the electrical connection between the flash assembly PCB80 and the motherboard 50.

[0054] See also Figure 8 and Figure 9 The supporting connector 70 includes a connector circuit board 71, connector pins 72, and connector pads. The connector circuit board has a first side facing the flash assembly PCB 80 and a second side facing the main board 50. Connector pins 72 are connected to the first side of the connector circuit board. Connector pads are connected to the second side of the connector circuit board. The system also includes a flash assembly PCB 80, which includes a flash PCB body 81 and flash PCB contacts 82. Flash PCB contacts 82 are located on the side of the flash PCB body 81 facing the supporting connector 70. The positions of the connector pins 72 correspond to the positions of the flash PCB contacts 82, and the positions of the connector pads correspond to the positions of the FPC connection springs. Inside the connector circuit board, traces are provided for connecting the connector pins 72 and the connector pads. The main board 50 does not have FPC connection springs; instead, it has an FOB connector for electrical connection to the flash assembly FPC 60. During assembly, the FOB connector can be removed to expose its pads, and the connector pads can be soldered to the FOB connector pads. The position of the flash assembly PCB80 is then constrained and fixed using the motherboard bracket, thus completing the assembly of the flash assembly PCB80.

[0055] The structure of the motherboard 50 and its application scenarios have been described above. In fact, the above description only provides a partial example implementation; the camera module setting area 52 of the motherboard 50 can also have other technical features, forming other implementations. For example, the supporting connector can be a metal sheet or an FPC, etc. Alternatively, it can be designed so that the motherboard body 51 semi-encloses the camera module setting area 52; such details can be modified according to actual needs.

[0056] In this embodiment of the invention, a placeholder 521 is provided in the camera module setting area 52. The placeholder 521 can be removed as needed, thus simultaneously accommodating cameras of different shapes and sizes, such as vertical telephoto cameras and periscope telephoto cameras. Furthermore, the supporting connector 70 ensures that not only are the lens elements of the two different cameras in the same position, but the flash positions are also completely identical. This arrangement allows two models of the same mobile phone with different cameras to share the same motherboard, the same mid-frame 10, and even the same back cover 20. This significantly increases the component commonality between two mobile phones with different cameras and greatly reduces design and trial production costs.

[0057] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many variations under the guidance of this application without departing from the spirit and scope of the claims. Those skilled in the art will understand that this invention is not limited to the specific embodiments described herein. Various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of this invention, and all such changes and substitutions are within the scope of protection of this application.

Claims

1. A camera module fixing device, characterized in that, Includes a motherboard, the motherboard comprising: The motherboard body is equipped with signal traces; The camera module setting area is surrounded by the motherboard body at least part of its edge. The camera module setting area does not have the signal traces. The camera module setting area includes a placeholder and a first-shaped camera window. The placeholder can be removed. Removing the placeholder can combine the space originally occupied by the placeholder and the first-shaped camera window into one to form a second-shaped camera window. The first-shaped camera window is used to house the first camera, and the second-shaped camera window is used to house the second camera.

2. The camera module fixing device according to claim 1, characterized in that, The placeholder includes a placeholder body and a placeholder connecting sub-part. The placeholder connecting sub-part is disposed between the placeholder body and the motherboard body and is used to connect the placeholder body and the motherboard body.

3. The camera module fixing device according to claim 2, characterized in that, The occupant connecting sub-part includes a cutout area and a connecting area. The occupant body on both sides of the cutout area is not connected to the motherboard body, while the occupant body on both sides of the connecting area is connected to the motherboard body.

4. The camera module fixing device according to claim 3, characterized in that, There are multiple hollow areas and multiple connecting areas, which are arranged at intervals.

5. The camera module fixing device according to claim 1, characterized in that, The motherboard body includes a flash assembly electrical connection terminal for electrically connecting the flash assembly.

6. The camera module fixing device according to claim 5, characterized in that, The electrical connection terminals of the flash assembly include FPC connection springs, BTB connectors, or FOB terminals.

7. The camera module fixing device according to claim 1, characterized in that, It also includes a support connector for filling the space to be filled between the flash assembly and the occupier, and for conducting the electrical connection between the flash assembly and the motherboard body.

8. The camera module fixing device according to claim 7, characterized in that, The supporting connector includes a connector circuit board, connector pins, and connector pads. The connector circuit board includes a first side, a second side, and internal traces. The first side is fixedly connected to the connector pins, which are used for electrical connection to the flash assembly. The second side is attached with the connector pads, which are used for electrical connection to the motherboard. The internal traces are used to connect the connector pins and the connector pads.

9. The camera module fixing device according to claim 1, characterized in that, It also includes a motherboard bracket, which is located on the side of the flash assembly away from the motherboard, and is used to constrain the position of the flash assembly.

10. An electronic device, characterized in that, Includes the camera module fixing device as described in any one of claims 1-9.

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