LED chip mounting equipment and method

Abstract

The invention belongs to the technical field of LED chips, particularly relates to an LED chip mounting device and method, and aims to solve the problems that the pressure of a traditional rigid pressing mode is uncontrollable, a brittle LED chip is prone to cracking, pin deformation and other physical damage, and the production defective rate is greatly increased. The top end of the chip mounter device is fixedly connected with a glass sealing window, the top end of the chip mounter device is provided with a workbench, the workbench is located in the glass sealing window, and the top end of the workbench is provided with an adsorption part. According to the LED chip mounting equipment and method disclosed by the invention, the pull rope is driven to be retracted and released through differential rotation of the driving motor, stable displacement of the movable frame is realized in cooperation with guiding of the sliding frame and the sliding groove hole, the rotating frame is driven to rotate in combination with the servo motor, and the pressing piece can be precisely aligned with the chip; and due to the elastic design of the pressing spring, chip pressing can be completed by flexible pressure, and chip damage caused by rigid pressing is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED chip, especially to a LED chip pasting device and method. BACKGROUND

[0002] The LED chip pasting device is an automatic equipment for LED packaging process, which can realize accurate pickup, positioning and mounting of LED chips, and is suitable for production and processing of multiple types of LED devices such as direct insertion type and patch type, and has the technical characteristics of high precision, high efficiency and high compatibility.

[0003] The traditional LED chip pressing adopts a rigid contact operation mode, and the pressure output completely depends on the hard drive of mechanical transmission, lacks flexible pressure buffering and adjusting mechanism, and the pressure size is easily affected by factors such as mechanical wear and transmission gap in the actual operation process, so it is difficult to realize accurate control. The LED chip itself is a brittle semiconductor component, and the structural strength of the chip body and the pin part is relatively weak, and the ability to resist external force impact is poor, so under the action of uncontrollable rigid pressure, the chip surface is easy to appear irreversible damage such as cracking and scratches. SUMMARY

[0004] The present application discloses a LED chip pasting device and method, which aims to solve the technical problem of uncontrollable pressure of traditional rigid pressing method in the background art, which easily causes physical damage such as cracking and pin deformation to brittle LED chips, and greatly increases the production of defective products.

[0005] The LED chip pasting device provided by the present application comprises a pasting machine device, a glass sealing window is fixedly connected to the top end of the pasting machine device, a workbench is arranged at the top end of the pasting machine device, and the workbench is located inside the glass sealing window, a suction accessory is arranged at the top end of the workbench, a pasting and pressing assembly is arranged above the pasting machine device, the pasting and pressing assembly comprises a rotating frame, a plurality of fixed frames are fixedly connected to the outer side of the rotating frame, a pressing spring is fixedly connected in each fixed frame, and a pressing piece is fixedly connected to the side, away from the fixed frame, of each pressing spring.

[0006] In a preferred scheme, the pasting and pressing assembly comprises two straight rails, the bottom end of each straight rail is fixedly connected to the top end of the pasting machine device, and the straight rails are located on both sides of the workbench, a movable seat is movably connected above the straight rails, and an upper frame is fixedly connected to the top end of the movable seat.

[0007] In a preferred scheme, the opposite sides of the upper frame are fixedly connected with connecting plates, two driving motors are arranged at the top end of each connecting plate, a rotating shaft is connected to the power output shaft of each driving motor through a shaft coupling, a pulling rope is wound around the outer side of each rotating shaft, and a movable frame is fixedly connected to the opposite side of each pulling rope.

[0008] In a preferred scheme, the bottom end of the movable frame is fixedly connected with a sliding frame, a sliding slot is formed in the connecting plate, the sliding frame is movably connected inside the sliding slot, the top end of the movable frame is provided with a servo motor, the power output shaft of the servo motor is connected with a rotating rod through a shaft coupling, and the outer side of the end of the rotating rod away from the servo motor is movably connected to the inner side of the rotating frame.

[0009] In a preferred scheme, one side of the patch pressing assembly is provided with a chip gap detection assembly, the chip gap detection assembly comprises an extension plate, one side of the extension plate is fixedly connected to the end of the connecting plate away from the rotating frame, and the top end of the extension plate is fixedly connected with a fixed plate.

[0010] In a preferred scheme, the top end of the extension plate away from the fixed plate is provided with an electric telescopic rod, the telescopic ends of the electric telescopic rod are fixedly connected with moving seats, the bottom end of the moving seat is fixedly connected with a moving frame, a slot is formed in the extension plate, the moving frame is movably connected inside the slot, and the top end of the moving seat is fixedly connected with an upper plate.

[0011] In a preferred scheme, the side of the upper plate close to the rotating frame is fixedly connected with a pointer, the lower side of the upper plate is provided with a chip detector, the lower side of the pointer is provided with a scale plate, the end of the scale plate close to the electric telescopic rod is fixedly connected with two front supports, one side of the front support is fixedly connected to the outer side of the extension plate, the end of the moving seat away from the electric telescopic rod is fixedly connected with two moving rods, and a circular hole is formed in the front support and the fixed plate, and the moving rod is movably connected inside the circular hole.

[0012] In a preferred scheme, the front end of the glass sealing window is provided with a display, the outer side of the glass sealing window is provided with a cabinet door, the top end inside of the glass sealing window is fixedly connected with a plurality of hanging frames, and the top end of the hanging frame is provided with two horizontal travel tracks.

[0013] In a preferred scheme, the top end of the horizontal travel track is provided with two longitudinal travel tracks, the outer side of the horizontal travel track is provided with a horizontal movable plate frame, the outer side of the longitudinal travel track is provided with a longitudinal movable plate, the outer side of the longitudinal movable plate and the horizontal movable plate frame is provided with a movable piece, and the bottom end of the movable piece is provided with a patch head.

[0014] A use method of the LED chip patching device, using the LED chip patching device as described above, comprising the following steps: Step one, after the device is started, the patching substrate is placed on the workbench, the suction accessory realizes stable fixation of the substrate through negative pressure adsorption, then the horizontal travel track and the longitudinal travel track supported by the hanging frame are linked, the movable piece and the bottom end patch head are driven to complete the column-by-column patching of the LED chip on the substrate according to the preset coordinates in the two-dimensional plane. Step two, after the completion of a column of patches, the patch pressing assembly starts, the straight rail drives the movable seat and the connecting plate to move to the chip column direction, the two drive motors at the top of the connecting plate rotate forward and reverse respectively, drive the rotating shaft and the pull rope to retract and release, pull the movable frame to slide smoothly along the sliding groove hole of the connecting plate through the sliding frame, until the rotating frame moves to the top of the chip column; Step three, after the movable frame is in place, the servo motor starts and drives the rotating rod to rotate, driving the rotating frame and the outer fixed frame to rotate synchronously, the pressing spring in the fixed frame releases the elastic potential energy, pushing the pressing piece to contact the surface of the chip, and the flexible pressing force presses the chip on the substrate pad; the rotating frame continues to rotate to realize the one-by-one pressing of the whole column of chips; Step four, while pressing the second column of chips, the extension plate connected with the connecting plate is displaced synchronously with the pressing assembly, so that the fixed plate is aligned with the already mounted chip column to form a reference, the electric telescopic rod retracts to drive the moving seat to slide along the extension plate groove hole, the moving rod is guided through the front frame and the circular hole of the fixed plate, the upper plate and the pointer are moved, and the gap value between the two columns of chips is read by cooperating with the scale plate, and the chip detector synchronously captures the edge position of the chip to assist calibration; Step five, after the pressing and detection of the single column of chips are completed, the straight rail drives the movable seat and the connecting plate to reset, the drive motor reverses to drive the movable frame to return to the initial position, the electric telescopic rod is extended to push the moving seat and the pointer to reset to the zero scale of the scale plate, and then the horizontal and vertical travel rails are linked again, and the patch head develops the next column of chip mounting.

[0015] As can be seen from the above, the LED chip patching device provided by the application has the advantages that the differential rotation of the drive motor drives the pull rope to retract and release, the sliding frame and the sliding groove hole are guided to realize stable displacement of the movable frame, and the rotating frame is rotated by the servo motor, so that the pressing piece can accurately align the chip; the elastic design of the pressing spring can complete the chip pressing with flexible pressure, and the beneficial effect of avoiding damage to the chip caused by rigid pressing. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The present application provides a kind of LED chip patching equipment overall structure schematic diagram; Figure 2 The present application provides a kind of LED chip patching equipment patching machine equipment top structure schematic diagram; Figure 3 The present application provides a kind of LED chip patching equipment workbench top structure schematic diagram; Figure 4 The present application provides a kind of LED chip patching equipment suspension bracket structure schematic diagram; Figure 5 The present application provides a kind of LED chip patching equipment patching pressing assembly structure schematic diagram; Figure 6 This is a schematic diagram of the chip mounting and pressing component of an LED chip mounting device proposed in this invention; Figure 7 This is a schematic diagram of the chip gap detection component structure of an LED chip mounting device proposed in this invention; Figure 8 This is a schematic diagram of the chip gap detection component structure of an LED chip mounting device proposed in this invention.

[0017] In the diagram: 1. Chip and mount machine; 2. Glass window seal; 3. Cabinet door; 4. Monitor; 5. Workbench; 6. Adsorption unit; 7. Hanging frame; 8. Lateral travel track; 9. Longitudinal travel track; 10. Lateral movable plate frame; 11. Longitudinal movable plate; 12. Chip and mount pressing assembly; 1201. Linear track; 1202. Movable seat; 1203. Upper frame; 1204. Connecting plate; 1205. Drive motor; 1206. Rotating shaft; 1207. Pull rope; 1208. Movable frame; 1209. Servo motor; 12 10. Sliding frame; 1211. Rotating rod; 1212. Rotating frame; 1213. Fixed frame; 1214. Pressing spring; 1215. Pressing component; 13. Moving component; 14. Chip gap detection assembly; 1401. Extension plate; 1402. Fixed plate; 1403. Moving base; 1404. Electric telescopic rod; 1405. Moving rod; 1406. Top plate; 1407. Scale plate; 1408. Front frame; 1409. Moving frame; 1410. Chip detector; 1411. Pointer; 15. Placement head. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] The LED chip mounting equipment disclosed in this invention is mainly used in scenarios where the pressure of the traditional rigid pressing method is uncontrollable, which can easily cause physical damage such as cracking and pin deformation to the brittle LED chip, thus greatly increasing the production defect rate.

[0020] Reference Figures 1-8An LED chip mounting device includes a mounting machine 1, a glass window 2 fixedly connected to the top of the mounting machine 1, a worktable 5 located inside the glass window 2 at the top of the mounting machine 1, an adsorption component 6 at the top of the worktable 5, and a mounting pressing assembly 12 above the mounting machine 1. The mounting pressing assembly 12 includes a rotating frame 1212, multiple fixing frames 1213 fixedly connected to the outer side of the rotating frame 1212, a pressing spring 1214 fixedly connected inside each fixing frame 1213, and a pressing component 1215 fixedly connected to the side of the pressing spring 1214 away from the fixing frame 1213.

[0021] Reference Figure 2 , Figure 3 , Figure 5 and Figure 6 The chip mounting and pressing assembly 12 includes two linear tracks 1201. The bottom ends of the linear tracks 1201 are fixedly connected to the top of the chip mounting machine 1, and the linear tracks 1201 are located on both sides of the worktable 5. Movable seats 1202 are movably connected above the linear tracks 1201, and upper frames 1203 are fixedly connected to the top of the movable seats 1202.

[0022] In this invention, a connecting plate 1204 is fixedly connected to each side of the upper frame 1203. Two drive motors 1205 are provided at the top of the connecting plate 1204. The power output shafts of the drive motors 1205 are connected to the rotating shafts 1206 through couplings. Pulling ropes 1207 are wound around the outside of the rotating shafts 1206. A movable frame 1208 is fixedly connected to each side of the pulling ropes 1207.

[0023] In this invention, a sliding frame 1210 is fixedly connected to the bottom end of the movable frame 1208, and a sliding groove hole is provided on the connecting plate 1204. The sliding frame 1210 is movably connected inside the sliding groove hole. A servo motor 1209 is provided at the top end of the movable frame 1208, and the power output shaft of the servo motor 1209 is connected to a rotating rod 1211 through a coupling. The outer side of the end of the rotating rod 1211 away from the servo motor 1209 is movably connected to the inner side of the rotating frame 1212.

[0024] Specifically, after a row of chips is placed, the chip placement pressing assembly 12 is activated. Linear tracks 1201 are symmetrically distributed on both sides of the worktable 5. The internal drive mechanism drives the movable seat 1202 to slide linearly along the tracks. The upper frame 1203 at the top of the movable seat 1202 moves accordingly, thereby pulling the connecting plate 1204 closer to the row of chips that has been placed. The connecting plate 1204 serves as the core load-bearing and transmission component of the chip placement pressing assembly 12. The two drive motors 1205 at the top begin differential rotation after receiving electronic control signals. One drive motor rotates forward, and the other rotates in the opposite direction. The power output shafts of the motors are connected via... The shaft drives the rotating shaft 1206 to rotate synchronously. The pulling rope 1207 on one side gradually tightens as the rotating shaft 1206 rotates in the forward direction, while the pulling rope 1207 on the other side slowly releases as the rotating shaft 1206 rotates in the reverse direction. The two ends of the pulling rope 1207 are fixed to the two sides of the movable frame 1208 respectively. The tightening and loosening of the rope directly translates into the horizontal displacement of the movable frame 1208. The sliding frame 1210 at the bottom of the movable frame 1208 is embedded in the sliding groove hole on the surface of the connecting plate 1204. Under the traction of the rope, the sliding frame 1210 slides smoothly and linearly along the sliding groove hole, ensuring that the movable frame 1208 remains horizontal during the movement without deflection or jamming. The movement of the movable frame 1208 drives the servo motor 1209 at the top to move synchronously. When the movable frame 1208 reaches the position directly above the chip array, the servo motor 1209 starts, and the power output shaft drives the rotating rod 1211 to rotate in a circular motion through the coupling. The other end of the rotating rod 1211 is movably connected to the inner side of the rotating frame 1212. Therefore, the rotation of the rotating rod 1211 directly drives the rotating frame 1212 to rotate on a fixed axis. Multiple fixed frames 1213 are evenly distributed on the outer side of the rotating frame 1212. The pressing springs 1214 inside the fixed frames 1213 are in a pre-compressed state. When the rotating frame 1212 rotates, the fixed frames 1213 rotate with it. The rotating frame 1212 moves in a circular motion, and the pressing member 1215 at the end of the fixed frame 1213 approaches the surface of the LED chip. When the pressing member 1215 contacts the chip, the pressing spring 1214 begins to release elastic potential energy and generates a gentle pressing force through its own elastic deformation, firmly pressing the LED chip onto the bonding pad of the substrate to complete the die bonding operation. As the rotating frame 1212 continues to rotate, multiple pressing members 1215 contact the chip in sequence, realizing the pressing of the entire row of chips one by one. The elastic design of the pressing spring 1214 effectively avoids mechanical damage to the chip caused by rigid pressing, while ensuring the tightness of the fit between the chip and the substrate.

[0025] In specific application scenarios, the differential rotation of the drive motor 1205 drives the pull rope 1207 to extend and retract. With the guidance of the sliding frame 1210 and the sliding groove hole, the movable frame 1208 can be moved smoothly. Combined with the servo motor 1209 driving the rotating frame 1212 to rotate, the pressing component 1215 can be precisely aligned with the chip. The elastic design of the pressing spring 1214 can complete the chip pressing with flexible pressure, avoiding chip damage caused by rigid pressing.

[0026] It should be noted that the chip bonding of the entire row can be completed one by one simultaneously without the need for a single alignment operation, thus improving the die bonding efficiency. At the same time, this component is directly connected to the chip gap detection component 14, and the pressing operation can be carried out simultaneously with the gap detection, reducing the process connection time.

[0027] Reference Figure 3 , Figure 7 and Figure 8 A chip gap detection component 14 is provided on one side of the chip pressing component 12. The chip gap detection component 14 includes an extension plate 1401, and one side of the extension plate 1401 is fixedly connected to the end of the connecting plate 1204 away from the rotating frame 1212. A fixing plate 1402 is fixedly connected to the top of the extension plate 1401.

[0028] In this invention, an electric telescopic rod 1404 is provided at the top of the end of the extension plate 1401 away from the fixed plate 1402. The telescopic ends of the electric telescopic rod 1404 are all fixedly connected to a movable seat 1403. The bottom end of the movable seat 1403 is fixedly connected to a movable frame 1409. The extension plate 1401 is provided with a slot, and the movable frame 1409 is movably connected to the inside of the slot. The top end of the movable seat 1403 is fixedly connected to an upper plate 1406.

[0029] In this invention, a pointer 1411 is fixedly connected to the side of the upper plate 1406 near the rotating frame 1212. A chip detector 1410 is provided below the upper plate 1406. A scale plate 1407 is provided below the pointer 1411. Two front frames 1408 are fixedly connected to one end of the scale plate 1407 near the electric telescopic rod 1404. One side of the front frame 1408 is fixedly connected to the outside of the extension plate 1401. Two moving rods 1405 are fixedly connected to one end of the movable seat 1403 away from the electric telescopic rod 1404. Both the front frame 1408 and the fixed plate 1402 have round holes, and the moving rods 1405 are movably connected to the inside of the round holes.

[0030] Specifically, while pressing the second row of LED chips, the chip gap detection component 14 simultaneously enters the working state. One end of the extension plate 1401 is fixedly connected to the end of the connecting plate 1204 away from the rotating frame 1212. Therefore, the movement of the connecting plate 1204 will directly drive the extension plate 1401 to move synchronously, so that the detection component always maintains a synchronous positional relationship with the pressing component. The fixing plate 1402 at the top of the extension plate 1401 is first aligned with one of the rows of chips that have been mounted. The edge of the fixing plate 1402 is aligned with the chip. The side edges of the column coincide to form a reference position for gap detection. Then, the electric telescopic rod 1404 at the end of the extension plate 1401 away from the fixed plate 1402 is activated, and the telescopic end begins to retract backward, driving the top movable seat 1403 to slide linearly along the surface of the extension plate 1401. The bottom end of the movable seat 1403 is fixed with a movable frame 1409, which is embedded in the slot opened in the extension plate 1401. The slot guides the movement of the movable frame 1409, ensuring that the movable seat 1403 does not deviate during the sliding process. The displacement of the movable seat 1403 simultaneously pulls the two movable rods 1405 to move synchronously. The two ends of the movable rods 1405 pass through circular holes on the front frame 1408 and the fixed plate 1402, respectively. The diameter of the circular holes precisely matches the diameter of the movable rods 1405, providing stable sliding support for the movable rods 1405 and further ensuring the horizontal sliding accuracy of the movable seat 1403. The upper plate 1406 at the top of the movable seat 1403 moves together with the movable seat 1403. The pointer 1411 on the side of the upper plate 1406 near the rotating frame 1212 moves laterally on the surface of the scale plate 1407. The scale plate 1407 is fixed to the outside of the extension plate 1401 by the front frame 1408. The device is engraved with precise distance scales as a measurement benchmark for gap detection. At the same time, the chip detector 1410 below the upper plate 1406 is activated, capturing the edge position of the chip in real time through optical detection. When the pointer 1411 moves directly above another row of chips, the electric telescopic rod 1404 stops retracting. The horizontal distance between the two rows of chips can be directly read by the reading of the pointer 1411 on the scale plate 1407. By comparing it with the preset standard gap value, it can be determined whether the chip mounting distance meets the process requirements. If the gap deviation is detected to exceed the allowable range, the electronic control system will immediately issue a warning signal, and the equipment will stop operating until the operator adjusts the mounting parameters before continuing to operate.

[0031] In specific application scenarios, the electric telescopic rod 1404 drives the moving base 1403 to slide smoothly. Combined with the dual guiding structure of the moving frame 1409 and the moving rod 1405, the accuracy of the pointer 1411's displacement is ensured. Through the cooperation of the pointer 1411 and the scale plate 1407, the chip column gap value can be directly read. Combined with the chip detector 1410 below the upper plate 1406 for auxiliary calibration, the accuracy of the detection results is further improved.

[0032] It should be noted that the telescopic stroke of the electric telescopic rod 1404 can be adjusted to meet the column spacing detection requirements of chips of different specifications; the overall structure is linked with the pressing component, eliminating the need to readjust the detection benchmark for different substrates, thus enhancing the equipment's adaptability to diverse production scenarios.

[0033] Reference Figures 1-4 In a preferred embodiment, a display 4 is provided at the front end of the glass window 2, a cabinet door 3 is provided on the outer side of the glass window 2, and multiple hanging brackets 7 are fixedly connected to the top of the glass window 2. Two horizontal travel rails 8 are provided at the top of the hanging brackets 7, and two vertical travel rails 9 are provided at the top of each horizontal travel rail 8. A horizontal movable plate frame 10 is provided on the outer side of the horizontal travel rail 8, and a vertical movable plate 11 is provided on the outer side of the vertical travel rail 9. Movable parts 13 are provided on the outer side of the vertical movable plate 11 and the horizontal movable plate frame 10, and a patch head 15 is provided at the bottom end of the movable part 13.

[0034] A method of using an LED chip placement equipment, comprising the following steps: Step 1: After the equipment is started, the substrate to be mounted is placed on the workbench 5. The adsorption component 6 achieves stable fixation of the substrate through negative pressure adsorption. Then, the horizontal travel track 8 supported by the suspension frame 7 is linked with the vertical travel track 9, which drives the movable component 13 and the bottom mounting head 15 to complete the row-by-row mounting of LED chips on the substrate in a two-dimensional plane according to the preset coordinates. Step 2: After one row of chips is placed, the chip placement pressing assembly 12 is activated. The linear track 1201 drives the movable seat 1202 and the connecting plate 1204 to move towards the chip row. The two drive motors 1205 at the top of the connecting plate 1204 rotate in the forward and reverse directions respectively, driving the rotating shaft 1206 and the pulling rope 1207 to move in and out. The traction movable frame 1208 slides smoothly along the sliding groove hole of the connecting plate 1204 through the sliding frame 1210 until the rotating frame 1212 moves to directly above the chip row. Step 3: After the movable frame 1208 is in place, the servo motor 1209 starts and drives the rotating rod 1211 to rotate, which in turn drives the rotating frame 1212 and the outer fixed frame 1213 to rotate synchronously. The pressing spring 1214 in the fixed frame 1213 releases its elastic potential energy and pushes the pressing component 1215 to contact the chip surface. The chip is pressed onto the substrate pad through flexible pressing force. The rotating frame 1212 continues to rotate, realizing the pressing of the entire row of chips one by one. Step 4: While pressing the second row of chips, the extension plate 1401 connected to the connecting plate 1204 moves synchronously with the pressing component, so that the fixing plate 1402 is aligned with the chip row that has been mounted to form a reference. The electric telescopic rod 1404 retracts and drives the moving seat 1403 to slide along the slot of the extension plate 1401. The moving rod 1405 is guided by the round hole of the front frame 1408 and the fixing plate 1402, and pulls the upper plate 1406 and the pointer 1411 to move. The scale plate 1407 reads the gap value between the two rows of chips. The chip detector 1410 simultaneously captures the chip edge position to assist in calibration. Step 5: After pressing and testing a single row of chips, the linear track 1201 drives the movable seat 1202 and the connecting plate 1204 to reset. The drive motor 1205 rotates in the opposite direction, driving the movable frame 1208 back to its initial position. The electric telescopic rod 1404 extends, pushing the movable seat 1403 and the pointer 1411 back to the zero mark of the scale plate 1407. Then, the horizontal and vertical travel tracks 9 are linked again, and the chip mounting head 15 begins the mounting of the next row of chips.

[0035] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An LED chip placement equipment, comprising a placement machine (1), characterized in that, The top of the placement machine (1) is fixedly connected to a glass window (2). The top of the placement machine (1) is provided with a worktable (5), and the worktable (5) is located inside the glass window (2). The top of the worktable (5) is provided with an adsorption component (6). The placement machine (1) is provided with a placement pressing assembly (12). The placement pressing assembly (12) includes a rotating frame (1212). Multiple fixed frames (1213) are fixedly connected to the outer side of the rotating frame (1212). Pressing springs (1214) are fixedly connected inside the fixed frames (1213). Pressing components (1215) are fixedly connected to the side of the pressing springs (1214) away from the fixed frames (1213).

2. The LED chip mounting equipment according to claim 1, characterized in that, The patch pressing assembly (12) includes two linear tracks (1201). The bottom ends of the linear tracks (1201) are fixedly connected to the top of the patch machine (1), and the linear tracks (1201) are located on both sides of the workbench (5). Movable seats (1202) are movably connected above the linear tracks (1201), and upper frames (1203) are fixedly connected to the top of the movable seats (1202).

3. The LED chip mounting equipment according to claim 2, characterized in that, A connecting plate (1204) is fixedly connected to each side of the upper frame (1203). Two drive motors (1205) are provided at the top of the connecting plate (1204). The power output shafts of the drive motors (1205) are connected to rotating shafts (1206) through couplings. Pulling ropes (1207) are wound around the outside of the rotating shafts (1206). A movable frame (1208) is fixedly connected to each side of the pulling ropes (1207).

4. The LED chip mounting equipment according to claim 3, characterized in that, The bottom end of the movable frame (1208) is fixedly connected to a sliding frame (1210). A sliding groove hole is provided on the connecting plate (1204). The sliding frame (1210) is movably connected inside the sliding groove hole. A servo motor (1209) is provided at the top of the movable frame (1208). The power output shaft of the servo motor (1209) is connected to a rotating rod (1211) through a coupling. The outer side of the rotating rod (1211) away from the servo motor (1209) is movably connected to the inner side of the rotating frame (1212).

5. The LED chip mounting equipment according to claim 4, characterized in that, A chip gap detection component (14) is provided on one side of the patch pressing component (12). The chip gap detection component (14) includes an extension plate (1401), and one side of the extension plate (1401) is fixedly connected to the end of the connecting plate (1204) away from the rotating frame (1212). A fixing plate (1402) is fixedly connected to the top of the extension plate (1401).

6. The LED chip mounting equipment according to claim 5, characterized in that, An electric telescopic rod (1404) is provided at the top of the end of the extension plate (1401) away from the fixed plate (1402). The telescopic ends of the electric telescopic rod (1404) are all fixedly connected to a movable seat (1403). The bottom end of the movable seat (1403) is fixedly connected to a movable frame (1409). The extension plate (1401) has a slot, and the movable frame (1409) is movably connected to the inside of the slot. The top end of the movable seat (1403) is fixedly connected to an upper plate (1406).

7. The LED chip mounting equipment according to claim 6, characterized in that, A pointer (1411) is fixedly connected to the side of the upper plate (1406) near the rotating frame (1212). A chip detector (1410) is provided below the upper plate (1406). A scale plate (1407) is provided below the pointer (1411). Two front frames (1408) are fixedly connected to the end of the scale plate (1407) near the electric telescopic rod (1404). One side of the front frame (1408) is fixedly connected to the outside of the extension plate (1401). Two moving rods (1405) are fixedly connected to the end of the moving seat (1403) away from the electric telescopic rod (1404). Both the front frame (1408) and the fixed plate (1402) are provided with round holes. The moving rods (1405) are movably connected to the inside of the round holes.

8. The LED chip mounting equipment according to claim 7, characterized in that, The front end of the glass window (2) is provided with a display (4), the outside of the glass window (2) is provided with a cabinet door (3), and the top of the glass window (2) is fixedly connected with multiple hanging brackets (7), and the top of the hanging brackets (7) is provided with two horizontal travel rails (8).

9. An LED chip mounting device according to claim 8, characterized in that, The top of each of the transverse travel rails (8) is provided with two longitudinal travel rails (9). A transverse movable plate frame (10) is provided on the outside of the transverse travel rails (8), and a longitudinal movable plate (11) is provided on the outside of the longitudinal travel rails (9). Movable parts (13) are provided on the outside of the longitudinal movable plate (11) and the transverse movable plate frame (10). A patch head (15) is provided at the bottom of the movable part (13).

10. A method of using an LED chip mounting equipment, comprising using an LED chip mounting equipment as described in claim 9, characterized in that, Includes the following steps: Step 1: After the equipment is started, the substrate to be attached is placed on the worktable (5). The adsorption component (6) achieves stable fixation of the substrate through negative pressure adsorption. Then, the horizontal travel track (8) supported by the suspension frame (7) is linked with the vertical travel track (9) to drive the movable component (13) and the bottom mounting head (15) to complete the row-by-row mounting of LED chips on the substrate in a two-dimensional plane according to the preset coordinates. Step 2: After one row of chips is placed, the chip pressing assembly (12) is started. The linear track (1201) drives the movable seat (1202) and the connecting plate (1204) to move towards the chip row. The two drive motors (1205) at the top of the connecting plate (1204) rotate in the forward and reverse directions respectively, driving the rotating shaft (1206) and the pulling rope (1207) to pull in and out. The traction movable frame (1208) slides smoothly along the sliding frame (1210) along the sliding groove hole of the connecting plate (1204) until the rotating frame (1212) moves to the top of the chip row. Step 3: After the movable frame (1208) is in place, the servo motor (1209) starts and drives the rotating rod (1211) to rotate, causing the rotating frame (1212) and the outer fixed frame (1213) to rotate synchronously. The pressing spring (1214) in the fixed frame (1213) releases elastic potential energy, pushing the pressing part (1215) to contact the chip surface, and pressing the chip onto the substrate pad through flexible pressing force; the rotating frame (1212) continues to rotate, realizing the pressing of the entire row of chips one by one; Step 4: While pressing the second column of chips, the extension plate (1401) connected to the connecting plate (1204) moves synchronously with the pressing component, so that the fixing plate (1402) is aligned with the chip column to form a reference. The electric telescopic rod (1404) retracts and drives the moving seat (1403) to slide along the slot of the extension plate (1401). The moving rod (1405) is guided by the round hole of the front frame (1408) and the fixing plate (1402), pulling the upper plate (1406) and the pointer (1411) to move. The scale plate (1407) reads the gap value between the two columns of chips. The chip detector (1410) simultaneously captures the chip edge position to assist in calibration. Step 5: After pressing and testing a single row of chips, the linear track (1201) drives the movable seat (1202) and connecting plate (1204) to reset. The drive motor (1205) rotates in the opposite direction to drive the movable frame (1208) back to the initial position. The electric telescopic rod (1404) extends to push the movable seat (1403) and pointer (1411) back to the zero mark of the scale plate (1407). Then the horizontal and vertical travel tracks (9) are linked again, and the chip mounting head (15) starts the next row of chip mounting.

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