Automatic test sorting machine system for flash memory chips

Abstract

The invention relates to the technical field of chip sorting, and discloses a flash memory chip automatic test sorting machine system which comprises a data acquisition and verification module, a control decision and parameter calculation module, a motor control and current monitoring module, a mechanical cooperative execution module and a system monitoring and feedback module. Through automatic testing and sorting of multi-module cooperation, various performance indexes of the flash memory chip can be covered, basic read-write speed and storage capacity parameters are concerned, key characteristics such as power consumption stability and anti-interference capability are also included, and the operation performance of the chip under different working conditions is deeply analyzed; the test result can reflect the real quality of the flash memory chip more accurately, and a more scientific basis is provided for chip production and quality control.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip sorting, and more particularly discloses a flash memory chip automatic test sorting machine system. BACKGROUND

[0002] Flash memory chips are core semiconductor devices for storing data and are widely used in solid state drives (SSDs), U disks, mobile phones and other devices. Due to the complexity of the manufacturing process, even chips produced from the same wafer differ in performance, lifespan and reliability. Therefore, strict automatic testing and sorting of the chips are required.

[0003] The patent document with the authorization announcement number CN120094868B discloses a "chip sorting method, computer equipment, chip sorting system and storage medium", which includes: obtaining the photoelectric performance and position information of each die in the target wafer, defining the BIN value of each die according to the photoelectric performance and position information, and generating a point measurement file according to the BIN value and the position information; obtaining the position information of the ordinary dies missed during photoelectric detection and defining the BIN value of the missed ordinary dies, and updating the point measurement file to form an AOI file.

[0004] The patent document with the authorization announcement number CN120527255A discloses a "chip sorting method and chip sorting system", which includes: providing multiple wafers, each wafer including multiple chips; performing photoelectric performance testing on the chips, recording and storing the wafer number and photoelectric performance parameters; performing a first sorting according to the photoelectric performance parameters, dividing the chips into first-level sub-BIN1 to first-level sub-BINn, respectively counting the number of chips and summing them up, and recording them as S1 to Sn; setting a first preset value A, comparing Sn with A, and determining the first-level sub-BIN to which the chip belongs according to the comparison result.

[0005] Although the prior art can improve the accuracy of chip sorting to some extent, reduce the problem of missing unqualified dies and sorting position deviation, increase the output of normal dies, improve the utilization rate of good chips and the sorting efficiency, avoid the waste caused by scrapping or downgrading a small number of qualified chips, reduce the BIN action of the sorting equipment to improve the equipment utilization rate, the prior art does not adapt to the special testing requirements of the storage performance, lifespan and reliability of flash memory chips, lacks a dedicated data collection and load adaptation mechanism, and lacks real-time fault warning and precise mechanical position compensation optimization during the sorting process, making it difficult to meet the high precision and high stability requirements of flash memory chip automatic testing and sorting. SUMMARY

[0006] The technical problem solved by the present application is to provide a flash memory chip automatic test sorting machine system that can solve the problems raised in the background art.

[0007] To solve the above technical problems, according to one aspect of the present application, more specifically, a flash memory chip automatic test handler system, comprising: data acquisition and verification module, control decision and parameter calculation module, motor control and current monitoring module, mechanical coordination execution module, system monitoring and feedback module; the data acquisition and verification module acquires flash memory chip related data and completes the validity verification of data; the control decision and parameter calculation module receives the verified data and generates parameter calculation results and action control instructions; the motor control and current monitoring module monitors and adjusts the motor operation related current parameters according to the control instructions; the mechanical coordination execution module executes XY axis accurate movement, completes Z axis chip pick-and-place action, and sorts and docks the chips according to the test results; the system monitoring and feedback module monitors the running state of each module in real time, gives early warning to abnormal state, displays system running information and feedback.

[0008] Further, the data acquisition and verification module comprises: data acquisition module, chip position recognition module, data verification module; Data acquisition module: acquires chip test parameters, mechanical load data, and power supply running state data; Chip position recognition module: based on Python+cv2 visual recognition technology, shoots chip tray image, determines the two-dimensional coordinate position of the chip through image preprocessing and feature extraction; Data verification module: performs validity verification on the collected chip parameters, load data and position information, eliminates abnormal data beyond the reasonable range, marks the data missing key fields and triggers the resampling process.

[0009] Further, the control decision and parameter calculation module comprises: parameter calculation module, load adaptation decision module, action instruction generation module; Parameter calculation module: based on chip position coordinates and mechanical structure size parameters, calculates the running parameters of step motor moving step distance and servo steering wheel rotation angle; Load adaptation decision module: analyzes chip weight and mechanical motion resistance load data, combines the performance parameters of Arduino UNO master chip ATmega328P and the rated parameters of the motor, and adapts the optimal running parameter combination; Action instruction generation module: fuses the calculation results and test result data to generate standardized XY axis movement, Z axis pick-and-place, and chip sorting action control instructions.

[0010] Further, the motor control and current monitoring module comprises: Vref adjustment module, step motor control module, current stability monitoring module; Vref adjustment module: adopt digital control potentiometer, receive control instruction dynamic adjustment A4988 drive board reference voltage, adapt motor operation demand; Stepping motor control module: through Arduino UNO+CNC expansion board, realize 1 / 16 microstep control of stepping motor, accurately execute movement instruction; Current stability monitoring module: through current sensor, real-time acquisition of stepping motor operation current data.

[0011] Further, the mechanical coordination execution module includes: XY axis movement execution module, Z axis taking and placing execution module, chip sorting and docking module; XY axis movement execution module: based on gantry non-standard mechanical structure, through synchronous belt transmission and stepping motor, realize horizontal accurate movement of suction cup structure; Z axis taking and placing execution module: servo steering wheel driven lifting structure, cooperate with air pump, electromagnetic valve and suction cup, complete chip suction and placement action; Chip sorting and docking module: according to chip test result, identify corresponding classification tray position, transport chip to target tray.

[0012] Further, the system monitoring and feedback module includes: running state monitoring module, fault early warning module, state display module; Running state monitoring module: through serial communication, real-time acquisition of each module working parameter, including motor current, mechanical position, air pump pressure, test progress and other data; Fault early warning module: preset parameter threshold, when monitoring data exceeds threshold, trigger sound and light early warning, record fault type, occurrence time and related parameters at the same time; State display module: based on Python tkinter library built customer interface.

[0013] Further, the data interaction between each module is realized through Python Serial library and Arduino NeoSWSerial library.

[0014] The flash memory chip automatic test sorting machine system has the beneficial effects that: through the automatic test and sorting of multiple modules in cooperation, various performance indexes of the flash memory chip can be covered, not only the basic read-write speed and storage capacity parameters are concerned, but also the key characteristics such as power consumption stability and anti-interference ability are included, and the running performance of the chip under different working conditions is analyzed in depth, so that the test result can more accurately reflect the real quality of the flash memory chip, and a more scientific basis is provided for chip production and quality control; in addition, through the unified communication protocol and standardized data interface, and real-time data interaction, the test sorting equipment and the production line MES system are effectively integrated, the information island is broken, the real-time sharing and synchronization of data between each link can be realized, the efficiency and controllability of chip production circulation are improved, and the adaptability and reliability of the test sorting model are enhanced; at the same time, through the man-machine interaction visualization and intelligent early warning decision, a more intuitive operation state monitoring means is provided, the distribution and fluctuation trend of the chip test data can be clearly displayed, the early warning mechanism based on real-time data and abnormal identification can quickly issue an alarm before the fault occurs, and the response speed of equipment operation and maintenance and the stability of the production process are greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] The application will be further described in detail below in combination with the drawings and specific implementation methods.

[0016] Figure 1 It is a system module architecture schematic diagram; Figure 2 It is a positioning and action schematic diagram; Figure 3 It is a gantry mechanical structure horizontal motion principle schematic diagram; Figure 4 It is a gantry mechanical structure vertical motion principle schematic diagram; Figure 5 It is an Arduino + Sensor working principle schematic diagram; Figure 6 It is a client interface schematic diagram. DETAILED DESCRIPTION

[0017] The application will be further described in detail below in combination with the drawings and specific implementation methods.

[0018] According to one aspect of the application, as shown in Figures 1-6 a flash memory chip automatic test sorting machine system is provided, comprising: a data acquisition and verification module, which acquires flash memory chip related data and completes the validity verification of the data. The module comprises: a data acquisition module: acquiring chip test parameters, mechanical load data and power supply operation state data; The chip test parameters are tested by the ASM1153E master chip carried by the SATA to USB PCB, including read-write speed, storage capacity, power stability, anti-interference ability, etc. The signal integrity data (including differential impedance value, data transmission error rate) in the SATA and USB protocol conversion process, chip working voltage and current waveform data, and core parameters such as read-write response time and data storage stability under different temperature conditions (for example, -10℃~60℃) are captured in real time. All test data is uploaded to the control decision and parameter calculation module through the Python Serial library; The mechanical load data is collected by a pressure sensor installed on the XY axis of the gantry mechanical structure, which collects the friction resistance data. The actual weight of a single or batch of chips is obtained by a miniature weighing sensor. The elastic coefficient and actual extension amount data of the YZ axis spring assistance structure are collected by combining the preset transmission efficiency parameters of the synchronous belt transmission system. The dynamic load resistance in the operation process of the stepper motor is calculated. In addition, the real-time running current of the stepper motor is collected by a current sensor, and a complete mechanical load data set is finally formed. Finally, the power supply running state data is continuously monitored by the voltage sensor and current sensor connected in series in the system power supply circuit, which continuously monitors the real-time fluctuation value of the power supply voltage, the stable output current size and the power consumption data of the power supply, and simultaneously records the power supply startup time, the number of abnormal power failures, the time of voltage sudden drop / sudden rise and other state information.

[0019] Chip position recognition module: based on Python+cv2 visual recognition technology, shoot chip tray image, through image preprocessing and feature extraction, determine the two-dimensional coordinate position of the chip; First, the industrial camera shoots the complete image of the chip tray. In the image preprocessing stage, the cv2.GaussianBlur function (kernel size 5x5, standard deviation 1.5) in the Python+cv2 library is called to remove image noise. Then the cv2.adaptiveThreshold function is used to realize adaptive threshold segmentation of the chip area and background. Then the cv2.morphologyEx function (opening operation + closing operation) is used to optimize the segmentation effect and fill the holes in the area and eliminate the edge burrs. Then in the feature extraction stage, the cv2.findContours function is used to identify the contour features of each chip, calculate the minimum circumscribed rectangle of the contour, and take the center coordinates of the rectangle as the two-dimensional reference coordinates of the chip. Combined with the pre-set positioning hole (such as diameter 2mm) on the edge of the tray, the coordinates are calibrated. Through solving the deviation value of the actual coordinates of the positioning hole and the pre-set coordinates, all chip coordinates are translated and corrected to eliminate the positioning error caused by the placement deviation of the tray. Finally, the coordinates obtained by positioning and the chip number information of the host computer test results are mapped through a Python dictionary to ensure that the coordinates and chip identity correspond one by one, and the final positioning accuracy is controlled within ±0.01 mm, providing accurate target position data for the XY axis movement execution module.

[0020] Data verification module: validity check on collected chip parameters, load data and position information, eliminate abnormal data beyond reasonable range, mark data missing key fields and trigger the re-sampling process; Specifically, the reasonable threshold range of each data is preset: for example, the read-write speed threshold in chip test parameters is set according to the flash memory chip specification book (minimum ≥100MB / s, maximum ≤1000MB / s), the friction resistance threshold in mechanical load data is set to 0.1N~5N, the power supply voltage fluctuation threshold is set to ±0.05V, and the chip coordinate threshold is limited within the physical boundary of the tray (X axis 0~300mm, Y axis 0~200mm). In the verification stage, Python numpy library is used for statistical analysis of collected data, and abnormal data is identified through 3σ principle, and invalid values are directly eliminated; Then for the records missing key fields (such as chip coordinates, test voltage values, load resistance data), send re-sampling instructions to the lower computer through Python Serial library, so that the data acquisition module re-collects data for the corresponding chip or power supply port. If the key data is still missing after several re-sampling, mark the chip as "to be manually checked", issue an audible and visual warning through the system monitoring and feedback module, and record the tray position coordinates (X axis, Y axis specific value) and abnormal type of the chip, which is convenient for subsequent manual traceability processing.

[0021] Control decision and parameter calculation module, receives the verified data and generates parameter calculation results and action control instructions. This module includes: Parameter calculation module: based on chip position coordinates and mechanical structure size parameters, calculate the running parameters of step motor moving step distance and servo steering wheel rotation angle; First, get the current two-dimensional coordinates of the chip and the coordinate data of the corresponding position of the target tray, calculate the horizontal distance that the XY axis needs to move through the coordinate difference, combine the synchronous belt transmission ratio, optical axis lead of the gantry mechanical structure and other size parameters, and the precision standard of 1 / 16 micro-step control of the step motor, convert the total number of steps required for the step motor to complete the distance movement, ensure that the distance of each movement is accurately controllable; Then for the calculation of the rotation angle of the servo steering engine, the lifting stroke requirement of the Z-axis pick-and-place action is first determined. According to the transmission link length of the lifting structure, the connection proportion relationship between the steering engine output shaft and the lifting mechanism, combined with the safety height requirement during chip suction and the fitting height requirement during placement, the angle range that the steering engine needs to rotate is derived. At the same time, reference is made to the mechanical limiting parameters of the Z-axis lifting structure in the mechanical cooperative execution module to avoid excessive rotation of the steering engine causing damage to the mechanism and ensure that the start and stop positions of the lifting action accurately match the chip pick-and-place requirements. In addition, real-time reference to the friction resistance change feedback in the mechanical load data, small compensation correction is made to the calculated moving step and rotation angle. When the friction resistance in a certain direction is detected to increase, the running parameters of the corresponding motor are adjusted appropriately to avoid movement jamming or position deviation caused by resistance changes; Finally, the calculated step motor step number, servo steering engine rotation angle and other running parameters are arranged and packaged in the system preset standardized data format. Through the communication protocol of Python Serial library and Arduino NeoSWSerial library, they are sent to the motor control and current monitoring module in real time. At the same time, the parameter calculation results are stored in the local database to form a complete parameter log for subsequent traceability check.

[0022] Load adaptation decision module: analyze chip weight, mechanical motion resistance load data, combine the performance parameters of Arduino UNO master chip ATmega328P and the rated parameters of motor to adapt the optimal running parameter combination; Specifically, first integrate the verified chip weight data, XY-axis optical axis friction resistance data, synchronous belt transmission resistance data and other load information to determine the total load size and trend in the mechanical motion process. Then, combined with the maximum processing rate, IO interface driving capability and other performance parameters of Arduino UNO master chip ATmega328P, as well as the rated torque, rated speed and other rated parameters of the stepper motor, a load and motor running parameter adaptation analysis model is established; By referring to the actual spring force feedback data of the YZ-axis spring assisted structure, the adaptation strategy is dynamically adjusted. When the spring force effectively offsets part of the vertical load, the motor running parameters are optimized to reduce energy consumption while ensuring that the motor output torque meets the remaining load demand. At the same time, it avoids the situation that the motor overheats or the mechanical impact is too large due to too high parameters, ensuring that the motor performance and mechanical load are always in the best matching state.

[0023] Action instruction generation module: fuse the calculation results and test results data to generate standardized XY-axis movement, Z-axis pick-and-place and chip sorting action control instructions; Firstly, the chip test results (including PASS, FAIL, Time Out, etc.) transmitted by the host computer are received, and the test results are associated with the stepping motor movement parameters and the servo steering engine rotation parameters output by the parameter calculation module. The chip sorting target tray position corresponding to different test results is determined, and the complete mechanical action flow from the current chip position to the target position is determined. Then, according to the action timing logic preset by the system, a standardized instruction sequence is generated, which includes, for example, start instructions for XY axis movement, speed gradient control instructions, stop position calibration instructions, start height instructions for Z axis lifting, lowering suction height instructions, and rising reset instructions, as well as timing control instructions for air pump suction, electromagnetic valve switching, and air release, to ensure smooth connection of XY axis movement, Z axis picking and placing, and chip sorting actions, without timing conflicts. Finally, the complete action control instruction set generated is linked and bound with the shortcut key function of the keyboard monitoring module. When the "start" shortcut key instruction is received, the action instruction sequence is immediately issued to the lower computer to drive the mechanical cooperative execution module to start the action. When the "pause" shortcut key instruction is received, an emergency stop instruction and a parameter reset instruction are immediately generated to control the motor to stop running and the related parameters to return to the initial state, avoiding chip deviation or damage caused by motor inertia. At the same time, the instruction execution status (such as instruction issuance success, action execution, and instruction execution completion) is fed back to the system monitoring and feedback module in real time.

[0024] Motor control and current monitoring module, which monitors and adjusts the motor running related current parameters according to the control instruction. The module includes: Vref adjustment module: uses a digital potentiometer to receive control instructions to dynamically adjust the reference voltage of the A4988 drive board to adapt to the motor running requirements; Firstly, the load adaptation instruction issued by the control decision and parameter calculation module is received, which contains the target drive current related parameters required by the motor at present. Combined with the circuit characteristics of the A4988 drive board, the corresponding target reference voltage value is calculated according to the following formula: In the formula, is the rated maximum running current of the motor, is the fixed resistance value of the sampling resistor on the A4988 drive board; Then the digital controlled potentiometer is connected with the Arduino UNO master control board through the I2C communication interface, receives the digital adjustment signal transmitted by the master control board, dynamically adjusts the output voltage to the target reference voltage value calculated through the precise switching of the internal resistance network, and inputs the voltage signal directly into the Vref pin of the A4988 drive board, thereby changing the current size output by the drive board to the stepper motor, realizing the precise matching of the motor driving current and the load demand, and avoiding the motor power shortage or current overload caused by load change.

[0025] Stepper motor control module: through Arduino UNO+CNC expansion board, 1 / 16 microstep control of stepper motor is realized, and movement instruction is accurately executed; Specifically, the Arduino UNO master control board is connected with the CNC expansion board through hardware adaptation, ensuring that the I / O interface of the master control board corresponds to the drive signal interface of the expansion board one by one, and the power interface of the expansion board is connected to a stable DC power supply to provide sufficient power support for the stepper motor drive (such as Figure 2 shown); At the same time, the microstep control program is written through Arduino IDE, the subdivision control pin level of the expansion board is configured, the running mode of the stepper motor is set to 1 / 16 microstep, and the motor only rotates 1 / 16 basic step angle for each received pulse signal, which greatly improves the motion control accuracy.

[0026] Current stability monitoring module: real-time collection of stepper motor running current data is realized through a current sensor; Specifically, the current sensor is connected in series in the power supply circuit of the stepper motor, and the signal output end of the sensor is connected to the signal collection pin of the Arduino UNO master control board through a shielded wire, so as to avoid the influence of external electromagnetic interference on the collection accuracy.

[0027] Mechanical cooperative execution module, which executes XY axis precise movement, completes Z axis chip pick-and-place action, and sorts and connects the chips according to test results. The module includes: XY axis movement execution module: based on the gantry non-standard mechanical structure, through synchronous belt transmission and cooperation with the stepper motor, the horizontal precise movement of the suction cup structure is realized; Specifically, the stepper motor is fixedly connected with the synchronous pulley through a coupling, the synchronous belt is tensioned between the driving pulley and the driven pulley, the suction cup mounting seat is rigidly connected with the synchronous belt through a locking block, and at the same time, the mounting seat is slidably connected with the linear guide rail on the gantry, so as to ensure that there is no deviation and shaking during movement (such as Figure 3 shown); Then, it receives 1 / 16 microstep control commands and step parameters from the motor control and current monitoring module. The stepper motor drives the synchronous belt to move the chuck along the XY axis according to the pulse signal. During the movement, it receives the current coordinate data fed back by the chip position recognition module in real time and compares and calibrates it with the target coordinates. If there is a slight deviation, the control module dynamically adjusts the motor pulse output to ensure that the error between the final moving position and the target coordinates is controlled within ±0.01mm, which meets the chip's precise alignment requirements.

[0028] Z-axis pick-and-place execution module: The lifting structure is driven by a servo motor, and together with an air pump, solenoid valve and suction cup, it completes the picking and placing of chips. Specifically, the servo motor is fixed to the XY-axis suction cup mounting base via a bracket. The servo motor output shaft is rigidly connected to the lifting linkage. A vacuum suction cup is installed at the bottom of the linkage. An air pump is connected in series with the suction cup and solenoid valve via an air pipe. The solenoid valve signal input terminal is connected to the IO interface of the Arduino UNO main control board to realize air circuit on / off control (e.g., ...). Figure 4 , Figure 5 (as shown) Simultaneously, upon receiving commands, such as when the XY axis moves above the target chip, the servo drives the lifting linkage to descend to the preset pick-up height. At this time, the main control board sends a power-on command to the solenoid valve, the air pump starts to generate negative pressure, the suction cup picks up the chip, and the current stability monitoring module provides real-time feedback on the servo motor's operating current. If the current rises abnormally (indicating excessive load), a stop-descending command is immediately issued to avoid damaging the chip. After the pick-up is completed, the servo drives the linkage to rise to a safe height. After moving above the target tray, the linkage descends again to the placement height, the solenoid valve is de-energized to cut off the negative pressure, and the chip is placed stably. The entire process is seamlessly connected with the XY axis movement, ensuring precise pick-up and placement timing.

[0029] Chip sorting and docking module: Based on the chip test results, it identifies the corresponding category tray position and transports the chips to the target tray; First, the chip test results (PASS / FAIL / Time Out) and the corresponding target tray position data are received. By associating them with the current tray coordinates fed back by the chip position recognition module, the optimal movement path from the current chip position to the target tray is determined, avoiding interference with other trays or mechanical structures. Then, with the coordinated action of the XY and Z axes, the suction cup for adsorbing the chip is precisely moved above the corresponding slot of the target tray. After confirming that there is no misalignment of the tray slot, the Z-axis descent and degassing action is performed to complete the chip placement. Finally, after the placement is completed, the suction cup immediately rises and resets, and sends a sorting completion signal to the system monitoring and feedback module, synchronously records the sorting result, target tray number and placement time of the chip, forms a sorting traceability log, and if the chip is not placed in the center of the grid after placement, a secondary adjustment instruction is triggered immediately to drive the XY axis fine adjustment to ensure the chip is placed regularly.

[0030] The system monitoring and feedback module monitors the running state of each module in real time, gives early warning to abnormal state, displays system running information and feedback. The module includes: The running state monitoring module: through serial communication, it collects the working parameters of each module in real time, including motor current, mechanical position, air pump pressure, test progress and other data; Specifically, based on Python Serial library and Arduino NeoSWSerial library, a double serial communication link is built, one of which is used to collect the real-time current of the motor control and current monitoring module and the Vref reference voltage data, and the other is used to synchronously obtain the current coordinates of the mechanical cooperative execution module, the Z-axis lifting height, the air pump pressure value, and through the communication interface with the data acquisition and verification module, the number of chip test completion, the number of untested and other progress related data are extracted; Then the collected discrete parameters are structured and packaged in the format of "module-parameter type-value-time stamp", stored in the local SQLite database, and through the data synchronization thread, the key parameters are pushed to the display interface in real time, ensuring the real-time and traceability of the running state data. If the serial communication is interrupted during the collection process, the local cache mechanism is triggered, and the cached data is automatically supplemented after the communication is restored, avoiding data loss.

[0031] The fault warning module: preset parameter threshold, when the monitoring data exceeds the threshold, trigger the sound and light warning, and record the fault type, occurrence time and related parameters; Among them, the parameter threshold is preset based on the system design standard and actual operation experience, for example, the motor current threshold is set to ±20% of the rated current of the motor, the air pump pressure threshold is set to 0.3MPa~0.6MPa, the mechanical position deviation threshold is set to ±0.02mm, and the power supply voltage fluctuation threshold is set to ±0.05V. All thresholds support visual adjustment through the client interface and save to the configuration file; Then real-time comparison of the collected data and the preset threshold, when detecting that the data exceeds the threshold, immediately trigger the sound and light warning at the hardware level: control the buzzer to emit a continuous alarm sound, while driving the red LED light to flash, the alarm mode supports manual closing or fault removal after automatic stop, the software level synchronously records fault information, including fault type (such as motor current overload, air pump pressure deficiency, mechanical position offset exceeds the standard, etc.), occurrence time (accurate to millisecond), relevant parameter value (such as motor current value when overload, actual coordinate and target coordinate difference value when offset) at the time of fault occurrence; Finally, the fault information is synchronously pushed to the client interface to pop up a window prompt, and a fault log file is generated and stored locally, the log file is named with date and fault occurrence time, which is convenient for later operation and maintenance personnel to trace the fault cause.

[0032] State display module: the client interface based on Python tkinter library; Specifically, the client interface is designed through the Python tkinter library, the operation instruction area is provided with function buttons such as "start", "pause", "stop", "reset", "initialize" and the like, after the user clicks the button, the interface real-time feedback instruction execution state (such as Figure 6 As shown).

[0033] Of course, the above description is not a limitation of the present application, the present application is not limited to the above examples, the changes, modifications, additions or replacements made by ordinary skilled in the art within the essential scope of the present application also belong to the protection scope of the present application.

Claims

1. An automated testing and sorting system for flash memory chips, characterized in that, include: The system comprises a data acquisition and verification module, a control decision and parameter calculation module, a motor control and current monitoring module, a mechanical cooperative execution module, and a system monitoring and feedback module. The data acquisition and verification module acquires relevant data from the flash memory chip and verifies the data's validity. The control decision and parameter calculation module receives the verified data and generates parameter calculation results and action control commands. The motor control and current monitoring module monitors and adjusts relevant current parameters of the motor operation according to the control commands. The mechanical collaborative execution module performs precise XY axis movement and completes the chip pick-and-place action on the Z axis, sorting and docking the chips according to the test results; the system monitoring and feedback module monitors the operating status of each module in real time, issues early warnings for abnormal states, displays system operating information, and provides feedback.

2. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The data acquisition and verification module includes: a data acquisition module, a chip location identification module, and a data verification module; Data acquisition module: Acquires chip test parameters, mechanical load data, and power supply operating status data; Chip position recognition module: Based on Python + cv2 vision recognition technology, it captures images of the chip tray and determines the two-dimensional coordinate position of the chip through image preprocessing and feature extraction; Data verification module: Verifies the validity of the collected chip parameters, load data and location information, removes abnormal data that exceeds the reasonable range, marks data with missing key fields and triggers the supplementary data collection process.

3. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The control decision and parameter calculation module includes: a parameter calculation module, a load adaptation decision module, and an action command generation module; Parameter calculation module: Based on chip position coordinates and mechanical structure dimensions, calculates the operating parameters of stepper motor movement step distance and servo motor rotation angle; Load adaptation decision module: Analyzes chip weight and mechanical motion resistance load data, and combines the performance parameters of the Arduino UNO main control chip ATmega328P with the motor's rated parameters to adapt the optimal combination of operating parameters; Action command generation module: It integrates the calculation results with the test results data to generate standardized XY axis movement, Z axis pick-and-place, and chip sorting action control commands.

4. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The motor control and current monitoring module includes: a Vref adjustment module, a stepper motor control module, and a current stability monitoring module; Vref adjustment module: Uses a digitally controlled potentiometer to receive control commands and dynamically adjust the reference voltage of the A4988 driver board to adapt to the motor's operating requirements; Stepper motor control module: Through the Arduino UNO+CNC expansion board, it realizes 1 / 16 microstep control of the stepper motor and accurately executes movement commands; Current stability monitoring module: Collects stepper motor operating current data in real time through a current sensor.

5. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The mechanical collaborative execution module includes: an XY axis movement execution module, a Z axis pick-and-place execution module, and a chip sorting and docking module; XY axis movement execution module: Based on the non-standard mechanical structure of the gantry, it realizes the precise horizontal movement of the suction cup structure through synchronous belt drive and stepper motor; Z-axis pick-and-place execution module: The lifting structure is driven by a servo motor, and together with an air pump, solenoid valve and suction cup, it completes the picking and placing of chips. Chip sorting and docking module: Based on the chip test results, it identifies the corresponding category tray position and transports the chip to the target tray.

6. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The system monitoring and feedback module includes: an operation status monitoring module, a fault early warning module, and a status display module; Operation status monitoring module: Collects the operating parameters of each module in real time through serial communication, including data such as motor current, mechanical position, air pump pressure, and test progress; Fault warning module: preset parameter thresholds. When the monitored data exceeds the threshold, an audible and visual warning is triggered, and the fault type, occurrence time and related parameters are recorded at the same time. Status display module: A client interface built using the Python tkinter library.

7. The automated testing and sorting system for flash memory chips according to claim 1, characterized in that: The modules interact with each other via the Python Serial library and the Arduino NeoSWSerial library.

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