High-performance copper alloy optical module shell and preparation method thereof

Abstract

The invention discloses a high-performance copper alloy optical module shell and a preparation method thereof, and belongs to the technical field of copper alloy material production. The method comprises the steps that graphene-coated copper alloy powder is prepared through room-temperature plasma catalytic coupling, the content of graphene ranges from 0.005 wt% to 0.03 wt%, and the number of coating layers is smaller than 10; the graphene-coated copper alloy powder is subjected to binder jet printing forming, and a heat dissipation part is obtained; and the heat dissipation part is sequentially subjected to degumming exhaust, solid phase sintering, hot isostatic pressing and heat treatment to obtain the high-performance copper alloy optical module shell. According to the method, efficient dispersion of graphene and stable interface combination are achieved, the shell has high thermal conductivity, high strength and high electrical conductivity, and the problems that in a traditional method, graphene is poor in dispersion in a copper matrix, interface combination is weak, and complex structure forming and performance are difficult to consider are solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of copper alloy material production, and particularly relates to a high-performance copper alloy optical module shell and a preparation method thereof. BACKGROUND

[0002] As a core component of data centers and communication networks, optical modules are developing towards high speed, miniaturization and high power density, such as 800G, 1.6T, etc. The chip heat flux has broken through 200W / cm 2 , which puts forward strict requirements on the heat dissipation performance and structural precision of the shell. The traditional zinc alloy shell (thermal conductivity 100W / m·K~120W / m·K) cannot meet the requirements, and high-thermal-conductivity copper alloy has become the mainstream direction. However, the existing technology has multiple bottlenecks: (1) Material performance bottleneck: pure copper and traditional copper alloys cannot balance high strength and high thermal conductivity, and the thermal expansion coefficient does not match the chip material, which easily introduces thermal stress; when graphene is used for reinforcement, mechanical mixing easily leads to graphene agglomeration, and the poor wettability of graphene and the copper matrix and the weak interface bonding hinder heat conduction, and the performance is even worse than that of pure copper.

[0003] (2) Difficulty in forming complex structure: the optical module shell contains precise reinforcing ribs and micro-channels, and traditional die casting and CNC machining have problems such as high mold cost and low material utilization; metal injection molding (MIM) is prone to cracking defects, and additive manufacturing technologies such as binder jetting have problems such as low green density, poor strength, and difficult control of subsequent shrinkage.

[0004] (3) Poor process chain integration and stability: it is difficult to connect multiple processes such as vapor deposition, printing, sintering, and hot isostatic pressing, and the parameter matching is poor, which easily leads to deterioration of the microstructure of the material, unstable product performance, and poor repeatability, and cannot meet the reliability requirements of high-speed optical modules.

[0005] In summary, the existing technology cannot prepare an optical module shell with complex structure, high density, high strength, and high thermal conductivity. SUMMARY

[0006] The purpose of the present application is to provide a high-performance copper alloy optical module shell and a preparation method thereof, which can solve the problems of poor dispersion of graphene in the copper matrix, weak interface bonding, and difficulty in balancing complex structure forming and performance in the traditional method.

[0007] To achieve the above purpose, the present application provides a preparation method of a high-performance copper alloy optical module shell, comprising the following steps: Preparation of graphene-coated copper alloy powder by room temperature plasma catalytic coupling; The graphene-coated copper alloy powder is printed by binder jetting to form a heat dissipation part. The heat dissipation part is prepared after being sequentially treated by degreasing and exhaust, solid-phase sintering, hot isostatic pressing and heat treatment. The content of graphene in the graphene-coated copper alloy powder is 0.005wt%-0.03wt%, and the number of layers of the graphene coating layer is less than 10.

[0008] Further, the graphene-coated copper alloy powder is prepared by room temperature plasma catalytic coupling, comprising: The plasma pretreatment and surface nanocrystallization are performed on the atomized copper alloy powder to obtain copper alloy powder with a high-activity surface; wherein the atomized copper alloy powder is a copper-chromium alloy powder, and the chromium content is 0.5wt%-0.8wt%; A graphene coating layer is formed on the surface of the copper alloy powder with a high-activity surface by plasma deposition treatment; After the plasma deposition treatment is completed, the carbon source is turned off, and the powder is heated to 100°C-300°C in a pure hydrogen or hydrogen-argon mixed gas plasma environment for 1min-5min; After the holding is completed, it is cooled to room temperature in an inert atmosphere to obtain the graphene-coated copper alloy powder.

[0009] Further, the plasma pretreatment and surface nanocrystallization include the following steps: Vacuumize to 10 -4 Pa, introduce Ar / H2 mixed gas, and start the double-frequency plasma source to perform plasma treatment at a temperature of 25°C-40°C; wherein, first start the 400kHz low-frequency plasma, the power density is 0.2W / cm 3 ~1W / cm 3 , process for 3min-5min; then start the 13.56MHz high-frequency plasma, the power density is 0.5W / cm 3 ~0.8W / cm 3 , process for 5min-10min.

[0010] Further, the plasma deposition treatment includes the following steps: Switch the atmosphere to a mixed gas of carbon source and hydrogen, and perform plasma deposition at a temperature below 80°C for 10min-60min; wherein the carbon source is ethylene or acetylene, and the flow ratio of the carbon source to hydrogen is 1:5-20.

[0011] Further, the layer thickness of the binder jet printing forming is 30μm-50μm, the binder saturation is 60%-80%, the printing speed is 280mm / s-320mm / s, and the atmosphere is inert gas; wherein the binder is a water-based binder, and the mass fraction of deionized water is 85%-92%.

[0012] Further, the degreasing exhaust treatment includes vacuum degreasing treatment and hydrogen degassing treatment. The vacuum degree of the vacuum degreasing treatment is 10 -2 Pa, the temperature is 145℃~155℃, and the holding time is 3h~5h. The initial temperature of the hydrogen degassing treatment is 300℃, the hydrogen is introduced at a flow rate of 10L / m 3 ~15L / m 3 After holding for 2h~4h, the temperature is increased to 450℃ and held for 2h~4h, then increased to 600℃ and held for 2h~4h, and finally increased to 700℃ and held for 2h~4h.

[0013] Further, the temperature of the solid phase sintering treatment is 900℃~1000℃, the time is 1h~2h, and the heating rate is 2℃ / min~3℃ / min; the cooling method of the solid phase sintering treatment is: cooling to 500℃ with the furnace, then opening the air cooling and cooling to less than 100℃ in 2h and discharging.

[0014] Further, the temperature of the hot isostatic pressing treatment is 900℃~950℃, the pressure is 130MPa~150MPa, the holding time is 4h~5h, and the atmosphere is hydrogen atmosphere.

[0015] Further, the heat treatment is carried out in a reducing atmosphere and pressurized environment, the gas pressure is 3MPa~5MPa, and the heat treatment includes: The part after the hot isostatic pressing treatment is held at 850℃~950℃ for 1.5h~2.5h, then cooled to room temperature with nitrogen at a cooling speed of 15℃ / s~25℃ / s; And then held at 350℃~370℃ for more than 10h.

[0016] The application also provides a high-performance copper alloy optical module shell, the oxygen content of the high-performance copper alloy optical module shell is less than 30ppm, the electrical conductivity is higher than 92%IACS, the thermal conductivity is higher than 350W / mK, the tensile strength can reach 320MPa, and the hardness is greater than 150HB.

[0017] In summary, the application has the following advantages: The application provides a preparation method of a high-performance copper alloy optical module shell. First, graphene-coated copper alloy powder is prepared through a room temperature plasma process. The graphene content is controlled to be 0.005wt%-0.03wt% and the layer number is less than 10, which avoids performance degradation caused by excessive graphene agglomeration, and relies on the intrinsic advantages of few-layer graphene, and a stable interface constructed by the plasma, so that the high strength and high thermal conductivity characteristics of graphene are fully transferred to the copper matrix, solving the problem that graphene addition has no effect in traditional mechanical mixing. Then, the combination of room temperature powdering and binder jet printing cold forming is used to completely avoid the damage of high-temperature process to the structure of graphene. Subsequent degumming, sintering and other treatments are adapted to the characteristics of the powder, compared with conventional high-temperature additive manufacturing, the complex forming and the protection of the reinforcing phase are realized. Finally, the prepared optical module shell realizes complex geometric structure forming, and also considers the integrity of the reinforcing phase and the high performance of the material, which provides a feasible path for the large-scale preparation of high-performance graphene reinforced copper alloy parts. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the application. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 It is a flowchart of the preparation method of the high-performance copper alloy optical module shell provided by the application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the application will be described clearly and completely in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are some embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application.

[0021] Although graphene is known as the king of new materials, it has natural problems of poor wettability and chemical inertness with copper matrix. The mechanical mixing method commonly used in the prior art not only cannot avoid the serious agglomeration of graphene nanosheets, but more importantly, graphene and copper can only form a mechanically interlocking interface with extremely weak bonding strength. Such a weak interface not only cannot transfer the excellent intrinsic properties of graphene, but also becomes a strong scattering center for phonons and electrons, resulting in the thermal conductivity and strength of the composite material being even lower than that of the pure copper matrix. Based on the fundamental defects of the material level, there is also a reliability contradiction in the complex structure forming and performance. For example, the traditional die casting process is high in cost and long in cycle, and is difficult to adapt to the increasingly complex internal heat dissipation structure of the optical module shell. While the binder jetting and other additive manufacturing technologies can realize near-net forming, but the green density is low and the strength is poor, and it is easy to deform and break in subsequent processing. More seriously, the forming process can easily lead to anisotropy of the material microstructure, affecting the uniformity and long-term reliability of the overall performance of the shell. Moreover, the densification process of copper alloy production and the comprehensive performance are difficult to achieve synergy. Specifically, the subsequent densification process of the green body of the additive manufacturing is complex, and it is difficult to obtain a high-density final part, which directly restricts the thermal conductivity and mechanical properties of the material. At the same time, when the traditional heat treatment method strengthens the copper alloy matrix, it often sacrifices the thermal conductivity as a trade-off, and cannot achieve the synergy optimization of high strength and high heat dissipation, which is difficult to meet the harsh requirements of high-speed optical modules.

[0022] In summary, the prior art has not fundamentally solved the interface bonding problem of graphene and copper, which leads to the inability to exert the enhancement advantage of graphene, and thus causes a series of chain problems in complex forming, densification and process stability. Based on this, the present application provides a preparation method of a high-performance copper alloy optical module shell, which can effectively solve the problems of uniform dispersion and strong interface bonding of graphene in the copper matrix, and also take into account the synergy of complex structure forming, high densification and high strength / high thermal conductivity performance, so as to meet the needs of high-speed optical modules.

[0023] In a first aspect, the present application provides a preparation method of a high-performance copper alloy optical module shell, as shown in Figure 1 The preparation method comprises the following steps: S1. Preparing graphene-coated copper alloy powder by room temperature plasma catalytic coupling.

[0024] In the specific embodiment, the preparation of graphene-coated copper alloy powder by room temperature plasma catalytic coupling comprises the following steps: S101. Plasma pretreatment and surface nanocrystallization are performed using atomized copper alloy powder to obtain copper alloy powder with a high-activity surface; wherein the atomized copper alloy powder is a copper-chromium alloy powder with a chromium content of 0.5wt%-0.8wt%. Cr is a strong carbide-forming element and can have a beneficial effect on the growth of graphene catalyzed by plasma; and the low Cr content can maximize the high electrical conductivity of Cu and improve the strength of Cu. In step S101, Ar + ions in the high-energy plasma perform nanoscale etching and bombardment on the powder surface, forming a large number of nanoscale protrusions and defects; at the same time, H2 plasma performs atomic-level reduction on the surface oxides, exposing pure copper and alloy element atoms with high surface activity. Thus, a large number of active sites can be created on the powder surface at room temperature.

[0025] S102. A graphene coating layer is formed on the surface of the copper alloy powder with a high-activity surface by plasma deposition treatment.

[0026] S103. After the plasma deposition treatment, the carbon source is turned off, and the powder is heated to 100°C-300°C in a pure hydrogen or hydrogen-argon mixed gas plasma environment for 1min-5min. Alternatively, after the plasma deposition is completed, the power of the hydrogen plasma can be increased directly for a short time to promote the ordering of the graphene structure. Step S103 of the present application provides precise and controllable micro energy to efficiently drive the in-situ structural rearrangement and self-annealing of the deposited carbon atoms. This process does not require complex external intervention and can directly eliminate defects in the arrangement of carbon atoms, promote the local dispersion of sp 2 The carbon network connection forms larger-size and higher-order few-layer graphene sheets, directly improving the structural integrity and performance stability of graphene. At the same time, the energy effect can simultaneously achieve deep cleaning of the material surface. The highest temperature throughout the process is strictly controlled below 300°C, which is much lower than the recrystallization temperature of copper alloy above 500°C and the powder sticking temperature. This low-temperature characteristic not only completely avoids the problems of grain coarsening and performance degradation of the copper alloy substrate due to high temperature, but also effectively prevents the alloy powder from sticking and agglomerating during the treatment process, ensuring the dispersion of the powder and laying a foundation for the stability of the subsequent forming process.

[0027] S104. After the heat preservation, cool down to room temperature in inert atmosphere to obtain graphene-coated copper alloy powder. Preferably, the graphene content in the graphene-coated copper alloy powder is 0.005wt%-0.03wt%, and the number of layers of the graphene coating layer is <10 layers. The increase of the oxygen content of the graphene-coated copper alloy composite powder obtained by the present application compared with the oxygen content of the atomized copper alloy powder raw material is less than 5%, but it has high surface activity. At the same time, the low oxygen content and high surface activity of the present application are the basic conditions for the sintering density of more than 95% after the subsequent BJAM cold forming process, which can avoid the damage of graphene by high-temperature forming in conventional additive manufacturing process.

[0028] Preferably, in step S101, the plasma pretreatment and surface nanocrystallization include the following steps: vacuumizing to 10 -4 Pa, introducing Ar / H2 mixed atmosphere, and starting the double-frequency plasma source to perform plasma treatment at a temperature of 25°C-40°C; wherein, first start the 400kHz low-frequency plasma, the power density is 0.2W / cm 3 ~1W / cm 3 , process for 3min-5min; then start the 13.56MHz high-frequency plasma, the power density is 0.5W / cm 3 ~0.8W / cm 3 , process for 5min-10min. In the present application, the low-energy Ar + ions generated by the low-frequency plasma can perform mild etching on the surface layer of the powder, and then expose the Ti element active site; the high-energy Ar + ions generated by the high-frequency plasma can deeply penetrate the transition layer to form a nano-scale concave-convex structure, and the H2 plasma can completely reduce the oxides (such as CuO, Cr2O3 or ZrO2) in the surface layer and the transition layer to expose the pure metal atom surface. The surface active site density of the powder after plasma pretreatment can be improved, which lays the foundation for the subsequent graphene chemical bonding.

[0029] Preferably, in step S102, the plasma deposition process comprises the following steps: switching the atmosphere to a mixture of carbon source and hydrogen, and performing plasma deposition at a temperature lower than 80℃ for 10min-60min; wherein the carbon source is ethylene or acetylene, and the flow ratio of carbon source to hydrogen is 1:5-20. During the plasma deposition process of the present application, the mild temperature and the plasma synergistic effect can promote the rearrangement of carbon atoms within the graphene layers and eliminate some edge defects. The maximum temperature throughout the process does not exceed 80℃, which is much lower than the recrystallization temperature of copper alloy, and can ensure the stability of the powder structure. In the plasma environment, the carbon source gas can be efficiently dissociated by high-energy electrons to generate a large number of highly active carbon-containing radicals and atomic hydrogen. This dissociation process has the advantages of strong reaction targeting and high active particle yield. Most notably, these active particles have extremely high reactivity at room temperature, eliminating the need for additional high-temperature excitation. This not only simplifies the process energy consumption control, but also avoids the performance damage that high-temperature environment may cause to the material. In the process of interacting with the pre-processed alloy powder surface, this process achieves multiple advantages through chemical bonding deposition: on the one hand, carbon-containing radicals can directly form stable chemical bonds with copper atoms and chromium atoms on the powder surface, significantly improving the bonding strength of the deposited structure and the substrate compared to physical adsorption; on the other hand, carbon radicals can directly construct sp 2 hybrid carbon six-membered ring structure at room temperature through surface migration and atomic rearrangement, achieving efficient nucleation at low energy consumption; at the same time, atomic hydrogen can selectively etch amorphous carbon impurities and promote the ordering of carbon six-membered ring structures, effectively ensuring the structural purity and quality of the deposition product, providing core support for the subsequent formation of high-quality graphene coating layer.

[0030] S2. The graphene-coated copper alloy powder is formed by binder jet printing to prepare a heat dissipation part.

[0031] In the specific implementation, the layer thickness of the binder jet printing is 30-50μm, the binder saturation is 60%-80%, the printing speed is 280-320mm / s, and the atmosphere is inert gas; wherein the binder is a water-based binder, and the mass fraction of deionized water is 85%-92%. The BJAM forming (binder jet printing forming) process can be used at room temperature or low temperature (temperature lower than 100℃) to prevent the structure of graphene from being damaged by conventional additive manufacturing methods (such as SLM or EBM, etc. The melting temperature of the two copper alloys is generally higher than 1500℃). The BJAM of the present application can print irregularly shaped powders, thereby reducing the cost of powders.

[0032] S3. The heat dissipation part is sequentially subjected to degreasing and exhaust treatment, solid phase sintering treatment, hot isostatic pressing treatment, and heat treatment to obtain a high-performance copper alloy optical module shell.

[0033] In the embodiment, the degreasing exhaust treatment includes vacuum degreasing treatment and hydrogen degassing treatment; wherein the vacuum degree of the vacuum degreasing treatment is 10 -2 Pa, the temperature is 145℃~155℃, and the holding time is 3h~5h; the initial temperature of the hydrogen degassing treatment is 300℃, the hydrogen is introduced at a flow rate of 10L / m 3 ~15L / m 3 , the temperature is raised to 450℃ and held for 2h~4h, the temperature is raised to 600℃ and held for 2h~4h, and the temperature is raised to 700℃ and held for 2h~4h; the hydrogen is used to reduce the adsorbed gas of the sample and remove the residual binder, so as to prevent the copper matrix from being oxidized to affect the final performance and prevent the formation of Cr2O3. In the degreasing and degassing stages, the temperature raising rate is not higher than 2℃ / min.

[0034] In the embodiment, the temperature of the solid phase sintering treatment is 900℃~1000℃, the time is 1h~2h, and the temperature raising rate is 2℃ / min~3℃ / min; the cooling method of the solid phase sintering treatment is: cooling to 500℃ in the furnace, opening the air cooling and reducing the temperature to less than 100℃ in 2h to discharge the furnace. The temperature of 900℃~1000℃ is lower than the melting point of copper and the traditional sintering temperature, which can avoid the damage or floating aggregation of the graphene structure and guarantee the value of the graphene in enhancing the heat conduction. The holding time of 1h~2h can make the density reach more than 95%, and the subsequent hot isostatic pressing is not needed, which breaks through the limitation of the traditional process on complex parts; the slow temperature raising rate of 2℃ / min~3℃ / min can reduce the thermal stress and prevent the thin-walled part from cracking.

[0035] In the embodiment, the temperature of the hot isostatic pressing treatment is 900℃~950℃, the pressure is 130MPa~150MPa, the pressure holding time is 4h~5h, and the atmosphere is hydrogen atmosphere.

[0036] In the embodiment, the heat treatment is carried out in a reducing atmosphere and pressurized environment, and the gas pressure is 3MPa~5MPa, which includes: holding the part after the hot isostatic pressing treatment at 850℃~950℃ for 1.5h~2.5h and rapidly cooling to room temperature by using nitrogen. Then, holding at 350℃~370℃ for more than 10h. The rapid cooling by using nitrogen in the heat treatment can effectively avoid the influence of oxygen in the conventional solid solution medium water and oil on the graphene, and can prevent the formation of oxide skin on the surface and reduce the subsequent processing procedures. The gas pressurization, low temperature and long aging are the key parameters for the graphene to play a role, and the aging temperature lower than the conventional CuCr and CuCrZr aging temperature (450℃~500℃) is to prevent over-aging from causing low strength, and the long-time pressurization and holding is to improve the interface state between the graphene and the copper to ensure that the graphene can play a role.

[0037] In a second aspect, based on the overall inventive concept, the application further provides a high-performance copper alloy optical module shell, the oxygen content of the high-performance copper alloy optical module shell is less than 30 ppm, the electrical conductivity is higher than 92% IACS, the thermal conductivity is higher than 350 W / mK, the tensile strength can reach 320 MPa, and the hardness is greater than 150 HB.

[0038] In summary, the application constructs a new cold powder and cold process preparation method of the high-performance copper alloy optical module shell through the synergistic effect of the room temperature plasma catalytic coupling preparation of graphene-coated copper alloy powder and the BJAM cold forming additive manufacturing process. Compared with the traditional hot processing process, the application has the following advantages: (1) The application reduces the core temperature of graphene synthesis and powder preparation from nearly 1000 degrees in the traditional process to the interval of room temperature to 300 DEG C, completely eliminates the industry pain point that alloy powder is easy to stick and aggregate in high temperature environment, guarantees the original spherical morphology and dispersity of the powder, and lays a key foundation for the subsequent forming process. The low temperature environment avoids the problems of grain coarsening and oxidation deterioration of the copper alloy substrate due to high temperature, and completely retains the intrinsic properties of the substrate material.

[0039] (2) In the room temperature non-equilibrium plasma environment, the interface formed by graphene and copper alloy substrate has unique properties different from traditional hot processing: on the one hand, the interface forms a stable chemical bonding state through in-situ chemical bonding, changing the weak interface mode of physical adsorption in traditional mechanical mixing; on the other hand, the difference in atomic diffusion rate under low temperature conditions forms an optimized interface stress distribution, effectively relieving the thermal expansion mismatch problem between graphene and copper substrate.

[0040] (3) The graphene-coated copper alloy powder prepared in the application does not have the best synergistic effect with the traditional thermal process, but is more suitable for the BJAM cold forming additive manufacturing process. The strong synergistic relationship between the two solves the core contradiction that the traditional thermal process cannot balance complex structure forming and enhanced phase integrity. The specific synergistic effects are as follows: first, the powder prepared by room temperature plasma has no thermal adhesion and can maintain the original spherical morphology and high flowability. The stable implementation of the BJAM process highly depends on uniform powder spreading. Poor powder flowability can easily lead to uneven printing layer thickness, defects, or even printing failure. With the synergy of the two, the high flowability of the powder directly provides the necessary physical premise for the BJAM process. This advantage is unmatched by high-temperature sinterable high-temperature powder, which guarantees the feasibility of complex structure printing from the source. Second, the powder preparation is carried out at low temperature throughout the process, avoiding high-temperature oxidation. In combination with the cleaning effect of the plasma, the powder has very low oxygen content and high activity at the interface. The BJAM process requires subsequent high-temperature stages such as debinding and sintering. If there are oxides or impurities on the surface of the powder, it will seriously deteriorate the performance of the final part. With the synergy of the two, the high-purity and high-activity powder sweeps away the chemical obstacles for the BJAM post-processing, so that the graphene-coated copper alloy powder of the application can obtain a dense part with high thermal conductivity, high strength, and high electrical conductivity through sintering and hot isostatic pressing. Third, the room temperature synthesis environment can ensure that the sp 2 crystal structure of graphene is not damaged, and there is no wrinkle or defect caused by thermal stress. The cold forming characteristics (room temperature bonding) of the BJAM process further realize zero damage to graphene. From powder preparation to part forming, the strengthening potential of graphene is completely preserved and transferred to the final product, truly playing its role in strengthening strength and thermal conductivity, and solving the problem of easy damage to the reinforcing phase in traditional thermal processes. Fourth, the room temperature plasma powder preparation takes room temperature as the starting point of the process, with very low energy consumption. The BJAM forming process itself is also a low-temperature operation. The synergy of the two forms a low-temperature manufacturing closed loop from powder to part, and the core links all avoid the temperature window that damages graphene and copper alloy.

[0041] The above technical solutions of the application will be described in detail below in conjunction with specific embodiments.

[0042] Example 1 The embodiment provides a preparation method of a high-performance copper alloy optical module shell, comprising the following steps: (1) Select an atomized copper alloy powder with a chromium content of 0.5wt%, a particle size D90<30μm, and a spherical morphology.

[0043] (2) Place the atomized copper alloy powder in a plasma reaction chamber, vacuumize to 10 -4Pa, Ar / H2 mixed gas atmosphere (Ar / H2 flow ratio 10:1) was introduced, and plasma treatment was carried out at 28℃ temperature by starting double-frequency plasma source; wherein, the plasma treatment first started 400kHz low-frequency plasma, the power density was 0.5W / cm 3 , and the treatment lasted for 5min; then 13.56MHz high-frequency plasma was started, the power density was 0.8W / cm 3 , and the treatment lasted for 10min.

[0044] (3) The reaction cavity temperature was kept below 80℃, the gas was switched to the mixed gas of carbon source gas and hydrogen (ethylene / H2 flow ratio 1:10), and the plasma deposition time was maintained for 30min.

[0045] (4) After the deposition was completed, the carbon source gas was turned off, and the powder was heated to 300℃ under the pure H2 plasma environment, and was kept for 2min.

[0046] (5) Cooling to room temperature under argon atmosphere, the graphene-coated copper alloy composite powder was obtained, which was completely non-adhesive and had excellent flowability. The mass ratio of graphene was 0.02wt%, and the number of graphene layers was less than 10.

[0047] (6) The STL file of the complex part was sliced according to the shape of the high-performance copper alloy optical module shell, and was imported into the BJAM printer system. The important printing parameters were set (layer thickness 50μm, binder saturation 60%, printing speed 300mm / s), and the heat dissipation part with complex structure was printed. The binder was water-based binder, and the water content was 90wt%. The rest was organic solvent (the same below). The printing atmosphere was nitrogen. 40wt% of the organic solvent was propylene glycol monomethyl ether (to maintain the stability of the whole binder), 30wt% was polyethylene glycol (a binder enhancer to enhance the overall strength of the printed green body), 20wt% was diethylene glycol (to improve the wettability of printing, so that the binder can better spread and penetrate on the powder surface), and 10wt% was nano-SiO2 (a rheological modifier to improve the flowability and spreading performance of the binder).

[0048] (7) Vacuumizing from room temperature, the vacuum degree was kept at 10 -2 Pa, and the heat dissipation part was degreased by increasing the temperature to 150℃ and keeping for 5h. After the heat preservation was completed, the temperature was randomly and slowly increased to 300℃ for degassing treatment, and the heating rate was 1℃ / min.

[0049] (8) Hydrogen was introduced from the temperature of 300℃, the hydrogen flow was 15L / m 3 , and the degassing treatment was carried out between 300℃ and 700℃. The temperature was kept at 300℃, 450℃, 600℃ and 700℃ for 2h respectively, and the heating rate was 1℃ / min.

[0050] (9) After the degassing stage is completed, the temperature is increased to 900°C, sintered for 2h, and solid-phase sintered to 95%-98% density. Then, the furnace is cooled, the temperature is reduced to 500°C, and air cooling is started to rapidly cool to less than 100°C in 2h and then discharged.

[0051] (10) The sintered sample is densified by hot isostatic pressing to prepare a high-heat-dissipation part with a density of more than 99.5% and an oxygen content of less than 10ppm. The hot isostatic pressing parameters include 950°C, 150MPa, and pressure holding for 4h, and the atmosphere is argon.

[0052] (11) The high-heat-dissipation part obtained by hot isostatic pressing is heated at 850°C for 2h, and the cooling method is nitrogen rapid cooling to 20°C.

[0053] (12) Then, under the pressure treatment of a reducing atmosphere, the high-performance copper alloy optical module shell is prepared by being kept at 350°C for more than 12h.

[0054] Example 2 The embodiment provides a preparation method of a high-performance copper alloy optical module shell, including the following steps: (1) An atomized copper alloy powder with a chromium content of 0.8wt% is selected, the particle size D90 is less than 30μm, and the morphology is spherical.

[0055] (2) The atomized copper alloy powder is placed in a plasma reaction chamber, vacuumized to 10 -4 Pa, argon / hydrogen mixed gas (argon / hydrogen flow ratio 5:1) is introduced, and a double-frequency plasma source is started to perform plasma treatment at a temperature of 40°C; wherein the plasma treatment first starts a 400kHz low-frequency plasma, the power density is 0.2W / cm 3 , and the treatment time is 5min; then a 13.56MHz high-frequency plasma is started, the power density is 0.5W / cm 3 , and the treatment time is 10min.

[0056] (3) The temperature of the reaction chamber is kept below 80°C, the gas is switched to a mixture of carbon source gas and hydrogen (acetylene / hydrogen flow ratio 1:5), and the plasma is maintained for 60min of deposition time.

[0057] (4) After the deposition is completed, the carbon source gas is turned off, and the powder is heated to 200°C in an argon / hydrogen mixed gas (argon / hydrogen flow ratio 5:1) plasma environment, and kept for 5min.

[0058] (5) The temperature is cooled to room temperature in an inert atmosphere to obtain a graphene-coated copper alloy composite powder with excellent flowability and no adhesion. The mass fraction of graphene is 0.005wt%, and the number of graphene layers is less than 10.

[0059] (6) The STL file of the complex part according to the shape of the high-performance copper alloy optical module shell is sliced, imported into the BJAM printer system, and important printing parameters (layer thickness 30 pm, binder saturation 70%, printing speed 300 mm / s) are set to print the complex structure of the heat dissipation part. Among them, the binder is a water-based binder, the water content is 90wt%, the rest is organic solvent, and the printing atmosphere is nitrogen.

[0060] (7) Vacuum extraction starts from room temperature, the vacuum degree is kept at 10 -2 Pa, the temperature is raised to 150℃ for 3h to degrease the heat dissipation part, and then slowly heated to 300℃ for degassing treatment, the heating rate is 1℃ / min.

[0061] (8) Hydrogen is introduced from 300℃, the hydrogen flow is 10L / m 3 , and the degassing treatment is carried out between 300℃~700℃, respectively at 300℃, 450℃, 600℃, 700℃ for 3h, and the heating rate is 1℃ / min.

[0062] (9) After the degassing stage is completed, the temperature is raised to 1000℃, and sintering is carried out for 1h, and the solid phase sintering is carried out to 95%~98% density. Then the furnace is cooled down, and when the temperature is reduced to 500℃, the air cooling is started, and the temperature is rapidly reduced to less than 100℃ in 2 hours.

[0063] (10) The sintered sample is densified by hot isostatic pressing to prepare a high-heat-dissipation part with a density of 99.5% or more and an oxygen content of less than 10ppm.

[0064] Among them, the hot isostatic pressing parameters include: 950℃, 150MPa, holding pressure for 4h, and the atmosphere is argon.

[0065] (11) The high-heat-dissipation part obtained by hot isostatic pressing is heated at 900℃ for 2h, and the cooling method is nitrogen rapid cooling to 25℃.

[0066] (12) Then, under the pressure treatment of the reducing atmosphere, it is kept at 350℃ for 15 hours to prepare a high-performance copper alloy optical module shell.

[0067] Example 3 The present embodiment provides a preparation method of a high-performance copper alloy optical module shell, comprising the following steps: (1) Selecting an atomized copper alloy powder with a chromium content of 0.6wt%, a particle size D90<30pm, and a spherical morphology.

[0068] (2) The atomized copper alloy powder is placed in a plasma reaction chamber, and vacuum extraction is carried out to 10 -4Pa, Ar / H2 mixed gas atmosphere (Ar / H2 flow ratio 20:1) is introduced, and double-frequency plasma source is started at 30℃ to perform plasma treatment; wherein, the plasma treatment is first started with 400kHz low-frequency plasma, and the power density is 0.5W / cm 3 , and then 13.56MHz high-frequency plasma is started, and the power density is 0.8W / cm 3 , and the treatment time is 10min.

[0069] (3) The reaction cavity temperature is kept below 80℃, the gas is switched to carbon source gas (mixed gas of ethylene / H2 (ethylene / H2 flow ratio 1:20), the plasma is maintained, and the deposition time is 20min.

[0070] (4) After the deposition is completed, the carbon source gas is turned off, the powder is heated to 280℃ under pure H2 plasma environment, and the temperature is kept for 2min.

[0071] (5) Cooling to room temperature under inert atmosphere, graphene-coated copper alloy composite powder with excellent flowability and no adhesion is obtained. The mass fraction of graphene is 0.01wt%, and the number of graphene layers is less than 10.

[0072] (6) The STL file of the complex part is sliced according to the shape of the high-performance copper alloy optical module shell, and is imported into the BJAM printer system. Important printing parameters (layer thickness 30μm, binder saturation 80%, printing speed 300mm / s) are set, and a complex structure heat dissipation part is printed. The binder is water-based binder, the water content is 90wt%, the rest is organic solvent, and the printing atmosphere is nitrogen.

[0073] (7) Vacuumizing from room temperature, the vacuum degree is kept at 10 -2 Pa, the temperature is increased to 150℃ and kept for 5h to remove the adhesive of the heat dissipation part, and then the temperature is slowly increased to 300℃ for degassing treatment at a rate of 1℃ / min.

[0074] (8) Hydrogen is introduced from 300℃, the hydrogen flow is 15L / m 3 , and the degassing treatment is carried out at 300℃~700℃, and the temperature is kept at 300℃, 450℃, 600℃ and 700℃ for 2h respectively, and the temperature increasing rate is 1℃ / min.

[0075] (9) After the degassing stage is completed, the temperature is increased to 1000℃, and sintering is carried out for 1h, and the solid phase sintering is carried out to 95%~98% density. Then the furnace is cooled down, and the temperature is reduced to 500℃, and then the air cooling is started, and the temperature is rapidly reduced to less than 100℃ in 2h, and then the furnace is discharged.

[0076] (10) The sintered sample is densified by hot isostatic pressing to prepare a high-heat-dissipation part with a density of more than 99.5% and an oxygen content of less than 10 ppm.

[0077] The hot isostatic pressing parameters include 950℃, 130MPa, 5h holding, and argon atmosphere.

[0078] (11) The high-heat-dissipation part obtained by hot isostatic pressing is heated at 950℃ for 2h, and the cooling method is nitrogen rapid cooling to 23℃.

[0079] (12) Then, under the pressure treatment of a reducing atmosphere, the high-performance copper alloy optical module shell is prepared by holding at 350℃ for 20h.

[0080] Comparative Example 1 The difference between this comparative example and Example 1 is that the atomized copper alloy powder is directly subjected to chemical vapor deposition (CVD) at 980℃, i.e., the mixed gas of carbon source gas and hydrogen (ethylene:H2 flow ratio 1:10) is deposited on the surface of the atomized copper alloy powder for 30min at a temperature of 980℃.

[0081] Comparative Example 2 The difference between this comparative example and Example 1 is that the graphene copper alloy composite powder is prepared by a traditional plasma enhanced chemical vapor deposition method. Specifically, the atomized copper alloy powder is placed in a plasma reaction chamber, vacuumed to 10 -4 Pa, the mixed gas of carbon source gas and hydrogen (ethylene:H2 flow ratio 1:10) is introduced, and the deposition time is 30min at 600℃.

[0082] Comparative Example 3 The difference between this comparative example and Example 1 is that the graphene and atomized copper alloy powder are mixed by a conventional mechanical mixing method to obtain a mixed powder.

[0083] Comparative Example 4 The difference between this comparative example and Example 1 is that the atomized copper alloy powder is directly subjected to printing forming, i.e., the atomized copper alloy powder is directly used for printing in step (6).

[0084] Comparative Example 5 The difference between this comparative example and Example 1 is that the graphene-coated copper alloy composite powder obtained is not subjected to BJAM printing, but is directly subjected to laser printing (model slicing is performed first, and then laser printing is performed). The printing parameters include laser power 60W, printing layer thickness 50μm, and printing speed 800mm / s. The subsequent processes are consistent with Example 1.

[0085] Comparative Example 6 The difference between the present comparative example and Example 1 is that the obtained graphene-coated copper alloy composite powder is not subjected to BJAM printing, but is directly used in a conventional high-temperature powder metallurgy process, the sintering temperature of which is 1050°C, the holding time is 10h, the hot isostatic pressing temperature is 1000°C, and the subsequent processes are consistent with steps (8)-(11) of Example 1. In the production process of Comparative Example 6, the conventional powder metallurgy process cannot be used to prepare complex shapes, and the light module shell is a thin-walled complex structural part, so the shaped parts produced in Comparative Example 6 are cylindrical or cubic, not the shape of the light module shell of the present application. There are two problems in the process of Comparative Example 6: 1) During the molding process, the severe friction between the powder and the powder, and the severe friction between the powder and the mold, will damage the structure of the graphene, resulting in the inability of the graphene to play a role. 2) The sintering temperature of conventional powder metallurgy is generally around 1020°C-1050°C, and the time is also relatively long, more than 5h, but it is still not completely densified, but the density will be higher than 93% (in powder metallurgy, 93% density or more indicates that there are no through holes in the block) can be directly hot isostatic pressed. At the same time, due to the combined effects of friction and high temperature, the structure of the graphene is damaged and cannot play the role of the thermal conductivity of the graphene. That is, the method of Comparative Example 6 has a relatively high density and can be directly hot isostatic pressed without the need for a cladding, but the structure of the graphene is damaged and cannot be directly used to produce complex-shaped light module shells.

[0086] Experimental Example 1. The properties of the copper alloy powder obtained in Example 1 and Comparative Examples 1-3 are shown in Table 1.

[0087] Table 1 Properties of the copper alloy powder obtained in Example 1 and Comparative Examples 1-3

[0088] The increase in oxygen content in Table 1 is a comparison with respect to the original copper alloy powder (i.e., the change in the graphene-coated copper alloy composite powder with respect to the atomized copper alloy powder raw material).

[0089] As can be seen from Table 1, the graphene-coated copper alloy powder of Example 1 is prepared by room temperature plasma catalytic coupling, the powder has no adhesion and excellent fluidity, the graphene Raman ID / IG value is 0.8-1.2 (complete structure), and the oxygen content increase is less than 5%. The comparative example 1 (980°C hot CVD) and the comparative example 2 (600°C traditional PECVD) have powder adhesion / balling and poor fluidity due to high temperature, the oxygen content increase is 10%-30%, and the graphene ID / IG value is lower (0.3-0.9), which shows that high temperature can destroy the graphene structure and cause powder oxidation adhesion. The comparative example 3 uses mechanical mixing method, although the reaction is at room temperature, the graphene is seriously disordered (no Raman signal), the powder is agglomerated and has no fluidity, and the oxygen content increase is as high as 30%-50%. It shows that the example of the application realizes in-situ coating by plasma, so that the trace graphene is uniformly dispersed and a stable coating layer is formed. It can be seen that the method of the application for preparing graphene-coated copper alloy powder by room temperature plasma catalytic coupling solves the problem of mixing and dispersion of graphene and copper powder.

[0090] 2, the performance of the copper alloy light module shell obtained from Example 1 and Comparative Examples 4-6 is shown in Table 2.

[0091] Table 2 Performance of copper alloy light module shell obtained from Example 1 and Comparative Examples 4-6

[0092] In which, the comparative example 4 does not increase the surface activity of the powder by the powdering process, resulting in a sintered material density of less than 93%, which needs to be treated by jacketed hot isostatic pressing. Although the comparative example 6 uses the powdering process to increase the surface activity of the powder, long time high temperature can damage the graphene structure, and the friction between the powders and the friction between the powders and the mold during the die pressing process can also damage the graphene structure. Finally, the graphene structure is damaged, and the graphene cannot play the effect of heat conduction enhancement, so the application uses the BJAM process and the subsequent low temperature sintering process to maximize the protection of the graphene structure from damage. For light module parts, the material utilization rate of the conventional powder metallurgy process is less than 30%, and the material utilization rate of the BJAM process used in the application can reach more than 85% after near net shape forming.

[0093] As can be seen from Table 2: Example 1 is the most optimal in terms of graphene structure integrity (ID / IG = 0.9), tensile strength (320 MPa), thermal conductivity (375 W / m·K), etc. Among them, Comparative Example 4 (without graphene) has a significant performance decline, Comparative Example 5 (laser printing) and Comparative Example 6 (powder metallurgy at room temperature) have graphene destroyed (no Raman signal) due to high temperature or process defects, and the performance is only slightly better than that of Comparative Example 4, indicating that the integrity of the graphene structure is directly related to the performance improvement. Specifically, the comparison of Example 1 with Comparative Examples 5 and 6 shows that only the BJAM cold forming printing process can protect the graphene while achieving complex shape preparation. Although Comparative Example 5 can form complex parts, the laser printing destroys the graphene at high temperature; Comparative Example 6 cannot produce complex shapes and can only produce simple square or cylindrical shapes, so it cannot produce the optical module shell of the present application. Example 1, with the synergy of cold powder and cold forming, can achieve 99.8% density without a sleeve, balancing the forming degree of freedom and performance. Comparative Example 4 (directly using copper powder without graphene coating), the powder is not active, the sintering density is less than 93%, so it needs to be handled with a sleeve, and the oxygen content (80 ppm) is much higher than that of Example 1 (25 ppm). The high activity of the graphene-coated powder of Example 1 of the present application allows the sintering density to reach 95% to 98%, and the subsequent hot isostatic pressing does not require a sleeve, and the low oxygen content can further protect the electrical and thermal conductivity performance.

[0094] In summary, the present application realizes near-net shaping of complex parts such as optical module shells through the synergistic effect of powder performance optimization-process collaborative design-precise temperature control, and further guarantees the comprehensive performance of the material with high thermal conductivity (≥440 W / mK), high strength (≥450 MPa) and high electrical conductivity (≥85% IACS), providing a feasible technical solution for the material and manufacturing upgrade in the field of high-speed optical modules. Specifically: 1. Since conventional copper alloy spherical powder uses traditional sintering process, the density is generally less than 90%. When the density of the blank is less than 90%, hot isostatic pressing (HIP) densification must rely on sleeve processing. The sleeve process not only has a complex process, but more importantly, it cannot be adapted to the preparation of complex shape parts, which severely limits the freedom of part design and manufacturing. The present application prepares low-oxygen-content (oxygen content increase ≤3%) and high-surface-activity graphene-coated copper alloy powder, achieving double technical value. On the one hand, the introduction of graphene provides core support for performance improvement; on the other hand, the high activity of the powder significantly optimizes the sintering response, allowing the blank to achieve a density of more than 95% through conventional sintering, without the need for a sleeve for subsequent hot isostatic pressing, ultimately obtaining a dense part with a density of ≥99.5%, which clears the key obstacles for the preparation of complex structures such as optical module shells with high performance.

[0095] 2. The structural integrity of graphene is a prerequisite for its reinforcing effect, while conventional additive manufacturing technologies (such as selective laser melting (SLM) and electron beam melting (EBM) all rely on high-temperature melting and forming. High-temperature environments can severely damage the spline structure of graphene. 2 The crystalline structure of graphene leads to a loss of its reinforcing and thermal conductivity properties. To address this, this application constructs a complete low-temperature system encompassing low-temperature powder preparation (room temperature - 80℃), low-temperature molding (room temperature BJAM printing), and low-temperature densification (sintering 900℃~1000℃, hot isostatic pressing 900℃~950℃, aging 350℃~370℃). All heating-related process steps have their temperature windows strictly controlled below the melting point of copper (1083℃). This fundamentally avoids high-temperature-induced structural damage to graphene and prevents graphene from floating and agglomerating on the surface of the molten copper matrix, thus ensuring uniform distribution and full utilization of graphene within the copper matrix.

[0096] 3. The graphene-coated copper alloy powder prepared in this application, combined with binder jet printing (BJAM) cold forming additive manufacturing, forms a synergistic system of cold powder and cold process, with advantages in two dimensions. First, while traditional powder metallurgy may achieve similar material properties through complex processes, it is limited by molding methods such as compression molding, making it impossible to achieve near-net-shape forming of complex thin-walled parts such as optical module housings, resulting in low material utilization and high subsequent processing costs. Second, most additive manufacturing technologies rely on high-temperature melting, which cannot protect graphene; however, the room-temperature forming characteristics of the BJAM process are highly compatible with the low-temperature preparation characteristics of the powder in this application, making it the only additive manufacturing technology currently capable of simultaneously meeting the dual requirements of graphene protection and complex structure forming.

[0097] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of this application.

[0098] Finally, it is to be understood that the terms such as first and second, etc., are used herein for the purpose of differentiating one element from another element only, and do not necessarily indicate or imply any actual relationship or order between the elements. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or terminal device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or terminal device including the element.

[0099] The principles and implementation manners of the present application are described by using specific examples in the present application, and the above example descriptions are only used to help understand the method and core idea of the present application; meanwhile, for the general technical personnel in the art, the specific implementation manners and application ranges will be changed according to the idea of the present application, and in view of the above, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A method for preparing a high-performance copper alloy optical module housing, characterized in that, Includes the following steps: Graphene-coated copper alloy powder was prepared by room temperature plasma catalytic coupling. The graphene-coated copper alloy powder was formed by adhesive jet printing to prepare a heat dissipation part; The heat dissipation component is manufactured by sequentially subjecting it to degumming and venting treatment, solid-state sintering treatment, hot isostatic pressing treatment, and heat treatment; wherein, The graphene content in the graphene-coated copper alloy powder is 0.005wt%~0.03wt%, and the number of graphene coating layers is <10.

2. The preparation method according to claim 1, characterized in that, The preparation of graphene-coated copper alloy powder via room-temperature plasma catalytic coupling includes: A copper alloy powder with a highly active surface is obtained by plasma pretreatment and surface nano-sizing of atomized copper alloy powder; wherein the atomized copper alloy powder is a copper-chromium alloy powder with a chromium content of 0.5wt%~0.8wt%. A graphene coating layer is formed on the surface of the copper alloy powder with a highly active surface through plasma deposition. After the plasma deposition process is completed, the carbon source is turned off, and the powder is heated to 100℃~300℃ in a plasma environment of pure hydrogen or Ar / H2 mixture for 1min~5min. After the heat preservation is completed, the mixture is cooled to room temperature in an inert atmosphere to obtain the graphene-coated copper alloy powder.

3. The preparation method according to claim 2, characterized in that, The plasma pretreatment and surface nanoforming include the following steps: Vacuum up to 10 -4 Pa, an Ar / H2 mixed atmosphere was introduced, and a dual-frequency plasma source was turned on to perform plasma treatment at a temperature of 25℃~40℃; among which... First, activate the 400kHz low-frequency plasma with a power density of 0.2W / cm³. 3 ~1W / cm 3 Process for 3-5 minutes; then restart the 13.56MHz high-frequency plasma with a power density of 0.5W / cm³. 3 ~0.8W / cm 3 Process for 5 to 10 minutes.

4. The preparation method according to claim 3, characterized in that, The plasma deposition process includes the following steps: The atmosphere is switched to a mixture of carbon source and hydrogen, and plasma deposition is carried out at a temperature below 80°C for 10 min to 60 min; wherein the carbon source is ethylene or acetylene, and the flow ratio of the carbon source to hydrogen is 1:5 to 20.

5. The preparation method according to claim 1, characterized in that, The adhesive jet printing process produces a layer thickness of 30μm to 50μm, an adhesive saturation of 60% to 80%, a printing speed of 280mm / s to 320mm / s, and an atmosphere of inert gas or nitrogen. The adhesive is an aqueous adhesive with a deionized water mass fraction of 85% to 92%.

6. The preparation method according to claim 1, characterized in that, The degumming and degassing process includes vacuum degumming and hydrogen degassing. The vacuum degree of the vacuum degumming process is 10. -2 Pa, temperature 145℃~155℃, heat preservation time 3h~5h; The initial temperature for the hydrogen degassing treatment is 300°C, at a rate of 10 L / m³. 3 ~15L / m 3 Hydrogen gas is introduced at a certain flow rate, and the temperature is maintained for 2-4 hours. Then, the temperature is increased to 450℃ and maintained for 2-4 hours; the temperature is increased to 600℃ and maintained for 2-4 hours; the temperature is increased to 700℃ and maintained for 2-4 hours.

7. The preparation method according to claim 1, characterized in that, The solid-state sintering treatment is performed at a temperature of 900℃~1000℃ for 1h~2h, with a heating rate of 2℃ / min~3℃ / min. The cooling method for the solid-state sintering treatment is as follows: the furnace is cooled to 500℃, air cooling is turned on, and the temperature is reduced to less than 100℃ within 2h before the furnace is removed.

8. The preparation method according to claim 1, characterized in that, The hot isostatic pressing treatment is performed at a temperature of 900℃~950℃, a pressure of 130MPa~150MPa, a holding time of 4h~5h, and in a hydrogen atmosphere.

9. The preparation method according to claim 1, characterized in that, The heat treatment is carried out in a reducing atmosphere under pressure, with a gas pressure of 3 MPa to 5 MPa, including: The parts that have undergone hot isostatic pressing are held at 850℃~950℃ for 1.5h~2.5h, then rapidly cooled to room temperature with nitrogen; and then held at 350℃~370℃ for more than 10h.

10. A high-performance copper alloy optical module housing, characterized in that, The high-performance copper alloy optical module housing obtained by the preparation method according to any one of claims 1-9 has an oxygen content of less than 30 ppm, an electrical conductivity of more than 92% IACS, a thermal conductivity of more than 350 W / mK, a tensile strength of up to 320 MPa, and a hardness of not less than 150 HB.

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