Display panel and display device

Abstract

The invention relates to the technical field of display, and discloses a display panel and a display device.The display panel comprises a display area, a bending area and a binding area, and the binding area is located on the side, away from the display area, of the bending area; the display panel comprises at least one first groove, and the first groove is located in at least one side of the binding area in the first direction; in the direction parallel to the plane where the display panel is located, the first direction intersects with the direction in which the display area points to the binding area; the display panel comprises a substrate and an array driving layer, wherein the array driving layer comprises at least one array organic layer; the first groove penetrates through all the array organic layers included in the array driving layer. The display device comprises the display panel. The first groove penetrating through all the array organic layers is formed in the position, closest to the cutting line, of the binding area, so that a water vapor path can be effectively cut off or a water vapor invasion path can be reduced, the problem of peeling between film layers can be avoided, the reliability of the panel can be improved, and the display effect can be ensured.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are active-matrix display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, and extremely fast response speed. Flexible OLED displays also have the advantage of being bendable, thus showing very promising development prospects.

[0003] Currently, display products on the market are gradually shifting towards high-end, high refresh rates, narrow bezels, and superior display effects. Therefore, panel design needs continuous optimization to adapt to market demands. However, flexible display products still face many unknowns. For example, in high-temperature and high-humidity environments, the demands on panel reliability are increasing, posing greater challenges. Based on current panel designs, especially in high-temperature and high-humidity environments, localized areas of the panel are still prone to peeling, leading to various functional defects such as abnormal image display. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a display panel and a display device to solve the problem of poor local reliability verification in the bonding area of ​​existing display devices.

[0005] This disclosure provides a display panel, including a display area, a bending area, and a binding area, wherein the binding area is located on the side of the bending area away from the display area; The display panel includes at least one first recess, which is located on at least one side of the bonding area along a first direction; wherein, in a direction parallel to the plane of the display panel, the first direction intersects the direction from the display area to the bonding area; The display panel includes a substrate and an array driving layer located on one side of the substrate, the array driving layer including at least one array organic layer; The first groove extends through all the array organic layers included in the array driving layer.

[0006] Based on the same inventive concept, this disclosure also provides a display device, which includes the above-described display panel.

[0007] The technical solution provided in this disclosure has the following advantages compared with the prior art: The display panel provided in this disclosure includes a display area and a non-display area at least partially surrounding the display area. The display area can be understood as a flat region, and the non-display area may include a bent area and a bonding area located at the lower bezel of the display panel. Along a second direction, the bonding area is located on the side of the bent area away from the display area. The second direction can be understood as the direction from the upper bezel of the display panel to the lower bezel. The substrate of the display panel can be a flexible substrate, meaning the display panel of this disclosure is a deformable flexible panel. The bonding area of ​​the display panel can be bent through the bent area, bending the bonding area towards the backlight side of the display panel, thereby reducing the bezel of the display panel and achieving a higher screen-to-body ratio. This disclosure also provides that the display panel includes at least one first groove. Along a first direction, the first groove is located on at least one side of the bonding area. The first direction can be understood as a direction parallel to the plane of the display panel, intersecting the direction from the display area to the bonding area. The first direction can also be understood as the direction from the left bezel of the display panel to the right bezel. The array driving layer of the display panel includes at least one array organic layer. The first groove is located on at least one side of the bonding area in the first direction, and the first groove penetrates all the array organic layers included in the array driving layer. Since the two sides of the bonding area in the first direction are closer to the cutting line, they are more prone to reliability issues due to water vapor intrusion. Therefore, the first groove is set at at least one side of the bonding area in the first direction. This is equivalent to setting a partition groove that penetrates all array organic layers at the position of the bonding area closest to the cutting line. This can effectively block the water vapor path or reduce the water vapor intrusion path, thereby avoiding the peeling problem between the film layers caused by the organic film layer absorbing water and expanding on any side of the bonding area close to the cutting line in the first direction. This is beneficial to improving the reliability of the panel and ensuring the display driving effect. Attached Figure Description

[0008] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0009] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of a planar structure of a display panel provided in an embodiment of this disclosure; Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction; Figure 3 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure; Figure 5 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure; Figure 6 yes Figure 5 A schematic diagram of a cross-sectional structure along the B-B' direction; Figure 7 yes Figure 5 A schematic diagram of a cross-sectional structure along the C-C' direction; Figure 8 yes Figure 5 Another cross-sectional view of the structure along the C-C' direction; Figure 9 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure; Figure 10 yes Figure 9 A schematic diagram of a cross-sectional structure along the D-D' direction; Figure 11 This is a schematic diagram of a planar structure of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0011] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0012] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0013] Please refer to the reference. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a planar structure of a display panel provided in an embodiment of this disclosure. Figure 2 yes Figure 1 A cross-sectional structural diagram along line A-A' is provided in this embodiment. The display panel 000 includes a display area AA, a bending area WA, and a binding area BA. The binding area BA is located on the side of the bending area WA away from the display area AA. The display panel 000 includes at least one first groove K1 along a first direction X, the first groove K1 being located on at least one side of the bonding area BA; wherein, in a direction parallel to the plane where the display panel 000 is located, the first direction X intersects the direction from the display area AA to the bonding area BA; The display panel 000 includes a substrate 10 and an array driving layer 20 located on one side of the substrate 10. The array driving layer 20 includes at least one array organic layer 20A. The first groove K1 penetrates all array organic layers 20A included in the array driving layer 20.

[0014] Specifically, the display panel 000 provided in this embodiment can be an organic light-emitting diode (OLED) display panel. The film structure of the display panel 000 includes at least a substrate 10 and an array driving layer 20 located on one side of the substrate 10. Optionally, it may also include other film structures, which will not be described in detail here. For details, please refer to the film structure of OLED display panels in related technologies. The substrate 10 in this embodiment can be a flexible substrate, so the display panel can be deformable, such as rolled, bent, folded, or rolled up. The array driving layer 20 is used to fabricate the pixel structure of the display panel 000, such as multiple sub-pixels forming a sub-pixel array in the display area AA. Figure 1 (Not illustrated in the image), multiple sub-pixels are configured to display dynamic or still images. The display panel 000 includes a display area AA and a non-display area NA that at least partially surrounds the display area AA. The display panel 000 surrounding the display area AA can be understood as a flat area. The non-display area NA may include a bent area WA and a bonding area BA located at the lower edge of the display panel 000. Along the second direction Y, the bonding area BA is located on the side of the bent area WA away from the display area AA. It can be understood that the second direction Y can be understood as the direction from the upper edge of the display panel 000 to the lower edge. Since the display panel is a deformable flexible panel, the bonding area BA of the display panel 000 in this embodiment can be bent through the bent area WA, bending the bonding area BA of the display panel 000 to the backlight side of the display panel 000, thereby reducing the bezel of the display panel 000 and achieving a higher screen-to-body ratio.

[0015] It should be noted that, in order to better explain the design scheme of the display panel in this embodiment, Figure 1 The illustration shows display panel 000 in a state where the bonding area BA has not yet been bent to the backlight side of display panel 000. In the actual finished product, the bonding area BA of display panel 000 will be on the backlight side of display panel 000. Figure 1 The schematic diagram of display panel 000 can be understood as a planar structural diagram of the light-emitting surface (display screen) of the display panel when the binding area BA of display panel 000 is not bent.

[0016] In related technologies, a large display substrate may simultaneously fabricate multiple duplicate display panels during the manufacturing process (e.g., fabricating 10 mobile phone-sized OLED display panels on a large mother substrate). The dicing line serves as an isolation zone between these duplicate display panels, containing no effective pixels or display functions, but only reserving physical space and auxiliary structures required for the process. When finally forming a single display panel, it is necessary to separate the multiple display panels along the dicing line. During the research and development process, the applicant discovered that, based on current display panel designs, especially when the display panel is used in high-temperature and high-humidity environments, there are significant reliability issues near the bonding area. After analyzing the cause, it was found that the bonding area is cut along both sides, and the organic film layer in the display panel easily absorbs water. When moisture enters the bonding area from the cut lines, it can cause the solder pads in the bonding area to peel against the anisotropic conductive film (ACF). Excessive moisture entering the bonding area from the cut lines can further cause the metal material of the solder pads in the bonding area to corrode and expand, and the inorganic layer to crack. The moisture is further absorbed and expanded by the organic film layer material, which further causes the organic film layer to peel against the touch film layer, ultimately resulting in various functional defects such as abnormal screen display.

[0017] To solve the above problems, this embodiment provides that the display panel 000 includes at least one first groove K1. Along the first direction X, the first groove K1 is located on at least one side of the binding area BA. The first direction X can be understood as intersecting the direction from the display area AA to the binding area BA in a direction parallel to the plane of the display panel 000. That is, the first direction X intersects the second direction Y in a direction parallel to the plane of the display panel 000. Alternatively, the first direction X and the second direction Y can be understood as being perpendicular to each other in a direction parallel to the plane of the display panel 000. The first direction X can also be understood as the direction from the left frame of the display panel to the right frame.

[0018] The array driving layer 20 of the display panel 000 includes at least one array organic layer 20A. Optionally, the array driving layer 20 may also include other film layers such as conductive metal layers, inorganic layers, etc. This embodiment does not limit this. In this embodiment, the first groove K1 is located on at least one side of the bonding area BA in the first direction X, and the first groove K1 penetrates all the array organic layers 20A included in the array driving layer 20, that is, the first groove K1 penetrates the thickness of all the array organic layers 20A included in the array driving layer 20. The first groove K1 is set on at least one side of the bonding area BA in the first direction X. Since the two sides of the bonding area BA in the first direction X are close to the cutting line CL, they are more prone to reliability problems caused by water vapor intrusion. Therefore, the first groove K1 is set on at least one side of the bonding area BA in the first direction X. It is equivalent to setting a partition groove that penetrates all the array organic layers 20A at the position of the bonding area BA closest to the cutting line CL. This can effectively block the water vapor path or reduce the water vapor intrusion path. In this way, it can avoid the peeling problem between the film layers caused by the organic film layer absorbing water and expanding on any side of the bonding area BA in the first direction X that is close to the cutting line CL. This is beneficial to improving the reliability of the panel and ensuring the display driving effect.

[0019] It is understood that this embodiment does not limit the number and film position of the array organic layers 20A included in the array driving layer 20. The array driving layer 20 may include multiple array organic layers 20A, such as multiple planarization layers, pixel definition layers, etc., as long as their manufacturing materials are organic materials, they all belong to the array organic layers 20A included in the array driving layer 20. In specific implementation, it is only necessary to ensure that the first groove K1 penetrates the thickness of all array organic layers 20A included in the array driving layer 20, so that the first groove K1 is formed at the position closest to the cutting line CL in the bonding area BA, penetrating all array organic layers 20A.

[0020] Optional, such as Figure 2As shown, taking the film structure of the bonding area BA in the display panel 000 as an example, the film structure of the bonding area BA may include a buffer layer, a first inorganic insulating layer 201, a second inorganic insulating layer 202, a second inorganic insulating layer 203, a second conductive layer 204, a third conductive layer 205, a first organic insulating layer 206, and a second organic insulating layer 207, which are sequentially stacked on the substrate 10. The bonding area BA includes multiple conductive pads BA1, which can be formed by stacking patterned second conductive layers 204 and third conductive layers 205. The first organic insulating layer 206 and the second organic insulating layer 207 are the array organic layers 20A included in the array driving layer 20. The first groove K1 can penetrate at least one side of the first organic insulating layer 206 and the second organic insulating layer 207 in the bonding area BA. It is understood that in other areas of the display panel 000, such as the display area AA, the film structure included in the display panel 000 may also include an active layer between the buffer layer and the first inorganic insulating layer 201, a gate metal layer between the first inorganic insulating layer 201 and the second inorganic insulating layer 202, a capacitor metal layer between the second inorganic insulating layer 202 and the second inorganic insulating layer 203, a light-emitting functional layer on the side of the third conductive layer 205 away from the substrate 10, and a thin film encapsulation layer on the side of the second organic insulating layer 207 away from the substrate 10, etc. This embodiment does not limit this. Figure 2 This example only illustrates the film structure of the display panel near the bonding area BA. For a more detailed understanding, please refer to the structure of OLED display panels in related technologies.

[0021] Optional, such as Figure 2 and Figure 3 As shown, Figure 3 This is a schematic diagram of another planar structure of the display panel provided in this embodiment. Along the first direction X, the first groove K1 is located on both sides of the bonding area BA, that is, both sides of the bonding area BA are close to the cutting line CL. Therefore, the first groove K1 that penetrates all array organic layers 20A is provided on both sides of the bonding area BA, which can further reduce or avoid the probability of water vapor at the cutting line CL invading from the organic film layer on both sides of the bonding area BA to the bonding area BA, which is conducive to more effectively improving the reliability of the panel.

[0022] Optional, such as Figure 2 and Figure 4 As shown, Figure 4This is a schematic diagram of another planar structure of the display panel provided in this embodiment. In this embodiment, when the first groove K1, which runs through all array organic layers 20A along the first direction X, is disposed on opposite sides of the bonding area BA, the length of the first groove K1 in the second direction Y (i.e., the direction from the display area AA to the bonding area BA) is L1, the maximum width of the bonding area BA in the second direction Y is L2, L1 > L2, and the range of the first groove K1 in the second direction Y covers the range of the bonding area BA in the second direction Y, so that the first groove K1 can act as a barrier groove, which can completely block the path of water vapor that may invade the bonding area BA from the cutting line CL, effectively ensuring the reliability of the panel.

[0023] Optional, such as Figure 2 and Figure 4 As shown, in this embodiment, when the length L1 of the first groove K1 in the second direction Y is greater than the maximum width L2 of the bonding area BA in the second direction Y, the first groove K1 can be extended and lengthened as much as possible in the second direction Y, that is, L1 can be as large as possible. However, one end of the first groove K1 in the second direction Y and the bending area BA still need to be set to have a certain distance JG. This can avoid the problem that when the first groove K1 penetrating the array organic layer 20A is set near the bending area WA, the remaining inorganic film material after the organic film material at the first groove K1 is hollowed out is easily affected by bending stress, resulting in cracks in the inorganic film layer. Therefore, setting one end of the first groove K1 in the second direction Y and the bending area BA still need to be set to have a certain distance JG. This can ensure the reliability of both sides of the bonding area BA at the cutting line CL position, block the water vapor intrusion path, and avoid cracks in the film layer near the bending area BA, further ensuring reliability.

[0024] In some alternative embodiments, please refer to the references. Figure 2 , Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure. Figure 6 yes Figure 5 A cross-sectional structural diagram along the B-B' direction (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 5 (Transparency filling is performed in the middle). The display panel 000 in this embodiment also includes a thin film encapsulation layer 30, which is located on the side of the array driving layer 20 away from the substrate 10. The thin film encapsulation layer 30 includes an encapsulation layer clearance area 30K, and the thin film encapsulation layer 30 has a cutout in the encapsulation layer clearance area 30K; The orthographic projection of the encapsulation layer clearance area 30K onto the plane where the display panel 000 is located at least covers the bending area WA and the area of ​​the bending area WA away from the display area AA.

[0025] This embodiment explains that the film structure of the display panel 000 includes at least a thin-film encapsulation layer 30 located on the side of the array driving layer 20 away from the substrate 10. The thin-film encapsulation layer 30 is a TFE (Thin-Film Encapsulation) structure. The display area AA of the display panel 000 may include multiple sub-pixels 00. The film structure of the area where the sub-pixels 00 are located includes a light-emitting functional layer 40, etc. This embodiment does not elaborate on the film structure of the display area AA, and the arrangement of the multiple sub-pixels 00 in the display area AA is only illustrative. In specific implementations, it includes, but is not limited to, this. This embodiment provides at least a thin-film encapsulation layer 30 in the display area AA of the display panel 000. The thin-film encapsulation layer 30 can be used to isolate water and oxygen, preventing water vapor and oxygen in the air from entering the light-emitting functional layer 40 and the array driving layer 20 of the sub-pixels 00 in the display area AA, thereby damaging the components therein. It may also include other film structures, such as a planarization layer, etc. This embodiment does not elaborate on this, but for details, please refer to the structure of organic light-emitting display panels in related technologies for understanding. Optional, such as Figure 6 As shown, the thin-film encapsulation layer 30 in this embodiment may include a first inorganic encapsulation layer 30A, a first organic encapsulation layer 30B, and a second inorganic encapsulation layer 30C (not filled in the figure). The first inorganic encapsulation layer 30A is used to block the first organic encapsulation layer 30B, preventing moisture, oxygen, or other impurities in the first organic encapsulation layer 30B from penetrating into the light-emitting functional layer 40 of the organic light-emitting material and reacting to damage the organic light-emitting material, leading to display panel failure. The first organic encapsulation layer 30B is used to relieve stress and prevent the inorganic encapsulation layer from cracking under stress, allowing moisture and oxygen to enter. The second inorganic encapsulation layer 30C is used to prevent moisture and oxygen from the external environment from entering the display panel 000. The first inorganic encapsulation layer 30A and the second inorganic encapsulation layer 30C of the thin-film encapsulation layer 30 form a double protection, which can further reduce the probability of intrusion.

[0026] This embodiment further provides that the thin film encapsulation layer 30 includes an encapsulation layer clearance area 30K. The thin film encapsulation layer 30 in the encapsulation layer clearance area 30K is hollowed out. That is, the encapsulation layer clearance area 30K can be understood as the area where the thin film encapsulation material of the thin film encapsulation layer 30 is hollowed out. The orthographic projection of the encapsulation layer clearance area 30K on the plane where the display panel 000 is located at least covers the bending area WA and the area of ​​the bending area WA away from the display area AA. That is, the encapsulation layer clearance area 30K of the display panel 000 (the area where the thin film encapsulation material of the thin film encapsulation layer 30 is hollowed out) is at least located in the bending area WA and the side of the bending area WA away from the display area AA (such as the bonding area BA and the first groove K1 position). That is, the thin film encapsulation layer 30 is not provided in the bending area WA to avoid the presence of the inorganic encapsulation layer of the thin film encapsulation layer 30 in the bending area WA, which would cause cracks during the bending process and affect the bending reliability of the panel. In the second direction Y-bending area, the side of the bending region WA furthest from the display area AA is also not provided with a thin-film encapsulation layer 30. The bonding pad BA1 of the bonding area BA needs to be connected to the external circuit via ACF adhesive; therefore, the bonding area BA does not cover the thin-film encapsulation layer 30 but instead has a clear area 30K to prevent the thin-film encapsulation layer 30 from obstructing electrical signal transmission. The bonding pad BA1 of the bonding area BA needs to remain exposed; therefore, the bonding area BA does not cover the thin-film encapsulation layer 30 but instead has a clear area 30K to facilitate the bonding process. In the first direction X-bending area WA, the first groove K1 on both sides is also not provided with a thin-film encapsulation layer 30 to prevent cracks in the inorganic encapsulation layer at the first groove K1 position from affecting the encapsulation effect.

[0027] In some alternative embodiments, please refer to the references. Figure 5 , Figure 6 and Figure 7 , Figure 7 yes Figure 5 A cross-sectional structural diagram along the C-C' direction is shown in this embodiment. The display panel 000 further includes a touch function layer 50, which is located on the side of the thin film encapsulation layer 30 away from the substrate 10. The touch function layer 50 includes at least one touch inorganic layer 50A, and the first groove K1 is filled with the touch inorganic layer 50A.

[0028] Optionally, the first groove K1 includes a first groove bottom K11 and a first groove wall K12, and the touch inorganic layer 50A at least covers the first groove bottom K11 and the first groove wall K12.

[0029] This embodiment explains that a touch function layer 50 can also be provided on the side of the thin film encapsulation layer 30 of the display panel 000 away from the substrate 10. By integrating the touch function layer 50 into the display panel 000, the display panel does not need to be equipped with an external touch module, and has the advantages of being thin, light and foldable, which can meet the product requirements of flexible folding and narrow bezel. In this embodiment, after the first groove K1 penetrates all the array organic layers 20A of the array driving layer 20, the array organic layers 20A will be exposed in the area of ​​the first groove K1. Since the bending area WA and the thin film encapsulation layer 30 on the side of the bending area WA away from the display area AA are hollowed out, at least one touch inorganic layer 50A of the touch functional layer 50 made in the subsequent process of the thin film encapsulation layer 30 can be used to fill the first groove K1. The first groove K1 includes a first groove bottom K11 and a first groove wall K12. The touch inorganic layer 50A at least covers the first groove bottom K11 and the first groove wall K12, thereby protecting the organic material exposed in the first groove K1 with the inorganic material of the touch inorganic layer 50A and enhancing the reliability of isolating moisture intrusion.

[0030] It is understood that the touch functional layer 50 in this embodiment may include a touch buffer layer, a first touch conductive layer, an interlayer insulating layer, a second touch conductive layer, a touch protective layer, etc., stacked sequentially along the direction away from the thin film encapsulation layer 30. Figure 7 (Not shown in the diagram) The touch electrodes and sensing electrodes that enable touch functionality can be located in the first touch conductive layer and the second touch conductive layer. The touch buffer layer, the interlayer insulating layer, and the touch protective layer can serve as insulation. The touch inorganic layer 50A filled in the first groove K1 can be either the touch buffer layer or the interlayer insulating layer of the touch functional layer 50. This embodiment does not limit this, only requiring that the touch inorganic layer 50A is any one or more inorganic layers in the touch functional layer 50. This embodiment does not limit this.

[0031] Optional, such as Figure 5 , Figure 6 and Figure 8 , Figure 8 yes Figure 5 Another cross-sectional structural diagram along the C-C' direction shows that the first groove K1 includes a first groove bottom K11 and a first groove wall K12, and the included angle α formed by the first groove bottom K11 and the first groove wall K12 is greater than 90 degrees.

[0032] This embodiment explains that during the process of forming the first groove K1, the actual process technology can make the included angle α formed by the first groove bottom K11 and the first groove wall K12 of the first groove K1 greater than 90 degrees. That is, the first groove wall K12 of the first groove K1 is an inclined contact surface. This allows the subsequent touch inorganic layer 50A to better contact the first groove wall K12 of the first groove K1, avoiding the exposure of the array organic layer 20A at the location of voids or breaks in the first groove K1. This simplifies the process technology of the touch inorganic layer 50A and effectively enhances the reliability of isolating moisture intrusion.

[0033] In some alternative embodiments, please continue to refer to the references. Figures 5-8 In this embodiment, along the first direction X, at least one side of the binding area BA includes an organic layer clearance area 000K, which does not include an organic film layer. The orthographic projection of the first groove K1 onto the plane where the display panel 000 is located covers the organic layer clearance area 000K.

[0034] This embodiment explains that an organic layer clearance area 000K can be set on at least one side of the bonding area BA. That is, the organic layer clearance area 000K of the display panel 000 does not include the organic film layer. In the film layer structure of the display panel 000, the organic film layer of the display panel 000 is completely hollowed out in the organic layer clearance area 000K. When a first groove K1 is set on at least one side of the bonding area BA in the first direction X, the orthographic projection of the first groove K1 on the plane where the display panel 000 is located covers the organic layer clearance area 000K. That is, it is equivalent to the organic film layer on at least one side of the bonding area BA in the first direction X being completely hollowed out. In the final process, the product presented after cutting along the cutting line CL has no related organic film layer from the bonding area BA to the cutting line CL. This simplifies the process and avoids complicating the patterning process of the first groove K1. This is beneficial to improving the reliability of the panel, as well as improving the process efficiency and reducing the process difficulty.

[0035] In some alternative embodiments, please refer to the references. Figure 9 and Figure 10 , Figure 9 This is a schematic diagram of another planar structure of the display panel provided in an embodiment of this disclosure. Figure 10 yes Figure 9 A cross-sectional structural diagram along the D-D' direction is shown in this embodiment. In the first direction X, along the direction from the binding area BA to the edge of the display panel 000, there are at least two parallel first grooves K1 between the binding area BA and the edge of the display panel 000.

[0036] This embodiment explains that when a first groove K1 is provided between the binding area BA on at least one side of the binding area BA in the first direction X, that is, between the cutting line CL near the binding area BA and the binding area BA, at least two first grooves K1 arranged in parallel can be provided between the binding area BA and the edge of the display panel 000. The multiple first grooves K1 arranged at intervals form a multi-layer water vapor isolation groove structure, thereby further improving the isolation effect.

[0037] Optionally, in the first direction X, the width W1 of the first groove K1 ranges from 10 to 100 μm. In the first direction X, the distance WL between two adjacent first grooves K1 is greater than or equal to 10 μm.

[0038] This embodiment explains that when at least two parallel first grooves K1 are provided between the cutting line CL near the bonding area BA and the bonding area BA, the width W1 of the first groove K1 in the first direction X ranges from 10 to 100 μm. Since the space between the bonding area BA and the cutting line CL is limited, when multiple first grooves K1 are provided in the first direction X, the width W1 of the first groove K1 is limited to 10-100 μm. This avoids the space between adjacent first grooves K1 being too small due to space limitations, thus preventing the touch inorganic layer 50A from failing to fill the first groove K1 for protection. Furthermore, this embodiment also sets the spacing WL between two adjacent first grooves K1 in the first direction X to be greater than or equal to 10 μm. Limiting the spacing WL between two adjacent first grooves K1 to greater than or equal to 10 μm ensures the patterning effect of the array organic layer 20A and also ensures that there are no metal or organic film material residues in the formed first grooves K1, avoiding morphological defects in the first grooves K1 caused by process limitations during the manufacturing process, and improving product yield.

[0039] In some alternative embodiments, please refer to the references. Figure 1 and Figure 2 , Figure 9 and Figure 10 The bonding area BA of the display panel 000 includes multiple conductive pads BA1; In the first direction X, the distance W2 from the first groove K1 to the conductive pad BA1 is greater than or equal to 40 μm.

[0040] This embodiment explains that when a first groove K1 is provided on at least one side of the bonding area BA in the first direction X, i.e., between the cleaving line CL near the bonding area BA and the bonding area BA, the distance between the first groove K1 closest to the bonding area BA and the bonding pad BA1 closest to the first groove K1, i.e., the minimum distance from the first groove K1 to the conductive pad BA1, needs to be at least 40μm. In the first direction X, the distance W2 between the first groove K1 and the conductive pad BA1 closest to the first groove K1 is greater than or equal to 40μm. Within the limited space between the bonding area BA and the cleaving line CL, the opening of the first groove K1 can avoid the bonding pad BA1 as much as possible, thus avoiding the opening of the first groove K1 from affecting the electrical connection reliability of the bonding pad BA1 and other conductive structures.

[0041] In some alternative embodiments, please refer to Figure 11 , Figure 11 This is a schematic diagram of a planar structure of a display device provided in an embodiment of the present disclosure. The display device 111 provided in this embodiment includes the display panel 000 provided in the above-described embodiment of the present disclosure. Figure 11 This embodiment uses a mobile phone as an example to illustrate the display device 111. It is understood that the display device 111 provided in this embodiment can be any other display device 111 with display functions, such as a computer, television, or in-vehicle display device. This disclosure does not impose specific limitations on this. The display device 111 provided in this embodiment has the beneficial effects of the display panel 000 provided in this embodiment. For details, please refer to the specific descriptions of the display panel 000 in the above embodiments; these will not be repeated here.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0043] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that, It includes a display area, a bending area, and a binding area, wherein the binding area is located on the side of the bending area away from the display area; The display panel includes at least one first recess along a first direction, the first recess being located on at least one side of the bonding area; wherein, in a direction parallel to the plane of the display panel, the first direction intersects the direction from the display area to the bonding area; The display panel includes a substrate and an array driving layer located on one side of the substrate, the array driving layer including at least one array organic layer; The first groove extends through all the array organic layers included in the array driving layer.

2. The display panel according to claim 1, characterized in that, Along the first direction, the first groove is located on opposite sides of the binding area.

3. The display panel according to claim 1, characterized in that, The display panel further includes a thin-film encapsulation layer, which is located on the side of the array driving layer away from the substrate; The thin film encapsulation layer includes an encapsulation layer clearance area, and the thin film encapsulation layer in the encapsulation layer clearance area is hollowed out. The orthographic projection of the encapsulation layer clearance area onto the plane where the display panel is located at least covers the bending area and the side of the bending area away from the display area.

4. The display panel according to claim 3, characterized in that, The display panel further includes a touch function layer, which is located on the side of the thin film encapsulation layer away from the substrate; The touch function layer includes at least one touch inorganic layer, and the first groove is filled with the touch inorganic layer.

5. The display panel according to claim 4, characterized in that, The first groove includes a first groove bottom and a first groove wall, and the touch inorganic layer at least covers the first groove bottom and the first groove wall.

6. The display panel according to claim 1, characterized in that, Along the first direction, at least one side of the bonding area includes an organic layer clearance area, which does not include an organic film layer; The first groove's orthographic projection onto the plane of the display panel covers the clearance area of ​​the organic layer.

7. The display panel according to claim 1, characterized in that, In the first direction, along the direction from the bonding area to the edge of the display panel, the bonding area and the edge of the display panel include at least two first grooves arranged side by side.

8. The display panel according to claim 7, characterized in that, In the first direction, the width of the first groove ranges from 10 to 100 μm.

9. The display panel according to claim 7, characterized in that, In the first direction, the distance between two adjacent first grooves is greater than or equal to 10 μm.

10. The display panel according to claim 1, characterized in that, The bonding area includes multiple conductive pads; In the first direction, the distance from the first groove to the conductive pad is greater than or equal to 40 μm.

11. The display panel according to claim 1, characterized in that, The first groove includes a first groove bottom and a first groove wall, and the angle formed by the first groove bottom and the first groove wall is greater than 90 degrees.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

Images