Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display panel, a composite layer and a circuit board, wherein the display panel comprises a display part, a bending part and a binding part which are connected in sequence; the composite layer is arranged on one side, facing the binding part, of the display part; the circuit board comprises a main board and at least one electronic element, and the at least one electronic element is arranged on the side, away from the composite layer, of the main board in the second direction; at least one hollow heat insulation cavity is arranged between the main board and the composite layer, and the orthographic projection of any electronic element on the display part is overlapped with the orthographic projection of at least one heat insulation cavity on the display part. The invention relates to the technical field of display equipment, and provides a display module and a display device, a heat insulation cavity is added between a heating electronic element and a display part, the influence of heat accumulated by the electronic element on a display panel is avoided, the risk of downtime of an overheating product caused by heat accumulation is reduced, the heat dissipation capability of the display module is improved, and the service life of the product is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, and more particularly, to a display module and a display device. BACKGROUND

[0002] An organic light emitting diode (OLED) is an active light emitting display device, which has the advantages of self-luminous, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, a display device using an OLED as a light emitting device and controlled by a thin film transistor (TFT) has become a mainstream product in the current display field.

[0003] A circuit board can be attached to the backlight side of a display panel, and at least one chip can be bound to the display panel. When the electronic elements on the circuit board and the chip are working, heat is generated. In particular, some electronic elements on the circuit board generate a large amount of heat after a long time of work, and the heat is conducted to the display panel, which affects the thermal balance of the product. SUMMARY

[0004] The display module provided by the embodiments of the present application comprises: a display panel comprising a display part, a bending part and a binding part connected in sequence, the bending part is arranged to be folded towards the backlight side of the display part, and one end of the binding part in a first direction is connected to the bending part, the first direction being parallel to the display part; a composite layer arranged on one side of the display part facing the binding part; a circuit board comprising a main board and at least one electronic element, the main board being attached to one side of the composite layer away from the display part in a second direction, the at least one electronic element being arranged on one side of the main board away from the composite layer in the second direction, the second direction being perpendicular to the display part, at least one hollow heat insulation cavity being arranged between the main board and the composite layer, and the orthogonal projection of any electronic element on the display part and the orthogonal projection of the at least one heat insulation cavity on the display part being overlapped.

[0005] In some example embodiments, the orthogonal projection of any electronic element on the display part is located within the orthogonal projection range of the at least one heat insulation cavity on the display part.

[0006] In some example embodiments, the electronic elements are provided in a plurality, and the heat insulation cavities are provided in a plurality, the plurality of electronic elements and the plurality of heat insulation cavities being one-to-one corresponding, and the orthogonal projection of any electronic element on the display part being located within the orthogonal projection range of one of the plurality of heat insulation cavities on the display part.

[0007] In some example embodiments, a first adhesive layer is further included between the main plate and the composite layer, the first adhesive layer is provided with at least one first through hole penetrating in the second direction, and the heat insulation cavity includes the first through hole.

[0008] In some example embodiments, the composite layer is provided with at least one first groove on a side thereof away from the display portion in the second direction, at least one of the first grooves and at least one of the first through holes correspond to and communicate with each other, and the first groove and the first through hole constitute the heat insulation cavity.

[0009] In some example embodiments, a normal projection of any of the first grooves on the display portion and a normal projection of one of the first through holes on the display portion overlap.

[0010] In some example embodiments, the main plate is provided with a convex bump protruding away from the composite layer in the second direction, and the at least one electronic component is arranged on a side of the convex bump away from the composite layer in the second direction. An end surface of the convex bump on a side thereof close to the composite layer in the second direction encloses a second groove, the second groove and the first through hole communicate with each other, and the second groove and the first through hole constitute the heat insulation cavity.

[0011] In some example embodiments, a normal projection of the second groove on the display portion and a normal projection of the at least one first through hole on the display portion overlap. Alternatively, a normal projection of the at least one first through hole on the display portion is located within a range of a normal projection of the second groove on the display portion.

[0012] In some example embodiments, the convex bump is one, and the electronic component is multiple, and the multiple electronic components are arranged on the one convex bump.

[0013] In some example embodiments, the main plate includes a flat plate segment, and the flat plate segment and the composite layer are bonded. The convex bump includes two side walls and a top wall, the two side walls are arranged in the first direction with a spacing, one end of any of the side walls is connected to the flat plate segment, and the other end extends away from the composite layer in the second direction, two ends of the top wall in the first direction are respectively connected to two ends of the side walls away from the composite layer in the second direction, and the at least one electronic component is arranged on the top wall. The side walls are parallel to the second direction, or are arranged in an inclined manner relative to the second direction.

[0014] In some example embodiments, the composite layer is provided with at least one first groove on a side thereof away from the display portion in the second direction; The main board is provided with a bulge protruding away from the composite layer in the second direction, and the at least one electronic component is arranged on a side of the bulge away from the composite layer in the second direction, and an end surface of the side of the bulge close to the composite layer in the second direction forms a second groove; An end of the first through hole in the second direction communicates with the first groove, and the other end communicates with the second groove, and the first groove, the first through hole and the second groove form the heat insulation cavity.

[0015] In some example embodiments, the display module further comprises at least one chip and a gasket; The binding portion is provided with a circuit binding area on a side thereof away from the display portion in the second direction, and the at least one chip is arranged in the circuit binding area; The gasket is clamped between the binding portion and the composite layer, and the material of the gasket comprises graphite.

[0016] In some example embodiments, the display module further comprises a cladding layer arranged in the circuit binding area, and the at least one chip is clamped between the cladding layer and the binding portion, and the material of the cladding layer comprises graphite.

[0017] In some example embodiments, the cladding layer covers an end surface of the chip away from the binding portion in the second direction, and covers an end surface of the chip parallel to the display portion.

[0018] The display device provided by the embodiments of the present application comprises the display module.

[0019] The display module of the embodiments of the present application adds a heat insulation cavity between the heat-generating electronic component and the display portion, avoids the heat accumulated by the electronic component from affecting the display panel, reduces the risk of overheating caused by heat accumulation, improves the heat dissipation capacity of the display module, and improves the service life of the product.

[0020] The display module of the embodiments of the present application can correspondingly perform special-shaped processing on the circuit board according to the position of the electronic component, or perform slotting processing on the composite layer, thereby enhancing the display module capacity and improving the service life of the product.

[0021] The display module of the embodiments of the present application can correspondingly provide graphite cladding for the chip, thereby improving the heat dissipation of the chip.

[0022] Other features and advantages of the present application will be described in the following description, and some will become apparent from the description, or will be understood from the practice of the present application. Other advantages of the present application can be achieved and obtained by the solutions described in the specification and the drawings. Attached Figure Description

[0023] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0024] Figure 1 This is a schematic diagram of a display module according to an exemplary embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of the display panel in the image; Figure 3 for Figure 1 A magnified view of part A in the diagram; Figure 4 for Figure 1 CC-direction section view; Figure 5 This is a schematic diagram of another display module for this exemplary embodiment; Figure 6 for Figure 1 A magnified view of section B in the diagram; Figure 7 This is a schematic diagram of yet another display module according to this exemplary embodiment; Figure 8 This is a schematic diagram of another display module for this exemplary embodiment; Figure 9 for Figure 8 A magnified view of part D in the diagram; Figure 10 This is a schematic diagram of yet another display module according to this exemplary embodiment; Figure 11 This is a schematic diagram of another display module for this exemplary embodiment; Figure 12 This is a schematic diagram of yet another display module according to this exemplary embodiment; Figure 13 for Figure 12 A magnified view of part E in the diagram. Detailed Implementation

[0025] The present application describes a number of embodiments, but the description is exemplary rather than limiting and it will be apparent to those of ordinary skill in the art that numerous more embodiments and implementations are possible within the scope of the embodiments described in the present application. Although a number of possible combinations of features have been set forth in the accompanying figures and discussed above, many other combinations of the disclosed features are possible. Unless specifically intended otherwise, any feature or element of any embodiment can be used in combination with any other feature or element of any other embodiment, or in replacement of any other feature or element in any other embodiment.

[0026] The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed herein can also be combined with any conventional features or elements to form unique invention solutions. Any feature or element of any embodiment can also be combined with features or elements from other invention solutions to form another unique invention solution. Thus, it should be understood that any feature shown and / or discussed in the present application can be implemented alone or in any appropriate combination. Accordingly, the embodiments are not to be restricted, except as by the appended claims and their equivalents. Additionally, various modifications and changes can be made within the scope of the claims.

[0027] Furthermore, in describing representative embodiments, the specification can have presented the method and / or process as a particular sequence of steps. However, to the extent that the method or process depends on more than one step, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps can be possible, and are within the scope of the embodiments. Thus, man skilled in the art will appreciate that the specific order of the steps in the descriptions of the specification is not to be taken as a limitation of the claimed embodiments. Additionally, the claims should not be limited to the steps of the method and / or process in the order written, and one skilled in the art can readily understand that the order of the steps can be varied and still remain within the scope of the embodiments.

[0028] At present, the backlight side of a display panel can be provided with a circuit board, and electronic elements on the circuit board can generate heat when working, especially when the display module works for a long time, some high-power electronic elements (such as a power manager and a timing controller) on the circuit board generate heat seriously. For example, for some display modules, the temperature of the power manager and the timing controller on the circuit board can all exceed 50℃ after reaching thermal equilibrium for thirty minutes after power-on, which is obviously higher than the temperature at other positions.

[0029] The technical solutions of the embodiments of the present application will be described in detail below through specific embodiments.

[0030] Figure 1This is a schematic diagram of a display module according to an exemplary embodiment. This embodiment provides a display module, such as... Figure 1 As shown, the display module may include a display panel 40, a composite layer 60, and a circuit board 90. The display panel 40 may include a display portion 41, a bending portion 42, and a bonding portion 43 connected in sequence. The bending portion 42 is configured to fold towards the backlight side of the display portion 41. One end of the bonding portion 43 is connected to the bending portion 42 in a first direction, which is parallel to the display portion 41. The composite layer 60 may be disposed on the side of the display portion 41 facing the bonding portion 43. The circuit board 90 may include a main board 91 and at least one electronic component 92. The main board 91 is bonded to the side of the composite layer 60 away from the display portion 41 in a second direction. At least one electronic component 92 is disposed on the side of the main board 91 away from the composite layer 60 in the second direction, which is perpendicular to the display portion 41. At least one hollow heat insulation cavity 10 is provided between the main board 91 and the composite layer 60. The orthographic projection of any electronic component 92 on the display portion 41 and the orthographic projection of at least one heat insulation cavity 10 on the display portion 41 overlap. Therefore, in this embodiment, a heat insulation cavity 10 is added between the heat-generating electronic component 92 and the display section 41 to prevent the heat accumulated by the electronic component 92 from affecting the display panel 40, reduce the risk of product shutdown due to overheating caused by heat accumulation, improve the heat dissipation capacity of the display module, and extend the product's service life.

[0031] Figure 2 for Figure 1 The schematic diagram of the display panel in the figure, in some exemplary embodiments, such as Figure 1 and Figure 2 As shown, the display part 41, the bending part 42, and the binding part 43 can be integrated as a single unit. The display part 41 may have a light-emitting side 44 and a backlight side 45. When the display part 41 is lit, the light-emitting side 44 emits light to display text or images. The light-emitting side 44 and the backlight side 45 are located on opposite sides of the display part 41 in the second direction. One end of the display part 41 in the first direction can be connected to the bending part 42. The bending part 42 is folded over to the backlight side 45 of the display part 41. The binding part 43 is located on the backlight side 45 of the display part 41. The side of the display module with the bending part 42 in the first direction can be called the ground side, and the opposite side can be called the top side. The bending part 42 can be made of a flexible material and can be bent. The bending part 42 has metal traces, etc. During the production of the bending part 42, it can be laid flat on the production equipment. During installation, the bending part 42 can be folded over to the backlight side 45 of the display part 41, so that the bending part 42 is in a bent state and remains in a bent state. The bonding portion 43 is parallel to the display portion 41. The bonding portion 43 has a circuit bonding area 431 on the side away from the display portion in the second direction. The circuit bonding area 431 can be divided into a chip on panel (COP) area and a driver integrated circuit (D-IC) area.

[0032] In some example embodiments, as shown in Figure 1 and Figure 2 The display module can further include a bottom film (BF) 50, a bending spacer 21, a polarizing layer 33, a light-transmitting layer 32, and a cover plate 31. The bottom film 50 can be divided into a first bottom film layer 51 and a second bottom film layer 52. The first bottom film layer 51 is located on the back light side surface of the display part 41, and the second bottom film layer 52 is located on the binding part 43. When the bending part 42 is in a curved state, the second bottom film layer 52 covers the surface of the binding part 43 facing the display part 41, and the first bottom film layer 51 covers the surface of the display part 41 close to the binding part 43. The first bottom film layer 51 and the second bottom film layer 52 can be prepared on the display panel 405 during the production of the display panel 405. At this time, the bending part 42 is laid flat on the production equipment, and the first bottom film layer 51 and the second bottom film layer 52 are arranged in place at one time. At the same time, the first bottom film layer 51 and the second bottom film layer 52 also fill part of the space between the display part 41 and the binding part 43. In addition, the display module can further include a protective layer (MCL), which covers at least one side of the bending part 42. The protective layer can protect the components it covers.

[0033] In some example embodiments, as shown in Figure 1 and Figure 2 The polarizing layer 33, the light-transmitting layer 32, and the cover plate 31 are all located on the light-out side 44 of the display part 41. The polarizing layer 33, the light-transmitting layer 32, and the cover plate 31 are arranged in order away from the display part 41 in the second direction. The polarizing layer 33, the light-transmitting layer 32, and the cover plate 31 can all transmit the light emitted by the display part 41. The cover plate 31 can protect the display part 41, and the polarizing layer 33 can reduce the influence of external light emission on the image display of the display part 41.

[0034] In some example embodiments, as shown in Figure 1 and Figure 2 The display module further includes a chip 70 and a flexible printed circuit board 80. The circuit board 90 is connected to the display panel 40 through the flexible printed circuit board 80 (FPC). The circuit board 90 can be connected to multiple flexible printed circuit boards 80. The multiple flexible printed circuit boards 80 can extend to the surface of the binding part 43 away from the display part 41 (i.e., the circuit binding area 431) and bind with the driving integrated circuit area of the binding part 43 to form an electrical connection. The chip 70 is located on the surface of the binding part 43 away from the display part 41 (i.e., the circuit binding area 431) and binds with the chip mounting area of the binding part 43 to form an electrical connection. The circuit board 90 can include a main board 91 and multiple electronic elements 92. The multiple electronic elements 92 can include a power manager, a timing controller, and capacitors and resistors, etc.

[0035] Figure 3 is a local enlarged view of A in Figure 1 , Figure 4 is a local enlarged view of C-C in Figure 1 , Figure 1 , Figure 3 and Figure 4 , the composite layer 605 can be a multi-layer laminated structure, for example, a filling layer of silicone gel material and a heat dissipation film of copper foil material are stacked together. The display module further includes a first adhesive layer 22 located between the mainboard 91 and the composite layer 60, and the first adhesive layer 22 is provided with at least one first through hole 11 penetrating in the second direction, which can serve as part of the heat insulation cavity 10.

[0036] In some example embodiments, as shown in Figure 1 , Figure 3 and Figure 4 , the composite layer 60 is provided with at least one first recess 12 on the side away from the display part 41 in the second direction, which can be recessed on the end face of the composite layer 60 away from the display part 41. The at least one first recess 12 and the at least one first through hole 11 correspond to each other and are in communication, and the slot of the first recess 12 can be in communication with the end of the corresponding first through hole 11 close to the display part 41, and the first recess 12 and the first through hole 11 constitute the heat insulation cavity 10. The slot type of the first recess 12 and the hole type of the corresponding first through hole 11 are consistent, and the outline dimensions are consistent, so that the orthographic projection of the first recess 12 on the display part 41 and the orthographic projection of the corresponding first through hole 11 on the display part 41 overlap. In the present example, the first recess 12 can be a rectangular slot, and the first through hole 11 can be a rectangular hole, but is not limited thereto, for example, the first recess 12 can be a circular slot, and the first through hole 11 can be a circular hole.

[0037] In some example embodiments, as shown in Figure 1 , Figure 3 and Figure 4 , the orthographic projection of any electronic component 92 on the display part 41 is located within the orthographic projection range of at least one heat insulation cavity 10 on the display part 41. Among them, the electronic component 92 is provided with a plurality of heat insulation cavities 10, and the heat insulation cavities 10 and the electronic components 92 are arranged one by one. The orthographic projection of any electronic component 92 on the display part 41 is located within the orthographic projection range of the corresponding heat insulation cavity 10 on the display part 41.

[0038] Figure 5 is another schematic view of a display module of the present example embodiment, in some example embodiments, as shown in Figure 5As shown, the orthographic projection of any electronic component 92 on the display portion 41 is within the orthographic projection range of at least one heat insulation cavity 10 on the display portion 41. In some embodiments, the number of electronic components 92 is greater than the number of heat insulation cavities 10, and two electronic components 92 can be arranged corresponding to one heat insulation cavity 10, such that the orthographic projection of the two electronic components 92 on the display portion 41 is within the orthographic projection range of the one heat insulation cavity 10 on the display portion 41. However, the present application is not limited thereto, for example, three or more electronic components 92 can be arranged corresponding to one heat insulation cavity 10, such that the orthographic projection of the three or more electronic components 92 on the display portion 41 is within the orthographic projection range of the one heat insulation cavity 10 on the display portion 41. For another example, the orthographic projection of any electronic component 92 on the display portion 41 overlaps with the orthographic projection of at least one heat insulation cavity 10 on the display portion 41, but does not overlap therewith.

[0039] In some embodiments, the orthographic projection of any first recess 12 on the display portion 41 overlaps with the orthographic projection of one of the at least one first through hole 11 on the display portion 41. In some embodiments, one first recess 12 can correspond to two or more first through holes 11, for example, the opening of one first recess 12 can be in communication with one end of two first through holes 11 close to the display portion 41, and the orthographic projection of the two first through holes 11 on the display portion 41 is within the orthographic projection range of the one first recess 12 on the display portion 41. Two electronic components 92 can correspond to the two first through holes 11 one by one, and the orthographic projection of one of the two electronic components 92 on the display portion 41 is within the orthographic projection range of one of the two first through holes 11 on the display portion 41, and the orthographic projection of the two electronic components 92 on the display portion 41 is within the orthographic projection range of the one first recess 12 on the display portion 41. For another example, the first recess 12 can correspond to the first through hole 11 one by one, and the orthographic projection of the first recess 12 on the display portion 41 overlaps with the orthographic projection of the corresponding first through hole 11 on the display portion 41.

[0040] Figure 6 For Figure 1 In some embodiments, as shown in the partial enlarged view of B in FIG. 1C, the first recess 12 can be arranged corresponding to the first through hole 11 one by one, and the orthographic projection of the first recess 12 on the display portion 41 overlaps with the orthographic projection of the corresponding first through hole 11 on the display portion 41. Figure 6As shown, the gasket 21 can be clamped between the second back film layer 52 and the composite layer 605 to support the space of the binding portion 43 and the display portion 41. The gasket 21 can be adhered to the second back film layer 52 by the second adhesive layer 23 and adhered to the composite layer 605 by the second adhesive layer 23. The material of the gasket 21 can include graphite, and the second adhesive layer 23 can be a pressure sensitive adhesive. The thickness of the gasket 21 can be 0.1-0.2 mm, the thermal conductivity of the gasket 21 can be 1900 W / m.k, and the thickness of the second adhesive layer 23 can be 0.1 mm. In the present example, the gasket 21 is a graphite sheet, which can have good heat dissipation performance without increasing the thickness of the module compared to a polyethylene terephthalate (PET) sheet.

[0041] Figure 7 As shown in FIG. 6, the display module 40 further includes a cladding layer 24 disposed on the circuit binding area 431, and at least one chip 70 is clamped between the cladding layer 24 and the binding portion 43. The material of the cladding layer 24 can include graphite. The cladding layer 24 can cover the end surface of the chip 70 away from the binding portion 43 in the second direction, and cover the end surface of the chip 70 parallel to the display portion 41. In the present example, the cladding layer 24 is added to enhance the heat dissipation capacity of the chip 70 after heating. Figure 7

[0042] As shown in FIG. 6, the display module 40 further includes a cladding layer 24 disposed on the circuit binding area 431, and at least one chip 70 is clamped between the cladding layer 24 and the binding portion 43. The material of the cladding layer 24 can include graphite. The cladding layer 24 can cover the end surface of the chip 70 away from the binding portion 43 in the second direction, and cover the end surface of the chip 70 parallel to the display portion 41. In the present example, the cladding layer 24 is added to enhance the heat dissipation capacity of the chip 70 after heating. Figure 8 Figure 9 Figure 8 As shown in FIG. 6, the display module 40 further includes a cladding layer 24 disposed on the circuit binding area 431, and at least one chip 70 is clamped between the cladding layer 24 and the binding portion 43. The material of the cladding layer 24 can include graphite. The cladding layer 24 can cover the end surface of the chip 70 away from the binding portion 43 in the second direction, and cover the end surface of the chip 70 parallel to the display portion 41. In the present example, the cladding layer 24 is added to enhance the heat dissipation capacity of the chip 70 after heating. Figure 8 Figure 9 As shown in FIG. 6, the display module 40 further includes a cladding layer 24 disposed on the circuit binding area 431, and at least one chip 70 is clamped between the cladding layer 24 and the binding portion 43. The material of the cladding layer 24 can include graphite. The cladding layer 24 can cover the end surface of the chip 70 away from the binding portion 43 in the second direction, and cover the end surface of the chip 70 parallel to the display portion 41. In the present example, the cladding layer 24 is added to enhance the heat dissipation capacity of the chip 70 after heating.

[0043] As shown in FIG. 6, the display module 40 further includes a cladding layer 24 disposed on the circuit binding area 431, and at least one chip 70 is clamped between the cladding layer 24 and the binding portion 43. The material of the cladding layer 24 can include graphite. The cladding layer 24 can cover the end surface of the chip 70 away from the binding portion 43 in the second direction, and cover the end surface of the chip 70 parallel to the display portion 41. In the present example, the cladding layer 24 is added to enhance the heat dissipation capacity of the chip 70 after heating. Figure 8 Figure 9 ​​​​As shown, the second grooves 13 can correspond to the first through holes 11 one by one, and the openings of the second grooves 13 can communicate with the ends of the corresponding first through holes 11 away from the display part 41. The orthographic projection of the second grooves 13 on the display part 41 overlaps the orthographic projection of the corresponding first through holes 11 on the display part 41. However, it is not limited to this. For example, two or more first through holes 11 can communicate with the same second groove 13, for example, the orthographic projection of the two or more first through holes 11 on the display part 41 is located within the orthographic projection range of the same second groove 13 on the display part 41. For another example, the second grooves 13 can correspond to the first through holes 11 one by one, and the orthographic projection of the second grooves 13 on the display part 41 overlaps the orthographic projection of the corresponding first through holes 11 on the display part 41.

[0044] In some example embodiments, as shown in Figure 8 and Figure 9 As shown, the main plate 91 includes a flat plate segment 911, which can be flat plate-shaped, and the flat plate segment 911 is parallel to the display part 41. The flat plate segment 911 and the convex 912 are an integral piece, and the flat plate segment 911 can be bonded by the first adhesive layer 22 and the composite layer 60. The convex 912 includes two side walls 9121 and a top wall 9122. The two side walls 9121 are arranged in the first direction and are spaced apart. One end of any side wall 9121 is connected to the flat plate segment 911, and the other end extends to the side away from the composite layer 60 in the second direction. The two ends of the top wall 9122 in the first direction are respectively connected to the ends of the two side walls 9121 away from the composite layer 60 in the second direction. The electronic element 92 is arranged on the top wall 9122.

[0045] In some example embodiments, as shown in Figure 8 and Figure 9 As shown, the two side walls 9121 are both parallel to the second direction, that is, the two side walls 9121 both extend along the second direction, and the two side walls 9121 are both perpendicular to the flat plate segment 911.

[0046] Figure 10 For another display module of the present example embodiment, as shown in Figure 10 As shown, the convex 912 includes two side walls 9121 and a top wall 9122. The two side walls 9121 are arranged in the first direction and are spaced apart. One end of any side wall 9121 is connected to the flat plate segment 911, and the other end extends to the side away from the composite layer 60 in the second direction. The two ends of the top wall 9122 in the first direction are respectively connected to the ends of the two side walls 9121 away from the composite layer 60 in the second direction. The electronic element 92 is arranged on the top wall 9122. The two side walls 9121 are both arranged obliquely relative to the second direction, wherein the included angle between the side wall 9121 and the second direction can be α. The second groove 13 surrounded by the convex 912 has a size in the first direction that gradually decreases in the direction away from the composite layer 60 in the second direction, forming a trapezoidal groove.

[0047] Figure 11 As shown in FIG. 13, the convex 912 is provided with one, and the electronic element 92 is provided with multiple, and the multiple electronic elements 92 are all arranged on one convex 912. Thus, the orthographic projection of the multiple electronic elements 92 on the display part 41 can be located on the same convex 912 within the orthographic projection range of the convex 912 on the display part 41. Figure 11

[0048] Figure 12 As shown in FIG. 14, the convex 912 is provided with one, and the electronic element 92 is provided with multiple, and the multiple electronic elements 92 are all arranged on one convex 912. Thus, the orthographic projection of the multiple electronic elements 92 on the display part 41 can be located on the same convex 912 within the orthographic projection range of the convex 912 on the display part 41. Figure 13 Figure 12 As shown in FIG. 15, the convex 912 is provided with one, and the electronic element 92 is provided with multiple, and the multiple electronic elements 92 are all arranged on one convex 912. Thus, the orthographic projection of the multiple electronic elements 92 on the display part 41 can be located on the same convex 912 within the orthographic projection range of the convex 912 on the display part 41. Figure 12 Figure 13 As shown in FIG. 16, the convex 912 is provided with one, and the electronic element 92 is provided with multiple, and the multiple electronic elements 92 are all arranged on one convex 912. Thus, the orthographic projection of the multiple electronic elements 92 on the display part 41 can be located on the same convex 912 within the orthographic projection range of the convex 912 on the display part 41.

[0049] In some example embodiments, a display device includes the display module described above, and the display device can be an OLED display device. The display device provided by the embodiments of the present disclosure can be applied to electronic equipment, and can be a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a vehicle-mounted display, and can also be a wearable device or any product or component with a display function, such as a smart watch, a smart bracelet, smart glasses, smart earphones, smart clothing, a head-mounted display, etc.

[0050] ​​​In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0051] In addition, the terms "first", "second", and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include at least one of the features.

[0052] In the description of the present application, "a plurality of" means at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0053] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, "connecting" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0055] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0056] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. A display module, characterized in that, include: The display panel includes a display part, a bending part, and a binding part connected in sequence. The bending part is configured to fold towards the backlight side of the display part. One end of the binding part is connected to the bending part in a first direction, which is parallel to the display part. A composite layer is disposed on the side of the display portion facing the bonding portion; A circuit board includes a motherboard and at least one electronic component. The motherboard is bonded to the composite layer on a side away from the display in a second direction. The at least one electronic component is disposed on the motherboard on the side away from the composite layer in a second direction, which is perpendicular to the display. At least one hollow heat insulation cavity is provided between the motherboard and the composite layer. The orthographic projection of any electronic component on the display and the orthographic projection of the at least one heat insulation cavity on the display overlap.

2. The display module according to claim 1, characterized in that, The orthographic projection of any of the electronic components on the display unit is located within the orthographic projection range of the at least one heat insulation cavity on the display unit.

3. The display module according to claim 2, characterized in that, The electronic components are provided in multiple ways, and the heat insulation cavities are provided in multiple ways. The multiple electronic components and the multiple heat insulation cavities correspond one-to-one. The orthographic projection of any electronic component on the display unit is located within the orthographic projection range of one of the multiple heat insulation cavities on the display unit.

4. The display module according to claim 1, characterized in that, It also includes a first adhesive layer located between the motherboard and the composite layer, the first adhesive layer having at least one first through hole extending through in the second direction, and the heat insulation cavity including the first through hole.

5. The display module according to claim 4, characterized in that, The composite layer has at least one first groove on the side away from the display part in the second direction. At least one first groove and at least one first through hole correspond to each other and are connected. The first groove and the first through hole constitute the heat insulation cavity.

6. The display module according to claim 5, characterized in that, The orthographic projection of any of the first grooves on the display unit overlaps with the orthographic projection of at least one of the first through holes on the display unit.

7. The display module according to claim 4, characterized in that, The motherboard has a protrusion that protrudes away from the composite layer in the second direction, and at least one electronic component is disposed on the side of the protrusion away from the composite layer in the second direction. The convex bulge forms a second groove on one end face of the composite layer in the second direction. The second groove communicates with the first through hole, and the second groove and the first through hole constitute the heat insulation cavity.

8. The display module according to claim 7, characterized in that, The orthographic projection of the second groove on the display unit and the orthographic projection of the at least one first through hole on the display unit overlap; Alternatively, the orthographic projection of the at least one first through hole on the display unit is located within the orthographic projection range of the second groove on the display unit.

9. The display module according to claim 7, characterized in that, The convex hull is provided, and multiple electronic components are provided, with all multiple electronic components disposed on a single convex hull.

10. The display module according to claim 7, characterized in that, The motherboard includes a flat plate segment, and the flat plate segment and the composite layer are bonded together. The convex hull includes two sidewalls and a top wall. The two sidewalls are arranged at intervals in the first direction. One end of each sidewall is connected to the flat plate segment, and the other end extends away from the composite layer in the second direction. The ends of the two sidewalls away from the composite layer in the second direction are respectively connected to the two ends of the top wall in the first direction. The at least one electronic component is disposed on the top wall. The sidewall is parallel to the second direction or inclined relative to the second direction.

11. The display module according to claim 4, characterized in that, The composite layer has at least one first groove on the side away from the display portion in the second direction; The motherboard has a protrusion that protrudes away from the composite layer in the second direction, and at least one electronic component is disposed on the side of the protrusion that protrudes away from the composite layer in the second direction. The end face of the protrusion that is close to the composite layer in the second direction forms a second groove. One end of the first through hole in the second direction is connected to the first groove, and the other end is connected to the second groove. The first groove, the first through hole, and the second groove constitute the heat insulation cavity.

12. The display module according to claim 1, characterized in that, It also includes at least one chip and a spacer; The bonding portion has a circuit bonding area on the side away from the display portion in the second direction, and the at least one chip is disposed in the circuit bonding area; The gasket is sandwiched between the bonding portion and the composite layer, and the material of the gasket includes graphite.

13. The display module according to claim 12, characterized in that, It also includes a coating layer disposed in the circuit bonding area, the at least one chip being sandwiched between the coating layer and the bonding portion, the material of the coating layer including graphite.

14. The display module according to claim 13, characterized in that, The covering layer covers the end face of the chip away from the bonding portion in the second direction, and also covers the end face of the chip in the direction parallel to the display portion.

15. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 14.

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