Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, the display panel comprises a substrate, a pixel definition layer and a light-emitting function layer, and the pixel definition layer comprises multiple isolation layers and pixel openings penetrating through the multiple isolation layers; the light-emitting functional layer comprises a plurality of light-emitting elements, each light-emitting element comprises a plurality of functional layers, the functional layers are sequentially stacked in the direction from the substrate to the pixel defining layer, and the functional layers comprise at least one first functional layer located in the pixel opening. And at least one isolation layer is arranged between the first functional layers of the adjacent light-emitting elements. According to the invention, crosstalk between at least one functional layer in adjacent light-emitting elements can be avoided or reduced.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays and LED-based display panels are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream in display devices.

[0003] In related technologies, leakage current is prone to occur in some functional layers of adjacent light-emitting elements in a display panel, causing crosstalk between adjacent light-emitting elements and affecting the display effect of the display panel. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to address the technical problem of improving the display effect of the relevant display panel.

[0005] An embodiment of the first aspect of this application provides a display panel, including:

[0006] substrate;

[0007] The pixel definition layer includes multiple isolation layers and pixel openings that penetrate the multiple isolation layers;

[0008] The light-emitting functional layer includes multiple light-emitting elements. Each light-emitting element includes multiple functional layers. The functional layers are stacked sequentially along the direction from the substrate to the pixel definition layer. The multiple functional layers include at least one first functional layer located within the pixel opening, and at least one isolation layer is disposed between the first functional layers of adjacent light-emitting elements.

[0009] According to an embodiment of the first aspect of this application, the multilayer isolation layer further includes a first isolation layer and a second isolation layer, wherein the first isolation layer is located on the side of the second isolation layer opposite to the substrate, and the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate.

[0010] According to an embodiment of the first aspect of this application, the surface of the first isolation layer that defines the pixel opening protrudes toward the central axis of the pixel opening relative to the surface of the second isolation layer that defines the pixel opening.

[0011] According to an embodiment of the first aspect of this application, the surface of the first isolation layer defining the pixel opening, the surface of the first isolation layer near the substrate, and the surface of the second isolation layer defining the pixel opening form a first step structure.

[0012] According to an embodiment of the first aspect of this application, the first isolation layer is an inorganic isolation layer.

[0013] According to the first aspect of this application, the second isolation layer is an inorganic isolation layer.

[0014] According to an embodiment of the first aspect of this application, under wet etching conditions, the etching rate of the first isolation layer is less than the etching rate of the second isolation layer.

[0015] According to an embodiment of the first aspect of this application, the first isolation layer is a silicon nitride layer, and the second isolation layer is a silicon oxide layer.

[0016] According to an embodiment of the first aspect of this application, the display panel includes a support layer, the support layer includes a plurality of first support portions, the first support portions are located on the side of the pixel definition layer away from the substrate, and the orthographic projection of the first support portion on the substrate overlaps with the orthographic projection of the pixel definition layer on the substrate.

[0017] According to an embodiment of the first aspect of this application, the orthographic projection of the support layer onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate.

[0018] According to an embodiment of the first aspect of this application, the multilayer isolation layer includes a second isolation layer and a third isolation layer, the third isolation layer is located on the side of the second isolation layer close to the substrate, and the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.

[0019] According to an embodiment of the first aspect of this application, in the surfaces of the second isolation layer and the third isolation layer that define the same pixel opening, the surface of the third isolation layer that defines the pixel opening protrudes toward the central axis of the pixel opening relative to the surface of the second isolation layer that defines the pixel opening.

[0020] According to an embodiment of the first aspect of this application, the surface of the third isolation layer defining the pixel opening, the surface of the third isolation layer facing away from the substrate, and the surface of the second isolation layer defining the pixel opening form a second step structure.

[0021] According to the first aspect of this application, the third isolation layer is an inorganic isolation layer.

[0022] According to an embodiment of the first aspect of this application, under wet etching conditions, the etching rate of the third isolation layer is less than the etching rate of the second isolation layer.

[0023] According to an embodiment of the first aspect of this application, the third isolation layer is a silicon nitride layer.

[0024] According to an embodiment of the first aspect of this application, the multilayer isolation layer further includes a first isolation layer, which is located on the side of the second isolation layer away from the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.

[0025] According to an embodiment of the first aspect of this application, the display panel further includes:

[0026] The first electrode layer includes a plurality of first electrodes spaced apart. The first electrodes are disposed on the side of the light-emitting element close to the substrate and in contact with the light-emitting element. The third isolation layer is disposed between adjacent first electrodes.

[0027] According to an embodiment of the first aspect of this application, the third isolation layer is disposed with its orthographic projection on the substrate surrounding the orthographic projection of the first electrode on the substrate.

[0028] According to an embodiment of the first aspect of this application, the first electrode includes a first connecting surface and a second connecting surface disposed opposite each other along the direction from the substrate to the pixel definition layer, and a side surface connecting the first connecting surface and the second connecting surface, and a third isolation layer covering the side surface.

[0029] According to an embodiment of the first aspect of this application, the second connecting surface is located on the side of the first connecting surface away from the substrate, and a portion of the second connecting surface is covered by a third isolation layer.

[0030] According to an embodiment of the first aspect of this application, the multilayer isolation layer includes a second isolation layer and a fourth isolation layer. The fourth isolation layer includes an isolation portion and a second support portion. The second support portion is disposed on the side of the isolation portion away from the substrate. The orthographic projection of the second isolation layer onto the substrate is located within the orthographic projection of the isolation portion onto the substrate.

[0031] According to an embodiment of the first aspect of this application, the orthographic projection of the second support portion onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate.

[0032] According to an embodiment of the first aspect of this application, the surface of the isolation portion near the substrate has a larger projected area on the substrate than the surface of the isolation portion away from the substrate.

[0033] According to an embodiment of the first aspect of this application, the multilayer isolation layer includes a first isolation layer, which is located between a second isolation layer and a fourth isolation layer, and the orthographic projection of the fourth isolation layer onto the substrate is located within the orthographic projection of the first isolation layer onto the substrate.

[0034] According to an embodiment of the first aspect of this application, under wet etching conditions, the etching rate of the fourth isolation layer is less than the etching rate of the second isolation layer.

[0035] According to an embodiment of the first aspect of this application, the fourth isolation layer is an organic adhesive layer.

[0036] According to an embodiment of the first aspect of this application, the isolation portion forms an opening, and the opening is connected to the pixel opening.

[0037] According to an embodiment of the first aspect of this application, the multilayer functional layer includes a first light-emitting layer, a charge-generating layer, and a second light-emitting layer, wherein the first light-emitting layer, the charge-generating layer, and the second light-emitting layer are sequentially stacked along the substrate to the pixel definition layer.

[0038] An isolation layer is placed between the charge generation layers of adjacent light-emitting elements.

[0039] According to an embodiment of the first aspect of this application, the multilayer functional layer includes a first hole injection layer, a first light-emitting layer, a charge generation layer and a second light-emitting layer, wherein the first hole injection layer, the first light-emitting layer, the charge generation layer and the second light-emitting layer are stacked sequentially along the substrate to the pixel definition layer.

[0040] An isolation layer is disposed between the first hole injection layers of adjacent light-emitting elements.

[0041] According to an embodiment of the first aspect of this application, the multilayer functional layer includes a first hole injection layer, a first hole transport layer, a first light emission layer, a first electron transport layer, a first electron injection layer, a charge generation layer, a second hole injection layer, a second hole transport layer, a second light emission layer, a second electron transport layer, and a second electron injection layer, which are sequentially stacked along the direction from the substrate to the pixel definition layer.

[0042] According to an embodiment of the first aspect of this application, at least one of the second hole injection layer, the second hole transport layer, the second electron injection layer, and the second electron transport layer is a first common layer, the first common layers in adjacent light-emitting elements are connected, and the orthogonal projection of the first common layer on the substrate covers the orthogonal projection of the pixel definition layer on the substrate.

[0043] An embodiment of the second aspect of this application provides a display panel, including:

[0044] substrate;

[0045] The pixel definition layer includes multiple isolation layers and a pixel opening that penetrates the multiple isolation layers. The multiple isolation layers include a second isolation layer and a fourth isolation layer. The fourth isolation layer includes an isolation portion and a second support portion. The second support portion is disposed on the side of the isolation portion away from the substrate. The orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the isolation portion on the substrate.

[0046] The light-emitting functional layer includes multiple light-emitting elements. Each light-emitting element includes multiple functional layers. The functional layers are stacked sequentially along the direction from the substrate to the pixel definition layer. The multiple functional layers include at least one first functional layer located within the pixel opening, and at least one isolation layer is disposed between the first functional layers of adjacent light-emitting elements.

[0047] According to an embodiment of the second aspect of this application, the orthographic projection of the second support portion onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate.

[0048] According to an embodiment of the second aspect of this application, the surface of the isolation portion near the substrate has a larger projected area on the substrate than the surface of the isolation portion away from the substrate.

[0049] According to an embodiment of the second aspect of this application, under wet etching conditions, the etching rate of the fourth isolation layer is less than the etching rate of the second isolation layer.

[0050] According to an embodiment of the second aspect of this application, the fourth isolation layer is an organic adhesive layer.

[0051] According to an embodiment of the second aspect of this application, the isolation portion forms an opening, and the opening is connected to the pixel opening.

[0052] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0053] A substrate and a first electrode layer disposed on one side of the substrate are provided, the first electrode layer including a plurality of spaced first electrodes;

[0054] A pixel definition layer is formed on one side of the substrate. The pixel definition layer includes multiple isolation layers and a pixel opening that penetrates the multiple isolation layers, with the pixel opening exposing the first electrode.

[0055] A light-emitting functional layer is formed on one side of the substrate. The light-emitting functional layer includes multiple light-emitting elements. The light-emitting elements are located on the side of the first electrode away from the substrate. The light-emitting elements include multiple functional layers. The functional layers are stacked sequentially along the direction from the substrate to the pixel definition layer. At least one functional layer is located inside the pixel opening. At least one isolation layer is disposed between the functional layers of adjacent light-emitting elements located inside the pixel opening.

[0056] According to an embodiment of the third aspect of this application, forming a pixel definition layer on one side of a substrate includes:

[0057] A multilayer isolation layer is provided on one side of the substrate. The multilayer isolation layer includes a first isolation layer, a second isolation layer and a third isolation layer. The first isolation layer is located on the side of the second isolation layer away from the substrate, and the third isolation layer is located on the side of the second isolation layer close to the substrate.

[0058] Dry etching is performed on the region of the first electrode corresponding to the multilayer isolation layer until the third isolation layer is exposed from the pixel opening obtained by etching.

[0059] The second isolation layer is wet etched to obtain a projection of the second isolation layer onto the substrate that is within the projection of the first isolation layer onto the substrate.

[0060] Dry etching is performed on the third isolation layer until the first electrode is exposed from the pixel opening.

[0061] According to the embodiment of the third aspect of this application, wet etching of the second isolation layer includes:

[0062] The second isolation layer is wet-etched using at least one of hydrofluoric acid and its derivatives.

[0063] According to an embodiment of the third aspect of this application, dry etching of the region corresponding to the first electrode in the multilayer isolation layer includes:

[0064] A patterned photoresist is disposed on the side of the first isolation layer away from the substrate, and the photoresist has a first opening corresponding to the first electrode;

[0065] Using photoresist as a photomask, dry etching is performed on the area of ​​the first electrode corresponding to the multilayer isolation layer until the third isolation layer is exposed from the pixel opening obtained by etching.

[0066] According to an embodiment of the third aspect of this application, a light-emitting functional layer is formed on one side of a substrate, comprising:

[0067] Remove the photoresist;

[0068] An organic adhesive layer is prepared on the side of the first isolation layer away from the substrate. The organic adhesive layer is patterned to obtain a support layer with multiple first support portions. The orthographic projection of the first support portion on the substrate overlaps with the orthographic projection of the pixel definition layer on the substrate.

[0069] A light-emitting functional layer is formed within the pixel opening;

[0070] According to an embodiment of the third aspect of this application, the orthographic projection of the support layer onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate.

[0071] According to the implementation of the third aspect of this application, the first isolation layer, the second isolation layer and the third isolation layer are all inorganic isolation layers.

[0072] According to the third aspect of this application, when wet etching is performed on the second isolation layer, the etching rates of the first isolation layer and the third isolation layer are both less than the etching rate of the second isolation layer.

[0073] According to an embodiment of the third aspect of this application, forming a pixel definition layer on one side of a substrate includes:

[0074] A multilayer isolation layer is provided on one side of the substrate. The multilayer isolation layer also includes a second isolation layer and a third isolation layer. The third isolation layer is located on the side of the second isolation layer that is close to the substrate.

[0075] An organic adhesive layer is prepared on the side of the multilayer isolation layer away from the substrate, and the organic adhesive layer is patterned to obtain a fourth isolation layer with multiple second support portions. The fourth isolation layer includes an isolation portion and a second support portion, and the second support portion is disposed on the side of the isolation portion away from the substrate.

[0076] Using the fourth isolation layer as a photomask, dry etching is performed on the area of ​​the first electrode corresponding to the multi-layer isolation layer until the third isolation layer is exposed from the pixel opening obtained by etching.

[0077] The second isolation layer is wet etched to obtain a projection of the second isolation layer onto the substrate that is located within the projection of the fourth isolation layer onto the substrate.

[0078] Using the fourth isolation layer as a photomask, the third isolation layer is dry etched until the first electrode is exposed.

[0079] According to an embodiment of the third aspect of this application, an organic adhesive layer is prepared on the side of the multilayer isolation layer facing away from the substrate, and the organic adhesive layer is patterned to obtain a fourth isolation layer comprising:

[0080] An organic adhesive layer is prepared on the side of the multilayer isolation layer away from the substrate;

[0081] A semi-transparent mask is used to pattern the organic adhesive layer to obtain the fourth isolation layer.

[0082] According to the implementation of the third aspect of this application, the second isolation layer and the third isolation layer are inorganic isolation layers.

[0083] According to an embodiment of the third aspect of this application, when the second isolation layer is wet-etched, the etching rate of the third isolation layer is less than the etching rate of the second isolation layer.

[0084] According to an embodiment of the third aspect of this application, the orthographic projection of the second isolation layer onto the substrate is located within the orthographic projection of the isolation portion onto the substrate.

[0085] The fourth aspect of this application also provides a display device, including a display panel prepared according to any of the first aspect embodiments, the second aspect embodiments, or the third aspect embodiments.

[0086] In the display panel provided in this application embodiment, by setting the pixel definition layer to include multiple isolation layers, and setting at least one of the multiple isolation layers to be disposed between the functional layers of adjacent light-emitting elements located within the pixel opening, the isolation layers can reduce or avoid crosstalk between the functional layers of adjacent light-emitting elements, improve the stability of light emission of the light-emitting elements, and improve the display effect of the display panel. Attached Figure Description

[0087] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0088] Figure 1 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0089] Figure 2 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0090] Figure 3 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0091] Figure 4 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0092] Figure 5 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0093] Figure 6 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0094] Figure 7 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0095] Figure 8 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0096] Figure 9 This is a cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0097] Figure 10 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0098] Figure 11 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0099] Figure 12 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0100] Figure 13 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0101] Figure 14 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application;

[0102] Figure 15 This is a partial flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application.

[0103] Explanation of reference numerals in the attached figures:

[0104] 1. Substrate; 11. Substrate; 12. Driving circuit layer;

[0105] 2. Pixel definition layer; 21. Isolation layer; 21a. First isolation layer; 21b. Second isolation layer; 21c. Third isolation layer; 21d. Fourth isolation layer; 22. Pixel opening; 211. Isolation part; 212. Second support part; 213. First stop surface; 214. Third surface; 215. Second stop surface; 216. First surface; 217. Second surface; 23. First step structure; 24. Second step structure;

[0106] 3. Light-emitting element; 30. Functional layer; 31. First hole injection layer; 32. First light-emitting layer; 33. First electron injection layer; 34. Charge generation layer; 35. Second hole injection layer; 36. Second light-emitting layer; 37. Second electron injection layer;

[0107] 4. First electrode layer; 41. First electrode; 411. First connecting surface; 412. Second connecting surface; 413. Side surface;

[0108] 5. Second electrode layer; 6. Support layer; 61. First support portion;

[0109] X, the first direction. Detailed Implementation

[0110] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0111] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0112] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0113] To address the aforementioned issues, this application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0114] The first aspect of this application provides a display panel, such as... Figure 1 and Figure 2 As shown, a display panel includes a substrate 1, a pixel definition layer 2, and a light-emitting functional layer. The pixel definition layer 2 includes multiple isolation layers 21 and pixel openings 22 penetrating the multiple isolation layers 21. The light-emitting functional layer includes a plurality of light-emitting elements 3. Each light-emitting element 3 includes multiple functional layers 30. The functional layers 30 are stacked sequentially along the direction from the substrate 1 to the pixel definition layer 2. Each multi-layer functional layer 30 includes at least one first functional layer located within the pixel opening 22. At least one isolation layer 21 is disposed between the first functional layers of adjacent light-emitting elements 3.

[0115] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0116] In the display panel provided in this application embodiment, the substrate 1 can not only provide support for the pixel definition layer 2, but also provide electrical signals for the light-emitting functional layer. There are various ways to configure the substrate 1. In some embodiments, the substrate 1 may include a substrate 11 and a driving circuit layer 12 disposed on the substrate 11. The driving circuit layer 12 may include a pixel driving circuit, multiple stacked conductive layers, etc. For example, the pixel driving circuit disposed on the driving circuit layer 12 includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a drain, and a source. The storage capacitor includes a first electrode and a second electrode.

[0117] The pixel defining layer 2 has multiple isolation layers 21, and the pixel opening 22 penetrates through the multiple isolation layers 21. This allows the layer structure on one side of the pixel defining layer 2 to be exposed through the pixel opening 22 during the vapor deposition process of the light-emitting functional layer. The vapor-deposited material can enter the pixel opening 22 from one side of the pixel defining layer 2 and contact the layer structure. The multiple isolation layers 21 may include two, three, four, or more layers, and those skilled in the art can set the number of isolation layers according to actual needs. In the multiple isolation layers 21, any two layers can be made of the same material for ease of fabrication. Alternatively, at least two layers can be made of different materials to obtain isolation layers 21 with different physicochemical properties.

[0118] At least a portion of the light-emitting element 3 is located within the pixel opening 22. The light-emitting element 3 can be a red light-emitting element 3, a blue light-emitting element 3, or a green light-emitting element 3. The red light-emitting element 3 emits red light, the blue light-emitting element 3 emits blue light, the green light-emitting element 3 emits green light, and so on for other colors of light-emitting elements 3. The driving circuit layer 12 controls the lighting or extinguishing of each light-emitting element 3 so that the display panel can display different images.

[0119] The light-emitting element 3 includes multiple functional layers 30, which may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, etc. The first functional layer can be any layer among the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, electron injection layer, etc. Optionally, the first hole injection layer is the first functional layer. Those skilled in the art will understand that in order to enable the display panel to emit light of different colors, it is necessary to fabricate light-emitting elements 3 for emitting different colors. The pixel definition layer 2 can be spaced apart between each light-emitting element 3. At least some of the functional layers 30 in the light-emitting elements 3 for emitting different colors of light use the same material, so that at least some of the functional layers 30 in the light-emitting elements 3 for emitting different colors of light can be formed together. When fabricating the light-emitting element 3, the material A used to fabricate the light-emitting element 3 can be vapor-deposited using vapor deposition technology. A patterned mask is used so that the vapor-deposited material A enters the pixel opening 22 through the vapor deposition opening on the mask, and the material A entering the pixel opening 22 forms the functional layer 30. The functional layers 30 used to form different light-emitting elements 3 are separated by one or more isolation layers 21, so that the isolation layers 21 can reduce or avoid crosstalk between the functional layers 30 of adjacent light-emitting elements 3, thereby improving the stability of light emission from the light-emitting elements 3. Optionally, please refer to Figure 5 All functional layers 30 of the light-emitting element 3 are separated by the isolation layer 21.

[0120] In this embodiment, by setting the pixel definition layer 2 to include multiple isolation layers 21, and setting at least one of the multiple isolation layers 21 to be disposed between the functional layers 30 of adjacent light-emitting elements 3 located within the pixel opening 22, the isolation layers 21 can reduce or avoid crosstalk between the functional layers 30 of adjacent light-emitting elements 3, improve the stability of light emission of light-emitting elements 3, and improve the display effect of the display panel.

[0121] Please refer to it again. Figure 1 and Figure 2 In some embodiments, the multilayer isolation layer 21 includes a first isolation layer 21a and a second isolation layer 21b. The first isolation layer 21a is located on the side of the second isolation layer 21b away from the substrate 1, and the orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the first isolation layer 21a onto the substrate 1.

[0122] The orthographic projection can be a projection along a first direction X, which can be the thickness direction of the display panel or the direction from the substrate 1 to the pixel definition layer 2. The multilayer isolation layer 21 includes a first isolation layer 21a and a second isolation layer 21b. The first isolation layer 21a and the second isolation layer 21b can be any two of the multilayer isolation layers 21, meaning the pixel definition layer 2 can also include other isolation layers 21 besides the first isolation layer 21a and the second isolation layer 21b. The orthographic projection of the second isolation layer 21b onto the substrate 1 lies within the orthographic projection of the first isolation layer 21a onto the substrate 1. That is, the first isolation layer 21a has a larger projection area than the second isolation layer 21b. The size of the pixel opening 22 at the first isolation layer 21a is smaller than the size of the pixel opening 22 at the second isolation layer 21b, allowing the first isolation layer 21a to block the functional layer 30 located within the pixel opening 22. This facilitates fixing at least one isolation layer 21 within the pixel opening 22, preventing the functional layer 30 located within the pixel opening 22 from peeling off from the pixel definition layer 2.

[0123] In some embodiments, the surface of the first isolation layer 21a that defines the pixel opening 22 protrudes toward the central axis of the pixel opening 22 relative to the surface of the second isolation layer 21b that defines the pixel opening 22, such that the portion of the first isolation layer 21a that protrudes relative to the second isolation layer 21b has a blocking effect on one or more functional layers 30, which is beneficial to improving the stability of the functional layer 30 within the pixel opening 22.

[0124] Please see Figure 3 and Figure 4 In some embodiments, the first isolation layer 21a defines the surface of the pixel opening 22, the surface of the first isolation layer 21a near the substrate 1, and the second isolation layer 21b defines the surface of the pixel opening 22 to form a first step structure 23.

[0125] The first isolation layer 21a and the second isolation layer 21b are stacked adjacent to each other. (See also...) Figure 3 First, dry etching can be performed on the surface of the pixel definition layer 2 facing away from the substrate 1 to obtain a pixel opening 22 whose size gradually increases along the direction from the substrate 1 to the pixel definition layer 2. This results in the first isolation layer 21a having a first surface 216 defining the pixel opening 22, and the second isolation layer 21b having a second surface 217 defining the pixel opening 22. The first surface 216 and the second surface 217 are connected to form a slope inclined relative to the direction from the substrate 1 to the pixel definition layer 2. (See also...) Figure 4Then, by wet etching the second isolation layer 21b, the second isolation layer 21b is recessed relative to the first isolation layer 21a in a direction away from the central axis of the pixel opening 22, exposing a portion of the surface of the first isolation layer 21a near the substrate 1, forming a first blocking surface 213. The first surface 216, the first blocking surface 213, and the second surface 217 are sequentially connected to form a first stepped structure 23. By setting the first stepped structure 23 with discontinuity, the surface area of ​​the light-emitting element 3 in contact with the pixel definition layer 2 is increased, and the blocking effect of the first isolation layer 21a on at least part of the functional layer 30 is enhanced.

[0126] Please refer to it again. Figure 1 and Figure 2 In some embodiments, the first isolation layer 21a is an inorganic isolation layer.

[0127] The inorganic isolation layer is made of inorganic materials. By setting the first isolation layer 21a as an inorganic isolation layer, the insulation effect of the first isolation layer 21a on the functional layer 30 that is separated is improved.

[0128] In some embodiments, the second isolation layer 21b is an inorganic isolation layer.

[0129] By setting the first isolation layer 21a as an inorganic isolation layer, the insulation effect of the second isolation layer 21b on the functional layer 30 that is separated is improved.

[0130] In some embodiments, under wet etching conditions, the etching rate of the first isolation layer 21a is less than the etching rate of the second isolation layer 21b.

[0131] The first isolation layer 21a and the second isolation layer 21b can be made of the same material, but the proportions of the materials used can be different to give the first isolation layer 21a and the second isolation layer 21b different physicochemical properties. Alternatively, the first isolation layer 21a and the second isolation layer 21b can be made of different materials to give them different physicochemical properties. Thus, under the same wet etching conditions, the etching rate of the second isolation layer 21b is lower than the etching rate of the first isolation layer 21a. This means that under these wet etching conditions, the first isolation layer 21a can be etched to protrude relative to the second isolation layer 21b towards the central axis of the pixel opening 22.

[0132] In some embodiments, the first isolation layer 21a is a silicon nitride layer and the second isolation layer 21b is a silicon oxide layer.

[0133] Under wet etching conditions, the etching rate of the silicon nitride layer is lower than that of the silicon oxide layer. Therefore, the first isolation layer 21a and the second isolation layer 21b can be etched by wet etching to obtain the desired structure. Optionally, at least one of hydrofluoric acid and its derivatives is used to wet etch the second isolation layer 21b, wherein the hydrofluoric acid and its derivatives do not react with the first isolation layer 21a, or the etching rate of the first isolation layer 21a is lower than the etching rate of the second isolation layer 21b.

[0134] Please see Figure 4 and Figure 5 In some embodiments, the display panel includes a support layer 6, which includes a plurality of first support portions 61. The first support portions 61 are located on the side of the pixel definition layer 2 away from the substrate 1, and the orthographic projection of the first support portions 61 on the substrate 1 overlaps with the orthographic projection of the pixel definition layer 2 on the substrate 1.

[0135] During the vapor deposition process of the light-emitting functional layer, the pixel definition layer 2 can be spaced apart from the fabrication mask by the support layer 6 to ensure the spacing between the pixel definition layer 2 and the mask. The orthographic projection of the first support portion 61 onto the substrate 1 overlaps with the orthographic projection of the pixel definition layer 2 onto the substrate 1, allowing the vapor-deposited material to enter the pixel opening 22 through the gap between the first support portions 61. Light emitted from the light-emitting functional layer can be emitted outward through the gap between the first support portions 61.

[0136] In some embodiments, the orthographic projection of the support layer 6 onto the substrate 1 is located within the orthographic projection of the second isolation layer 21b onto the substrate 1.

[0137] The orthographic projection of the support layer 6 onto the substrate 1 lies within the orthographic projection of the second isolation layer 21b onto the substrate 1. That is, compared to the support layer 6, the second isolation layer 21b has a larger projection area, which facilitates the passage of light emitted by the light-emitting element 3 through the inter-emission gap between the first support portions 61. Optionally, the first support portion 61 is a light-shielding pillar, which can reduce or prevent light mixing between adjacent light-emitting elements 3.

[0138] In some embodiments, the multilayer isolation layer 21 further includes a third isolation layer 21c, which is located on the side of the second isolation layer 21b close to the substrate 1, and the orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the third isolation layer 21c onto the substrate 1.

[0139] The orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the third isolation layer 21c onto the substrate 1. That is, compared to the second isolation layer 21b, the third isolation layer 21c has a larger projection area. The size of the pixel opening 22 at the third isolation layer 21c is smaller than the size of the pixel opening 22 at the second isolation layer 21b. This allows the third isolation layer 21c to block the functional layer 30 located within the pixel opening 22, which is beneficial for fixing at least one isolation layer 21 within the pixel opening 22 and preventing the functional layer 30 located within the pixel opening 22 from peeling off from the pixel definition layer 2.

[0140] In some embodiments, the second isolation layer 21b and the third isolation layer 21c define the surface of the same pixel opening 22. The surface of the third isolation layer 21c that defines the pixel opening 22 protrudes towards the central axis of the pixel opening 22 relative to the surface of the second isolation layer 21b that defines the pixel opening 22. This makes the portion of the third isolation layer 21c that protrudes relative to the second isolation layer 21b block one or more functional layers 30, which helps to improve the stability of the functional layer 30 within the pixel opening 22.

[0141] Please see Figure 3 and Figure 4 In some embodiments, the third isolation layer 21c defines the surface of the pixel opening 22, the surface of the third isolation layer 21c facing away from the substrate 1, and the second isolation layer 21b defines the surface of the pixel opening 22 to form a second step structure 24.

[0142] The third isolation layer 21c and the second isolation layer 21b are stacked adjacent to each other. Dry etching can be performed on the surface of the pixel definition layer 2 facing away from the substrate 1 to obtain a pixel opening 22 with an increasing dimension along the direction from the substrate 1 to the pixel definition layer 2, and a second step structure 24. (See also...) Figure 3 With the first isolation layer 21a provided, the surface of the pixel definition layer 2 facing away from the substrate 1 can be dry-etched first to obtain a pixel opening 22 whose size gradually increases along the direction from the substrate 1 to the pixel definition layer 2. This results in the first isolation layer 21a having a first surface 216 defining the pixel definition layer 2, the second isolation layer 21b having a second surface 217 defining the pixel opening 22, and the third isolation layer 21c having a third surface 214 defining the pixel opening 22. The first surface 216, the second surface 217, and the third surface 214 are connected to form a slope inclined relative to the direction from the substrate 1 to the pixel definition layer 2. (See also...) Figure 4Then, by wet etching the second isolation layer 21b, the second isolation layer 21b is recessed relative to the first isolation layer 21a and the third isolation layer 21c in a direction away from the central axis of the pixel opening 22. The portion of the surface of the first isolation layer 21a near the substrate 1 is exposed, forming the first blocking surface 213 defining the pixel definition layer 2. The portion of the surface of the third isolation layer 21c away from the substrate 1 is exposed, forming the second blocking surface 215 defining the pixel definition layer 2. The first surface 216, the first blocking surface 213, and the second surface 217 are sequentially connected to form the first step structure 23. The second surface 217, the second blocking surface 215, and the third surface 214 are sequentially connected to form the second step structure 24. By setting the first step structure 23 and the second step structure 24 with discontinuities, the surface area of ​​the light-emitting element 3 in contact with the pixel definition layer 2 is increased, and the blocking effect of the first isolation layer 21a and the third isolation layer 21c on at least part of the functional layer 30 is improved.

[0143] The first isolation layer 21a, the second isolation layer 21b, and the third isolation layer 21c can be enclosed to form a groove structure, that is, the first blocking surface 213, the second surface 217, and the second blocking surface 215 can be enclosed to form a groove structure. At least a portion of the light-emitting element 3 is embedded in the groove structure, which helps to improve the relative stability of the pixel definition layer 2 and the light-emitting element 3 and avoids the light-emitting element 3 from peeling off from the pixel definition layer 2.

[0144] In some embodiments, the third isolation layer 21c is an inorganic isolation layer 21.

[0145] The inorganic isolation layer 21 is made of inorganic materials. By setting the third isolation layer 21c as the inorganic isolation layer 21, the insulation effect of the first isolation layer 21a on the functional layer 30 that is separated is improved.

[0146] In some embodiments, under wet etching conditions, the etching rate of the third isolation layer 21c is less than the etching rate of the second isolation layer 21b.

[0147] The third isolation layer 21c and the second isolation layer 21b can be prepared using the same material, but the material ratios can be different to give them different physicochemical properties. Alternatively, the third isolation layer 21c and the second isolation layer 21b can be prepared using different materials to achieve the same physicochemical properties. Therefore, under the same wet etching conditions, the etching rate of the third isolation layer 21c is lower than that of the second isolation layer 21b. This means that under these wet etching conditions, the third isolation layer 21c can be etched to protrude relative to the second isolation layer 21b towards the central axis of the pixel opening 22.

[0148] In some embodiments, the third isolation layer 21c is a silicon nitride layer.

[0149] Under wet etching conditions, the etching rate of the silicon nitride layer is less than that of the silicon oxide layer, so the third isolation layer 21c and the second isolation layer 21b can be etched by wet etching to obtain the desired structure.

[0150] In some embodiments, the multilayer isolation layer 21 further includes a first isolation layer 21a, which is located on the side of the second isolation layer 21b away from the substrate 1, and the orthographic projection of the first isolation layer 21a onto the substrate 1 is located within the orthographic projection of the third isolation layer 21c onto the substrate 1.

[0151] Compared to the first isolation layer 21a, the third isolation layer 21c has a larger projected area on the substrate 1. That is, the size of the pixel opening 22 at the first isolation layer 21a is larger than the size of the pixel opening 22 at the third isolation layer 21c. Therefore, by dry etching starting from the side of the first isolation layer 21a away from the substrate 1, a pixel opening 22 that is larger at the top and smaller at the bottom can be obtained. The larger size of the pixel opening 22 at the first isolation layer 21a is beneficial to the emission of light emitted by the light-emitting element 3.

[0152] Please see Figure 5 In some embodiments, the display panel further includes a first electrode layer 4, which includes a plurality of first electrodes 41 spaced apart. The first electrodes 41 are disposed on the side of the light-emitting element 3 near the substrate 1 and are in contact with the light-emitting element 3. A third isolation layer 21c is disposed between adjacent first electrodes 41.

[0153] The display panel may further include a second electrode layer 5. The first electrode 41, the light-emitting element 3, and the second electrode layer 5 are sequentially stacked along the direction from the substrate 1 to the pixel definition layer 2 to achieve electrical conductivity between the first electrode layer 4, the light-emitting element 3, and the second electrode layer 5, thereby driving the light-emitting element 3 to emit light. One of the first electrode layer 4 and the second electrode layer 5 can serve as an anode electrode, and the other can serve as a cathode electrode. Optionally, the first electrode layer 4 is the anode electrode, and the second electrode layer 5 is the cathode electrode.

[0154] The third isolation layer 21c is disposed adjacent to the first electrode 41, thereby preventing leakage between adjacent first electrodes 41.

[0155] In some embodiments, the second electrode layer 5 can be a surface electrode, meaning that each light-emitting element 3 is electrically connected to the surface electrode, and the surface electrode can provide the same voltage level to each light-emitting element 3. The first electrode 41 is a point electrode, meaning that each light-emitting element 3 is electrically connected to a different first electrode 41, and different first electrodes 41 can provide different voltage levels to each light-emitting element 3. The second electrode layer 5 can be located outside the pixel opening 22.

[0156] In some embodiments, the third isolation layer 21c is disposed around the orthogonal projection of the first electrode 41 onto the substrate 1.

[0157] The third insulating layer 21c is disposed around the first electrode 41, thereby effectively insulating and protecting the periphery of the first electrode 41.

[0158] Please see Figure 6 In some embodiments, the first electrode 41 includes a first connection surface 411 and a second connection surface 412 disposed opposite to each other along the direction from the substrate 1 to the pixel definition layer 2, and a side surface 413 connecting the first connection surface 411 and the second connection surface 412, and the third isolation layer 21c covers the side surface 413.

[0159] The third isolation layer 21c covers the side surface 413, thereby preventing damage to the first electrode 41 during some fabrication processes in the display panel manufacturing process. For example, during wet etching of the isolation layer 21, if the side surface of the first electrode 41 is exposed to the etching solution used in wet etching, the etching solution will corrode part of the layer structure of the first electrode 41 from the side surface 413, resulting in poor conductivity of the first electrode 41. By covering the side surface 413 with the third isolation layer 21c, etching damage to the isolation layer 21 during wet etching can be avoided.

[0160] In some embodiments, the second connecting surface 412 is located on the side of the first connecting surface 411 away from the substrate 1, and a portion of the third isolation layer 21c overlaps with a portion of the second connecting surface 412.

[0161] The third isolation layer 21c partially overlaps the side of the first electrode 41 away from the substrate 1, thereby facilitating the protection of the side of the first electrode 41.

[0162] In some embodiments, the orthographic projection of the third isolation layer 21c onto the substrate 1 overlaps with the orthographic projection of the first electrode 41 onto the substrate 1. A portion of the third isolation layer 21c extends to the side of the first electrode 41 opposite to the substrate 1.

[0163] Please see Figure 7 In some embodiments, the multilayer isolation layer 21 includes a second isolation layer 21b and a fourth isolation layer 21d. The fourth isolation layer 21d includes an isolation portion 211 and a second support portion 212. The second support portion 212 is disposed on the side of the isolation portion 211 away from the substrate 1. The orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the isolation portion 211 onto the substrate 1.

[0164] Compared to the second isolation layer 21b, the fourth isolation layer 21d has a larger projected area, allowing it to shield the side of the second isolation layer 21b that faces away from the substrate 1. (See also...) Figure 8During the process of creating the pixel opening 22 by dry etching the pixel definition layer 2, the fourth isolation layer 21d can be reused as a photomask to block one side of the pixel definition layer 2, thereby eliminating the need to coat the pixel definition layer 2 with photoresist. During the process of fabricating the light-emitting element 3 by vapor deposition, the second support portion 212 can be disposed between the pixel definition layer 2 and the photomask to keep the distance between the pixel definition layer 2 and the photomask fixed.

[0165] In some embodiments, the orthographic projection of the second support portion 212 onto the substrate 1 is located within the orthographic projection of the second isolation layer 21b onto the substrate 1.

[0166] Compared to the second isolation layer 21b, the second support portion 212 has a smaller projected area, thereby preventing the second support portion 212 from blocking the material used to prepare the light-emitting element 3 from entering the pixel opening 22 and preventing the second support portion 212 from blocking the light-emitting element 3 from emitting light.

[0167] In some embodiments, the surface of the isolation portion 211 near the substrate 1 has a larger projected area on the substrate 1 than the surface of the isolation portion 211 away from the substrate 1.

[0168] The surface of the isolation portion 211 near the substrate 1 is smaller than the surface of the isolation portion 211 away from the substrate 1, which facilitates the entry of the material used to fabricate the light-emitting element 3 into the pixel opening 22. The size of the isolation portion 211 can be formed to gradually decrease along the direction away from the substrate 1.

[0169] Please see Figure 8 In some embodiments, the multilayer isolation layer 21 includes a first isolation layer 21a, which is located between a second isolation layer 21b and a fourth isolation layer 21d. The orthographic projection of the fourth isolation layer 21d onto the substrate 1 is located within the orthographic projection of the first isolation layer 21a onto the substrate 1.

[0170] The fourth isolation layer 21d can be reused as a photomask to block one side of the first isolation layer 21a. The orthographic projection of the fourth isolation layer 21d onto the substrate 1 is located within the orthographic projection position of the first isolation layer 21a onto the substrate 1 obtained by photolithography.

[0171] In some embodiments, under wet etching conditions, the etching rate of the fourth isolation layer 21d is less than the etching rate of the second isolation layer 21b.

[0172] The etching rates of the fourth isolation layer 21d and the third isolation layer 21c can be set to be lower than the etching rate of the second isolation layer 21b. Thus, the second isolation layer 21b can be wet-etched to obtain a projected area of ​​the second isolation layer 21b that is smaller than the projected areas of the fourth isolation layer 21d and the third isolation layer 21c.

[0173] In some embodiments, the fourth isolation layer 21d is an organic adhesive layer.

[0174] By setting the fourth isolation layer 21d as an organic adhesive layer, the fourth isolation layer 21d and the second isolation layer 21b can be differentiated, thus expanding the range of selectable etching parameters for wet etching preparation of the second isolation layer 21b. Since the fourth isolation layer 21d is an organic adhesive layer, a patterned fourth isolation layer 21d can be prepared based on a crosslinking reaction. For example, an organic adhesive with a crosslinked substance is coated on one side of the pixel definition layer 2. The crosslinked substance can be a crosslinking molecule or a crosslinking group. Light is irradiated onto a first region of the organic adhesive, causing the crosslinked substance in the first region to undergo a crosslinking reaction, and the organic adhesive in the first region to solidify. The organic adhesive is then cleaned to remove uncured organic adhesive in a second region, which corresponds to the gap between the second support portion 212, thus obtaining the fourth isolation layer 21d.

[0175] Alternatively, a half-tone mask (HTM) can be used to pattern the organic adhesive layer through exposure and development, forming the required isolation portion 211 and second support portion 212. For example, the fully transparent area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the gap between the second support portion 212, the semi-transparent area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the isolation portion 211, and the light-blocking area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the second support portion 212. Thus, the isolation portion 211 and the second support portion 212 can be prepared simultaneously using a single mask.

[0176] In some embodiments, the isolation portion 211 surrounds an opening that communicates with the pixel opening 22.

[0177] Unlike the multiple spaced second support portions 212, the isolation portion 211 can be a mesh structure, and the opening formed by the isolation portion 211 is the mesh of the mesh structure. The mesh structure isolation portion 211 can effectively block one side of the first isolation layer 21a or the second isolation layer 21b as a photomask. The pixel opening 22 formed by the first isolation layer 21a, the second isolation layer 21b, and the third isolation layer 21c is connected to the opening, so that the material used to prepare the light-emitting element 3 can be stacked and disposed on one side of the first electrode 41 through the opening.

[0178] Please see Figure 9 In some embodiments, the multilayer functional layer 30 includes a first light-emitting layer 32, a charge-generating layer 34, and a second light-emitting layer 36. The first light-emitting layer 32, the charge-generating layer 34, and the second light-emitting layer 36 are stacked sequentially along the substrate 1 to the pixel definition layer 2. The charge-generating layer 34 of adjacent light-emitting elements 3 is isolated by the isolation layer 21.

[0179] Those skilled in the art will understand that the light-emitting element 3 may also include other layer structures besides the first light-emitting layer 32, the second light-emitting layer 36, and the charge-generating layer 34. The first light-emitting layer 32, the charge-generating layer 34, and the second light-emitting layer 36 can form a stacked light-emitting structure. Under the drive of the driving circuit, the first light-emitting layer 32 and the second light-emitting layer 36 can emit light together. The first light-emitting layer 32 and the second light-emitting layer 36 can be stacked and used to emit light of the same color to improve the lifespan and brightness of the display panel. The first light-emitting layer 32 and the second light-emitting layer 36 can also be stacked and used to emit light of different colors to enrich the display effects achievable by the display panel.

[0180] A charge generation layer 34 (CGL) is disposed between the first light-emitting layer 32 and the second light-emitting layer 36 to supply electrons to one of the first light-emitting layer 32 and the second light-emitting layer 36 and to the other. The charge generation layers of the plurality of light-emitting elements 3 are spaced apart by their orthogonal projections on the substrate 1, and are disposed between the charge generation layers 34 of adjacent light-emitting elements 3 by means of an isolation layer 21 to avoid or reduce charge crosstalk between the charge generation layers 34 of adjacent light-emitting elements 3.

[0181] The first light-emitting layer 32, the second light-emitting layer 36, the charge-generating layer 34 in adjacent light-emitting elements, and other layer structures in light-emitting element 3 can all be separated by the isolation layer 21.

[0182] In some embodiments, the multilayer functional layer 30 includes a first hole injection layer 31, a first light-emitting layer 32, a charge generation layer 34, and a second light-emitting layer 36. The first hole injection layer 31, the first light-emitting layer 32, the charge generation layer 34, and the second light-emitting layer 36 are stacked sequentially along the substrate 1 to the pixel definition layer 2. An isolation layer 21 is disposed between the first hole injection layers 31 of adjacent light-emitting elements 3.

[0183] The first hole injection layer 31 is used to generate holes. The first hole injection layers 31 of multiple light-emitting elements 3 are spaced apart on the substrate 1 by their orthogonal projections. They are disposed between the first hole injection layers 31 of adjacent light-emitting elements 3 by an isolation layer 21, so as to avoid or reduce charge crosstalk between the first hole injection layers 31 of adjacent light-emitting elements 3.

[0184] In some embodiments, the multilayer functional layer 30 includes a first hole injection layer 31, a first light-emitting layer 32, a first electron injection layer 33, a charge generation layer 34, a second hole injection layer 35, a second light-emitting layer 36, and a second electron injection layer 37, which are sequentially stacked along the direction from the substrate 1 to the pixel definition layer 2.

[0185] The first hole injection layer 31 (HIL), the first light-emitting layer 32 (HBL), and the first electron injection layer 33 are stacked on one side of the charge generation layer 34, and the second hole injection layer 35, the second light-emitting layer 36, and the second electron injection layer 37 are stacked sequentially on the other side of the charge generation layer 34. The light-emitting element 3 has a stacked light-emitting structure, thereby improving the lifespan and brightness of the display panel.

[0186] In some embodiments, a first hole transport layer (HTL) is further disposed between the first hole injection layer 31 and the first light-emitting layer 32, and a first electron transport layer (HTL) is further disposed between the first electron injection layer 33 and the first light-emitting layer 32. A second hole transport layer is further disposed between the second hole injection layer 35 and the second light-emitting layer 36, and a second electron transport layer (HTL) is further disposed between the second electron injection layer 37 and the second light-emitting layer 36.

[0187] In some embodiments, at least one of the second hole injection layer 35, the second hole transport layer, the second electron injection layer 37, and the second electron transport layer is a first common layer. The first common layers in adjacent light-emitting elements 3 are connected to each other, and the orthographic projection of the first common layer on the substrate 1 covers the orthographic projection of the pixel definition layer 2 on the substrate 1.

[0188] When the isolation layer 21 is disposed between the charge generation layers 34 of adjacent light-emitting elements 3, other functional layers 30 located on the charge generation layers 34 away from the substrate 1 can be separated by the isolation layer 21, that is, the first common layer of adjacent light-emitting elements 3 is connected, and the first common layer can be fabricated on the entire surface to simplify the fabrication steps.

[0189] The orthographic projection of the first common layer on the substrate 1 covers the orthographic projection of the pixel definition layer 2 on the substrate 1, and at least a portion of the first common layer of adjacent light-emitting elements 3 is connected across the pixel definition layer 2. The first common layer may be partially located outside the pixel opening 22, or it may be completely distributed outside the pixel opening 22.

[0190] Secondly, embodiments of this application also provide a display panel. Please refer to [the relevant documentation / reference]. Figure 7The display panel includes a substrate 1, a pixel definition layer 2, and a light-emitting functional layer. The pixel definition layer 2 includes multiple isolation layers 21 and a pixel opening 22 penetrating the multiple isolation layers 21. The light-emitting functional layer includes multiple light-emitting elements 3. The light-emitting elements 3 include multiple functional layers 30. The functional layers 30 are stacked sequentially along the direction from the substrate 1 to the pixel definition layer 2. The multiple functional layers 30 include at least one first functional layer located within the pixel opening 22. At least one isolation layer 21 is disposed between the first functional layers of adjacent light-emitting elements 3.

[0191] The multilayer isolation layer 21 includes a second isolation layer 21b and a fourth isolation layer 21d. The fourth isolation layer 21d includes an isolation portion 211 and a second support portion 212. The second support portion 212 is disposed on the side of the isolation portion 211 away from the substrate 1.

[0192] In this embodiment, by setting the pixel definition layer 2 to include multiple isolation layers 21, and setting at least one of the multiple isolation layers 21 to be disposed between the functional layers 30 of adjacent light-emitting elements 3 located within the pixel opening 22, the isolation layers 21 can reduce or avoid crosstalk between the functional layers 30 of adjacent light-emitting elements 3, improve the stability of light emission of light-emitting elements 3, and improve the display effect of the display panel.

[0193] In some embodiments, the orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the isolation portion 211 onto the substrate 1.

[0194] Compared to the second isolation layer 21b, the fourth isolation layer 21d has a larger projected area, allowing it to shield the side of the second isolation layer 21b that faces away from the substrate 1. (See also...) Figure 8 During the process of creating the pixel opening 22 by dry etching the pixel definition layer 2, the fourth isolation layer 21d can be reused as a photomask to block one side of the pixel definition layer 2, thereby eliminating the need to coat the pixel definition layer 2 with photoresist. During the process of fabricating the light-emitting element 3 by vapor deposition, the second support portion 212 can be disposed between the pixel definition layer 2 and the photomask to keep the distance between the pixel definition layer 2 and the photomask fixed.

[0195] In some embodiments, the orthographic projection of the second support portion 212 onto the substrate 1 is located within the orthographic projection of the second isolation layer 21b onto the substrate 1.

[0196] Compared to the second isolation layer 21b, the second support portion 212 has a smaller projected area, thereby preventing the second support portion 212 from blocking the material used to prepare the light-emitting element 3 from entering the pixel opening 22 and preventing the second support portion 212 from blocking the light-emitting element 3 from emitting light.

[0197] In some embodiments, the surface of the isolation portion 211 near the substrate 1 has a larger projected area on the substrate 1 than the surface of the isolation portion 211 away from the substrate 1.

[0198] The surface of the isolation portion 211 near the substrate 1 is smaller than the surface of the isolation portion 211 away from the substrate 1, which facilitates the entry of the material used to fabricate the light-emitting element 3 into the pixel opening 22. The size of the isolation portion 211 can be formed to gradually decrease along the direction away from the substrate 1.

[0199] Please see Figure 8 In some embodiments, the multilayer isolation layer 21 includes a first isolation layer 21a, which is located between a second isolation layer 21b and a fourth isolation layer 21d. The orthographic projection of the fourth isolation layer 21d onto the substrate 1 is located within the orthographic projection of the first isolation layer 21a onto the substrate 1.

[0200] The fourth isolation layer 21d can be reused as a photomask to block one side of the first isolation layer 21a. The orthographic projection of the fourth isolation layer 21d onto the substrate 1 is located within the orthographic projection position of the first isolation layer 21a onto the substrate 1 obtained by photolithography.

[0201] In some embodiments, under wet etching conditions, the etching rate of the fourth isolation layer 21d is less than the etching rate of the second isolation layer 21b.

[0202] The etching rates of the fourth isolation layer 21d and the third isolation layer 21c can be set to be lower than the etching rate of the second isolation layer 21b. Thus, the second isolation layer 21b can be wet-etched to obtain a projected area of ​​the second isolation layer 21b that is smaller than the projected areas of the fourth isolation layer 21d and the third isolation layer 21c.

[0203] In some embodiments, the fourth isolation layer 21d is an organic adhesive layer.

[0204] By setting the fourth isolation layer 21d as an organic adhesive layer, the fourth isolation layer 21d and the second isolation layer 21b can be differentiated, thus expanding the range of selectable etching parameters for wet etching preparation of the second isolation layer 21b. Since the fourth isolation layer 21d is an organic adhesive layer, a patterned fourth isolation layer 21d can be prepared based on a crosslinking reaction. For example, an organic adhesive with a crosslinked substance is coated on one side of the pixel definition layer 2. The crosslinked substance can be a crosslinking molecule or a crosslinking group. Light is irradiated onto a first region of the organic adhesive, causing the crosslinked substance in the first region to undergo a crosslinking reaction, and the organic adhesive in the first region to solidify. The organic adhesive is then cleaned to remove uncured organic adhesive in a second region, which corresponds to the gap between the second support portion 212, thus obtaining the fourth isolation layer 21d.

[0205] Alternatively, a half-tone mask (HTM) can be used to pattern the organic adhesive layer 300 through exposure and development, forming the required isolation portion 211 and second support portion 212. For example, the fully transparent area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the gap between the second support portion 212, the semi-transparent area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the isolation portion 211, and the light-blocking area of ​​the half-tone mask corresponds to the area in the organic adhesive that corresponds to the second support portion 212. Thus, the isolation portion 211 and the second support portion 212 can be prepared simultaneously using a single mask.

[0206] In some embodiments, the isolation portion 211 surrounds an opening that communicates with the pixel opening 22.

[0207] Unlike the multiple spaced second support portions 212, the isolation portion 211 can be a mesh structure, and the opening formed by the isolation portion 211 is the mesh of the mesh structure. The mesh structure isolation portion 211 can effectively block one side of the first isolation layer 21a or the second isolation layer 21b as a photomask. The pixel opening 22 formed by the first isolation layer 21a, the second isolation layer 21b, and the third isolation layer 21c is connected to the opening, so that the material used to prepare the light-emitting element 3 can be stacked and disposed on one side of the first electrode 41 through the opening.

[0208] Thirdly, this application also provides a method for manufacturing a display panel; please refer to [link to relevant documentation]. Figure 10 The display panel manufacturing method includes the following steps:

[0209] S110, a substrate 1 and a first electrode layer 4 disposed on one side of the substrate 1 are provided, the first electrode layer 4 including a plurality of spaced first electrodes 41;

[0210] S200, a pixel definition layer 2 is formed on one side of the substrate 1. The pixel definition layer 2 includes multiple isolation layers 21 and a pixel opening 22 that penetrates the multiple isolation layers 21. The pixel opening 22 exposes the first electrode 41.

[0211] S300, a light-emitting functional layer is formed on one side of the substrate 1. The light-emitting functional layer includes a plurality of light-emitting elements 3. The light-emitting elements 3 include multiple functional layers 30. The light-emitting elements 3 are located on the side of the first electrode 41 away from the substrate 1. The functional layers 30 are stacked sequentially along the direction from the substrate 1 to the pixel definition layer 2. At least one functional layer 30 is located in the pixel opening 22. At least one isolation layer 21 is disposed between the functional layers 30 of adjacent light-emitting elements 3 located in the pixel opening 22.

[0212] In S100, substrate 1 can be formed through processes such as coating, curing, and film formation. Substrate 1 can be a rigid substrate, such as a glass substrate; or it can be a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, or polyethylene naphthalate. Substrate 1 is mainly used to support devices mounted on it.

[0213] In S100, a conductive material for forming the first electrode layer 4 can be pre-formed on the substrate 1, and the conductive material can be patterned to obtain a plurality of spaced first electrodes 41.

[0214] In S200, a multilayer inorganic material layer for forming the isolation layer 21 can be prepared stepwise using a CVD (Chemical Vapor Deposition) process. The inorganic material layer can be a layer structure using inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride. At least one of dry or wet etching processes can be used to etch away the area of ​​the isolation layer 21 corresponding to the first electrode 41, etching the inorganic material layer to form a pixel opening 22, thus exposing the first electrode 41 through the pixel opening 22. In S200, the electron injection layer, electron transport layer, hole blocking layer, light-emitting material layer, electron blocking layer, hole transport layer, and first hole injection layer in the multilayer functional layers 30 can all be formed by a vapor deposition process. At least some of the functional layers 30 are separated by the isolation layer 21, thereby preventing charge leakage between these functional layers 30.

[0215] Since the method for preparing the display panel provided in the third aspect of this application can prepare the display panel provided in the first aspect or the second aspect of the application, the method for preparing the display panel provided in the third aspect of this application has the beneficial effects of the display panel of any of the first or second aspects of the application, which will not be repeated here.

[0216] In some embodiments, S200 includes:

[0217] S210, a multilayer isolation layer 21 is provided on one side of the substrate 1. The multilayer isolation layer 21 includes a first isolation layer 21a, a second isolation layer 21b and a third isolation layer 21c. The first isolation layer 21a is located on the side of the second isolation layer 21b away from the substrate 1, and the third isolation layer 21c is located on the side of the second isolation layer 21b close to the substrate 1.

[0218] S220, dry etching is performed on the region of the multilayer isolation layer 21 corresponding to the first electrode 41 until the third isolation layer 21c is exposed from the etched pixel opening 22.

[0219] S230, perform wet etching on the second isolation layer 21b to obtain that the orthographic projection of the second isolation layer 21b on the substrate 1 is located within the orthographic projection of the first isolation layer 21a on the substrate 1;

[0220] S241, dry etching is performed on the third isolation layer 21c until the first electrode 41 is exposed from the pixel opening 22.

[0221] The multi-layer isolation layer 21 may also include a fourth isolation layer 21, a fifth isolation layer 21, a sixth isolation layer 21, etc., and the specific order of the fourth isolation layer 21, the fifth isolation layer 21, the sixth isolation layer 21, etc. in the multi-layer isolation layer 21 is not limited.

[0222] In S220, dry etching is used to etch from the surface of the multilayer isolation layer 21 away from the substrate 1 to obtain a pixel opening 22 that penetrates the isolation layer 21 until the third isolation layer 21c is exposed from the etched pixel opening 22, that is, the third isolation layer 21c covers the side of the first electrode 41 away from the substrate 1.

[0223] In step S230, the second isolation layer 21b is wet-etched. The etching solution used in the wet etching process has little or no corrosive effect on the first isolation layer 21a and the third isolation layer 21c in the multilayer isolation layers 21. This causes the second isolation layer 21b to be recessed away from the central axis of the pixel opening 22 during step S230. The third isolation layer 21c covers the side of the first electrode 41 away from the substrate 1, thus protecting the first electrode 41 from the wet etching process and preventing etching damage to the first electrode 41. Optionally, at least one of hydrofluoric acid and its derivatives is used to wet-etch the second isolation layer 21b.

[0224] The projection of the second isolation layer 21b onto the substrate 1 is located within the projection of the first isolation layer 21a onto the substrate 1, so that the other isolation layers 21 located on both sides of the second isolation layer 21b have a blocking effect on the subsequently fabricated functional layer 30, thereby avoiding or reducing the peeling of the light-emitting element 3 and the pixel definition layer 2.

[0225] In step S241, dry etching of the third isolation layer 21c begins from the side of the third isolation layer 21c facing away from the substrate 1. Since the orthographic projection of the second isolation layer 21b onto the substrate 1 lies within the orthographic projection of the first isolation layer 21a onto the substrate 1, the layer structure on the side of the second isolation layer 21b facing away from the substrate 1 can shield the second isolation layer 21b during the dry etching process, preventing the second isolation layer 21b from being dry-etched. Through step S241, the first electrode 41 is exposed from the pixel opening 22, and the functional layer 30 can be directly fabricated on the exposed first electrode 41.

[0226] In some embodiments, S220 includes:

[0227] S221, a patterned photoresist is provided on the side of the first isolation layer 21a away from the substrate 1, and the photoresist has a first opening corresponding to the first electrode 41;

[0228] S222, using photoresist as a photomask, dry etching is performed on the area of ​​the multilayer isolation layer 21 corresponding to the first electrode 41 until the third isolation layer 21c is exposed from the etched pixel opening 22.

[0229] In S221, patterned photoresist can be set by means of exposure and development, and the orthographic projection of the first opening on the substrate 1 and the orthographic projection of the first electrode 41 on the substrate 1 at least partially overlap.

[0230] Please see Figure 11 , among which Figure 11 As shown in (a), photoresist 100 is disposed on the side of the first isolation layer 21a facing away from the substrate 1; Figure 11 As shown in (b), the photoresist 100 is patterned to obtain the first opening; as... Figure 11 As shown in (c), in S222, using photoresist 100 as a photomask, dry etching is performed on the region of the multilayer isolation layer 21 corresponding to the first electrode 41, so that the area of ​​the isolation layer 21 that is blocked by photoresist 100 is retained, and the area exposed at the first opening is etched. Etching begins from the surface of the multilayer isolation layer 21 away from the substrate 1, layer by layer, until the third isolation layer 21c is exposed from the etched pixel opening 22. Figure 11 As shown in (d), S230 is executed to perform wet etching on the second isolation layer 21b, so that the orthographic projection of the second isolation layer 21b on the substrate 1 is located within the orthographic projection of the first isolation layer 21a on the substrate 1.

[0231] Please see Figure 12 In some embodiments, S300 includes:

[0232] S320, remove photoresist;

[0233] S310, an organic adhesive layer 300 is prepared on the side of the first isolation layer 21a away from the substrate 1, and the organic adhesive layer 300 is patterned to obtain a support layer 6 having multiple first support portions 61, wherein the orthographic projection of the first support portion 61 on the substrate 1 overlaps with the orthographic projection of the pixel definition layer 2 on the substrate 1.

[0234] S320 forms a light-emitting functional layer within the pixel opening 22.

[0235] In S320, the pixel openings 22 that penetrate each isolation layer 21 have been prepared, so the photoresist covering the pixel definition layer 2 is removed.

[0236] In S310, the prepared organic adhesive layer 300 may include cross-linking molecules or cross-linking groups. Irradiation of a first region in the organic adhesive layer 300 causes a cross-linking reaction in the cross-linking molecules or cross-linking groups in the first region, resulting in curing of the first region. The uncured organic adhesive layer 300 is then removed to obtain the support layer 6. Alternatively, a half-tone mask (HTM) can be used to pattern the organic adhesive layer 300 through exposure and development to form the desired three-dimensional shape.

[0237] In S320, when the light-emitting functional layer is prepared by vapor deposition, the support layer 6 can be placed between the mask and the pixel definition layer 2 to keep the spacing of each vapor deposition fixed and improve the consistency of the display panel.

[0238] Please see Figure 12 Among them, such as Figure 12 As shown in (a), remove photoresist 100; as... Figure 12 As shown in (b), an organic adhesive layer 300 is prepared on the side of the first isolation layer 21a away from the substrate 1, and the organic adhesive layer 300 is patterned to obtain a support layer 6 having a first support portion 61.

[0239] In some embodiments, the orthographic projection of the support layer 6 onto the substrate 1 is located within the orthographic projection of the second isolation layer 21b onto the substrate 1.

[0240] The projected area of ​​the support layer 6 on the substrate 1 is smaller than that of the second isolation layer 21b on the substrate 1, thereby avoiding the support layer 6 from blocking the vapor deposition material when preparing the light-emitting functional layer, which is beneficial to increasing the light emission angle of the light-emitting element 3.

[0241] In some embodiments, the first isolation layer 21a, the second isolation layer 21b, and the third isolation layer 21c are all inorganic isolation layers 21.

[0242] The high density of the inorganic isolation layer 21 is beneficial to improving the insulation effect of the isolation layer 21 on the adjacent functional layers 30 that it separates.

[0243] In some embodiments, when wet etching is performed on the second isolation layer 21b, the etching rates of the first isolation layer 21a and the third isolation layer 21c are both less than the etching rate of the second isolation layer 21b.

[0244] Thus, in S230, the first isolation layer 21a and the third isolation layer 21c can be retained, and the second isolation layer 21b can be etched to obtain an isolation layer 21 with a stepped structure.

[0245] Please see Figure 13 and Figure 14 In some embodiments, S200 includes:

[0246] S250, a multilayer isolation layer 21 is provided on one side of the substrate 1. The multilayer isolation layer 21 also includes a second isolation layer 21b and a third isolation layer 21c. The third isolation layer 21c is located on the side of the second isolation layer 21b close to the substrate 1.

[0247] S260, an organic adhesive layer 300 is prepared on the side of the multilayer isolation layer 21 away from the substrate 1, and the organic adhesive layer 300 is patterned to obtain a fourth isolation layer 21d. The fourth isolation layer 21d includes an isolation portion 211 and a second support portion 212, and the second support portion 212 is disposed on the side of the isolation portion 211 away from the substrate 1.

[0248] S270, using the fourth isolation layer 21d as a photomask, dry etching is performed on the area of ​​the first electrode 41 corresponding to the multilayer isolation layer 21 until the third isolation layer 21c is exposed from the pixel opening 22 obtained by etching.

[0249] S280, wet etching is performed on the second isolation layer 21b to obtain that the orthographic projection of the second isolation layer 21b on the substrate 1 is located within the orthographic projection of the fourth isolation layer 21d on the substrate 1.

[0250] S290, using the fourth isolation layer 21d as a photomask, dry etching is performed on the third isolation layer 21c until the first electrode 41 is exposed.

[0251] In some embodiments, S270 includes:

[0252] S271, an organic adhesive layer 300 is prepared on the side of the multilayer isolation layer 21 facing away from the substrate;

[0253] S272, a semi-transparent mask is used to pattern the organic adhesive layer 300 to obtain the fourth isolation layer 21d.

[0254] Please see Figure 13 In step S250, the multilayer isolation layer 21 can be prepared with reference to step S210. Unlike step S210, step S250 prepares at least a second isolation layer 21b and a third isolation layer 21c. Figure 13 In the illustrated embodiment, a first isolation layer 21a is also provided on the side of the second isolation layer 21b facing away from the substrate 1. A semi-shading mask 200 is used to perform patterned exposure and development on the organic adhesive layer 300. Please refer to the following reference. Figure 14 ,like Figure 14As shown in (a), an isolation portion 211 and a second support portion 212 are formed. The fully transparent area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive that corresponds to the pixel opening 22, the semi-transparent area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive that corresponds to the isolation portion 211, and the light-blocking area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive that corresponds to the second support portion 212. Thus, the isolation portion 211 and the second support portion 212 are prepared simultaneously using a single mask.

[0255] Unlike S310, in this embodiment, a second support portion 212 with a supporting spacer function is first prepared, and then the isolation layer 21 is etched to open a complete pixel opening 22. For example... Figure 14 As shown in (b), the fourth isolation layer 21d prepared earlier can be used as a photomask for subsequent dry etching, thereby eliminating the steps of setting and removing photoresist.

[0256] S280 can be prepared by referring to S230, as shown in the preparation. Figure 14 (b) Structure; S290 can be prepared by referring to S241 to obtain the following... Figure 14 (c) The structure will not be elaborated here.

[0257] In some embodiments, the second isolation layer 21b and the third isolation layer 21c are inorganic isolation layers 21.

[0258] The high density of the inorganic isolation layer 21 is beneficial to improving the insulation effect of the isolation layer 21 on the adjacent functional layers 30 that it separates.

[0259] In some embodiments, when the second isolation layer 21b is wet etched, the etching rate of the third isolation layer 21c is less than the etching rate of the second isolation layer 21b.

[0260] Thus, in S230, the third isolation layer 21c can be retained, and the second isolation layer 21b can be etched to obtain an isolation layer 21 with a stepped structure.

[0261] In some embodiments, the orthographic projection of the second isolation layer 21b onto the substrate 1 is located within the orthographic projection of the isolation portion 211 onto the substrate 1.

[0262] Since the isolation portion 211 is used to prepare the second isolation layer 21b for the photomask, and then the second isolation layer 21b is wet etched, the orthogonal projection of the second isolation layer 21b on the substrate 1 is reduced, and the orthogonal projection area of ​​the isolation portion 211 on the substrate 1 is greater than the orthogonal projection area of ​​the second isolation layer 21b on the substrate 1.

[0263] Please see Figure 15In another embodiment, the second isolation layer 21b and the third isolation layer 21c are prepared via S250. The organic adhesive layer 300 is patterned and developed using a semi-shading mask 200 to obtain the desired result. Figure 15 The structure shown in (a) forms an isolation portion 211 and a second support portion 212. The fully transparent area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive corresponding to the pixel opening 22, the semi-transparent area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive corresponding to the isolation portion 211, and the light-shielding area of ​​the semi-shading mask 200 corresponds to the area in the organic adhesive corresponding to the second support portion 212. Thus, using a single mask, the isolation portion 211 and the second support portion 212 are simultaneously fabricated. In S280, the second isolation layer 21b is wet-etched to obtain the structure shown in (a). Figure 15 The structure shown in (b) is obtained by dry etching the third isolation layer 21c using the previously prepared fourth isolation layer 21d as a photomask for subsequent dry etching in S290, resulting in the structure shown in (b). Figure 15 (c) structure, thus eliminating the steps of setting and removing photoresist.

[0264] The embodiments of the third aspect of this application also provide a display device, including a display panel of any of the first aspect embodiments described above, or a display panel prepared in any of the second aspect embodiments described above, or a display panel prepared in any of the third aspect embodiments described above. Since the display device provided by the third aspect embodiments of this application includes the display panel of any of the first, second, and third aspects described above, the display device provided by the third aspect embodiments of this application has the beneficial effects of the display panel of any of the first, second, or third aspects described above, which will not be elaborated further here.

[0265] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0266] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, include: substrate; A pixel definition layer includes multiple isolation layers and pixel openings penetrating the multiple isolation layers; The light-emitting functional layer includes a plurality of light-emitting elements, each light-emitting element comprising a multilayer functional layer, the functional layers being stacked sequentially along the direction from the substrate to the pixel definition layer, the multilayer functional layer including at least one first functional layer located within the pixel opening, and at least one isolation layer disposed between the first functional layers of adjacent light-emitting elements.

2. The display panel according to claim 1, characterized in that, The multilayer isolation layer includes a first isolation layer and a second isolation layer. The first isolation layer is located on the side of the second isolation layer opposite to the substrate, and the orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate. Preferably, the surface of the first isolation layer that defines the pixel opening protrudes towards the central axis of the pixel opening relative to the surface of the second isolation layer that defines the pixel opening; Preferably, the surface of the first isolation layer defining the pixel opening, the surface of the first isolation layer adjacent to the substrate, and the surface of the second isolation layer defining the pixel opening form a first step structure; Preferably, the first isolation layer is an inorganic isolation layer; Preferably, the second isolation layer is an inorganic isolation layer; Preferably, under wet etching conditions, the etching rate of the first isolation layer is less than the etching rate of the second isolation layer; Preferably, the first isolation layer is a silicon nitride layer, and the second isolation layer is a silicon oxide layer.

3. The display panel according to claim 2, characterized in that, The display panel includes a support layer, the support layer includes a plurality of first support portions, the first support portions are located on the side of the pixel definition layer opposite to the substrate, and the orthographic projection of the first support portion on the substrate overlaps with the orthographic projection of the pixel definition layer on the substrate. Preferably, the orthographic projection of the support layer onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate.

4. The display panel according to claim 1 or 2, characterized in that, The multilayer isolation layer includes a second isolation layer and a third isolation layer. The third isolation layer is located on the side of the second isolation layer that is close to the substrate. The orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate. Preferably, in the second isolation layer and the third isolation layer defining the same surface of the pixel opening, the surface of the third isolation layer defining the pixel opening protrudes towards the central axis of the pixel opening relative to the surface of the second isolation layer defining the pixel opening; Preferably, the surface of the third isolation layer defining the pixel opening, the surface of the third isolation layer facing away from the substrate, and the surface of the second isolation layer defining the pixel opening form a second step structure; Preferably, the third isolation layer is an inorganic isolation layer; Preferably, under wet etching conditions, the etching rate of the third isolation layer is less than the etching rate of the second isolation layer; Preferably, the third isolation layer is a silicon nitride layer; Preferably, the multilayer isolation layer further includes a first isolation layer, which is located on the side of the second isolation layer opposite to the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.

5. The display panel according to claim 4, characterized in that, The display panel also includes: The first electrode layer includes a plurality of spaced-apart first electrodes, which are disposed on the side of the light-emitting element close to the substrate and in contact with the light-emitting element, and the third isolation layer is disposed between adjacent first electrodes; Preferably, the third insulating layer is disposed on the substrate in a manner that surrounds the first electrode ... Preferably, the first electrode includes a first connection surface and a second connection surface disposed opposite to each other along the direction from the substrate to the pixel definition layer, and a side surface connecting the first connection surface and the second connection surface, wherein the third isolation layer covers the side surface; Preferably, the second connecting surface is located on the side of the first connecting surface away from the substrate, and a portion of the third isolation layer overlaps with a portion of the second connecting surface.

6. The display panel according to claim 1, characterized in that, The multilayer isolation layer includes a second isolation layer and a fourth isolation layer. The fourth isolation layer includes an isolation portion and a second support portion. The second support portion is disposed on the side of the isolation portion away from the substrate. The orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the isolation portion on the substrate. Preferably, the orthographic projection of the second support portion onto the substrate is located within the orthographic projection of the second insulating layer onto the substrate; Preferably, the surface area of ​​the isolation portion near the substrate that is projected onto the substrate is larger than the surface area of ​​the isolation portion away from the substrate that is projected onto the substrate. Preferably, the multilayer isolation layer includes a first isolation layer, which is located between the second isolation layer and the fourth isolation layer, and the orthographic projection of the fourth isolation layer on the substrate is located within the orthographic projection of the first isolation layer on the substrate; Preferably, under wet etching conditions, the etching rate of the fourth isolation layer is less than the etching rate of the second isolation layer; Preferably, the fourth isolation layer is an organic adhesive layer; Preferably, the isolation portion forms an opening, and the opening communicates with the pixel opening.

7. The display panel according to claim 1, characterized in that, The multilayer functional layer includes a first light-emitting layer, a charge-generating layer, and a second light-emitting layer, wherein the first light-emitting layer, the charge-generating layer, and the second light-emitting layer are stacked sequentially along the substrate to the pixel definition layer; The isolation layer is disposed between the charge generation layers of adjacent light-emitting elements.

8. The display panel according to claim 1 or 7, characterized in that, The multilayer functional layer includes a first hole injection layer, a first light-emitting layer, a charge generation layer, and a second light-emitting layer, wherein the first hole injection layer, the first light-emitting layer, the charge generation layer, and the second light-emitting layer are stacked sequentially along the substrate to the pixel definition layer; The isolation layer is disposed between the first hole injection layers adjacent to the light-emitting elements.

9. The display panel according to claim 1, characterized in that, The multilayer functional layer includes a first hole injection layer, a first hole transport layer, a first light emission layer, a first electron transport layer, a first electron injection layer, a charge generation layer, a second hole injection layer, a second hole transport layer, a second light emission layer, a second electron transport layer, and a second electron injection layer, which are sequentially stacked along the direction from the substrate to the pixel definition layer. Preferably, at least one of the second hole injection layer, the second hole transport layer, the second electron injection layer, and the second electron transport layer is a first common layer, the first common layers in adjacent light-emitting elements are connected, and the orthographic projection of the first common layer on the substrate covers the orthographic projection of the pixel definition layer on the substrate.

10. A display panel, characterized in that, include: substrate; A pixel definition layer includes multiple isolation layers and pixel openings penetrating the multiple isolation layers. The multiple isolation layers include a second isolation layer and a fourth isolation layer. The fourth isolation layer includes an isolation portion and a second support portion. The second support portion is disposed on the side of the isolation portion away from the substrate. The orthographic projection of the second isolation layer on the substrate is located within the orthographic projection of the isolation portion on the substrate. The light-emitting functional layer includes a plurality of light-emitting elements, each light-emitting element comprising a multilayer functional layer, the functional layers being stacked sequentially along the direction from the substrate to the pixel definition layer, the multilayer functional layer including at least one first functional layer located within the pixel opening, and at least one isolation layer disposed between the first functional layers of adjacent light-emitting elements.

11. The display panel according to claim 10, characterized in that, The second support portion is projected onto the substrate in the same direction as the second isolation layer in the same direction as the substrate. Preferably, the surface area of ​​the isolation portion near the substrate that is projected onto the substrate is larger than the surface area of ​​the isolation portion away from the substrate that is projected onto the substrate. Preferably, under wet etching conditions, the etching rate of the fourth isolation layer is less than the etching rate of the second isolation layer; Preferably, the fourth isolation layer is an organic adhesive layer; Preferably, the isolation portion forms an opening, and the opening communicates with the pixel opening.

12. A method for manufacturing a display panel, characterized in that, The method includes: A substrate and a first electrode layer disposed on one side of the substrate are provided, the first electrode layer comprising a plurality of spaced first electrodes; A pixel definition layer is formed on one side of the substrate. The pixel definition layer includes multiple isolation layers and a pixel opening that penetrates the multiple isolation layers, and the pixel opening exposes the first electrode. A light-emitting functional layer is formed on one side of the substrate. The light-emitting functional layer includes a plurality of light-emitting elements. The light-emitting elements are located on the side of the first electrode away from the substrate. The light-emitting elements include multiple functional layers. The functional layers are stacked sequentially along the direction from the substrate to the pixel definition layer. At least one of the functional layers is located within the pixel opening. At least one isolation layer is disposed between the functional layers of adjacent light-emitting elements located within the pixel opening.

13. The method for manufacturing a display panel according to claim 12, characterized in that, The process of forming a pixel definition layer on one side of the substrate includes: A multilayer isolation layer is disposed on one side of the substrate. The multilayer isolation layer includes a first isolation layer, a second isolation layer and a third isolation layer. The first isolation layer is located on the side of the second isolation layer away from the substrate, and the third isolation layer is located on the side of the second isolation layer close to the substrate. Dry etching is performed on the region of the multilayer isolation layer corresponding to the first electrode until the third isolation layer is exposed from the etched pixel opening; The second isolation layer is wet etched to obtain a projection of the second isolation layer onto the substrate that is located within the projection of the first isolation layer onto the substrate. The third isolation layer is dry etched until the first electrode is exposed from the pixel opening; Preferably, the wet etching of the second isolation layer includes: The second isolation layer is wet-etched using at least one of hydrofluoric acid and its derivatives; Preferably, the dry etching of the region of the multilayer isolation layer corresponding to the first electrode includes: A patterned photoresist is provided on the side of the first isolation layer away from the substrate, and the photoresist has a first opening corresponding to the first electrode; Using the photoresist as a photomask, dry etching is performed on the region of the multilayer isolation layer corresponding to the first electrode until the third isolation layer is exposed from the etched pixel opening; Preferably, the step of forming a light-emitting functional layer on one side of the substrate includes... Remove the photoresist; An organic adhesive layer is prepared on the side of the first isolation layer away from the substrate, and the organic adhesive layer is patterned to obtain a support layer with multiple first support portions, wherein the orthographic projection of the first support portion on the substrate overlaps with the orthographic projection of the pixel definition layer on the substrate. The light-emitting functional layer is formed within the pixel opening; Preferably, the orthographic projection of the support layer onto the substrate is located within the orthographic projection of the second isolation layer onto the substrate; Preferably, the first isolation layer, the second isolation layer, and the third isolation layer are all inorganic isolation layers; Preferably, when the second isolation layer is wet etched, the etching rates of the first isolation layer and the third isolation layer are both less than the etching rate of the second isolation layer.

14. The method for manufacturing a display panel according to claim 12, characterized in that, The process of forming a pixel definition layer on one side of the substrate includes: A multilayer isolation layer is disposed on one side of the substrate, the multilayer isolation layer further comprising a second isolation layer and a third isolation layer, the third isolation layer being located on the side of the second isolation layer closer to the substrate; An organic adhesive layer is prepared on the side of the multilayer isolation layer away from the substrate, and the organic adhesive layer is patterned to obtain a fourth isolation layer. The fourth isolation layer includes an isolation portion and a second support portion, and the second support portion is disposed on the side of the isolation portion away from the substrate. Using the fourth isolation layer as a photomask, dry etching is performed on the region of the multilayer isolation layer corresponding to the first electrode until the third isolation layer is exposed from the etched pixel opening; The second isolation layer is wet etched to obtain a second isolation layer whose orthogonal projection on the substrate is located within the orthogonal projection of the fourth isolation layer on the substrate; Using the fourth isolation layer as a photomask, the third isolation layer is dry etched until the first electrode is exposed; Preferably, the step of preparing an organic adhesive layer on the side of the multilayer isolation layer opposite to the substrate, and patterning the organic adhesive layer to obtain the fourth isolation layer includes: An organic adhesive layer is prepared on the side of the multilayer isolation layer opposite to the substrate; The organic adhesive layer is patterned using a semi-transparent mask to obtain the fourth isolation layer; Preferably, the second isolation layer and the third isolation layer are inorganic isolation layers; Preferably, when the second isolation layer is wet etched, the etching rate of the third isolation layer is less than the etching rate of the second isolation layer; Preferably, the orthographic projection of the second isolation layer onto the substrate is located within the orthographic projection of the isolation portion onto the substrate.

15. A display device, characterized in that, The display panel includes any one of the display panels according to claims 1-11, or a display panel prepared by the method of any one of claims 12-14.

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