Display substrate, manufacturing method thereof and display device

Abstract

The invention provides a display substrate, a manufacturing method thereof and a display device, and the display substrate comprises a substrate; the pixel defining layer is located on the substrate, and a plurality of first openings used for limiting pixel units are formed in the pixel defining layer; the pixel defining layer is provided with an isolation groove in the thickness direction, and the isolation groove is arranged around each first opening; the sacrificial layer covers the side wall of the isolation groove, and one side, deviating from the side wall, of the sacrificial layer is provided with at least one groove; the orthographic projection of the sacrificial layer on the substrate completely falls into the area range of the orthographic projection of the isolation groove on the substrate; the light-emitting functional layer covers the pixel defining layer; the light-emitting functional layers are arranged in the corresponding areas of the groove bottoms of the grooves in a disconnected mode and are continuously arranged in the other areas except the corresponding areas of the groove bottoms of the grooves.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device. BACKGROUND

[0002] With the continuous improvement of consumer demand for display product image quality, the organic light emitting diode (OLED) display technology has become one of the mainstream directions in the field of medium and large size display due to its high pixel density (PPI), high contrast, low power consumption, wide color gamut and other advantages.

[0003] At present, in order to further improve the brightness of OLED screen and reduce power consumption, high-efficiency single-layer and stacked OLED devices are generally developed in the industry, but such devices face serious pixel-to-pixel crosstalk and lateral leakage problems in the application process. In this way, when the screen displays a certain color, the lateral current in the light-emitting common layer will flow to the adjacent pixels of other colors, causing the adjacent pixels to be mislit, ultimately causing color display distortion and seriously affecting the user's viewing experience.

[0004] How to effectively avoid pixel-to-pixel crosstalk and lateral leakage has become a technical problem that needs to be solved urgently. SUMMARY

[0005] The present application provides a display substrate, a manufacturing method thereof and a display device, which are used to avoid pixel-to-pixel crosstalk and lateral leakage problems and improve display effect.

[0006] In a first aspect, an embodiment of the present application provides a display substrate, comprising: a substrate; a pixel definition layer located on the substrate, and the pixel definition layer is provided with a plurality of first openings for defining pixel units; the pixel definition layer is provided with an isolation groove in the thickness direction, and the isolation groove is arranged around each first opening; a sacrifice layer covering the side wall of the isolation groove, and the sacrifice layer is provided with at least one groove on the side away from the side wall; the orthographic projection of the sacrifice layer on the substrate completely falls within the area range of the orthographic projection of the isolation groove on the substrate; a light-emitting functional layer covering the pixel definition layer; the light-emitting functional layer is discontinuously arranged in the corresponding area of each groove bottom, and continuously arranged in other areas except the corresponding area of each groove bottom.

[0007] In a possible implementation manner, the sacrifice layer is discontinuously arranged at the groove bottom of the isolation groove.

[0008] In a possible implementation, the thickness of the light-emitting functional layer at the portion in contact with each groove is less than the thickness of the light-emitting functional layer at other portions.

[0009] In a possible implementation, the maximum extension length of the sacrificial layer on the same side wall of the isolation groove in a direction perpendicular to the center lines of the two adjacent first openings is 3.5 μm to 5.5 μm, and the minimum extension length is 0.5 μm to 1 μm.

[0010] In a possible implementation, the maximum extension length of each groove in a direction perpendicular to the center lines of the two adjacent first openings is equal, and is 1.5 μm to 3 μm.

[0011] In a possible implementation, the at least one groove is one, and the extension length of the groove in a direction parallel to the center lines of the two adjacent first openings is 1.5 μm to 3 μm.

[0012] In a possible implementation, the at least one groove is three, and the extension length of each groove in a direction parallel to the center lines of the two adjacent first openings is equal, and is 0.5 μm to 1.5 μm.

[0013] In a possible implementation, the extension length of the isolation groove in a direction perpendicular to the center lines of the two adjacent first openings is greater than the extension length of the isolation groove in a direction parallel to the center lines of the two adjacent first openings.

[0014] In a possible implementation, the extension length of the isolation groove in a direction perpendicular to the center lines of the two adjacent first openings is 4 μm to 8 μm, and the extension length of the isolation groove in a direction parallel to the center lines of the two adjacent first openings is 2 μm to 4 μm.

[0015] In a possible implementation, the cross-sectional shape of each groove in a direction parallel to the center lines of the two adjacent first openings is at least one of a triangle, a semicircle, and a rectangle.

[0016] In a second aspect, an embodiment of the present application further provides a display device, including: The display substrate as any one of the above.

[0017] In a third aspect, an embodiment of the present application further provides a manufacturing method of a display substrate, including: forming a whole-layer pixel definition layer on a substrate; Patterning the pixel defining layer to form a plurality of first openings for defining pixel units; An isolation groove is formed along the thickness direction of the pixel defining layer by a patterning process; the isolation groove is arranged around each of the first openings; A whole layer of a sacrificial layer is deposited on the side of the pixel defining layer away from the substrate; The sacrificial layer is subjected to a patterning process to retain a portion covering the sidewall of the isolation groove; At least one groove is formed on the side of the sacrificial layer away from the sidewall by an etching process; the orthographic projection of the sacrificial layer on the substrate completely falls within the area range of the orthographic projection of the isolation groove on the substrate; A light-emitting functional layer is formed covering the pixel defining layer; the light-emitting functional layer is discontinuously arranged in the corresponding area of each groove bottom and continuously arranged in other areas except the corresponding area of each groove bottom.

[0018] The present application has the following advantages: The display substrate, the manufacturing method thereof and the display device provided by the present application, wherein the display substrate comprises a substrate, a pixel defining layer, a sacrificial layer and a light-emitting functional layer; the pixel defining layer is located on the substrate and is provided with a plurality of first openings for defining pixel units; the pixel defining layer is provided with an isolation groove along the thickness direction, and the isolation groove is arranged around each of the first openings; thus, the isolation groove can block the light-emitting functional layer to some extent; in addition, the sacrificial layer covers the sidewall of the isolation groove, and at least one groove is formed on the side of the sacrificial layer away from the sidewall; the orthographic projection of the sacrificial layer on the substrate completely falls within the area range of the orthographic projection of the isolation groove on the substrate; the light-emitting functional layer covers the pixel defining layer; the light-emitting functional layer is discontinuously arranged in the corresponding area of each groove bottom and continuously arranged in other areas except the corresponding area of each groove bottom. In this way, the isolation groove formed on the pixel defining layer and the at least one groove formed on the sidewall of the isolation groove covered by the sacrificial layer effectively block the current flow path in the light-emitting functional layer, thereby avoiding the crosstalk and lateral leakage problems between the pixel units and improving the display effect. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of one of the display panels in the related art; Figure 2 It is a top view structural schematic diagram of one of the display substrates provided by the present application; Figure 3 It is a structural schematic diagram along the direction indicated by MM in the figure; Figure 2 Figure 4 ​One of the structural schematic diagrams of the display substrate provided by the embodiment of the present application; Figure 5 One of the structural schematic diagrams of the display substrate provided by the embodiment of the present application; Figure 6 One of the structural schematic diagrams of the display substrate provided by the embodiment of the present application; Figure 7 One of the structural schematic diagrams of the display device provided by the embodiment of the present application; Figure 8 One of the method flow diagrams of the manufacturing method of the display substrate provided by the embodiment of the present application; Figure 9 One of the process flow diagrams of the display substrate shown in the preparation Figure 3 One of the process flow diagrams of the display substrate shown in the preparation Explanation of reference numerals: 10-substrate; 20-pixel defining layer; 30-pixel unit; 40-first opening; 50-light emitting functional layer; 60-isolation groove; 70-inorganic insulating layer; 80-second opening; 90-sacrificial layer; 91-groove; 92-driving circuit layer; 93-planarization layer; 94-anode layer; 95-organic insulating layer. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. And in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort belong to the protection scope of the present application.

[0021] Unless otherwise defined, technical terms or scientific terms used in the present application shall be understood as the usual meaning understood by those of ordinary skill in the art to which the present application belongs. The terms "first", "second" and similar words used in the present application do not represent any order, number or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar words mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. The terms "in", "out", "up", "down" and the like are only used to represent relative positional relationship, which may change accordingly when the absolute position of the described object changes.

[0022] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of the invention. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0023] In related technologies, the design for inter-pixel isolation largely relies on traditional pixel-bound planar isolation structures. Figure 1 Taking the display panel shown as an example, specifically, pixel units of different colors are divided on the plane by a pixel delimiting layer; however, since the light-emitting common layer 01 and the light-emitting layer 02 are continuously distributed on the surface of the pixel delimiting layer, this structure cannot effectively block the lateral current flow of the light-emitting common layer 01 and the light-emitting layer 02 above the pixel delimiting layer. The lateral current can flow freely along the surface of the film layer, and the crosstalk and leakage problems between pixel units of different colors cannot be fundamentally solved.

[0024] In view of this, embodiments of the present invention provide a display substrate, a method for manufacturing the same, and a display device to avoid crosstalk between pixels and lateral leakage current problems, thereby improving the display effect.

[0025] Combination Figure 2 and Figure 3 As shown, the display substrate provided in this embodiment of the invention includes a plurality of pixel units 30 arranged in an array. The specific number of the plurality of pixel units 30 can be set according to actual application needs and is not limited here. Figure 2 This is a top view schematic diagram of one type of display substrate structure provided in an embodiment of the present invention. Figure 3 For along Figure 2 A schematic diagram of one possible structure in the direction shown in the MM diagram. Specifically, the display substrate includes: Substrate 10; A pixel defining layer 20 is located on the substrate 10, and the pixel defining layer 20 has a plurality of first openings 40 for defining pixel units 30; the pixel defining layer 20 has isolation grooves 60 in the thickness direction, and the isolation grooves 60 are arranged around each of the first openings 40. A sacrificial layer 90 covers the sidewall of the isolation trench 60, and at least one groove 91 is formed on the side of the sacrificial layer 90 away from the sidewall; the orthographic projection of the sacrificial layer 90 on the substrate 10 falls completely within the area of ​​the orthographic projection of the isolation trench 60 on the substrate 10. The light-emitting functional layer 50 covers the pixel defining layer 20; the light-emitting functional layer 50 is disconnected in the corresponding area of ​​the bottom of each groove 91, and is continuously disposed in other areas except for the corresponding area of ​​the bottom of each groove 91.

[0026] In the implementation process, the display substrate provided by the embodiment of the present application comprises a substrate 10, a pixel definition layer 20, a sacrifice layer 90 and a light-emitting functional layer 50. The substrate 10 may, for example, be a rigid substrate or a flexible substrate, and the present application does not limit the substrate. In addition, the pixel definition layer 20 is located on the substrate 10, and the pixel definition layer 20 is provided with a plurality of first openings 40 for defining pixel units 30. The plurality of first openings 40 may, for example, be two, three or more, and the present application does not limit the number of first openings. In addition, the light-emitting functional layer 50 is located on the side of the pixel definition layer 20 away from the substrate 10 and covers the pixel definition layer 20. The light-emitting functional layer 50 may, for example, comprise an emitting common (EV) layer and an emitting material layer (EML), wherein the emitting common layer comprises an emitting hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL) and an electron injection layer (EIL).

[0027] In addition, the pixel definition layer 20 is provided with an isolation groove 60 in the thickness direction, and the isolation groove 60 is arranged around each first opening 40. The isolation groove 60 may, for example, be a groove structure partially penetrating the thickness of the pixel definition layer 20. The isolation groove 60 may, for example, also be a through-hole structure completely penetrating the thickness of the pixel definition layer 20. The arrangement of the isolation groove 60 may, for example, be as shown in FIG. 1B. Figure 2 In addition, the sacrifice layer 90 covers the side wall of the isolation groove 60, and the side of the sacrifice layer 90 away from the side wall is provided with at least one recess 91. The at least one recess 91 may, for example, be one, two or more. The number of the at least one recess 91 may, for example, be determined according to actual application requirements, and the present application does not limit the number of recesses. In the example shown in FIG. 1C, the at least one recess 91 is three. Figure 3 In an example embodiment, the distribution of each recess 91 on the same side wall of the isolation groove 60 may, for example, be uniform or non-uniform, and the present application does not limit the distribution. In an example embodiment, the recesses 91 corresponding to the two oppositely arranged side walls in the same isolation groove 60 may, for example, be symmetrically distributed, thereby ensuring the uniformity of the isolation effect of the isolation groove 60 on the light-emitting functional layer 50 and improving the use performance of the display substrate.

[0028] The material for preparing the sacrifice layer 90 may, for example, be a-Si. It should be noted that the sacrifice layer 90 only covers the side wall of the isolation groove 60 and does not completely fill the isolation groove 60. The a-Si material may, for example, be deposited on the side wall of the isolation groove 60. In this way, the sacrifice layer 90 arranged on the side wall of the isolation groove 60 provides a guarantee for the subsequent preparation of the at least one recess 91. In addition, the orthographic projection of the sacrifice layer 90 on the substrate 10 completely falls within the area range of the orthographic projection of the isolation groove 60 on the substrate.

[0029] In addition, the light-emitting functional layer 50 covers the pixel defining layer 20; the light-emitting functional layer 50 is discontinuously arranged in the corresponding area of the groove bottom of each groove 91, and continuously arranged in other areas except the corresponding area of the groove bottom of each groove 91. In this way, by means of the isolation groove 60 opened on the pixel defining layer 20 and at least one groove 91 opened on the side wall of the isolation groove 60 covered by the sacrifice layer 90, the current flow path in the light-emitting functional layer 50 is effectively blocked, the cross-talk and lateral leakage problems between pixels are effectively avoided, and the display effect is improved.

[0030] In the embodiment of the present application, the sacrifice layer 90 is discontinuously arranged at the groove bottom of the isolation groove 60.

[0031] In the specific implementation process, the sacrifice layer 90 is discontinuously arranged at the groove bottom of the isolation groove 60. In this way, the extension distance of the deposited film layer can be extended to a certain extent during the subsequent deposition of the light-emitting functional layer 50; in this way, the light-emitting functional layer 50 with a longer extension distance is extremely easy to be discontinuously arranged at the groove bottom of the isolation groove 60, thereby blocking the current flow path in the light-emitting functional layer 50 to a certain extent, avoiding the cross-talk and lateral leakage problems between pixels, and improving the display effect.

[0032] In the embodiment of the present application, the thickness of the light-emitting functional layer 50 in the part in contact with each groove 91 is less than the thickness of other parts except the part.

[0033] In the specific implementation process, the groove 91 opened on the sacrifice layer 90 can block the deposited light-emitting functional layer 50 to a certain extent; in this way, the thickness of the light-emitting functional layer 50 in the part in contact with each groove 91 is less than the thickness of other parts except the part. For example, the thickness of the light-emitting functional layer 50 in the part in contact with each groove 91 ranges from 0 to 800 angstroms, the thickness of the light-emitting functional layer 50 at the groove bottom of the isolation groove 60 ranges from 400 angstroms to 600 angstroms, and the thickness of the light-emitting functional layer 50 except the isolation groove 60 ranges from 600 angstroms to 800 angstroms. In one exemplary embodiment, the light-emitting functional layer 50 is discontinuously arranged in the corresponding area of the groove bottom of each groove 91, and correspondingly, the light-emitting functional layer 50 is not patterned in the corresponding area of the groove bottom of each groove 91.

[0034] It should be noted that, still in combination with the above-mentioned thickness setting range of the light-emitting functional layer 50, the light-emitting functional layer 50 comprises a light-emitting material layer and a light-emitting common layer other than the light-emitting material layer; wherein the thickness range of the light-emitting common layer in the light-emitting functional layer 50 on the sidewall of the sacrificial layer 90 is 0-300 angstroms, the thickness range of the light-emitting common layer at the bottom of the isolation groove 60 is 100 angstroms-200 angstroms, and the thickness range of the light-emitting common layer other than the isolation groove 60 is 200 angstroms-300 angstroms; the thickness range of the light-emitting material layer in the light-emitting functional layer 50 on the sidewall of the sacrificial layer 90 is 0-500 angstroms, the thickness range of the light-emitting material layer at the bottom of the isolation groove 60 is 300 angstroms-400 angstroms, and the thickness range of the light-emitting material layer other than the isolation groove 60 is 400 angstroms-500 angstroms. Of course, the specific thickness of the light-emitting common layer and the light-emitting material layer in the light-emitting functional layer 50 can also be set according to actual application needs, which will not be described in detail here.

[0035] In the embodiment of the present application, along the direction of the edge of each groove 91 pointing to the corresponding groove bottom, the thickness of the light-emitting functional layer 50 shows a decreasing trend.

[0036] In the specific implementation process, along the direction of the edge of each groove 91 pointing to the corresponding groove bottom, the thickness of the light-emitting functional layer 50 shows a decreasing trend; for example, the thickness of the light-emitting functional layer 50 gradually thins from 800 angstroms to 0 along the direction of the edge of each groove 91 pointing to the corresponding groove bottom. Correspondingly, the blocking effect of the light-emitting functional layer 50 at the groove bottom of each groove 91 is better, thereby avoiding the problem of cross talk and lateral leakage between pixels and improving the display effect.

[0037] In the embodiment of the present application, on the same sidewall of the isolation groove 60, along the direction perpendicular to the center line of the adjacent two first openings 40, the maximum extension length of the sacrificial layer 90 is 3.5-5.5 μm, and the minimum extension length is 0.5-1 μm.

[0038] Still in combination Figure 2In the example shown, the arrow X indicates the direction parallel to the center line of the two adjacent first openings 40, and the arrow Y indicates the direction perpendicular to the center line of the two adjacent first openings 40. In the actual implementation, on the same side wall of the isolation groove 60, the maximum extension length of the sacrificial layer 90 in the direction perpendicular to the center line of the two adjacent first openings 40 is 3.5 μm-5.5 μm, and the minimum extension length is 0.5 μm-1 μm. For example, in the actual preparation process, the sacrificial layer 90 with the required pattern can be prepared by depositing a-Si material with a thickness of 5.5 μm, the maximum extension length of the sacrificial layer 90 is 5.5 μm, and the minimum extension length is 0.5 μm. It should be noted that in the actual preparation process, when at least one groove 91 is formed on the side of the sacrificial layer 90 away from the side wall of the isolation groove 60, a certain thickness of material needs to be reserved, so as to avoid damaging the pixel definition layer 20 while ensuring the preparation efficiency of the groove 91.

[0039] In the embodiment of the present application, the maximum extension length of each groove in the direction perpendicular to the center line of the two adjacent first openings 40 is equal and is 1.5 μm-3 μm.

[0040] In the actual implementation, the maximum extension length of each groove 91 in the direction perpendicular to the center line of the two adjacent first openings 40 is equal and is 1.5 μm-3 μm. In this way, the blocking effect of each groove 91 on the corresponding material of the subsequently deposited light-emitting functional layer is ensured, and the blocking effect of each groove 91 on the corresponding material of the subsequently deposited light-emitting functional layer is substantially the same, thereby ensuring the use effect of the display substrate. For example, the maximum extension length of each groove 91 in the direction perpendicular to the center line of the two adjacent first openings 40 is equal and is 3 μm, that is, the maximum extension length from the groove bottom to the groove top of each groove 91 is 3 μm. In one example embodiment, the maximum extension length of the sacrificial layer 90 in the direction perpendicular to the center line of the two adjacent first openings 40 is 4 μm, the maximum extension length from the groove bottom to the groove top of each groove 91 is 3 μm, and the extension length of the sacrificial layer 90 at the position corresponding to the groove bottom of each groove 91 is 1 μm. Of course, the maximum extension length of each groove 91 in the direction perpendicular to the center line of the two adjacent first openings 40 can also be set according to actual application needs, which is not limited herein.

[0041] In one example embodiment, as shown in Figure 4 the at least one groove 91 is one, and the extension length of the groove 91 in the direction parallel to the center line of the two adjacent first openings 40 is 1.5 μm-3 μm.

[0042] Still in combination with Figure 4In the shown example embodiment, the sacrifice layer 90 is provided with only one groove 91 on the side wall of the isolation groove 60, and the extension length of the groove 91 is less than the extension length of the isolation groove 60 along the direction parallel to the center line of the adjacent two first openings 40, and the extension length of the groove 91 is 1.5 μm-3 μm. For example, the extension length of the groove 91 is 1.5 μm, and the extension length of the isolation groove 60 is 4 μm.

[0043] In one example embodiment, still in combination with Figure 3 As shown, the at least one groove 91 is three, and the extension length of each groove 91 is equal and is 0.5 μm-1.5 μm along the direction parallel to the center line of the adjacent two first openings 40.

[0044] Still in combination with Figure 3 In the shown example embodiment, the sacrifice layer 90 is provided with three grooves 91 on the side wall of the isolation groove 60; and the extension length of each groove 91 is equal and is 0.5 μm-1.5 μm along the direction parallel to the center line of the adjacent two first openings 40. In this way, the uniformity of the grooves 91 and the same blocking effect are ensured.

[0045] In the example embodiment, the extension length of the isolation groove 60 along the direction perpendicular to the center line of the adjacent two first openings 40 is greater than the extension length of the isolation groove 60 along the direction parallel to the center line of the adjacent two first openings 40.

[0046] Still in combination with Figure 3 and Figure 4 In the shown example embodiment, the extension length of the isolation groove 60 along the direction perpendicular to the center line of the adjacent two first openings 40 is greater than the extension length of the isolation groove 60 along the direction parallel to the center line of the adjacent two first openings 40. In this way, the blocking effect of the isolation groove 60 on the light-emitting functional layer 50 along the direction perpendicular to the center line of the adjacent two first openings 40 is ensured, thereby providing a guarantee for blocking the current flow path in the light-emitting functional layer 50.

[0047] In the example embodiment, the extension length of the isolation groove 60 along the direction perpendicular to the center line of the adjacent two first openings 40 is 4 μm-8 μm; and the extension length of the isolation groove 60 along the direction parallel to the center line of the adjacent two first openings 40 is 2 μm-4 μm.

[0048] In one of the example embodiments, the isolation groove 60 has an extension length of 4 μm along a direction perpendicular to the center lines of the two adjacent first openings 40, and has an extension length of 2 μm along a direction parallel to the center lines of the two adjacent first openings 40. In this way, the isolation groove 60 can effectively block the light emitting functional layer 50 along the direction perpendicular to the center lines of the two adjacent first openings 40, thereby ensuring the current flow path in the light emitting functional layer 50.

[0049] In the example embodiments, the cross-sectional shape of each of the grooves 91 along the direction parallel to the center lines of the two adjacent first openings 40 is at least one of a triangle, a semicircle, and a rectangle.

[0050] Still in combination with the example embodiments shown in Figure 3 and Figure 4 In the example embodiments, the cross-sectional shape of each of the grooves 91 along the direction parallel to the center lines of the two adjacent first openings 40 is a semicircle.

[0051] In one of the example embodiments, as shown in Figure 5 the cross-sectional shape of each of the grooves 91 along the direction parallel to the center lines of the two adjacent first openings 40 is a triangle.

[0052] In one of the example embodiments, as shown in Figure 6 the cross-sectional shape of each of the grooves 91 along the direction parallel to the center lines of the two adjacent first openings 40 is a rectangle. Of course, in addition to the above-mentioned cases, the number of the grooves 91 in the isolation groove 60 and the corresponding cross-sectional shape can also be set according to actual application needs, which are not limited herein.

[0053] In the example embodiments, the cross-sectional shape of the portion of the isolation groove 60 between the two adjacent first openings 40 along the direction parallel to the center lines of the two adjacent first openings 40 is at least one of a rectangle and a trapezoid. In actual applications, the cross-sectional shape of the isolation groove 60 can be set according to specific needs, which is not limited herein.

[0054] It should be noted that, in the specific implementation process, the Bosch process (i.e., deep reactive ion etching process, or time division etching process) can be used to form at least one groove 91 on the side of the sacrificial layer 90 away from the side wall of the isolation groove 60. For example, by adjusting the etching conditions such as the proportion, pressure, and temperature of the injected etching gas, the groove 91 with the desired structure can be formed on the a-Si material on the side wall of the isolation groove 60.

[0055] Of course, in addition to the above-mentioned manner, the display substrate can also be provided with other forms of structures according to actual application needs, which are not described in detail herein.

[0056] In addition, the display substrate can further include a driving circuit layer 92 disposed on the substrate 10, and a planar layer 93 located on the side of the driving circuit layer 92 away from the substrate 10; the specific arrangement of the driving circuit layer 92 can be implemented with reference to the related art, and will not be described in detail here. In this way, the driving capability of the display substrate to the pixel units 30 is ensured by the driving circuit layer 92; the structural stability of the subsequent film layers is ensured by the planar layer 93, thereby improving the use performance of the display substrate. In addition, the display substrate further includes an anode layer 94 located between the pixel defining layer 20 and the planar layer 93, which is arranged one-to-one corresponding to the first openings 40. Of course, other film layer structures can also be arranged according to actual application needs, and the specific arrangement can be implemented with reference to the related art, and will not be described in detail here.

[0057] Based on the same inventive concept, as shown in Figure 7 The embodiment of the present application further provides a display device, which comprises the display substrate 100 according to any one of the above.

[0058] Since the display device solves the problem by the similar principle as the display substrate 100 described above, the implementation of the display device can refer to the implementation of the display substrate 100 described above, and the repeated parts will not be described in detail.

[0059] In the specific implementation process, the display device provided by the embodiment of the present application can be any product or component with display function, such as mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, etc. The other essential components of the display device should be understood by those skilled in the art, and will not be described in detail here, and should not be regarded as a limitation on the present application.

[0060] Based on the same inventive concept, as shown in Figure 8 The embodiment of the present application further provides a manufacturing method of a display substrate, comprising: S101: forming a whole layer of pixel defining layer on a substrate; S102: patterning the pixel defining layer to form a plurality of first openings for defining pixel units; S103: using a patterning process to open a separation groove along the thickness direction of the pixel defining layer; the separation groove is arranged around each of the first openings; S104: depositing a whole layer of sacrificial layer on the side of the pixel defining layer away from the substrate; S105: patterning the sacrificial layer to retain the part covering the sidewall of the separation groove; S106: etching is performed to form at least one groove on the side of the sacrificial layer away from the sidewall of the isolation groove; the orthographic projection of the sacrificial layer on the substrate falls within the area range of the orthographic projection of the isolation groove on the substrate; S107: a light-emitting functional layer is formed to cover the pixel defining layer; the light-emitting functional layer is discontinuously arranged in the corresponding area of the bottom of each groove and continuously arranged in other areas except the corresponding area of the bottom of each groove.

[0061] In the implementation process, the display substrate shown in Figure 3 The display substrate shown in the example is combined with the process flow diagram shown in Figure 9 The specific implementation process of steps S101 to S107 is explained as follows: First, a whole layer of pixel defining layer 20 is formed on the substrate 10; the conventional material for forming the pixel defining layer 20 can be, for example, polymethyl acrylate and its derivatives (such as polymethyl methacrylate), photoinitiator, monomer, additive and solvent. Then, a patterning process is used to form an isolation groove 60 along the thickness direction of the pixel defining layer 20; the isolation groove 60 is arranged around each first opening 40. It should be noted that, in the embodiment of the present application, unless otherwise specified, the patterning process mainly uses exposure, development and etching to form a pattern of the corresponding film layer.

[0062] Then, a whole layer of sacrificial layer 90 is deposited on the side of the pixel defining layer 20 away from the substrate 10; the material of the sacrificial layer 90 can be, for example, a-Si. Then, the sacrificial layer 90 is subjected to a patterning process to retain the part covering the sidewall of the isolation groove 60 and remove other parts. For example, a mask process is used to pattern the sacrificial layer 90. Then, an etching process, such as Bosch process, is used to form three grooves 91 on the side of the sacrificial layer 90 away from the sidewall of the isolation groove 60; for example, by adjusting the etching conditions such as the ratio of etching gas, pressure and temperature, the groove 91 with the required structure can be formed for the a-Si material on the sidewall of the isolation groove 60. The orthographic projection of the sacrificial layer 90 on the substrate 10 falls within the area range of the orthographic projection of the isolation groove 60 on the substrate 10. Then, a light-emitting functional layer 50 is formed to cover the pixel defining layer 20; the light-emitting functional layer 50 is discontinuously arranged in the corresponding area of the bottom of each groove 91 and continuously arranged in other areas except the corresponding area of the bottom of each groove 91. In the embodiment of the present application, after the light-emitting functional layer 50 is formed to cover the pixel defining layer 20, a cathode layer, a thin film encapsulation layer, a color filter layer, a touch layer and a cover plate can be sequentially prepared; the specific preparation process can be implemented by referring to related technologies, which is not limited herein.

[0063] It should be noted that the preparation process of the display substrate with other structures mentioned in the embodiments of the present application can be prepared by referring to similar methods, which will not be described in detail here.

[0064] The embodiments of the present application provide a display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises a substrate 10, a pixel definition layer 20, a sacrifice layer 90 and a light emitting functional layer 50; the pixel definition layer 20 is located on the substrate 10 and is provided with a plurality of first openings 40 for defining pixel units 30; the pixel definition layer 20 is provided with an isolation groove 60 in the thickness direction, and the isolation groove 60 is arranged around each first opening 40; in this way, the isolation groove 60 can block the subsequent light emitting functional layer 90 to a certain extent; in addition, the sacrifice layer 90 covers the side wall of the isolation groove 60, and at least one groove 91 is arranged on the side of the sacrifice layer 90 away from the side wall; the orthographic projection of the sacrifice layer 90 on the substrate 10 completely falls within the area range of the orthographic projection of the isolation groove 60 on the substrate 10; the light emitting functional layer 50 covers the pixel definition layer 20; the light emitting functional layer 50 is discontinuously arranged in the corresponding area of the groove bottom of each groove 91, and is continuously arranged in other areas except the corresponding area of the groove bottom of each groove 91. In this way, by arranging the isolation groove 60 on the pixel definition layer 20 and the at least one groove 91 arranged on the side wall of the isolation groove 60 covered by the sacrifice layer 90, the flow path of the current in the light emitting functional layer 50 is effectively blocked, thereby avoiding the cross talk and lateral leakage problems between the pixel units, and improving the display effect.

[0065] Although the preferred embodiments of the present application have been described, those skilled in the art who have the basic inventive concept can make further changes and modifications to the embodiments. Therefore, the appended claims are intended to include the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0066] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. A display substrate, characterized in that, include: Substrate; A pixel defining layer is located on the substrate, and the pixel defining layer has a plurality of first openings for defining pixel units; The pixel defining layer has isolation grooves in the thickness direction, and the isolation grooves are arranged around each of the first openings; A sacrificial layer covers the sidewall of the isolation trench, and at least one groove is formed on the side of the sacrificial layer opposite to the sidewall; the orthographic projection of the sacrificial layer on the substrate falls completely within the area of ​​the orthographic projection of the isolation trench on the substrate. A light-emitting functional layer covers the pixel boundary layer; The light-emitting functional layer is disconnected in the corresponding area of ​​the bottom of each groove, and continuously disposed in other areas besides the corresponding area of ​​the bottom of each groove.

2. The display substrate as described in claim 1, characterized in that, The sacrificial layer is disconnected at the bottom of the isolation trench.

3. The display substrate as described in claim 1 or 2, characterized in that, The thickness of the portion of the light-emitting functional layer that contacts each groove is less than the thickness of the other portions.

4. The display substrate as described in claim 3, characterized in that, Along the edge of each groove pointing towards the bottom of the corresponding groove, the thickness of the light-emitting functional layer decreases.

5. The display substrate as described in claim 4, characterized in that, On the same sidewall of the isolation groove, along the direction perpendicular to the center line of the two adjacent first openings, the maximum extension length of the sacrificial layer is 3.5μm~5.5μm, and the minimum extension length is 0.5μm~1μm.

6. The display substrate as described in claim 5, characterized in that, Along the direction perpendicular to the center line of the two adjacent first openings, the maximum extension length of each groove is equal, and is 1.5μm~3μm.

7. The display substrate as described in claim 6, characterized in that, The at least one groove is one, and the extension length of the groove is 1.5μm~3μm along the direction parallel to the center line of the two adjacent first openings.

8. The display substrate as described in claim 6, characterized in that, The at least one groove consists of three grooves, and the extension length of each groove is equal along the direction parallel to the center line of the two adjacent first openings, and each groove is 0.5μm~1.5μm.

9. The display substrate according to any one of claims 1, 2, 4-8, characterized in that, The length of the isolation groove extending perpendicular to the center line of the two adjacent first openings is greater than the length of the isolation groove extending parallel to the center line of the two adjacent first openings.

10. The display substrate as claimed in claim 9, characterized in that, The length of the isolation groove extending perpendicular to the center line of the two adjacent first openings is 4μm to 8μm; the length of the isolation groove extending parallel to the center line of the two adjacent first openings is 2μm to 4μm.

11. The display substrate according to any one of claims 1, 2, 4-8, characterized in that, Along the direction parallel to the center line of two adjacent first openings, the cross-sectional shape of each groove is at least one of triangle, semicircle, and rectangle.

12. A display device, characterized in that, include: The display substrate as described in any one of claims 1-11.

13. A method for manufacturing a display substrate, characterized in that, include: A complete pixel definition layer is formed on the substrate; The pixel defining layer is patterned to form a plurality of first openings for defining pixel units; Using a patterning process, isolation grooves are formed along the thickness direction of the pixel defining layer; the isolation grooves are arranged around each of the first openings. A whole sacrificial layer is deposited on the side of the pixel defining layer opposite to the substrate; The sacrificial layer is patterned, retaining the portion covering the sidewall of the isolation groove; An etching process is used to create at least one groove on the side of the sacrificial layer away from the sidewall; the orthogonal projection of the sacrificial layer on the substrate falls completely within the area of ​​the orthogonal projection of the isolation groove on the substrate. A light-emitting functional layer is formed covering the pixel defining layer; the light-emitting functional layer is disconnected in the corresponding area of ​​each groove bottom, and continuously disposed in other areas except for the corresponding area of ​​each groove bottom.

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