Display panel, display device, display master mask and preparation method of display master mask

Abstract

The invention provides a display panel, a display device, a display master mask and a preparation method thereof, the display panel comprises a first area and a second area, the first area comprises a pixel electrode, the pixel electrode is located on one side of a substrate, and the pixel electrode is electrically connected with a light-emitting element; the second area comprises a gasket, the gasket and the pixel electrode are located on the same side of the substrate, and the gasket is connected with the signal line; the conductive connecting part comprises a first conductive connecting part and a second conductive connecting part, the first conductive connecting part is located on the side, away from the substrate, of the pixel electrode, and the pixel electrode is electrically connected with the light-emitting element through the first conductive connecting part; the second conductive connecting part is located on the side, away from the substrate, of the liner, the second conductive connecting part and the liner are at least partially overlapped in the direction perpendicular to the plane where the display panel is located, and the first conductive connecting part and the second conductive connecting part comprise the same material. The electric connection effect of different parts in the display panel can be ensured by arranging the conductive connection part, and the stability and reliability of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and in particular to a display panel, display device, display master and its preparation method. Background Technology

[0002] With the continuous development of display technology, display panels have been widely used in people's production and daily life. In order to better meet people's needs, some structural parts of the display panel can be finely adjusted, thereby improving the structural stability and reliability of the display panel and ensuring the display effect. Summary of the Invention

[0003] This application provides a display panel, a display device, a display master, and a method for manufacturing the same. By providing conductive connection parts, the electrical connection effect of different components in the display panel can be ensured, thereby improving the stability and reliability of the display panel.

[0004] In a first aspect, embodiments of this application provide a display panel, including a first area and a second area.

[0005] The first region includes a pixel electrode, which is located on one side of the substrate and is electrically connected to a light-emitting element;

[0006] The second region includes a pad located on the same side of the substrate as the pixel electrode, and the pad is connected to a signal line;

[0007] The conductive connection portion includes a first conductive connection portion and a second conductive connection portion. The first conductive connection portion is located on the side of the pixel electrode away from the substrate, and the pixel electrode is electrically connected to the light-emitting element through the first conductive connection portion.

[0008] The second conductive connection is located on the side of the pad away from the substrate, along a direction perpendicular to the plane of the display panel, and the second conductive connection overlaps the pad at least partially; wherein the first conductive connection and the second conductive connection are made of the same material.

[0009] Secondly, embodiments of this application provide a display device including the display panel described in the first aspect.

[0010] Thirdly, embodiments of this application provide a display master, including the display panel described in the first aspect; the display master further includes a substrate, and a plurality of the display panels are located on one side of the substrate.

[0011] Fourthly, embodiments of this application provide a method for preparing a display master, used to prepare the display master described in the first aspect, the method comprising:

[0012] A substrate is provided; a plurality of display panels are located on one side of the substrate; each display panel includes a first region and a second region, the first region including a pixel electrode located on one side of the substrate and electrically connected to a light-emitting element; the second region including a pad located on the same side of the substrate as the pixel electrode and connected to a signal line.

[0013] A conductive connection portion is prepared; the conductive connection portion includes a first conductive connection portion and a second conductive connection portion, the first conductive connection portion is located on the side of the pixel electrode away from the substrate, and the pixel electrode is electrically connected to the light-emitting element through the first conductive connection portion; the second conductive connection portion is located on the side of the pad away from the substrate, along a direction perpendicular to the plane of the display panel, and the second conductive connection portion at least partially overlaps the pad; wherein, the first conductive connection portion and the second conductive connection portion are prepared simultaneously and include the same material.

[0014] In summary, this application provides a display panel including a first region and a second region. The first region includes pixel electrodes electrically connected to light-emitting elements, and the second region includes a pad electrically connected to signal lines. Both the pad and the pixel electrodes are located on one side of a substrate. Furthermore, the display panel also includes conductive connections, including a first conductive connection and a second conductive connection. The first conductive connection is located on the side of the pixel electrodes away from the substrate, and the light-emitting elements are electrically connected to the pixel electrodes through the first conductive connection. The second conductive connection is located on the side of the pad away from the substrate, ensuring the electrical connection between the pad and other components. Therefore, by providing conductive connections, the structural stability of the display panel can be ensured, the reliability of electrical signal transmission in the display panel can be improved, and the display effect of the display panel can be enhanced. Furthermore, the first and second conductive connections are made of the same material, so during the fabrication of the display panel, the first and second conductive connections can be fabricated simultaneously using the same process, which helps to reduce the manufacturing cost of the display panel. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this application and these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the first type of display panel provided in the embodiments of this application;

[0017] Figure 2 These are schematic diagrams of the structures of two display panels provided in the embodiments of this application;

[0018] Figure 3 yes Figure 2 A schematic diagram of a cross-section along section line A-A';

[0019] Figure 4 yes Figure 2 A schematic diagram of a cross-section along section line B-B';

[0020] Figure 5 This is a schematic diagram of the structure of the third type of display panel provided in the embodiments of this application;

[0021] Figure 6 yes Figure 5 A schematic diagram of a cross-section along section line C-C';

[0022] Figure 7 This is a schematic diagram illustrating the manufacturing process of a display panel according to an embodiment of this application;

[0023] Figure 8 This is a schematic diagram of the structure of the fourth type of display panel provided in the embodiments of this application;

[0024] Figure 9 yes Figure 8 A schematic diagram of a cross-section along section line E-E';

[0025] Figure 10 yes Figure 8 An enlarged schematic diagram of region d1 in the middle;

[0026] Figure 11 yes Figure 8 An enlarged schematic diagram of region d2 in the middle;

[0027] Figure 12 yes Figure 8 An enlarged schematic diagram of region d3 in the middle;

[0028] Figure 13 yes Figure 8 An enlarged schematic diagram of region d4 in the middle;

[0029] Figure 14 yes Figure 2 An enlarged schematic diagram of the d5 region;

[0030] Figure 15 This is a schematic diagram of the structure of the fifth type of display panel provided in the embodiments of this application;

[0031] Figure 16 yes Figure 15 A schematic diagram of a cross-section along section line F-F';

[0032] Figure 17 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0033] Figure 18 This is a schematic diagram of a display master provided in an embodiment of this application;

[0034] Figure 19 This is an enlarged schematic diagram of a display panel in a display master provided in an embodiment of this application;

[0035] Figure 20 This is an enlarged schematic diagram of the display panel in another display master provided in this application embodiment;

[0036] Figure 21 This is an enlarged schematic diagram of the display panel in another display master provided in the embodiments of this application;

[0037] Figure 22 This is a schematic flowchart of a method for preparing a display master according to an embodiment of this application;

[0038] Figure 23 This is a schematic flowchart of another method for preparing a display master provided in an embodiment of this application. Detailed Implementation

[0039] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit its scope. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present application, not the entire structure.

[0040] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0043] Figure 1 This is a schematic diagram of the structure of the first type of display panel provided in the embodiments of this application. Figure 2 These are schematic diagrams of the structures of two display panels provided in embodiments of this application. Figure 3 yes Figure 2 A schematic diagram of a cross-section along section line A-A'. Figure 4 yes Figure 2 A schematic diagram of a cross-section along section line B-B'. Figure 5 This is a schematic diagram of the structure of the third type of display panel provided in the embodiments of this application. Figure 6 yes Figure 5 A schematic diagram of a cross-section along section line C-C', for reference. Figures 1 to 6As shown, this application provides a display panel 10, which includes a first region 101 and a second region 102. The first region 101 includes a pixel electrode 200, which is located on one side of a substrate 1000 and is electrically connected to a light-emitting element 300. The second region 102 includes a pad 400, which is located on the same side of the substrate 1000 as the pixel electrode 200 and is connected to a signal line 500. A conductive connection portion 600 is also provided, which includes a first conductive connection portion 610. The first conductive connection 610 is located on the side of the pixel electrode 200 away from the substrate 1000, and the pixel electrode 200 is electrically connected to the light-emitting element 300 through the first conductive connection 610; the second conductive connection 620 is located on the side of the pad 400 away from the substrate 1000, along a direction perpendicular to the plane of the display panel 10, and the second conductive connection 620 overlaps the pad 400 at least partially; wherein the first conductive connection 610 and the second conductive connection 620 are made of the same material.

[0044] Among them, reference Figure 1 , Figure 2 and Figure 5 As shown, the display panel 10 includes a first area 101, in which multiple light-emitting elements 300 are disposed to realize the display function of the display panel 10. Therefore, the first area 101 can be understood as the light-emitting display area of ​​the display panel 10. Specifically, refer to... Figure 2 and Figure 3 As shown, the display panel 10 includes pixel electrodes 200 in the first area 101. The pixel electrodes 200 are electrically connected to the light-emitting element 300. The electrical signal driving the light-emitting element 300 to emit light is transmitted to the light-emitting element 300 through the pixel circuit 200, thereby realizing the display function of the display panel 10. It should be noted that... Figure 1 , Figure 2 and Figure 5 Only a portion of the structure of the display panel 10 is shown in the image.

[0045] Further reference Figure 3 As shown, the display panel 10 also includes an array substrate 2000 on one side of the substrate 1000. The array substrate 2000 is composed of multiple film layer structures stacked together, and a driving circuit 2001 for driving the light-emitting elements 300 to emit light for display is disposed in the array substrate 2000. The driving circuit 2001 includes at least one transistor 2002. Figure 3 The example uses a transistor 2002. The driving circuit 2001 transmits the electrical signal for driving the light-emitting element 300 to emit light for display via the pixel electrode 200 to the light-emitting element 300. Further, refer to... Figure 3As shown, the pixel electrode 200 includes a first pixel electrode unit 210 and a second pixel electrode unit 220. The first pixel electrode unit 210 is electrically connected to the first connection terminal 301 of the light-emitting element 300, and the second pixel electrode unit 220 is electrically connected to the second connection terminal 302 of the light-emitting element 300, thus realizing the electrical connection between the pixel electrode 200 and the light-emitting element 300. The light-emitting element 300 can be a micro light-emitting element or a mini light-emitting element, etc. The specific type and category of this light-emitting element are not limited in this embodiment.

[0046] Among them, reference Figure 1 , Figure 2 and Figure 5 As shown, the display panel 10 also includes a second region 102, which surrounds at least a portion of the first region 101. The relative positional relationship between the first region 101 and the second region 102 can be adaptively adjusted according to different display panels 10, and this application does not impose specific limitations on this. Specifically, the second region 102 can be understood as the border area surrounding the light-emitting display area in the display panel 10. Shift registers and driver chips, among other devices, can be configured in the second region 102.

[0047] For details, please refer to Figure 2 and Figure 3 Or refer to Figure 5 and Figure 6 As shown, the display panel 10 includes a pad 400 in the second region 102, and the pad 400 and the pixel electrode 300 are both located on one side of the substrate 1000. In the second region 102, an array substrate 2000 is also disposed on one side of the substrate 1000. Some signal lines or frame circuits are disposed within the array substrate 2000. This application does not provide specific examples of these, therefore the pad 400 is also located on the side of the array substrate 2000 away from the substrate 1000. The pad 400 can be a pad providing signals to the circuit structure in the display panel 10, such as providing signals to the driving circuit 2001 or other circuits. It should be noted that the pad 400 includes multiple conductive layers 401. The signal lines 500 are electrically connected through the conductive layers 401 of the same layer, thereby enabling the transmission of related signals. This embodiment of the invention does not specifically limit the number of conductive layers 401. The pad 400 can also be a solder pad providing test signals, enabling testing of the display panel 10 (e.g., visual testing). This application does not limit the specific type of the pad 400. For example, see [reference needed]. Figures 2 to 6 As shown in the illustration, the driver chip 700 provides signals to the driver circuit 2001 through the pad 400. Figure 2 and Figure 3 The example illustrates this by directly bonding the pad 400 to the driver chip 700. Figure 5and Figure 6 The example illustrates how the pad 400 is electrically connected to the driver chip 700 via a side trace. In other embodiments, the pad 400 may also be bonded to a circuit board or other electrical components; this application does not specifically limit this. For details, refer to... Figure 3 and Figure 4 As shown, the driver chip 700 in the display panel 10 is bonded to the pad 400 via the driver chip pad 710. Further, the signal line 500 in the display panel 10 is used to transmit electrical signals, wherein the pad 400 is connected to the signal line 500 in the display panel 10 to realize the transmission of electrical signals. Specifically, the signal line 500 can be directly electrically connected to the pad 400, or the signal line 500 can be electrically connected to the pad 400 through other electrical components. For example, the signal line 500 includes a first signal line 510 and a second signal line 520, wherein reference... Figure 2 As shown, the first signal line 510 is electrically connected to the pad 400 through the driver chip 700, reference... Figure 5 and Figure 6 As shown, the second signal line 520 is electrically connected to the pad 400, and the second signal line 520 is bent to the back of the display panel 10 and electrically connected to the driver chip 700. The back of the display panel 10 can be understood as the non-light-emitting side of the display panel 10.

[0048] Further reference Figures 1 to 6 As shown, the display panel 10 also includes a conductive connection portion 600. The conductive connection portion 600 is conductive, and its placement position can improve the electrical connection effect of corresponding devices. For details, refer to... Figure 2 and Figure 3 As shown, the conductive connection portion 600 includes a first conductive connection portion 610, which is located between the pixel electrode 200 and the light-emitting element 300. The first conductive connection portion 610 ensures the electrical connection between the pixel electrode 200 and the light-emitting element 300, guarantees the driving effect of the light-emitting element 300, and ensures the display effect of the display panel 10. Further, refer to... Figures 2 to 4 As shown, the conductive connection portion 600 further includes a second conductive connection portion 620. The second conductive connection portion 620 is located on the side of the pad 400 away from the substrate 1000, and along the thickness direction of the display panel 10, the second conductive connection portion 620 at least partially overlaps with the pad 400. By providing the second conductive connection portion 620, it is beneficial to improve the signal transmission effect in the pad 400, that is, to ensure the bonding effect between the pad 400 and the driver chip 700, and to improve the reliability and stability of signal transmission in the display panel 10.

[0049] Among them, reference Figure 3As shown, the first conductive connection portion 610 and the second conductive connection portion 620 are disposed in the same layer, and the first conductive connection portion 610 and the second conductive connection portion 620 can be made of the same material. This can also be understood as the first conductive connection portion 610 and the second conductive connection portion 620 being made using the same process, which helps to reduce the manufacturing cost of the display panel 10. The material of the conductive connection portion 600 may include one or more of titanium, copper, molybdenum, or silver; this application does not specifically limit this. For example, Figure 7 This is a schematic diagram of the manufacturing process of a display panel provided in an embodiment of this application, with reference to... Figure 7 In step a, a pixel electrode 200 and a pad 400 are included on one side of the substrate 1000; Reference Figure 7 In step b, a photoresist layer 800 is coated on one side of the display panel 10, and the photoresist layer 800 is designed with openings that expose the pixel electrode 200 and the pad 400, respectively; (Refer to...) Figure 7 In step c, a photomask 810 is placed on the side of the photoresist layer 800 away from the substrate 1000, and a conductive interconnect layer 900 is deposited on the side of the photomask 810 away from the substrate 1000; (Refer to...) Figure 7 In step d, the photoresist layer 800 and the mask 810 are removed, and the conductive connection layer 900 on the side of the mask 810 away from the substrate 1000 is also removed simultaneously, thereby retaining the first conductive connection portion 610 and the second conductive connection portion 620. The first conductive connection portion 610 is located on the side of the pixel electrode 200 away from the substrate 1000, and the second conductive connection portion 620 is located on the side of the pad 400 away from the substrate 1000. Thus, the first conductive connection portion 610 and the second conductive connection portion 620 are fabricated simultaneously in the same process, which can reduce the manufacturing cost of the display panel 10.

[0050] The pixel electrode 200 and the pad 400 are electrically connected through some circuit structures (such as the driving circuit 2001) disposed in the array substrate 2000. The first conductive connection portion 610 is provided to ensure the electrical connection between the pixel electrode 200 and the light-emitting element 300. Therefore, if only the first conductive connection portion 610 is fabricated, a large potential difference between the pixel electrode 200 and the pad 400 can easily lead to the generation of large static electricity, which can damage the circuit structures in the array substrate 2000, causing circuit failure and affecting the display function of the display panel 10. Furthermore, referring to... Figure 7In step c, while preparing the first conductive connection portion 610, the second conductive connection portion 620 is also prepared. That is, the deposited conductive connection layer 900 is a continuous whole-surface structure, which can ensure that the pixel electrode 200, the conductive connection layer 900 and the pad 400 are a continuous conductive structure. This is equivalent to short-circuiting the pixel electrode 200 and the pad 400 through the conductive connection layer 900, thereby ensuring that the potential difference between the pixel electrode 200 and the pad 400 is close, and avoiding the static electricity generated due to the large potential difference from affecting the interior of the display panel 10.

[0051] In summary, this application provides a display panel, which further includes conductive connections. A first conductive connection is located on the side of the pixel electrode away from the substrate, and the light-emitting element is electrically connected to the pixel electrode through the first conductive connection. A second conductive connection is located on the side of the pad away from the substrate, ensuring the electrical connection between the pad and other components. Therefore, by providing conductive connections, the structural stability of the display panel can be ensured, the reliability of electrical signal transmission in the display panel can be improved, and the display effect of the display panel can be enhanced. Furthermore, the first and second conductive connections are made of the same material, so during the fabrication of the display panel, the first and second conductive connections can be fabricated simultaneously using the same process, which helps to reduce the manufacturing cost of the display panel.

[0052] Figure 8 This is a schematic diagram of the structure of the fourth type of display panel provided in the embodiments of this application. Figure 9 yes Figure 8 A schematic diagram of a cross-section along section line E-E', for reference. Figure 8 and Figure 9 As shown, the conductive connection portion 600 also includes a third conductive connection portion 630 located on one side of the substrate 1000. The third conductive connection portion 620 is located in the second region 102, and the third conductive connection portion 630 and the second conductive connection portion 620 do not overlap in a direction perpendicular to the plane of the display panel 10.

[0053] Among them, reference Figure 8As shown, the conductive connection portion 600 also includes a third conductive connection portion 630, wherein both the second conductive connection portion 620 and the third conductive connection portion 630 are located in the second region 102. The orthographic projection of the second conductive connection portion 620 onto the substrate 1000 does not overlap with the orthographic projection of the third conductive connection portion 630 onto the substrate 1000; that is, the second conductive connection portion 620 and the third conductive connection portion 630 are located at different positions in the second region 102. This can also be understood as the second conductive connection portion 620 being located on the side of the pad 400 away from the substrate 1000, and the third conductive connection portion 630 not overlapping with the pad 400 along the thickness direction of the display panel 10; that is, the third conductive connection portion 630 is disposed at other positions in the second region 102. It should be noted that... Figure 8 The signal lines are not shown in the diagram.

[0054] Further reference Figure 8 and Figure 9 As shown, the third conductive connection portion 630 is located on one side of the substrate 1000, specifically on the side of the array substrate 2000 away from the substrate 1000. By adding multiple third conductive connections 630 in the second region 102, the film thickness value in this region can be increased, thereby ensuring that the overall film thickness difference in the second region 102 is small, which is beneficial to ensuring the overall film thickness uniformity of the display panel 10.

[0055] Furthermore, the third conductive connection portion 630 and the second conductive connection portion 620 may also include the same material, that is, the third conductive connection portion 630, the second conductive connection portion 620 and the first conductive connection portion 610 may be manufactured simultaneously using the same process. (Refer to the reference...) Figure 7 As shown, when designing the openings after coating the photoresist layer, openings are prepared to expose the pixel electrodes and pads. When the display panel includes a third conductive connection, new openings can be added to the photoresist layer for subsequent fabrication of the third conductive connection. Thus, during the fabrication of the display panel, the addition of multiple openings to the photoresist layer facilitates subsequent photoresist layer stripping, preventing photoresist residue from remaining in the display panel and ensuring the quality of the display panel fabrication.

[0056] Figure 10 yes Figure 8 An enlarged schematic diagram of region d1 in the middle. Figure 11 yes Figure 8 An enlarged schematic diagram of region d2 in the middle, for reference. Figure 8 , Figure 10 and Figure 11 As shown, the distribution density of the first conductive connection portion 610 per unit area is P1, and the distribution density of the third conductive connection portion 630 per unit area is P2, wherein |P1-P2| / P2≤0.2.

[0057] Furthermore, the distribution density of the first conductive connection 610 per unit area is P1, and the distribution density of the third conductive connection 630 is P2, where P1 and P2 satisfy: |P1-P2| / P2≤0.2. This can be understood as P1 and P2 having the same or similar values, meaning that the distribution densities of the first conductive connection 610 and the third conductive connection 630 in the display panel 10 are the same or similar. The third conductive connection 630 can be disposed on one side of the substrate 1000, thus its placement is flexible. The placement of the first conductive connection 610 needs to be considered in conjunction with the placement of the pixel electrode 200, and the placement of the second conductive connection 620 needs to be considered in conjunction with the placement of the pad 400. To ensure the regularity of the display panel 10, the distribution densities of the third conductive connection 630 and the first conductive connection 610 in the display panel 10 can be adjusted to be the same or similar.

[0058] For example, refer to Figure 10 The selected unit area is W1×W2, and there are 4 first conductive connection parts 610 within the W1×W2 area, i.e., P1=4 / (W1×W2); Reference Figure 11 As shown, the unit area selected is W1×W2. There are 4 third conductive connection parts 630 in the area of ​​W1×W2, that is, P2=4 / (W1×W2). Therefore, P1 and P2 have the same value.

[0059] Furthermore, the manufacturing process of the display panel 10 can be simplified when preparing the first conductive connection portion 610 and the third conductive connection portion 630. For example, the same mask can be selected to make openings in different areas of the photoresist layer. That is, the openings corresponding to the first conductive connection portion and the openings corresponding to the third conductive connection portion are prepared using the same mask, thereby reducing the manufacturing cost of the display panel 10.

[0060] Furthermore, the distribution density of the conductive connection portion 600 can be reflected by the number of each conductive connection portion per unit area and / or the area size of each conductive connection portion 600, wherein the arrangement of the first conductive connection portion 610 and the third conductive connection portion 630 can be as follows:

[0061] Continue to refer to Figure 8 , Figure 10 and Figure 11 As shown, the orthographic projection area of ​​a first conductive connection portion 610 on the substrate 1000 is S1, and the orthographic projection area of ​​a third conductive connection portion 630 on the substrate 1000 is S2, wherein |S1-S2| / S2≤0.2.

[0062] For details, please refer to Figure 10As shown, the projected area of ​​a first conductive connection portion 610 on the substrate 1000 is S1, referring to... Figure 11 As shown, the projected area of ​​a third conductive connection 630 on the substrate 1000 is S2, where S1 and S2 satisfy: |S1-S2| / S2≤0.2. This can be understood as S1 and S2 having the same or similar values, meaning that the area of ​​each first conductive connection 610 is the same or similar to the area of ​​each third conductive connection 630. This further demonstrates the regularity and uniformity of the conductive connections 600 in the display panel 10, reflecting the regularity and uniformity of the overall structure of the display panel 10.

[0063] Continue to refer to Figure 8 , Figure 10 and Figure 11 As shown, within a unit area, the number of first conductive connection parts 610 is N1, and the number of third conductive connection parts 630 is N2, where |N1-N2| / N2≤0.2.

[0064] Specifically, within a unit area, the number of first conductive connection portions 610 is N1; within a unit area, the number of third conductive connection portions 630 is N2, where N1 and N2 satisfy: |N1-N2| / N2≤0.2. This can be understood as N1 and N2 having the same or similar values, meaning that within the same selected area, the number of first conductive connection portions 610 and the number of third conductive connection portions 630 are the same or similar. For example, Figure 10 The example illustrates this by setting four first conductive connection parts 610 per unit area. Figure 11 The example illustrates this by setting four third conductive connection parts 630 per unit area. Figure 10 neutralization Figure 11 The single-sided area of ​​each part is the same. This further demonstrates the regularity and uniformity of the conductive connection part 600 in the display panel 10, and reflects the regularity and uniformity of the overall structure of the display panel 10.

[0065] Continue to refer to Figure 8 , Figure 10 and Figure 11 As shown, along the first direction X1, the distance between two adjacent first conductive connection portions 610 is L1, and the distance between two adjacent third conductive connection portions 630 is L2, wherein |L1-L2| / L2≤0.2; the first direction X1 is parallel to the plane where the display panel 10 is located.

[0066] Further reference Figure 10 As shown, along the first direction X1, the spacing between two adjacent first conductive connection portions 610 is L1; Reference Figure 11As shown, along the first direction X1, the distance between two adjacent third conductive connection portions 630 is L2, where L1 and L2 satisfy |L1-L2| / L2≤0.2. This can be understood as L1 and L2 having the same or similar values, and the distance between two adjacent first conductive connection portions 610 being the same or similar to the distance between two adjacent third conductive connection portions 630. Adjusting the distance between two adjacent conductive connection portions 600 can be understood as adjusting the arrangement of the conductive connection portions 600. In other words, the arrangement of the first conductive connection portions 610 in the display panel 10 is the same as or similar to the arrangement of the third conductive connection portions 630, thus reflecting the regularity and uniformity of the conductive connection portions 600 in the display panel 10, and reflecting the regularity and uniformity of the overall structure of the display panel 10.

[0067] Figure 12 yes Figure 8 An enlarged schematic diagram of region d3 in the middle. Figure 13 yes Figure 8 An enlarged schematic diagram of region d4 in the middle, for reference. Figure 8 , Figure 12 and Figure 13 As shown, the distribution density of the second conductive connection 620 per unit area is P3, and the distribution density of the third conductive connection 630 per unit area is P2, wherein |P3-P2| / P2≤0.2.

[0068] Furthermore, the distribution density of the second conductive connection 620 per unit area is P3, and the distribution density of the third conductive connection 630 is P2, where P3 and P2 satisfy: |P3-P2| / P2≤0.2. This can be understood as P3 and P2 having the same or similar values, meaning that the distribution densities of the second conductive connection 620 and the third conductive connection 630 in the display panel 10 are the same or similar. The third conductive connection 630 can be disposed on one side of the substrate 1000, thus its placement is flexible. The placement of the first conductive connection 610 needs to be considered in conjunction with the placement position of the pixel electrode 200, and the placement of the second conductive connection 620 needs to be considered in conjunction with the placement position of the pad 400. To ensure the regularity of the display panel 10, the distribution densities of the third conductive connection 630 and the second conductive connection 620 in the display panel 10 can be adjusted to be the same or similar.

[0069] For example, refer to Figure 12 The selected unit area is W3×W4. Within the W3×W4 area, there are four second conductive connection parts 620, i.e., P3=4 / (W3×W4); Reference Figure 13As shown, the unit area selected is W3×W4. There are 4 third conductive connection parts 630 in the W3×W4 area, that is, P2=4 / (W3×W4). Therefore, P3 and P2 have the same value.

[0070] Furthermore, the manufacturing process of the display panel 10 can be simplified when preparing the second conductive connection portion 620 and the third conductive connection portion 630. For example, the same mask can be used to make openings in different areas of the photoresist layer. That is, the openings corresponding to the second conductive connection portion and the openings corresponding to the third conductive connection portion are prepared using the same mask, thereby reducing the manufacturing cost of the display panel 10.

[0071] Furthermore, the distribution density of the conductive connection portion 600 can be reflected by the number of each conductive connection portion per unit area and / or the area size of each conductive connection portion 600, etc., wherein the arrangement of the second conductive connection portion 620 and the third conductive connection portion 630 can be as follows:

[0072] refer to Figure 8 , Figure 12 and Figure 13 As shown, the projected area of ​​a second conductive connection portion 620 on the substrate 100 is S3, and the projected area of ​​a third conductive connection portion 630 on the substrate 1000 is S2, wherein |S3-S2| / S2≤0.2.

[0073] For details, please refer to Figure 12 As shown, the projected area of ​​a second conductive connection portion 620 on the substrate 1000 is S3, referring to... Figure 13 As shown, the projected area of ​​a third conductive connection 630 on the substrate 1000 is S2, where S3 and S2 satisfy: |S3-S2| / S2≤0.2. This can be understood as S3 and S2 having the same or similar values, meaning that the area of ​​each second conductive connection 620 is the same or similar to the area of ​​each third conductive connection 630, further demonstrating the regularity and uniformity of the conductive connections 600 in the display panel 10, and reflecting the regularity and uniformity of the overall structure of the display panel 10.

[0074] Continue to refer to Figure 8 , Figure 12 and Figure 13 As shown, the number of second conductive connection parts 620 per unit area is N3, and the number of third conductive connection parts 630 is N2, where |N3-N2| / N2≤0.2.

[0075] Specifically, the number of second conductive connection portions 620 provided per unit area is N3; the number of third conductive connection portions 630 provided per unit area is N2, where N3 and N2 satisfy: |N3-N2| / N2≤0.2. This can be understood as N3 and N2 having the same or similar values, meaning that within the same selected area, the number of second conductive connection portions 620 and the number of third conductive connection portions 630 provided are the same or similar. For example, Figure 12 The example illustrates this by setting four second conductive connection parts 620 per unit area. Figure 13 The example illustrates this by setting four third conductive connection parts 630 per unit area. Figure 12 neutralization Figure 13 The single-sided area of ​​each part is the same. This further demonstrates the regularity and uniformity of the conductive connection part 600 in the display panel 10, and reflects the regularity and uniformity of the overall structure of the display panel 10.

[0076] Continue to refer to Figure 8 , Figure 12 and Figure 13 As shown, along the first direction X1, the distance between two adjacent second conductive connection portions 620 is L3, and the distance between two adjacent third conductive connection portions 630 is L2, wherein |L3-L2| / L2≤0.2; the first direction X1 is parallel to the plane where the display panel 10 is located.

[0077] Further reference Figure 12 As shown, along the first direction X1, the spacing between two adjacent second conductive connection portions 620 is L3; Reference Figure 13 As shown, along the first direction X1, the distance between two adjacent third conductive connection portions 630 is L2, where L3 and L2 satisfy |L3-L2| / L2≤0.2. This can be understood as L3 and L2 having the same or similar values. Similarly, the distance between two adjacent second conductive connection portions 620 is the same or similar to the distance between two adjacent third conductive connection portions 630. Adjusting the distance between two adjacent conductive connection portions 600 can be understood as adjusting the arrangement of the conductive connection portions 600. In other words, the arrangement of the second conductive connection portions 620 in the display panel 10 is the same or similar to the arrangement of the third conductive connection portions 630, thus demonstrating the regularity and uniformity of the conductive connection portions 600 in the display panel 10, and reflecting the overall regularity and uniformity of the display panel 10 structure.

[0078] refer to Figure 2 and Figure 8 As shown, the number of pads 400 is the same as the number of second conductive connections 620, and each pad 400 is provided with a second conductive connection 620 on the side away from the substrate 1000.

[0079] For details, please refer to Figure 2 and Figure 8 As shown, the number of pads 400 in the display panel 10 is the same as the number of second conductive connections 620. That is, each pad 400 is provided with a second conductive connection 620 on the side away from the substrate 1000. This can ensure the electrical connection effect between the pads 400 in the display panel 10 and the subsequently bonded devices (such as the driver chip 700), and at the same time, it can also ensure the regularity and flatness of the overall structure of the display panel 10.

[0080] Figure 14 yes Figure 2 An enlarged schematic diagram of the d5 region. Figure 15 This is a schematic diagram of the structure of the fifth type of display panel provided in the embodiments of this application. Figure 16 yes Figure 15 A schematic diagram of a cross-section along section line F-F', for reference. Figure 2 , Figure 4 , Figures 14 to 16 As shown, the projected area of ​​the pad 400 on the substrate 1000 is greater than or equal to the projected area of ​​the second conductive connection portion 620 on the substrate 1000.

[0081] The arrangement of the second conductive connection portion 620 on one side of the gasket 400 can be varied. (See reference) Figure 2 , Figure 4 and Figure 14 As shown, the projected area of ​​the pad 400 on the substrate 1000 is larger than the projected area of ​​the second conductive connection 620 on the substrate 1000. Furthermore, when the area of ​​the fabricated second conductive connection 620 is smaller than that of the pad 400, that is, the distance between two adjacent second conductive connections 620 is greater than the distance between two adjacent pads 400, this better ensures that the second conductive connection 620 is located within the area of ​​the pad 400, meaning the second conductive connection 620 will not deposit between two pads 400, avoiding short circuits in the pads 400 and ensuring the stability and reliability of signal transmission in the display panel 10. It should be noted that the pad 400 includes multiple conductive layers 401 and protective layers 402 located on both sides of the conductive layers 401. The projected area of ​​the pad 400 on the substrate 1000 can be understood as the area of ​​the conductive layers 401 exposed through the protective layers 402.

[0082] Or, refer to Figure 15 and Figure 16As shown, the projected area of ​​the pad 400 on the substrate 1000 is equal to the projected area of ​​the second conductive connection 620 on the substrate 1000. Furthermore, when the area of ​​the second conductive connection 620 is the same as the exposed area of ​​the pad 400, the same mask used for fabricating the protective layer 402 in the pad 400 can be used when etching the photoresist layer to create the opening corresponding to the second conductive connection 620. That is, the same opening can be used to create a deposition structure of the same area, thus reducing the manufacturing cost of the display panel 10. Simultaneously, the equal projected area of ​​the pad 400 on the substrate 1000 ensures the electrical connection between the pad 400 and the driver chip 700, guaranteeing the stability and reliability of signal transmission in the display panel 10 and ensuring the display effect of the display panel 10.

[0083] Combination Figure 2 , Figure 4 , Figures 14 to 16 As shown, the orthographic projection of the center o1 of the pad 400 on the substrate 1000 coincides with the orthographic projection of the center o2 of the second conductive connection portion 620 on the substrate 1000.

[0084] For details, please refer to Figure 2 , Figure 4 , Figures 14 to 16 As shown, along the thickness direction of the display panel 10, the center o1 of the pad 400 coincides with the center o2 of the second conductive connection 620, meaning the second conductive connection 620 is located at the center of the pad 400. This prevents the second conductive connection 620 from depositing in the gap between two adjacent pads 400 during the manufacturing process, thus avoiding short circuits between adjacent pads 400 and ensuring the reliability of signal transmission in the display panel 10. Furthermore, placing the second conductive connection 620 at the center of the pad 400 also ensures a more regular arrangement of the conductive connections 600 in the display panel 10, improving the overall structural regularity of the display panel 10.

[0085] Optional, in Figure 2 , Figure 4 , Figures 14 to 16 In this paper, the shape of the gasket 400 is illustrated by a rectangle, and the shape of the second conductive connection 620 is also illustrated by a rectangle. However, the specific shapes of the gasket 400 and the second conductive connection 620 are not limited to a rectangle. They can be adapted to the actual process requirements. This application does not impose specific limitations on them.

[0086] Based on the same inventive concept, this application also provides a display device. Figure 17 This is a schematic diagram of the structure of a display device assembly provided in an embodiment of this application, as shown below. Figure 17 As shown, the display device 1 includes the display panel 10 described in any of the above embodiments. Therefore, the display device 1 provided in this application has the corresponding beneficial effects of the above embodiments, which will not be repeated here. The display device 1 can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device.

[0087] Figure 18 This is a schematic diagram of a display master provided in an embodiment of this application, with reference to... Figure 18 As shown, this application embodiment provides a display master 2, which includes a plurality of display panels 10 as described in the above embodiments. Specifically, the display master 1 includes a substrate 3000, on which a plurality of display panels 10 are disposed. By cutting the plurality of display masters 2, a plurality of display panels 10 can be fabricated.

[0088] Figure 19 This is an enlarged schematic diagram of a display panel in a display master provided in an embodiment of this application. Figure 20 This is an enlarged schematic diagram of the display panel in another display master provided in this application embodiment, see reference. Figures 18 to 20 As shown, the second region 102 includes a bonding region 102a and a detection region 102b; the pad 400 includes a first pad 400a and a second pad 400b, the first pad 400a being located in the bonding region 102a and the second pad 400b being located in the detection region 102b; the second conductive connection portion 620 includes a first conductive electronic connection portion 621 and a second conductive electronic connection portion 622, the first conductive electronic connection portion 621 being located on the side of the first pad 400a away from the substrate 3000, and the second conductive electronic connection portion 622 being located on the side of the second pad 400b away from the substrate 3000.

[0089] For details, please refer to Figure 19 As shown, the multiple display panels 10 distributed on the display master 2 include a first area 101 and a second area 102. The second area 102 includes a bonding area 102a and a detection area 102b. The bonding area 102a can be understood as the area in the display panel 10 used for bonding with other components, such as a driver chip. A first pad 400a is provided in the bonding area 102a to facilitate subsequent bonding and connection with the driver chip. The detection area 102b can be understood as a test area for testing some circuits or display functions in the display panel 10. A second pad 400b is provided in the detection area 102b to transmit test signals, thereby checking the functionality of the display panel 10.

[0090] In this display panel 10, the second conductive connection portion 620 is located on the side of the pad 400 away from the substrate 3000. The second conductive connection portion 620 further includes a first conductive connection portion 621 and a second conductive connection portion 622. The first conductive connection portion 621 is located on the side of the first pad 400a away from the substrate 3000, and the second conductive connection portion 622 is located on the side of the second pad 400b away from the substrate 3000. By providing the second conductive connection portion 620 on both the first pad 400a and the second pad 400b, the flatness of the overall structure of the display panel 10 can be ensured. (Reference) Figure 20 As shown, the conductive connection portion 600 in the display panel 10 may include a plurality of first conductive connection portions 610, a plurality of second conductive connection portions 620 and a plurality of third conductive connection portions 630, and there are various ways to arrange the conductive connection portion 600.

[0091] As shown above, combined with Figure 7 As shown, during the fabrication of the display panel 10, specifically while fabricating the first conductive connection portion 610, the first conductive electronic connection portion 621 and the second conductive electronic connection portion 622 are also fabricated simultaneously. That is, the deposited conductive connection layer 900 is a continuous whole-surface structure, which better neutralizes the potential difference between the pixel electrode 200 and the pad 400, and better ensures that the pixel electrode 200, the conductive connection layer 900 and the pad 400 are a continuous conductive structure. This is equivalent to short-circuiting the pixel electrode 200 and the pad 400 through the conductive connection layer 900, thereby ensuring that the potential difference between the pixel electrode 200 and the pad 400 is close, and avoiding the generation of static electricity due to a large potential difference that affects the interior of the display panel 10.

[0092] It should be noted that when preparing the display panel 10 using the display master 2, multiple display panels 10 are cut to form individual display panels 10. The detection area 102b included in the display panel 10 on the substrate 3000 can be removed during the cutting process. Furthermore, the substrate 3000 in the display master 2, after being cut, forms the substrate 1000 in the corresponding display panel 10.

[0093] Figure 21 This is an enlarged schematic diagram of the display panel in another display master provided in this application embodiment, see reference. Figure 19 and Figure 21 As shown, the number of second pads 400b is M1, and the number of second conductive electronic connections 622 is M2; wherein, M1≥M2.

[0094] For details, please refer to Figure 19As shown, the number of second pads 400b is M1, and the number of second conductive electronic connectors 622 is M2. M1 and M2 satisfy: M1=M2. That is, the number of second conductive electronic connectors 622 corresponds one-to-one with the number of second pads 400b. For example, five second pads 400b are used on one side of the first region 101, and five second conductive electronic connectors 622 are used on one side of the first region 101.

[0095] For details, please refer to Figure 21 As shown, the number of second pads 400b is M1, and the number of second conductive electronic connectors 622 is M2. M1 and M2 satisfy: M1 > M2, meaning that the number of second conductive electronic connectors 622 is less than the number of second pads 400b. For example, five second pads 400b are used on one side of the first region 101, and one second conductive electronic connector 622 is used on the other side of the first region 101. This demonstrates the versatility of the arrangement of the second conductive electronic connectors 622.

[0096] refer to Figure 19 and Figure 21 As shown, a second conductive electronic connection 622 is electrically connected to a second pad 400b; or, a second conductive electronic connection 622 is electrically connected to a plurality of second pads 400b.

[0097] For details, please refer to Figure 19 As shown, a second conductive electronic connection portion 622 is provided on the side of a second pad 400b away from the substrate 300, meaning that a second electronic connection portion 622 is electrically connected to a second pad 400b. Further, referring to Figure 18, a second conductive electronic connection portion 622 is provided on the side of a plurality of second pads 400b away from the substrate 300, meaning that a second conductive electronic connection portion 622 is electrically connected to a plurality of second pads 400b. This demonstrates the diversity of the arrangement of the second conductive electronic connection portion 622 relative to the second pads 400b.

[0098] Further reference Figure 21 Combination Figure 7As shown, if a second conductive electronic connection portion 622 in the display master 2 is electrically connected to multiple second pads 400b, it can be understood that during the preparation of the display master 2, the opening of the photoresist layer corresponding to the deposition of the second conductive electronic connection portion 622 is larger than the size of the second pad 400b. This can better ensure that the deposited conductive connection layer 900 covers the corresponding opening better, which is conducive to the formation of the second conductive electronic connection portion 622. This ensures the electrical connection effect between the pad 400 and the pixel electrode 200 through the conductive connection layer 900, and short-circuits the pixel electrode 200 and the pad 400 through the conductive connection layer 900. This can ensure that the potential difference between the pixel electrode 200 and the pad 400 is close, avoiding the static electricity generated due to the large potential difference from affecting the interior of the display panel, and ensuring the structural stability of the display panel during the preparation process.

[0099] It should be noted that the reference Figure 21 As shown, during the fabrication of the first conductive connection portion 610, to ensure the structural stability of the display panel, a second conductive connection portion 622 is electrically connected to multiple second pads 400b. After the first conductive connection portion 610 is fabricated, the second pads 400b in the display panel will subsequently be used to test some functions of the display panel. During the testing process, it is necessary to cut off one of the second conductive connection portions 622 by means of cutting or other methods to prevent the second conductive connection portion 622 from short-circuiting the multiple second pads 400b.

[0100] Based on the same inventive concept, embodiments of this application also provide a method for preparing a display master. Figure 22 This is a flowchart illustrating a method for preparing a display master according to an embodiment of this application. The preparation method includes:

[0101] S110, Provides a substrate.

[0102] The display master includes a substrate, on which multiple display panels are disposed. Multiple display panels can be fabricated by cutting the multiple display masters. It should be noted that when fabricating display panels using the display masters, multiple display panels are cut to form individual display panels. The substrate in the display master, after being cut, forms the substrate of the corresponding display panel.

[0103] Specifically, the display panel disposed on the display master includes a first area, in which multiple light-emitting elements are disposed to realize the display function of the display panel. Therefore, the first area can be understood as the light-emitting display area of ​​the display panel. Specifically, the display panel includes pixel electrodes in the first area, which are electrically connected to the light-emitting elements. The electrical signals driving the light-emitting elements to emit light are transmitted to the light-emitting elements through the pixel circuit, thus realizing the display function of the display panel. Further, the display panel also includes an array substrate on one side of the substrate. The array substrate is composed of multiple film layer structures stacked on top of each other, and the driving circuit for driving the light-emitting elements to emit light is disposed in the array substrate. The driving circuit includes at least one transistor; this application does not limit the specific type of the driving circuit. The driving circuit transmits the electrical signals driving the light-emitting elements to emit light to the light-emitting elements through the pixel electrodes.

[0104] The display panel also includes a second region that surrounds at least a portion of the first region. The relative positional relationship between the first and second regions can be adaptively adjusted according to different display panels, and this application does not impose specific limitations on this. Specifically, the second region can be understood as the border area surrounding the light-emitting display area in the display panel, where shift registers and driver chips, among other devices, can be configured.

[0105] Specifically, the display panel includes pads in the second region, with both the pads and pixel electrodes located on one side of the substrate. In this second region, an array substrate is also disposed on one side of the substrate, and some signal lines or bezel circuits are located within the array substrate (not detailed here). Therefore, the pads are also located on the side of the array substrate furthest from the substrate. The pads can be pads that provide signals to the circuit structures in the display panel, such as providing signals to driving circuits or other circuits. The pads can also be pads that provide test signals, enabling testing of the display panel (e.g., visual testing). This application does not limit the specific type of pad. For example, refer to... Figures 2 to 6 As shown in the illustration, the driver chip 700 provides signals to the driver circuit 2001 through the pad 400. Figure 2 and Figure 3 The example illustrates this by directly bonding the pad 400 to the driver chip 700. Figure 5 and Figure 6 The example illustrates how the pad 400 is electrically connected to the driver chip 700 via a side trace. In other embodiments, the pad 400 may also be bonded to a circuit board or other electrical components; this application does not specifically limit this. For details, refer to... Figure 3 and Figure 4As shown, the driver chip 700 in the display panel 10 is bonded to the pad 400 via the driver chip pad 710. Further, the signal lines in the display panel are used to transmit electrical signals, wherein the pad is connected to the signal lines in the display panel to realize the transmission of electrical signals. Specifically, the signal lines can be directly electrically connected to the pads, or the signal lines can be electrically connected to the pads through other electrical components. For example, the signal line 500 includes a first signal line 510 and a second signal line 520, wherein reference... Figure 2 As shown, the first signal line 510 is electrically connected to the pad 400 through the driver chip 700, reference... Figure 5 and Figure 6 As shown, the second signal line 520 is electrically connected to the pad 400, and the second signal line 520 is bent to the back of the display panel 10 and electrically connected to the driver chip 700. The back of the display panel 10 can be understood as the non-light-emitting side of the display panel 10.

[0106] S120, Prepare conductive connecting parts.

[0107] Furthermore, a conductive connection portion is fabricated. This conductive connection portion is conductive, and its placement can improve the electrical connection effect of the corresponding device. Specifically, the conductive connection portion includes a first conductive connection portion located between the pixel electrode and the light-emitting element. This first conductive connection portion ensures the electrical connection between the pixel electrode and the light-emitting element, guarantees the driving effect of the light-emitting element, and ensures the display effect of the display panel. Further, the conductive connection portion also includes a second conductive connection portion located on the side of the pad away from the substrate, and at least partially overlapping the pad along the thickness direction of the display panel. The inclusion of the second conductive connection portion improves the signal transmission effect in the pad, ensuring the bonding effect between the pad and the driving chip, and enhancing the reliability and stability of signal transmission in the display panel.

[0108] The first conductive connection portion and the second conductive connection portion are made of the same material, which can be understood as the first conductive connection portion and the second conductive connection portion being manufactured using the same process. The first conductive connection portion and the second conductive connection portion can be disposed in the same layer, which is beneficial to reducing the manufacturing cost of the display panel. The material of the conductive connection portion can include one or more of titanium, copper, molybdenum or silver, and this application does not specifically limit it.

[0109] In summary, this application provides a method for fabricating a display master, which includes multiple display panels. The fabrication process includes the preparation of conductive connections. A first conductive connection is located on the side of the pixel electrode furthest from the substrate, and the light-emitting element is electrically connected to the pixel electrode through the first conductive connection. A second conductive connection is located on the side of the pad furthest from the substrate, ensuring the electrical connection between the pad and other components. Therefore, by providing conductive connections, the structural stability of the display panel can be ensured, and the reliability of electrical signal transmission in the display panel can be improved, thereby enhancing the display effect. Furthermore, the first and second conductive connections are made of the same material. Therefore, during the fabrication of the display panel, the first and second conductive connections can be fabricated simultaneously using the same process, which helps reduce the manufacturing cost of the display panel.

[0110] Optional, Figure 23 This is a schematic flowchart of another method for preparing a display master provided in an embodiment of this application. The preparation method further includes:

[0111] S210, Provides a substrate.

[0112] refer to Figure 7 As shown in step a.

[0113] S220. Prepare a photoresist layer, wherein the photoresist layer is located on the side of the pixel electrode away from the substrate, and the photoresist layer is located on the side of the pad away from the substrate.

[0114] S230, etching the photoresist layer to form the first and second openings.

[0115] In this process, a photoresist layer is prepared, which covers the pixel electrode and the pad. Further, different openings are formed by etching the photoresist layer. Specifically, a first opening and a second opening are formed in the photoresist layer. The first opening exposes the pixel electrode, and the second opening exposes the pad.

[0116] refer to Figure 7 As shown in step b, a first opening 800a and a second opening 800b are prepared by etching the photoresist layer 800, wherein the first opening 800a exposes the pixel electrode 200 and the second opening 800b exposes the pad 400.

[0117] S240, provides a mask.

[0118] S250, Deposit a conductive interconnect layer on the side closest to the substrate using a photomask.

[0119] Furthermore, a photomask is provided on the side of the photoresist layer away from the substrate, and the photomask includes mask openings that expose the first opening and the second opening. A conductive interconnect layer is deposited onto the display master using the photomask, thereby fabricating the conductive interconnect.

[0120] For details, please refer to Figure 7 As shown in step c, a mask 810 is placed on the side of the photoresist layer 800 away from the substrate 1000, wherein the mask 810 includes mask openings that expose a first opening 800a and a second opening 800b. Further, a conductive interconnect layer 900 is deposited on the side of the mask 810 away from the substrate 1000. The conductive interconnect layer 900 is a full-surface film structure, including portions deposited at the first opening 800a and the second opening 800b, and also portions disposed on the side of the mask 810 away from the photoresist layer 800, so that the pixel electrode 200 and the pad 400 can be electrically connected through the conductive interconnect layer 900.

[0121] The pixel electrode 200 and the pad 400 are electrically connected through some circuit structures (such as the driving circuit 2001) disposed in the array substrate 2000. The first conductive connection portion 610 is provided to ensure the electrical connection between the pixel electrode 200 and the light-emitting element 300. Therefore, if only the first conductive connection portion 610 is fabricated, a large potential difference between the pixel electrode 200 and the pad 400 can easily lead to the generation of large static electricity, which can damage the circuit structures in the array substrate 2000, causing circuit failure and affecting the display function of the display panel 10. Furthermore, referring to... Figure 7 In step c, while preparing the first conductive connection portion 610, the second conductive connection portion 620 is also prepared. That is, the deposited conductive connection layer 900 is a continuous whole-surface structure, which can ensure that the pixel electrode 200, the conductive connection layer 900 and the pad 400 are a continuous conductive structure. This is equivalent to short-circuiting the pixel electrode 200 and the pad 400 through the conductive connection layer 900, thereby ensuring that the potential difference between the pixel electrode 200 and the pad 400 is close, and avoiding the static electricity generated due to the large potential difference from affecting the interior of the display panel 10.

[0122] Optional, see reference Figure 7 As shown in step c, the mask 810 can be grounded so that the static electricity generated during the deposition of the conductive interconnect layer 900 can be discharged in time through the mask 810, avoiding damage to the inside of the display panel and ensuring the structural stability and reliability of the display panel.

[0123] S260, Remove the mask and photoresist layer.

[0124] For details, please refer to Figure 7As shown in step d, the photoresist layer 800 and the mask 810 are removed, and the conductive connection layer 900 on the side of the mask 810 away from the substrate 1000 is also removed simultaneously, thereby retaining the first conductive connection portion 610 and the second conductive connection portion 620. The first conductive connection portion 610 is located on the side of the pixel electrode 200 away from the substrate 1000, and the second conductive connection portion 620 is located on the side of the pad 400 away from the substrate 1000. Thus, the first conductive connection portion 610 and the second conductive connection portion 620 are fabricated simultaneously in the same process, which can reduce the manufacturing cost of the display panel 10.

[0125] Obviously, the above embodiments of this application are merely examples for clear illustration and are not intended to limit the implementation of this application. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the scope of protection of this application. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of the claims of this application.

Claims

1. A display panel, characterized in that, Including Zone 1 and Zone 2, The first region includes a pixel electrode, which is located on one side of the substrate and is electrically connected to a light-emitting element; The second region includes a pad located on the same side of the substrate as the pixel electrode, and the pad is connected to a signal line; The conductive connection portion includes a first conductive connection portion and a second conductive connection portion. The first conductive connection portion is located on the side of the pixel electrode away from the substrate, and the pixel electrode is electrically connected to the light-emitting element through the first conductive connection portion. The second conductive connection is located on the side of the pad away from the substrate, along a direction perpendicular to the plane of the display panel, and the second conductive connection overlaps the pad at least partially; wherein the first conductive connection and the second conductive connection are made of the same material.

2. The display panel according to claim 1, characterized in that, The conductive connection portion further includes a third conductive connection portion located on one side of the substrate. The third conductive connection portion is located in the second region and is in a direction perpendicular to the plane of the display panel. The third conductive connection portion does not overlap with the second conductive connection portion.

3. The display panel according to claim 2, characterized in that, Within a unit area, the distribution density of the first conductive connection is P1, and the distribution density of the third conductive connection is P2, wherein |P1-P2| / P2≤0.

2.

4. The display panel according to claim 3, characterized in that, The orthographic projection area of ​​the first conductive connection on the substrate is S1, and the orthographic projection area of ​​the third conductive connection on the substrate is S2, wherein |S1-S2| / S2≤0.

2.

5. The display panel according to claim 3, characterized in that, Within a unit area, the number of the first conductive connection parts is N1, and the number of the third conductive connection parts is N2, wherein |N1-N2| / N2≤0.

2.

6. The display panel according to claim 3, characterized in that, Along the first direction, the distance between two adjacent first conductive connections is L1, and the distance between two adjacent third conductive connections is L2, wherein |L1-L2| / L2≤0.2; the first direction is parallel to the plane where the display panel is located.

7. The display panel according to claim 2, characterized in that, Within a unit area, the distribution density of the second conductive connection is P3, and within a unit area, the distribution density of the third conductive connection is P2, wherein |P3-P2| / P2≤0.

2.

8. The display panel according to claim 7, characterized in that, The projected area of ​​the second conductive connection on the substrate is S3, and the projected area of ​​the third conductive connection on the substrate is S2, wherein |S3-S2| / S2≤0.

2.

9. The display panel according to claim 7, characterized in that, Within a unit area, the number of the second conductive connection is N3, and the number of the third conductive connection is N2, wherein |N3-N2| / N2≤0.

2.

10. The display panel according to claim 7, characterized in that, Along the first direction, the distance between two adjacent second conductive connections is L3, and the distance between two adjacent third conductive connections is L2, wherein |L3-L2| / L2≤0.2; the first direction is parallel to the plane where the display panel is located.

11. The display panel according to claim 1, characterized in that, The number of pads is the same as the number of second conductive connections, and one second conductive connection is provided on the side of each pad away from the substrate.

12. The display panel according to claim 11, characterized in that, The projected area of ​​the pad on the substrate is greater than or equal to the projected area of ​​the second conductive connection on the substrate.

13. The display panel according to claim 12, characterized in that, The orthographic projection of the center of the pad on the substrate coincides with the orthographic projection of the center of the second conductive connection portion on the substrate.

14. A display device, characterized in that, Includes the display panel as described in any one of claims 1-13.

15. A display master, characterized in that, The display master includes a plurality of display panels as described in any one of claims 1-13; the display master also includes a substrate, and the plurality of display panels are located on one side of the substrate.

16. The display master according to claim 15, characterized in that, The second area includes a binding area and a detection area; The pad includes a first pad and a second pad, the first pad being located in the binding area and the second pad being located in the detection area; The second conductive connection portion includes a first conductive connection portion and a second conductive connection portion. The first conductive connection portion is located on the side of the first pad away from the substrate, and the second conductive connection portion is located on the side of the second pad away from the substrate.

17. The display master according to claim 16, characterized in that, The number of the second pads is M1, and the number of the second conductive electronic connections is M2; wherein, M1 ≥ M2.

18. The display master according to claim 17, characterized in that, One of the second conductive contacts is electrically connected to one of the second pads; or, one of the second conductive contacts is electrically connected to a plurality of the second pads.

19. A method for preparing a display master, characterized in that, The method for preparing the display master according to any one of claims 15-18 comprises: A substrate is provided; a plurality of display panels are located on one side of the substrate; each display panel includes a first region and a second region, the first region including a pixel electrode located on one side of the substrate and electrically connected to a light-emitting element; the second region including a pad located on the same side of the substrate as the pixel electrode and connected to a signal line. A conductive connection portion is prepared; the conductive connection portion includes a first conductive connection portion and a second conductive connection portion, the first conductive connection portion is located on the side of the pixel electrode away from the substrate, and the pixel electrode is electrically connected to the light-emitting element through the first conductive connection portion; the second conductive connection portion is located on the side of the pad away from the substrate, along a direction perpendicular to the plane of the display panel, and the second conductive connection portion at least partially overlaps the pad; wherein, the first conductive connection portion and the second conductive connection portion are prepared simultaneously and include the same material.

20. The preparation method according to claim 19, characterized in that, The fabrication of the conductive connection includes: A photoresist layer is prepared, wherein the photoresist layer is located on the side of the pixel electrode away from the substrate, and the photoresist layer is located on the side of the pad away from the substrate. The photoresist layer is etched to form a first opening and a second opening; along a direction perpendicular to the plane of the display panel, the first opening at least partially overlaps with the pixel electrode, and the second opening at least partially overlaps with the pad; A photomask is provided; the photomask includes a photomask opening that exposes the first opening and the second opening; A conductive connection layer is deposited on the side closer to the substrate through the mask; the conductive connection layer is deposited at least at the first opening to form a first conductive connection portion, and the conductive connection layer is deposited at least at the second opening to form a second conductive connection portion, wherein the first conductive connection portion and the second conductive connection portion are electrically connected; Remove the mask and the photoresist layer.

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