Display device

Abstract

A display device is provided. The display device includes an active area and a non-active area. The display device includes a display panel and a polarizing member disposed on a surface of the display panel, in which the display panel and the polarizing member include a first through hole penetrating the display panel and the polarizing member in a thickness direction and a hole coating disposed on an inner wall of the first through hole in the polarizing member.

Description

[0001] This application is a divisional application of the patent application filed on March 30, 2020, with application number 202010236088.2 and title "Display Device". Technical Field

[0002] Exemplary embodiments of the invention relate to a display device. Background Technology

[0003] Electronic devices that provide images to users (such as smartphones, tablet PCs, digital cameras, laptops, navigation devices, and smart TVs) include display devices for displaying images.

[0004] Display devices include a display panel and components for driving the display panel. Recently, components for realizing various functions beyond screen display have also been added to display devices. An example of such a display device is a smartphone equipped with optical elements such as a camera and an infrared sensor.

[0005] Display devices may include optical apertures for receiving light from optical elements. To improve the transmittance of the optical aperture, some components of the display device are physically penetrated. The area around the physically penetrated aperture may be exposed to external air, such as moisture. Summary of the Invention

[0006] Among the components that make up a display device, there are components that deteriorate when exposed to moisture. For example, when moisture penetrates into the polarizing film, the polarizing film shrinks. This shrinkage of the polarizing film can lead to appearance defects.

[0007] An exemplary embodiment of the invention provides a display device capable of preventing moisture from penetrating through through-holes.

[0008] However, exemplary embodiments of the invention are not limited to those set forth herein. The above and other exemplary embodiments of the invention will become more apparent to those skilled in the art by referring to the detailed description of the invention given below.

[0009] An exemplary embodiment of the display device includes an effective area and an ineffective area, and the display device includes a display panel and a polarizing member disposed on a first surface of the display panel, wherein a first through hole penetrating the display panel and the polarizing member in the thickness direction is defined in the display panel and the polarizing member, and the display panel and the polarizing member include a hole coating disposed on the inner wall of the first through hole in the polarizing member.

[0010] An exemplary embodiment of the display device includes a hole region disposed within an effective region, and the display device includes: a display panel including a flexible substrate, an active element layer disposed on the flexible substrate and including a light-emitting element, and a thin film encapsulation layer disposed on the active element layer; a polarization bonding layer disposed on the thin film encapsulation layer of the display panel; a polarization film disposed on the polarization bonding layer; a transparent bonding layer disposed on the polarization film; and a window member disposed on the transparent bonding layer and including a window substrate and a printed layer disposed on the window substrate; wherein a first through-hole penetrating the flexible substrate, the active element layer, the thin film encapsulation layer, the polarization bonding layer, and the polarization film in the thickness direction is defined in the hole region, and the hole region includes a hole coating disposed on the inner wall of the first through-hole; a second through-hole penetrating the transparent bonding layer in the thickness direction and superimposed on the first through-hole is defined in the hole region; an optical hole is defined by the printed layer and the optical hole is superimposed on the first through-hole and the second through-hole.

[0011] In an exemplary embodiment of the display device, a perforated coating is used to cover the through-holes to prevent moisture from penetrating towards the polarizing member through the through-holes. Therefore, shrinkage defects and resulting appearance defects in the polarizing member due to exposure to moisture can be prevented.

[0012] However, the effects of the exemplary embodiments are not limited to those set forth herein. The above and other effects of the exemplary embodiments will become more apparent to those skilled in the art upon which they pertain by referring to the claims.

[0013] Other features of the exemplary embodiments may become apparent from the claims and the following detailed description and drawings. Attached Figure Description

[0014] These and / or other exemplary embodiments will become apparent and more readily understood from the following description of exemplary embodiments in conjunction with the accompanying drawings, in which: Figure 1 This is a plan view of an exemplary embodiment of the display device; Figure 2 This is a schematic cross-sectional view around an exemplary embodiment of the curved area of ​​the display device; Figure 3 This is a cross-sectional view around an exemplary embodiment of the hole area of ​​the display device; Figure 4 It is a plan view showing the planar positional relationship between components around the hole area; Figure 5 This is a circuit diagram of an exemplary embodiment of a pixel of a display device; Figure 6 This is a cross-sectional view of an exemplary embodiment of a pixel of a display device; Figure 7 Is Figure 6A cross-sectional view of the area around the hole in the display device; Figures 8 to 11 This is a cross-sectional view illustrating an exemplary embodiment of the steps of a method for manufacturing a display device; Figure 12 This is a cross-sectional view around an exemplary embodiment of the hole area of ​​the display device; Figure 13 This is a cross-sectional view around an exemplary embodiment of the hole area of ​​the display device; Figure 14 and Figure 15 A cross-sectional view of an exemplary embodiment of the hole region of the display device; and Figure 16 This is a cross-sectional view around an exemplary embodiment of the hole area of ​​the display device. Detailed Implementation

[0015] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0016] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or there may be an intermediate layer. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element.

[0017] Although the terms “first,” “second,” etc., are used herein to describe various elements, these elements should not be limited by these terms. These terms can be used to distinguish one element from another. Therefore, without departing from the teachings of one or more embodiments, a first element discussed below may be designated as a second element. Describing an element as a “first” element does not require or imply the existence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish elements of different classes or groups. For simplicity, the terms “first,” “second,” etc., may respectively represent “first class (or first group),” “second class (or second group),” etc.

[0018] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms (including “at least one of…”). “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that the terms “comprising” and variations thereof and / or “including” and variations thereof, when used in this specification, indicate the presence of the stated features, regions, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integrals, steps, operations, elements, components, and / or groups thereof.

[0019] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that relative terms are also intended to encompass different orientations of the device beyond those depicted in the drawings. For example, if the device in one of the drawings is flipped, an element described as being “below” the other element will subsequently be positioned “above” the other element. Thus, based on a specific orientation in the drawings, the exemplary term “below” can encompass both “above” and “below” orientations. Similarly, if the device in one of the drawings is flipped, an element described as being “below” or “under” the other element will subsequently be positioned “above” the other element. Thus, the exemplary terms “below” or “under” can encompass both “above” and “below” orientations.

[0020] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up,” etc., are used herein to describe the relationship between one element or feature as shown in the accompanying drawings and another (additional) element or feature. The device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0021] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, the terms “about” or “approximately” include the stated value and indicate an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0022] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their context in the relevant field and their meaning in this disclosure, and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0023] Exemplary embodiments are described herein with reference to cross-sectional views as an idealized embodiment. Thus, variations in the shape of the illustrated areas will be expected, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but will include deviations in shape due to, for example, manufacturing processes. For example, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the areas shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0024] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the disclosed preferred embodiments of the invention are used only in a general and descriptive sense, and not for purposes of limitation.

[0025] In the following description, specific embodiments will be illustrated with reference to the accompanying drawings.

[0026] Figure 1This is a plan view of an exemplary embodiment of the display device 1. In the exemplary embodiment, the first direction DR1 and the second direction DR2 are different directions that intersect each other, for example, directions that intersect perpendicularly in the plan view. The third direction DR3 is a direction that intersects with the plane in which the first direction DR1 and the second direction DR2 are located, for example, a direction that intersects perpendicularly with both the first direction DR1 and the second direction DR2. In the figures, the first direction DR1 represents the vertical direction of the display device 1, the second direction DR2 represents the horizontal direction of the display device 1, and the third direction DR3 represents the thickness direction of the display device 1. In the following embodiments, in the plan view, one side of the first direction DR1 points upward, and the other side of the first direction DR1 points downward; in the plan view, one side of the second direction DR2 points to the right, and the other side of the second direction DR2 points to the left; in the cross-sectional view, one side of the third direction DR3 points upward, and the other side of the third direction DR3 points downward. However, the directions mentioned in the exemplary embodiments should be understood as relative directions, and the exemplary embodiments are not limited to the mentioned directions.

[0027] Reference Figure 1 The display device 1 displays moving or still images. The display orientation of the main screen can be on one side of the third-direction DR3 (e.g., a top-emitting display device), but it can also be on the other side of the third-direction DR3 (e.g., a bottom-emitting display device), or both on one side and the other side of the third-direction DR3 (e.g., a dual-sided emitting display device or a transparent display device).

[0028] Display device 1 can refer to any electronic device that provides a display screen. Examples of display device 1 may include portable electronic devices that provide a display screen, such as mobile phones, smartphones, tablet personal computers (“PCs”), electronic watches, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (“PMPs”), navigation devices, game consoles, and digital cameras, as well as televisions, laptops, monitors, billboards, and the Internet of Things.

[0029] Display device 1 includes an effective area AAR and an ineffective area NAR. In display device 1, the portion where an image is displayed can be defined as the display area, and the portion where no image is displayed can be defined as the non-display area. In this case, the display area can be included in the effective area AAR. When display device 1 has a touch function, the touch area where touch input is sensed can also be included in the effective area AAR. The display area and the touch area can be superimposed on each other. That is, the effective area AAR can be the area that displays an image and senses touch input.

[0030] The effective region AAR can include multiple pixels PX. Pixels PX can be arranged along the matrix direction. In a planar view (i.e., viewed from above), each pixel PX can be rectangular or square. However, the planar shape of each pixel PX is not limited to the above example, but can also have various other shapes, such as a rhombus shape including each side inclined relative to the first direction DR1. Each pixel PX can include a light-emitting region EMA (see reference). Figure 6 ) and non-luminescent region NEM (reference) Figure 6 The non-luminescent region NEM can be set to a lattice shape or a grid shape in a planar view, and can surround the luminescent region EMA.

[0031] The effective area AAR can be rectangular or a rectangle with rounded corners. The effective area AAR shown in the figure is rectangular, including rounded corners, and is longer in the first direction DR1 than in the second direction DR2. However, the shape of the effective area AAR is not limited to this shape; the effective area AAR can have various shapes, such as a rectangle, a square or other polygon, a circle, and an ellipse, which are longer in the second direction DR2 than in the first direction DR1.

[0032] The non-valid area NAR is set around the valid area AAR. The non-valid area NAR can be a border area. The non-valid area NAR can be superimposed on the printed layer 22 of the window component 20, which will be described later.

[0033] The non-effective region NAR can surround all sides of the effective region AAR (the four sides in the figures). However, the invention is not limited to this. In an exemplary embodiment, for example, the non-effective region NAR may not be positioned around the upper side of the effective region AAR.

[0034] In the non-active area NAR, signal wiring or drive circuitry for transmitting signals to the active area AAR (display area or touch area) can be provided. The non-active area NAR may not include a display area. Furthermore, the non-active area NAR may not include a touch area. In an exemplary embodiment, the non-active area NAR may include a portion of the touch area, and a sensor component, such as a pressure sensor, may be disposed in that portion. In some exemplary embodiments, the active area AAR may be identical to the display area displaying an image, and the non-active area NAR may be identical to a non-display area not displaying an image.

[0035] The display device 1 may also include a hole region HLA having at least one hole HLE. The hole region HLA will be described in detail later.

[0036] Figure 2 This is a schematic cross-sectional view around an exemplary embodiment of the curved region BR of the display device 1. Figure 2A cross-section of the display device 1 is shown schematically, and will be referred to later. Figure 6 A detailed cross-sectional structure of display device 1 is described in detail.

[0037] Reference Figure 1 and Figure 2 The display device 1 includes a display panel 10 that provides a display screen. Examples of the display panel 10 include organic light-emitting display panels, micro light-emitting diode (“LED”) display panels, nano LED display panels, quantum dot light-emitting display panels, liquid crystal display panels, plasma display panels, field emission display panels, electrophoretic display panels, and electrowetting display panels. The following describes an example of using an organic light-emitting display panel as the display panel 10, but the invention is not limited to this; other display panels can also be used, provided the same technical spirit applies.

[0038] The display device 1 may also include a touch component for sensing touch input. As illustrated in the embodiments below, the touch component may be integrated into the display panel 10 in the form of a touch layer (TSP). However, the invention is not limited to this, and the touch component may also be configured as a component separate from the display panel 10 in the form of a touch panel or touch film, and then attached to the display panel 10.

[0039] In an exemplary embodiment, the display panel 10 may include a flexible substrate 100, which includes a flexible polymer material such as polyimide. Therefore, the display panel 10 may be deformable, for example, bendable, foldable, or rollable.

[0040] The display panel 10 may include a curved region BR in which the display panel 10 bends. The display panel 10 may be divided into a main region MR located on one side of the curved region BR and a sub-region SR located on the other side of the curved region BR.

[0041] The display area of ​​the display panel 10 is disposed in the main region MR. In an exemplary embodiment, the edge portion surrounding the display area in the main region MR, the entire curved region BR, and the entire sub-region SR may be non-display areas. However, the curved region BR and / or the sub-region SR may also include display areas.

[0042] The shape of the main region MR can be substantially similar to the planar shape of the display device 1. The main region MR can be a flat area located in a plane. However, the invention is not limited to this case, and at least one of the edges of the main region MR other than the edge (side) connected to the curved region BR can also be curved or can be vertically curved.

[0043] If at least one of the edges of the main region MR, excluding the edge (side) connected to the curved region BR, is bent or curved, the display area may also be located at the bent or curved edge. However, the invention is not limited to this case; the bent or curved edge may also be a non-display area where no image is displayed, or may include a combination of display and non-display areas.

[0044] The active element layer ATL, the thin-film encapsulation layer 190, and the touch layer TSP can be disposed on one surface of the substrate 100 in the main region MR. Figure 2 For ease of description, the active element layer ATL, the thin-film encapsulation layer 190, and the touch layer TSP are schematically shown. (Refer to later...) Figure 6 To describe the more detailed cross-sectional structure of these components.

[0045] The active element layer ATL may include a light-emitting element and a thin-film transistor (“TFT”) for driving the light-emitting element. A thin-film encapsulation layer 190 may cover the active element layer ATL to prevent it from being exposed to moisture or air. A touch layer TSP may be disposed on the thin-film encapsulation layer 190. The touch layer TSP may include a plurality of touch electrodes. The touch electrodes may be configured in a grid shape. In another exemplary embodiment, the touch layer TSP may be omitted.

[0046] The display device 1 may further include a polarizing member POL disposed on the display panel 10. The polarizing member POL polarizes light passing through it. The polarizing member POL can reduce the reflection of external light. The polarizing member POL can be attached to the touch layer TSP through a polarizing bonding layer PLA. When the touch layer TSP is omitted, the polarizing member POL can be attached to the thin film encapsulation layer 190.

[0047] The polarizing element POL can be disposed in the main region MR, and in some cases, the polarizing element POL can also be disposed in the curved region BR or the sub-region SR. In another exemplary embodiment, the polarizing element POL can be omitted.

[0048] Although not shown, a cover panel may be disposed on another surface of the substrate 100. In an exemplary embodiment, the cover panel may include, for example, a heat dissipation layer, a pad, etc.

[0049] The curved region BR connects to the other side of the main region MR in the first direction DR1. In an exemplary embodiment, for example, the curved region BR may connect to the lower short side of the main region MR. The width of the curved region BR may be smaller than the width of the short side of the main region MR. The connection portion between the main region MR and the curved region BR may have an L-shaped cutout.

[0050] In the curved region BR, the display panel 10 can be bent with a certain curvature toward the other side on the third direction DR3. The curved region BR can have a constant radius of curvature. However, the invention is not limited to this, and the curved region BR can also have different radii of curvature in each section. When the display panel 10 is bent in the curved region BR, the surface of the display panel 10 can be flipped. That is, the upward-facing surface of the display panel 10 can be changed to face outward through the curved region BR and then downward.

[0051] A bend protection layer BPL can be provided in the bend region BR. The bend protection layer BPL can be provided on one surface of the substrate 100. The bend protection layer BPL can include, for example, a resin for protecting the bend region BR. The bend protection layer BPL can be configured to be superimposed not only on the bend region BR, but also on a portion of the main region MR and a portion of the sub-region SR adjacent to the bend region BR.

[0052] The sub-region SR extends from the curved region BR. After the bending is completed, the sub-region SR may extend parallel to the main region MR. The sub-region SR may be superimposed on the main region MR in the third direction DR3 (i.e., in the thickness direction of the display panel 10). The width of the sub-region SR (in the second direction DR2) may (but is not required to) be the same as the width of the curved region BR.

[0053] A driver chip IC can be located in the sub-region SR. The driver chip IC may include an integrated circuit for driving the display panel 10. The integrated circuit may include an integrated circuit for the display and / or an integrated circuit for the touch component. The integrated circuit for the display and the integrated circuit for the touch component may be set as separate chips or may be integrated into a single chip. The driver chip IC may be located on the driving substrate FPC or on another external printed circuit board (“PCB”) connected to the driving substrate FPC.

[0054] A pad (also known as a solder pad) portion may be disposed at the end of a sub-region SR of the display panel 10. The pad portion may include multiple display signal routing pads and multiple touch signal routing pads. A driving substrate FPC may be connected to the pad portion at the end of the sub-region SR of the display panel 10. The driving substrate FPC may be a flexible PCB ("FPCB") or a film.

[0055] The display panel 10 may further include a first protective film PF1 and a second protective film PF2 disposed in an overlapping region between the main region MR and the sub-region SR. In an exemplary embodiment, for example, the first protective film PF1 may be attached to another surface of the substrate 100 in the main region MR, and the second protective film PF2 may be attached to another surface of the substrate 100 in the sub-region SR. The first protective film PF1 and the second protective film PF2 may face each other and may be bonded together by a bonding layer PSA such as an adhesive or glue. Therefore, the mechanical stability of the curved structure can be improved.

[0056] The display device 1 may also include a window member 20. The window member 20 may cover and protect the display panel 10. The window member 20 may be attached to the surface of the display panel 10 by means of a transparent bonding layer 30 comprising an optically transparent adhesive or an optically transparent resin. When the display device 1 includes a polarizing member POL, the window member 20 may be attached to the surface of the polarizing member POL.

[0057] The window component 20 may include a window base 21 and a printed layer 22 disposed on the window base 21.

[0058] The window substrate 21 may include a transparent material. In an exemplary embodiment, the window substrate 21 may include, for example, glass or plastic. When the window substrate 21 includes plastic, the window substrate 21 may have flexible properties.

[0059] Examples of plastics suitable for the window substrate 21 include, but are not limited to, polyimide, polyacrylate, polymethyl methacrylate (“PMMA”), polycarbonate (“PC”), polyethylene naphthalate (“PEN”), polyvinylidene chloride, polyvinylidene fluoride (“PVDF”), polystyrene, ethylene vinyl alcohol copolymer, polyethersulfone (“PES”), polyetherimide (“PEI”), polyphenylene sulfide (“PPS”), polyallyl compounds, cellulose triacetate (“TAC”), and cellulose acetate propionate (“CAP”).

[0060] The planar shape of the window base 21 corresponds to the shape of the display device 1 on which the window base 21 is applied. In an exemplary embodiment, for example, when the display device 1 is substantially rectangular in a plan view, the window base 21 may also be substantially rectangular. In another exemplary embodiment, when the display device 1 is circular, the window base 21 may also be circular.

[0061] In the plan view, the window base 21 may be larger than the display panel 10, and the side surfaces of the window base 21 may protrude from the side surfaces of the display panel 10. The window base 21 may protrude outward from all sides of the display panel 10 (the four sides in the attached figure).

[0062] Printed layer 22 can be disposed on window substrate 21. Printed layer 22 can be disposed on one surface and / or another surface of window substrate 21. Printed layer 22 can be disposed on the edge portion of window substrate 21 and can be disposed in the non-functional area NAR. In addition, printed layer 22 can be disposed in the hole area HLA. For aesthetic purposes, printed layer 22 can be a light-shielding layer or a decorative layer.

[0063] The hole area HLA of the display device 1 will now be described in detail.

[0064] Figure 3 This is a cross-sectional view around an exemplary embodiment of the hole region HLA of the display device 1. Figure 4 It is a planar diagram showing the planar positional relationship between components around the hole region HLA.

[0065] Reference Figures 1 to 4 The hole area HLA can be disposed on one side of the display device 1 in the first direction DR1. The hole area HLA itself can be a non-active area NAR in which display and / or touch are not performed. The hole area HLA can be disposed within the active area AAR. That is, the hole area HLA can be as follows: Figure 1 The example shown is surrounded by the effective region AAR. In another example, the aperture region HLA can be surrounded by the ineffective region NAR, or the aperture region HLA can be positioned around the boundary between the effective region AAR and the ineffective region NAR, such that part of the aperture region HLA is surrounded by the effective region AAR and another part is surrounded by the ineffective region NAR.

[0066] In a planar drawing, the hole region HLA can resemble a circle, ellipse, dumbbell, or rectangle with a convex short side. However, the shape of the hole region HLA is not limited to these examples and can be varied into various shapes, such as rectangles, squares, and other polygons.

[0067] At least one aperture HLE may be defined within an aperture region HLA. In an exemplary embodiment, the aperture HLE may be, for example, circular or elliptical.

[0068] The aperture HLE may include a physically penetrating through-hole HLE_TH. The through-hole HLE_TH may include a first through-hole HLE_TH1 that physically penetrates the display panel 10 and the polarizing member POL. Additionally, the through-hole HLE_TH may also include a second through-hole HLE_TH2 that penetrates the transparent bonding layer 30. Removing the above components from the through-hole HLE_TH can improve the light transmittance in that area.

[0069] The second through-hole HLE_TH2 of the transparent bonding layer 30 can be completely superimposed on the first through-hole HLE_TH1. The inner diameter of the second through-hole HLE_TH2 can be smaller than the inner diameter of the first through-hole HLE_TH1 in the laminate of the display panel 10 and the polarizing member POL. In plan view, the second through-hole HLE_TH2 can be located inside the first through-hole HLE_TH1. The inner wall of the second through-hole HLE_TH2 can protrude inward from the inner wall of the first through-hole HLE_TH1. Furthermore, the inner wall of the second through-hole HLE_TH2 can protrude inward from the hole coating HCVB, which will be described later. However, the invention is not limited to this. The second through-hole HLE_TH2 of the transparent bonding layer 30 can also have the same inner diameter as the first through-hole HLE_TH1, and the inner wall of the second through-hole HLE_TH2 can also be aligned with the inner wall of the first through-hole HLE_TH1. In addition, a portion of the second through-hole HLE_TH2 of the transparent bonding layer 30 can be located outside the first through-hole HLE_TH1.

[0070] Window member 20 is not physically penetrated in the area overlapping with the through hole HLE_TH. Because the window base 21 of window member 20 itself has high light transmittance, high light transmittance can be maintained even though window member 20 is not penetrated. Furthermore, since window member 20 physically covers the area overlapping with the through hole HLE_TH without being penetrated, it can protect the components disposed below window member 20.

[0071] In addition to the through-hole HLE_TH, an optical hole HLE_OP, serving as an optical light-transmitting window, can also be defined within the hole region HLA. The optical hole HLE_OP can be superimposed on the through-hole HLE_TH and can be defined by the pattern of the printed layer 22 of the window member 20. The printed layer 22 can be disposed within a portion of the hole region HLA to prevent light from the pixel PX from being output through the through-hole HLE_TH (e.g., light leakage). The printed layer 22 can extend to the outer periphery of the hole region HLA, but the invention is not limited to this.

[0072] A printed layer 22 is disposed around the via HLE_TH and exposes at least a portion of the via HLE_TH. The area of ​​the via HLE_TH exposed by the printed layer 22 can be an optical aperture HLE_OP through which light is transmitted. In an exemplary embodiment, the printed layer 22 of the aperture region HLA can be stacked with a portion of the via HLE_TH. That is, the inner surface of the printed layer 22 can protrude inward from the inner wall of the via HLE_TH.

[0073] When the via HLE_TH is circular in the plan view, the area where the via HLE_TH and the printed layer 22 overlap each other can be annular. However, the invention is not limited to this case, and the inner wall of the printed layer 22 of the via region HLA can also be aligned with the inner wall of the via HLE_TH with the smallest radius, or it can be located outside the inner wall of the via HLE_TH, so that the via HLE_TH and the printed layer 22 do not overlap each other. Even when the inner wall of the printed layer 22 of the via region HLA is located outside the inner wall of the via HLE_TH, light leakage through this area can be prevented when a light-shielding coating is applied to the inner wall of the via HLE_TH.

[0074] The display device 1 may further include an optical element OPS comprising a light-receiving portion. Examples of the optical element OPS including a light-receiving portion may include a camera, a lens (condenser lens, light guide lens, etc.), and optical sensors such as infrared sensors, iris recognition sensors, and illuminance sensors. The optical element OPS may be disposed on the other side surface of the display panel 10 to overlap with the aperture region HLA. At least a portion of the light-receiving portion of the optical element OPS may be located inside the optical aperture HLE_OP. Light from outside the display device 1 can pass through the window substrate 21 surrounded by the printed layer 22 and enter the light-receiving portion through the through-hole HLE_TH disposed below the window substrate 21. As described above, when the window substrate 21 has high light transmittance, external light can reach the light-receiving portion of the optical element OPS through the above optical path without significant loss.

[0075] A hole coating HCVB (or hole cover layer) can be applied to the inner wall of the first through-hole HLE_TH1 in the hole region HLA. The hole coating HCVB can cover the entire inner wall of the first through-hole HLE_TH1 of the display panel 10 and the polarizing member POL. The hole coating HCVB can be stacked with the printed layer 22, and the inner surface of the printed layer 22 can protrude inward from the hole coating HCVB.

[0076] The HCVB (Hyperpore Coating) can comprise a resin that is water-resistant and chemical-resistant. When moisture permeates into the polarizing member POL, the polarizing member POL discolors, and localized shrinkage defects appear around the first through-hole HLE_TH1. Therefore, appearance defects are detected throughout the entire hole area HLA. However, as in the exemplary embodiment, when the water-resistant and chemical-resistant HCVB is disposed on the inner wall of the first through-hole HLE_TH1, it can block the path through which moisture can permeate into the polarizing member POL. Therefore, the aforementioned defects in the hole area HLA can be prevented. Furthermore, since the HCVB blocks moisture and the like from permeating into the display panel 10 through the first through-hole HLE_TH1, the organic layer (organic light-emitting layer) of the display panel 10 can be prevented from deteriorating due to moisture. The HCVB may not be disposed on the inner wall of the second through-hole HLE_TH2.

[0077] The HCVB (Hole Coating HCVB) can include a black resin containing a black dye or black pigment. When the HCVB includes a black resin, it can prevent light leakage through the hole region HLA. Furthermore, even if the inner wall of the first through-hole HLE_TH1 is not completely covered by the printed layer 22 of the hole region HLA due to alignment errors or according to the intended design, it can effectively block light leakage through the first through-hole HLE_TH1.

[0078] In an exemplary embodiment, the HCVB orifice coating can have a uniform thickness along the outer circumference of the first through-hole HLE_TH1. Additionally, the HCVB orifice coating can have a uniform thickness in the thickness direction.

[0079] Next, the pixel circuit and detailed cross-sectional structure of the above-described display device 1 will be described.

[0080] Figure 5 This is a circuit diagram of an exemplary embodiment of a pixel PX of the display device 1.

[0081] Reference Figure 5 The pixel circuit may include a first transistor TR1, a second transistor TR2, a capacitor Cst, and an organic light-emitting diode (OLED). Each pixel circuit is connected to a scan line SL, a data line DL, and a first power supply voltage line ELVDDL.

[0082] The first transistor TR1 can be a driving transistor, and the second transistor TR2 can be a switching transistor. Although both the first transistor TR1 and the second transistor TR2 are p-channel metal-oxide-semiconductor (“PMOS”) transistors in the figures, either the first transistor TR1 or the second transistor TR2, or both the first transistor TR1 and the second transistor TR2, can also be n-channel metal-oxide-semiconductor (NMOS) transistors.

[0083] The first electrode (source electrode) of the first transistor TR1 is connected to the first power supply voltage line ELVDDL, and the second electrode (drain electrode) of the first transistor TR1 is connected to the anode of the organic light-emitting diode (OLED). The first electrode (source electrode) of the second transistor TR2 is connected to the data line DL, and the second electrode (drain electrode) of the second transistor TR2 is connected to the gate electrode of the first transistor TR1. A capacitor Cst is connected between the gate electrode and the first electrode of the first transistor TR1. The cathode of the OLED receives a second power supply voltage ELVSS. The second power supply voltage ELVSS may be lower than the first power supply voltage ELVDD provided by the first power supply voltage line ELVDDL.

[0084] The second transistor TR2 can output a data signal transmitted to the data line DL in response to the scan signal transmitted to the scan line SL. The capacitor Cst can be charged with a voltage corresponding to the data signal received from the second transistor TR2. The first transistor TR1 can control the driving current flowing through the organic light-emitting diode (OLED) based on the amount of charge stored in the capacitor Cst.

[0085] Figure 5 The equivalent circuit is just one example, and pixel circuits can also include a greater number of transistors (e.g., seven transistors) and capacitors.

[0086] Figure 6 This is a cross-sectional view of an exemplary embodiment of a pixel PX of the display device 1.

[0087] Reference Figure 6 The thin-film element layer of the display panel 10 of the display device 1 may include a substrate 100, a buffer layer 105, a semiconductor layer 110, a first insulating layer 121, a first gate conductive layer 130, a second insulating layer 122, a second gate conductive layer 140, a third insulating layer 123, a data conductive layer 150, a fourth insulating layer 124, an anode 160, a dam layer 126 including an opening exposing the anode 160, a light-emitting layer 170 disposed in the opening of the dam layer 126, and a cathode 180 disposed on the light-emitting layer 170 and the dam layer 126. Each of the above layers may be a single layer or a stack of multiple layers. Additional layers may also be disposed between the above layers.

[0088] Substrate 100 supports each layer disposed on substrate 100. Substrate 100 may include an insulating material such as a polymeric resin. In an exemplary embodiment, the polymeric material may be, for example, polyethersulfone (“PES”), polyacrylate (“PA”), polyarylate (“PAR”), polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethylene terephthalate (“PET”), polyphenylene sulfide (“PPS”), polyallylated compounds, polyimide (“PI”), polycarbonate (“PC”), cellulose triacetate (“TAC”), cellulose acetate propionate (“CAP”), or combinations thereof. In an exemplary embodiment, substrate 100 may also include inorganic materials such as glass or quartz.

[0089] In an exemplary embodiment, substrate 100 may include a plurality of sub-substrates 101 and 102. In an exemplary embodiment, substrate 100 may include, for example, a first sub-substrate 101 and a second sub-substrate 102 stacked in the thickness direction. Each of the first sub-substrate 101 and the second sub-substrate 102 may be a flexible substrate comprising, for example, polyimide. Substrate 100 may also include a barrier layer 103 disposed between the first sub-substrate 101 and the second sub-substrate 102. In an exemplary embodiment, barrier layer 103 may include, for example, silicon nitride, silicon oxide, or silicon oxynitride. Although not shown, the barrier layer may also be disposed on the second sub-substrate 102.

[0090] A buffer layer 105 is disposed on the substrate 100. In an exemplary embodiment, the buffer layer 105 may include, for example, silicon nitride, silicon oxide, or silicon oxynitride.

[0091] A semiconductor layer 110 is disposed on the buffer layer 105. The semiconductor layer 110 forms the channel of the TFT of the pixel PX. The semiconductor layer 110 may include polycrystalline silicon. However, the material of the semiconductor layer 110 is not limited to polycrystalline silicon, and the semiconductor layer 110 may also include monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor. Examples of oxide semiconductors may include binary compounds (ABs) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), ternary compounds (AB) x C y ) and quaternary compounds (AB) x C y D z ).

[0092] A first insulating layer 121 is disposed on the semiconductor layer 110. The first insulating layer 121 may be a gate insulating film with gate insulation function. The first insulating layer 121 may include silicon compounds, metal oxides, etc. In an exemplary embodiment, the first insulating layer 121 may include, for example, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0093] A first gate conductive layer 130 is disposed on a first insulating layer 121. The first gate conductive layer 130 may include the gate electrode GAT of the TFT of the pixel PX, a scan line connected to the gate electrode GAT, and a first electrode CE1 of the storage capacitor.

[0094] In an exemplary embodiment, the first gate conductive layer 130 may include one or more metals, including at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu).

[0095] The second insulating layer 122 may be disposed on the first gate conductive layer 130. The second insulating layer 122 may be an interlayer insulating film or a second gate insulating film. In an exemplary embodiment, the second insulating layer 122 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide.

[0096] A second gate conductive layer 140 is disposed on the second insulating layer 122. The second gate conductive layer 140 may include a second electrode CE2 of a storage capacitor. In an exemplary embodiment, the second gate conductive layer 140 may include one or more metals, including at least one selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The second gate conductive layer 140 may be made of, but is not limited to, the same material as the first gate conductive layer 130.

[0097] A third insulating layer 123 is disposed on the second gate conductive layer 140. The third insulating layer 123 may be an interlayer insulating film. In an exemplary embodiment, the third insulating layer 123 may include an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide.

[0098] A data conductive layer 150 is disposed on the third insulating layer 123. The data conductive layer 150 may include a first electrode SD1 and a second electrode SD2 of the TFT of the pixel PX. The first electrode SD1 and the second electrode SD2 of the TFT can be electrically connected to the source and drain regions of the semiconductor layer 110 through contact holes penetrating the third insulating layer 123, the second insulating layer 122, and the first insulating layer 121. The first power supply voltage electrode ELVDDE of the pixel PX may also be included in the data conductive layer 150. The first power supply voltage electrode ELVDDE can be electrically connected to the second electrode CE2 of the storage capacitor through contact holes penetrating the third insulating layer 123.

[0099] In an exemplary embodiment, the data conductive layer 150 may include one or more metals, such as at least one selected from aluminum (Al), molybdenum (Mo), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The data conductive layer 150 may be a single layer or multiple layers. In an exemplary embodiment, the data conductive layer 150 may have a stacked structure such as Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, or Ti / Cu.

[0100] A fourth insulating layer 124 is disposed on the data conductive layer 150. The fourth insulating layer 124 covers the data conductive layer 150. The fourth insulating layer 124 may be a via layer. In an exemplary embodiment, the fourth insulating layer 124 may include an organic insulating material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (“BCB”).

[0101] Anode 160 is disposed on the fourth insulating layer 124. Anode 160 may be a pixel electrode disposed in each pixel PX. Anode 160 may be electrically connected to the second electrode SD2 of the TFT through a contact hole penetrating the fourth insulating layer 124. Anode 160 may be at least partially superimposed on the light-emitting region EMA of pixel PX.

[0102] In an exemplary embodiment, the anode 160 may have, but is not limited to, a stacked structure in which layers of material with high work function (such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO) or indium oxide (In2O3)) and reflective material layers (such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or combinations thereof) are stacked. The material layer with high work function may be disposed on the reflective material layer close to the light-emitting layer 170. In an exemplary embodiment, the anode 160 may have, but is not limited to, a multilayer structure such as ITO / Mg, ITO / MgF2, ITO / Ag, or ITO / Ag / ITO.

[0103] A dam layer 126 may be disposed on the anode 160 and may include openings that expose the anode 160. The luminescent region (EMA) and the non-luminescent region (NEM) may be distinguished from each other by the dam layer 126 and the openings in the dam layer 126. In an exemplary embodiment, the dam layer 126 may comprise an organic insulating material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or BCB. The dam layer 126 may also comprise an inorganic material.

[0104] Spacers 127 can be provided on the embankment 126. Spacers 127 can be directly provided on the embankment 126. Spacers 127 can be stacked with the embankment 126 in the thickness direction. Spacers 127 can maintain a gap between the embankment 126 and the structures provided on the spacers 127. In exemplary embodiments, for example, when depositing the organic material of the light-emitting layer 170 through a fine metal mask (“FMM”), spacers 127 can prevent the FMM from sagging. In some cases, spacers 127 can support structures stacked on the spacers 127, or can reduce deformation due to stress when the display panel 10 is pressed. Spacers 127 can be narrower than the embankment 126. Spacers 127 can be provided only on a portion of the embankment 126, thus creating a step difference with the portion where spacers 127 are not present.

[0105] Spacer 127 may comprise an organic insulating material, similar to dam 126. Spacer 127 may include a layer different from dam 126, but may also comprise the same material as dam 126 in a single process. In an exemplary embodiment, for example, dam 126 and spacer 127 may be configured to have different heights in a single process by coating a photosensitive organic material and then exposing and developing the photosensitive organic material using a slit mask or halftone mask.

[0106] A light-emitting layer 170 is disposed on the anode 160 exposed by the dam layer 126. The light-emitting layer 170 may include an organic material layer. The organic material layer of the light-emitting layer 170 may include an organic light-emitting layer, and may also include a hole injection layer / hole transport layer and / or an electron injection layer / electron transport layer.

[0107] The cathode 180 can be disposed on the light-emitting layer 170. The cathode 180 can be a common electrode disposed integrally and without distinction between pixels. The anode 160, the light-emitting layer 170, and the cathode 180 can form an organic light-emitting element.

[0108] The cathode 180 can contact not only the light-emitting layer 170, but also the upper surface of the embankment layer 126. Furthermore, in the area where the spacer 127 is provided, the cathode 180 can contact and cover the surface of the spacer 127. The cathode 180 can be conformally arranged along the structure below it to reflect the steps of the structure.

[0109] In an exemplary embodiment, the cathode 180 may include a material layer having a small work function, such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF2, Ba, or a complex or combination thereof (e.g., a combination of Ag and Mg). The cathode 180 may also include a transparent metal oxide layer disposed on the material layer having a small work function.

[0110] A thin-film encapsulation layer 190, comprising a first inorganic layer 191, a first organic layer 192, and a second inorganic layer 193, is disposed on the cathode 180. The first inorganic layer 191 and the second inorganic layer 193 may be in contact with each other at one end of the thin-film encapsulation layer 190 (see [reference]). Figure 7 The first organic layer 192 can be sealed by the first inorganic layer 191 and the second inorganic layer 193.

[0111] In an exemplary embodiment, each of the first inorganic layer 191 and the second inorganic layer 193 may include, for example, silicon nitride, silicon oxide, or silicon oxynitride. In an exemplary embodiment, the first organic layer 192 may include an organic insulating material such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or BCB.

[0112] A touch layer TSP can be disposed on the thin-film encapsulation layer 190. The touch layer TSP may include a touch substrate layer 205, a first touch conductive layer 210, a first touch insulating layer 215, a second touch conductive layer 220, and a second touch insulating layer 230 sequentially stacked on the thin-film encapsulation layer 190. Either the first touch conductive layer 210 or the second touch conductive layer 220 (e.g., the second touch conductive layer 220) can form a grid electrode constituting a touch sensing electrode, while the other (e.g., the first touch conductive layer 210) can be used as a connecting electrode connecting adjacent touch sensing electrodes. The first touch conductive layer 210 and the second touch conductive layer 220 can be stacked with the dam layer 126 and can be disposed in the non-light-emitting area NEM. Since the first touch conductive layer 210 and the second touch conductive layer 220 are not stacked with the light-emitting area EMA, they can substantially not reduce the brightness of the display device 1 and can be invisible to the user, even when they include opaque metal.

[0113] The touch substrate layer 205 of the touch layer TSP may include an inorganic insulating material. In exemplary embodiments, the touch substrate layer 205 may include, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In some exemplary embodiments, the touch substrate layer 205 may be replaced by a second inorganic layer 193 constituting the thin-film encapsulation layer 190.

[0114] Each of the first touch conductive layer 210 and the second touch conductive layer 220 may include a metal or a transparent conductive layer. The metal may include aluminum, titanium, copper, molybdenum, silver, or alloys thereof. In an exemplary embodiment, the transparent conductive layer may include a transparent conductive oxide (such as ITO, IZO, zinc oxide (ZnO), or indium tin zinc oxide (“ITZO”), a conductive polymer (such as PEDOT, metal nanowires, graphene, etc.). As described above, when the first touch conductive layer 210 and the second touch conductive layer 220 are disposed in the non-light-emitting region NEM, they may not interfere with the propagation of emitted light even when they comprise opaque metals with low transmittance.

[0115] The first touch conductive layer 210 and / or the second touch conductive layer 220 may include multiple conductive layers. In an exemplary embodiment, the first touch conductive layer 210 and / or the second touch conductive layer 220 may have, for example, a three-layer structure of titanium / aluminum / titanium.

[0116] The first touch insulating layer 215 and the second touch insulating layer 230 may comprise inorganic or organic materials. In an exemplary embodiment, either the first touch insulating layer 215 or the second touch insulating layer 230 may comprise an inorganic material, and the other may comprise an organic material. In an exemplary embodiment, for example, the first touch insulating layer 215 may comprise a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, while the second touch insulating layer 230 may comprise at least any one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0117] The touch layer TSP may also include a light-shielding pattern 240 and a cover layer 250 disposed on the second touch insulating layer 230.

[0118] A light-shielding pattern 240 may be disposed on the second touch insulating layer 230. The light-shielding pattern 240 can reduce the reflection of external light and improve the perceived color of reflected light. The light-shielding pattern 240 is disposed in the non-emitting region NEM. In an exemplary embodiment, for example, the light-shielding pattern 240 may have a lattice shape or a mesh shape in a planar view. The light-shielding pattern 240, the first touch conductive layer 210 and the second touch conductive layer 220, and the dam layer 126 may all be disposed in the non-emitting region NEM and may be stacked on top of each other in the thickness direction. The width of the light-shielding pattern 240 may be less than or equal to the width of the dam layer 126 and greater than the width of the first touch conductive layer 210 and the second touch conductive layer 220. The light-shielding pattern 240 may not be stacked with the emitting region EMA.

[0119] A cover layer 250 is disposed on the light-shielding pattern 240. The cover layer 250 can be directly disposed on the light-shielding pattern 240. The cover layer 250 can be used to protect the light-shielding pattern 240 by covering it. In an exemplary embodiment, the cover layer 250 can also be used to planarize the surface.

[0120] In another exemplary embodiment, the aforementioned light-shielding pattern 240 and / or covering layer 250 may be omitted.

[0121] A polarizing bonding layer PLA is disposed on the cover layer 250, and a polarizing member POL is disposed on the polarizing bonding layer PLA. The polarizing member POL may include a polarizing film 260. The polarizing film 260 can be attached to the touch layer TSP through the polarizing bonding layer PLA including an adhesive or the like.

[0122] The polarizing film 260 may include a polarizing layer 263 and protective members 261 and 262 sandwiching the polarizing layer 263 from above and below. The polarizing layer 263 may include a polyvinyl alcohol film. The polarizing layer 263 may be stretched in one direction. The stretching direction of the polarizing layer 263 may be the absorption axis, and the direction perpendicular to the stretching direction may be the transmission axis. Protective members 261 and 262 may be respectively disposed on one surface and the other surface of the polarizing layer 263. In an exemplary embodiment, protective members 261 and 262 may include, but are not limited to, cellulose resins such as cellulose triacetate or polyester resins.

[0123] A transparent bonding layer 30 is disposed on the polarizing member POL (i.e., polarizing film 260), and a window member 20 is disposed on the transparent bonding layer 30. Since the transparent bonding layer 30 and the window member 20 have been described in detail above, their redundant descriptions are omitted.

[0124] Figure 7 Is Figure 6 A cross-sectional view of the hole area HLA around the display device 1.

[0125] Reference Figure 6 and Figure 7 The first via HLE_TH1 can penetrate the substrate 100, the second organic layer 128 and the third organic layer 129 disposed on the substrate 100, the touch layer TSP, the polarization bonding layer PLA, and the polarization film 260. The inner walls of the layers constituting the first via HLE_TH1 can be aligned with each other.

[0126] A dam structure DAM may be disposed around the first via HLE_TH1. The dam structure DAM may include stacked insulating layers 105, 121, 122, 123, 124, 126, and 127. A recess TCH defined by removing the insulating layers 105, 121, 122, 123, 124, 126, and 127 (excluding the substrate 100) and the metal layers 130, 140, 150, 160, and 180 may be disposed between the dam structure DAM and the pixel PX. At least a portion of the thin-film encapsulation layer 190 may be disposed in the recess TCH. In an exemplary embodiment, for example, the first organic layer 192 of the thin-film encapsulation layer 190 may extend into the dam structure DAM and may not be disposed in the via region HLA outside the dam structure DAM. That is, the dam structure DAM may prevent the first organic layer 192 from overflowing into the via region HLA. The first inorganic layer 191 and the second inorganic layer 193 of the thin-film encapsulation layer 190 may further extend beyond the dam structure DAM. Although the first inorganic layer 191 and the second inorganic layer 193 do not extend to the first through hole HLE_TH1 in the attached drawings, but terminate on the dam structure DAM before the first through hole HLE_TH1, the invention is not limited to this case.

[0127] The thin-film encapsulation layer 190 surrounding the aperture region HLA may slope downward toward the first via HLE_TH1. One or more organic layers 128 and 129 may be further disposed on the thin-film encapsulation layer 190 to flatten the sloped surface around the aperture region HLA. In an exemplary embodiment, for example, a second organic layer 128 may be disposed on the first organic layer 192, and a third organic layer 129 may be disposed on the second organic layer 128. The second organic layer 128 and the third organic layer 129 may flatten the sloped step around the aperture region HLA by filling the sloped step. In an exemplary embodiment, the second organic layer 128 and the third organic layer 129 may be exposed to the first via HLE_TH1 and may form the inner wall of the first via HLE_TH1. Therefore, the inner wall of the first through-hole HLE_TH1 can be formed by the corresponding side surfaces of the substrate 100, buffer layer 105, second organic layer 128, third organic layer 129, touch substrate layer 205, first touch insulating layer 215, second touch insulating layer 230, cover layer 250, polarizing bonding layer PLA, and polarizing film 260. The inner wall of the first through-hole HLE_TH1 can be covered by the hole coating HCVB as described above.

[0128] The manufacturing process will now be described. Figure 3 The method of an exemplary embodiment of the display device 1.

[0129] Figures 8 to 11 This is a cross-sectional view illustrating an exemplary embodiment of the steps of a method for manufacturing a display device 1.

[0130] Reference Figure 8 First, prepare a laminate (LAM) of the display panel 10 and the polarizing member POL. The laminate (LAM) can be set by attaching the polarizing member POL to the surface of the display panel 10 using a method such as lamination.

[0131] Reference Figure 9 A first through-hole HLE_TH1 is defined in the hole region HLA of the laminate LAM. For example, a laser LSR can be used to define the first through-hole HLE_TH1. The first through-hole HLE_TH1 physically penetrates the display panel 10 and the polarizing member POL in the thickness direction. Since the through-holes of the display panel 10 and the polarizing member POL are defined in the same process, their inner walls can be aligned with each other, and their inner diameters can be the same.

[0132] As a result of forming the first through-hole HLE_TH1, the display panel 10 and the polarizing member POL can be exposed toward the inner wall of the first through-hole HLE_TH1. In the case of the display panel 10, the area defining the first through-hole HLE_TH1 can be compared with the above-mentioned reference. Figure 7 The described packaging structure (see) Figure 7The “190” in the diagram, the groove TCH, and the dam structure DAM are completed together. Therefore, it is possible to prevent crack propagation and the penetration of moisture or external air into the effective area AAR. When the polarizing element POL is set as a film, it is difficult to have a different structure in each region, and the effective area AAR will be directly exposed due to physical penetration. As mentioned above, since the polarizing element POL will discolor or locally shrink when exposed to moisture, a hole coating HCVB can be used in a subsequent process to coat the inner wall of the first through-hole HLE_TH1.

[0133] The HCVB (Hole-Coating Body) can be applied not only to the exposed inner wall of the polarizing member POL, but also to the inner wall of the display panel 10, which is laminated with the polarizing member POL. It may be easier to form the HCVB on both the inner wall of the polarizing member POL and the inner wall of the display panel 10 than to form it only on the inner wall of the polarizing member POL. Furthermore, when the HCVB is also defined on the inner wall of the display panel 10, unnecessary steps inside the first through-hole HLE_TH1 can be reduced, preventing moisture and other contaminants from penetrating into the effective area AAR of the display panel 10.

[0134] Figures 10A to 10C A method for forming a porous coating HCVB according to various embodiments is shown.

[0135] In an exemplary embodiment, it can be as follows: Figure 10A The diagram shows the application of a contact coating HCVB. Specifically, the coating composition HCC is applied to a contact pad CTP, which includes a silicon pad, and the contact pad CTP is inserted into the first via HLE_TH1. Then, the coating composition HCC is applied to or transferred to the inner wall of the first via HLE_TH1, thereby coating the inner wall of the first via HLE_TH1 with the coating composition HCC.

[0136] In an exemplary embodiment, it can be as follows: Figure 10B The diagram illustrates the application of a non-contact coating method for the orifice coating HCVB. Specifically, a spray bar ZBR, comprising one or more spray holes ZHL on its side surface, is inserted into a first through-hole HLE_TH1. The spray bar ZBR is then rotated to spray the coating composition HCC through the spray holes ZHL, thereby coating the inner wall of the first through-hole HLE_TH1 with the coating composition HCC.

[0137] In an exemplary embodiment, it can be as follows: Figure 10CThe diagram shows the setting of the hole coating HCVB. Specifically, the inner wall of the first through hole HLE_TH1 can be coated by placing a mask MSK that exposes the first through hole HLE_TH1 on or above the surface of the laminate LAM (the surface of the polarizing member POL) and spraying the coating composition HCC into the first through hole HLE_TH1 using a nozzle NZZ.

[0138] It can make use of, such as Figures 10A to 10C The coating composition HCC applied by those methods is dried and / or cured into a porous coating HCVB. In an exemplary embodiment, the coating composition HCC can be cured by, but not limited to, ultraviolet curing and / or thermal curing.

[0139] When the above method is used to place the hole coating HCVB on the inner wall of the first through hole HLE_TH1 of the laminate LAM, the inner diameter of the first through hole HLE_TH1 of the laminate LAM can be reduced due to the thickness of the hole coating HCVB.

[0140] Reference Figure 11 A transparent bonding layer 30 is attached to a laminated assembly LAM including a via coating HCVB. The attachment of the transparent bonding layer 30 can be achieved through lamination or coating. A second via HLE_TH2 can be defined in the attached transparent bonding layer 30 such that, in a plan view, the second via HLE_TH2 is located inside the first via HLE_TH1 of the laminated assembly LAM. The transparent bonding layer 30, in which the second via HLE_TH2 is defined, can be attached to the laminated assembly LAM, but the second via HLE_TH2 can also be defined while the transparent bonding layer 30 is attached to the laminated assembly LAM.

[0141] Next, refer to Figure 3 The window component 20 is attached to the transparent bonding layer 30. The window component 20 includes a pattern of a printed layer 22 defining an optical aperture HLE_OP. The optical aperture HLE_OP may be stacked with a first through-hole HLE_TH1 of the laminate LAM and a second through-hole HLE_TH2 of the transparent bonding layer 30. The optical aperture HLE_OP may have an inner diameter smaller than the inner diameter of the first through-hole HLE_TH1 of the laminate LAM and / or the inner diameter of the second through-hole HLE_TH2 of the transparent bonding layer 30, and may be located inside the first through-hole HLE_TH1 and / or the second through-hole HLE_TH2.

[0142] Although in the above embodiments, the window member 20 is attached after the transparent bonding layer 30 is attached to the laminate LAM, in exemplary embodiments, the transparent bonding layer 30 may be attached to the window member 20 first, and then the window member 20, including the transparent bonding layer 30, may be attached to the laminate LAM. In alternative exemplary embodiments, the transparent bonding layer 30 and the window member 20 may be laminated simultaneously.

[0143] Other exemplary embodiments will be described below.

[0144] Figure 12 This is a cross-sectional view around an exemplary embodiment of the hole region HLA of the display device 1.

[0145] Reference Figure 12 An exemplary embodiment of the display device 1 shown is... Figure 3 The exemplary embodiment differs in that the transparent bonding layer 31 does not include the second via HLE_TH2. Because the transparent bonding layer 31 itself has high light transmittance, even when the transparent bonding layer 31, like the window substrate 21, covers the via region HLA, it allows external light to pass through, enabling external light to reach the light-receiving portion of the optical element OPS. Figure 3 Compared to the exemplary embodiment, the transmittance of the optical aperture HLE_OP may be reduced, but because there is no alignment problem between the second through hole of the transparent bonding layer 31 and the first through hole HLE_TH1 of the laminate LAM including the display panel 10 and the polarizing member POL, it is more conducive to maintaining the uniform transmittance inside the optical aperture HLE_OP.

[0146] Figure 13 This is a cross-sectional view around an exemplary embodiment of the hole region HLA of the display device 1.

[0147] Reference Figure 13 An exemplary embodiment of the display device 1 shown is... Figure 3 The difference in the exemplary embodiment is that the aperture coating HCVW comprises a transparent resin. When the aperture coating HCVW is transparent, it is difficult for the aperture coating HCVW itself to perform the function of preventing light leakage. However, the function of preventing light leakage can be supplemented by completely covering the through-hole HLE with the pattern of the printed layer 22 of the window member 20. In this respect, in the exemplary embodiment shown, the printed layer 22 may be superimposed on the aperture coating HCVW in the thickness direction and may completely cover the aperture coating HCVW.

[0148] Figure 14 and Figure 15 This is a cross-sectional view of an exemplary embodiment of the hole region HLA of the display device 1.

[0149] Figure 14 and Figure 15An exemplary embodiment shows that the aperture coating HCVW not only covers the inner wall of the first through-hole HLE_TH1 of the laminate LAM including the display panel 10 and the polarizing member POL, but also fills the first through-hole HLE_TH1. In this case, the aperture coating HCVW may include a transparent material to ensure the optical aperture HLE_OP.

[0150] In an exemplary embodiment, reference is made to... Figure 14 The thickness of the HCVW coating can be substantially the same as the thickness of the LAM laminate, and can be generally uniform. Figure 14 In an exemplary embodiment, one surface and the other surface of the hole coating HCVW can be flat and substantially parallel to each other.

[0151] In an exemplary embodiment, reference is made to... Figure 15 The thickness of the HCVW orifice coating can be maximized in the region adjacent to the inner wall of the LAM laminate and can decrease towards the center. Figure 15 In an exemplary embodiment, one surface and / or another surface of the hole coating HCVW may include a concave surface.

[0152] Figure 16 This is a cross-sectional view around an exemplary embodiment of the hole region HLA of the display device 1.

[0153] Figure 16 An exemplary embodiment illustrates that the display device 1 may include both a hole coating HCVB and a filler FLLW in a first through-hole HLE_TH1. Specifically, the inner wall of the first through-hole HLE_TH1 may be covered by the hole coating HCVB, and the space defined by the hole coating HCVB may be filled with the filler FLLW. The filler FLLW may contact the hole coating HCVB. The hole coating HCVB may include, for example... Figure 3 The black material in the exemplary embodiment or such Figure 13 The transparent material in the exemplary embodiment. The filler FLLW may include a transparent material.

[0154] In summarizing the specific embodiments, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the disclosed preferred embodiments of the invention are used only in a general and descriptive sense, and not for purposes of limitation.

Claims

1. A display device, the display device comprising: Display panel, including a first through hole; A polarizing member is disposed on the surface of the display panel and includes a second through hole superimposed on the first through hole, wherein the inner walls of the first through hole and the second through hole are aligned with each other in a first direction in which the first through hole and the second through hole extend. A capping layer that covers the inner wall of the first through hole and the inner wall of the second through hole.

2. The display device according to claim 1, wherein, The capping layer is in direct contact with the inner wall of the first through hole and the inner wall of the second through hole.

3. The display device according to claim 1, wherein, The capping layer has a uniform thickness on the inner wall of the first through hole and the inner wall of the second through hole.

4. The display device according to claim 1, wherein, Each of the inner walls of the first through hole and the second through hole is flat in the first direction.

5. The display device according to claim 1, wherein, The capping layer comprises black resin.

6. The display device according to claim 1, wherein, The capping layer comprises a transparent resin.

7. The display device according to claim 1, wherein the display device further comprises a window member disposed on the surface of the polarizing member.

8. The display device according to claim 7, wherein, The window component includes a window base and a printed layer, the printed layer being disposed on the window base, overlapping the first through hole, and exposing the first through hole at least partially.

9. The display device according to claim 8, wherein, The inner surface of the printed layer protrudes inward from the first through hole, and the cover layer is stacked on top of the printed layer.

10. The display device according to claim 7, further comprising a transparent bonding layer disposed between the polarizing member and the window member.

11. The display device according to claim 10, wherein, The transparent bonding layer includes a third through-hole that overlaps with the first through-hole.

12. The display device according to claim 11, wherein, The inner wall of the third through hole protrudes inward from the inner wall of the first through hole.

13. A display device, the display device comprising: The display panel includes a first through-hole and a thin-film transistor for driving light-emitting elements; A polarizing member is disposed on the surface of the display panel and includes a second through hole; A resin layer is located on the inner wall of the second through-hole. In the cross-sectional view, the resin layer and the thin-film transistor are disposed on the same layer, and In the cross-sectional view, the display panel is disposed on a different layer than the polarizing member.

14. The display device according to claim 13, wherein, The resin layer is further disposed on the inner wall of the first through hole.

15. The display device according to claim 14, wherein, The resin layer has a uniform thickness on the inner wall of the first through hole and the inner wall of the second through hole.

16. The display device according to claim 14, wherein, The inner walls of the first through hole and the second through hole are aligned with each other in a first direction in which the first through hole and the second through hole extend.

17. The display device according to claim 14, wherein, The resin layer covers the entire surface of the inner wall of the first through hole and the inner wall of the second through hole.

18. The display device according to claim 14, wherein, The resin layer is in direct contact with the inner wall of the first through hole and the inner wall of the second through hole.

19. The display device according to claim 13, wherein, The resin layer comprises black resin.

20. The display device according to claim 13, wherein, The resin layer comprises a transparent resin.

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