Electroplating device and electroplating method

Abstract

The present invention is a plating device for plating at least one main surface of a rectangular substrate. The anode electrode disposed above the substrate is isolated from the plating solution in the processing tank by the isolation tank. The bottom of the isolation groove is composed of an electrolytic diaphragm, and the anode electrode is immersed in liquid in the isolation groove. Anode sludge generated from the anode electrode is shielded by the electrolytic separator and does not adhere to the substrate. By arranging a mechanism for inclining the isolation groove, the liquid in the isolation groove can be efficiently discharged, so that anode sludge can be prevented from being accumulated on the electrolysis diaphragm. The purpose of the present invention is to prevent a reduction in the quality of a plating film due to anode sludge even without using a special anode material.

Description

TECHNICAL FIELD

[0001] The present application relates to a plating apparatus and a plating method for plating at least one main surface of a rectangular substrate such as a printed wiring board or a glass substrate. BACKGROUND

[0002] A technique for forming a metal thin film on the surface of various substrates such as semiconductor substrates, printed wiring boards, and glass substrates by plating is widely used. For example, in the plating apparatus described in Patent Document 1, a substrate to be plated is held in a horizontal posture in a face-up state, and an anode electrode is disposed above the substrate immersed in a plating solution.

[0003] Prior Art Documents Patent Documents Patent Document 1: Japanese Patent Application Publication No. 2003-129286 SUMMARY

[0004] Problems to be Solved by the Invention

[0005] For example, in a case where a metal material is used as an anode electrode as in electrolytic copper plating, the metal material gradually dissolves in the plating solution as the process proceeds. It is known that at this time, a residue (also referred to as anode sludge) that is not dissolved in the liquid in an electrochemical manner but is detached from the anode electrode is generated. In the prior art described in Patent Document 1, the residue detached from the anode electrode settles in the plating solution and adheres to the upper surface of the substrate supported in a face-up state on the lower side. This can cause a decrease in the quality of the plated film.

[0006] Regarding this problem, a technique of adding a chemical substance that suppresses the generation of anode sludge to the anode electrode material, that is, the metal material, and a technique of using an insoluble anode and externally supplying a metal ion that is a material of the plated film in the form of a salt have also been put into practical use.

[0007] However, in the described techniques, a special material must be used as the anode or a chemical substance that is a source of metal ions must be prepared separately. Also, there can be a case where a substance that is not needed in the original electrochemical reaction is mixed into the plated film and causes a decrease in the quality of the plated film. Therefore, a technique is required that can prevent a decrease in the quality of the plated film due to anode sludge even without using a special anode material or a metal salt.

[0008] Means for Solving the Problem

[0009] The present application has been achieved in view of the above-described problems, and aims to provide a technique that can prevent a decrease in the quality of a plated film due to anode sludge even without using a special anode material in a technique of performing plating processing on the upper surface of a substrate supported in a face-up state.

[0010] One embodiment of the present application is an electroplating apparatus that electroplates at least one main surface of a flat plate-shaped substrate. The electroplating apparatus includes a processing tank that stores an electroplating solution; a holding portion that holds the substrate in a horizontal posture with the one main surface facing upward in the processing tank; a cathode electrode that contacts a portion of the one main surface of the substrate held by the holding portion; an anode electrode that is disposed above the substrate held by the holding portion and faces the one main surface; a power supply portion that is connected to the anode electrode and the cathode electrode; and a partition portion that surrounds the side and the lower side of the anode electrode and separates the anode electrode from the electroplating solution in the processing tank.

[0011] Here, the partition portion includes a box-shaped partition tank that has at least a bottom portion made of an electrolytic diaphragm and that houses the anode electrode in an internal space; a tilting mechanism that switches a posture of the partition tank between a horizontal posture in which the bottom portion is horizontal and a tilted posture in which the bottom portion is tilted with respect to the horizontal plane; a supply portion that supplies a liquid to the internal space so that the anode electrode is immersed in the liquid; and a discharge portion that discharges the liquid from the partition tank in the tilted posture.

[0012] Further, one embodiment of the present application is an electroplating method that electroplates at least one main surface of a flat plate-shaped substrate. The electroplating method includes the steps of holding the substrate in a horizontal posture with the one main surface facing upward in a processing tank that stores an electroplating solution by a holding portion; contacting a cathode electrode with a portion of the one main surface of the substrate held by the holding portion, and on the other hand, disposing an anode electrode above the substrate facing the one main surface; and applying a voltage between the anode electrode and the cathode electrode.

[0013] Here, the anode electrode is surrounded by a partition tank that has at least a bottom portion made of an electrolytic diaphragm, and is separated from the electroplating solution, and is applied with the voltage in a state of being immersed in a liquid stored in the partition tank. Further, after the voltage is applied, a posture of the partition tank is changed from a horizontal posture to a tilted posture, and the liquid is discharged from a position in a side wall of the partition tank that is lowest in a vertical direction in the tilted posture.

[0014] In the thus-configured application, the anode electrode is disposed above the substrate held in the electroplating solution with the electroplated surface facing upward, but is separated from the substrate by the electrolytic diaphragm. Therefore, the current flows through the electrolytic diaphragm between the anode electrode and the substrate, and thus the electroplating reaction is performed. On the other hand, the non-soluble component released from the anode electrode is separated by the electrolytic diaphragm, and can be prevented from adhering to the substrate.

[0015] Here, during the repeated plating processing, the insoluble components gradually accumulate on the bottom of the separation tank. In order to prevent this, the liquid in the separation tank must be periodically drained and replaced. However, the lower surface side of the separation tank faces the substrate, and it is difficult to secure sufficient space to configure a structure for draining the liquid. Moreover, when draining the liquid to the side of the separation tank, it is not possible to efficiently drain the liquid remaining near the bottom of the separation tank.

[0016] Therefore, in the present application, the separation tank can be switched between the horizontal posture and the inclined posture, and the liquid is drained when in the inclined posture. Therefore, the draining can be efficiently performed from the side of the separation tank. Therefore, in the present application, the plating processing can be performed without the anode sludge generated from the anode electrode arranged above adhering to the substrate. By periodically replacing the liquid, the accumulation of the anode sludge on the electrolytic membrane can be suppressed. Especially in the case of continuously processing a plurality of substrates, the processing can be stably performed for a long period.

[0017] Effects of the Invention

[0018] As described above, in the present application, the anode electrode is arranged above the substrate supported in the horizontal posture, but the anode sludge released from the anode electrode is blocked by the electrolytic membrane and does not adhere to the substrate. Therefore, it is possible to prevent the anode sludge from adhering to the upper surface of the substrate and causing the quality of the plated film to decrease. Moreover, the separation tank can be inclined to efficiently drain the liquid, and therefore, by replacing the liquid, it is possible to suppress the accumulation of the anode sludge on the electrolytic membrane. As a result, the plating processing can be stably performed for a long period.

[0019] The objects and other novel features of the present application will become more fully apparent from the following detailed description, taken in conjunction with the accompanying drawings. However, the accompanying drawings are intended only to illustrate the more important ones among the numerous objects of the present application. The present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 FIG. 1 is a diagram showing the schematic configuration of an embodiment of a plating apparatus of the present application.

[0021] Figure 2 FIG. 2 is a diagram showing the schematic configuration of a plating processing section.

[0022] Figure 3A FIG. 3 is a diagram showing the schematic configuration of a plating processing section.

[0023] Figure 3B FIG. 4 is a diagram showing the schematic configuration of a plating processing section.

[0024] Figure 4A FIG. 5 is a diagram showing the schematic configuration of a chuck mechanism.

[0025] Figure 4B FIG. 6 is a diagram showing the schematic configuration of a chuck mechanism.

[0026] Figure 5 FIG. 1 is a diagram schematically showing the configuration of the main part of the anode electrode unit.

[0027] Figure 6A FIG. 2 is a diagram schematically showing the state in which the isolation tank is immersed in the plating tank.

[0028] Figure 6B FIG. 3 is a diagram schematically showing the state in which the isolation tank is immersed in the plating tank.

[0029] Figure 7 FIG. 4 is an appearance perspective view showing the support mechanism of the isolation tank in the anode electrode unit.

[0030] Figure 8A FIG. 5 is a diagram schematically showing the case where the discharge of the plating solution is supplied to the isolation tank.

[0031] Figure 8B FIG. 6 is a diagram schematically showing the case where the discharge of the plating solution is supplied to the isolation tank.

[0032] Figure 9 FIG. 7 is a diagram showing the lifting action of the isolation tank in more detail.

[0033] Figure 10 FIG. 8 is a diagram showing the lifting action of the isolation tank in more detail.

[0034] Figure 11 FIG. 9 is a diagram showing the lifting action of the isolation tank in more detail.

[0035] Figure 12 FIG. 10 is a diagram showing the lifting action of the entire support mechanism.

[0036] Figure 13 FIG. 11 is a block diagram showing the electrical structure of the plating apparatus.

[0037] Figure 14 FIG. 12 is a flowchart showing the plating process.

[0038] Figure 15 FIG. 13 is a diagram schematically showing the action of each part.

[0039] Figure 16A FIG. 14 is a diagram showing a modification example of the anode electrode.

[0040] Figure 16B FIG. 15 is a diagram showing a modification example of the anode electrode.

[0041] Figure 16C FIG. 16 is a diagram showing a modification example of the anode electrode.

[0042] Figure 17A FIG. 17 is a diagram schematically showing a modification example of the support mechanism of the anode electrode unit.

[0043] Figure 17BFig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. DETAILED DESCRIPTION

[0044] Hereinafter, a specific embodiment of the electroplating apparatus of the present application will be described with reference to the drawings.

[0045] Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit.

[0046] Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit. Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit.

[0047] Figure 1 Fig. 1 is a diagram schematically showing a modification example of a support mechanism of an anode electrode unit.

[0048] The electroplating apparatus 1 further includes an infeed section 3, an electroplating treatment section 4, a rinsing treatment section 5, an outfeed section 6, a power supply section 7, and a control section 9. The infeed section 3, the electroplating treatment section 4, the rinsing treatment section 5, and the outfeed section 6 are arranged sequentially along the transport direction Dt (Y direction) of the transport section 2 for transporting the substrate. That is, in this electroplating apparatus 1, the substrate S is transported by the transport section 2 along the Y direction and undergoes the required treatment in each of the above-mentioned treatment sections.

[0049] The receiving unit 3 receives and temporarily holds the unprocessed substrate S transported from the outside, and supplies the substrate S to the electroplating processing unit 4 at necessary times. The electroplating processing unit 4 is the processing body for performing the electroplating method of the present invention, and immerses the substrate S in an electroplating solution for electroplating treatment. The structure and operation of the electroplating processing unit 4 will be described in detail below.

[0050] The rinsing treatment unit 5 includes a rinsing tank 51, a cylinder 52, and a rinsing liquid supply and discharge unit 59. The rinsing tank 51 has an internal space large enough to accommodate the substrate S, and can store the rinsing liquid in this internal space. An opening is provided on the Y-direction side of the rinsing tank 51 at the portion overlapping with the transport path P. Baffles 51a and 51b are provided in this opening and can be opened and closed freely.

[0051] A tank 52 is positioned below the rinsing tank 51 to receive rinsing liquid overflowing from the rinsing tank 51. A rinsing liquid supply and discharge unit 59 supplies rinsing liquid to the rinsing tank 51 as needed and discharges rinsing liquid from the rinsing tank 51. The rinsing treatment unit 5 performs rinsing treatment on the substrate S immersed in the electroplating solution in the electroplating treatment unit 4. Water can be used as the rinsing liquid, for example. The transport unit 6 temporarily holds the substrate S while it is being transported by an external transport device to a post-processing step after rinsing treatment.

[0052] The power supply unit 7 supplies the necessary power to each part of the device. The control unit 9 controls each part of the device configured as described above, causing the electroplating apparatus 1 to perform a predetermined process. The hardware configuration of the control unit 9 can, for example, be the same as that of a general computer device. That is, through the central processing unit (CPU) provided in the control unit 9... Figure 13 By executing a pre-prepared control program, the various processes described below can be achieved. Unless otherwise specified, each part of the device operates based on control commands from the control unit 9.

[0053] The electroplating processing unit 4 includes an electroplating tank 41, cylinders 42 and 44, a clamping head 40, a moving mechanism 43, an anode electrode unit 45, a cleaning mechanism 48, and an electroplating solution supply and discharge unit 49. The electroplating tank 41 can store electroplating solution in an internal space large enough to accommodate a substrate S. The cylinder 42 is disposed below the electroplating tank 41 to receive overflowing electroplating solution. The clamping head 40 is disposed above the electroplating tank 41 to hold the substrate S undergoing electroplating processing. The cylinder 44 is disposed adjacent to the cylinder 42 below the electroplating tank 41 on the (-Y) side. The cleaning mechanism 48 cleans the clamping head 40 using a suitable cleaning solution (e.g., water). For this purpose, the cleaning mechanism 48 includes a cleaning nozzle 481 disposed within the cylinder 44. Figure 2 The cleaning solution supply and discharge section 482 supplies cleaning solution to the cleaning nozzle 481. The electroplating solution supply and discharge section 49 supplies electroplating solution to the electroplating tank 41 as needed and discharges electroplating solution from the electroplating tank 41.

[0054] Figure 2 , Figure 3A and Figure 3B A diagram showing the general structure of the electroplating processing section. More specifically, Figure 2 This is a front view of the main part of the electroplating treatment section 4 viewed in the (-X) direction. Figure 3A and Figure 3B This is equivalent to viewing the side view of the electroplating treatment section 4 in the (+Y) direction. Furthermore, to avoid making the diagram cumbersome, in... Figure 2 and Figure 3A The illustration of the anode electrode unit 45 is omitted.

[0055] like Figure 1 and Figure 2 As shown, openings are provided on the (-Y) and (+Y) sides of the electroplating tank 41, where they overlap with the transport path P. Baffles 41a and 41b, which can be opened and closed freely, are provided at these openings. When the baffles 41a and 41b are open, the substrate S, transported by the transport unit 2 along the transport path P, can pass through the openings on the sides of the electroplating tank 41. Therefore, untreated substrates S can be transported into the electroplating tank 41, and treated substrates S can be transported out of the electroplating tank 41.

[0056] On the other hand, in the closed state, the opening portion provided to the side surface of the plating bath 41 is closed. At this time, the conveyance path P of the substrate S is interrupted, but the plating solution exceeding the height of the opening portion can be stored inside the plating bath 41. After the substrate S is accommodated in the plating bath 41 with the shutter 41a on the (-Y) side in the open state, the shutter 41a is closed, and the inside space of the plating bath 41 is filled with the plating solution L, so that the substrate S is immersed in the plating solution L to perform the plating treatment. Thereafter, when the plating solution is discharged and the shutter 41b on the (+Y) side is opened, the liquid level of the plating solution L is lowered to below the lower end of the opening portion, and the substrate S after the plating treatment is conveyed out to the rinsing section 5. The shutters 41a and 41b can be independently opened and closed, and can also be integrally opened and closed.

[0057] As shown in FIG. 1, the conveyance roller 21 is provided with a rotation axis 22. The rotation axis 22 is rotatably supported by the upper frame 11 and the lower frame 12 of the housing 10. The rotation axis 22 is provided with a rotation motor 23. The rotation motor 23 is controlled by the control section 9, and rotates the conveyance roller 21 to convey the substrate S in the Y direction. Figure 3A As shown in FIG. 1, the conveyance roller 21 is provided with a rotation axis 22. The rotation axis 22 is rotatably supported by the upper frame 11 and the lower frame 12 of the housing 10. The rotation axis 22 is provided with a rotation motor 23. The rotation motor 23 is controlled by the control section 9, and rotates the conveyance roller 21 to convey the substrate S in the Y direction. Further, a part of the roller can be a driven roller not connected to a driving source.

[0058] Further, as shown in FIG. 1, two sets of chuck portions 40 are provided corresponding to each end portion of the substrate S accommodated in the plating bath 41. Figure 3A Figure 1 and Figure 2 In the drawing, only one set on the (+X) side among them is illustrated. The two sets of chuck portions 40 are symmetrically arranged with respect to the YZ plane, but have the same basic configuration. That is, each chuck portion 40 is provided with at least one chuck mechanism 400, a support frame 430 supporting the chuck mechanism 400, and a moving mechanism 43 moving the support frame 430 in the Y direction.

[0059] The support frame 430 is supported by the moving mechanism 43 so as to be movable in the Y direction, and the moving mechanism 43 is installed to the upper frame 11 among the frame members constituting the housing 10. More specifically, the moving mechanism 43 is provided with a guide rail 431 fixed to the upper frame 11 above the plating treatment section 4 and extending in the Y direction, a slide 432 engaged with the guide rail 431, and a driving source not shown which moves the slide 432 along the guide rail 431 in the Y direction. As the configuration, a suitable linear motion mechanism such as a linear motor, a linear motion guide mechanism, a chain drive mechanism, or a belt drive mechanism can be applied. For example, a single-axis robot in which such a drive mechanism is integrated in advance can be preferably applied.

[0060] ​The support frame 430 is combined with the lower end of the slider 432, and the chuck mechanism 400 is fixed to the support frame 430. Therefore, when the slider 432 moves in the Y direction along the guide rail 431, the support frame 430 and the chuck mechanism 400 mounted on the support frame 430 integrally move in the Y direction. That is, the moving mechanism 43 moves the slider 432 according to the control command from the control section 9, and thereby the chuck mechanism 400 moves in the Y direction.

[0061] In this embodiment, three sets of the chuck mechanism 400 are arranged in the Y direction and mounted on one support frame 430. They integrally move in the Y direction as the support frame 430 moves. Therefore, each of the chuck mechanisms 400 can move back and forth in the Y direction between the "plating position" PI located above the plating bath 41 and the "cleaning position" P2 located above the cylinder 44. Figure 2 In FIG. 6, the chuck mechanism 400 is shown in the plating position PI by a solid line, and the chuck mechanism 400 is shown in the cleaning position P2 by a broken line. On the other hand, Figure 1 In FIG. 7, the chuck mechanism 400 is shown in the cleaning position P2 by a solid line.

[0062] The chuck mechanism 400 holds the substrate S and stably maintains the posture of the substrate S in the plating bath 41, and makes the built-in cathode electrode in contact with one main surface of the substrate S. Also, by applying a direct current voltage between the anode electrode and the cathode electrode described below, a coating film is formed on the one main surface by electrolytic plating. Here, the coating film is formed on the upper surface of the substrate S.

[0063] The chuck mechanism 400 holds the substrate S at both ends in the X direction of the substrate S, that is, both ends in the width direction orthogonal to the conveyance direction Dt. Also, by providing a plurality of chuck mechanisms 400 in the Y direction, that is, the conveyance direction Dt of the substrate S, the substrate S is held at most of both ends in the X direction. The chuck mechanism 400 contributes to stably maintaining the posture of the substrate S by holding the substrate S, and in addition, can impart a uniform potential in a wide range by bringing the cathode electrode 412 extending in the Y direction into contact with the substrate S. Therefore, the plating apparatus 1 can form a plating coating film with good uniformity on the substrate S. Figure 4B

[0064] Figure 4A and Figure 4B FIG. 6 is a view showing the schematic configuration of the chuck mechanism. More specifically, Figure 4A FIG. 7 is a perspective view schematically showing the configuration of the chuck mechanism 400, Figure 4B ​The diagram shows the holding state of the chuck mechanism 400 on the substrate S. Furthermore, in the following description of the structure and function of the chuck mechanism 400, the chuck mechanism 400 holding the (-X) side end of the substrate S will be primarily illustrated. However, by considering reversing the same structure around the Z-axis, the structure and operation of the chuck mechanism holding the (+X) side end of the substrate S can be understood. Moreover, to improve the visual clarity of the diagram, Figure 4A A portion of the components of the chuck mechanism 400 is omitted from the illustration.

[0065] The chuck mechanism 400 uses an upper chuck 411 and a lower chuck 421 that can be raised and lowered independently to hold the X-direction end of the substrate S. Specifically, the upper chuck 411 and the lower chuck 421 are both elongated flat plate members extending in the Y-direction. The lower surface 411b of the upper chuck 411 abuts against the (-X) side end of the upper surface Sa of the substrate S, and the upper surface 421a of the lower chuck 421 abuts against the (-X) side end of the lower surface Sb of the substrate S, thereby holding the substrate S. In fact, a cathode electrode 412 is mounted on the lower surface 411b of the upper chuck 411, and the cathode electrode 412 is in contact with the upper surface Sa of the substrate S.

[0066] The cathode electrode 412 is electrically connected to the power supply unit 7. Furthermore, a sealing member 415, formed in an annular shape using an elastic material, is provided around the cathode electrode 412. When the upper clamp 411 is separated from the substrate S, the lower end of the sealing member 415 extends to a position lower than the lower surface of the cathode electrode 412.

[0067] Therefore, as Figure 4B As shown, when the cathode electrode 412 contacts the upper surface Sa of the substrate S, the sealing member 415 undergoes elastic deformation to surround the cathode electrode 412 in an airtight state. Therefore, when the substrate S is immersed in the electroplating solution, the cathode electrode 412 does not come into contact with the electroplating solution and remains in a dry state. Thus, corrosion or film formation of the cathode electrode 412 caused by contact with the electroplating solution can be prevented.

[0068] like Figure 4B As shown, the lower clamp 421 serves to define the position of the substrate S in the height direction (Z direction) by abutting against the lower surface Sb of the substrate S from below. Furthermore, when the cathode electrode 412 disposed on the upper clamp 411 comes into contact with the substrate S, the lower clamp 421 also functions as a support member. Therefore, it stably maintains the height direction position of the substrate S and also ensures reliable electrical contact between the cathode electrode 412 and the upper surface Sa of the substrate.

[0069] A shaft member 413 extending in the Z direction is attached to the upper surface 411a of the upper chuck 411, and the shaft member 413 is supported by a lifting mechanism 414 in a manner so as to be liftable. The upper chuck 411 is fixed to the shaft member 413 in a manner so as to be detachable (i.e., replaceable) by, for example, screws. The lifting mechanism 414 has a solenoid, a linear motor, or a ball screw mechanism, or the like, and lifts the shaft member 413. Thus, the upper chuck 411 attached to the lower end of the shaft member 413 is lifted. Here, a unit including the upper chuck 411, the shaft member 413, the lifting mechanism 414, and the like, which are integrally configured, is referred to as an "upper chuck unit 410".

[0070] Likewise, a shaft member 423 extending in the Z direction is attached to the upper surface 421a of the lower chuck 421, and the shaft member 423 is supported by a lifting mechanism 424 in a manner so as to be liftable. The lower chuck 421 is fixed to the shaft member 423 in a manner so as to be detachable by, for example, screws. The lifting mechanism 424 has a solenoid, a linear motor, or a ball screw mechanism, or the like, and lifts the shaft member 423. Thus, the lower chuck 421 attached to the lower end of the shaft member 423 is lifted. Here, a unit including the lower chuck 421, the shaft member 423, the lifting mechanism 424, and the like, which are integrally configured, is referred to as a "lower chuck unit 420".

[0071] The upper chuck unit 410 is fixed to the support member 401. Thus, the upper chuck 411 is movable only in a lifting direction with respect to the support member 401. On the other hand, the lower chuck unit 420 is attached to the support member 401 via the advance / retreat mechanism 402. Specifically, the support member 403 to which the lower chuck unit 420 is attached is coupled to a movable portion of the advance / retreat mechanism 402 having the X direction as a movable direction. The advance / retreat mechanism 402 has a solenoid, a cylinder, a linear motor, or a ball screw mechanism, or the like, and a body portion thereof is fixed to the support member 401.

[0072] Thus, the lower chuck unit 420 is movable in the X direction within a movable range defined by a stopper (not shown) by the operation of the advance / retreat mechanism 402. Thus, the lower chuck 421 is movable in a lifting direction with respect to the support member 401 by the operation of the lifting mechanism 424, and is movable in the X direction with respect to the support member 401 by moving the lifting mechanism 424 by the advance / retreat mechanism 402.

[0073] In a state where the lower chuck 421 is advanced to the most (+X) side within the movable range, as shown by a solid line in FIG. 6, the (+X) side front end portion of the lower chuck 421 is positioned further to the (+X) side than the end surface of the substrate S, and the upper surface 421a of the lower chuck 421 is able to support the lower surface Sb of the substrate S. On the other hand, as shown by a dashed line in FIG. 6, the lower chuck 421 is positioned at the most (-X) side within the movable range, and the (-X) side front end portion of the lower chuck 421 is positioned further to the (-X) side than the end surface of the substrate S. Thus, the lower surface Sb of the substrate S is not able to be supported by the upper surface 421a of the lower chuck 421. Figure 4B In a state where the lower chuck 421 is advanced to the most (+X) side within the movable range, as shown by a solid line in FIG. 6, the (+X) side front end portion of the lower chuck 421 is positioned further to the (+X) side than the end surface of the substrate S, and the upper surface 421a of the lower chuck 421 is able to support the lower surface Sb of the substrate S. On the other hand, as shown by a dashed line in FIG. 6, the lower chuck 421 is positioned at the most (-X) side within the movable range, and the (-X) side front end portion of the lower chuck 421 is positioned further to the (-X) side than the end surface of the substrate S. Thus, the lower surface Sb of the substrate S is not able to be supported by the upper surface 421a of the lower chuck 421.Figure 4B As shown by the dotted line in FIG. 41, in a state where the lower chuck 421 is retracted to the most (-X) side within the movable range, the (+X) side end portion of the lower chuck 421 is retracted to the (-X) side more than the end surface of the substrate S. Thus, contact of the lower chuck 421 with the substrate S during lifting can be avoided.

[0074] In the chuck mechanism 400, the upper chuck 411 and the lower chuck 421 cooperate to hold the substrate S in the plating bath 41. Specifically, the upper chuck 411 and the lower chuck 421 are lowered from the chuck mechanism 400 positioned at the plating position into the plating bath 41 to hold the end portions of the substrate S at the same height as the height of the substrate S supported by the conveyance rollers 21. Thus, in the plating bath 41, the substrate S is held in a horizontal attitude with the upper surface flat. Hereinafter, the Z-direction position of the upper chuck 411 and the lower chuck 421 at this time is referred to as the "lower position".

[0075] As shown in FIG. 41, the upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner. The upper chuck 411 is arranged above the lower chuck 421. The upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner in the Z-direction. Figure 1 As shown in FIG. 41, the upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner. The upper chuck 411 is arranged above the lower chuck 421. The upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner in the Z-direction. Figure 3B As shown in FIG. 41, the upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner. The upper chuck 411 is arranged above the lower chuck 421. The upper chuck 411 and the lower chuck 421 are arranged in a vertically stacked manner in the Z-direction.

[0076] Figure 5 FIG. 45 is a diagram schematically showing the configuration of the main part of the anode electrode unit. The anode electrode 451 has a plurality of electrode plates arranged in the horizontal direction. In the example shown in FIG. 45, nine electrode plates 451a to 451i arranged in a 3 x 3 matrix form the anode electrode 451. The lower surfaces of the electrode plates 451a to 451i facing the substrate S are located in the same horizontal plane. Figure 5

[0077] The anode electrode 451 is electrically connected to the power supply section 7 and receives supply of electric power. More specifically, the power supply section 7 has a plurality of output sections 71a to 71i capable of independently setting the output current, and the plurality of electrode plates are electrically connected to the plurality of output sections one-to-one, for example, with the output section 71a connected to the electrode plate 451a and the output section 71b connected to the electrode plate 451b. Each of the output sections 71a to 71i can be constituted by, for example, a direct-current constant-current source or a voltage source capable of setting the upper limit of the output current of a direct current or a pulse current.

[0078] ​The output current of each output section 71a to 71i is determined in accordance with a control instruction from the control section 9. Specifically, the power supply section 7 is provided with a setting storage section 72 that stores information related to the current value that each output section 71a to 71i should output. Each output section 71a to 71i outputs a current having a predetermined current value based on the information stored in the setting storage section 72. The current value of each output section 71a to 71i stored in the setting storage section 72 can be changed in accordance with a control instruction from the control section 9 and an operation input by the user.

[0079] The isolation tank 450 has a frame 452 that surrounds the periphery of the anode electrode 451 from the side, and an electrolytic diaphragm 453 that closes the lower portion of the frame 452 to form the bottom of the isolation tank 450. The frame 452 is substantially rectangular in plan view and penetrates in the vertical direction, and is formed of a material that is resistant to corrosion by the plating solution L, such as a resin material. Also, the electrolytic diaphragm 453 is formed in a flat plate shape or a sheet shape from a material that blocks non-ionized substances while allowing metal ions to pass. For example, the electrolytic diaphragm 453 can be composed of a porous resin material, an ion exchange resin material, or the like.

[0080] The frame 452 is closed at the lower portion by the electrolytic diaphragm 453 to form the bottom surface, and the isolation tank 450 is formed in a rectangular box shape with the upper portion open. The anode electrode 451 is housed in the internal space 454 of this isolation tank 450, as indicated by the single-dot chain line arrow. For this reason, the frame 452 that constitutes the isolation tank 450 is rectangular in plan view with the inner wall slightly larger than the outer dimensions of the anode electrode 451. Also, the anode electrode 451 is preferably detachable with respect to the isolation tank 450 in consideration of the convenience of replacement work that occurs as the electrode material is consumed.

[0081] As will be described below, the isolation tank 450 in which the anode electrode 451 is housed is immersed in the plating solution L stored in the plating tank 41.

[0082] Figure 6A and Figure 6B A diagram schematically showing the state in which the isolation tank is immersed in the plating tank. As Figure 6AAs shown, the isolation tank 450 is configured in a manner that at least the lower surface of the electrolysis separator 453 forming the bottom thereof is in contact with the plating solution L stored in the plating tank 41. Also, in the inner space 454 of the isolation tank 450, the 2nd plating solution L2 is injected to the extent that the anode electrode 451 is immersed in the liquid. As for the composition of the 2nd plating solution L2, there is no particular limitation, and for example, it can be the same as the 1st plating solution L stored in the plating tank 41. Further, the "same composition" referred to here means the composition at the time of supply, and the composition can also differ as the process proceeds. Also, for example, it can be substantially the same but different in concentration, or at least one of the presence or absence of an additive, type, content, or the like, of the main component can be the same as the 1st plating solution. Also, it is possible to use a liquid having a different composition from the 1st plating solution as the 2nd plating solution, as needed.

[0083] Therefore, inside the plating tank 41, the substrate S supported by the collet mechanism 400 (upper collet 411, lower collet 421) and the anode electrode 451 are arranged facing each other with the plating solution L (+ L2) and the electrolysis separator 453 therebetween.

[0084] A predetermined gap G1 greater than zero is provided between the lower surface of the anode electrode 451 and the upper surface of the electrolysis separator 453. Also, a predetermined gap G2 greater than zero is provided between the lower surface of the electrolysis separator 453 and the upper surface of the substrate S. Therefore, the gap G between the lower surface of the anode electrode 451 and the upper surface of the substrate S is represented by the following equation using the thickness t of the electrolysis separator 453: G = G1 + G2 + t.

[0085] As shown in Figs. 1 and 2, the anode electrode 451 is arranged in the isolation tank 450. Figure 5 and Figure 6B As shown, one output terminal of each of the output sections 71a to 71i is independently connected to each of the electrode plates 451a to 451i, while the other output terminal is uniformly connected to the cathode electrode 412. Also, as shown in Figure 4B the cathode electrode 412 is arranged at the lower end of the upper collet 411 and is in contact with the upper surface of the substrate S.

[0086] Therefore, when output currents of a predetermined size are respectively output from each of the output sections 71a to 71i of the power supply section 7, as shown by the arrows in Figure 6B , a current flowing from the anode electrode 451 toward the upper surface of the substrate S via the electrolysis separator 453 is generated. An electrochemical reaction caused by this current causes the upper surface of the substrate S to be plated.

[0087] In this electrochemical reaction, unevenness in the current density distribution on the upper surface of the substrate S affects the quality of the plated film. That is, in order to obtain a film with uniform composition and film thickness, it is desirable to obtain a uniform current density distribution in the plane of the substrate S. However, the substrate S is an insulator, i.e., a glass product, its outer shape is rectangular, and electrical contact with the cathode electrode 412 is limited to the peripheral portion of the substrate S, and these factors can cause the current density to be difficult to keep uniform. In an electrolytic plating technique in which the anode electrode is opposed to one main surface of the substrate and the cathode electrode is in contact with the peripheral portion of the substrate, as in the present embodiment, current concentration is likely to occur in the peripheral portion of the substrate. Therefore, there is a tendency for the film thickness to be greater in the peripheral portion than in the central portion. In particular, in a case where the takt time of the plating process is sought to be shortened, the amount of current supplied from the power supply portion 7 must be increased, but this also causes the deviation of the current to become greater.

[0088] As a countermeasure against this problem, there is, for example, a technique in which current concentration is alleviated by covering the peripheral portion of the substrate with a shield plate. However, for example, for a large substrate such as a glass substrate for a display device, the shield plate that covers the periphery must also be large. Furthermore, the size of the shield plate must be optimized depending on the size of the substrate, which can cause an increase in the cost of the device. Moreover, as for the size and shape of the shield plate that is effective for a rectangular substrate, there is not yet enough insight.

[0089] In the present embodiment, the anode electrode 451 is divided into a plurality of electrode plates 451a to 451i. Furthermore, for each of the electrode plates 451a to 451i, an output portion 71a to 71i that can independently set the output current is independently connected. Therefore, by independently adjusting the amount of current supplied to each of the electrode plates 451a to 451i, the density distribution of the current flowing from the anode electrode 451 toward the substrate S can be changed. Therefore, the deviation of the current can be corrected so that the current density approaches a uniform distribution, thereby improving the uniformity of the plated film.

[0090] As described above, current concentration is likely to occur in the peripheral portion of a rectangular substrate. In view of this, it is considered that there is a tendency for the amount of current to be less in the electrode plate 451e that is opposed to the central portion of the substrate S and for the amount of current to be more in the other electrode plates that are arranged so as to surround the electrode plate 451e in the horizontal direction. Therefore, by setting the amount of current to be more in the electrode plate 451e arranged in the center than in the other electrode plates, it is expected that the current distribution can be made more uniform.

[0091] Further, according to the holding embodiment in which the cathode electrode 412 is in contact with both end portions of the substrate S in the X direction, it is predicted that there is a tendency that the end current in the X direction is larger than that in the Y direction. Therefore, it is considered that it is desirable to give a larger current to the electrode plates 451b, 451h located at both end portions in the Y direction than to the electrode plates 451d, 451f located at both end portions in the X direction in the arrangement of the electrode plates.

[0092] Thus, the current input to each of the electrode plates 451a to 451i can be predetermined based on the shape of the substrate S or the electrode arrangement. In order to achieve the uniformization of the current density more accurately, it is only necessary to measure the current distribution by a preliminary experiment, to specify the set value of the current supplied to each of the electrode plates 451a to 451i for each of the output portions 71a to 71i, and to correct the deviation of the current distribution based on the result thereof.

[0093] For the purpose of uniformizing the current density in the vicinity of the substrate surface, the current set value can be optimized, for example, in the following manner. Here, the value obtained by dividing the current value to be given to each of the electrode plates by the area of the lower surface (facing surface with respect to the substrate S) of the electrode plate (hereinafter referred to as "electrode area") is defined as "electrode current density". Further, if the electrode current density is considered to represent the current density in the substrate upper surface Sa in the portion facing the electrode plate, it is only necessary to specify the output current value for each of the electrode plates 451a to 451i in such a manner that the electrode current density becomes an appropriate current density at each position on the substrate S. In this way, the output current value for each of the electrode plates 451a to 451i can be appropriately set in any case where the electrode areas of the electrode plates 451a to 451i are equal or different.

[0094] For example, in the case where the current density exhibits a tendency that it is higher at the peripheral portion of the substrate S and lower at the central portion as in the above-described example, the uniformization of the overall current density distribution can be achieved by setting the electrode current density to be larger in the electrode plate 451e arranged at the central portion and smaller in the other electrode plates arranged around it. Further, as for the electrode plate in which a part of the lower surface is located further outward than the substrate S in plan view and there is a portion not facing the substrate S, the area of the portion facing the substrate S can also be regarded as an effective electrode area. Further, unless the peripheral portion of the electrode plate protrudes considerably outward from the substrate S, the current output from the portion located further outward than the substrate S can actually reach the substrate S and contribute to the plating reaction. In this case, the entire electrode plate can also be regarded as an effective electrode and included in the electrode area.

[0095] The prescribed set value can be stored in advance as a default value in a setting storage section 72 of the power supply section 7, and the set value is read out to cause each output section 71a to 71i to operate. The user and the control section 9 can change the setting as needed. Therefore, it is also possible to cope with cases where, for example, the size of the substrate S or the like must be changed.

[0096] Further, regarding the isolation groove 450, it is also considered that not only the bottom surface but also the side wall surface is composed of a material having ion permeability. However, movement of ions through the side wall surface causes current to concentrate in the peripheral portion of the substrate, thereby impairing the uniformity of the plating film. By allowing ions to move through only the bottom surface of the isolation groove facing the upper surface of the substrate S, such current concentration can be prevented.

[0097] For the same reason, if the cathode electrode 412 is disposed directly below the electrolytic diaphragm 453 forming the bottom of the isolation groove 450, a shorter current path than in other portions is formed in this portion, causing current concentration. To avoid this, the cathode electrode 412 is preferably in contact with the substrate S more outward than the region of the substrate upper surface Sa facing the anode electrode 451 in plan view, and preferably in contact with the substrate S more outward than the bottom of the isolation groove 450.

[0098] In this sense, it is also effective to compose the frame 452 of a material having no ion permeability, or to make the outer dimensions of the isolation groove 450 in plan view (more strictly, the outer dimensions of the electrolytic diaphragm 453 forming the bottom) smaller than the outer dimensions of the substrate S in advance. In the composition, movement of ions in a path other than the electrolytic diaphragm 453 is prevented, and therefore, it can be said that the isolation groove itself functions as a shield plate as in the related art. As shown in FIG. 6, in the present embodiment, the condition is satisfied. Figure 6B

[0099] In the electrolytic plating process performed in this way, a metal soluble in the electrolyte, i.e., the plating solution L, can be used for the anode electrode 451, and a plating film of the metal is formed on the surface of the substrate S. For example, to form a copper plating film on a glass substrate, i.e., the substrate S, it is preferable to apply, for example, an aqueous copper sulfate solution as the plating solution L (L2), and it is preferable to apply, for example, a copper plate as the anode electrode 451.

[0100] By applying a direct current voltage between the anode electrode 451 and the cathode electrode 412, current is supplied to the anode electrode 451, and a metal material (for example, copper) is ionized from the anode electrode 451 and dissolved in the plating solution L2. The ionized metal adheres to the upper surface of the substrate S via the electrolytic diaphragm 453 and the plating solution L, and a plating film is formed. That is, the anode electrode 451 in the plating reaction is a so-called soluble electrode containing a material consumed to form the plating film.

[0101] ​In this process, the anode electrode 451 gradually dissolves in the plating solution L (L2), and at this time, non-soluble impurities contained in the electrode material are released from the anode electrode 451 into the liquid. The non-soluble residue generated in the plating solution in this manner is sometimes referred to as "anode sludge" or "anode mud".

[0102] In the present embodiment, a configuration is employed in which the substrate S is supported in a horizontal posture with the plating surface facing upward, and the anode electrode 451 is disposed above it. Therefore, the anode sludge containing impurities released from the anode electrode 451 settles in the plating solution toward the substrate S disposed below. If such impurities adhere to the plating surface, that is, the upper surface of the substrate S, it can cause plating failure to occur, resulting in a decrease in the quality of the plated film.

[0103] To address this problem, in the present embodiment, the anode electrode 451 is isolated from the substrate S by the isolation tank 450. Specifically, the electrolytic separator 453 is disposed between the lower surface of the anode electrode 451 and the upper surface of the substrate S, and the side of the anode electrode 451 is surrounded by the frame 452. Also, the isolation tank 450 is immersed in the plating solution L in the plating tank 41, and the internal space 454 is filled with the plating solution L2 of the same composition as the plating solution L.

[0104] Therefore, for metal ions involved in the plating reaction, a path is ensured from the anode electrode 451 toward the substrate S via the plating solutions L, L2 and the electrolytic separator 453. On the other hand, for the liquid components and non-soluble components in the plating solution, the anode electrode 451 and the substrate S are isolated from each other by the isolation tank 450. Therefore, the anode sludge generated by the aggregation of non-soluble components is blocked by the electrolytic separator 453 and does not adhere to the substrate S.

[0105] Also, the upper portion of the box-shaped isolation tank 450 is open, and therefore, the upper portion of the anode electrode 451 housed in the isolation tank 450 is in an open state. Therefore, the mounting / demounting work of the anode electrode 451 with respect to the isolation tank 450 can be easily performed. The anode electrode 451 gradually wears out as the reaction proceeds, and therefore, it must be replaced periodically. The above-described configuration also contributes to improving the convenience of such replacement work.

[0106] Also, the anode electrode 451 is divided into a plurality of electrode plates 451a to 451i. Therefore, the replacement work can be performed for each electrode plate. This can improve the workability at the time of replacement, and only the electrode plate that needs to be replaced in the anode electrode 451 can be replaced, and therefore, efficient use of resources is achieved.

[0107] The interval of each electrode plate 451a to 451i in the horizontal direction, for example, the distance from the lower surface of each electrode plate 451a to 451i to the substrate S, is preferably set to be half or less of the distance. If the interval between the electrode plates is large, there is a risk that the area of the substrate upper surface Sa that is not opposed to any of the electrode plates is not supplied with sufficient current and current density unevenness occurs. It is known that the current flowing from the electrode plates diffuses to some extent from the outer edge of the electrode plates in the liquid. According to the present inventors' insight related thereto, by setting the interval as described above, it is possible to suppress such current unevenness.

[0108] Next, the mechanism for supporting the isolation groove 450 in the anode electrode unit 45 will be described. The bottom surface of the isolation groove 450 is arranged to be opposed to the substrate S, and the isolation groove 450 is immersed in the plating solution L stored in the plating bath 41, and the support mechanism of the isolation groove 450 must be provided above the isolation groove 450 due to the above-described configuration. Also, in order to renew the plating solution L2 and suppress the accumulation of anode sludge on the electrolytic diaphragm 453, it is desirable to periodically replace the plating solution L2 stored in the isolation groove 450. The support mechanism described below corresponds to such a requirement.

[0109] Figure 7 FIG. 6 is a perspective view showing the appearance of the support mechanism of the isolation groove in the anode electrode unit. Also, Figure 7 In FIG. 6, in order to clearly show the configuration of the support mechanism, the description of the anode electrode 451 housed in the inner space 454 of the isolation groove 450 is omitted. In the anode electrode unit 45, the isolation groove 450 is mounted to the housing 10 via the support mechanism 460. The support mechanism 460 supports the isolation groove 450 in a manner that allows the isolation groove 450 to be moved up and down with respect to the plating bath 41 fixed to the frame 10.

[0110] The support mechanism 460 has support frames 461, 462, and 463 arranged in the vertical direction (Z direction). The support frames have the following relationship: the first support frame 461 arranged at the lowermost side supports the isolation groove 450, the second support frame 462 arranged thereon supports the first support frame 461, and further, the third support frame 463 arranged thereon supports the second support frame 462, and the third support frame 463 is fixed to the upper frame 11 of the housing 10. Figure 1 、 Figure 3A ).

[0111] Each of the support frames 461 to 463 has a substantially rectangular outer shape and is configured as a frame shape with a central portion extending in the vertical direction. Of these, the third support frame 463 located at the uppermost portion is provided with four sets of lift guide mechanisms 466 whose action direction is the vertical direction. Specifically, linear bushes 466a of the lift guide mechanisms 466 are provided at the four corners of the support frame 463. The linear bushes 466a are hollow cylindrical members extending in the vertical direction, and movable rods 466b are inserted into the hollow portions. The movable rods 466b extend downward from the linear bushes 466a, and the lower ends thereof are coupled to the second support frame 462 located below.

[0112] If the lift mechanisms 47 act in accordance with the control instructions from the control section 9, the movable rods 466b move up and down within a predetermined movable range, and thus the second support frame 462 coupled to the lower ends of the movable rods 466b is lifted and lowered. At this time, the first support frame 461 supported by the second support frame 462, and the isolation tank 450 supported by the first support frame 461 are also lifted and lowered in the same manner.

[0113] Similarly, the second support frame 462 is provided with four sets of lift guide mechanisms 465 whose action direction is the vertical direction. Specifically, linear bushes 465a of the lift guide mechanisms 465 are provided at the four corners of the support frame 462, and movable rods 465b are inserted into the hollow portions of the linear bushes 465a. The movable rods 465b extend downward from the linear bushes 465a, and the lower ends thereof are coupled to the first support frame 461 located below.

[0114] If the lift mechanisms 47 act in accordance with the control instructions from the control section 9, the movable rods 465b move up and down within a predetermined movable range, and thus the first support frame 461 coupled to the lower ends of the movable rods 465b is lifted and lowered. At this time, the isolation tank 450 supported by the first support frame 461 is also lifted and lowered in the same manner.

[0115] In this way, the lift guide mechanisms 465, 466 can act in cooperation with the lift mechanisms 47 to move the isolation tank 450 in the vertical direction. As the lift guide mechanisms 465, 466, various mechanisms other than the combination of the cylindrical linear bushes and the movable rods described above can be used. For example, mechanisms that restrict the movement of an object in one direction, such as linear motion guide mechanisms that are formed by combining a guide rail and a slide, can be used. Furthermore, the lift guide mechanisms 465, 466 can also be provided with a damper function, like the lift guide mechanisms 464 described below.

[0116] On the other hand, the first support frame 461 supports the isolation tank 450 so as to be movable up and down and tiltable about the X axis. Specifically, four sets of lift guide mechanisms 464 are installed in the first support frame 461, and movable rods 464b extend downward from linear bushings 464a of the lift guide mechanisms 464. As described later, the lift guide mechanisms 464 have damper mechanisms, and thus, impact transmitted to the isolation tank 450 when the isolation tank 450 is lifted is moderated.

[0117] Furthermore, a frame 455 composed of a plate member 455a extending in the X direction and a plate member 455b extending in the Y direction is installed in the upper portion of the frame body 452 of the isolation tank 450, and hinge members 455c are installed in four portions of the upper portion of the frame 455. The lower ends of the movable rods 464b extending from the four lift guide mechanisms 464 respectively engage with the hinge members 455c positioned directly below, and are installed so as to be rotatable about axes parallel to the X axis. In this way, the isolation tank 450 is supported by the support mechanism 460 to the support frame 461.

[0118] Furthermore, between two of the four hinge members 455c, 455c disposed on the (-Y) side, a roller member 455f is provided which is pivotally supported by a suitable support member so as to be rotatable. The roller member 455f is not connected to a driving mechanism, and is freely rotatable. The function of the roller member 455f will be described later.

[0119] Furthermore, a device for supplying and discharging the electroplating solution L2 to the isolation tank 450 is disposed around the isolation tank 450. That is, a nozzle 491 for ejecting the electroplating solution sent out from the electroplating solution supply and discharge portion 49 toward the inside space 454 of the isolation tank 450 is provided above the isolation tank 450. The nozzle 491 is installed in the frame 455 via a suitable fixing member.

[0120] The electroplating solution supply and discharge portion 49 and the nozzle 491 are connected by a pipe 492 to form a supply path of the electroplating solution. A flexible joint 493 is provided in the pipe 492 at a position close to the isolation tank 450. The flexible joint is a pipe member in which at least a portion of the pipe is formed of a flexible material such as rubber. By inserting the flexible joint into a portion of a pipe system composed mainly of a non-flexible pipe material, the pipe is allowed to flex at the insertion site. The flexible joint is widely used, for example, to absorb positional displacement or vibration of the connection sites of the pipes from each other.

[0121] As described later, in order to efficiently discharge the electroplating solution, the isolation tank 450 is provided so as to be rotatable about the X axis. By installing the flexible joint 493 in the pipe 492, such rotation is allowed, and a supply path of the electroplating solution can be formed between the electroplating solution supply and discharge portion 49 and the nozzle 491.

[0122] Furthermore, a pipe for discharging the plating solution stored in the internal space 454 to the plating solution supply / discharge section 49 is provided in the isolation tank 450. Specifically, a through-hole 452a is provided in the lower portion of the (+Y) side surface of the frame 452 constituting the isolation tank 450, and a discharge pipe 494 is connected to the through-hole 452a. As with the plating solution supply pipe 492, a flexible joint 495 is inserted into the discharge pipe 494.

[0123] Further, a lifting mechanism 47 is provided above the anode electrode unit 45 and is fixed to the frame 11 of the housing 10. Here, for the sake of explanation, the lifting mechanism 47 is configured as a winch mechanism that lifts and lowers an object by winding and unwinding a wire. That is, a wire 471 is suspended downward from the lifting mechanism 47, and the wire 471 passes through the openings in the central portions of the respective support frames 461 to 463 and reaches a position directly above the isolation tank 450. The lower end of the wire 471 is attached to a stopper portion 455d provided in the frame 455. The stopper portion 455d provided in the frame 455 is disposed closer to the (-Y) side than the middle positions of the two hinge members 455c, 455c arranged along the Y direction.

[0124] The lifting mechanism 47 is operated in accordance with a control command from the control section 9 to move the isolation tank 450 and the frame 455 stopped by the wire 471 integrally in the vertical direction. As for the vertical movement of the isolation tank 450, in addition to the above, various drive mechanisms can be used. For example, a linear motion mechanism such as a known ball screw mechanism or a cylinder mechanism, a linear motor mechanism, or a mechanism commercialized as a ZIP CHAIN ACTUATOR (registered trademark) can be preferably used.

[0125] Figure 8A and Figure 8B is a view schematically showing a case where the plating solution is supplied and discharged to the isolation tank. Although simplified in Figure 7 , as shown in Figure 8A , the lifting guide mechanism 464 includes a linear bushing (also referred to as a linear motion bearing, a linear bearing, or the like) 464a through which a movable rod 464b extending in the vertical direction (Z direction) is inserted, a base member 464c to which the linear bushing 464a is attached, a flat plate-shaped bracket 464d attached to the upper end of the movable rod 464b, and a damper mechanism 464e provided between the flat plate member 464d and the base member 464c. As the damper mechanism 464e, a known shock absorber, for example, can be used.

[0126] The movable rod 464b is inserted so as to be freely movable up and down with respect to the linear bush 464a. If the movable rod 464b moves up and down, the bracket 464d also moves up and down. If the bracket 464d descends, the bracket 464d abuts against the damper mechanism 464e, and further downward movement is restricted. That is, the damper mechanism 464e has a function of allowing the movable rod 464b to move up and down and regulating the movable range thereof, and moderating the impact at the time of stop of descent.

[0127] In the Y direction, two sets of the lift guide mechanisms 464 are provided at different positions. Also, the lower end of the movable rod 464b of each lift guide mechanism 464 is engaged with the hinge member 455c installed to the frame 455 of the isolation tank 450. Therefore, in the normal state, the isolation tank 450 is supported in a substantially horizontal posture.

[0128] In the state in which the isolation tank 450 is supported in a substantially horizontal posture as such, as shown by the hollow arrow in FIG. 4, the plating solution L2 is supplied from the plating solution supply / drain unit 49 to the isolation tank 450 via the pipe 491. The plating solution L2 is discharged from the discharge port provided to the lower surface of the nozzle 491 toward the inside space 454 of the isolation tank 450, and in this way, the plating solution L2 is supplied to the isolation tank 450. The plating treatment is performed in a state in which the anode electrode 451 is immersed in the plating solution L2. Figure 8A

[0129] After the plating treatment ends, the existing plating solution is drained and new plating solution is replenished, and thus, the plating solution L2 in the inside space 454 can be renewed. However, when the plating solution L2 is drained from the isolation tank 450, it is not possible to provide a discharge path below the isolation tank 450. The reason for this is that the substrate S is disposed in a position directly below the isolation tank 450.

[0130] Also, it is also considered to flow the plating solution L2 from the isolation tank 450 to the plating tank 41 and drain the plating solution L2 via the plating tank 41. However, in this case, the anode sludge contained in the plating solution L2 can be mixed into the plating tank 41. Therefore, it is preferable to drain the plating solution L2 using a path independent of the path for draining from the plating tank 41.

[0131] For the same reason, in the process of supplying the plating solution to the isolation tank 450 and tilting the isolation tank 450 to promote drainage described below, it is also necessary to avoid the plating solution L2 from overflowing from the isolation tank 450 and flowing into the plating tank 41.

[0132] ​To meet the requirement and to drain the electrolyte, a drain is provided in the side wall surface of the isolation tank 450 to drain the electrolyte to the side. However, compared with the case where a drain is provided in the lower surface, it is inevitable that the smoothness of the drainage is impaired. Therefore, in the present embodiment, a through-hole 452a as a drain is provided in the (+Y) side surface of the isolation tank 450 and a pipe 494 for drainage is connected, and when the electrolyte L2 is drained, the isolation tank 450 is lifted on the side opposite to the drain, that is, the (-Y) side to incline the bottom surface. Therefore, the drainage of the electrolyte L2 from the inner space 454 can be facilitated.

[0133] Specifically, the wire 471 is wound up by the lifting mechanism 47, and as shown by the dotted arrow in Figure 8B , the (-Y) side end portion of the isolation tank 450 can be lifted by pulling the frame 455. In this way, the isolation tank 450 is brought to an inclined posture where the bottom surface is inclined with respect to the horizontal plane. Therefore, as shown by the hollow arrow in Figure 8B , the electrolyte L2 stored in the inner space 454 flows toward the through-hole 452a which becomes a drain. In this way, the drainage of the electrolyte L2 is facilitated. The waste liquid flowing into the pipe 494 is recovered by the electrolyte supply and drain section 49.

[0134] The support embodiment of the isolation tank 450 allows the inclination of such an isolation tank 450 via the lifting guide mechanisms 464 connected through the hinge members 455c which are rotatable. That is, in each of the pair of lifting guide mechanisms 464, 464 disposed at different positions in the Y direction, the movable rods 464b are independently moved up and down, and therefore, the state where the isolation tank 450 is inclined can be achieved.

[0135] Furthermore, in the pipe 492 for supplying the electrolyte and the pipe 494 for drainage connected to the isolation tank 450, a flexible joint 493, 495 is respectively inserted. Therefore, the isolation tank 450 can be inclined in the state where the pipes are connected.

[0136] Figure 9 to Figure 11 is a view for explaining the action of the roller member 455f in more detail. Also in the view, in order to facilitate understanding, a part of the configuration which is not needed for explanation is omitted or the configuration is schematically illustrated. Furthermore, in order to explain the action of the roller member 455f which is blocked by the hinge member 455c, the arrangement position thereof is changed to be more on the (+Y) side than in reality.

[0137] As shown in Figure 9As shown, a freely rotatable roller member 455f is provided on the upper part of the isolation groove 450. Furthermore, a tapered member 468, whose lower surface is inclined relative to the horizontal plane, is installed on the lower surface of the support frame 461, directly above the roller member 455f. When the lifting mechanism 47 operates and winds up the wire 471 as indicated by the dashed arrow, the isolation groove 450 is pulled upwards while maintaining its inclined posture, and the roller member 455f and the tapered member 468 gradually approach each other.

[0138] like Figure 10 As shown, the roller member 455f abuts against the lower surface, i.e., the inclined surface, of the conical member 468, thus restricting further upward displacement of the roller member 455f. If the isolation groove 450 is pulled further upward in this state, the rise of the (-Y) side end of the isolation groove 450 is restricted by the roller member 455f and the conical member 468, while there is room for further rise at the (+Y) side end of the isolation groove 450.

[0139] Therefore, the (+Y) side end of the isolation groove 450 is further raised, eventually as follows: Figure 11 As shown, the isolation tank 450 is held in a horizontal position. Thus, during the process of lifting the isolation tank 450 from the electroplating tank 41, the isolation tank 450 is temporarily tilted to allow the electroplating solution L2 to be discharged, but eventually the isolation tank 450 returns to a horizontal position.

[0140] When the isolation tank 450 descends from its retracted, upward position, the operation is the reverse of the above. That is, the isolation tank 450 temporarily changes from a horizontal to an inclined position, but returns to a horizontal position when housed in the electroplating tank 41. This allows for the supply of new electroplating solution L2.

[0141] Figure 12 This diagram illustrates the lifting and lowering motion of the entire support mechanism. The operation of the lifting guide mechanism 464, which raises and lowers the isolation groove 450 relative to the support frame 461, was explained above. (See diagram below.) Figure 7 As shown, the support mechanism 460 has the following structure: the support frame 461 is supported by the lifting guide mechanism 465 installed on the support frame 462, and the support frame 462 is supported by the lifting guide mechanism 466 installed on the support frame 463.

[0142] The lifting guide mechanisms 465 and 466 are identical in structure and operation to the lifting guide mechanism 464, except that the damper mechanism is omitted. Therefore, the support frame 461 can be raised and lowered relative to the support frame 462, and consequently, the support frame 462 can be raised and lowered relative to the support frame 463. Thus, in the support mechanism 460, it is possible to... Figure 12 As shown in the diagram above, the support frames 461 and 462 are lowered to their lowest positions relative to their respective support bodies, as shown in the diagram. Figure 12The following drawings show the transition between the state in which the support frames 461, 462 are raised to the highest position with respect to the respective support bodies. The support frame 463 is fixed to the upper frame 11 that constitutes the device housing 10, and therefore, this configuration contributes to increasing the movable range of the isolation groove 450 in the up-down direction.

[0143] Figure 13 A block diagram showing the electrical structure of the plating device is shown in FIG. 9. In the plating device 1 configured as described above, the control section 9 controls each section of the device so that the plating device 1 performs predetermined processing. As the hardware configuration of the control section 9, for example, the same as that of a general computer device can be used. That is, as the control section 9, one provided with a central processing unit (CPU) 91, a memory 92, a storage device 93, an input section 94, a display section 95, an interface section 96, and the like can be used.

[0144] The memory 92 temporarily stores various data generated in the processing process. The storage device 93 stores various data and a control program 931 for a long time. The input section 94 and the display section 95 are responsible for the user interface function. The interface section 96 is responsible for communication with external machines and the like.

[0145] The CPU 91 reads out and executes the control program 931 stored in advance in the storage device 93, and based on this, controls each section of the device to perform predetermined actions, and thus, various actions described below are realized. For this purpose, the CPU 91 realizes functional modules such as a conveyance control section 911 that controls the action of the conveyance section 2, a chuck control section 912 that controls the action of the chuck section 40, a supply / discharge control section 913 that controls the supply source of various fluids and manages the supply and discharge thereof, a flow control section 914 that controls the valve on the pipe to adjust the flow rate of the fluid passing therethrough, a power supply control section 915 that controls the power supply of the power supply section 7 to the electrode, and the like in the form of software. At least a part of the functional modules can also be configured as dedicated hardware, for example.

[0146] Further, in Japanese Patent Application Publication No. 2023-180832 previously disclosed by the applicant of the present application, a plating device having a configuration similar to the plating device 1 of the present embodiment is disclosed, and the configuration of each section of the device or the function thereof, the action of the device, and the like are described in detail.

[0147] Next, the action of the plating device 1 configured as described above will be described. The basic action flow of the plating device 1 is roughly as follows. An unprocessed substrate S is conveyed into the conveyance-in section 3. The substrate S is conveyed from the conveyance-in section 3 to the plating processing section 4. The plating processing section 4 performs electrolytic plating processing on the substrate S to form a metal coating film on the surface (upper surface Sa) thereof. The substrate S subjected to the plating processing is subjected to a rinsing process in the rinsing processing section 5, and is finally conveyed out to the conveyance-out section 6.

[0148] Figure 14is a flowchart showing the plating process. Also, Figure 15 is a diagram schematically showing the operation of each section. More specifically, Figure 15 is a diagram showing the operation of each section as time elapses with time T as the time axis. After the unprocessed substrate S is supplied to the in-feed section 3 at time T0, the device sections perform the following operations. The initial state of each section is shown in brackets in the diagram. Also, Figure 15 In the diagram, the portion in which the vertical line of each processing section is shown in a thick solid line means that the substrate S is present in the processing section.

[0149] Each section of the plating device 1 is set in advance to a predetermined initial state. In the initial state, the chuck mechanism 400 is positioned at the plating position above the plating bath 41, and the upper chuck 411 and the lower chuck 421 are positioned at the upper position where they do not interfere with the plating bath 41. Also, the upper chuck 411 and the lower chuck 421 can be positioned further downward as long as they do not interfere with the conveyance of the substrate S along the conveyance path P.

[0150] The substrate S that is conveyed into the in-feed section 3 is temporarily held therein. In the plating processing section 4, the shutters 41a, 41b of the plating bath 41 are opened, so that the substrate S can be conveyed along the conveyance path P. At this time, the plating solution supplied from the plating solution supply / drain section 49 is stored in the plating bath 41 to a level that does not flow out of the opening. Also, for the anode electrode unit 45, the isolation bath 450 is retracted to the upper position, and the internal space 454 is not storing the plating solution. In the rinsing processing section 5, the shutters 51a, 51b of the rinsing bath 51 are also opened, so that the substrate S can be conveyed along the conveyance path P. At the out-feed section 6, there is no substrate S at this point in time.

[0151] At time T1, the conveyance section 2 starts to convey the substrate S, and the substrate S is conveyed along the conveyance path P in the conveyance direction Dt (+Y direction) and is finally conveyed to the plating bath 41 (step S101). Figure 15 In the diagram, the dotted arrows show the conveyance of the substrate S by the conveyance section 2.

[0152] When the substrate S is conveyed into the plating bath 41, the shutters 41a, 41b are closed. The upper chuck 411 and the lower chuck 421 of the chuck mechanism 400 are lowered toward the substrate S housed in the plating bath 41 and hold the substrate S (step S102). Also, for the anode electrode unit 45, the isolation bath 450 is lowered and is disposed in opposition to the upper surface of the substrate S held in the plating bath 41. Also, there can be an embodiment in which the substrate S is conveyed to the plating bath 41 in a state in which the isolation bath 450 is already lowered in advance.

[0153] In this state, the electroplating solution supply / drain unit 49 supplies the electroplating solution L to the electroplating bath 41 (step S103). Also, in parallel with this, the electroplating solution supply / drain unit 49 supplies the electroplating solution L2 to the isolation bath 450. Thus, the state shown in Fig. 6, i.e., the state in which the substrate S is immersed in the electroplating solution L in the electroplating bath 41, the anode electrode 451 is immersed in the electroplating solution L2 in the isolation bath 450, and the lower surface of the electrolytic diaphragm 453 of the bottom surface of the isolation bath 450 is in contact with the electroplating solution L in the electroplating bath 41, is achieved. Figure 6A

[0154] Also, by outputting a predetermined current from each output unit 71a and the like of the power supply unit 7 (step S104), the electroplating treatment is performed on the substrate S. By bringing the cathode electrode, which extends long in the Y direction, into contact with both end portions in the X direction in the upper surface Sa of the substrate S, the deviation in the current density in the upper surface Sa of the substrate S can be suppressed, and thus the electroplating film with good uniformity can be formed.

[0155] At this time, the chuck mechanism 400 swings the substrate S in the electroplating bath 41 in conjunction with the conveyance roller 21 (step S105), and thus the uniformity of the electroplating film can be further improved. Specifically, by the action of the moving mechanism 43, the support frame 430 that supports the chuck mechanism 400 alternately repeats the movement in the (+Dt) direction and the movement in the (-Dt) direction. Thus, the chuck mechanism 400 mounted on the support frame 430 moves back and forth in the Y direction as a whole, and the substrate S held by the chuck mechanism 400 swings in the Y direction in the electroplating solution L.

[0156] At this time, the conveyance roller 21 is linked with the support frame 430. That is, when the support frame 430 moves in the (+Y) direction and the chuck mechanism 400 moves the substrate S in the (+Y) direction, the conveyance roller 21 rotates in the forward direction, i.e., rotates in a direction in which the substrate S is conveyed in the conveyance direction Dt. On the other hand, when the support frame 430 moves in the (-Y) direction and the chuck mechanism 400 moves the substrate S in the (-Y) direction, the conveyance roller 21 rotates in the reverse direction, i.e., rotates in a manner in which the substrate S is conveyed in the direction opposite to the conveyance direction Dt (-Dt).

[0157] By thus swinging the substrate S in the electroplating solution L, the electroplating solution L can be stirred to reduce the deviation in the ion concentration in the liquid, and thus the uniformity of the electroplating film can be improved. The swinging of the substrate S in the electroplating bath 41 is achieved by the linkage of the chuck mechanism 400 that holds the end portions of the substrate S and the conveyance roller 21 that supports the central portion of the substrate S from the lower surface side. Thus, it is possible to prevent the application of local stress to the substrate S, maintain the horizontal posture, and swing the substrate S.

[0158] ​After the above state is continued for a predetermined time, the supply of current is stopped (step S106), and thus the plating treatment is stopped. Subsequently, the plating solution L is discharged from the plating bath 41, and the plating solution L2 is discharged from the isolation bath 450 (step S107). The discharge from the isolation bath 450 is achieved by the following procedure. That is, in a state where the isolation bath 450 is retracted upward by the support mechanism 460, the lifting mechanism 47 is operated to lift the (-Y) side end portion of the isolation bath 450.

[0159] Subsequently, the chuck mechanism 400 is released from the holding of the substrate S (step S108), and the shutter 41b is opened. At time T2, the conveyance section 2 transfers the substrate S from the plating treatment section 4 to the rinsing treatment section 5 (step S109). By releasing the holding of the substrate S after the discharge of the plating solution L, the cathode electrode 412 can be prevented from contacting the plating solution. Further, there is no such limitation for the anode electrode 451. Thus, as for the discharge from the isolation bath 450, it can be performed at any time point after the current is stopped. That is, it is not necessary to be performed simultaneously with the discharge of the plating solution L from the plating bath 41.

[0160] In the rinsing treatment section 5, when the substrate S is housed in the rinsing bath 51, the shutters 51a, 51b are closed. The rinsing solution is supplied from the rinsing solution supply / drain section 59, and the substrate S is subjected to the rinsing treatment (step S110). After the rinsing treatment is performed for a predetermined time, the supply of the rinsing solution is stopped, and the shutter 51b is opened. At time T3, the substrate S is carried out to the carry-out section 6 (step S111).

[0161] Further, when the plating solution is discharged from the plating bath 41, it is not necessary to completely discharge the liquid in the bath. That is, as long as the liquid is discharged to a degree that the substrate S supported in the bath can be carried out from the liquid, it is not problematic that the liquid remains in the bath. On the contrary, by leaving the liquid, the amount of the liquid required to fill the bath when the next substrate S is treated can be reduced. This contributes to the reduction of the consumption amount of the liquid and the reduction of the environmental load.

[0162] On the other hand, after the holding of the substrate S is released, the chuck mechanism 400 is subjected to a cleaning treatment for removing the plating solution adhered to the upper chuck 411 and the lower chuck 421 (step S112). The content of the cleaning treatment is arbitrary, and for example, one of them is as follows. That is, the support mechanism 43 moves the support frame 430 in the (-Y) direction, and positions each chuck mechanism 400 at a cleaning position above the cylinder 44. In this state, the cleaning mechanism 48 cleans the chuck mechanism 400, and more specifically, the upper chuck 411 and the lower chuck 421 by supplying an appropriate cleaning solution or spraying air.

[0163] As for the movement of the chuck mechanism 400 between the plating position and the cleaning position, as described above, the support mechanism 43 is operated to move the support frame 430 in the (-Y) direction, and the lifting mechanism 47 is operated to lift the (-Y) side end portion of the support frame 430. Thus, the chuck mechanism 400 is moved to the cleaning position. Figure 2As shown by the broken line in FIG. 4, the upper chuck 411 and the lower chuck 421 are retracted to the upper side by the lifting mechanisms 412, 422. Thus, the upper chuck 411 and the lower chuck 421 can be prevented from contacting the wall surface of the plating bath 41 during movement. Hereinafter, the Z-direction position of the upper chuck 411 and the lower chuck 421 at this time is referred to as an "upper position".

[0164] The chuck mechanism 400 after cleaning is returned to the plating position (step S113). By cleaning the chuck mechanism 400 in this manner, the plating solution adhering to the chuck mechanism 400 can be prevented from adhering to the substrate S when processing is performed on the next substrate S. In the case where there is a substrate S that should be further processed, the processing is repeated from step S101.

[0165] As described above, in the plating apparatus of the present embodiment, the substrate S, which is the object of plating processing, is supported in the plating bath 41 in a horizontal posture with one main surface Sa of the surface to be plated facing upward, i.e., in a so-called face-up state. The cathode electrode 412 is in contact with the peripheral portion of the substrate S, and the anode electrode 451 is disposed facing the upper surface of the substrate S.

[0166] However, the anode electrode 451 is separated from the substrate S by the electrolytic diaphragm 453. Thus, for metal ions that are the material of the plating film, a path between the anode electrode 451 and the substrate S is ensured, and on the other hand, for insoluble components and liquid components, the anode electrode 451 and the substrate S are isolated. Thus, anode sludge generated from the free material from the anode electrode 451 can be prevented from adhering to the substrate S, which can cause a decrease in the quality of the plating film.

[0167] Further, the anode electrode 451 is divided into a plurality of electrode plates 451a to 451i, and a constant current source, i.e., an output section 71a to 71i of the power supply section 7 is connected to each electrode plate independently. Further, the output current from each output section 71a to 71i can be set independently. Thus, even in the case where the substrate S is large, the deviation of the current density distribution in the plane of the substrate S can be suppressed, and the uniformity of the film thickness of the plating film can be achieved.

[0168] Further, regarding the replacement of the plating solution in the isolation bath 450, since the lower surface of the isolation bath 450 is disposed facing the substrate S, it is difficult to provide a mechanism for draining the solution below the isolation bath 450. Thus, in the present embodiment, a drain is provided in the side surface of the isolation bath 450. Further, in order to drain the solution efficiently, a mechanism for lifting the end portion of the isolation bath 450 on the side opposite to the side surface in which the drain is provided to incline the bottom surface is provided. Thus, the discharge of the plating solution can be promoted.

[0169] That is, the isolation groove 450 of the present embodiment can switch the posture between a horizontal posture in which the bottom surface is horizontal and an inclined posture in which the bottom surface is significantly inclined with respect to the horizontal plane. In the horizontal posture, the anode electrode 451 can be opposed to the substrate S to perform the plating treatment. On the other hand, in the inclined posture, the plating solution remaining in the inner space 454 of the isolation groove 451 can be efficiently discharged. Thereafter, new plating solution is received, and thus, the plating solution stored in the inner space 454 can be maintained in a fresh state.

[0170] <Modification Example>

[0171] Figure 16A to Figure 16C is a view showing a modification example of the anode electrode. The anode electrode 451 in the above-described embodiment is obtained by arranging nine electrode plates 451a to 451i having substantially the same shape in a 3 x 3 matrix. However, the mode of dividing the anode electrode into a plurality of pieces is not limited to this, and various modes can be considered. For example, in the anode electrode 456 shown in Figure 16A , substantially the same electrode plates are arranged in a 5 x 4 matrix. In this way, the number of electrode plates arranged is arbitrary and is not limited to the above-described embodiment.

[0172] Further, in the anode electrode 457 shown in Figure 16B , a large-area electrode plate is arranged in a central portion where a relatively uniform current density is easily obtained. On the other hand, in a peripheral portion and a corner portion where a current density deviation is easily generated, the area of the electrode plate is made smaller. Thus, fine adjustment of the current density distribution is easily performed. In this way, the shape and size of each electrode plate can also be appropriately specified in accordance with the purpose.

[0173] Further, Figure 16C The anode electrode 458 shown in

[0174] In this way, various modes can be considered for the division mode of the anode electrode. In the setting of the division mode and the distribution of the current to each electrode plate, for example, a method of actually measuring the current density distribution by a preliminary experiment and deciding based on the result thereof can be employed. Specifically, in a region in which the current density varies less in the substrate surface, the necessity of finely dividing the electrode plate opposed thereto is low. On the contrary, in a region in which the current density varies greatly, by finely dividing the electrode plate, adjustment of the current density distribution can be easily performed. Further, the current setting value is made smaller in a region in which the current density is higher, and thus, uniformization of the current density can be achieved.

[0175] Especially, in the case of holding two of the four edges of the rectangular substrate in opposition by the chuck, since the cathode electrode is disposed in the vicinity of the above two edges, it is predicted that the current distribution is significantly different between the vicinity of the two edges which are not held. Even in this case, by adjusting the division pattern of the anode electrode and the supply current value to each electrode plate, it is possible to suppress the deviation of the current density distribution and achieve the improvement of the uniformity of the plated film.

[0176] Figure 17A and Figure 17B is a view schematically showing a modification example of the support mechanism in the anode electrode unit. Further, here, for the configurations common or equivalent to those in the above embodiment, common symbols are marked and the explanation is omitted. In the above embodiment, the isolation groove 450 is tilted by winding the wire 471 of the lifting mechanism 47, and the wire 471 is installed to the isolation groove 450 at a position shifted in the Y direction from the middle point of the two hinge members 455c arranged in the Y direction. Instead, for example, as shown in Figure 17A , a configuration can be adopted in which the isolation groove 450 is supported by two suspension mechanisms 467a, 467b having significantly different spring constants. That is, the isolation groove 450 is supported by the suspension mechanisms 467a, 467b installed to the support frame 461 in combination with the frame 455 of the isolation groove 450.

[0177] In order to maintain the isolation groove 450 in a horizontal posture, it is preferable to appropriately provide a stopper 469 which restricts the displacement of the isolation groove 450 downward. Further, the shape or the arrangement position of the stopper is not limited to the illustration, and is arbitrary as long as it can directly or indirectly restrict the displacement of the isolation groove 450 downward.

[0178] As shown by the dotted arrows in Figure 17B , when the support mechanism 460 raises the support frame 461, since the spring constants of the two suspension mechanisms 467a, 467b are different from each other, the isolation groove 450 becomes in a tilted state. In the example shown in Figure 17B , the spring constant of the support mechanism 467a provided on the (-Y) side is larger than that of the suspension mechanism 467b provided on the (+Y) side, and thus the (-Y) side end portion of the isolation member 450 is raised. Therefore, the same effect as that in the above embodiment can be obtained. Further, in the case where the support mechanism 460 itself supports the isolation groove 450 via the configuration for tilting the isolation groove 450, the lifting mechanism 47 can also lift the isolation groove 450 with the middle position of the two hinge members 455c in the Y direction as the action point.

[0179] <Other>

[0180] As explained above, in the described embodiment, the electroplating apparatus 1 corresponds to the "electroplating apparatus" of the present invention, and the electroplating tank 41, the clamping mechanism 400, the cathode electrode 412, the anode electrode 451, the power supply unit 7, and the isolation tank 450 function as the "processing tank," "holding unit," "cathode electrode," "anode electrode," "power supply unit," and "isolation unit" of the present invention, respectively. Furthermore, in the isolation tank 450, the frame 452 and the electrolytic diaphragm 453 correspond to the "side wall" and "bottom" of the present invention, respectively. Moreover, the electroplating solution L and the electroplating solution L2 correspond to the "electroplating solution" and "liquid" of the present invention, respectively. Furthermore, the support mechanism 460 and the lifting mechanism 47 of the anode electrode unit 45 function as the "tilting mechanism" of the present invention. In this embodiment, the nozzle 491 functions as the "supply unit" of the present invention, while the electroplating solution supply and discharge unit 49 functions as the "supply source" and "recovery unit" of the present invention.

[0181] Furthermore, the present invention is not limited to the above-described embodiments, and various modifications other than those described can be made without departing from its spirit. For example, in the above-described embodiment, the clamping mechanism 400 is provided on two opposing sides of the rectangular substrate S. However, it is also possible to use the clamping mechanism to hold all or three of the four sides instead.

[0182] Furthermore, for example, the above-described embodiment is configured such that the chuck mechanism 400 holds the substrate S, which is conveyed to the electroplating tank 41 by the conveying roller 21. However, the conveying means is arbitrary and not limited to rollers. On the other hand, an embodiment in which the substrate is conveyed while being held by the chuck mechanism is also considered. In this case, the conveying means are not a necessary configuration, but in order to stably maintain the posture of the large substrate, it is ideal to provide any support unit that supports the central portion of the substrate S from below.

[0183] Furthermore, the substrate to be processed does not necessarily have to be a geometric rectangle in the strict sense. For example, even if there are some irregularities on one side of the substrate, as long as the envelope shape can be regarded as approximately rectangular, it is acceptable.

[0184] Furthermore, for example, the power supply unit 7 in the above embodiment has a constant current output source that corresponds independently to each of the electrode plates constituting the anode electrode 451. Alternatively, the power supply unit can be configured by, for example, a combination of a single voltage source and a plurality of current limiting components provided corresponding to each electrode plate.

[0185] Furthermore, for example, in the power supply unit 7 of the above embodiment, each electrode plate constituting the anode electrode 451 has its own independent output unit. However, several electrode plates can also be connected in parallel to a common output unit. For example, even if it has Figure 16AThe anode electrode 456 of the illustrated split pattern can also achieve substantially the same effect as Figure 16B the anode electrode 457. Furthermore, the configuration of the connection relationship between the electrode plate and the power source can also be changed as needed.

[0186] Furthermore, for example, in the above embodiment, the anode electrode 451 is split into a plurality of electrode plates. However, the effect of preventing anode sludge from adhering to the substrate, which is obtained by isolating the anode electrode from the substrate using the isolation groove, can also be achieved in a plating device in which the anode electrode is composed of a single electrode plate.

[0187] Furthermore, in the above embodiment, the liquid stored in the plating bath 41 and the liquid stored in the isolation groove 451 are plating solutions that are the same or substantially the same in composition. However, the above configuration is also effective even in cases in which the liquids differ in composition. That is, each liquid can be independently supplied and discharged, and mixing of the two liquids can be avoided.

[0188] Furthermore, the anode electrode 451 of the above embodiment is a soluble electrode that contains a metal (for example, copper) that is the material of the plated film and is consumed as the plating process proceeds. However, even in the case of a non-soluble electrode in which the electrode material does not directly contribute to the plating reaction, the problem of unevenness in film thickness or film quality caused by a deviation in current density distribution can also occur. Therefore, in a non-soluble electrode, the split configuration described above can be provided to enable independent adjustment of the current, and functions to optimize the current density distribution and achieve uniformization of the film thickness.

[0189] As exemplified and described in the above specific embodiments, in the plating device of the present application, as the electrolytic separator, for example, a porous film or an ion exchange resin film can be used. According to this configuration, ions are allowed to move through the electrolytic separator, and on the other hand, non-soluble substances can be prevented from passing through. Therefore, plating processing can be performed without anode sludge adhering to the substrate.

[0190] Furthermore, for example, the configuration can also be such that a through-hole that becomes a discharge port is provided at a position that is lowest in the vertical direction in the inclined posture in the side wall of the isolation groove, and the discharge portion discharges the liquid from the discharge port. According to this configuration, by the isolation groove being in the inclined posture, the liquid inside is guided toward the discharge port, and thus discharge of the liquid can be performed with high efficiency.

[0191] More specifically, for example, in a case where the four side walls that surround the internal space from the lateral sides when the isolation tank is in the horizontal posture are formed in a rectangular shape in a plan view, the discharge port can be provided in one of the four side walls whose position in the vertical direction is lowest in the inclined posture. It is preferable that the discharge port is provided at a lower portion of the side wall, for example, at a connection portion with the bottom portion, so that the liquid can be discharged without remaining in the internal space.

[0192] Further, for example, the electroplating apparatus can further include a supply source that supplies the liquid to the supply portion, and at least a portion of a pipe that connects the supply source and the supply portion is composed of a flexible pipe. Further, for example, the electroplating apparatus can include a recovery portion that recovers the liquid discharged from the discharge port, and at least a portion of a pipe that connects the discharge port and the recovery portion is composed of a flexible pipe. According to the configuration, the posture of the isolation tank can be changed between the horizontal posture and the inclined posture without being hindered by the pipe. Further, it is possible to prevent the flow in the pipe from being hindered by such a change in posture.

[0193] Further, for example, in the present application, the liquid supplied to the storage tank can have the same or substantially the same composition as the electroplating solution stored in the treatment tank. Here, "substantially the same" means that the main components are common and the basic chemical properties are substantially the same, and includes a case where there is a slight difference in the content of each component, or a case where only the presence or absence, type, content, or the like of an additive is different. According to this configuration, the liquids separated by the electrolytic diaphragm can be considered to be substantially integrated. Therefore, it is possible to achieve the intended electroplating treatment reaction.

[0194] The present application has been described above with reference to specific embodiments, but the description is not intended to be interpreted in a limiting sense. If reference is made to the description of the application, various modifications of the disclosed embodiments are apparent to those skilled in the art as being equally applicable to other embodiments of the application. Accordingly, it is considered that the appended claims encompass such modifications or embodiments within the scope of the application.

[0195] Industrial Applicability

[0196] The present application is applicable to a technology of performing an electroplating treatment on one main surface of a substrate to form a film. In particular, it has a significant effect in a case where a large rectangular substrate is the target of the treatment.

[0197] Explanation of Reference Numerals

[0198] 1: Electroplating apparatus

[0199] 2: Conveying portion

[0200] 4: Electroplating treatment portion

[0201] 41: Electroplating tank (treatment tank)

[0202] 400: chuck mechanism (holding portion)

[0203] 412: cathode electrode

[0204] 450: partition groove (partition portion)

[0205] 451: anode electrode

[0206] 452: frame (side wall)

[0207] 453: electrolytic diaphragm

[0208] 46: support mechanism (tilting mechanism)

[0209] 47: lifting mechanism (tilting mechanism)

[0210] 49: plating liquid supply and discharge portion (supply source, recovery portion)

[0211] 491: nozzle (supply portion)

[0212] L: plating liquid (plating liquid)

[0213] L2: plating liquid (liquid)

[0214] S: substrate

[0215] Sa: upper surface (one main surface) of the substrate S

Claims

1. An electroplating apparatus for electroplating at least one main surface of a flat substrate, wherein, have: Processing tank for storing electroplating solution; The holding section holds the substrate in a horizontal position with one main surface facing upward within the processing tank; The cathode electrode is in contact with a portion of one main surface of the substrate held by the holding portion; An anode electrode is disposed above the substrate held by the holding portion and faces the main surface; A power supply unit is connected to the anode electrode and the cathode electrode; and An isolation section surrounds the sides and bottom of the anode electrode and isolates the anode electrode from the electroplating solution within the processing tank; The isolation section has: The box-shaped isolation tank is at least composed of an electrolytic diaphragm at the bottom and houses the anode electrode in its internal space; The tilting mechanism switches the posture of the isolation groove between a horizontal posture where the bottom is horizontal and a tilted posture where the bottom is tilted relative to the horizontal plane. The supply unit supplies liquid to the internal space and immerses the anode electrode in the liquid; and The discharge section discharges the liquid from the isolation tank in the tilted position.

2. The electroplating apparatus as described in claim 1, wherein, The electrolytic membrane is a porous membrane or an ion exchange resin membrane.

3. The electroplating apparatus as described in claim 1 or 2, wherein, In the side wall of the isolation groove, at the lowest position in the vertical direction under the inclined posture, a through hole is provided to serve as a discharge outlet. The discharge section discharges the liquid from the discharge port.

4. The electroplating apparatus as described in claim 3, wherein, The isolation groove, when in the horizontal position, is formed into a rectangular shape when viewed from above by the four side walls that surround the internal space from the sides, and the outlet is located on the side wall that is lowest in the vertical direction when in the inclined position.

5. The electroplating apparatus as described in claim 1, wherein, It has a supply source that delivers the liquid to the supply unit. At least a portion of the piping connecting the supply source and the supply unit is flexible piping.

6. The electroplating apparatus as described in claim 3, wherein, It is equipped with a recovery unit to recover the liquid discharged from the outlet. At least a portion of the piping connecting the outlet and the recovery unit is flexible piping.

7. An electroplating method for electroplating at least one main surface of a flat substrate, wherein, The following steps are required: The step of holding the substrate in a horizontal position with one main surface facing upwards by a holding part in a treatment tank for storing electroplating solution; The steps include: bringing the cathode electrode into contact with a portion of one main surface of the substrate held by the holding portion, and, on the other hand, disposing the anode electrode facing the one main surface above the substrate. and The step of applying a voltage between the anode electrode and the cathode electrode; The anode electrode is surrounded on the sides and below by an isolation tank, at least at the bottom, which is composed of an electrolytic membrane, thereby isolating it from the electroplating solution, and the voltage is applied while it is immersed in the liquid stored in the isolation tank. After the voltage is applied, the orientation of the isolation tank is changed from a horizontal orientation to an inclined orientation, and the liquid is discharged from the lowest position in the vertical direction of the side wall of the isolation tank in the inclined orientation.

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