Wearable device including conductive member for forming antenna

Abstract

The wearable device may include: a metal frame; a display; a printed circuit board (PCB); a wireless charging coil; a conductive member disposed between the wireless charging coil and the printed circuit board, facing the wireless charging coil, and spaced apart from the wireless charging coil; and a wireless communication circuit disposed on the printed circuit board, where the wireless communication circuit is configured to transmit or receive a radio frequency (RF) signal by using the metal frame, the conductive member is coupled to the wireless charging coil, and the conductive member, the wireless charging coil, and the display may be configured as a ground of the metal frame.

Description

TECHNICAL FIELD

[0001] The following description relates to a wearable device including a conductive member forming an antenna. BACKGROUND

[0002] Various portable communication devices such as smart phones, tablet PCs, and wearable devices are being developed. Among them, wearable devices such as smart watches are increasingly popular due to their provision of various functions and conveniences.

[0003] As communication technology advances, the communication frequency of these devices is increasing. Accordingly, there is a need to design and implement an antenna that supports various radio frequencies.

[0004] The above-described information can be provided as related art for the purpose of helping to understand the present disclosure. It is not claimed or determined that any of the above-described information can be used as prior art related to the present disclosure. SUMMARY

[0005] TECHNICAL SOLUTION

[0006] According to one or more example embodiments, a wearable device can include a metal frame, a display, a printed circuit board (PCB), a wireless charging coil, a conductive member disposed between the wireless charging coil and the PCB, facing the wireless charging coil, and spaced apart from the wireless charging coil, and a wireless communication circuit disposed on the PCB. The wireless communication circuit can be configured to transmit or receive a radio frequency (RF) signal using the metal frame, the conductive member can be coupled to the wireless charging coil, and the conductive member, the wireless charging coil, and the display can be configured as a ground of the metal frame.

[0007] The PCB can include a first portion forming a first part of a periphery of the PCB, a second portion spaced apart from the first portion and forming a second part of the periphery opposite the first part, and a third portion between the first portion and the second portion, forming a remaining part of the periphery. The wireless communication circuit can be configured to feed power to the metal frame connected to the first portion of the PCB, the conductive member and the wireless charging coil can be connected to the first portion, respectively, the display can be connected to the second portion, and the metal frame can be connected to the second portion.

[0008] The wireless communication circuit can be configured to feed power to the metal frame through a first point on the first portion of the PCB, the conductive member can be connected to a ground of the PCB through a second point on the first portion of the PCB, the wireless charging coil can be connected to the ground of the PCB through a third point on the first portion of the PCB, the display can be connected to the ground of the PCB through a fourth point on the second portion of the PCB, and the metal frame can be connected to the ground of the PCB through a fifth point on the second portion of the PCB.

[0009] The third point can be located between the first point and the second point, as viewed from a top view of the PCB.

[0010] The second point can be closer to the first point than the second point to the fourth point and the fifth point.

[0011] The third point can be closer to the first point than the third point to the fourth point and the fifth point.

[0012] The wearable device can further include: a first flexible PCB connecting the display to the PCB; a first connector disposed on the PCB and coupled to the first flexible PCB; a second flexible PCB connecting the wireless charging coil to the PCB; a second connector disposed on the PCB and coupled to the second flexible PCB; and a third connector disposed on the PCB and coupled to the conductive member.

[0013] The third connector can include a C-clip connector, and the conductive member can be in contact with the C-clip connector.

[0014] The wearable device can further include a shield disposed on the PCB. The wireless communication circuit can be disposed on the third portion of the PCB. The shield can be disposed on the third portion around the wireless communication circuit.

[0015] The wearable device can include at least one of: a first plurality of matching circuits, wherein any one of the first plurality of matching circuits is configured to be selectively connected between the ground and the second point of the PCB; a second plurality of matching circuits, wherein any one of the second plurality of matching circuits is configured to be selectively connected between the ground and the fifth point of the PCB; or a matching circuit connected between the wireless communication circuit and the first point of the PCB.

[0016] The conductive member can include: a closed loop shape; an open ring shape having two open ends; or a circular plate shape.

[0017] The conductive member can have an open loop shape having two open ends, and the second point can overlap one end of the two open ends based on a direction perpendicular to the PCB.

[0018] The conductive member can include: a first portion parallel to the PCB and facing the wireless charging coil; and a second portion extending from the first portion to the PCB and connecting the first portion to the PCB. The first portion of the conductive member can be spaced apart from the PCB.

[0019] The wearable device can further include: a cover coupled to the metal frame and configured to contact a body wearing the wearable device. The cover can support the wireless charging coil.

[0020] The wearable device can further include a shielding member covering the wireless charging coil supported by the cover. The cover can include a support portion including a first surface facing the conductive member and a second surface opposite the first surface and facing the PCB, the shielding member can include a first surface facing the first surface of the support portion, and the conductive member can be attached to the first surface of the support portion or the first surface of the shielding member.

[0021] The second portion of the conductive member can penetrate the support portion.

[0022] The wearable device can further include a capacitor disposed on the PCB. The conductive member can be connected to the wireless charging coil through the capacitor.

[0023] According to one or more example embodiments, a wearable device can include a frame that can include a conductive portion, a display, a wireless charging coil, a printed circuit board (PCB), a conductive member disposed between the wireless charging coil and the PCB, facing the wireless charging coil, spaced apart from the wireless charging coil, and a wireless communication circuit disposed on the PCB. The wireless communication circuit can be configured to transmit or receive a radio frequency signal (RF signal) using the conductive portion, the conductive member can be coupled to the wireless charging coil, the conductive member, the wireless charging coil, and the display can be configured to be a ground of the conductive portion. The PCB can include a first portion forming a first part of a periphery of the PCB, a second portion spaced apart from the first portion and forming a second part of the periphery opposite the first part, and a third portion between the first portion and the second portion, forming a remaining part of the periphery. The wireless communication circuit can be configured to feed the conductive portion through the first portion connected to the conductive portion, the conductive member and the wireless charging coil can be configured to be grounded in the first portion, respectively, and the display can be configured to be grounded in the second portion.

[0024] The first portion can include a first point connected to the conductive portion, the wireless communication circuit being configured to feed the conductive portion through the first point, a second point at which the conductive member is configured to be grounded, and a third point at which the wireless charging coil is configured to be grounded. The second portion includes a fourth point at which the display is configured to be grounded.

[0025] The entire frame can be formed of the conductive portion.

[0026] The conductive portion can be configured to be grounded in the second portion.

[0027] The conductive portion can be configured to be grounded at a fifth point on the second portion and a sixth point spaced apart from the fifth point.

[0028] The frame can include a non-conductive frame, and the conductive portion can include a conductive pattern disposed on an inner surface of the non-conductive frame.

[0029] The second point can be closer to the first point than the third to fifth points, and the third point can be closer to the first point than the fourth and fifth points.

[0030] The conductive member can include a first portion facing the wireless charging coil and a second portion extending from the first portion so that the first portion is connected to the PCB, and the first portion of the conductive member can be spaced apart from the PCB.

[0031] According to one or more example embodiments, a wearable device can include a frame, a display, a wireless charging coil, a printed circuit board (PCB) between the display and the wireless charging coil, a conductive member disposed between the wireless charging coil and the PCB, facing the wireless charging coil, and spaced apart from the wireless charging coil, and a wireless communication circuit disposed on the PCB. The wireless communication circuit can be configured to transmit or receive a radio frequency signal (RF signal) using the display, the conductive member can be coupled to the wireless charging coil, and the conductive member and the wireless charging coil can be configured as a ground of the display.

[0032] The PCB can include a first portion forming a first part of a periphery of the PCB, a second portion spaced apart from the first portion and forming a second part of the periphery opposite the first part, and a third portion between the first portion and the second portion, forming a remaining part of the periphery. The wireless communication circuit can be configured to transmit a signal of a first frequency band by feeding power to the frame via the first portion connected to the frame, and transmit a signal of a second frequency band different from the first frequency band by feeding power to the display via the second portion connected to the display. The frame and the wireless charging coil can be respectively configured to be grounded in the first portion. BRIEF DESCRIPTION OF DRAWINGS

[0033] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0034] Figure 1 is a front perspective view of an electronic device according to one or more embodiments;

[0035] Figure 2 is a rear perspective view of an electronic device according to one or more embodiments;

[0036] Figure 3 is an exploded perspective view of an electronic device according to one or more embodiments;

[0037] Figure 4 is a cross-sectional view of an electronic device according to one or more embodiments;

[0038] Figure 5 illustrates a conductive member according to one or more embodiments;

[0039] Figure 6 FIG. 1 is a diagram illustrating a first cover on which a conductive member is disposed according to one or more embodiments;

[0040] Figure 7a FIG. 2 is a diagram illustrating a printed circuit board according to one or more embodiments;

[0041] Figure 7b FIG. 3 is a diagram illustrating an electrical connection relationship of an electronic device according to one or more embodiments;

[0042] Figure 8 FIG. 4 is a diagram illustrating an electronic device according to one or more embodiments;

[0043] Figure 9 FIG. 5 is a diagram illustrating a current flow of an electronic device according to one or more embodiments;

[0044] Figure 10 FIG. 6 is a diagram illustrating a radiation effective area of an electronic device according to one or more embodiments;

[0045] Figure 11 FIG. 7 is a diagram illustrating a radiation pattern of an electronic device according to one or more embodiments;

[0046] Figure 12 FIG. 8 is a graph illustrating a radiation efficiency of an electronic device according to one or more embodiments;

[0047] Figure 13 FIG. 9 illustrates a radiation efficiency according to a distance between a first point and a second point according to one or more embodiments;

[0048] Figure 14 FIG. 10 illustrates a reflection coefficient according to a matching circuit according to one or more embodiments;

[0049] Figure 15 FIG. 11 is a diagram illustrating an electronic device according to one or more embodiments;

[0050] Figure 16 FIG. 12 is a diagram illustrating an electronic device according to one or more embodiments;

[0051] Figure 17 FIG. 13 is a diagram illustrating an electronic device according to one or more embodiments;

[0052] Figure 18 FIG. 14 illustrates a shape of a conductive member according to one or more embodiments;

[0053] Figure 19 FIG. 15 is a graph illustrating a radiation efficiency according to a shape of a conductive member according to one or more embodiments; and

[0054] Figure 20 is a block diagram illustrating an electronic device in a network environment according to various embodiments. SUMMARY

[0055] Figure 1 is a front perspective view of an electronic device 100 according to one or more embodiments. Figure 2 is a rear perspective view of an electronic device 100 according to one or more embodiments. Referring to Figure 1 and Figure 2 , an electronic device 100 (e.g., an electronic device 2001) according to one or more embodiments can include a housing 110 forming a front surface 110A, a rear surface 110B, and side surfaces 110C around a space between the front surface 110A and the rear surface 110B, and fastening members 150 and 160 connected to at least a portion of the housing 110 and configured to detachably bind the electronic device 100 to a portion (e.g., a wrist, etc.) of a user's body. For example, the electronic device 100 can be referred to as a wearable device or a wearable electronic device. Figure 20

[0056] The housing 110 can refer to a structure forming at least a portion of the front surface 110A, the rear surface 110B, and the side surfaces 110C. In one or more embodiments, the front surface 110A can be formed of a front plate 101 (e.g., a glass plate including various coating layers, or a polymer plate), at least a portion of which is formed to be substantially transparent. The rear surface 110B can be formed of a rear plate 107 that is substantially opaque. The rear plate 107 may, for example, be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surfaces 110C can be formed of a frame 106 coupled to the front plate 101 and the rear plate 107. For example, the frame 106 can include metal. For example, the frame 106 can be referred to as a "metal frame," a "side member," or a "side bezel structure."

[0057] The fastening members 150 and 160 can be formed of various materials and shapes. For example, the fastening members 150 and 160 can be formed of a plurality of unit links that are integral or movable with respect to each other by a woven material, leather, rubber, polyurethane, metal, ceramic, or a combination of at least two of the above materials.

[0058] According to one or more embodiments, the electronic device 100 can include a display 120, an audio module (e.g., a speaker, a microphone, etc.), a camera module (e.g., a front camera or a rear camera, etc.), an Inter-IC (I2C) bus, a Serial Peripheral Interface (SPI), a Mobile Industry Processor Interface (MIPI), and a Universal Integrated Circuit Bus (I2C). Figure 20 ​The electronic device 100 can include at least one or more of a communication module 2100, an interface 2200, a sensor module 111, a key input device 102, 103, and 104, and a connector hole 109. In some embodiments, the electronic device 100 can omit at least one of the components (e.g., the key input device 102, 103, and 104, the connector hole 109, or the sensor module 111), or can additionally include other components.

[0059] The display 120 can be exposed, for example, through a large portion of the front plate 101. The shape of the display 120 can correspond to the shape of the front plate 101, and can be various shapes such as a circular shape, an elliptical shape, or a polygonal shape. The display 120 can be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0060] The audio module can include a microphone hole 105 and a speaker hole 108. A microphone for obtaining external sound can be disposed within the microphone hole 105. The microphone can include a plurality of microphones that can detect the direction of sound, but is not limited thereto. The speaker hole 108 can serve as an external speaker and a receiver for a call. In some embodiments, the speaker hole 108 can be integrated into the microphone hole 105, such that the speaker hole 108 and the microphone hole 105 can be implemented as one hole, or can include a speaker without the speaker hole 108 (e.g., a piezoelectric speaker).

[0061] The sensor module 111 can generate an electrical signal or a data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor module 111 can include, for example, a sensor module 111 (e.g., a heart rate monitor (HRM) sensor) disposed on the rear surface 110B of the housing 110. The electronic device 100 can further include at least one of a sensor module (e.g., a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor).

[0062] In one or more embodiments, the key input devices 102, 103, and 104 can include a scroll key 102 disposed on the front surface 110A of the housing 110 and rotatable in at least one direction, and / or key buttons 104 and 103 disposed on the side surface 110C of the housing 110. For example, the scroll key 102 can have a shape corresponding to that of the front plate 101. In another embodiment, the electronic device 100 can not include some or all of the above-described key input devices 102, 103, and 104. For example, the electronic device 100 can not include the scroll key 102. In one or more embodiments, the non-included scroll key 102 can be implemented in other forms such as a soft key on the display 120.

[0063] The connector hole 109 can accommodate a connector (e.g., a USB connector) for transmitting power and / or data to and receiving power and / or data from an external electronic device. The electronic device 100 can further include, for example, a connector cover that covers at least a portion of the connector hole 109 and blocks external foreign substances from flowing into the connector hole. In another embodiment, the electronic device 100 can not include the connector hole 109, in which case the electronic device 100 can transmit power and / or data to and receive power and / or data from an external electronic device by using wireless communication.

[0064] In one or more embodiments, the fastening members 150 and 160 can be detachably coupled to at least some areas of the housing 110 by using the locking members 151 and 161. For example, the fastening members 150 and 160 can include at least one of a fixing member 152, a fixing member fastening hole 153, a band guide member 154, and a band fixing ring 155.

[0065] In one or more embodiments, the fixing member 152 can be configured to fix the housing 110 and the fastening members 150 and 160 to a portion of a user's body (e.g., a wrist, etc.). The fixing member fastening hole 153 can fix the housing 110 and the fastening members 150 and 160 to a portion of a user's body in response to the fixing member 152. The band guide member 154 can allow the fastening members 150 and 160 to be tightly bound to a portion of a user's body by being configured to limit a range of movement of the fixing member 152 when the fixing member 152 is fastened to the fixing member fastening hole 153. The band fixing ring 155 can limit a range of movement of the fastening members 150 and 160 in a state in which the fixing member 152 and the fixing member fastening hole 153 are fastened.

[0066] Figure 3is an exploded perspective view of an electronic device according to one or more embodiments. The first direction D1 shown can be substantially perpendicular to the display 310 and can be a direction from the display 310 toward the cover 360. The second direction D2 can be a direction opposite to the first direction D1. Hereinafter, a repeated description of a configuration having the same reference numeral as the foregoing configuration can be omitted.

[0067] Referring to Figure 3 , the electronic device 300 (e.g., the electronic device 100) according to one or more embodiments can include a display 310, a frame 320 (e.g., the frame 106), a printed circuit board 350, a cover 360 (e.g., the rear plate 107), a conductive member 370, a wireless charging module 380, and / or a biometric sensor module 390 (e.g., the sensor module 111). Figure 1 Figure 1 In one or more embodiments, the display 310 can be disposed on a side (e.g., the first direction D1) of the frame 320. The display 310 can be coupled to the frame 320. The display 310 can be at least partially housed within the frame 320. For example, the display 310 can include a cover (e.g., the front plate 101) forming an outer appearance (e.g., the front surface 110A) of the electronic device 300, a display panel (e.g., the display 120) disposed under the cover, and a connection member (e.g., the connection member 312) connecting the display panel to the printed circuit board 350. Figure 2 Figure 2 In one or more embodiments, the frame 320 can be disposed between the display 310 and the cover 360. The frame 320 can form a space in which components of the electronic device 300 are disposed by surrounding a space between the display 310 and the cover 360. The frame 320 can be at least partially formed of a conductive material. For example, the frame 320 can be completely formed of a conductive material (e.g., metal), in which case the frame 320 can be referred to as a metal frame. As another example, the frame 320 can include a conductive portion (e.g., the conductive portion 1624) and a non-conductive portion (e.g., the non-conductive portion 1622). The metal frame or the conductive portion can function as an antenna radiator for transmitting and receiving radio frequency (RF) signals.

[0068] Figure 1 Figure 1 Figure 1 Figure 7b

[0069] Figure 16 Figure 16

[0070] ​​​​​​​​​​In one or more embodiments, the bracket 330 can be disposed inside the frame 320. For example, the bracket 330 can be located between the display 310 and the printed circuit board 350. For example, the display 310 can be disposed on one surface (e.g., a surface facing the first direction D1) of the bracket 330, and the printed circuit board 350 can be disposed on the other surface (e.g., a surface facing the second direction D2). The bracket 330 can support the display 310 and the printed circuit board 350. The bracket 330 can be formed of a metal material and / or a non-metal material (e.g., a polymer).

[0071] In one or more embodiments, the battery 340 can include, for example, a rechargeable secondary battery, as a device for supplying power to at least one component of the electronic device 300. For example, the battery 340 can be accommodated in a recess formed in the bracket 330. The recess can be formed on, for example, a surface of the bracket 330 facing the printed circuit board 350.

[0072] In one or more embodiments, the printed circuit board 350 can be disposed between the bracket 330 and the first cover 361. The printed circuit board 350 can be supported by the bracket 330. For example, a processor (e.g., the processor 2020 of FIG. 2), a memory (e.g., the memory 2030 of FIG. 2), a wireless communication circuit (e.g., the wireless communication module 2092 of FIG. 2), and / or an interface (e.g., the interface 2077 of FIG. 2) can be disposed on the printed circuit board 350. The processor can include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor hub, or a communication processor. The memory can include, for example, a volatile memory or a non-volatile memory. The interface can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The wireless communication circuit can transmit or receive an RF signal by using the frame 320. The interface can electrically or physically connect the electronic device 300 to, for example, an external electronic device, and can include a USB connector, an SD card / MMC connector, or an audio connector. Figure 20 Figure 20 Figure 20 Figure 20 In one or more embodiments, the cover 360 can be coupled under the frame 320 (e.g., the second direction D2) to enclose an internal space of the frame 320. The cover 360, the frame 320, and the display 310 forming an outer appearance of the electronic device 300 can be referred to as a housing (e.g., the housing 110 of FIG. 1) of the electronic device 300.

[0073] In one or more embodiments, the cover 360 can be coupled under the frame 320 (e.g., the second direction D2) to enclose an internal space of the frame 320. The cover 360, the frame 320, and the display 310 forming an outer appearance of the electronic device 300 can be referred to as a housing (e.g., the housing 110 of FIG. 1) of the electronic device 300. Figure 1

[0074] ​​​​In one or more embodiments, the cover 360 can include a first cover 361 and a second cover 362. The first cover 361 can be disposed between the frame 320 and the second cover 362. First and second holes 367 and 369 can be formed in the first cover 361. In one or more embodiments, the second cover 362 can be disposed below (e.g., the second direction D2) the first cover 361. The second cover 362 can cover the first and second holes 367 and 369 of the first cover 361. The first and / or second cover 362 can be formed of metal, plastic, glass, or a combination thereof, but is not limited thereto.

[0075] In one or more embodiments, the conductive member 370 can be disposed between the printed circuit board 350 and the wireless charging module 380. For example, the conductive member 370 can include a first portion 371 disposed between the first cover 361 and the wireless charging module 380, and a second portion 372 extending from the first portion 371 to the printed circuit board 350 through the first hole 367. For example, the first portion 371 of the conductive member 370 can be attached to the first cover 361 and / or the wireless charging module 380. In one or more embodiments, the conductive member 370 can be at least partially formed of a conductive material. For example, the conductive member 370 can include a conductive pattern formed on a carrier using laser direct structuring (LDS), a conductive pattern of a flexible printed circuit board, a conductive material deposited or plated on a substrate, a conductive metal sheet, a conductive metal film, or a conductive metal foil. In one or more embodiments, the conductive member 370 can be formed to be at least partially bendable. For example, the second portion 372 of the conductive member 370 can be formed to be bendable. The conductive member 370 can be referred to as a conductor.

[0076] In one or more embodiments, the wireless charging module 380 configured to transmit and receive a power signal to and from an external device can be disposed between the first cover 361 and the second cover 362. The wireless charging module 380 can be disposed between the conductive member 370 and the second cover 362. The wireless charging module 380 can be disposed on the second cover 362 (e.g., the first direction D1). For example, the wireless charging module 380 can be attached on the second cover 362. For example, the wireless charging module 380 can surround the biometric sensor module 390 on the second cover 362.

[0077] In one or more embodiments, the biometric sensor module 390 can be disposed between the first cover 361 and the second cover 362. The biometric sensor module 390 can be disposed on the second cover 362 (e.g., the first direction D1). The biometric sensor module 390 can be partially accommodated in the second hole 369. The biometric sensor module 390 can detect biometric information of a user through the second cover 362 by being disposed to face the second cover 362. For example, the biometric sensor module 390 can detect a biometric signal regarding a user's body that contacts the second cover 362. For example, the biometric sensor module 390 can include an optical sensor and / or an ultrasonic sensor for detecting a heart rate and / or an oxygen saturation, but is not limited thereto. In the case where the biometric sensor module 390 includes the optical sensor, the second cover 362 can be at least partially formed of a material capable of transmitting light (e.g., a transparent resin or glass).

[0078] Figure 4 is a cross-sectional view of an electronic device according to one or more embodiments. Figure 5 shows a conductive member according to one or more embodiments. Figure 6 shows a first cover on which a conductive member is disposed according to one or more embodiments.

[0079] Referring to Figure 4 In one or more embodiments, the printed circuit board 350 can include a first surface 350A and a second surface 350B. The first surface 350A can face the conductive member 370 (e.g., the second direction D2). The second surface 350B can be opposite the first surface 350A and can face the display 310 (e.g., the first direction D1). The first surface 350A of the printed circuit board 350 can be supported by the first cover 361.

[0080] In one or more embodiments, the wireless charging module 380 can include a wireless charging coil 382, a shielding member 384, and / or a connection member 386. The wireless charging coil 382 can generate a current induced from a magnetic field generated by a transmission coil of an external device. The shielding member 384 can improve power transmission and reception efficiency by concentrating a magnetic field to the wireless charging coil 382. For example, the shielding member 384 can be formed of a magnetic material to shield a magnetic field. For example, the shielding member 384 can be formed of ferrite, but is not limited thereto.

[0081] In one or more embodiments, the wireless charging coil 382 can be supported by the second cover 362. The wireless charging coil 382 can be disposed on the second cover 362 (e.g., the first direction D1). For example, the wireless charging coil 382 can be attached on the second cover 362. The shielding member 384 can be disposed on the second cover 362 to cover the wireless charging coil 382. The shielding member 384 can include a first surface 384A facing the conductive member 370 (e.g., the first direction D1). In one or more embodiments, the connection member 386 can connect the wireless charging coil 382 to the printed circuit board 350. For example, the positive electrode and the negative electrode of the wireless charging coil 382 can be electrically connected to the wireless charging circuit on the printed circuit board 350 through the first wire and the second wire of the connection member 386. The wireless charging circuit can include a rectifier that converts alternating current transmitted through the first wire and the second wire into direct current, a regulator that constantly limits the rectified output, or a charging circuit that supplies the output of the regulator to the battery 340. For example, the connection member 386 can extend from the wireless charging coil 382 to the printed circuit board 350 through the second hole 369 passing through the first cover 361. For example, the connection member 386 can include a flexible printed circuit board.

[0082] Referring to Figure 4 and Figure 5 In one or more embodiments, the first cover 361 can include a support portion 365. For example, the support portion 365 can be located at a central portion of the first cover 361. For example, the support portion 365 can include a first surface 365A facing the second cover 362 (e.g., the second direction D2) and a second surface 365B opposite the first surface 365A and facing the printed circuit board 350 (e.g., the first direction D1). In one or more embodiments, the first hole 367 or the second hole 369 can be formed in the support portion 365. For example, the first hole 367 and the second hole 369 can penetrate the support portion 365, respectively.

[0083] In one or more embodiments, the second cover 362 can cover the support portion 365 of the first cover 361. Since the second cover 362 covers the support portion 365 of the first cover 361, the support portion 365 can not be exposed to the outside.

[0084] Referring to Figure 4 , Figure 5 and Figure 6In one or more embodiments, the conductive member 370 can be disposed between the printed circuit board 350 and the wireless charging coil 382. For example, a first portion 371 of the conductive member 370 can be disposed between the support portion 365 of the first cover 361 and the wireless charging coil 382. For example, the first portion 371 can be parallel to the printed circuit board 350. For example, the first portion 371 can face the wireless charging coil 382. For example, the first portion 371 can face the wireless charging coil 382 face-to-face. For example, the first portion 371 of the conductive member 370 can overlap the wireless charging coil 382 based on a direction (e.g., the first direction D1) perpendicular to the printed circuit board 350. In one or more embodiments, the first portion 371 and the wireless charging coil 382 can be formed to be substantially the same or similar in size and / or shape to each other, such that an area facing each other is as large as possible, but are not limited thereto.

[0085] In one or more embodiments, the conductive member 370 can be spaced apart from the wireless charging coil 382. For example, the first portion 371 of the conductive member 370 can be spaced apart from the wireless charging coil 382. In one or more embodiments, the first portion 371 of the conductive member 370 can be attached on the support portion 365 of the first cover 361 and / or the shielding member 384. For example, the first portion 371 of the conductive member 370 can be attached on the first surface 365A of the support portion 365 and / or the first surface 384A of the shielding member 384.

[0086] In one or more embodiments, the conductive member 370 can be partially spaced apart from the printed circuit board 350. For example, the first portion 371 of the conductive member 370 can be spaced apart from the printed circuit board 350.

[0087] In one or more embodiments, the first portion 371 can have a ring shape extending in a circular shape along a periphery of the second cover 362 (or the wireless charging coil 382) when viewed from above (e.g., when viewed in the first direction D1, or viewed from above the PCB). For example, the first portion 371 can have a ring shape that is open in some sections, thereby forming two ends (i.e., two end portions) 371a and 371b of the ring. However, the shape of the conductive member 370 is not limited to the illustrated example. Various shapes of the conductive member 370 will be described later with reference to FIGS. 13A to 13C. Figure 18 Various shapes of the conductive member 370 will be described later with reference to FIGS. 13A to 13C.

[0088] In one or more embodiments, the second portion 372 can extend from the first portion 371 to the printed circuit board 350. For example, the second portion 372 can extend from the first end 371a of the first portion 371. In one or more embodiments, the second portion 372 can penetrate the first cover 361. For example, the second portion 372 can pass through the first hole 367 of the first cover 361. The second portion 372 can electrically connect the first portion 371 to the printed circuit board 350.

[0089] Figure 7a FIG. 1 is a diagram illustrating a printed circuit board according to one or more embodiments. Referring to FIG. 1, a printed circuit board 100 can include a first point A, a second point B, a third point C, a fourth point D, a fifth point E, and / or a sixth point F. For example, each of the first point A, the second point B, the third point C, the fourth point D, the fifth point E, and / or the sixth point F can be a point or an area located on a first surface 100A or a second surface 100B of the printed circuit board 100. Figure 7a

[0090] In one or more embodiments, the printed circuit board 100 can include a first portion 101, a second portion 102, and / or a third portion 103. The first portion 101 can include a first part 101a of a periphery of the printed circuit board 100. The second portion 102 can include a second part 102a of the periphery of the printed circuit board 100. For example, the second part 102a can be located opposite to the first part 101a. The second portion 102 can be spaced apart from the first portion 101. The third portion 103 can include a remaining part 103a of the periphery of the printed circuit board 100. For example, the third portion 103 can be formed between the first portion 101 and the second portion 102. The third portion 103 can extend from the first portion 101 to the second portion 102. The periphery of the printed circuit board 100 can include the first part 101a, the second part 102a, and the remaining part 103a.

[0091] In one or more embodiments, the first point A, the second point B, and the third point C can be located on the first portion 101 of the printed circuit board 100. The fourth point D, the fifth point E, and the sixth point F can be located on the second portion 102 of the printed circuit board 100. In one or more embodiments, a wireless communication circuit and a shielding member (e.g., a shield can) covering the wireless communication circuit can be disposed on the third portion 103 of the printed circuit board 100. The shielding member can not be located on the first portion 101 and the second portion 102 of the printed circuit board 100.

[0092] ​In one or more embodiments, a first area (e.g., the second portion 352) having the fourth point D connected to the display 310 and the printed circuit board 350 and a second area (e.g., the first portion 351) having the second point B connected to the conductive member 370 and the printed circuit board 350 can be areas facing each other. For example, the first area can be an area where the fourth point D is located, and the second area can be an area where the second point B is located. By positioning the second point B and the fourth point D as far away from the printed circuit board 350 as possible, the electrical length of the antenna ground can be lengthened.

[0093] Based on Figure 7a In one or more embodiments, the third point C can be located between the first point A and the second point B. The second point B can be closer to the first point A than the fourth point D, the fifth point E, and the sixth point F. The third point C can be closer to the first point A than the fourth point D, the fifth point E, and the sixth point F.

[0094] In one or more embodiments, based on one direction, the distance d1 between the first point A and the second point B can be about 15 mm or more, but is not limited thereto. Based on a direction perpendicular to the one direction, the distance d2 between the first point A and the second point B can be less than about 5 mm, but is not limited thereto.

[0095] Figure 7b FIG. 1 is a diagram illustrating an electrical connection relationship of an electronic device according to one or more embodiments. Figure 8 FIG. 2 is a diagram illustrating an electronic device according to one or more embodiments. Referring to FIG. 2, Figure 7b and Figure 8 and Figure 7a In one or more embodiments, the frame 320 can be connected to the first point A, the fifth point E, and the sixth point F of the printed circuit board 350. For example, the frame 320 can be electrically connected to the first point A, the fifth point E, and the sixth point F, respectively. The points of the frame 320 connected to the first point A, the fifth point E, and the sixth point F can be different from each other.

[0096] In one or more embodiments, the wireless communication circuit provided on the printed circuit board 350 can feed power to the frame 320 connected to the first portion 351 of the printed circuit board 350. For example, the wireless communication circuit can feed power to the frame 320 through a first point A on the first portion 351. A transmission line (or a conductive trace) connecting the wireless communication circuit and the first point A can be formed on and / or within the printed circuit board 350. The wireless communication circuit can transmit an RF signal of a first frequency band by feeding power to the frame 320. The wireless communication circuit can receive an RF signal of the first frequency band by using the frame 320. The first frequency band can include, for example, a low frequency band of about 300 MHz to 1,000 MHz, but is not limited thereto. In one or more embodiments, the connection 322 between the first point A and the frame 320 can be formed, for example, by the frame 320 contacting a connector (e.g., a C-clip connector) provided on the first point A, but is not limited thereto. Additionally or alternatively, the electronic device 300 can include a matching circuit for impedance matching connected between the first point A and the wireless communication circuit.

[0097] In one or more embodiments, the frame 320 can be grounded by being connected to the second portion 352 of the printed circuit board 350. For example, the frame 320 can be grounded through a fifth point E and a sixth point F on the second portion 352. For example, the frame 320 can be electrically connected to a ground of the printed circuit board 350 through the fifth point E and / or the sixth point F. For example, the ground can include at least one conductive area formed on the printed circuit board 350. The connection 324 between the fifth point E and the frame 320 can be formed, for example, by the frame 320 contacting a connector (e.g., a C-clip connector) disposed on the fifth point E, but is not limited thereto. The connection 326 between the sixth point F and the frame 320 can be formed, for example, by the frame 320 contacting a connector (e.g., a C-clip connector) provided on the sixth point F, but is not limited thereto. Alternatively, the frame 320 can be grounded at only one point among the fifth point E and the sixth point F.

[0098] In one or more embodiments, the conductive member 370 can be connected to the first portion 351 of the printed circuit board 350. For example, the conductive member 370 can be connected to a second point B on the first portion 351. For example, the conductive member 370 can be connected to the printed circuit board 350 by contacting a second portion 372 of the conductive member 370 with a connector (e.g., a C-clip connector) provided on the second point B, but is not limited thereto. The conductive member 370 can be grounded through the first portion 351 of the printed circuit board 350. For example, the conductive member 370 can be grounded through the second point B on the first portion 351. For example, the conductive member 370 can be electrically connected to a ground of the printed circuit board 350 through the second point B.

[0099] In one or more embodiments, the wireless charging coil 382 can be connected to the first portion 351 of the printed circuit board 350. For example, the wireless charging coil 382 can be connected to a third point C on the first portion 351. For example, the wireless charging coil 382 can be connected to the third point C through the connection member 386. For example, the wireless charging coil 382 can be connected to the printed circuit board 350 by coupling a connector (e.g., a plug) formed at an end portion of the connection member 386 to a corresponding connector (e.g., a socket) provided on the third point C. The wireless charging coil 382 can be connected to the wireless charging circuit through the first portion 351 of the printed circuit board 350.

[0100] In one or more embodiments, in order to prevent near-field loss between the conductive member 370 and the printed circuit board 350, the conductive member 370 can be spaced apart from the printed circuit board 350. For example, the first portion 371 of the conductive member 370 can be spaced apart from the printed circuit board 350 in the second direction D2. For example, based on the second direction D2, the first portion 371 of the conductive member 370 and the printed circuit board 350 can be spaced apart by a distance of about 1 mm or more, but are not limited thereto.

[0101] In one or more embodiments, the first portion 371 of the conductive member 370 spaced apart from and facing each other can be coupled with the wireless charging coil 382. For example, the ground area of the antenna can be expanded by coupling the conductive member 370 and the wireless charging coil 382. The conductive member 370 can be electromagnetically connected to the wireless charging coil 382. For example, the conductive member 370 and the wireless charging coil 382 can be capacitively coupled and / or inductively coupled. The conductive member 370 and the wireless charging coil 382 can function as a ground for an antenna for using at least a portion of the frame 320 as a radiator.

[0102] Additionally or optionally, the conductive member 370 and the wireless charging coil 382 can be connected through an element provided on the printed circuit board 350. For example, a wiring of the printed circuit board 350 connected to the conductive member 370 and a wiring of the printed circuit board 350 connected to the wireless charging coil 382 can be connected through a capacitor.

[0103] In one or more embodiments, the display 310 can be connected to the second portion 352 of the printed circuit board 350. For example, the display 310 can be connected to a fourth point D on the second portion 352. For example, the display 310 can be connected to the fourth point D of the printed circuit board 350 through the connection member 312. For example, the display 310 can be connected to the printed circuit board 350 by coupling a connector (e.g., a plug) formed on the connection member 312 with a corresponding connector (e.g., a socket) provided on the fourth point D. For example, the connection member 312 can include a flexible printed circuit board. In one or more embodiments, the display 310 can be grounded through the second portion 352 of the printed circuit board 350. For example, a conductive layer included in the display 310 and operating as a ground can be grounded through the fourth point D on the second portion 352. For example, the conductive layer of the display 310 can be electrically connected to the ground of the printed circuit board 350 through the fourth point D. The display 310 (e.g., a conductive layer of a display panel) can serve as a ground of an antenna that uses at least a portion of the frame 320 as a radiator.

[0104] Additionally or optionally, the electronic device 300 can include a first plurality of matching circuits and a first switch circuit connected between the second point B of the printed circuit board 350 and the ground. Any one of the first plurality of matching circuits selected through the first switch circuit can electrically connect the conductive member 370 connected to the second point B to the ground of the printed circuit board 350. Thereby, impedance matching and / or resonance frequency adjustment can be possible. The antenna characteristics according to the matching circuit connected to the second point B will be described later with reference to FIG. 4. Figure 14

[0105] Additionally or optionally, the electronic device 300 can include a second plurality of matching circuits and a second switch circuit connected between a fifth point E of the printed circuit board 350 and the ground. Any one of the second plurality of matching circuits selected through the second switch circuit can electrically connect the frame 320 connected to the fifth point E to the ground of the printed circuit board 350. Thereby, impedance matching and / or resonance frequency adjustment can be possible.

[0106] Additionally or optionally, the electronic device 300 can include a third plurality of matching circuits and a third switch circuit connected between a sixth point F of the printed circuit board 350 and the ground. Any one of the third plurality of matching circuits selected through the third switch circuit can electrically connect the frame 320 connected to the fifth point E to the ground of the printed circuit board 350. Thereby, impedance matching and / or resonance frequency adjustment can be possible.

[0107] ​Considering wearability, portability, and user preferences, wearable devices, such as electronic device 300, are becoming increasingly compact. Due to the limited size of wearable devices, the grounding of antennas, which affects various antenna characteristics such as coverage and bandwidth, may also be physically limited. In particular, antennas operating in low-frequency bands are essential for data communication; however, the small size of wearable devices typically further limits the implementation of such antennas, as the lower the resonant frequency, the longer the antenna needs to be.

[0108] Figure 9 This is a diagram illustrating the current flow in an electronic device according to one or more embodiments. (Refer to...) Figure 9 When the frame 320 is fed through the first point A, the display 310, printed circuit board 350, conductive member 370, and wireless charging coil 382 can be used as ground for an antenna that uses at least a portion of the frame 320 as a radiator. For example, when the frame 320 is fed through the first point A, a current path P can flow to the display 310, printed circuit board 350, conductive member 370, and wireless charging coil 382. The display 310 can extend the current path P originating from the printed circuit board 350. Additionally, the coupled conductive member 370 and wireless charging coil 382 can extend the current path P originating from the printed circuit board 350. Thus, by physically and electrically extending the ground of the antenna using the frame 320, bandwidth and radiation efficiency can be improved. Furthermore, the electrical length of the antenna used to form the low-frequency band resonant frequency can be ensured. The low-frequency band can be from approximately 300 MHz to 1 GHz or less, but is not limited to this.

[0109] In one or more embodiments, the display 310, printed circuit board 350, conductive member 370, and wireless charging coil 382 may form an antenna for the electronic device 300 together with at least a portion of the frame 320 that is fed through a first point A. In one or more embodiments, the display 310, printed circuit board 350, conductive member 370, and wireless charging coil 382 may serve as ground for an antenna comprising at least a portion of the frame 320 that is fed through the first point A. In one or more embodiments, the display 310, printed circuit board 350, conductive member 370, and wireless charging coil 382 may be understood to form antenna radiation by operating together with the frame 320 fed via the first point A as an antenna for the electronic device 300.

[0110] In one or more embodiments, the antenna structure using frame 320 may include: a structure in which a display 310 serving as ground, a printed circuit board 350, a conductive member 370, and a wireless charging coil 382 are stacked substantially parallel to each other; and a structure in which the display 310 is connected to a fourth point D and the conductive member 370 and the wireless charging coil 382 are connected to a second point B and a third point C. Because these structures increase the capacitive load, the resonant frequency of the antenna using the metal frame 320 can be reduced.

[0111] In one or more embodiments, the display 310 may be grounded at a fourth point D on the printed circuit board 350, and the frame 320 may be fed at a first point A. In one or more embodiments, the conductive member 370 may be grounded at a second point B. The wireless charging coil 382 may be connected to the printed circuit board 350 at a third point C. Each of the first point A, the second point B, and the third point C may be positioned as far apart as possible from the fourth point D. Thus, the current path P for antenna grounding can be extended. Therefore, bandwidth and radiation efficiency can be improved due to the extended physical and electrical ground of the antenna using the frame 320.

[0112] In one or more embodiments, antenna performance can be improved as the distance d2 between the first point A and the second point B decreases. This will be discussed later. Figure 13 Described.

[0113] Figure 10 This is a diagram showing the effective radiation area of ​​an electronic device according to one or more embodiments. Figure 11 This is a diagram illustrating the radiation patterns of an electronic device according to one or more embodiments. (Refer to...) Figure 10 In one or more embodiments, the effective radiation region can be improved by coupling the conductive member 370 to the wireless charging coil 382. For example, without the conductive member 370, the effective radiation region (or effective radiation volume) of the electronic device 300 can be formed as region A2, which includes only the display 310, the metal frame 320, and the printed circuit board 350. This is likely because the current fed to the frame 320 flows only to the printed circuit board 350 and the display 310. In contrast, the effective radiation region of the electronic device 300 can be extended to region A1, which includes the display 310, the metal frame 320, the printed circuit board 350, the conductive member 370, the wireless charging coil 382, ​​and the cover 360 on which the wireless charging coil 382 is disposed, by coupling the conductive member 370 to the wireless charging coil 382 below the printed circuit board 350.

[0114] Reference Figure 11 as well as Figure 10The radiation pattern of the electronic device 300, having a radiation effective area A1 including a cover 360, can include a user's body in contact with the cover 360. Antenna performance can be improved by using the user's body in contact with the cover 360 as an antenna element. This is likely because the conductive user's body faces the conductive member 370 and the wireless charging coil 382 in parallel, thus the user's body also functions as the ground (or radiator) of the frame 320. As the resonant frequency formed by the antenna decreases, the effect of improving antenna performance by using the body as an antenna element can be enhanced. Furthermore, by using the wireless charging coil 382 disposed on the cover 360 in contact with the user's body as the ground of the antenna, the distance between the ground and the user's body can be reduced. Therefore, antenna performance can be improved by increasing the amount of coupling between the wireless charging coil 382 and the user's body.

[0115] Figure 12 This is a graph showing the radiation efficiency of an electronic device. Figure 12 Curve 1201 represents the radiation efficiency of the electronic device according to the comparative embodiment, and curve 1203 represents the radiation efficiency of the electronic device according to one or more embodiments. The electronic device according to the comparative embodiment does not include the conductive member 370. (See also...) Figure 12 Curves 1201 and 1203, compared to the comparative embodiment, show that the electronic device according to one or more embodiments can improve the radiation efficiency and bandwidth of a first frequency band of about 600 MHz to 1,400 MHz, a second frequency band of about 1,600 MHz to 1,800 MHz, and a third frequency band of about 2,200 MHz to 2,800 MHz. For example, the antenna performance of the first frequency band can be improved most significantly, and the antenna performance of the third frequency band, which includes the third harmonic component of the first frequency band, can also be improved. Therefore, even if the antenna space of the electronic device 300 is limited, the performance of the required frequency band can be ensured. Furthermore, since antenna performance can be improved without adding separate circuit components, costs can be reduced and installation space can be saved. By using the saved installation space as antenna space for another frequency band, it is beneficial to ensure the antenna performance of that other frequency band.

[0116] Figure 13 The radiation efficiency based on the distance between a first point and a second point is shown according to one or more embodiments. (Refer to...) Figure 13 and Figure 9 Curve 1301 represents the radiation efficiency when the distance d2 between the first point A and the second point B is a first distance. Curve 1303 represents the radiation efficiency when the distance d2 between the first point A and the second point B is a second distance less than the first distance. Curve 1305 represents the radiation efficiency when the distance d2 between the first point A and the second point B is a third distance less than the second distance. (See reference...) Figure 13Curves 1301, 1303, and 1305 show that the radiation efficiency increases as the distance d2 between the first point A and the second point B decreases. This is likely because the ground spread effect of the antenna using frame 320 is maximized as the distance d2 between the first point A and the second point B decreases.

[0117] Figure 14 The reflection coefficients according to the matching circuit are shown according to one or more embodiments. See also... Figure 8 , Figure 14 Curves 1401, 1403, and 1405 can represent the reflection coefficients based on the matching circuit connected to the ground of the conductive member 370 and the printed circuit board 350. Curve 1401 represents the reflection coefficient when the conductive member 370 is connected to a matching circuit having a capacitance (e.g., 100 pF). Curve 1403 represents the reflection coefficient when the conductive member 370 is connected to a matching circuit having an inductance of a first size (e.g., 15 nH). Curve 1405 represents the reflection coefficient when the conductive member 370 is connected to a matching circuit having an inductance of a second size (e.g., 33 nH) greater than the first size. Figure 14 As shown, the resonant frequency of the antenna using frame 320 can be adjusted by selectively connecting conductive member 370 to matching circuits with different values.

[0118] Figure 15 This is a diagram illustrating an electronic device according to one or more embodiments. (Refer to...) Figure 15 Electronic device 1500 according to one or more embodiments (e.g., Figure 8 The display 310 of the electronic device 300 can be connected to the seventh point G. Wireless communication circuitry on the printed circuit board 350 can power the display 310 via the seventh point G. A transmission line (or conductive trace) connecting the wireless communication circuitry and the seventh point G can be formed on and / or within the printed circuit board 350. The wireless communication circuitry can transmit RF signals of a second frequency band different from the first frequency band by powering the display 310. The wireless communication circuitry can receive the second frequency band RF signals using the display 310. The second frequency band can include, for example, an intermediate frequency band of 1000 MHz to 2300 MHz and / or a high frequency band of 2300 MHz or higher, but is not limited thereto. In one or more embodiments, the connection 1512 between the display 310 and the seventh point G can include, for example, a C-clamp connector and / or a spring pin, but is not limited thereto.

[0119] Refer to together Figure 7a and Figure 7bIn one or more embodiments, the seventh point G may be located adjacent to the fourth point D, which is connected to the connection member 312 of the display 310. For example, the seventh point G may be located on the second portion 352 of the printed circuit board 350. The seventh point G may be positioned further away from the first point A than the second point B and the third point C. Additionally or optionally, the electronic device 300 may include a matching circuit for impedance matching connected between the seventh point G and the wireless communication circuitry.

[0120] Alternatively, the frame 320 of the electronic device 1500 may not be fed at the first point A. In this case, the frame 320 can be used as part of the antenna ground by grounding via at least one of the first point A and the fifth point E.

[0121] Alternatively, point E or point F, one of the points from A to G, can be omitted. For example, frame 320 may not be connected to point E or point F.

[0122] Figure 16 This is a diagram illustrating an electronic device according to one or more embodiments. The electronic device 1600 according to one or more embodiments (e.g., Figure 8 The electronic device 300 may include a frame 1620 (e.g., Figure 8 (Frame 320). For example, frame 1620 may further include a non-conductive portion 1622 and a conductive portion 1624 supported by the inner surface of the non-conductive portion 1622. In one or more embodiments, the conductive portion 1624 may include a conductive pattern. The conductive pattern may be formed, for example, directly on the non-conductive portion 1622, or formed on a separate substrate (or carrier). For example, the conductive pattern may be formed by plating or deposition, but is not limited thereto. The conductive portion 1624 may include, for example, a conductive pattern of a flexible printed circuit board or a conductive pattern of an LDS antenna, but is not limited thereto.

[0123] In one or more embodiments, the conductive portion 1624 may be connected to a first point A on the printed circuit board 350. A wireless communication circuit may feed power to the conductive portion 1624 through the first point A. The wireless communication circuit may transmit RF signals of a first frequency band by feeding power to the conductive portion 1624 of the frame 1620. The wireless communication circuit may receive RF signals of the first frequency band by using the conductive portion 1624 of the frame 1620. In one or more embodiments, a connection 1626 between the first point A and the conductive portion 1624 may be formed, for example, by contacting the conductive portion 1624 with a connector (e.g., a C-clamp connector) disposed on the first point A, but is not limited thereto. For example, the connection 1626 may be formed by a coaxial cable or conductive traces of a flexible printed circuit board connecting the first point A and the conductive portion 1624. The flexible printed circuit board may be a flexible printed circuit board on which the conductive portion 1624 is formed or a flexible printed circuit board independent of the conductive portion 1624. Additionally or optionally, the electronic device 300 may include a matching circuit for impedance matching connected between the first point A and the wireless communication circuit. The non-conductive portion 1622 of frame 1620 can be referred to as a non-conductive frame.

[0124] Figure 17 This is a diagram illustrating an electronic device according to one or more embodiments. (Refer to...) Figure 17 Electronic device 1700 according to one or more embodiments (e.g., Figure 16 The display 310 of the electronic device 1600 can be connected to the seventh point G. The wireless communication circuit on the printed circuit board 350 can feed power to the display 310 through the seventh point G.

[0125] Alternatively, the electronic device 1600 may not include the first point A among the first points A to the seventh point G and the conductive portion 1624 of the frame 1620 connected to the first point A.

[0126] Figure 18 The shape of the conductive member 370 according to one or more embodiments is shown. (Refer to...) Figure 18 The first part of the conductive component (e.g., Figure 6 The first part 371) can be formed in various shapes. For example, conductive member 1801 may include a closed-loop shape. For example, conductive member 1803 may include a circular plate shape. For example, conductive member 1805 may include an open-loop shape in some sections, thereby forming two ends 1805a and 1805b of the loop, similar to Figure 6 The conductive component 370. In this case, one of the two ends 1805a and 1805b of the conductive component 1805 can be connected to the printed circuit board (e.g., Figure 17 The ground of the printed circuit board (350).

[0127] Figure 19 This is a graph showing the radiation efficiency according to the shape of the conductive member according to one or more embodiments. (Refer to...) Figure 19 as well as Figure 18 Curve 1901 represents the radiative efficiency of the electronic device including conductive member 1801, curve 1903 represents the radiative efficiency of the electronic device including conductive member 1803, and curve 1905 represents the radiative efficiency of the electronic device including conductive member 1805. Curves 1901 and 1903 of conductive member 1801 can have higher radiative efficiencies in relatively low frequency bands (e.g., less than 1.5 GHz) than curve 1905 of conductive member 1805. This is likely because the areas of conductive members 1801 and 1803 facing the wireless charging coil are larger than the area of ​​conductive member 1805. Furthermore, curves 1901 and 1903 of conductive member 1801 can have similar radiative efficiencies in relatively low frequency bands (e.g., approximately less than 1.5 GHz). This is likely because the areas of conductive members 1801 and 1803 facing the wireless charging coil are similar.

[0128] In one or more embodiments, curve 1905 of conductive member 1805 may have higher radiative efficiency than curves 1901 and 1903 in a relatively high frequency band (e.g., about 1.9 GHz or higher).

[0129] Wearable devices according to one or more embodiments (e.g., Figure 3 The electronic device 300 may include a metal frame (e.g., Figure 3 The frame 320), the display (e.g., Figure 3 The display 310), printed circuit board (e.g., Figure 3 Printed circuit board 350), wireless charging coil (e.g., Figure 4 The wireless charging coil 382), conductive components (e.g., Figure 3 The conductive component 370) and the wireless communication circuit disposed on the printed circuit board ( Figure 20 The wireless communication module 2092. A conductive component may be disposed between the wireless charging coil and the printed circuit board, facing the wireless charging coil and spaced apart from it. The wireless communication circuit may be configured to transmit or receive radio frequency (RF) signals using a metal frame. The conductive component may be coupled to the wireless charging coil. The conductive component, the wireless charging coil, and the display may serve as ground for the metal frame.

[0130] In one or more embodiments, the PCB may include a first portion forming the periphery of the PCB (e.g., Figure 7a The first part of Part 351a) (e.g., Figure 7aThe first part 351), spaced apart from the first part and forming a second part opposite to the outermost first part (e.g., Figure 7a Part 2 of 352a) (e.g., Figure 7a The second part 352), and the remaining portion forming the periphery between the first part and the second part (e.g., Figure 7a The third part of the remaining part 353a) (for example, Figure 7a (Part 353). The wireless communication circuit can be configured to feed power to a metal frame connected to a first part of the PCB. A conductive component serving as ground and a wireless charging coil can be connected to the first part, respectively. A display serving as ground can be connected to a second part. The metal frame can be connected to the second part.

[0131] In one or more embodiments, the wireless communication circuit can be configured to communicate via a first point on the first portion (e.g., Figure 7a The first point A) supplies power to the metal frame. Conductive components can be supplied via a second point (e.g., on the first part of the PCB). Figure 7a The second point (B) is connected to the ground of the PCB. The wireless charging coil can be connected via a third point (e.g., on the first part of the PCB). Figure 7a The third point (C) is connected to the PCB ground. The display can be connected via the fourth point (e.g., on the second part of the PCB). Figure 7a Point D) on the fourth part of the PCB is connected to the ground. The metal frame can be connected via point D on the second part of the PCB (e.g., point D). Figure 7a Point E) is connected to the ground of the PCB.

[0132] In one or more embodiments, when the PCB is viewed from above, the third point may be located between the first and second points.

[0133] In one or more embodiments, the second point may be closer to the first point than the fourth and fifth points.

[0134] In one or more embodiments, the third point may be closer to the first point than the fourth and fifth points.

[0135] A wearable device according to one or more embodiments may include a first flexible PCB for connecting a display to a PCB (e.g., Figure 8 The connecting member 312), the first connector disposed on the PCB and connected to the first flexible PCB, and the second flexible PCB that connects the wireless charging coil to the PCB (e.g., Figure 8 (386) connecting member, second connector disposed on PCB and connected to second flexible PCB, and third connector disposed on PCB and connected to conductive member.

[0136] In one or more embodiments, the third connector may include a C-clamp connector. A conductive component may contact the C-clamp connector.

[0137] A wearable device according to one or more embodiments may include a shield disposed on a PCB. Wireless communication circuitry may be disposed on a third portion. The shield may be disposed on the third portion to surround the wireless communication circuitry.

[0138] A wearable device according to one or more embodiments may include at least one of a first plurality of matching circuits, a second plurality of matching circuits, and a matching circuit. The first plurality of matching circuits, any one of which may be configured to be selectively connected between ground on the PCB and a second point on the PCB. The second plurality of matching circuits, any one of which may be configured to be selectively connected between ground on the PCB and a fifth point on the PCB. The matching circuit may be connected between a wireless communication circuit and the first point.

[0139] In one or more embodiments, the conductive component may include a closed-loop shape (e.g., Figure 18 The conductive component 1801), in a certain section, makes the two ends of the ring (e.g., Figure 8 The open ring shape at both ends (1805a and 1805b) (e.g., Figure 8 The conductive component 1805), or a circular plate shape (e.g., Figure 18 (Conductive component 1803).

[0140] In one or more embodiments, the conductive member may be formed in an open-loop shape in a portion of the segment (e.g., Figure 18 The conductive component 1805), thereby forming the two ends of the ring (e.g., Figure 18 The two ends, 1805a and 1805b. Based on the direction perpendicular to the PCB, the second point can be connected to one of the two ends (e.g., Figure 18 The ends 1805a) overlap.

[0141] In one or more embodiments, the conductive member may include a first portion parallel to the PCB and facing the wireless charging coil (e.g., Figure 5 The first part 371) and the second part extending from the first part to the PCB and connecting the first part to the PCB (e.g., Figure 5 Part 2 (372). Part 1 can be spaced apart from the PCB.

[0142] Wearable devices according to one or more embodiments may include a cover (e.g., Figure 3 The cover (360°) is attached to the frame and comes into contact with the body wearing the wearable device. The cover can support the wireless charging coil.

[0143] Wearable devices according to one or more embodiments may include a shielding member covering a wireless charging coil supported by a cover (e.g., Figure 4 The shielding member 384). The cover may include a support portion (e.g., Figure 4 The support portion 365 includes a first surface facing the conductive member (e.g., Figure 4 The first surface 365A) and the second surface opposite to the first surface and facing the PCB (e.g., Figure 4 The second surface 365B). The shielding member may include a first surface facing the first surface of the support portion (e.g., Figure 4 (First surface 384A). The conductive component may be attached to the first surface of the support portion or the first surface of the shielding component.

[0144] In one or more embodiments, the second portion may penetrate the support portion.

[0145] A wearable device according to one or more embodiments may include a capacitor disposed on a PCB. Conductive components may be connected to a wireless charging coil via the capacitor.

[0146] Wearable devices according to one or more embodiments (e.g., Figure 3 The electronic device 300 may include: a conductive portion (e.g., Figure 16 The frame of the conductive portion 1624 (e.g., Figure 16 The frame 1620), the display (e.g., Figure 3 The display 310), wireless charging coil (e.g., Figure 4 Wireless charging coil 382), printed circuit board (e.g., Figure 3 Printed circuit board 350), conductive components (e.g., Figure 3 The conductive component 370) and the wireless communication circuit (e.g.,) disposed on the PCB. Figure 20 The wireless communication module 2092. A conductive member may be disposed between the wireless charging coil and the PCB, facing the wireless charging coil and spaced apart from it. The wireless communication circuit may be configured to transmit or receive radio frequency signals (RF signals) using the conductive member. The conductive member may be coupled to the wireless charging coil. The conductive member, the wireless charging coil, and the display may serve as ground for the conductive member. The PCB may include a first portion forming the periphery of the PCB (e.g., Figure 7a The first part of Part 351a) (e.g., Figure 7a The first part 351), spaced apart from the first part and forming a second part opposite to the outermost first part (e.g., Figure 7a Part 2 of 352a) (e.g., Figure 7aThe second part 352), and the remaining portion forming the periphery between the first part and the second part (e.g., Figure 7a The third part of the remaining part 353a) (for example, Figure 7a (Part 353). The wireless communication circuit can be configured to feed power to a conductive portion via a first portion, the conductive portion being connected to the first portion. The conductive component and the wireless charging coil can be grounded in the first portion, respectively. The display can be grounded in the second portion.

[0147] In one or more embodiments, the first portion may include a first point connected to the conductive portion (e.g., Figure 20 The first point A), and the second point where the conductive component is grounded (e.g., Figure 20 The second point B), and the third point where the wireless charging coil is grounded (e.g., ​ The third point C). The second part may include a fourth point where the display is grounded (e.g., ​ (Point D). The wireless communication circuit can be configured to feed power to the conductive portion through the first point.

[0148] In one or more embodiments, the entire frame may be formed of conductive portions.

[0149] In one or more embodiments, the conductive portion may be grounded in the second portion.

[0150] In one or more embodiments, the conductive portion may be at a fifth point on the second portion and a sixth point spaced apart from the fifth point (e.g., ​ Grounding is applied at point F, the sixth point of the structure.

[0151] In one or more embodiments, the frame may include a non-conductive frame (e.g., ​ The non-conductive portion 1622). The conductive portion may include a conductive pattern formed on the inner surface of the non-conductive frame.

[0152] In one or more embodiments, the second point may be closer to the first point than the fourth and fifth points. The third point may be closer to the first point than the fourth and fifth points.

[0153] In one or more embodiments, the conductive member may include a first portion facing the wireless charging coil (e.g., ​ The first part 371) and the second part extending from the first part such that the first part is connected to the PCB (e.g., ​ (Part 2, 372). The first part of the conductive component may be spaced apart from the PCB.

[0154] Wearable devices according to one or more embodiments (e.g., ​The electronic device 300 may include a frame (e.g., ​ Frame 320 and ​ The frame 1620), the display (e.g., ​ The display 310), wireless charging coil (e.g., ​ The wireless charging coil 382), and the printed circuit board between the display and the wireless charging coil (e.g., ​ Printed circuit board 350), conductive components (e.g., ​ The conductive component 370) and the wireless communication circuit (e.g.,) disposed on the PCB. ​ The wireless communication module 2092. A conductive component may be disposed between the wireless charging coil and the PCB. The conductive component may face the wireless charging coil. The conductive component may be spaced apart from the wireless charging coil. The wireless communication circuit may be configured to transmit or receive radio frequency signals (RF signals) using a display. The conductive component may be coupled to the wireless charging coil. The conductive component and the wireless charging coil may be used as ground for the display.

[0155] In one or more embodiments, the PCB may include a first portion forming the periphery of the PCB (e.g., ​ The first part of Part 351a) (e.g., ​ The first part 371), spaced apart from the first part and forming a second part opposite to the outermost first part (e.g., ​ Part 2 of 352a) (e.g., ​ The second part 372), and the remaining portion forming the periphery between the first part and the second part (e.g., ​ The third part of the remaining part 353a) (for example, ​ (Part 373). The wireless communication circuit can transmit a first frequency band signal by feeding the frame via a first part connected to the frame. The wireless communication circuit can be configured to transmit a second frequency band signal, different from the first frequency band, by feeding the display via a second part connected to the display. The frame and the wireless charging coil can be grounded in the first part, respectively.

[0156] ​ This is a block diagram illustrating an electronic device 2001 in a network environment 2000 according to various embodiments. (Refer to...) ​In network environment 2000, electronic device 2001 can communicate with electronic device 2002 via a first network 2098 (e.g., a short-range wireless communication network), or with at least one of electronic device 2004 or server 2008 via a second network 2099 (e.g., a long-range wireless communication network). According to one or more embodiments, electronic device 2001 can communicate with electronic device 2004 via server 2008. According to one or more embodiments, electronic device 2001 may include a processor 2020, memory 2030, input module 2050, sound output module 2055, display module 2060, audio module 2070, sensor module 2076, interface 2077, connection terminal 2078, haptic module 2079, camera module 2080, power management module 2088, battery 2089, communication module 2090, user identification module (SIM) 2096, or antenna module 2097. In some embodiments, at least one of the above-described components (e.g., connection terminal 2078) may be omitted from electronic device 2001, or one or more other components may be added to electronic device 2001. In some embodiments, some of the above-described components (e.g., sensor module 2076, camera module 2080, or antenna module 2097) may be implemented as a single integrated component (e.g., display module 2060).

[0157] Processor 2020 may run software (e.g., program 2040) to control at least one other component (e.g., hardware or software component) of electronic device 2001 connected to processor 2020, and may perform various data processing or calculations. According to one or more embodiments, as at least part of the data processing or calculations, processor 2020 may store commands or data received from another component (e.g., sensor module 2076 or communication module 2090) in volatile memory 2032, process the commands or data stored in volatile memory 2032, and store the result data in non-volatile memory 2034. According to one or more embodiments, processor 2020 may include a main processor 2021 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 2023 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 2021. For example, when electronic device 2001 includes a main processor 2021 and an auxiliary processor 2023, the auxiliary processor 2023 may be adapted to consume less power than the main processor 2021, or adapted to be dedicated to a specific function. The auxiliary processor 2023 may be implemented separately from the main processor 2021, or may be implemented as part of the main processor 2021.

[0158] When the main processor 2021 is inactive (e.g., in sleep) state, the auxiliary processor 2023 (other than the main processor 2021) can control at least some of the functions or states associated with at least one component of the electronic device 200120 (e.g., display module 2060, sensor module 2076, or communication module 2090), or when the main processor 2021 is active (e.g., running an application), the auxiliary processor 2023 can work with the main processor 2021 to control at least some of the functions or states associated with at least one component of the electronic device 2001 (e.g., display module 2060, sensor module 2076, or communication module 2090). According to one or more embodiments, the auxiliary processor 2023 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 2080 or communication module 2090) functionally associated with the auxiliary processor 2023. According to one or more embodiments, the auxiliary processor 2023 (e.g., a neural processing unit) may include hardware architecture dedicated to processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 2001 where the artificial intelligence is performed or via a separate server (e.g., server 2008). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. Artificial neural networks may be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more thereof. Additionally or optionally, the artificial intelligence model may include software architecture in addition to hardware architecture.

[0159] The memory 2030 may store various data used by at least one component of the electronic device 2001 (e.g., processor 2020 or sensor module 2076). The various data may include, for example, software (e.g., program 2040) and input or output data for commands associated with it. The memory 2030 may include volatile memory 2032 or non-volatile memory 2034.

[0160] The program 2040 may be stored as software in the memory 2030, and the program 2040 may include, for example, an operating system (OS) 2042, middleware 2044, or application 2046.

[0161] Input module 2050 can receive commands or data from outside electronic device 2001 (e.g., a user) that will be used by other components of electronic device 2001 (e.g., processor 2020). Input module 2050 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0162] The sound output module 2055 can output sound signals to the outside of the electronic device 2001. The sound output module 2055 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to one or more embodiments, the receiver may be implemented separately from the speaker or as part of the speaker.

[0163] Display module 2060 can visually provide information to the outside of electronic device 2001 (e.g., to a user). Display device 2060 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to one or more embodiments, display module 2060 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0164] The audio module 2070 can convert sound into electrical signals and vice versa. According to one or more embodiments, the audio module 2070 can obtain sound via the input module 2050, or output sound via the sound output module 2055 or headphones of an external electronic device (e.g., electronic device 2002) that is directly (e.g., wired) or wirelessly connected to the electronic device 2001.

[0165] Sensor module 2076 can detect the operating state of electronic device 2001 (e.g., power or temperature) or the environmental state outside electronic device 2001 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to one or more embodiments, sensor module 2076 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0166] Interface 2077 may support one or more specific protocols used to enable electronic device 2001 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 2002). According to one or more embodiments, interface 2077 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0167] Connection end 2078 may include a connector, through which electronic device 2001 may be physically connected to an external electronic device (e.g., electronic device 2002). According to one or more embodiments, connection end 2078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0168] The haptic module 2079 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to one or more embodiments, the haptic module 2079 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0169] Camera module 2080 can capture still or moving images. According to one or more embodiments, camera module 2080 may include one or more lenses, image sensors, image signal processors, or flashes.

[0170] The power management module 2088 manages the power supply to the electronic device 2001. According to one or more embodiments, the power management module 2088 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0171] Battery 2089 may power at least one component of electronic device 2001. According to one or more embodiments, battery 2089 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0172] Communication module 2090 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 2001 and external electronic devices (e.g., electronic device 2002, electronic device 2004, or server 2008), and perform communication via the established communication channel. Communication module 2090 may include one or more communication processors capable of operating independently of processor 2020 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to one or more embodiments, communication module 2090 may include wireless communication module 2092 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 2094 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 2098 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 2099 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 2092 can identify and verify the electronic device 2001 in the communication network (such as the first network 2098 or the second network 2099) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 2096.

[0173] Wireless communication module 2092 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 2092 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 2092 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 2092 can support various requirements specified in electronic device 2001, external electronic device (e.g., electronic device 2004), or network system (e.g., second network 2099). According to one or more embodiments, the wireless communication module 2092 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 2064 dB or less) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 20 ms or less round trip) for implementing URLLC.

[0174] Antenna module 2097 can transmit or receive signals or power to or from the exterior of electronic device 2001 (e.g., external electronic device). According to one or more embodiments, antenna module 2097 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to one or more embodiments, antenna module 2097 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 2098 or a second network 2099) can be selected from the multiple antennas by, for example, communication module 2090 (e.g., wireless communication module 2092). Signals or power can then be transmitted or received between communication module 2090 and the external electronic device via the selected at least one antenna. According to one or more embodiments, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 2097.

[0175] According to various embodiments, antenna module 2097 may form a millimeter-wave antenna module. According to one or more embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the plurality of antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals of the specified high-frequency band.

[0176] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0177] According to one or more embodiments, commands or data can be sent or received between electronic device 2001 and external electronic device 2004 via server 2008 connected to the second network 2099. Each of electronic device 2002 or electronic device 2004 can be a device of the same type as electronic device 2001, or a device of a different type. According to one or more embodiments, all or some operations that would be performed on electronic device 2001 can be performed on one or more of external electronic devices 2002, external electronic device 2004, or server 2008. For example, if electronic device 2001 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 2001 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 2001 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 2001. Electronic device 2001 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 2001 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 2004 may include an Internet of Things (IoT) device. Server 2008 may be an intelligent server using machine learning and / or neural networks. According to one or more embodiments, external electronic device 2004 or server 2008 may be included in a second network 2099. Electronic device 2001 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0178] The electronic device according to various embodiments can be one of a variety of types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to one or more embodiments of this disclosure, the electronic device is not limited to those described above.

[0179] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “in conjunction with another element (e.g., a second element)” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0180] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to one or more embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0181] The various embodiments set forth herein can be implemented as software (e.g., program 2040) containing one or more instructions readable by a machine (e.g., electronic device 2001) stored in a storage medium (e.g., internal memory 2036 or external memory 2038). For example, under the control of a processor, the processor (e.g., processor 2020) of the machine (e.g., electronic device 2001) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0182] According to one or more embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0183] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0184] Elements described as “modules,” “units,” or “components” can be physically implemented by one or more analog and / or digital circuits, including logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, etc.

[0185] While certain embodiments of this disclosure have been specifically shown and described, it will be understood that various changes in form and detail may be made therein without departing from the spirit and scope of the appended claims.

Claims

1. A wearable device comprising: a metal frame; a display; a printed circuit board (PCB); a wireless charging coil; a conductive member disposed between the wireless charging coil and the PCB, facing the wireless charging coil, and spaced apart from the wireless charging coil; and a wireless communication circuit disposed on the PCB, wherein the wireless communication circuit is configured to transmit or receive a radio frequency (RF) signal using the metal frame, wherein the conductive member is coupled to the wireless charging coil, and wherein the conductive member, the wireless charging coil, and the display are configured as a ground of the metal frame.

2. The wearable device of claim 1, the PCB comprising: wherein a first portion forming a first part of a periphery of the PCB; a second portion spaced apart from the first portion and forming a second part of the periphery opposite the first part; and a third portion between the first portion and the second portion, forming a remaining part of the periphery, wherein the wireless communication circuit is configured to feed power to the metal frame connected to the first portion of the PCB, wherein the conductive member and the wireless charging coil are connected to the first portion, respectively, wherein the display is connected to the second portion, and wherein the metal frame is connected to the second portion.

3. The wearable device of claim 2, the wireless communication circuit is configured to feed power to the metal frame through a first point on the first portion of the PCB, wherein, wherein the conductive member is connected to a ground of the PCB through a second point on the first portion of the PCB, wherein the wireless charging coil is connected to the ground of the PCB through a third point on the first portion of the PCB, wherein the display is connected to the ground of the PCB through a fourth point on the second portion of the PCB, and wherein the metal frame is connected to the ground of the PCB through a fifth point on the second portion of the PCB. The third point is located between the first point and the second point from a top view of the PCB.

4. The wearable device of claim 3, wherein, The second point is closer to the first point than the second point to the fourth point and the fifth point.

5. The wearable device of claim 3 or claim 4, wherein, The third point is closer to the first point than the third point to the fourth point and the fifth point.

6. The wearable device of any one of claims 3-5, wherein, 7. The wearable device of any one of claims 2 to 6, comprising: a first flexible PCB connecting the display to the PCB; a first connector disposed on the PCB and coupled to the first flexible PCB; a second flexible PCB connecting the wireless charging coil to the PCB; a second connector disposed on the PCB and coupled to the second flexible PCB; and a third connector disposed on the PCB and coupled to the conductive member.

8. The wearable device of claim 7, the third connector comprises a C-clip connector, and wherein the conductive member is in contact with the C-clip connector. wherein, ​ ​ 9.The wearable device of any one of claims 2 to 8, comprising: a shield disposed on the PCB, wherein the wireless communication circuit is disposed on the third portion of the PCB, and wherein the shield is disposed on the third portion around the wireless communication circuit. 10.The wearable device of any one of claims 3 to 9, comprising at least one of: a first plurality of matching circuits, wherein any one of the first plurality of matching circuits is configured to be selectively connected between the ground and the second point of the PCB; a second plurality of matching circuits, wherein any one of the second plurality of matching circuits is configured to be selectively connected between the ground and the fifth point of the PCB; or a matching circuit connected between the wireless communication circuit and the first point of the PCB. The conductive member comprises:

11. The wearable device of any one of the preceding claims, wherein, a closed loop shape; an open loop shape having two open ends; or a circular plate shape. 12.The wearable device of any one of claims 3 to 10, the conductive member has an open loop shape having two open ends, and wherein, wherein the second point overlaps one of the two open ends based on a direction perpendicular to the PCB. 13.The wearable device of any one of the preceding claims, the conductive member comprises: wherein a first portion parallel to the PCB and facing the wireless charging coil; and a second portion extending from the first portion to the PCB and connecting the first portion to the PCB, and wherein the first portion of the conductive member is spaced apart from the PCB. 14.The wearable device of claim 13, comprising: a cover coupled to the metal frame and configured to contact a body wearing the wearable device, wherein the cover supports the wireless charging coil. 15.The wearable device of claim 14, comprising: a shielding member covering the wireless charging coil supported by the cover, wherein the cover comprises a support portion including a first surface facing the conductive member and a second surface opposite to the first surface and facing the PCB, wherein the shielding member comprises a first surface facing the first surface of the support portion, and wherein the conductive member is attached to the first surface of the support portion or the first surface of the shielding member. ​

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