An electromagnetic simulation mesh generation method, device and electronic device

Abstract

The application relates to an electromagnetic simulation grid generation method and device and an electronic device, wherein the electromagnetic simulation grid generation method comprises the following steps: cutting a GDSII layout file according to a process technology file to generate a two-dimensional layout file; stretching the two-dimensional layout file according to the process technology file to generate a three-dimensional geometric model, and establishing a mapping relationship between a two-dimensional graph and a three-dimensional entity; wherein the two-dimensional graph contains a graphic label added for a target object; determining a target three-dimensional entity corresponding to the graphic label of the target object according to a netlist file in combination with the mapping relationship, and creating a port surface at an endpoint of the target three-dimensional entity; constructing an air box surrounding the three-dimensional geometric model; adding an electromagnetic grid to a region represented by each three-dimensional entity, the port surface and an air domain of the air box of the three-dimensional geometric model to generate an electromagnetic simulation grid file, so as to solve the problem of too much manual intervention in the conversion process from a GDSII layout to a simulation grid.

Description

Technical Field

[0001] This application relates to the fields of integrated circuit design and electromagnetic simulation, and in particular to an electromagnetic simulation mesh generation method, apparatus, and electronic device. Background Technology

[0002] In the design and verification of ultra-high frequency and high-speed integrated circuits, electromagnetic simulation has become an indispensable key technology for evaluating circuit performance. Electromagnetic simulation can completely reproduce all physical processes in the high-frequency field based on Maxwell's equations, accurately capturing high-frequency losses, parasitic coupling, and signal distortions that are difficult to quantify using traditional methods. Compared with traditional verification methods such as quasi-static simulation and equivalent circuit methods, its simulation accuracy is significantly higher, making it a key technology for achieving high-precision performance evaluation in the design and verification of ultra-high frequency and high-speed integrated circuits.

[0003] However, the accuracy and efficiency of electromagnetic simulation are highly dependent on its input medium, namely the quality of the electromagnetic simulation mesh. The geometric accuracy, material property partitioning rationality, and local refinement strategies of the electromagnetic simulation mesh directly determine the reliability of the simulation results and the efficiency of the computation process. Currently, the industry generally uses GDSII layout files as the design source to generate the corresponding electromagnetic simulation mesh. However, since GDSII layout files are essentially two-dimensional planar geometric descriptions, they lack the three-dimensional structural information (such as layer thickness and vertical stacking relationships), material properties (such as dielectric constant and conductivity), and circuit connection relationships (such as port definitions and grounding references) necessary for electromagnetic simulation. Currently, the conversion from GDSII layouts to electromagnetic simulation meshes requires manual operation by relevant technical personnel to add relevant information. This process suffers from excessive reliance on manual labor, low efficiency, and difficulty in guaranteeing accuracy.

[0004] Currently, no effective solution has been proposed to address the problems of excessive manual intervention, low efficiency, and poor accuracy in the conversion process from GDSII layout to simulation mesh in related technologies. Summary of the Invention

[0005] This application provides an electromagnetic simulation mesh generation method and apparatus to at least solve the problems of excessive manual intervention, low efficiency, and poor accuracy in the conversion process from GDSII layout to simulation mesh in related technologies.

[0006] In a first aspect, embodiments of this application provide an electromagnetic simulation mesh generation method, including:

[0007] In response to a simulation instruction for a target object in a target chip, the GDSII layout file of the target chip is cut according to the cutting range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object;

[0008] Based on the three-dimensional information defined in the process technology document, the two-dimensional layout file is stretched to generate a three-dimensional geometric model, and a mapping relationship is established between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object;

[0009] Based on the correspondence between the target object and the graphic label recorded in the netlist file, and in conjunction with the mapping relationship, the target 3D entity corresponding to the graphic label of the target object is determined in the 3D geometric model, and a port face is created at the endpoint of the target 3D entity; the port face is used to define the connection relationship between the endpoint and the ground end of the target 3D entity;

[0010] According to the air box configuration conditions indicated by the simulation instructions, an air box surrounding the three-dimensional geometric model is constructed.

[0011] According to the electromagnetic mesh addition rules indicated by the simulation command, electromagnetic meshes are added to the regions represented by each three-dimensional entity of the three-dimensional geometric model, the port surface, and the air domain of the air box, thereby generating the electromagnetic simulation mesh file corresponding to the simulation command.

[0012] Secondly, embodiments of this application provide an electromagnetic simulation mesh generation device, including: a cutting module, a stretching module, and a generation module;

[0013] The cutting module is used to respond to simulation instructions for a target object in the target chip, and to cut the GDSII layout file of the target chip according to the cutting range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object;

[0014] The stretching module is used to stretch the two-dimensional layout file according to the three-dimensional information defined in the process technology file, generate a three-dimensional geometric model, and establish a mapping relationship between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object;

[0015] The generation module is used to determine the target 3D entity corresponding to the graphic label of the target object in the 3D geometric model according to the correspondence between the target object and the graphic label recorded in the netlist file, and in combination with the mapping relationship, and to create port faces at the endpoints of the target 3D entity; the port faces are used to define the connection relationship between the endpoints and the ground end of the target 3D entity;

[0016] The generation module is also used to construct an air box surrounding the three-dimensional geometric model according to the air box configuration conditions indicated by the simulation command.

[0017] The generation module is further configured to add electromagnetic meshes to the regions represented by each three-dimensional entity of the three-dimensional geometric model, the port surface, and the air domain of the air box according to the electromagnetic mesh addition rules indicated by the simulation command, thereby generating an electromagnetic simulation mesh file corresponding to the simulation command.

[0018] Thirdly, embodiments of this application provide an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the electromagnetic simulation mesh generation method as described in the first aspect above.

[0019] Compared to related technologies, the electromagnetic simulation mesh generation method provided in this application automatically creates a three-dimensional geometric model, locates the target endpoints and generates port surfaces, creates air boxes, and automatically performs mesh generation on the corresponding areas by inputting four types of engineering files: the GDSII layout file of the target chip, the process technology file, the netlist file, and the simulation configuration file for the target object. This solves the problems of excessive manual intervention, low efficiency, and poor accuracy in the existing GDSII layout to simulation mesh conversion process.

[0020] Details of one or more embodiments of this application are set forth in the following drawings and description to make other features, objects and advantages of this application more readily apparent. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0022] Figure 1 This is a flowchart of an electromagnetic simulation mesh generation method according to an embodiment of this application;

[0023] Figure 2 This is a simplified geometric schematic diagram according to an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of port face creation according to an embodiment of this application;

[0025] Figure 4 This is a structural block diagram of an electromagnetic simulation mesh generation device according to an embodiment of this application;

[0026] Figure 5This is a hardware structure block diagram of the electromagnetic simulation mesh generation method according to an embodiment of this application. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application. Furthermore, it is understood that although the efforts made in such a development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, modifications to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0028] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0029] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application means two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The terms “first,” “second,” “third,” etc., used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0030] As mentioned in the background section, the existing technology for converting GDSII layout files into electromagnetic simulation meshes suitable for electromagnetic simulation heavily relies on a "multi-tool serialization + intensive manual intervention" approach. Specifically, in the existing technology, designers first need to import the entire GDSII layout file of the target chip into a geometry tool (such as general CAD software or a specialized layout viewing tool like GMASH), locate the target object to be simulated based on technical experience, and cut it to obtain a two-dimensional layout file of the area to be simulated. Then, based on information such as layer thickness and vertical offset in the process technology file (techfile), the two-dimensional layout file is manually stretched and completed into a three-dimensional model. Subsequently, the generated three-dimensional model is imported into a simulation preprocessing tool, where material properties are manually assigned to different areas, excitation ports are set, and radiation or absorption boundaries are defined. Finally, in the meshing tool, the global and local mesh sizes are adjusted based on experience, key areas are densified, and the specific format required by the solver is finally exported. This fragmented process is not only cumbersome and time-consuming, but also suffers from uncertainties in manual operation and potential distortions in data conversion between tools, making it difficult to guarantee the geometric fidelity and physical property accuracy of the final mesh. This has become a key bottleneck restricting simulation efficiency and reliability. Therefore, there is an urgent need in this field for an integrated method that can integrate standardized design data and achieve automatic generation of the entire process from two-dimensional layout to three-dimensional simulation mesh, in order to overcome the above-mentioned technical bottlenecks.

[0031] This embodiment provides a method for generating electromagnetic simulation meshes. Figure 1 This is a flowchart of an electromagnetic simulation mesh generation method according to an embodiment of this application, such as... Figure 1 As shown, the process includes the following steps:

[0032] Step S110: In response to the simulation instruction for the target object in the target chip, the GDSII layout file of the target chip is cut according to the cutting range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object.

[0033] The target object is the conductor network in the target chip.

[0034] This application uses four types of engineering files: the GDSII layout file of the target chip, the process technology file, the netlist file, and the simulation configuration file corresponding to the simulation instructions for the target object. The following provides a detailed description of these four types of engineering files.

[0035] GDSII (Graphic Data System II) layout files are a standard two-dimensional geometric description file commonly used in the field of integrated circuit design. Output by EDA design tools, it is one of the core deliverables from the design firm to the foundry (fab). Its core components include layout layer-level identifiers, two-dimensional geometric data for each layer (vertex coordinates of rectangles, polygons, etc.), data types, hierarchical nesting relationships, and unique graphic labels. It accurately records the chip's planar layout information and can be directly used for layout verification and tape-out manufacturing. In this application, the GDSII layout file serves as a two-dimensional geometric data source, providing information including layout layer-level identifiers, data types, two-dimensional geometric data for each layer, hierarchical nesting relationships, and unique graphic labels (i.e., graphic tags).

[0036] In particular, the unique graphic tags (hereinafter referred to as graphic tags) contained in the GDSII layout file play a crucial bridging role in the subsequent automatic port generation. A graphic tag is a unique identifier added by the designer or an automated script to the endpoints of a specific conductor network (such as signal lines, power lines, and ground lines) during the integrated circuit design phase. This graphic tag is stored as a graphic attribute in the GDSII layout file, and identical graphic tags are also recorded in the netlist file. Through this shared, unique graphic tag, a precise association between the physical layout and the circuit logic is achieved.

[0037] A technology file (techfile) is a core parameter document connecting integrated circuit design and manufacturing, provided by the foundry or design firm. Its core content includes the mapping relationship between each functional layer (conductor / dielectric / passivation layer) and the GDS layer number, vertical three-dimensional parameters (layer thickness, vertical offset), material physical properties (dielectric constant, conductivity, loss tangent, etc.), and process rules for cross-layer structures (such as vias). This document provides crucial vertical dimensions and material data for the conversion of two-dimensional layouts into three-dimensional models. Furthermore, the material properties it records form the basis for subsequent identification of ground conductors and the division of material regions to add corresponding electromagnetic meshes.

[0038] A netlist file is a standard text file describing the circuit topology and connections in an integrated circuit. It primarily records device identifiers, port nodes, graphic labels, and node connections, focusing on the functional relationships of the circuit and containing no geometric information. The graphic labels in the netlist file correspond one-to-one with the graphic labels in the GDSII layout file, recording the correspondence between target objects and graphic labels. In this application, the netlist file uses shared graphic labels to establish a two-dimensional graphic association between the target objects in the GDSII layout file. By parsing the netlist file, the system can clearly determine:

[0039] (1) Which graphic labels correspond to the target objects that need to be simulated (such as a signal line);

[0040] (2) Which graphic labels correspond to a reference ground (GND) or power supply with a fixed potential?

[0041] The electrical connections and network attribute information in the aforementioned netlist file provide an indispensable circuit logic basis for subsequent automatic location of target objects, identification of grounding conductors, and creation of port surfaces.

[0042] A simulation configuration file is used to control the specific behavior and parameters of the mesh generation process. This file is a parameterized control file written by the user based on the specific simulation target object, used to customize and drive the entire automated mesh generation process. In this application, the simulation configuration file serves as a unified user interface and process controller, translating user intent into system-executable simulation instructions. The parameters that need to be configured in this application include, but are not limited to:

[0043] (1) Simulation target: Specify the target object in the simulation configuration file;

[0044] (2) Geometric processing parameters: Set the layout cutting range of the target object and the via simplification rules of the via layer (such as the aperture and spacing threshold).

[0045] (3) Simulation domain settings: Define the configuration conditions of the air box, such as the expansion distance in each direction, boundary condition parameters, etc.;

[0046] (4) Electromagnetic mesh addition rules: specify mesh densification strategies for different regions (such as conductor surface, port surface, air domain).

[0047] With the simulation configuration file mentioned above, users do not need to intervene in the complex details of intermediate geometric modeling and processing. They can flexibly start and control the entire process simply by configuring high-level parameters, thus achieving both high efficiency and ease of use.

[0048] Specifically, in the practical application of the technical solution of this application, firstly, the four engineering files—the GDSII layout file containing the target object, the process technology file, the netlist file, and the simulation configuration file (providing process control parameters)—are input into the electromagnetic simulation mesh generation system or tool proposed in this application (e.g., a dedicated software module based on the open-source framework gdsfactory and gmsh integration). The GDSII layout file provides two-dimensional geometric data and graphic labels, the process technology file provides three-dimensional information parameters and material property data, the netlist file provides electrical connection relationships, and the simulation configuration file generates simulation instructions and provides process control parameters. Responding to the simulation instructions, the system cuts the GDSII layout file of the target chip according to the layout cutting range parameters defined in the simulation configuration file, generating a two-dimensional layout file containing only the target region.

[0049] It should be further clarified that the "target area" defined in the aforementioned "cutting range" is typically larger than the geometric area of ​​the target object itself. This is because in high-frequency electromagnetic simulations, nearby conductors and dielectric structures can affect the electromagnetic properties of the target object through spatial coupling, ground return paths, and other means. Therefore, the cutting range needs to be determined by engineers based on experience or preliminary analysis to ensure that the cut target area includes all surrounding structures that may have a significant electromagnetic impact on the target object, thereby guaranteeing the accuracy of the simulation results.

[0050] Through the above steps and the unified scheduling of simulation configuration files, this application achieves automated alignment and fusion of three types of heterogeneous design data: geometric data from GDSII layout files, physical rules from process technology files, and connection logic from netlist files, thus constructing a complete, accurate, and consistent simulation data foundation. Compared to the cumbersome manual data extraction, transcription, and association operations in traditional workflows, the above process is automatically executed by the system, generating two-dimensional layout files more accurately and quickly, laying a crucial foundation for subsequent fully automated three-dimensional modeling, port face generation, and electromagnetic mesh generation.

[0051] Step S120: Based on the three-dimensional information defined in the process technology document, perform an extrusion operation on the two-dimensional layout file to generate a three-dimensional geometric model, and establish a mapping relationship between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object.

[0052] The three-dimensional information includes at least the layer thickness, vertical offset, and process rules for cross-layer structures of each functional layer as defined in the process technology document. Graphical tags are unique identifiers added by designers or through automated scripts to the two-dimensional graphics of target object networks (such as signal lines and power / ground lines) in the GDSII layout file during the integrated circuit design phase. These graphic tags, as graphic attributes associated with the two-dimensional graphics of the target object, mark the target object network in the physical layout.

[0053] Specifically, an electromagnetic simulation mesh generation system, or by calling other geometric modeling kernels (e.g., the extrusion modeling module integrated into the tool), can perform an extrusion operation on the planar 2D graphics of each layer in the 2D layout file according to the layer thickness and vertical offset parameters corresponding to each functional layer in the process technology file, thereby generating a multi-layered stacked 3D geometric model. During this process, the system automatically establishes and maintains a mapping table that records the correspondence between each generated 3D entity and its source (i.e., the original 2D graphics in the 2D layout file). Because graphic labels are fully preserved in this mapping table, by querying this mapping table, a graphic label can be used to uniquely locate its corresponding 3D entity in the 3D model (i.e., the 3D entity representation of the target object in the 3D geometric model).

[0054] In addition, it should be noted that for two-dimensional graphics such as vias or through-holes that connect different layers, the system performs continuous stretching operations according to the process rules for cross-layer structures defined in the process technology document, so that it passes through the specified dielectric layer, thereby forming a vertical conductive channel connecting different metal layers in three-dimensional space.

[0055] Step S130: Based on the correspondence between the target object and the graphic label recorded in the netlist file, and combined with the mapping relationship, determine the target 3D entity corresponding to the graphic label of the target object in the 3D geometric model, and create port faces at the endpoints of the target 3D entity; the port faces are used to define the connection relationship between the endpoints and the grounding end of the target 3D entity.

[0056] The grounding terminal is the grounding conductor in the 3D geometric model. Specifically, the automated process for creating the port surface is as follows: First, the netlist file is parsed, and the circuit network corresponding to the target object is found in the netlist file according to the target object name indicated by the simulation command. Then, based on the correspondence between the target object and the graphic label recorded in the netlist file, the graphic label corresponding to the target object is determined. Next, based on the found image label, the corresponding target 3D entity in the 3D geometric model can be directly and quickly located using the "mapping relationship table" established in step S120. Subsequently, the system automatically analyzes the outer contour geometry of the target 3D entity, identifies its endpoint position as a circuit input or output terminal, and designates it as the target endpoint. Finally, a port surface is created between the target endpoint and the grounding conductor. This port surface is used to define the excitation port in subsequent electromagnetic simulations.

[0057] Step S140: Construct an air box surrounding the three-dimensional geometric model according to the air box configuration conditions indicated by the simulation command.

[0058] In this context, an airbox refers to the background region (typically endowed with the material properties of air) created in a simulation to enclose all solid models in an open space or finite computational domain. The outer surface of the airbox needs to be fitted with radiation boundary conditions or a perfectly matched layer (PML) to absorb outwardly propagating electromagnetic waves and simulate a non-reflective open environment.

[0059] Specifically, the system automatically calculates the bounding box of the 3D geometric model based on the air box configuration conditions (such as the expansion distance in each direction) defined in the simulation configuration file, and expands it outward according to its specified size to construct a cuboid region that completely encloses the model as the air box. The system also adds corresponding boundary conditions based on the boundary condition parameters set in the air box configuration conditions.

[0060] Step S150: According to the electromagnetic mesh addition rules indicated by the simulation command, add electromagnetic meshes to the regions represented by the air domains of each three-dimensional entity, port surface, and air box in the three-dimensional geometric model, and generate the electromagnetic simulation mesh file corresponding to the simulation command.

[0061] The air domain refers to the continuous blank area remaining within the constructed air box geometry, excluding the space occupied by all three-dimensional solid models (i.e., the target three-dimensional model and port surfaces). This region is physically assigned the electromagnetic material properties of air (usually a relative permittivity ε≈1, a relative permeability μ≈1, and zero conductivity) to simulate the free propagation space of electromagnetic waves around the chip package or an approximation of an infinitely large half-space.

[0062] Specifically, based on the electromagnetic mesh addition rules in the simulation configuration file, the system implements differentiated meshing strategies within the spatial regions represented by the air domains of each three-dimensional entity, port surface, and air box in the three-dimensional geometric model, generating electromagnetic simulation mesh files corresponding to the simulation commands.

[0063] Through the steps S110 to S150 above, by integrating four types of standardized design files—GDSII layout files, process technology files, netlist files, and simulation configuration files—the entire process of 2D layout cutting, 3D automatic modeling, automatic generation of port faces, air box setting, and layered mesh generation is fully automated. This fundamentally changes the traditional work mode that relies on manual multi-tool connection and significantly improves the efficiency, accuracy, and reliability of electromagnetic simulation preprocessing.

[0064] In some embodiments, stretching a two-dimensional layout file to generate a three-dimensional geometric model includes:

[0065] Based on the data types defined in the process technology documents, determine the via layers to be identified in the two-dimensional layout file;

[0066] Based on the two-dimensional graphics and coordinates of the via layers to be identified recorded in the GDSII layout file, determine the size and spacing of the vias in each via layer to be identified.

[0067] According to the via simplification rules indicated by the simulation command, the target via layer that meets the via simplification rules is determined from the via layers to be identified, and the simplification operation is performed on the target via layer to generate the simplified via layer, thus obtaining the simplified two-dimensional layout file;

[0068] Perform an extrusion operation on the simplified 2D layout file to generate a 3D geometric model.

[0069] Specifically, after obtaining the two-dimensional layout file, the method also includes a geometric simplification process for the via layers in the two-dimensional layout file. Figure 2 This is a simplified geometric schematic diagram according to an embodiment of this application, such as... Figure 2 As shown, multiple fragmented vias that conform to the via simplification rules are merged into a single large equivalent via. This geometric simplification can be achieved through the following steps:

[0070] (1) Identify the via layer in the two-dimensional layout file according to the data type defined in the process technology document, and use it as the via layer to be identified;

[0071] (2) Calculate the size and spacing of each via in each layer to be identified based on the two-dimensional graphics and coordinates of the via layers to be identified recorded in the GDSII layout file.

[0072] (3) According to the via simplification rules defined in the simulation configuration file, determine whether the via size and spacing in each via layer to be identified meet the via simplification rules, that is, whether the via size is less than the first preset threshold and whether the spacing between vias is less than the second preset threshold; define the via layer containing vias that meet the above conditions as the target via layer.

[0073] (4) Simplify the vias in the target via layer that meet the preset conditions to generate a simplified via layer and obtain a simplified two-dimensional layout file.

[0074] Furthermore, Boolean operations can be used to merge these fragmented vias that conform to the simplification rules into a single equivalent via.

[0075] Furthermore, based on the total cross-sectional area of ​​the via before simplification and the total cross-sectional area of ​​a single equivalent via after simplification, the equivalent material parameters of the simplified via are calculated.

[0076] The equivalent material parameter mainly refers to the equivalent conductivity, which is calculated using the following formula:

[0077] ;

[0078] in It is the combined equivalent conductivity. It is the electrical conductivity of the material itself. It is the total cross-sectional area of ​​the vias before merging. It is the total cross-sectional area of ​​the vias after merging.

[0079] For example, the material of the via is copper, and its conductivity is... The total cross-sectional area of ​​the previous group of vias was 10 square micrometers, and the cross-sectional area of ​​the equivalent large via after merging was 20 square micrometers. Therefore, the equivalent conductivity of the equivalent via can be calculated as follows:

[0080] ;

[0081] It should be noted that the calculated equivalent conductivity ( This will serve as the material property parameter for the simplified via, and will be used as the basis for configuring the physical properties when adding the electromagnetic mesh later.

[0082] (5) Perform batch stretching operations on the simplified two-dimensional layout file to generate a three-dimensional geometric model.

[0083] Through the above geometric simplification steps, this application automatically identifies and merges dense and fragmented via arrays in the layout using parametric rules, and performs equivalent conversion of electrical parameters based on the area ratio. While ensuring that key electrical characteristics (such as DC resistance) remain basically unchanged, it significantly reduces unnecessary small geometric features and the number of meshes, thereby achieving a good balance between simulation accuracy and computational efficiency, and effectively solving the problem of excessive computing power requirements when directly simulating high-density layouts.

[0084] Optionally, after generating the 3D geometric model, physical property configuration management can be performed. Based on the process technology documents and the equivalent material parameters calculated in the aforementioned geometric simplification steps, the system divides each 3D entity into a corresponding material physical group. Each material physical group is bound to a corresponding material property (such as dielectric constant and conductivity). This categorizes 3D entities with the same material properties into the same physical group, which not only facilitates management but also provides a direct interface for subsequent simulation software to identify different material regions.

[0085] In some embodiments, the target object is an interconnect, and port faces are created at the endpoints of the target three-dimensional entity, including:

[0086] Identify the outer contour of the target 3D entity and determine the endpoints of the target 3D entity in the outer contour as the target endpoints;

[0087] Based on the netlist file, mapping relationships, and process technology documents, mark each grounding conductor in the three-dimensional geometric model;

[0088] Starting from the target endpoint, locate each grounding conductor in the three-dimensional geometric model according to the preset direction, calculate the target distance between each grounding conductor and the target endpoint, and determine the grounding conductor with the smallest target distance as the target grounding conductor;

[0089] Create a port face between the target endpoint and the target ground conductor.

[0090] Specifically, the target object is an interconnect. After locating the target 3D entity based on the netlist and mapping relationship, the system analyzes the outer contour (i.e., geometric shape) of the target 3D entity to identify its endpoints (e.g., automatically identified using the central axis extraction method), and uses these endpoints as target endpoints. After identifying the target endpoints, the system parses the graphic labels belonging to the grounding network from the netlist file. Based on the aforementioned mapping relationship, it finds the 3D entities corresponding to these labels. Subsequently, in conjunction with the process technology documents, it confirms that these entities have conductor material properties (e.g., conductivity higher than a threshold), thus marking the set of grounding conductors in the 3D geometric model. Starting from the target endpoints, a neighborhood search is performed along the six principal directions of the Cartesian coordinate system (+X, -X, +Y, -Y, +Z, -Z). In each direction, it searches for the existence of a network labeled "GND" or a conductor with ground potential, and records the distance when such a conductor is first encountered. Then, from all directions where grounding conductors are found, the one closest to the target endpoint is selected, and its corresponding grounding conductor is determined as the target grounding conductor.

[0091] Through the above steps, the electrical endpoints of the interconnects are accurately located via automatic geometric analysis (such as central axis extraction), and the nearest grounding reference point is automatically located in complex 3D environments using an intelligent direction search algorithm. This achieves full automation from the 3D entity of the interconnect to the definition of the simulation excitation ports. This method eliminates the tedious and error-prone operation of manually selecting port positions and specifying reference grounds in traditional electromagnetic simulation preprocessing, which relies on experience. It significantly improves the processing efficiency and consistency of port settings and ensures the objectivity and repeatability of port definitions (signal endpoints and reference ground positions) through algorithms, laying a solid foundation for subsequent high-precision and high-reliability electromagnetic simulations.

[0092] In some embodiments, a port face is created between the target endpoint and the target ground conductor, including:

[0093] Along the direction from the target endpoint of the interconnect to the target ground conductor, a rectangular port surface is added between the target endpoint and the target ground conductor; wherein the length and width of the rectangular port surface do not exceed one-tenth of the preset simulation wavelength.

[0094] Specifically, in the scenario where the target object is an interconnect, after determining the target ground conductor, a rectangular planar geometry is added as a port surface between the target endpoint and the target ground conductor along the direction from the target endpoint to the target ground conductor. Figure 3This is a schematic diagram of port surface creation according to an embodiment of this application. One end of the planar geometry is in contact with the interconnect to be simulated, and the other end is in contact with the target ground conductor. For example, if the nearest target ground conductor is found starting from the conductor label of the interconnect in the +Y direction, then a rectangular surface geometry can be added on the XY plane starting from the target endpoint of the interconnect. The length of this rectangular surface in the Y direction is the distance from the conductor to ground, and the length in the X direction can be preset to a fixed value (e.g., 5 micrometers).

[0095] When the target object is an interconnect, the length and width of the rectangular port surface should be much smaller than the electromagnetic wave wavelength, generally set to no more than 1 / 10 of the preset wavelength used in the simulation. For the typical application scenario of this application, namely integrated circuit interconnect simulation, the actual size of the port surface (side length is usually several micrometers to tens of micrometers) is much smaller than the above wavelength limit (hundreds of micrometers). Therefore, in the automated process of this application, the port surface size created by the system by default naturally meets the requirement of being less than one-tenth of the wavelength, and users usually do not need to set additional port size limits in the configuration file, which further simplifies user operation. However, to ensure the completeness and robustness of the method, this physical constraint can still be preset in the port creation rules of the simulation configuration file. When the system detects potential risks in ultra-high frequency or special structure simulations, it can automatically adjust the port surface size or issue a warning according to this rule.

[0096] Through the above steps, by automatically constructing rectangular port surfaces with accurate orientation and compliant dimensions, the automation, standardization, and physical rationality of the excitation port definition are achieved. This avoids the tedious manual drawing, orientation, and adjustment of port surfaces in the traditional process, which not only improves preprocessing efficiency but also fundamentally eliminates the problem of inconsistent port definitions caused by differences in human experience, making the establishment of simulation models more reliable and repeatable.

[0097] In some embodiments, electromagnetic meshes are added to the regions characterized by the air domain in each three-dimensional entity, port face, and airbox of the three-dimensional geometric model according to the electromagnetic mesh addition rules indicated by the simulation instructions, including:

[0098] In the space represented by the three-dimensional entity of the conductor class, an electromagnetic mesh is added according to the first encryption rule in the electromagnetic mesh addition rules;

[0099] In the space represented by the non-conductor three-dimensional entity and the air domain in the air box, add an electromagnetic mesh according to the second encryption rule in the electromagnetic mesh addition rules;

[0100] In the space represented by the port surface, an electromagnetic grid is added according to the third encryption rule in the electromagnetic grid addition rules; wherein the first encryption rule, the second encryption rule, and the third encryption rule are used to indicate different encryption strategies.

[0101] The differentiated encryption strategy is based on electromagnetic field simulation principles and computational efficiency optimization, and may include the following rule settings:

[0102] (1) The first encryption rule, applied to three-dimensional entities of conductors, is based on the skin depth. Specifically, a dense grid is set on the surface of the conductor and within the skin depth region to accurately resolve the skin effect of high-frequency current. For example, it may be required that at least 3-5 layers of grid cells be arranged in this region.

[0103] (2) The second encryption rule is applied to non-conductor three-dimensional entities and air domains. It is set by a gradient encryption strategy. Specifically, in the region near the conductor, dielectric interface or port surface, the mesh size is smaller to capture the gradient of field strength change; as you move away from these key regions, the mesh size gradually increases to reduce the total number of units.

[0104] (3) The third encryption rule is applied to the port surface and is set to ensure the accuracy of the port excitation input. Specifically, it is to perform local encryption in the small volume of the port surface and its vicinity to ensure that the region has a sufficiently fine grid to define the distribution of the port field.

[0105] Specifically, in the space represented by the three-dimensional entity of the conductor class, an electromagnetic mesh is added according to the first encryption rule in the electromagnetic mesh addition rules;

[0106] In the space represented by the non-conductor three-dimensional entity and the air domain in the air box, add an electromagnetic mesh according to the second encryption rule in the electromagnetic mesh addition rules;

[0107] In the space represented by the port surface, an electromagnetic grid is added according to the third encryption rule in the electromagnetic grid addition rules.

[0108] By employing the aforementioned layered and regional meshing strategy, this application can ensure simulation accuracy in critical regions where electromagnetic field changes are drastic, while effectively controlling the total number of meshes in regions where field changes are gradual. This significantly improves the efficiency of mesh generation and subsequent simulation calculations while ensuring the reliability of the results.

[0109] In some embodiments, the above method further includes:

[0110] The electromagnetic simulation mesh file is inspected and optimized, and then output in a standard format that can be recognized by open-source simulation tools.

[0111] Specifically, the system can perform quality checks on the generated mesh (such as checking the element distortion rate and aspect ratio), automatically reconstruct and optimize unqualified meshes, and finally export them as standard format files to ensure that they can be directly used for simulation solutions in subsequent open source software (such as Palace).

[0112] Through the above steps, by outputting standard-format electromagnetic simulation mesh files that can be recognized by open-source tools, on the one hand, the risks of poor convergence or even failure of simulation results caused by the heavy reliance on manual experience to judge mesh quality and the lack of unified quantitative standards in traditional processes are resolved. This achieves automated detection and intelligent optimization of mesh quality, providing an underlying guarantee for high-precision and high-reliability numerical solutions of electromagnetic fields. On the other hand, it also solves engineering bottlenecks such as toolchain lock-in, high licensing costs, and poor technical adaptability caused by relying on the proprietary formats of specific commercial simulation software. This achieves seamless integration of simulation data with open-source solution ecosystems (such as Palace) and independently controllable simulation platforms, significantly improving the flexibility, economy, and technological autonomy of the R&D process.

[0113] The content of this application will be described and explained below through preferred embodiments.

[0114] This embodiment takes the generation of an electromagnetic simulation mesh for a high-speed interconnect (used for high-speed communication between chips, consisting of 5 metal layers M1-M5 and corresponding dielectric layers and vias) as an example to illustrate the specific implementation process of this method. The goal is to automatically generate an electromagnetic simulation mesh file that can be directly used by open-source simulation tools (such as gmsh and Palace) based on the input standardized design file.

[0115] First, prepare the input files. Four types of essential project files are required:

[0116] (1) GDSII layout file of the target chip: contains complete two-dimensional planar geometric data of the target interconnects and surrounding structures, wherein the target interconnects are marked with unique graphic labels (such as NET1, NET2).

[0117] Process technical documents include three-dimensional information of each layer (e.g., metal layer M1 starting height 0μm, thickness 1.5μm; dielectric layer thickness 1.0μm; via spanning layers M1-M5) and material properties (e.g., copper conductivity). ).

[0118] Netlist file: Records the electrical connection relationships of the circuit, clearly identifies the graphic labels corresponding to the target interconnect LINE1 as NET1 and NET2, and identifies the graphic label (GND) corresponding to the ground network.

[0119] Simulation configuration file:

[0120] Target object: Specifies the target interconnect network LINE1;

[0121] Cutting range: X: 0-2.5mm, Y: 0-6mm;

[0122] Simplified via rules: via diameter < 1µm, spacing < 1.5µm;

[0123] Air box configuration: 1mm expansion in all directions, boundary conditions set to radial boundary;

[0124] Electromagnetic mesh addition rules: Set differentiated encryption strategies for conductors, dielectric / air domains, and port surfaces.

[0125] Then, the system responds to the simulation command and executes the following steps in sequence:

[0126] (1) Layout cutting and two-dimensional file generation.

[0127] The system reads the GDSII layout file and, based on the cutting range defined in the simulation configuration (X: 0-2.5mm, Y: 0-6mm), automatically cuts out the region containing the target interconnects and adjacent related structures, generating the target two-dimensional layout file.

[0128] (2) Geometric simplification and construction of three-dimensional geometric models.

[0129] Via simplification: The system identifies via layers in the 2D layout file. Based on configured rules (via diameter < 1µm, spacing < 1.5µm), it merges dense arrays of small vias that meet the criteria into a single equivalent large via using Boolean operations. The conductivity of the equivalent via is calculated based on the ratio of the total cross-sectional area of ​​the vias before and after merging (e.g., the conductivity of the total cross-sectional area before merging). After the merger Then the equivalent conductivity is 1 / 2 of the original via conductivity.

[0130] Extrusion Modeling: Based on the layer thickness, vertical offset, and cross-layer structure process rules provided in the process technical documents, the simplified 2D layout is extruded layer by layer. For example, the M1 layer is extruded upwards by 1.5µm from its initial height (0µm) to form a solid. This process automatically establishes and maintains a mapping table between each generated 3D solid and its original 2D graphic (including graphic labels), generating a complete multi-layer 3D geometric model.

[0131] (3) Port plane is created automatically.

[0132] Locating the target entity: The system parses the netlist and finds the graphic labels NET1 and NET2 corresponding to the target net LINE1. Taking NET1 as an example, by querying the mapping table, the system accurately locates the target 3D entity S1 corresponding to the image label NET1 in the 3D model.

[0133] Identify target endpoints: Analyze the geometric outer contour of S1, identify its end endpoints, and use its end endpoints as target endpoints.

[0134] Search Reference Ground: The system retrieves all grounding (GND) tags from the netlist and finds the corresponding 3D grounding entities (G1, G2, G3) through mapping relationships. Starting from the target endpoint, the system searches along the coordinate axis, calculates the distance to each grounding entity, and identifies the nearest grounding conductor (such as G1) as the target grounding conductor.

[0135] Create a port surface: A rectangular plane is automatically created between the target endpoint and G1 as the port surface. The port surface is perpendicular to the line connecting the two, and its size ensures that the maximum side length is less than 1 / 10 of the wavelength corresponding to the highest simulation frequency (for example, for a 100GHz simulation, the wavelength is about 3mm, and the port surface side length is <300µm) to satisfy the quasi-static approximation and ensure the accuracy of the excitation definition.

[0136] (4) Air box construction.

[0137] The system calculates the axial bounding box of all three-dimensional entities (including port faces), and according to the simulation configuration, it uniformly expands the bounding box by 1mm in six directions to construct a cuboid air box that completely encloses the model, and sets radiation boundary conditions on its outer surface to simulate open space and absorb radiation waves.

[0138] (5) Differentiated electromagnetic grid generation and output.

[0139] The system uses a mesh engine (such as gmsh) to perform intelligent mesh generation based on the encryption rules for different physical regions specified in the simulation configuration.

[0140] Conductor Region: A skin depth-based encryption strategy is applied. First, the skin depth δ at the operating frequency is calculated. At least 3-5 boundary layer meshes are generated within the conductor surface and the δ depth range. The outermost mesh size is no larger than δ / 3 (e.g., for copper at 10 GHz, δ ≈ 0.66 µm, then the surface mesh size is ≤ 0.22 µm). The size of each subsequent layer increases gradually at a preset growth rate (e.g., 1.2 times) to accurately simulate the skin effect and conductor loss.

[0141] Port surface region: Implement local high-precision encryption. Within the port surface and its adjacent finite volume, set the mesh size to 0.5 to 0.8 times the global finest mesh (e.g., 0.11µm to 0.18µm) to ensure that the port field patterns can be sampled at high density and accurately defined.

[0142] Non-conductor and air regions: A gradient refinement strategy is employed. A smaller initial mesh size (e.g., 0.1µm) is set near the conductor or dielectric interface. As the location moves away from the interface, the mesh size smoothly increases according to a preset gradient coefficient (e.g., the size increases by a factor of 1.2 for every 1µm of distance), until a coarser size (e.g., 10µm) is reached outside the air region. This approach effectively controls the overall mesh size while ensuring accuracy in regions with drastic field changes.

[0143] After mesh generation, the system automatically performs quality checks and optimizations, ultimately outputting a standard format file (e.g., .msh format) containing complete geometry, material properties, boundary conditions, port definitions, and a high-quality mesh. This file can be directly imported into open-source or commercial solvers such as gmsh and Palace for electromagnetic simulation calculations.

[0144] Furthermore, to improve the management efficiency of complex models and the clarity of interfaces with downstream simulation software, this solution can also enhance the above process by incorporating the concept of a "physics group." After completing the construction of the 3D geometric model and the creation of the port surface, the system can perform the following additional steps:

[0145] (1) Automatic division of physical groups: The system automatically classifies three-dimensional entities and port surfaces into different physical groups based on the material properties provided in the process technology documents, the equivalent material parameters calculated in the through hole simplification steps, and the functional definition of the port surface.

[0146] Materials Physics Group: Divided according to the electromagnetic properties of materials. For example, all materials with electrical conductivity... Copper conductor entities are classified into the "Material_Conductor_Cu" physics group; all silicon dioxide dielectric entities with a relative permittivity of 3.9 are classified into the "Material_Dielectric_SiO2" physics group; and the air domain is classified into the "Material_Air" physics group.

[0147] Functional physics groups: These are divided according to simulation functions. For example, all automatically created port face rectangles are grouped into the "Boundary_Port_Lumped" physics group.

[0148] (2) Mesh rule mapping based on physical groups: When implementing differentiated mesh partitioning, the system can directly associate encryption rules with physical groups. For example, the "first encryption rule based on skin depth" is mapped to the "Material_Conductor_Cu" physical group; the "second encryption rule based on gradient encryption" is mapped to the "Material_Dielectric_SiO2" and "Material_Air" physical groups; and the "third encryption rule based on local high precision" is mapped to the "Boundary_Port_Lumped" physical group. This makes the application of encryption strategies more structured and manageable.

[0149] (3) Output and Interface: The final exported mesh file (e.g., .msh) will fully retain these physical group definitions. When the downstream simulation solver reads the file, it can directly and accurately identify the material properties, boundary conditions and port settings of the corresponding region by the physical group name (e.g., “Material_Conductor_Cu”, “Boundary_Port_Lumped”), thus realizing the standardization and seamless connection of the simulation data interface.

[0150] Through the above process, by introducing a physics group management approach, this solution further enhances the organization, maintainability, and compatibility with the open-source simulation ecosystem for electromagnetic simulation preprocessing of large-scale, multi-material chip designs while maintaining full-process automation.

[0151] It should be noted that the steps shown in the above process or in the flowchart of the accompanying figures can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0152] This embodiment also provides an electromagnetic simulation mesh generation device, which is used to implement the above embodiments and preferred embodiments, and will not be repeated as already described. As used below, the terms "module," "unit," "subunit," etc., can refer to a combination of software and / or hardware that performs a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0153] Figure 4 This is a structural block diagram of an electromagnetic simulation mesh generation device according to an embodiment of this application, such as... Figure 4 As shown, the device includes: a cutting module 10, a stretching module 20, and a generating module 30;

[0154] The dicing module 10 is used to respond to simulation instructions for a target object in the target chip, and to dice the GDSII layout file of the target chip according to the dicing range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object.

[0155] The stretching module 20 is used to stretch a two-dimensional layout file according to the three-dimensional information defined in the process technology document, generate a three-dimensional geometric model, and establish a mapping relationship between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object;

[0156] The generation module 30 is used to determine the target 3D entity corresponding to the graphic label of the target object in the 3D geometric model according to the correspondence between the target object and the graphic label recorded in the netlist file and in combination with the mapping relationship, and to create port faces at the endpoints of the target 3D entity; the port faces are used to define the connection relationship between the endpoints and the ground end of the target 3D entity.

[0157] The generation module 30 is also used to construct an air box surrounding the three-dimensional geometric model according to the air box configuration conditions indicated by the simulation instructions.

[0158] The generation module 30 is also used to add electromagnetic meshes to the regions represented by the air domains of each three-dimensional entity, port surface, and air box of the three-dimensional geometric model according to the electromagnetic mesh addition rules indicated by the simulation command, and generate an electromagnetic simulation mesh file corresponding to the simulation command.

[0159] It should be noted that the above modules can be functional modules or program modules, and can be implemented by software or hardware. For modules implemented by hardware, the above modules can reside in the same processor; or the above modules can be located in different processors in any combination. Specific examples in this embodiment can be found in the examples described in the above embodiments and optional implementations, and will not be repeated in this embodiment.

[0160] This embodiment also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0161] Optionally, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0162] Optionally, in this embodiment, the processor can be configured to perform the following steps via a computer program:

[0163] S1, in response to a simulation instruction for a target object in the target chip, cuts the GDSII layout file of the target chip according to the cutting range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object.

[0164] S2, based on the three-dimensional information defined in the process technology document, stretch the two-dimensional layout file to generate a three-dimensional geometric model, and establish the mapping relationship between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object.

[0165] S3. Based on the correspondence between the target object and the graphic label recorded in the netlist file, and combined with the mapping relationship, determine the target 3D entity corresponding to the graphic label of the target object in the 3D geometric model, and create port faces at the endpoints of the target 3D entity; the port faces are used to define the connection relationship between the endpoints and the grounding end of the target 3D entity.

[0166] S4, according to the air box configuration conditions indicated by the simulation command, constructs an air box surrounding the three-dimensional geometric model.

[0167] S5, according to the electromagnetic mesh addition rules indicated by the simulation command, adds electromagnetic meshes to the regions represented by the air domains of each three-dimensional entity, port surface, and air box in the three-dimensional geometric model, and generates the electromagnetic simulation mesh file corresponding to the simulation command.

[0168] It should be noted that the specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementations, and will not be repeated here.

[0169] Furthermore, in conjunction with the electromagnetic simulation mesh generation method in the above embodiments, this application embodiment can provide a storage medium for implementation. This storage medium stores a computer program; when executed by a processor, the computer program implements any of the electromagnetic simulation mesh generation methods in the above embodiments.

[0170] Furthermore, the method embodiments provided in this example can be executed on a terminal, computer, or similar computing device. Taking running on a terminal as an example, Figure 5 This is a hardware structure block diagram of a terminal for an electromagnetic simulation mesh generation method according to an embodiment of this application. For example... Figure 5 As shown, a terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 502 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 504 for storing data are also shown. Optionally, the terminal may further include a transmission device 506 for communication functions and an input / output device 508. Those skilled in the art will understand that... Figure 5 The structure shown is for illustrative purposes only and does not limit the structure of the terminal described above. For example, the terminal may also include components that are more... Figure 5 The more or fewer components shown, or having the same Figure 5 The different configurations shown.

[0171] The memory 504 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the electromagnetic simulation mesh generation method in this embodiment. The processor 502 executes various functional applications and data processing by running the computer program stored in the memory 504, thus implementing the aforementioned method. The memory 504 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 504 may further include memory remotely located relative to the processor 502, and these remote memories can be connected to the terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0172] Transmission device 506 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the terminal's communication provider. In one example, transmission device 506 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, transmission device 506 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0173] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0174] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0175] Those skilled in the art should understand that the technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments have been described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0176] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for generating electromagnetic simulation meshes, characterized in that, include: In response to simulation instructions for a target object in a target chip, the GDSII layout file of the target chip is cut according to the cutting range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object; the target object is an interconnect. Based on the three-dimensional information defined in the process technology document, the two-dimensional layout file is stretched to generate a three-dimensional geometric model, and a mapping relationship is established between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object; Based on the correspondence between the target object and the graphic label recorded in the netlist file, and in conjunction with the mapping relationship, the target 3D entity corresponding to the graphic label of the target object is determined in the 3D geometric model, and a port face is created at the endpoint of the target 3D entity; the port face is used to define the connection relationship between the endpoint and the ground end of the target 3D entity; According to the air box configuration conditions indicated by the simulation instructions, an air box surrounding the three-dimensional geometric model is constructed. According to the electromagnetic mesh addition rules indicated by the simulation command, electromagnetic meshes are added to the regions represented by the air domain of each three-dimensional entity of the three-dimensional geometric model, the port surface, and the air box, thereby generating the electromagnetic simulation mesh file corresponding to the simulation command. Creating a port face at the endpoint of the target three-dimensional entity includes: Identify the outer contour of the target three-dimensional entity, and determine the endpoints of the target three-dimensional entity in the outer contour as target endpoints; Based on the netlist file, the mapping relationship, and the process technology document, mark each grounding conductor in the three-dimensional geometric model; Starting from the target endpoint, each grounding conductor is located in the three-dimensional geometric model in a preset direction, and the target distance between each grounding conductor and the target endpoint is calculated. The grounding conductor with the smallest target distance is determined as the target grounding conductor. A port face is created between the target endpoint and the target grounding conductor.

2. The electromagnetic simulation mesh generation method according to claim 1, characterized in that, The step of stretching the two-dimensional layout file to generate a three-dimensional geometric model includes: Based on the data type defined in the process technology document, determine the via layer to be identified in the two-dimensional layout file; Based on the two-dimensional graphics and coordinates of the via layers to be identified recorded in the GDSII layout file, determine the size and spacing of the vias in each via layer to be identified; According to the via simplification rules indicated by the simulation instructions, the target via layer that meets the via simplification rules is determined from the via layers to be identified, and the simplification operation is performed on the target via layer to generate the simplified via layer, thereby obtaining the simplified two-dimensional layout file; The simplified two-dimensional layout file is stretched to generate a three-dimensional geometric model.

3. The electromagnetic simulation mesh generation method according to claim 2, characterized in that, The step of performing a simplification operation on the target via layer to generate a simplified via layer includes: Boolean operations are performed on the vias in the target via layer that conform to the via simplification rules to merge the vias that conform to the via simplification rules and generate a simplified via layer.

4. The electromagnetic simulation mesh generation method according to claim 2, characterized in that, After obtaining the simplified two-dimensional layout file, the method further includes: For the target via layer, the equivalent material parameters of the simplified via are calculated based on the total cross-sectional area of ​​the vias conforming to the via simplification rules before simplification and the total cross-sectional area of ​​the vias after simplification. Adding an electromagnetic mesh to the region represented by the air domain of each three-dimensional entity in the three-dimensional geometric model, the port surface, and the air box further includes: Based on the equivalent material parameters, and according to the electromagnetic mesh addition rules indicated by the simulation command, a simulation mesh is added to the three-dimensional entity corresponding to the simplified via.

5. The electromagnetic simulation mesh generation method according to claim 1, characterized in that, Creating a port face between the target endpoint and the target grounding conductor includes: Along the direction from the target endpoint of the interconnect to the target ground conductor, a rectangular port surface is added between the target endpoint and the target ground conductor; wherein the length and width of the rectangular port surface do not exceed one-tenth of a preset simulation wavelength.

6. The electromagnetic simulation mesh generation method according to claim 1, characterized in that, The step of adding electromagnetic meshes to the regions represented by the air domains of the three-dimensional geometric model, the port faces, and the air boxes, according to the electromagnetic mesh addition rules indicated by the simulation instructions, includes: In the space represented by the three-dimensional entity of the conductor class, an electromagnetic mesh is added according to the first encryption rule in the electromagnetic mesh addition rules; In the space represented by the non-conductor three-dimensional entity and the region represented by the air box, an electromagnetic mesh is added according to the second encryption rule in the electromagnetic mesh addition rules; In the space represented by the port surface, an electromagnetic grid is added according to the third encryption rule in the electromagnetic grid addition rules; wherein the first encryption rule, the second encryption rule and the third encryption rule are used to indicate different encryption strategies.

7. The electromagnetic simulation mesh generation method according to any one of claims 1 to 6, characterized in that, The method further includes: The electromagnetic simulation mesh file is inspected and optimized, and then output in a standard format that can be recognized by open-source simulation tools.

8. An electromagnetic simulation mesh generation device, characterized in that, include: Cutting module, stretching module, and generation module; The dicing module is configured to respond to simulation instructions for a target object in the target chip, and dicing the GDSII layout file of the target chip according to the dicing range defined in the process technology file of the target chip to generate a two-dimensional layout file; the two-dimensional layout file contains the target object; the target object is an interconnect. The stretching module is used to stretch the two-dimensional layout file according to the three-dimensional information defined in the process technology file, generate a three-dimensional geometric model, and establish a mapping relationship between each two-dimensional graphic in the two-dimensional layout file and each three-dimensional entity in the three-dimensional geometric model; wherein, the two-dimensional graphic includes graphic tags added for the target object; The generation module is used to determine the target 3D entity corresponding to the graphic label of the target object in the 3D geometric model according to the correspondence between the target object and the graphic label recorded in the netlist file, and in combination with the mapping relationship, and to create port faces at the endpoints of the target 3D entity; the port faces are used to define the connection relationship between the endpoints and the ground end of the target 3D entity; The generation module is also used to construct an air box surrounding the three-dimensional geometric model according to the air box configuration conditions indicated by the simulation command. The generation module is also used to add electromagnetic meshes to the regions represented by each three-dimensional entity of the three-dimensional geometric model, the port surface, and the air domain of the air box according to the electromagnetic mesh addition rules indicated by the simulation command, and generate an electromagnetic simulation mesh file corresponding to the simulation command. Creating a port face at the endpoint of the target three-dimensional entity includes: Identify the outer contour of the target three-dimensional entity, and determine the endpoints of the target three-dimensional entity in the outer contour as target endpoints; Based on the netlist file, the mapping relationship, and the process technology document, mark each grounding conductor in the three-dimensional geometric model; Starting from the target endpoint, each grounding conductor is located in the three-dimensional geometric model in a preset direction, and the target distance between each grounding conductor and the target endpoint is calculated. The grounding conductor with the smallest target distance is determined as the target grounding conductor. A port face is created between the target endpoint and the target grounding conductor.

9. An electronic device comprising a memory and a processor, characterized in that, The memory stores a computer program, and the processor is configured to run the computer program to perform the electromagnetic simulation mesh generation method according to any one of claims 1 to 7.

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