Thermal insulation material screening method and device, electronic equipment and readable storage medium
By solving the heat conduction equation to determine the upper limit of thermal diffusivity, the problem of low efficiency and high cost in traditional thermal insulation material screening is solved, enabling efficient screening of suitable thermal insulation materials, improving the design efficiency of thermal insulation layers and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-04-14
AI Technical Summary
Traditional methods for selecting thermal insulation materials are inefficient and costly, making it difficult to quickly select suitable materials to improve the design efficiency of high-performance insulation layers and reduce manufacturing costs.
By obtaining the thickness, initial temperature, and constraint temperature of the insulation material, the boundary and initial conditions are determined, the heat conduction equation is solved, and the temperature variation relationship with space and time is obtained. Insulation materials are then selected based on the upper limit of thermal diffusivity.
It enables the rapid selection of suitable insulation materials, improves the design efficiency of high-performance insulation layers, and reduces manufacturing costs.
Smart Images
Figure CN121862274A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of thermodynamic analysis technology of materials, and in particular to a method, apparatus, electronic device and readable storage medium for screening thermal insulation materials. Background Technology
[0002] Thermal insulation materials play a crucial role in high-temperature protection. They effectively isolate the high-temperature environment from the object requiring protection through various means, including blocking heat transfer (conduction, radiation, and convection), actively absorbing heat, and forming physical barriers. From protecting lives to ensuring normal equipment operation, from maintaining structural stability to improving energy efficiency, thermal insulation materials play an irreplaceable and fundamental protective role in many fields of modern society. Their performance directly affects the effectiveness and reliability of the protection. Traditional methods for designing high-performance thermal insulation layers often rely on experimental trial and error or empirical formulas, resulting in low efficiency and high costs. Summary of the Invention
[0003] This application provides a method, apparatus, electronic device, and readable storage medium for screening thermal insulation materials, which facilitates the rapid selection of suitable thermal insulation materials, thereby improving the design efficiency of high-performance thermal insulation layers and reducing the manufacturing cost of high-performance thermal insulation layers.
[0004] A first aspect of this application provides a method for screening thermal insulation materials, the method comprising: The thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constraint temperature of the back side of the thermal insulation material are obtained. Boundary conditions are determined based on the thickness, the initial temperature, and the constant temperature, and initial conditions are determined based on the initial temperature; Solve the heat conduction equation based on the initial conditions and the boundary conditions to obtain the solution of the heat conduction equation, which is the temperature variation with respect to space and time. The upper limit of thermal diffusivity is determined based on the constraint temperature and the solution of the thermal conduction equation; The thermal insulation materials are screened based on the upper limit of the thermal diffusivity.
[0005] Optionally, the step of solving the heat conduction equation based on the initial conditions and the boundary conditions to obtain a solution to the heat conduction equation includes: The steady-state solution is determined based on the boundary conditions, and the transient solution is determined based on the boundary conditions and the initial conditions. The steady-state solution is a temperature that varies only with space and not with time, and the transient solution is a temperature that varies both with space and with time. The solution to the heat conduction equation is determined by the sum of the steady-state solution and the transient solution.
[0006] Optionally, the boundary conditions include front boundary conditions and back boundary conditions; determining the steady-state solution based on the boundary conditions includes: Determine the general solution of the steady-state solution, which is a linear function of spatial variation; The intercept of the linear function is determined based on the front boundary conditions, and the slope of the linear function is determined based on the back boundary conditions. The linear function is determined based on the intercept and the slope, and the steady-state solution is obtained.
[0007] Optionally, the transient solution is equal to the product of the spatial and temporal components, and determining the transient solution based on the boundary conditions and the initial conditions includes: The method of separation of variables is applied to the transient solution to express the transient solution as a product of the spatial and temporal components; Determine the general solutions for the time portion and the spatial portion respectively based on the heat conduction equation; The general solution of the transient solution is determined based on the general solution of the time part and the general solution of the space part; Determine the orthogonality coefficients in the general solution of the transient solution based on the boundary conditions and the initial conditions; The transient solution is determined based on the orthogonality coefficients and the general solution of the transient solution.
[0008] Optionally, determining the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation includes: The approximate solution to the heat conduction equation is determined by the series expansion of the solution to the heat conduction equation. The approximate solution for the back surface temperature of the thermal insulation material is determined based on the approximate solution of the heat conduction equation. The upper limit of thermal diffusivity is determined based on the approximate solution of the back surface temperature and the constraint temperature.
[0009] Optionally, the step of screening the thermal insulation material based on the upper limit of thermal diffusivity includes: The thermal conductivity, density, and specific heat capacity of the insulation material are determined based on the upper limit of the thermal diffusivity. The thermal insulation material with low thermal conductivity is used as the target thermal insulation material, or the thermal insulation material with high density and high specific heat capacity is used as the target thermal insulation material.
[0010] Optionally, the thermal insulation material includes at least one of the following: lithium battery thermal runaway protection layer material, aerospace thermal protection system thermal insulation layer material, and industrial high-temperature equipment thermal insulation material.
[0011] A second aspect of this application provides a thermal insulation material screening device, the device comprising: The parameter acquisition unit is used to acquire the thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constraint temperature of the back side of the thermal insulation material. A condition determination unit is configured to determine boundary conditions based on the thickness, the initial temperature, and the constant temperature, and to determine initial conditions based on the initial temperature. The equation solving unit is used to solve the heat conduction equation based on the initial conditions and the boundary conditions, and obtain the solution of the heat conduction equation, which is the temperature variation relationship with space and time. A thermal diffusivity determination unit is used to determine the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation; A material screening unit is used to screen the thermal insulation material according to the upper limit of the thermal diffusivity.
[0012] A third aspect of this application provides an electronic device, including: a processor and a memory; The processor is connected to a memory, wherein the memory is used to store computer programs and the processor is used to invoke the computer programs to execute the methods as described in the first aspect of the embodiments of this application.
[0013] A fourth aspect of this application provides a computer-readable storage medium storing a computer program, the computer program including program instructions, which, when executed by a processor, perform the method as described in the first aspect of this application.
[0014] As can be seen, the thermal insulation material screening method provided in this application determines the boundary conditions based on the thickness of the thermal insulation material and the constant temperature applied to its front side at the initial moment, and determines the initial conditions based on the initial temperature of the thermal insulation material; then, the heat conduction equation is solved based on the initial conditions and the boundary conditions to obtain the solution of the heat conduction equation, realizing the theoretical solution of the temperature change relationship with space and time; finally, the upper limit of thermal diffusivity is determined based on the constraint temperature of the back side of the thermal insulation material and the theoretical solution, which is beneficial to quickly select suitable thermal insulation materials based on the upper limit of thermal diffusivity, thereby improving the design efficiency of high-performance thermal insulation layers and reducing the manufacturing cost of high-performance thermal insulation layers.
[0015] Based on the same inventive concept, this application also provides a heat insulation material screening device, an electronic device, and a readable storage medium. The derivation of its beneficial effects can be found in the derivation process of the above method embodiments, and will not be repeated here. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A schematic diagram of the operating environment of an insulation material screening application provided in one embodiment of this application is shown; Figure 2 A schematic flowchart of a thermal insulation material screening method according to an embodiment of this application is shown; Figure 3 This invention provides a schematic diagram of the structure of a thermal insulation material screening device according to an embodiment of the present application. Figure 4 A schematic diagram of the structure of a computer device provided in one embodiment of this application is shown. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0019] Please refer to Figure 1 This diagram illustrates the operating environment of an insulation material screening application provided in one embodiment of this application. The application operating environment may include: a terminal 10 and a server 20.
[0020] Terminal 10 includes, but is not limited to, electronic devices such as mobile phones, computers, smart voice interaction devices, smart home appliances, in-vehicle terminals, game consoles, e-book readers, multimedia playback devices, and wearable devices. Application clients can be installed on terminal 10.
[0021] In this embodiment, the application described above can be any application capable of providing insulation material screening services. Typically, this application is an industrial application. Of course, other types of applications besides industrial applications can also provide services relying on insulation material screening. For example, research applications, browser applications, virtual reality (VR) applications, augmented reality (AR) applications, etc., are not limited in this embodiment. Optionally, a client of the aforementioned application runs on terminal 10.
[0022] Server 20 provides background services to clients of applications in terminal 10. For example, server 20 can be a background server for the aforementioned applications. Server 20 can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN (Content Delivery Network), and big data and artificial intelligence platforms. Optionally, server 20 can simultaneously provide background services to applications in multiple terminals 10.
[0023] Optionally, terminal 10 and server 20 can communicate with each other via network 30. Terminal 10 and server 20 can be directly or indirectly connected via wired or wireless communication, which is not limited herein.
[0024] Please refer to Figure 2 This document illustrates a flowchart of a method for screening thermal insulation materials according to an embodiment of this application. This method can be applied to computer equipment, which refers to electronic devices capable of data calculation and processing. For example, the executing entity for each step could be... Figure 1 The application runtime environment shown is either terminal 10 or server 20. The method may include the following steps: Step 201: Obtain the thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constraint temperature of the back side of the thermal insulation material.
[0025] For example, the thermal insulation material includes at least one of the following: lithium battery thermal runaway protection layer material, aerospace thermal protection system thermal insulation layer material, and industrial high-temperature equipment thermal insulation material.
[0026] For example, when the heat insulation material is used as a protective layer for thermal runaway of lithium batteries, the initial temperature is the temperature of the material before thermal runaway is triggered, the constant temperature applied to the front side of the heat insulation material at the initial moment is the cell eruption temperature during thermal runaway, and the constraint temperature on the back side of the heat insulation material is the maximum back side temperature allowed by the protective layer. By reasonably selecting the heat insulation material, time can be bought for the people on the vehicle to escape.
[0027] For example, thermal insulation materials are used as thermal insulation layer materials in the thermal protection system of aerospace vehicles. The initial temperature can be the temperature under sunlight. The constant temperature applied to the front of the thermal insulation material at the initial moment can be the temperature of rocket engine ejection or the temperature generated by friction when entering the atmosphere at high speed. The constrained temperature of the back of the thermal insulation material can be the temperature that the cabin structure can withstand. By reasonably selecting thermal insulation materials, the safety of the crew and passengers inside the aerospace vehicle and the normal operation of electronic equipment can be protected.
[0028] For example, the thermal insulation material is used for industrial high-temperature equipment. The initial temperature can be the temperature during cold start or hot maintenance of the equipment. The constant temperature applied to the front of the thermal insulation material at the initial moment can be the temperature of pyrolysis or steam. The constrained temperature on the back of the thermal insulation material can be the temperature that the supporting structure or equipment shell can withstand. By reasonably selecting thermal insulation materials, the normal operation of industrial high-temperature equipment can be protected.
[0029] Step 202: Determine boundary conditions based on the thickness, the initial temperature, and the constant temperature, and determine initial conditions based on the initial temperature.
[0030] For example, boundary conditions include frontal boundary conditions and backal boundary conditions. A frontal boundary condition means that the temperature at the location of the front face in space is a constant temperature. (The temperature is expressed as...) It means that, among them, Representing space, If time is represented, then the positive boundary conditions can be expressed as follows: express, The temperature is constant. The back boundary conditions can be determined according to the heat convection transfer rate formula. The back boundary conditions are:
[0031] in, Where L is the thermal conductivity and L is the thickness of the insulation material. The convective heat transfer coefficient is... This is the initial temperature of the insulation material.
[0032] For example, the initial condition is that the temperature at the initial time is the initial temperature, where the initial time is represented by t=0. Therefore, the initial condition is...
[0033] Step 203: Solve the heat conduction equation according to the initial conditions and the boundary conditions to obtain the solution of the heat conduction equation, which is the temperature variation relationship with space and time.
[0034] The heat conduction equation is used to describe how the temperature changes over time within a region.
[0035] Specifically, the step of solving the heat conduction equation based on the initial conditions and the boundary conditions to obtain the solution to the heat conduction equation includes: The steady-state solution is determined based on the boundary conditions, and the transient solution is determined based on the boundary conditions and the initial conditions. The steady-state solution is a temperature that varies only with space and not with time, and the transient solution is a temperature that varies both with space and with time. The solution to the heat conduction equation is determined by the sum of the steady-state solution and the transient solution.
[0036] For example, the total temperature field can be decomposed into a steady-state field and a transient field, then the solution to the heat conduction equation is the steady-state solution. and transient solutions The sum is:
[0037] in, It changes only with space and not with time. Temperature varies both spatially and over time.
[0038] Specifically, the boundary conditions include front boundary conditions and back boundary conditions; determining the steady-state solution based on the boundary conditions includes: Determine the general solution of the steady-state solution, which is a linear function of spatial variation; The intercept of the linear function is determined based on the front boundary conditions, and the slope of the linear function is determined based on the back boundary conditions. The linear function is determined based on the intercept and the slope, and the steady-state solution is obtained.
[0039] For example, the governing equations of the steady-state field are Laplace's equations, which satisfy:
[0040] Therefore, the general solution of the steady-state solution can be represented by a linear function, assuming the linear function is as follows:
[0041] Where A is the slope and B is the intercept.
[0042] According to the frontal boundary conditions
[0043] achievable and That is, intercept .
[0044] According to the back boundary conditions
[0045] The slope can be obtained
[0046] Therefore, the linear function can be determined based on its slope and intercept.
[0047] Specifically, the transient solution is equal to the product of the spatial and temporal components, and determining the transient solution based on the boundary conditions and the initial conditions includes: The method of separation of variables is applied to the transient solution to express the transient solution as a product of the spatial and temporal components; Determine the general solutions for the time portion and the spatial portion respectively based on the heat conduction equation; The general solution of the transient solution is determined based on the general solution of the time part and the general solution of the space part; Determine the orthogonality coefficients in the general solution of the transient solution based on the boundary conditions and the initial conditions; The transient solution is determined based on the orthogonality coefficients and the general solution of the transient solution.
[0048] For example, by applying the method of separation of variables to the transient solution, the transient solution can be represented as the spatial part. and time section The product of, i.e. .
[0049] For transient fields, the above heat conduction equation becomes a homogeneous equation:
[0050] The boundary conditions also change to homogeneous boundary conditions, and the positive boundary conditions are:
[0051] The back boundary conditions are:
[0052] Will Substituting into the homogeneous heat conduction equation and separating the variables, we get:
[0053] in, These are the eigenvalues.
[0054] Solve the equation:
[0055] The general solution for the time part is:
[0056] Solve the equation:
[0057] The general solution for the spatial part is:
[0058] Apply boundary conditions ,Right now:
[0059] exist Application boundary conditions:
[0060] Simplifying, we get the characteristic equation:
[0061] The transient solution is in series form:
[0062] Application initial conditions: when hour, ,Right now:
[0063] Finding coefficients using orthogonality :
[0064] To obtain the exact solution:
[0065] Step 204: Determine the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation.
[0066] Specifically, determining the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation includes: The approximate solution to the heat conduction equation is determined by the series expansion of the solution to the heat conduction equation. The approximate solution for the back surface temperature of the thermal insulation material is determined based on the approximate solution of the heat conduction equation. The upper limit of thermal diffusivity is determined based on the approximate solution of the back surface temperature and the constraint temperature.
[0067] For a time t, the higher-order terms of the series expansion of the solution to the heat conduction equation ( The decay is faster, so the first term of the series can be taken. By approximating it, the approximate solution to the heat conduction equation is:
[0068] Let L be the spatial position of the back side of the insulation material. Substituting this into the approximate solution, we can obtain the approximate solution for the temperature of the back side of the insulation material as follows:
[0069] The temperature is also constrained to be That is, the constraints on the back side can be obtained.
[0070] Based on this constraint, the upper limit of thermal diffusivity can be obtained:
[0071] Step 205: Screen the thermal insulation materials according to the upper limit of the thermal diffusivity. Specifically, the screening of the thermal insulation material based on the upper limit of thermal diffusivity includes: The thermal conductivity, density, and specific heat capacity of the insulation material are determined based on the upper limit of the thermal diffusivity. The thermal insulation material with low thermal conductivity is used as the target thermal insulation material, or the thermal insulation material with high density and high specific heat capacity is used as the target thermal insulation material.
[0072] according to The derived materials must meet the following requirements:
[0073] By adjusting , , The value of can ensure that the insulation material satisfies the above inequality.
[0074] Using the thermal insulation material with low thermal conductivity as the target thermal insulation material, or using the thermal insulation material with high density and high specific heat capacity as the target thermal insulation material, can reduce the thermal diffusivity.
[0075] As can be seen, the thermal insulation material screening method provided in this application determines the boundary conditions based on the thickness of the thermal insulation material and the constant temperature applied to its front side at the initial moment, and determines the initial conditions based on the initial temperature of the thermal insulation material; then, the heat conduction equation is solved based on the initial conditions and the boundary conditions to obtain the solution of the heat conduction equation, realizing the theoretical solution of the temperature change relationship with space and time; finally, the upper limit of thermal diffusivity is determined based on the constraint temperature of the back side of the thermal insulation material and the theoretical solution, which is beneficial to quickly select suitable thermal insulation materials based on the upper limit of thermal diffusivity, thereby improving the design efficiency of high-performance thermal insulation layers and reducing the manufacturing cost of high-performance thermal insulation layers.
[0076] Figure 3 A schematic diagram of a thermal insulation material screening device according to an embodiment of this application is shown. The device includes: The parameter acquisition unit 301 is used to acquire the thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constraint temperature of the back side of the thermal insulation material. The condition determination unit 302 is used to determine boundary conditions based on the thickness, the initial temperature, and the constant temperature, and to determine initial conditions based on the initial temperature. The equation solving unit 303 is used to solve the heat conduction equation according to the initial conditions and the boundary conditions, and obtain the solution of the heat conduction equation, wherein the solution of the heat conduction equation is the temperature variation relationship with space and time. Thermal diffusivity determination unit 304 is used to determine the upper limit of thermal diffusivity based on the constraint temperature and the solution of the thermal conduction equation; The material screening unit 305 is used to screen the thermal insulation material according to the upper limit of the thermal diffusivity.
[0077] Figure 4 A schematic diagram of the structure of a computer device provided in one embodiment of this application is shown, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the functions of the computer system of the heat insulation material screening method in any of the above embodiments.
[0078] This application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a computer, causes the computer to perform the functions of the computer system of the thermal insulation material screening method in any of the above embodiments.
[0079] This application also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the functions of the computer system of the thermal insulation material screening method in any of the above embodiments.
[0080] It is understood that the specific examples in this application are only intended to help those skilled in the art better understand the implementation methods of this application, and are not intended to limit the scope of the invention.
[0081] It is understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not limit the implementation process of the embodiments of this application in any way.
[0082] It is understood that the various implementation methods described in this application can be implemented individually or in combination, and the implementation methods in this application are not limited in this respect.
[0083] Unless otherwise stated, all technical and scientific terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items. The singular forms "a," "the," and "the" as used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0084] It is understood that the processor in the embodiments of this application can be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method embodiments can be completed by the integrated logic circuits in the processor's hardware or by instructions in software form. The processor can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly embodied in the execution of a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules can be located in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory; the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above method.
[0085] It is understood that the memory in the embodiments of this application may be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. Specifically, non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory may be random access memory (RAM). It should be noted that the memory in the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.
[0086] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0087] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the aforementioned method implementations, and will not be repeated here.
[0088] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0089] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.
[0090] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0091] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0092] The above are merely specific embodiments of this application, but the scope of protection of this invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this invention should be determined by the scope of the claims.
Claims
1. A method for screening thermal insulation materials, characterized in that, The method includes: The thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constrained temperature of the back side of the thermal insulation material are obtained. Boundary conditions are determined based on the thickness, the initial temperature, and the constant temperature, and initial conditions are determined based on the initial temperature; Solve the heat conduction equation based on the initial conditions and the boundary conditions to obtain the solution of the heat conduction equation, which is the temperature variation with respect to space and time. The upper limit of thermal diffusivity is determined based on the constraint temperature and the solution of the thermal conduction equation; The thermal insulation materials are screened based on the upper limit of the thermal diffusivity.
2. The method according to claim 1, characterized in that, The step of solving the heat conduction equation based on the initial conditions and the boundary conditions to obtain the solution to the heat conduction equation includes: The steady-state solution is determined based on the boundary conditions, and the transient solution is determined based on the boundary conditions and the initial conditions. The steady-state solution is a temperature that varies only with space and not with time, and the transient solution is a temperature that varies both with space and with time. The solution to the heat conduction equation is determined by the sum of the steady-state solution and the transient solution.
3. The method according to claim 2, characterized in that, The boundary conditions include front boundary conditions and back boundary conditions; determining the steady-state solution based on the boundary conditions includes: Determine the general solution of the steady-state solution, which is a linear function of spatial variation; The intercept of the linear function is determined based on the front boundary conditions, and the slope of the linear function is determined based on the back boundary conditions. The linear function is determined based on the intercept and the slope, and the steady-state solution is obtained.
4. The method according to claim 2, characterized in that, The transient solution is equal to the product of the spatial and temporal components. Determining the transient solution based on the boundary conditions and the initial conditions includes: The method of separation of variables is applied to the transient solution to express the transient solution as a product of the spatial and temporal components; Determine the general solutions for the time portion and the spatial portion respectively based on the heat conduction equation; The general solution of the transient solution is determined based on the general solution of the time part and the general solution of the space part; Determine the orthogonality coefficients in the general solution of the transient solution based on the boundary conditions and the initial conditions; The transient solution is determined based on the orthogonality coefficients and the general solution of the transient solution.
5. The method according to claim 1, characterized in that, The step of determining the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation includes: The approximate solution to the heat conduction equation is determined by the series expansion of the solution to the heat conduction equation. The approximate solution for the back surface temperature of the thermal insulation material is determined based on the approximate solution of the heat conduction equation. The upper limit of thermal diffusivity is determined based on the approximate solution of the back surface temperature and the constraint temperature.
6. The method according to claim 1, characterized in that, The screening of the thermal insulation material based on the upper limit of thermal diffusivity includes: The thermal conductivity, density, and specific heat capacity of the insulation material are determined based on the upper limit of the thermal diffusivity. The thermal insulation material with low thermal conductivity is used as the target thermal insulation material, or the thermal insulation material with high density and high specific heat capacity is used as the target thermal insulation material.
7. The method according to any one of claims 1-6, characterized in that, The thermal insulation material includes at least one of the following: lithium battery thermal runaway protection layer material, aerospace thermal protection system thermal insulation layer material, and industrial high-temperature equipment thermal insulation material.
8. A heat insulation material screening device, characterized in that, The device includes: The parameter acquisition unit is used to acquire the thickness of the thermal insulation material, the initial temperature of the thermal insulation material, the constant temperature applied to the front side of the thermal insulation material at the initial moment, and the constraint temperature of the back side of the thermal insulation material. A condition determination unit is configured to determine boundary conditions based on the thickness, the initial temperature, and the constant temperature, and to determine initial conditions based on the initial temperature. The equation solving unit is used to solve the heat conduction equation based on the initial conditions and the boundary conditions, and obtain the solution of the heat conduction equation, which is the temperature variation relationship with space and time. A thermal diffusivity determination unit is used to determine the upper limit of thermal diffusivity based on the constraint temperature and the solution of the heat conduction equation; A material screening unit is used to screen the thermal insulation material according to the upper limit of the thermal diffusivity.
9. An electronic device, characterized in that, include: Processor and memory; The processor is connected to a memory, wherein the memory is used to store a computer program, and the processor is used to invoke the computer program to perform the method as described in any one of claims 1-7.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, the computer program including program instructions that, when executed by a processor, perform the method as described in any one of claims 1-7.