Laser sensor and processing method thereof

Abstract

The invention relates to the technical field of laser sensor production, in particular to a laser sensor and a processing method thereof. The liquid dye laser sensor has the beneficial effect that the liquid dye laser sensor capable of reducing the maintenance requirement can be produced. A laser sensor machining method comprises the following steps that S1, an anti-collision layer is installed at the bottom of the inner side of a shell; s2, a control device and a measuring device are installed on the upper side of the anti-collision layer; s3, mounting a laser emitting device on the front sides of the control device and the measuring device; and S4, laser detection devices are installed on the two sides of the laser emitting device. A laser sensor comprises a shell, an anti-collision layer is fixedly connected to the bottom of the inner side of the shell, a control device and a measuring device are fixedly connected to the upper side of the anti-collision layer, a laser emitting device is installed on the front side of the control device and the front side of the measuring device, and laser detecting devices are installed on the two sides of the laser emitting device. A pump light source, a dye bin and an optical control assembly are installed in the laser emitting device.

Description

Technical Field

[0001] This invention relates to the field of laser sensor manufacturing technology, and more specifically to a laser sensor and its processing method. Background Technology

[0002] A laser sensor is a sensor that uses laser technology for measurement. It consists of a laser, a laser detector, and a measurement circuit. As a new type of measuring instrument, its advantages include non-contact, long-distance measurement, high speed, high accuracy, large measuring range, and strong resistance to light and electrical interference. It is further classified into several types based on the different working substances of the laser. Liquid dye lasers, due to their continuously tunable wavelength and stable energy, have great applications in specific environments. However, laser sensors made using liquid dye lasers have disadvantages such as environmental sensitivity and difficult maintenance, resulting in low efficiency in practical applications. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a laser sensor and its processing method, the beneficial effect of which is that the present invention can produce a liquid dye laser sensor that reduces maintenance requirements.

[0004] The technical solution adopted by this invention to solve its technical problem is:

[0005] A laser sensor processing method includes the following steps:

[0006] S1: Install an anti-collision layer on the bottom inside the shell;

[0007] S2: Install control and measuring devices on the upper side of the anti-collision layer;

[0008] S3: Install a laser emitting device in front of the control and measuring devices;

[0009] S4: Install laser detection devices on both sides of the laser emitting device to enable the processing of laser sensors.

[0010] The laser emitting device in step S3 includes a pump source, a dye chamber, and optical control components.

[0011] The processing of the dye bin includes the following steps:

[0012] S31: Place the bottom shell and top shell of the silo on the processing equipment respectively;

[0013] S32: Install a bottom shell ring on the upper side of the bottom shell and a top shell ring on the upper side of the top shell;

[0014] S33: Install cushioning pads on the upper sides of both the bottom shell and the top shell of the silo;

[0015] S34: Install liquid dye medium on the bottom ring;

[0016] S35: Install the top shell of the silo onto the upper side of the bottom shell of the silo to obtain the dye silo;

[0017] S36: Install the dye chamber inside the laser emitting device.

[0018] The processing equipment includes a fixed base, a movable plate slidably connected to the outside of the fixed base, and fixed plates rotatably connected to both the front and rear sides of the movable plate.

[0019] The fixed base has a bottom shell groove for placing the bottom shell of the silo and a top shell groove for placing the top shell of the silo. The height of the plane where the bottom shell groove is located is lower than the height of the plane where the top shell groove is located.

[0020] The movable plate has fixing holes on both the front and rear sides, and the fixing base has fixing grooves corresponding to the fixing holes.

[0021] A laser sensor includes a housing, an anti-collision layer fixedly attached to the bottom inner side of the housing, a control device and a measuring device fixedly attached to the upper side of the anti-collision layer, a laser emitting device mounted in front of the control device and the measuring device, and laser detection devices mounted on both sides of the laser emitting device. The laser emitting device contains a pump light source, a dye chamber and an optical control component.

[0022] The dye tank includes a bottom shell, a top shell mounted on the bottom shell, a bottom shell ring fixed to the upper side of the bottom shell, a top shell ring mounted on the upper side of the top shell, buffer pads fixed to the upper sides of both the bottom shell and the top shell, and a liquid dye medium fixed to the bottom shell ring.

[0023] Both ends of the bottom shell ring are slidably connected to spring covers, and both ends of the bottom shell ring are fixedly connected to springs. The springs are located inside the corresponding spring covers, and a liquid dye medium is fixedly connected between the two spring covers.

[0024] A bottom shell slider is slidably connected to the bottom shell of the silo, and a top shell is hinged to the bottom shell slider. Attached Figure Description

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0026] Figure 1 This is a flowchart illustrating a laser sensor manufacturing method.

[0027] Figure 2 This is a schematic diagram of the components of a laser emitting device;

[0028] Figure 3 This is a flowchart of the dye warehouse process.

[0029] Figure 4 This is a process flow diagram of a laser sensor manufacturing method;

[0030] Figure 5 This is a process flow diagram of the dye warehouse;

[0031] Figure 6 This is a schematic diagram of the dye storage tank.

[0032] Figure 7 This is a cross-sectional view of the dye tank structure;

[0033] Figure 8 for Figure 7 A partially enlarged sectional view of section I;

[0034] Figure 9 This is a schematic diagram illustrating the use of the processing equipment;

[0035] Figure 10 This is a schematic diagram of the processing equipment. Detailed Implementation

[0036] A laser sensor processing method includes the following steps:

[0037] S1: Install an anti-collision layer on the bottom inside the shell;

[0038] S2: Install control and measuring devices on the upper side of the anti-collision layer;

[0039] S3: Install a laser emitting device in front of the control and measuring devices;

[0040] S4: Install laser detection devices on both sides of the laser emitting device to enable the processing of laser sensors.

[0041] Since the laser sensor has laser detection devices installed on both sides of the laser emitting device, the changes in the detection results of the emitted laser can be measured by the two laser detection devices to measure the position to be detected. This eliminates the detection error caused by the single laser detection device being in a different position from the laser emitting device, thereby improving the measurement results of the laser sensor.

[0042] Meanwhile, the anti-collision layer can prevent the internal structure of the laser sensor from moving due to vibration during the movement, which would cause deformation of the measurement results. This reduces the need to move the laser sensor and thus reduces the maintenance requirements caused by moving the laser sensor.

[0043] The laser emitting device in step S3 includes a pump source, a dye chamber, and optical control components.

[0044] The processing of the dye bin includes the following steps:

[0045] S31: Place the bottom shell 000 and the top shell 010 of the silo onto the processing equipment respectively;

[0046] S32: Install a bottom shell ring 020 on the upper side of the bottom shell 000 and a top shell ring 030 on the upper side of the top shell 010.

[0047] S33: Install buffer pads 040 on the upper side of both the bottom shell 000 and the top shell 010 of the silo.

[0048] S34: Install liquid dye medium on bottom ring 020;

[0049] S35: Install the top shell 010 onto the upper side of the bottom shell 000 to obtain the dye bin;

[0050] S36: Install the dye chamber inside the laser emitting device;

[0051] Because the laser emitting device is equipped with a dye chamber, and the liquid dye medium is installed inside the dye chamber, the dye chamber can further protect the liquid dye medium when the environment changes, thereby reducing the environmental sensitivity of the laser emitting device and improving the environmental adaptability of the laser sensor.

[0052] like Figure 9-10 As shown:

[0053] The processing equipment includes a fixed base 100, a movable plate 110 slidably connected to the outside of the fixed base 100, and fixed plates 120 rotatably connected to both the front and rear sides of the movable plate 110.

[0054] When the processing equipment processes the dye bin, the bottom shell 000 and the top shell 010 of the bin can be placed on the upper side of the fixed seat 100. Then, the movable plate 110 can be slid upward so that the upper side of the movable plate 110 can be aligned with the bottom shell 000 or the top shell 010. Then, the fixed plate 120 can be rotated so that the lower side of both fixed plates 120 can be in contact with the upper side of the bottom shell 000 and the top shell 010. Thus, the bottom shell 000 and the top shell 010 can be pressed by the two fixed plates 120, thereby fixing the bottom shell 000 and the top shell 010 and preventing the bottom shell 000 and the top shell 010 from moving, which would cause the dye bin to fail to cooperate during processing.

[0055] Meanwhile, when the two fixing plates 120 fix and limit the bottom shell 000 and the top shell 010, material shelves can be placed on the upper side of the two fixing plates 120, which makes it convenient for workers to process the bottom shell 000 or the top shell 010.

[0056] Further:

[0057] The fixing base 100 has a bottom shell groove 101 for placing the bottom shell 000 and a top shell groove 102 for placing the top shell 010. The height of the plane where the bottom shell groove 101 is located is lower than the height of the plane where the top shell groove 102 is located. This ensures that when the bottom shell 000 and the top shell 010 are placed on the fixing base 100, their upper surfaces are aligned. This allows the upper surfaces of the bottom shell 000 and the top shell 010 to be simultaneously abutted by the two fixing plates 120. The two fixing plates 120 can simultaneously fix the bottom shell 000 and the top shell 010, thus keeping them relatively fixed and preventing misalignment between them during dye storage processing.

[0058] Further:

[0059] The movable plate 110 has fixing holes on both the front and rear sides, and the fixing seat 100 has fixing grooves corresponding to the fixing holes. Thus, after the upper sides of the bottom shell 000 and the top shell 010 are completely fixed by the two fixing plates 120, the movable plate 110 can be fixed to the fixing seat 100 by screws. This prevents the movable plate 110 from continuing to slide on the fixing seat 100. In subsequent processing, the position of the bottom shell 000 and the top shell 010 can be corrected by flipping the fixing plates 120, which simplifies the processing steps of the workers and avoids displacement and misalignment of the bottom shell 000 and the top shell 010 during processing.

[0060] A laser sensor fabricated using a laser sensor processing method includes a housing, an anti-collision layer fixedly attached to the bottom inner side of the housing, a control device and a measuring device fixedly attached to the upper side of the anti-collision layer, a laser emitting device mounted in front of the control device and measuring device, and laser detection devices mounted on both sides of the laser emitting device. The laser emitting device contains a pump light source, a dye chamber, and optical control components. This allows for the direct opening of the dye chamber when the liquid dye medium needs to be replaced, enabling rapid and convenient replacement of the liquid dye medium.

[0061] Meanwhile, when the liquid dye medium leaks, the dye chamber can block the leaking liquid dye medium, thereby preventing the liquid dye medium from leaking into the laser sensor and causing pollution. This further improves the environmental adaptability of the laser emitting device and reduces the maintenance requirements of the laser sensor.

[0062] like Figure 6-8 As shown:

[0063] The dye tank includes a bottom shell 000, a top shell 010 installed on the bottom shell 000, a bottom shell ring 020 snapped onto the upper side of the bottom shell 000, a top shell ring 030 bonded to the upper side of the top shell 010, a buffer pad 040 bonded to the upper side of both the bottom shell 000 and the top shell 010, a liquid dye medium snapped onto the bottom shell ring 020, and an insulation layer covered on the outside of the buffer pad 040.

[0064] When using a dye tank to hold liquid dye media, the liquid dye media can be placed on the upper side of the bottom shell ring 020, thereby fixing the liquid dye media through the bottom shell ring 020. Then, the top shell 010 can be fastened to the upper side of the bottom shell 000, so that the top shell ring 030 and the bottom shell ring 020 can be inserted and aligned into a ring, thereby fixing the liquid dye media in the center of the dye tank through the top shell ring 030 and the bottom shell ring 020, thus completing the fixation of the liquid dye media. When vibration or bumps occur outside the dye tank, the bottom shell ring 020 can move slightly inside the dye tank. At this time, the liquid dye media can come into contact with the buffer pad 040, thereby cushioning the liquid dye media through the buffer pad 040, thus preventing the outer shell of the liquid dye media from breaking or the media from leaking. At the same time, the heat insulation layer on the outside of the buffer pad 040 can play a heat preservation role, preventing the liquid dye media from failing due to excessive temperature changes.

[0065] Further:

[0066] Both ends of the bottom shell ring 020 are slidably connected to spring covers 021, and both ends of the bottom shell ring 020 are fixedly connected to springs 022. The springs 022 are located inside the corresponding spring covers 021, and a liquid dye medium is fixedly connected between the two spring covers 021. Thus, when the liquid dye medium is subjected to vibration or bumps, the bottom shell ring 020 can move slightly on the spring covers 021, thereby avoiding the bottom shell ring 020 from affecting the liquid dye medium during vibration or bumps. At the same time, the springs 022 can push the bottom shell ring 020 back to its original position by their own elasticity after the vibration ends, thereby preventing the liquid dye medium from shifting due to vibration or bumps.

[0067] Further:

[0068] A bottom shell slider 001 is slidably connected to the bottom shell 000, and a top shell 010 is hinged to the bottom shell slider 001. Therefore, when the top shell 010 is fastened to the upper side of the bottom shell 000, the bottom shell slider 001 can be pulled to slide on the bottom shell 000 first, allowing the top shell ring 030 to be smoothly fastened to the upper side of the bottom shell ring 020. This aligns the top shell ring 030 and the bottom shell ring 020 into a ring shape, preventing loosening of the dye tank after fastening, simplifying the process of changing the liquid dye medium, and providing convenience for changing the liquid dye medium.

Claims

1. A method for processing a laser sensor, characterized in that: Includes the following steps: S1: Install an anti-collision layer on the bottom inside the shell; S2: Install control and measuring devices on the upper side of the anti-collision layer; S3: Install a laser emitting device in front of the control and measuring devices; S4: Install laser detection devices on both sides of the laser emitting device to enable the processing of laser sensors.

2. The laser sensor processing method according to claim 1, characterized in that: The laser emitting device in step S3 includes a pump source, a dye chamber, and optical control components.

3. The laser sensor processing method according to claim 2, characterized in that: The processing of the dye bin includes the following steps: S31: Place the bottom shell (000) and top shell (010) of the silo on the processing equipment respectively; S32: Install a bottom shell ring (020) on the upper side of the bottom shell (000) and a top shell ring (030) on the upper side of the top shell (010); S33: Buffer pads (040) are installed on the upper side of both the bottom shell (000) and the top shell (010); S34: Install liquid dye medium on the bottom shell ring (020); S35: Install the top shell (010) onto the upper side of the bottom shell (000) to obtain the dye bin; S36: Install the dye chamber inside the laser emitting device.

4. The laser sensor processing method according to claim 3, characterized in that: The processing equipment includes a fixed base (100), a movable plate (110) is slidably connected to the outside of the fixed base (100), and fixed plates (120) are rotatably connected to both the front and rear sides of the movable plate (110).

5. The laser sensor processing method according to claim 4, characterized in that: The fixed base (100) has a bottom shell groove (101) for placing the bottom shell (000) and a top shell groove (102) for placing the top shell (010). The height of the plane where the bottom shell groove (101) is located is lower than the height of the plane where the top shell groove (102) is located.

6. The laser sensor processing method according to claim 4, characterized in that: The movable plate (110) has fixing holes on both the front and rear sides, and the fixing seat (100) has fixing grooves corresponding to the fixing holes.

7. The laser sensor prepared by the laser sensor processing method according to any one of claims 1-6, characterized in that: The laser sensor includes a housing, an anti-collision layer fixed to the bottom of the inner side of the housing, a control device and a measuring device fixed to the upper side of the anti-collision layer, a laser emitting device installed in front of the control device and the measuring device, and laser detection devices installed on both sides of the laser emitting device. The laser emitting device contains a pump light source, a dye chamber and an optical control component.

8. A laser sensor according to claim 7, characterized in that: The dye tank includes a bottom shell (000), a top shell (010) installed on the bottom shell (000), a bottom shell ring (020) fixed to the upper side of the bottom shell (000), a top shell ring (030) installed on the upper side of the top shell (010), a buffer pad (040) fixed to the upper side of both the bottom shell (000) and the top shell (010), and a liquid dye medium fixed to the bottom shell ring (020).

9. A laser sensor according to claim 8, characterized in that: Both ends of the bottom shell ring (020) are slidably connected to spring covers (021), and both ends of the bottom shell ring (020) are fixedly connected to springs (022). The springs (022) are set inside the corresponding spring covers (021), and a liquid dye medium is fixedly connected between the two spring covers (021).

10. A laser sensor according to claim 8, characterized in that: The bottom shell (000) is slidably connected to a bottom shell slider (001), and the top shell (010) is hinged to the bottom shell slider (001).

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